TWI815827B - Substrate processing equipment - Google Patents

Abstract

A substrate processing apparatus useful for managing oxygen concentration in substrate processing is provided.

The substrate processing device (1) is equipped with: a carrier block (3), which can be equipped with a carrier (11) that accommodates a plurality of wafers (W); a liquid processing unit (U1) and a heat treatment unit (U2) for processing Processing of wafers (W); the transport arm (A2) transports the wafers (W) between the carrier (11) and the liquid processing unit (U1) and the thermal processing unit (U2); the housing (10) accommodates liquid processing The unit (U1), the heat treatment unit (U2) and the transfer arm (A2); the package body (20) accommodates the housing (10) with a higher airtightness than the housing (10); the first pressure regulating part (40) , adjust the air pressure in the casing (10); the second pressure adjustment part (50) adjusts the air pressure in the bag body (20); and the control part (100) performs as follows: so that the air pressure in the bag body (20) The first pressure regulating part (40) and the second pressure regulating part (50) are controlled so that the air pressure is kept lower than the air pressure outside the package body (20) and the air pressure inside the casing (10).

Description

Substrate processing equipment

This disclosure relates to a substrate processing apparatus.

In the semiconductor manufacturing process, there is a concern about oxidation of the coating film. Patent Document 1 discloses, for example, a heat treatment apparatus for a substrate in which, in the hardening process of a coating film using an oxygen-sensitive material, the material is coated in a processing chamber maintained in a low oxygen atmosphere. Heating and cooling of substrates. [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2002-93799

[Problems to be solved by the present invention]

In substrate processing apparatuses such as the above-mentioned heat treatment apparatus, a material more sensitive to oxygen may be used as a coating film. Under such circumstances, it is required to more appropriately manage the oxygen concentration in substrate processing.

The present disclosure aims to provide a substrate processing apparatus useful for managing oxygen concentration in substrate processing. [Means used to solve problems]

A substrate processing device according to one aspect of the present disclosure is provided with: a carrier support portion that can be provided with a carrier that accommodates a plurality of substrates; a processing unit that processes the substrates; and a transfer arm that transfers the substrates between the carrier and the processing unit. ; The housing accommodates the processing unit and the transport arm; the package body accommodates the housing with a higher airtightness than the housing; the first pressure regulating part regulates the air pressure in the housing; the second pressure regulating part regulates the air pressure in the package ; and a control unit that controls the first pressure regulating unit and the second pressure regulating unit in such a manner that the air pressure inside the package is maintained lower than either the air pressure outside the package or the air pressure inside the housing.

According to this substrate processing apparatus, the housing is housed in a package with a higher airtightness than the housing, and the air pressure inside the package is maintained lower than the air pressure outside the package and the air pressure inside the housing. This can suppress leakage from the housing. The gas leaked from the body to the outside of the shell leaks out of the package. Therefore, the oxygen concentration in each part of the housing, such as the transfer area, the processing unit, etc., can be adjusted to a desired state. Therefore, the present substrate processing apparatus is useful for managing the oxygen concentration during substrate processing.

It may also be further provided with: a first air-conditioning unit that regulates the oxygen concentration inside the bag, and the control unit may further perform the following steps: controlling the third air-conditioning unit to maintain the oxygen concentration inside the bag lower than the oxygen concentration outside the bag. An air conditioning department. In this case, by adjusting the oxygen concentration in the package housing the case, the oxygen concentration in each part within the case can be adjusted efficiently.

The first air conditioning unit may include: a gas supply part that supplies gas into the package; a concentration adjustment part that adjusts the oxygen concentration of the gas sent from the gas supply part to the package; and a return part that allows the gas to flow out of the package. Returning to the gas supply part, the control part may also perform the following: while maintaining the oxygen concentration inside the package lower than the oxygen concentration outside the package, the oxygen of the gas transferred from the gas supply part to the package can be The concentration adjustment part is controlled so that the oxygen concentration is lower than the oxygen concentration outside the package. In this case, since the oxygen concentration of the gas sent from the gas supply part into the package is adjusted, the oxygen concentration in the package can be maintained more reliably. In addition, since the gas in the package is returned to the gas supply part through the return part, the gas with the adjusted oxygen concentration can be recycled and the oxygen concentration can be maintained efficiently.

The first pressure regulating part may also have an air supply part to transmit gas from the package to the casing. The second pressure regulating part may also have a first exhaust part to guide part of the gas in the package. to the exhaust path. In this case, the air pressure can be adjusted with a simple configuration.

The substrate processing device may further include: a first door for entering and exiting the package; a first lock for switching between a state that allows the opening of the first door and a state that prohibits the opening of the first door; and a first lock. An oxygen concentration sensor measures the oxygen concentration in the bag, and the control unit may further perform the following: so that the oxygen concentration of the gas sent from the gas supply part to the bag is higher than the oxygen concentration in the bag. in a manner of controlling the concentration adjustment part; and in the case where the measurement result of the oxygen concentration caused by the first oxygen concentration sensor is lower than a predetermined value, in a manner of prohibiting the opening of the first door, controlling the first lock. In this case, since the opening of the first door is prohibited by the first lock until the oxygen concentration in the package is adjusted to be equal to or higher than the predetermined value, for example, before the operator enters the package, the oxygen concentration in the package can be Oxygen concentration definitely rises.

Furthermore, the substrate processing apparatus may further include: a second oxygen concentration sensor that measures the oxygen concentration in a space open to the outside within the casing, and the control unit is configured to operate on the second oxygen concentration sensor. When the measurement result of the oxygen concentration is lower than a predetermined value, the first lock can also be controlled by prohibiting the opening of the first door. In this case, when the operator opens the space in the casing that can be opened to the outside, the oxygen concentration can be reliably increased.

In addition, the substrate processing apparatus may further include a third oxygen concentration sensor that measures the oxygen concentration in the recirculation part, and a control unit that detects the oxygen concentration based on the detection result of the third oxygen concentration sensor. When the value is lower than the predetermined value, the first lock can also be controlled by prohibiting the opening of the first door. In this case, since the first lock prohibits the opening of the first door until the oxygen concentration in the return part reaches a predetermined value or more, the oxygen concentration in the package can be increased more reliably.

You may further include a fourth oxygen concentration sensor that measures the oxygen concentration in the gas supply unit, and a control unit that detects the oxygen concentration even if the detection result of the oxygen concentration by the fourth oxygen concentration sensor is lower than a predetermined value. , you can also prohibit the opening of the first door and control the first lock. In this case, since the opening of the first door is prohibited by the first lock until the oxygen concentration in the gas supply part reaches a predetermined value or more, the oxygen concentration in the package can be increased more reliably.

Moreover, the substrate processing apparatus may further include: a volatile matter concentration sensor for measuring the concentration of volatile matter flowing out from the processing unit into the package, and the control unit is located on the volatile matter concentration sensor When the resulting measurement result is higher than the predetermined value, the first lock can also be controlled by prohibiting the opening of the first door. In this case, since the opening of the first door is prohibited by the first lock until the concentration of volatile matter in the package becomes below the predetermined value, it is possible to reliably reduce the concentration of volatile matter in the package before the operator enters the package. volatiles.

The volatile matter concentration sensor may also be disposed in the first exhaust part. With this configuration, the concentration of volatile matter can be easily detected using the first exhaust part.

The gas supply part may also include: a first gas pipeline that guides the gas into the package; and a second gas pipeline that guides the gas into the processing unit. In this case, since the first gas pipe is used to guide the gas into the package, and the second gas pipe as another path is used to guide the gas into the processing unit, the processing unit can be adjusted more strictly. oxygen concentration within.

It may also be further provided with: a second exhaust part to guide the gas in the processing unit to the exhaust path. In this case, since the gas in the processing unit with a high volatile matter concentration is exhausted, it is possible to suppress the volatile matter concentration from becoming excessively high.

The second exhaust part may also have a third gas pipeline to guide the gas to the side of the housing. According to this structure, it is easy to integrate the exhaust pipe from the processing unit inside the package.

The substrate processing device may further include: a carrier accommodating part to accommodate the carrier; a second door to open and close the carrier accommodating part to the outside of the bag; a third door to open and close the carrier accommodating part to the inside of the bag; and a receiving and receiving part in The carrier is received and transferred between the carrier receiving part and the carrier supporting part; and the second air conditioning part adjusts the oxygen concentration in the carrier receiving part. The control part may further perform the following: before the second door is opened, The second air-conditioning unit is controlled in such a way that the oxygen concentration in the carrier receiving part is close to the oxygen concentration outside the bag; and before the opening of the third door, the third air conditioning part is controlled in such a way that the oxygen concentration in the carrier receiving part is close to the oxygen concentration in the bag. 2. Air conditioning department. In this case, when the second door is opened and the carrier is carried out and loaded in, leakage of gas with a low oxygen concentration from the inside of the carrier accommodating portion to the outside of the package can be suppressed. When the third door is opened and the carrier is transported, leakage of gas with a high oxygen concentration from the carrier accommodating portion into the package body can be suppressed.

The substrate processing device may further include: a second lock that switches between a state that allows the opening of the second door and a state that prohibits the opening of the second door; and a third lock that allows the opening of the third door. The state is switched with the state that prohibits the opening of the third door; and the fifth oxygen concentration sensor measures the oxygen concentration in the carrier receiving part, and the control unit can further perform the following: in the fifth oxygen concentration sensing When the measurement result caused by the fifth oxygen concentration sensor is lower than the predetermined value, the second lock is controlled by prohibiting the opening of the second door; and when the measurement result caused by the fifth oxygen concentration sensor is higher than the predetermined value Next, control the third lock by prohibiting the opening of the third door. In this case, since the opening of the second door and the third door is prohibited until the oxygen concentration in the carrier accommodating part is appropriately adjusted, the carrier can be adjusted more reliably before the second door and the third door are opened. Oxygen concentration in the containment unit. [Effects of the invention]

According to the present disclosure, it is possible to provide a substrate processing apparatus useful for managing oxygen concentration in substrate processing.

Hereinafter, the embodiment will be described in detail with reference to the drawings. In the description, the same elements or elements with the same function are marked with the same symbols, and repeated descriptions are omitted.

[Substrate processing equipment] The substrate processing device 1 is a device that processes a substrate. The substrate processing apparatus 1 processes substrates in, for example, a normal pressure environment. In addition, normal pressure refers to the pressure range 20% above and below the standard atmospheric pressure of 101325Pa. The substrate to be processed is, for example, a semiconductor wafer W. In the following, the substrate processing apparatus 1 for forming a photosensitive film on the wafer W will be described as an example.

As shown in FIGS. 1 and 2 , the substrate processing apparatus 1 is equipped with: a coating device 2 for forming a photosensitive film; a package 20; a first air conditioning unit 30; a first pressure adjustment unit 40; The pressure regulating part 50; the exhaust part 51; a plurality of load lock chambers 60; a receiving and receiving part 67; a plurality of second air conditioning parts 70; and the control part 100. The coating device 2 has: a carrier block 3 (carrier support part); a processing block 4; and a housing 10.

The carrier block 3 is a carrier 11 for the wafer W. The carrier 11 accommodates, for example, a plurality of circular wafers W in a sealed state. The carrier block 3 has a built-in receiving and receiving arm A1. The receiving and receiving arm A1 takes out the wafer W from the carrier 11 and transfers it to the processing block 4 , and receives the wafer W from the processing block 4 and returns it to the carrier 11 .

The processing block 4 has: a plurality of liquid processing units U1 (processing units) and a plurality of thermal processing units U2 (processing units) for processing the wafer W; and a transport arm A2 for transporting the wafer W to these units. unit. The liquid processing unit U1 performs processing of applying a processing liquid to the surface of the wafer W (hereinafter referred to as "coating processing"). The liquid processing unit U1 has a cup C, which accommodates the wafer W being coated and collects the processing liquid. The heat treatment unit U2 performs heat treatment such as heating of the film formed by the above-mentioned coating process. The heat treatment unit U2 has a chamber that accommodates the heated wafer W being coated. A shelf unit U10 is provided on the side of the carrier block 3 in the processing block 4 . The scaffold unit U10 is divided into a plurality of cells arranged in the up and down direction.

The casing 10 accommodates a plurality of liquid processing units U1, a plurality of heat treatment units U2, a rack unit U10, a receiving and receiving arm A1, and a transport arm A2. The housing 10 does not need to be integrally formed, and may be separated for each processing block, for example.

The package body 20 contains the housing 10 with a higher airtightness than the housing 10 . The package body 20 includes: a door 21 (first door); a lock (first lock) 22; and an operation panel 23. The door 21 is used for operators to enter and exit the package body 20 from outside. The lock 22 switches between a state that allows the door 21 to be opened (hereinafter referred to as the "unlocked state") and a state that prohibits the door 21 from being opened (hereinafter referred to as the "locked state"). The operation panel 23 is attached to the external space side of the package body 20 and is arranged near the door 21 . The operation panel 23 has an input unit 23a (see Fig. 4(a)). The operation panel 23 is used to request unlocking of the door 21 by inputting to the input unit 23a.

The first air conditioning unit 30 adjusts the oxygen concentration in the package body 20 . The first air conditioning unit 30 includes a gas supply unit 31 , a concentration adjustment unit 32 , and a return unit 33 . The first air conditioning unit 30 is configured to circulate the gas in the package body 20 through the gas supply unit 31, the concentration adjustment unit 32, and the return unit 33. The circulating gas contains, for example, inert gas (such as nitrogen) and air.

The gas supply part 31 includes: an air blower 31a to pressure-feed gas into the package body 20; pipelines L1 and L2; and filters 31b and 31c. The air blower 31a has a temperature adjustment unit 31d for adjusting the temperature of the pressure-fed gas. Specific examples of the temperature control unit 31d include a heater, a cooling coil, and the like. The pipeline L1 (first gas pipeline) guides gas from the blower 31a into the package body 20. The pipeline L2 (second gas pipeline) guides gas from the blower 31a into each liquid processing unit U1. For example, pipeline L2 guides gas to the cup C in each liquid treatment unit U1. The filter 31b is installed in the pipeline L1 and removes particles and the like in the gas flowing in the pipeline L1. The filter 31c is provided in the pipeline L2 and removes particles and the like in the gas flowing in the pipeline L1. Specific examples of the filters 31b and 31c include HEPA filters.

The recirculation part 33 recirculates gas from the inside of the package 20 to the gas supply part 31 . For example, the return part 33 includes: pipelines L5 and L6; and filter units 33a, 33b, 33c, and 33d. The pipeline L5 guides the gas from the inside of the package 20 and the heat treatment unit U2 to the gas supply part 31 . The pipeline L6 guides gas from the liquid processing unit U1 to the gas supply unit 31 .

The filter units 33a and 33b are provided in the pipeline L5. The filter unit 33a includes a cooling unit C1 and a filter F1. The cooling part C1 cools the gas using a cooling coil, for example. The filter F1 is a HEPA filter, for example, and removes particles in the gas. The filter unit 33b is arranged between the filter unit 33a and the gas supply part 31, and includes the filter F2. The filter F2 removes organic matter in the gas using activated carbon, for example.

The filter units 33c and 33d are provided in the pipeline L6. The filter unit 33c includes a cooling unit C3 and a filter F3. The cooling part C3 cools the gas using a cooling coil, for example. The filter F3 is a HEPA filter, for example, and removes particles in the gas. The filter unit 33d is disposed between the filter unit 33c and the gas supply part 31, and includes the filter F4. The filter F4 removes organic matter in the gas using activated carbon, for example.

In addition, a blower f for pressurizing gas may be provided in any one of the filter units 33a, 33b, 33c, and 33d. For example, in the structure shown in the figure, the air blower f is provided in the filter units 33a, 33b, and 33d.

The concentration adjustment unit 32 adjusts the oxygen concentration of the gas supplied from the gas supply unit 31 . The concentration adjustment unit 32 includes, for example, pipelines L3 and L4 and valves 32a and 32b. The pipeline L3 introduces air from the blower 31a into the gas flow path into the package body 20 . For example, the pipeline L1 extends from any one of the filter units 33a, 33b, 33c, and 33d (for example, the filter unit 33a), and introduces air through the filter unit 33a.

The valve 32b is provided in the pipeline L4 and adjusts the opening and closing degree of the flow path in the pipeline L4. The pipe line L4 introduces the inert gas from the gas supply part 31 into the gas flow path into the package body 20 . For example, the pipeline L4 connects the nitrogen supply source N and the air blower 31a, and introduces the nitrogen gas from the supply source N into the air blower 31a. The valve 32b is provided in the pipeline L4 and adjusts the opening and closing degree of the flow path in the pipeline L4. In addition, adjusting the opening and closing of the flow path also includes blocking the flow path.

The first pressure regulating part 40 regulates the air pressure in the housing 10 . The first pressure regulating part 40 has air blowing parts 41 and 42. The air blowing part 41 transmits gas from the inside of the package body 20 to the inside of the casing 10 . The air blowing part 41 is, for example, a fan with a built-in filter (not shown), and sends the gas from which particles and the like have been removed into the casing 10 . The air blowing part 42 transmits gas from the casing 10 to the package body 20 . When the amount of gas delivered through the air blowing part 41 is greater than the amount of gas delivered through the air blowing part 42, the air pressure in the housing 10 rises. The air pressure is falling.

The second pressure regulating part 50 regulates the air pressure in the bag body 20 . The second pressure regulating part 50 has an air blowing part 43 and an exhaust part 52 (first exhaust part). The air blowing part 43 circulates gas within the package body 20 . The exhaust part 52 includes: a pipeline L9; and a baffle 52a. Pipeline L9 guides gas from the package body 20 to the power equipment X for exhaust. The baffle 52a is provided in the pipeline L9 to adjust the opening and closing degree of the flow path in the pipeline L9. When the opening and closing degree of the baffle 52a increases, the exhaust volume from the package body 20 increases and the air pressure in the package body 20 decreases. When the opening and closing degree of the baffle 52a decreases, the exhaust volume from the package body 20 decreases. The air pressure in the package body 20 increases as it decreases.

The exhaust part 51 (second exhaust part) has pipe lines L7 and L8. Pipeline L7 (third gas pipeline) guides gas from the cup C in each liquid processing unit U1 to the power equipment X. Pipeline L8 (third gas pipeline) guides gas from the chamber in each heat treatment unit U2 to the power equipment X. Pipes L7 and L8 guide the gas to the side of the housing 10 (see Figure 3).

A plurality of (for example, two) load lock chambers 60 are provided between the peripheral wall of the package body 20 and the carrier block 3 . The load lock chamber 60 includes: a storage part 61 (carrier storage part); doors 62, 63; a lock 64 (second lock); a switch driving part 65; and an operation panel 66. The accommodating part 61 stores the carrier 11 . Door 62 (second door) opens and closes the load lock chamber 60 from the inside to the outside of the package. The locking 64 is, for example, electromagnetic locking, and is performed between a state in which the opening of the door 62 is allowed (hereinafter referred to as the "released state") and a state in which the opening of the door 62 is prohibited (hereinafter referred to as the "locked state"). switch.

The door 63 (third door) opens and closes from the inside of the accommodating part 61 to the inside of the package body 20 . The switch driving unit 65 (third lock) switches the state in which the door 63 is allowed to open and the state in which the door 63 is prohibited from being opened. The switch driving unit 65 includes a power source (for example, an electric motor) for opening and closing the door 63, and also drives the door 63 to open and close.

The operation panel 66 is attached to the external space side of the package body 20 and is arranged near the door 62 . The operation panel 66 has an input part 66a and a display part 66b (see FIG. 4(b)). The input unit 66a is used to input a request for locking the door 62, a request for unlocking the door 62, a request for transporting the carrier 11 from the storage unit 61 to the carrier block 3, and the like. The display part 66b is used to display whether the carrier 11 is present in the accommodating part 61.

The receiving and receiving unit 67 is located between the carrier block 3 and each load lock chamber 60 and performs receiving and receiving of the carrier 11 . For example, the receiving and receiving unit 67 has a transfer robot arm A3. The transport robot A3 takes out the carrier 11 from the accommodating part 61 and transports it to the carrier block 3 , and receives the carrier 11 from the carrier block 3 and transports it to the accommodating part 61 .

A plurality of (for example, two) second air conditioning units 70 adjust the oxygen concentrations in a plurality of load lock chambers 60 respectively. Each second air conditioning unit 70 includes: pipelines L11, L12, L13, and L14; valves 71, 72, and 73; and a pump P. The pipeline L11 guides the gas from outside the package body 20 to the receiving part 61 . The pipeline L12 guides the gas from the package body 20 to the receiving part 61 . The pipeline L13 guides the gas from the containing part 61 to the pipeline L5. The pipeline L14 guides the gas from the accommodation part 61 to the power equipment X.

The valve 71 is provided in the pipeline L11 and adjusts the opening and closing degree of the flow path in the pipeline L11. The valve 72 is provided in the pipeline L12 and adjusts the opening and closing degree of the flow path in the pipeline L12. The valve 73 is provided in the pipeline L14 and adjusts the opening and closing degree of the flow path in the pipeline L14. The pump P is provided in the pipe line L13, and pressurizes the gas from the accommodation part 61 to the pipe line L5. When the pump P is driven with the valves 71 and 73 closed and the valve 72 opened, the gas in the package 20 will flow into the receiving portion 61 . When the valves 71 and 73 are opened while the valve 72 is closed and the pump P is stopped, the gas outside the package 20 will flow into the accommodating portion 61 . In this way, the gas inside and outside the package body 20 selectively flows into the containing part 61, thereby adjusting the oxygen concentration in the containing part 61.

The substrate processing device 1 further includes: oxygen concentration sensors D1 to D6; a volatile concentration sensor D7; pressure sensors D8 and D9; a carrier sensor D10; and a door switch sensor D11.

The oxygen concentration sensor D1 (first oxygen concentration sensor) is installed in the package body 20 and measures the oxygen concentration in the package body 20 . The substrate processing apparatus 1 may also be equipped with oxygen concentration sensors D1 at a plurality of positions within the package 20 . The oxygen concentration sensor D2 (second oxygen concentration sensor) is provided in a space open to the outside in the housing 10 . For example, the oxygen concentration sensor D2 is installed in the transfer area of the wafer W caused by the receiving arm A1 and the transfer arm A2. The oxygen concentration sensor D3 (third oxygen concentration sensor) is provided in the return part 33 . For example, the oxygen concentration sensors D3 are respectively provided inside the filter units 33a, 33b, 33c, and 33d. The substrate processing apparatus 1 may be provided with a plurality of oxygen concentration sensors D3 in the filter units 33a, 33b, 33c, and 33d respectively. The oxygen concentration sensor D4 (the fourth oxygen concentration sensor) is provided in the gas supply part 31 . For example, the oxygen concentration sensor D4 may also be disposed in the air blower 31a. The substrate processing apparatus 1 may be provided with a plurality of oxygen concentration sensors D4 in the air blower 31a. The oxygen concentration sensor D5 is installed in the cup C of the liquid treatment unit U1. The oxygen concentration sensor D6 (fifth oxygen concentration sensor) is provided in the receiving portion 61 of the load lock chamber 60 .

The volatile matter concentration sensor D7 measures the concentration of volatile matter flowing out from the liquid treatment unit U1 or the heat treatment unit U2 into the package body 20 (hereinafter, referred to as "the volatile matter concentration in the package body 20"). The volatile matter concentration sensor D7 is provided in the exhaust part 52 .

The pressure sensor D8 is installed in the housing 10 . The pressure inside the housing 10 is measured. The pressure sensor D9 is installed in the package body 20 and measures the pressure in the package body 20 .

The carrier sensor D10 is installed in the receiving portion 61 of the load lock chamber 60 and detects whether the carrier 11 is present in the receiving portion 61 . The door switch sensor D11 detects the switch status of the door 21. The door switch sensor D11 is installed in the package body 20 and is arranged near the door 21 . The door switch sensor D12 detects the switch state of the door 62 . The door switch sensor D12 is located in the receiving portion 61 of the load lock chamber 60 and is arranged near the door 62 .

The control unit 100 controls the first pressure regulator 40 and the second pressure regulator so that the air pressure inside the package body 20 is maintained lower than either the air pressure outside the package body 20 or the air pressure inside the casing 10 . Department 50. The control unit 100 may further perform the following steps: control the first air conditioning unit 30 in a manner to maintain the oxygen concentration inside the package 20 lower than the oxygen concentration outside the package 20 . For example, the control unit 100 maintains the oxygen concentration inside the package 20 lower than the oxygen concentration outside the package 20 so that the oxygen concentration of the gas sent from the gas supply unit 31 into the package 20 is lower than the oxygen concentration in the package 20 . The concentration adjustment unit 32 is controlled so that the oxygen concentration outside the body 20 is lower.

Furthermore, the control unit 100 may further control the concentration adjustment so that the oxygen concentration of the gas sent from the gas supply unit 31 into the package 20 is higher than the oxygen concentration in the package 20 . part 32; and when the measurement result of the oxygen concentration caused by the oxygen concentration sensor D1 is lower than a predetermined value, the lock 22 is controlled to prohibit the opening of the door 21. The control unit 100 is configured to operate when the measurement result of the oxygen concentration by the oxygen concentration sensor D2 is lower than a predetermined value and when the detection result of the oxygen concentration by the oxygen concentration sensor D3 is lower than the predetermined value. Next, when the detection result of the oxygen concentration caused by the oxygen concentration sensor D4 is lower than the predetermined value or when the measurement result caused by the volatile concentration sensor D7 is higher than the predetermined value, the door can also be prohibited. 21. Opening method, control locking 22.

Moreover, the control unit 100 may also perform the following steps: before the door 62 is opened, the second air conditioning unit 70 is controlled in such a manner that the oxygen concentration in the accommodation part 61 is close to the oxygen concentration outside the package body 20; Before opening 63, the second air-conditioning unit 70 is controlled in such a way that the oxygen concentration in the load lock chamber 60 is close to the oxygen concentration in the package 20; when the measurement result caused by the oxygen concentration sensor D6 is lower than the predetermined value In this case, the lock 64 is controlled to prohibit the opening of the door 62; and when the measurement result caused by the oxygen concentration sensor D6 is higher than a predetermined value, the switch drive is controlled to prohibit the opening of the door 63. Department 65.

For example, as shown in FIG. 5 , the control unit 100 includes an air pressure adjustment unit 101 , a first oxygen concentration adjustment unit 102 , a first lock control unit 103 , a second oxygen concentration adjustment unit 104 , and a second lock control unit 105 , the transportation control unit 106 and the third locking control unit 107 serve as a functional configuration (hereinafter referred to as "functional module").

The air pressure regulating part 101 obtains the air pressure data in the casing 10 from the pressure sensor D8. When the air pressure in the casing 10 is lower than the target air pressure, it transmits it from the package 20 to the casing 10. The air supply part 41 is controlled in such a way that the amount of gas increases. In addition, when the air pressure in the casing 10 is lower than the target air pressure, the air pressure regulator 101 can also control the air blower 42 in a manner to reduce the amount of gas transmitted from the casing 10 to the package 20 . The target air pressure of the air pressure in the casing 10 is, for example, a value that is approximately several Pa higher than the air pressure in the package body 20 .

In addition, the air pressure regulator 101 obtains the air pressure data in the casing 20 from the pressure sensor D9, and when the air pressure in the package 20 is higher than the target air pressure, it is guided from the inside of the package 20 to The exhaust part 52 is controlled so that the amount of gas in the power equipment X (exhaust path) increases. For example, the air pressure regulator 101 increases the opening and closing degree of the shutter 52a. The target air pressure of the air pressure inside the package body 20 is a value lower than either the air pressure outside the package body 20 or the air pressure inside the casing 10 .

The first oxygen concentration adjustment unit 102 controls the first air conditioning unit 30 in a manner to maintain the oxygen concentration inside the package 20 lower than the oxygen concentration outside the package 20 . The first oxygen concentration adjustment unit 102 is based on the measurement result of the oxygen concentration in the package 20 obtained from the oxygen concentration sensor D1, so as to adjust the oxygen concentration ratio of the gas sent from the gas supply unit 31 to the package 20 The concentration adjustment unit 32 is controlled so that the oxygen concentration outside the package 20 is lower. In addition, the first oxygen concentration adjustment unit 102 is based on the information obtained from the first lock control unit 103 so that the oxygen concentration of the gas sent from the gas supply unit 31 to the package body 20 is higher than the oxygen concentration in the package body 20 . To achieve a higher concentration, the concentration adjustment unit 32 is controlled.

When reducing the oxygen concentration of the gas sent from the gas supply part 31 into the package 20, the first oxygen concentration adjusting part 102 decreases the opening and closing degree of the valve 32a and increases the opening and closing degree of the valve 32b. , control the concentration adjustment unit 32. On the other hand, when the oxygen concentration of the gas sent from the gas supply part 31 into the package body 20 is increased, the first oxygen concentration adjustment part 102 increases the opening and closing degree of the valve 32a and opens the valve 32b. The concentration adjustment unit 32 is controlled so that the degree of closeness decreases.

The first lock control unit 103 controls based on the presence or absence of a lock release request for the input unit 23a and the measurement results of the oxygen concentration sensors D1 to D4 and the measurement results of the volatile concentration sensor D7. Lock 22. Specifically, the first lock control unit 103, after the lock release request is input to the input unit 23a, when the measurement result of the oxygen concentration by the oxygen concentration sensor D1 is lower than a predetermined value, The lock 22 is controlled to prohibit the opening of the door 21 . The first lock control unit 103 can control the lock 22 so as to prohibit the opening of the door 21 even when the oxygen concentration measurement result of the oxygen concentration sensors D2 to D4 is lower than a predetermined value. Furthermore, the first lock control unit 103 can control the lock 22 so as to prohibit the opening of the door 21 even when the measurement result obtained from the volatile concentration sensor D7 is higher than a predetermined value.

The first locking control unit 103 maintains a state where the measurement results of the oxygen concentration by the oxygen concentration sensors D1 to D4 are equal to or higher than a predetermined value for a predetermined time or more, and the volatile matter concentration sensor D7 evaporates. When the measurement result of the substance concentration is below a predetermined value and is maintained for more than a predetermined time, the lock 22 is controlled to allow the opening of the door 21 . The above-mentioned predetermined value of the oxygen concentration is set to a value close to the oxygen concentration in the air (for example, 19.5%). The above-mentioned predetermined value of the volatile matter concentration is appropriately set depending on the type of volatile matter and the like. The above-mentioned predetermined value of the volatile matter concentration is, for example, 5 ppm. The above-mentioned predetermined time is appropriately set taking into account variations in measurement results and the like. The above predetermined time is, for example, 1 minute.

The second oxygen concentration adjusting unit 104 controls the second air conditioning unit 70 before the door 62 is opened so that the oxygen concentration in the accommodating part 61 is close to the oxygen concentration outside the package 20 . Specifically, the second oxygen concentration adjustment unit 104 controls the second air conditioning unit 70 based on whether there is a request to unlock the input unit 66a.

In addition, the second oxygen concentration adjusting unit 104 controls the second air conditioning unit 70 so that the oxygen concentration in the accommodating part 61 is close to the oxygen concentration in the casing 10 before the door 63 is opened. Specifically, the second oxygen concentration adjustment unit 104 controls the second air conditioning unit 70 based on the presence or absence of a request for transportation of the carrier 11 (transportation from the storage unit 61 to the carrier block 3 ) to the input unit 66 a.

The second lock control unit 105 controls the lock 64 based on the presence or absence of a lock release request from the input unit 66a and the measurement result from the oxygen concentration sensor D6. Specifically, after the lock release request is input to the input unit 66a, the second lock control unit 105 prohibits the door when the measurement result caused by the oxygen concentration sensor D6 is lower than a predetermined value. The opening method of 62 controls the locking of 64. The second lock control unit 105 controls the lock to prohibit the opening of the door 62 when the measurement result of the oxygen concentration by the oxygen concentration sensor D6 is above a predetermined value and is maintained for more than a predetermined time. Solid 64. The above-mentioned predetermined value of the oxygen concentration is set to a value close to the oxygen concentration in the air (for example, 19.5%). The above-mentioned predetermined time is appropriately set taking into account variations in measurement results and the like. The above predetermined time is, for example, 1 minute.

The transport control unit 106 determines whether there is a carrier transport request to the input unit 66a, the detection result of the carrier sensor D10, and the presence or absence of the carrier 11 to be transported in the carrier block 3, so that the carrier 11 in the storage unit 61 and the carrier area To transport the carrier 11 between the blocks 3, the switch drive unit 65 and the transport robot arm A3 are controlled. Specifically, when the transportation request of the carrier 11 is input to the input unit 66a, the transportation control unit 106 controls the transportation robot A3 so that the carrier 11 in the storage unit 61 is transported to the carrier block 3. In conjunction with this, the switch driving unit 65 is controlled to open and close the door 63 . Furthermore, when the carrier 11 to be carried out exists in the carrier block 3 , the transport control unit 106 controls the transport robot arm A3 so that the carrier 11 to be carried out is transported from the carrier block 3 into the accommodating part 61 , and in cooperation with this, the switch driving unit 65 is controlled to open and close the door 63 . At this time, the transportation control unit 106 uses the carrier sensor D10 to select the storage portion 61 where the carrier 11 has not been detected as the transportation destination of the carrier 11 .

Furthermore, the transport control unit 106 controls the display unit 66b to display the detection result based on the detection result of the presence or absence of the carrier 11 in the load lock chamber 60 obtained from the carrier sensor D10. For example, when the carrier sensor D10 detects the carrier 11 in the accommodating part 61, the transport control part 106 lights up the display part 66b corresponding to the accommodating part 61. If the carrier sensor D10 does not detect the carrier 11, In the case of the carrier 11 in the accommodating part 61, the display part 66b corresponding to the accommodating part 61 is turned off.

The third locking control unit 107 controls the switch driving unit 65 via the transport control unit 106 to prohibit the opening of the door 63 when the measurement result of the oxygen concentration sensor D6 is higher than a predetermined value. When the measurement result of the oxygen concentration by the oxygen concentration sensor D6 is below a predetermined value and the state is maintained for more than a predetermined time, the third lock control unit 107 allows the opening of the door 63 via the conveyor. The control unit 106 controls the switch driving unit 65 . The above-mentioned predetermined value of the oxygen concentration is set to be the same as the target value of the oxygen concentration in the package 20 . The above-mentioned predetermined time is appropriately set taking into account variations in measurement results and the like. The above predetermined time is, for example, 1 minute.

The control unit 100 is composed of one or a plurality of control computers. For example, as shown in FIG. 6 , the control unit 100 includes a circuit 91 . The circuit 91 has one or a plurality of processors 92, a memory 93, a storage 94, an input/output port 95 and a timer 96. The input/output port 95 is connected to the valves 32a and 32b, the air supply part 41, the air supply part 42, the exhaust part 52, the lock 22, the valves 71, 72, 73, the pump P, the lock 64, the switch driving part 65, and the conveying machine Arm A3, oxygen concentration sensors D1~D4, volatile matter concentration sensor D7, pressure sensors D8, D9, input part 23a, oxygen concentration sensor D6, carrier sensor D10, door switch sensor Electrical signals are input and output between D11, the input unit 66a, the display unit 66b, and the like. The timer 96 measures the elapsed time by counting reference pulses of a fixed period, for example.

The storage 94 is a recording medium that can be read by a computer, such as a hard disk. The memory medium records the programs used to constitute each functional module. Memory media can also be removable media such as non-volatile semiconductor memory, magnetic disks, and optical disks. The memory 93 temporarily records the program loaded from the memory medium of the storage 94 and the calculation result caused by the processor 92 . The processor 92 forms each functional module by cooperating with the memory 93 to execute the above program.

In addition, the hardware structure of the controller 100 is not necessarily limited to the one in which each functional module is composed of a program. For example, each functional module of the controller 100 can also be composed of a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) integrating the logic circuit.

[Substrate processing method] Next, the contents of the substrate processing performed by the substrate processing apparatus 1 will be described as an example of the substrate processing method. The substrate processing includes substrate processing in the coating device 2 , air conditioning processing performed accompanying the substrate processing, loading processing of the carrier into the package body 20 , and unloading processing of the carrier 11 from the package body 20 . The procedures for each processing are explained below.

(Substrate processing program) The coating device 2 performs substrate processing in the next step. First, the receiving and receiving arm A1 transports the wafer W in the carrier 11 to the rack unit U10. Next, the transfer arm A2 transfers the wafer W from the rack unit U10 to the liquid processing unit U1, and the liquid processing unit U1 applies a coating process to the wafer W. Next, the transfer arm A2 transfers the wafer W from the liquid processing unit U1 to the heat treatment unit U2, and the heat treatment unit U2 performs heat treatment on the wafer W. Next, the transfer arm A2 transfers the wafer W from the thermal processing unit U2 to the rack unit U10, and the receiving and receiving arm A1 returns the wafer W from the rack unit U10 to the carrier 11. Through the above, the coating process and heat treatment for one wafer W are completed.

(air conditioning treatment) Fig. 7 is a flowchart showing the air conditioning processing procedure. First, the controller 100 executes step S01. In step S01, the first oxygen concentration adjustment unit 102 confirms that the door 21 is in a locked state (a state in which the door 21 is closed and the opening of the door 21 is prohibited by the lock 22). When the door 21 is not in the locked state, the first oxygen concentration adjustment unit 102 waits until the door 21 becomes the locked state.

After the door 21 enters the locked state, the control unit 100 executes step S02. In step S02, the first oxygen concentration adjustment unit 102 controls the first air conditioning unit 30 (for example, the concentration adjustment unit) in a manner to start a cycle process of maintaining the oxygen concentration inside the package 20 lower than the oxygen concentration outside the package 20. 32). Specifically, the first oxygen concentration adjustment unit 102 controls the concentration adjustment unit 32 to decrease the opening degree of the valve 32a (for example, close the valve 32a) and increase the opening degree of the valve 32b, and to start each air blower f. The resulting gas pressure delivery method controls the first air conditioning unit 30 .

Next, the controller 100 executes steps S03 and S04 in sequence. In step S03, the air pressure regulator 101 obtains the air pressure data in the housing 10 from the pressure sensor D8, and obtains the air pressure data in the package body 20 from the pressure sensor D9. In step S04, the air pressure regulator 101 determines whether the air pressure in the package body 20 is lower than the target air pressure based on the air pressure data obtained in step S03.

In step S04, when the air pressure in the package body 20 is determined to be less than the non-target air pressure, the control unit 100 executes step S05. In step S05, the air pressure regulator 101 controls the exhaust unit 52 to increase the opening and closing degree of the damper 52a.

Next, the control unit 100 executes step S06. In step S04, when the air pressure in the package body 20 is determined to be less than the target air pressure, the control unit 100 executes step S06 without executing step S05. In step S06, the air pressure regulator 101 determines whether the air pressure in the casing 10 is equal to or higher than the target air pressure.

In step S06, when the air pressure inside the casing 10 is determined to be above the non-target air pressure, the control unit 100 sequentially executes steps S07 and S08. In step S07 , the air pressure regulator 101 controls the air blower 41 so as to increase the amount of gas transmitted from the package body 20 to the casing 10 . In step S08 , the air pressure regulator 101 controls the air blower 42 so that the amount of gas transferred from the casing 10 to the package 20 is reduced. In addition, the control unit 100 may change the order of steps S07 and S08, or may execute steps S07 and S08 in parallel. Alternatively, the control unit 100 may only execute any one of steps S07 and S08.

Next, the control unit 100 sequentially executes steps S09 and S10. In step S06, when the air pressure in the casing 10 is determined to be equal to or higher than the target air pressure, the control unit 100 executes steps S09 and S10 without executing steps S07 and S08. In step S09, the first oxygen concentration adjustment unit 102 obtains the measurement result of the oxygen concentration in the package 20 from the oxygen concentration sensor D1. In step S10 , the first oxygen concentration adjustment unit 102 determines whether the oxygen concentration in the package 20 is lower than a predetermined value based on the measurement result obtained in step S09 .

In step S10, when the oxygen concentration in the package body 20 is determined to be higher than the predetermined value, the control unit 100 executes step S11. In step S11, the first oxygen concentration adjustment unit 102 controls the first air conditioning unit 30 to increase the opening and closing degree of the valve 32b. In addition, the first oxygen concentration adjusting unit 102 may control the first air conditioning unit 30 by reducing the opening and closing degree of the valve 32a.

Next, the control unit 100 executes step S12. In step S12, the first oxygen concentration adjustment unit 102 determines whether there is a request to unlock the door 21 from the input unit 23a.

In step S12, when it is determined that there is no request to unlock the door 21 from the input unit 23a, the control unit 100 returns the process to step S02. Thereafter, in step S12, until it is determined that there is a request to unlock the door 21, the control unit 100 continues to adjust the pressure in the casing 10 and the package 20 and the oxygen concentration in the package 20. .

In step S12, when it is determined that there is no request to unlock the door 21 from the input unit 23a, the control unit 100 executes step S13. In step S13, the control unit 100 executes the first lock release process. The specific content of the first lock release process is as described later. With the above, the air conditioning processing procedure is completed.

FIG. 8 is a flowchart showing the first lock release processing program. As shown in Figure 8, the controller 100 first executes step S101. In step S101, the first oxygen concentration adjustment unit 102 controls the concentration adjustment unit 32 and the exhaust unit 52 so as to start the process of increasing the oxygen concentration in the package body 20. For example, the first oxygen concentration adjustment unit 102 controls the concentration adjustment unit 32 to increase the opening degree of the valve 32a and decrease the opening degree of the valve 32b (for example, closing the valve 32b), and to increase the opening degree of the damper 52a. The exhaust part 52 is controlled in an ascending manner.

Next, the control unit 100 sequentially executes steps S102 and S103. In step S102, the first oxygen concentration adjustment unit 102 obtains the measurement results of the oxygen concentration in the package 20 from the oxygen concentration sensors D1 to D4. In step S103, the first oxygen concentration adjustment unit 102 determines whether the measurement results of the oxygen concentration sensors D1 to D4 include values below a predetermined value based on the measurement results obtained in step S102.

In step S103, when it is determined that the measurement results of the oxygen concentration sensors D1 to D4 include a value below a predetermined value, the control unit 100 returns the process to step S102. Thereafter, the measurement results of the oxygen concentration sensors D1 to D4 are repeatedly confirmed until the measurement results of the oxygen concentration sensors D1 to D4 no longer have a value below the predetermined value.

In step S103, when it is determined that the measurement results of the oxygen concentration sensors D1 to D4 do not have a value below the predetermined value, the control unit 100 sequentially executes steps S104 and S105. In step S104, the first oxygen concentration adjustment unit 102 obtains the measurement result of the volatile concentration in the package 20 from the volatile concentration sensor D7. In step S105, the first oxygen concentration adjustment unit 102 determines whether the measurement result of the volatile matter concentration sensor D7 is equal to or less than a predetermined value.

In step S105, when the measurement result of the volatile concentration sensor D7 is determined to be higher than the predetermined value, the control unit 100 returns the process to step S104. Thereafter, the measurement result of the volatile matter concentration sensor D7 is repeatedly checked until the measurement result of the volatile matter concentration sensor D7 becomes the predetermined value or less.

In step S105, when the measurement result of the volatile matter concentration sensor D7 is determined to be less than the predetermined value, the control unit 100 executes step S106. In step S106, the first lock control unit 103 controls the lock 22 to allow the door 21 to be opened. Through the above, the first lock release process can be completed, and the door 21 can be opened. Thereby, operators can enter the package body 20 to perform maintenance work.

(Carrier import processing procedure) 9 and 10 are flowcharts showing the carrier loading processing procedure. First, the controller 100 executes step S21. In step S21, the second lock control unit 105 waits until a request to unlock the door 62 is input to the input unit 66a.

In step S21, after there is a request to unlock the door 62 from the input unit 66a, the control unit 100 sequentially executes steps S22 and S23. In step S22 , the second oxygen concentration adjustment unit 104 controls the second air conditioning unit 70 so as to start a process of bringing the oxygen concentration inside the load lock chamber 60 close to the oxygen concentration outside the package 20 . The second oxygen concentration adjusting unit 104 controls the second air conditioning unit 70 so as to increase the opening degree of the valve 71, decrease the opening degree of the valve 72 (for example, close the valve 72), and increase the opening degree of the valve 73. In step S23, the second lock control unit 105 determines whether the measurement result of the oxygen concentration in the load lock chamber 60 obtained from the oxygen concentration sensor D6 is equal to or higher than a predetermined value.

In step S23, when the measurement result of the oxygen concentration sensor D6 is determined to be lower than the predetermined value, the control unit 100 returns the process to step S22. Thereafter, the measurement result of the oxygen concentration sensor D6 is repeatedly checked until the measurement result of the oxygen concentration sensor D6 becomes a predetermined value or more.

In step S23, when the measurement result of the oxygen concentration sensor D6 is determined to be equal to or greater than the predetermined value, the control unit 100 executes step S24. In step S24, the second oxygen concentration adjustment unit 104 controls the second air conditioning unit 70 so as to stop the process of increasing the oxygen concentration in the load lock chamber 60. For example, the second oxygen concentration adjusting unit 104 controls the second air conditioning unit 70 to close the valve 71 , the valve 72 and the valve 73 .

Next, the control unit 100 executes step S25. In step S25, the second lock control unit 105 switches the locked state (a state in which the door 62 is closed and the opening of the door 62 is prohibited by the lock 64) to the unlocked state (the door 62 is closed and is not opened by the lock 64). The lock 64 is controlled in such a manner that the lock 64 prohibits the opening of the door 62 and allows the opening of the door 62 .

Next, the control unit 100 executes step S26. In step S26, the transport control unit 106 waits until the carrier 11 is loaded into the accommodating unit 61. Specifically, the transport control unit 106 waits until the carrier sensor D10 in the storage unit 61 detects the carrier 11 .

When the carrier sensor D10 in the receiving part 61 detects the carrier 11, the control part 100 executes step S27. In step S27, the transportation control unit 106 controls the display unit 65b to display that the carrier 11 is present in the load lock chamber 60.

As shown in Figure 10, the controller 100 then executes step S28. In step S28, the transportation control unit 106 waits until a request for transportation of the carrier 11 is input to the input unit 65a.

When a request to transport the carrier 11 is input, the control unit 100 sequentially executes steps S29 and S30. In step S29, the second lock control unit 105 confirms that the door 62 is closed. Specifically, the second lock control unit 105 confirms that the door switch sensor D11 detects that the door 62 is closed. When the door 62 is not closed, the second lock control unit 105 waits until the door 62 is closed.

Next, the control unit 100 executes step S30. In step S30, the second lock control unit 105 controls the lock 64 to switch the unlocked state to the locked state and prohibit the opening of the door 62.

Next, the control unit 100 sequentially executes steps S31 and S32. In step S31, the second oxygen concentration adjustment unit 104 controls the second air conditioning unit 70 so as to start a process of lowering the oxygen concentration in the load lock chamber 60. The second oxygen concentration adjusting unit 104 decreases the opening degree of the valve 71 (for example, closes the valve 71), increases the opening degree of the valve 72, and decreases the opening degree of the valve 73 (for example, closes the valve 73) to start the pump. The method of pressurizing the gas caused by P controls the second air conditioning unit 70 . In step S32, the third lock control unit 107 determines whether the measurement result of the oxygen concentration in the load lock chamber 60 obtained from the oxygen concentration sensor D6 is equal to or less than a predetermined value.

In step S32, when the measurement result of the oxygen concentration sensor D6 is determined to be higher than the predetermined value, the control unit 100 returns the process to step S31. Thereafter, the measurement result of the oxygen concentration sensor D6 is repeatedly checked until the measurement result of the oxygen concentration sensor D6 becomes a predetermined value or more.

In step S32, when the measurement result of the oxygen concentration sensor D6 is determined to be less than the predetermined value, the control unit 100 executes step S33. In step S33, the second oxygen concentration adjustment unit 104 controls the second air conditioning unit 70 so as to stop the reduction process of the oxygen concentration in the load lock chamber 60. For example, the second oxygen concentration adjustment unit 104 controls the second air conditioner to close the valve 71, the valve 72, and the valve 73 so that the opening and closing degree is set to 0, and to stop the pressure feeding of gas by the pump P. Department 70.

Next, the control unit 100 sequentially executes steps S34, S35, and S36. In step S34, the third locking control unit 107 switches the locking state to the unlocked state, and the transportation control unit 106 controls the switch driving unit 65 to open the door 63. In step S35 , the transport control unit 106 controls the transport robot arm A3 to transport the carrier 11 in the load lock chamber 60 to the carrier block 3 . In step S36, the transportation control unit 106 controls the display unit 65b so as to display that the carrier 11 is not present in the load lock chamber 60. For example, the transport control unit 106 controls the display unit 65b so as to switch from the lighting state to the off state.

Next, the control unit 100 executes step S37. In step S37, the transport control unit 106 controls the switch drive unit 65 to close the door 63, and the third lock control unit 107 switches the unlocked state to the locked state. Through the above, the carrier loading process is completed.

(Carrier removal process) 11 and 12 are flowcharts showing the carrier unloading processing procedure. As shown in Fig. 11, the controller 100 first executes step S41. In step S41, the second oxygen concentration adjustment unit 104 waits until the carrier 11 provided in the carrier block 3 becomes a removal target. The carrier 11 to be taken out refers to, for example, the carrier 11 that has completed the coating process for all the wafers W accommodated therein.

Next, the control unit 100 sequentially executes steps S42 and S43. In step S42 , the second oxygen concentration adjusting unit 104 controls the second air conditioning unit 70 so as to start a process of lowering the oxygen concentration in the empty load lock chamber 60 among the plurality of load lock chambers 60 . The second oxygen concentration adjusting unit 104 decreases the opening degree of the valve 71 (for example, closes the valve 71), increases the opening degree of the valve 72, and decreases the opening degree of the valve 73 (for example, closes the valve 73) to start the pump. The method of pressurizing the gas caused by P controls the second air conditioning unit 70 . In step S43, the third lock control unit 107 determines whether the measurement result of the oxygen concentration in the load lock chamber 60 obtained from the oxygen concentration sensor D6 is equal to or less than a predetermined value.

In step S43, when the measurement result of the oxygen concentration sensor D6 is determined to be higher than the predetermined value, the control unit 100 returns the process to step S42. Thereafter, the measurement result of the oxygen concentration sensor D6 is repeatedly checked until the measurement result of the oxygen concentration sensor D6 becomes a predetermined value or more.

In step S43, when the measurement result of the oxygen concentration sensor D6 is determined to be less than the predetermined value, the control unit 100 executes step S44. In step S44, the second oxygen concentration adjustment unit 104 controls the second air conditioning unit 70 so as to stop the reduction process of the oxygen concentration in the load lock chamber 60. For example, the second oxygen concentration adjustment unit 104 controls the second air conditioner to close the valve 71, the valve 72, and the valve 73 so that the opening and closing degree is set to 0, and to stop the pressure feeding of gas by the pump P. Department 70.

Next, the control unit 100 sequentially executes steps S45, S46, and S47. In step S45, the third locking control unit 107 switches the locking state to the unlocked state, and the transportation control unit 106 controls the switch driving unit 65 to open the door 63. In step S46 , the transport control unit 106 controls the transport robot arm A3 so as to transport the carriers 11 of the carrier block 3 into the load lock chamber 60 . In step S47, the transportation control unit 106 controls the display unit 65b to display that the carrier 11 is present in the load lock chamber 60. For example, the transport control unit 106 controls the display unit 65b to switch the display unit 65b from the light-off state to the light-on state.

Next, the control unit 100 executes step S48. In step S48, the transport control unit 106 controls the switch drive unit 65 to close the door 63, and the third lock control unit 107 switches the unlocked state to the locked state.

As shown in Figure 12, the controller 100 then executes step S49. In step S49, the second oxygen concentration adjustment unit 104 waits until a request to unlock the door 62 is input to the input unit 65a.

When a request to unlock the door 62 is input, the control unit 100 sequentially executes steps S50 and S51. In step S50 , the second oxygen concentration adjustment unit 104 controls the second air conditioning unit 70 so as to start a process of increasing the oxygen concentration in the load lock chamber 60 . The second oxygen concentration adjusting unit 104 controls the second air conditioning unit 70 so as to increase the opening degree of the valve 71, decrease the opening degree of the valve 72 (for example, close the valve 72), and increase the opening degree of the valve 73. In step S51, the second oxygen concentration adjustment unit 104 determines whether the measurement result of the oxygen concentration in the load lock chamber 60 obtained from the oxygen concentration sensor D6 is equal to or higher than a predetermined value.

In step S51, when the measurement result of the oxygen concentration sensor D6 is determined to be lower than the predetermined value, the control unit 100 returns the process to step S50. Thereafter, the measurement result of the oxygen concentration sensor D6 is repeatedly checked until the measurement result of the oxygen concentration sensor D6 becomes a predetermined value or more.

In step S51, when the measurement result of the oxygen concentration sensor D6 is determined to be equal to or greater than the predetermined value, the control unit 100 executes step S52. In step S52, the second oxygen concentration adjustment unit 104 controls the second air conditioning unit 70 to stop the process of increasing the oxygen concentration in the load lock chamber 60. The second oxygen concentration adjusting unit 104 controls the valve 71 , the valve 72 and the valve 73 so that the opening and closing degree is set to 0.

Next, the control unit 100 sequentially executes steps S53 and S54. In step S53, the second lock control unit 105 controls the lock 64 to switch the lock state to the unlocked state. In step S54, the transport control unit 106 waits until the carrier sensor D10 does not detect the carrier 11.

When the carrier sensor D10 does not detect the carrier 11, the control unit 100 executes step S55. In step S55, the transportation control unit 106 controls the display unit 65b so as to display that the carrier 11 is not present in the load lock chamber 60. For example, the transport control unit 106 controls the display unit 65b so as to switch from the lighting state to the off state.

Next, the control unit 100 executes step S56. In step S56, the transport control unit 106 waits until a request to lock the door 62 is input to the input unit 65a. In step S56, when a request to lock the door 62 is input, the control unit 100 executes step S56. In step S26, the second lock control unit 105 confirms that the door 62 is closed. Specifically, the second lock control unit 105 confirms that the door switch sensor D11 detects that the door 62 is closed. When the door 62 is not closed, the second lock control unit 105 waits until the door 62 is closed.

Next, the control unit 100 executes step S58. In step S58, the second lock control unit 105 controls the lock 64 to switch the unlocked state to the locked state and allow the door 62 to be opened. Through the above, the carrier unloading process is completed.

[Effects of this embodiment]

The substrate processing device 1 is equipped with: a carrier block 3, which can be provided with a carrier 11 for accommodating a plurality of wafers W; a liquid processing unit U1 and a heat treatment unit U2 for processing the wafers W; a transfer arm A2, which is mounted on the carrier 11 transports the wafer W between the liquid processing unit U1 and the thermal processing unit U2; the housing 10 houses the liquid processing unit U1, the thermal processing unit U2 and the transport arm A2; the package 20 houses it with a higher airtightness than the housing 10 Housing 10; the first pressure regulating part 40, which regulates the air pressure in the housing 10; the second pressure regulating part 50, which regulates the air pressure in the package body 20; and the control part 100, so that the air pressure in the package body 20 is kept below The first pressure regulating part 40 and the second pressure regulating part 50 are controlled by the state of any one of the air pressure outside the package body 20 and the air pressure inside the casing 10 .

According to the substrate processing apparatus 1, the housing 10 is accommodated in the package 20 with a higher airtightness than the housing 10, and the air pressure inside the package 20 is kept lower than the air pressure outside the package 20 and the air pressure inside the housing 10. state, whereby the gas leaking from the inside of the casing 10 to the outside of the casing 10 can be suppressed from leaking out of the package body 20 . Therefore, the oxygen concentration in each part of the casing 10 , such as the transfer area, the liquid treatment unit U1 , etc., can be maintained in a desired state. Therefore, the substrate processing apparatus 1 is useful for managing the oxygen concentration during substrate processing.

The substrate processing apparatus 1 may further include: a first air conditioning unit 30 to adjust the oxygen concentration in the package 20 , and the control unit 100 may further perform the following steps: to adjust the oxygen concentration in the package 20 The first air conditioning unit 30 is controlled to maintain the oxygen concentration lower than that outside the package body 20 . In this case, the oxygen concentration in the package 20 containing the housing 10 is adjusted, thereby, The oxygen concentration in each part within the housing 10 can be adjusted efficiently.

The first air conditioning unit 30 may also include: a gas supply unit 31 that supplies gas into the package body 20; a concentration adjustment unit 32 that adjusts the oxygen concentration of the gas sent from the gas supply unit 31 to the package body 20; and The reflux part 33 makes the gas flow back from the inside of the package 20 to the gas supply part 31. The control part 100 may also perform the following steps: maintaining the oxygen concentration inside the package 20 lower than the oxygen concentration outside the package 20. In this case, the concentration adjustment unit 32 is controlled so that the oxygen concentration of the gas sent from the gas supply unit 31 into the package body 20 is lower than the oxygen concentration outside the package body 20 . In this case, since the concentration-adjusted gas is delivered from the gas supply part 31 into the package body 20 , the oxygen concentration in the package body 20 can be maintained more reliably. In addition, since the gas in the package 20 is returned to the gas supply part 31 through the return part 33, the gas with the adjusted oxygen concentration can be recycled and the oxygen concentration can be maintained efficiently.

The first pressure regulating part 40 may also have an air blowing part 41 for transmitting gas from the package body 20 to the housing 10. The second pressure regulating part 50 may also have an exhaust part 52 for transmitting gas from the package body 20 to the housing 10. Part of the gas within 20 is directed to the exhaust path. According to this structure, the air pressure can be adjusted with a simple structure.

The substrate processing device 1 may further include: a door 21 for entering and exiting the package 20; a lock 22 for switching between a state that allows the opening of the door 21 and a state that prohibits the opening of the door 21; and an oxygen concentration. The sensor D1 measures the oxygen concentration in the package 20 . The control unit 100 may further perform the following steps: so that the oxygen concentration of the gas sent from the gas supply unit 31 to the package 20 is higher than the oxygen concentration in the package 20 . The concentration adjustment unit 32 is controlled in a manner that the oxygen concentration in the air is higher; and when the measurement result of the oxygen concentration caused by the oxygen concentration sensor D1 is lower than a predetermined value, the lock is controlled in a manner that prohibits the opening of the door 21 Solid 22. In this case, the lock 22 prohibits the door 21 from opening until the oxygen concentration in the package 20 is adjusted to a predetermined value or more. Therefore, for example, when a person enters the package 20, Before the door 21 is opened, the oxygen concentration in the package body 20 is surely increased.

Furthermore, the substrate processing apparatus 1 may further include an oxygen concentration sensor D2 that measures the oxygen concentration in a space open to the outside in the casing 10 , and the control unit 100 is configured to detect the oxygen concentration sensor D2 When the resulting measurement result of the oxygen concentration is lower than a predetermined value, the lock 22 can also be controlled to prohibit the opening of the door 21 . In this case, when opening the space openable to the outside in the casing 10, the oxygen concentration can be reliably increased.

In addition, the substrate processing apparatus 1 may further include an oxygen concentration sensor D3 for measuring the oxygen concentration in the recirculation part 33, and the control unit 100 may be configured to measure the oxygen concentration caused by the oxygen concentration sensor D3. When the detection result is lower than the predetermined value, the lock 22 can also be controlled to prohibit the opening of the door 21 . In this case, since the lock 22 prohibits the door 21 from opening until the oxygen concentration in the return part 33 reaches a predetermined value or more, the oxygen concentration in the package body 20 can be increased more reliably.

Furthermore, the oxygen concentration sensor D4 may be further provided to measure the oxygen concentration in the gas supply unit 31, and the control unit 100 may detect the oxygen concentration even if the detection result of the oxygen concentration by the oxygen concentration sensor D4 is lower than a predetermined value. In this case, the lock 22 can also be controlled by prohibiting the opening of the door 21 . In this case, the lock 22 prevents the door 21 from opening until the oxygen concentration in the gas supply part 31 reaches a predetermined value or more. Therefore, the oxygen concentration in the package 20 can be increased more reliably.

Moreover, the substrate processing apparatus 1 may further include a volatile concentration sensor D7 for measuring the concentration of volatiles flowing out from the liquid processing unit U1 and the heat treatment unit U2 into the package 20, and the control unit 100, even when the measurement result caused by the volatile matter concentration sensor D7 is higher than a predetermined value, the lock 22 can be controlled to prohibit the opening of the door 21. In this case, the lock 22 prevents the door 21 from opening until the concentration of volatile matter in the package body 20 becomes below the predetermined value. Therefore, the volatile matter in the package body 20 can be reliably reduced.

The volatile matter concentration sensor D7 may also be provided in the exhaust part 52 . With this configuration, the exhaust part 52 can be used to easily detect volatile matter. In addition, when the opening and closing degree of the baffle 52a is the maximum, the amount of gas guided to the exhaust part 52 increases, so the volatile matter can be detected more easily.

The gas supply part 31 may also include: a pipeline L1 that guides the gas into the package 20; and a pipeline L2 that guides the gas into the liquid treatment unit U1 and the heat treatment unit U2. In this case, since the gas is guided into the package body 20 through the pipeline L1, and the gas is guided into the liquid treatment unit U1 and the heat treatment unit U2 through the pipeline L2 as another path, it can be more stringent. The oxygen concentration in the liquid treatment unit U1 and the heat treatment unit U2 is adjusted accordingly.

It may further include an exhaust part 51 to guide the gas in the liquid treatment unit U1 and the heat treatment unit U2 to the exhaust path. In this case, since the gas in the liquid treatment unit U1 and the heat treatment unit U2 with high volatile matter concentration is exhausted, it is possible to suppress the volatile matter concentration from becoming excessively high. In addition, compared with the case where the gas in the liquid treatment unit U1 and the heat treatment unit U2 with a high concentration of volatile matter is returned to the return part 33, the amount of volatile matter removed by the filter units 33b and 33d of the return part 33 will be reduced. , therefore, an increase in the frequency of maintenance of the filter units 33b, 33d can be suppressed.

The exhaust part 51 may also have pipelines L7 and L8 to guide gas to the side of the housing 10 . According to this structure, it is easy to integrate the exhaust pipes from the liquid processing unit U1 and the heat treatment unit U2 in the package body 20 .

The substrate processing device 1 may further include: a load lock chamber 60 for accommodating the carrier 11; a door 62 for opening and closing the load lock chamber 60 from the inside to the outside of the package body 20; and a door 63 for opening and closing the load lock chamber 60 from the inside of the package body 20. switch; the receiving and receiving part 67 is used to receive and receive the carrier 11 between the load lock chamber 60 and the carrier block 3; and the second air conditioning part 70 is used to adjust the oxygen concentration in the load lock chamber 60. The control part 100 can also be Further execution is as follows: before the door 62 is opened, the second air conditioning unit 70 is controlled in such a manner that the oxygen concentration in the load lock chamber 60 is close to the oxygen concentration outside the package 20; and before the door 63 is opened, The second air conditioning unit 70 is controlled so that the oxygen concentration in the load lock chamber 60 is close to the oxygen concentration in the package body 20 . According to this configuration, the door 62 can be opened to carry out the carrier 11 from the load lock chamber 60 , and the door 63 can be opened to store the carrier 11 in the load lock chamber 60 . In addition, when the carrier 11 is carried out and stored, the leakage of gas with a high oxygen concentration from the load lock chamber 60 to the outside of the package 20 and the leakage of gas with a low oxygen concentration from the load lock chamber 60 into the package 20 can be suppressed at the same time. of leakage.

The substrate processing apparatus 1 may further include: a lock 64 for switching between a state that allows the door 62 to be opened and a state that prohibits the door 62 from being opened; and a switch drive unit 65 that switches between a state that allows the door 63 to be opened and a state that prohibits the door 62 from being opened. The prohibition door 63 is switched to an open state; and the oxygen concentration sensor D6 measures the oxygen concentration in the load lock chamber 60. The control unit 100 may further perform the following: when the oxygen concentration sensor D6 When the measurement result of the oxygen concentration sensor D6 is lower than the predetermined value, the lock 64 is controlled to prohibit the opening of the door 62; and when the measurement result of the oxygen concentration sensor D6 is higher than the predetermined value, the door 63 is prohibited from opening. In an open mode, the switch driving part 65 is controlled. In this case, the opening of the door 62 and the door 63 is prohibited until the oxygen concentration in the load lock chamber 60 is appropriately adjusted. Therefore, the load lock chamber can be adjusted more reliably before the door 62 or the door 63 is opened. Oxygen concentration within 60%.

Although the embodiments have been described above, the present invention is not necessarily limited to the above-described embodiments, and various changes can be made without departing from the gist of the invention. For example, the substrate processing apparatus 1 may be configured to further expose the photosensitive film and develop the photosensitive film in addition to the formation of the photosensitive film. The above-mentioned structure can also be applied to processing of a substrate in an atmosphere other than low oxygen, as long as the processing is performed in a space maintained in a predetermined atmosphere. The substrate to be processed is not limited to a semiconductor wafer, but may also be a glass substrate, a photomask substrate, an FPD (Flat Panel Display), etc.

1‧‧‧Substrate processing device 11‧‧‧Carrier 3‧‧‧Carrier block (carrier support part) 4‧‧‧Processing Block 10‧‧‧Casing 20‧‧‧Inclusion body Gate 21‧‧‧(the first gate) 22‧‧‧Lock (first lock) 30‧‧‧First Air Conditioning Department 31‧‧‧Gas Supply Department 32‧‧‧Concentration adjustment part 33‧‧‧Reflow Department 40‧‧‧First pressure regulating part 41‧‧‧Air supply part 50‧‧‧Second pressure regulating part 51‧‧‧Exhaust part (second exhaust part) 52‧‧‧Exhaust part (first exhaust part) 61‧‧‧Containment Department (Carrier Containment Department) Gate 62‧‧‧(Second Gate) Gate 63‧‧‧(the third gate) 64‧‧‧Lock (second lock) 65‧‧‧Switch driving part (third locking) 67‧‧‧Receiving and Receiving Department 70‧‧‧Second Air Conditioning Department 100‧‧‧Control Department A2‧‧‧Conveying arm D1‧‧‧Oxygen concentration sensor (the first oxygen concentration sensor) D2‧‧‧Oxygen concentration sensor (second oxygen concentration sensor) D3‧‧‧Oxygen concentration sensor (the third oxygen concentration sensor) D4‧‧‧Oxygen concentration sensor (the fourth oxygen concentration sensor) D6‧‧‧Oxygen concentration sensor (fifth oxygen concentration sensor) D7‧‧‧Volatile concentration sensor L1‧‧‧pipeline (first gas pipeline) L2‧‧‧pipe (second gas pipe) L7, L8‧‧‧pipeline (third gas pipeline) U1‧‧‧Liquid processing unit (processing unit) U2‧‧‧Heat treatment unit (processing unit) W‧‧‧wafer (substrate) X‧‧‧Power equipment (exhaust path)

[Fig. 1] Fig. 1 is a schematic diagram showing the schematic structure of a substrate processing apparatus. [Fig. 2] Fig. 2 is a cross-sectional view along line II-II of Fig. 1. [Fig. 3] Fig. 3 is a side view showing a gas pipeline. [Fig. 4] Fig. 4(a) and Fig. 4(b) are schematic diagrams showing the operation panel. [Fig. 5] Fig. 5 is a block diagram showing the functional structure of the control unit. [Fig. 6] Fig. 6 is a block diagram showing the hardware structure of the control unit. [Fig. 7] Fig. 7 is a flowchart showing an air conditioning processing program. [Fig. 8] Fig. 8 is a flowchart showing the first lock release processing program. [Fig. 9] Fig. 9 is a flowchart showing the carrier loading processing program. [Fig. 10] Fig. 10 is a flowchart showing the carrier loading processing program. [Fig. 11] Fig. 11 is a flowchart showing the carrier unloading processing program. [Fig. 12] Fig. 12 is a flowchart showing the carrier unloading processing program.

1:Substrate processing device

2: Coating device

10: Shell

20: package body

21:door

22:Lock

30:First air conditioning department

31:Gas supply department

31a: Blower

31b: filter

31c: filter

31d:Temperature control unit

32:Concentration adjustment part

32a: valve

32b: valve

33: Return Department

33a: Filter unit

33b: Filter unit

33c: Filter unit

33d: filter unit

50: Second pressure regulating part

51:Exhaust part

52:Exhaust part

52a:Baffle

60:Load lock chamber

61: Containment Department

62:door

63:door

64:Lock

70:Second Air Conditioning Department

71:Valve

72:Valve

73:Valve

100:Control Department

C1: Cooling part

C3: Cooling part

D1: Oxygen concentration sensor

D2: Oxygen concentration sensor

D3: Oxygen concentration sensor

D4: Oxygen concentration sensor

D5: Oxygen concentration sensor

D6: Oxygen concentration sensor

D7: Volatile concentration sensor

D8: Pressure sensor

D9: Pressure sensor

F1: filter

F2: Filter

F3: Filter

F4: Filter

L1:Pipeline

L2:Pipeline

L4:Pipeline

L5:Pipeline

L6:Pipeline

L7:Pipeline

L8:Pipeline

L9:Pipeline

L11:Pipeline

L12:Pipeline

L13:Pipeline

L14:Pipeline

U1: liquid processing unit

U2: Heat treatment unit

f: blower

C: cup

N: supply source

P:pump

W:wafer

X: Power equipment

Claims (15)

A substrate processing device is provided with: a carrier support part that can be provided with a carrier that accommodates a plurality of substrates; a processing unit that processes the substrate; a transport arm that transports the substrate between the carrier and the processing unit; and a shell. The body accommodates the aforementioned processing unit and the aforementioned transport arm; the package body accommodates the aforementioned housing with a higher airtightness than the aforementioned housing; the first pressure regulating part regulates the air pressure in the aforementioned housing; the second pressure regulating part regulates the aforementioned The air pressure inside the bag; and the control unit performs the following steps: controlling the first pressure regulating part and the aforementioned third pressure regulator in such a manner that the air pressure inside the bag is maintained lower than the air pressure outside the bag and the air pressure inside the casing. 2. Pressure regulating part. For example, the substrate processing apparatus of claim 1 of the patent application further includes: a first air-conditioning unit to adjust the oxygen concentration in the package, and the control unit further performs the following steps: to adjust the oxygen concentration in the package. The first air conditioning unit is controlled to maintain the oxygen concentration lower than the oxygen concentration outside the package. For example, in the substrate processing device of Item 2 of the patent application, the aforementioned first air conditioning unit has: a gas supply part that supplies gas into the package; a concentration adjustment part that adjusts the oxygen concentration of the gas sent from the gas supply part to the package; and a return part that returns the gas from the package to the gas supply part , the control unit is executed as follows: while maintaining the oxygen concentration inside the package to be lower than the oxygen concentration outside the package, the oxygen concentration ratio of the gas sent from the gas supply unit to the inside of the package is The concentration adjusting part is controlled in such a manner that the oxygen concentration outside the package is lower. For example, in the substrate processing device of Item 3 of the patent application, the first pressure regulating part has an air blowing part to transmit gas from the package to the casing, and the second pressure regulating part has: An exhaust part guides part of the gas in the package to the exhaust path. For example, the substrate processing device of Item 4 of the patent application scope further includes: a first door for entering and exiting the package; a first lock for allowing the opening of the first door and prohibiting the first door. and the first oxygen concentration sensor measures the oxygen concentration in the package, and the control unit further performs the following steps: so that the gas is transferred from the gas supply unit to the package. The concentration adjustment part is controlled in such a manner that the oxygen concentration is higher than the oxygen concentration in the package; and when the measurement result of the oxygen concentration caused by the first oxygen concentration sensor is lower than a predetermined value, prohibiting the third The opening method of a door controls the aforementioned first locking. For example, the substrate processing device of claim 5 of the patent application further includes: a second oxygen concentration sensor that measures the oxygen concentration in the space open to the outside in the housing, and the control unit is even when the second oxygen concentration sensor is used. When the measurement result of the oxygen concentration caused by the oxygen concentration sensor is lower than a predetermined value, the first lock is also controlled to prohibit the opening of the first door. For example, the substrate processing device of Item 5 or 6 of the patent application further includes: a third oxygen concentration sensor that measures the oxygen concentration in the recirculation part, and the control part is configured to detect the oxygen concentration when the third oxygen concentration sensor is used When the detection result of the oxygen concentration caused by the device is lower than a predetermined value, the first locking is also controlled by prohibiting the opening of the first door. For example, the substrate processing device of Item 5 or 6 of the patent application is further equipped with: a fourth oxygen concentration sensor for measuring the oxygen concentration in the gas supply part. The control unit controls the first lock to prohibit the opening of the first door even when the detection result of the oxygen concentration caused by the fourth oxygen concentration sensor is lower than a predetermined value. solid. For example, the substrate processing device of Item 5 or 6 of the patent application further includes: a volatile matter concentration sensor for measuring the concentration of volatile matter flowing out from the aforementioned processing unit into the aforementioned package, and the aforementioned control unit, Even if the measurement result caused by the volatile matter concentration sensor is higher than a predetermined value, the first lock is controlled to prohibit the opening of the first door. For example, in the substrate processing apparatus of claim 9, the volatile matter concentration sensor is provided in the first exhaust part. For example, the substrate processing device of Item 5 or 6 of the patent application, wherein the aforementioned gas supply part includes: a first gas pipeline that guides the gas into the aforementioned package; and a second gas pipeline that guides the gas. to the aforementioned processing unit. For example, if the substrate processing device in item 5 or 6 of the patent scope is applied for, it further includes: The second exhaust part guides the gas in the processing unit to the exhaust path. For example, in the substrate processing device of Item 12 of the patent application, the second exhaust part has a third gas pipeline to guide the gas to the side of the casing. For example, the substrate processing device of any one of items 1 to 6 of the patent application scope, further includes: a carrier receiving part to accommodate the aforementioned carrier; a second door to enable the interior of the aforementioned carrier receiving portion to open and close to the exterior of the aforementioned package; and a third door. , causing the inside of the carrier receiving part to open and close to the inside of the bag; a receiving and receiving part to receive and receive the carrier between the carrier receiving part and the carrier supporting part; and a second air conditioning part to adjust the oxygen concentration in the carrier receiving part, as mentioned above The control unit further performs the following steps: before opening the second door, control the second air-conditioning unit in such a manner that the oxygen concentration in the carrier storage unit is close to the oxygen concentration outside the package; and in the third step, Before the door is opened, the second air-conditioning unit is controlled so that the oxygen concentration in the carrier housing is close to the oxygen concentration in the casing. For example, the substrate processing device in item 14 of the patent application scope includes more It is equipped with: a second lock that switches between a state that allows the opening of the aforementioned second door and a state that prohibits the opening of the aforementioned second door; and a third lock that switches between a state that permits the opening of the aforementioned third door and a state that prohibits the aforementioned third door. The open state of the three doors is switched; and the fifth oxygen concentration sensor measures the oxygen concentration in the aforementioned carrier receiving part. The aforementioned control unit further performs the following: in the aforementioned fifth oxygen concentration sensor caused When the measurement result is lower than a predetermined value, the second lock is controlled to prohibit the opening of the second door; and when the measurement result caused by the fifth oxygen concentration sensor is higher than the predetermined value , controlling the aforementioned third lock by prohibiting the opening of the aforementioned third door.