JP6872632B2 - Board processing equipment - Google Patents

Description

The present disclosure relates to a substrate processing apparatus.

In the semiconductor manufacturing process, there is concern about oxidation of the coating film. Patent Document 1 describes, for example, a heat treatment apparatus for a substrate in which, in the curing treatment of a coating film using an oxygen-sensitive material, the substrate coated with the material is heated and lowered in a processing chamber maintained in a low oxygen atmosphere. Is disclosed.

JP-A-2002-93799

In a substrate processing apparatus such as the above heat treatment apparatus, a material more sensitive to oxygen may be used as the coating film. In such a case, it is required to more appropriately control the oxygen concentration during the substrate processing.

It is an object of the present disclosure to provide a substrate processing apparatus useful for controlling oxygen concentration during substrate processing.

The substrate processing apparatus according to one aspect of the present disclosure includes a carrier support portion in which a carrier accommodating a plurality of substrates can be installed, a processing unit that processes the substrate, and a transport that conveys the substrate between the carrier and the processing unit. The arm, the housing that houses the processing unit and the transport arm, the enclosure that houses the housing with higher airtightness than the housing, the first pressure control unit that regulates the air pressure inside the housing, and the air pressure inside the housing. Performs control of the second pressure regulator to be adjusted and the first pressure regulator and the second pressure regulator so that the air pressure inside the enclosure is kept lower than either the air pressure outside the enclosure or the air pressure inside the housing. It is provided with a control unit for the operation.

According to this board processing device, the enclosure is housed in an enclosure that is more airtight than the enclosure, and the air pressure inside the enclosure is kept lower than the air pressure outside the enclosure and the air pressure inside the enclosure. It is possible to prevent the gas leaked to the outside of the enclosure from leaking to the outside of the enclosure. Therefore, it is possible to adjust the oxygen concentration in each part of the housing such as the transport region and the processing unit to a desired state. Therefore, this substrate processing apparatus is useful for controlling the oxygen concentration during substrate processing.

It further includes a first air conditioner that regulates the oxygen concentration inside the enclosure, and the control unit further controls the first air conditioner to keep the oxygen concentration inside the enclosure lower than the oxygen concentration outside the enclosure. You may. In this case, by adjusting the oxygen concentration in the enclosure accommodating the housing, the oxygen concentration in each part in the housing can be efficiently adjusted.

The first air conditioning unit recirculates gas from the enclosure to the gas supply unit, a gas supply unit that supplies gas into the enclosure, a concentration adjustment unit that adjusts the oxygen concentration of the gas sent from the gas supply unit to the enclosure, and It has a recirculation unit, and the control unit is sent from the gas supply unit into the enclosure when the oxygen concentration inside the enclosure is kept lower than the oxygen concentration outside the enclosure, as compared with the oxygen concentration outside the enclosure. It may be carried out to control the concentration adjusting unit so as to lower the oxygen concentration of the gas. In this case, since the oxygen concentration of the gas sent from the gas supply unit into the enclosure is adjusted, the oxygen concentration in the enclosure can be maintained more reliably. Further, since the gas in the enclosure is returned to the gas supply unit by the reflux unit, the gas having an adjusted oxygen concentration can be circulated and used, and the oxygen concentration can be efficiently maintained.

The first pressure adjusting part has a blower part that sends gas from the inside of the enclosure into the housing, and the second pressure adjusting part has a first exhaust part that guides a part of the gas in the enclosure to the exhaust path. May be good. In this case, the atmospheric pressure can be adjusted with a simple configuration.

This board processing device has a first door for entering and exiting the enclosure, a first lock that switches between a state that allows the opening of the first door and a state that prohibits the opening of the first door, and the oxygen concentration in the enclosure. The control unit is equipped with a primary oxygen concentration sensor that measures the oxygen concentration, and the control unit has a concentration adjustment unit that increases the oxygen concentration of the gas sent from the gas supply unit to the enclosure compared to the oxygen concentration inside the enclosure. Control and control of the first lock so as to prohibit the opening of the first door when the measurement result of the oxygen concentration by the first oxygen concentration sensor is lower than a predetermined value may be further executed. .. In this case, the opening of the first door is prohibited by the first lock until the oxygen concentration in the enclosure is adjusted to a predetermined value or more. Therefore, for example, the oxygen concentration in the enclosure prior to the entry of the operator into the enclosure. Can be surely raised.

Further, this substrate processing device further includes a secondary oxygen concentration sensor that measures the oxygen concentration in the space inside the housing that can be opened to the outside, and the control unit determines the measurement result of the oxygen concentration by the secondary oxygen concentration sensor. The first lock may be controlled so as to prohibit the opening of the first door even when the value is lower than the value. In this case, the oxygen concentration can be reliably increased prior to the operator opening the space of the housing that can be opened to the outside.

Further, this substrate processing apparatus further includes a third oxygen concentration sensor that measures the oxygen concentration in the reflux unit, and the control unit is also the first when the detection result of the oxygen concentration by the third oxygen concentration sensor is lower than a predetermined value. The first lock may be controlled so as to prohibit the opening of one door. In this case, since the opening of the first door is prohibited by the first lock until the oxygen concentration in the reflux portion becomes equal to or higher than a predetermined value, the oxygen concentration in the enclosure can be increased more reliably.

A fourth oxygen concentration sensor that measures the oxygen concentration in the gas supply unit is further provided, and the control unit prohibits the opening of the first door even when the detection result of the oxygen concentration by the fourth oxygen concentration sensor is lower than a predetermined value. The first lock may be controlled as such. In this case, since the opening of the first door is prohibited by the first lock until the oxygen concentration in the gas supply unit becomes equal to or higher than a predetermined value, the oxygen concentration in the enclosure can be increased more reliably.

Further, this substrate processing apparatus further includes a volatile concentration sensor for measuring the concentration of volatiles flowing out from the processing unit into the enclosure, and the control unit has a control unit in which the measurement result by the volatile concentration sensor is higher than a predetermined value. The first lock may be controlled so as to prohibit the opening of the first door even when it is high. In this case, the first lock prohibits the opening of the first door until the concentration of volatiles in the enclosure falls below a predetermined value. Therefore, prior to the entry of the operator into the enclosure, the volatiles in the enclosure are removed. It can be surely reduced.

The volatile matter concentration sensor may be provided in the first exhaust unit. With this configuration, the volatile matter concentration can be easily detected by using the first exhaust unit.

The gas supply unit may include a first gas pipeline that guides gas into the enclosure and a second gas pipeline that guides gas into the processing unit. In this case, while guiding the gas in the enclosure through the first gas pipeline, the gas is guided into the processing unit through the second gas pipeline as a separate route, so that the oxygen concentration in the processing unit can be adjusted more strictly. it can.

A second exhaust section that guides the gas in the processing unit to the exhaust path may be further provided. In this case, since the gas in the processing unit having a high volatile concentration is exhausted, it is possible to prevent the volatile concentration from becoming excessive.

The second exhaust unit may have a third gas pipeline for leading out gas to the side of the housing. According to this configuration, it is easy to organize the exhaust pipes from the processing unit in the enclosure.

This board processing device includes a carrier accommodating portion for accommodating a carrier, a second door for opening and closing the inside of the carrier accommodating portion to the outside of the enclosure, a third door for opening and closing the inside of the carrier accommodating portion inside the enclosure, and an inside of the carrier accommodating portion and a carrier support portion. A delivery unit that transfers the carrier to and from the carrier and a second air-conditioning unit that adjusts the oxygen concentration in the carrier accommodation unit are further provided, and the control unit is provided with an oxygen concentration in the carrier accommodation unit prior to opening the second door. Control the second air-conditioning unit so that it approaches the oxygen concentration outside the enclosure, and control the second air-conditioning unit so that the oxygen concentration inside the carrier housing unit approaches the oxygen concentration inside the enclosure prior to opening the third door. And you may do more. In this case, when the carrier is carried in and out by opening the second door, it is possible to suppress the leakage of gas having a low oxygen concentration from the inside of the carrier accommodating portion to the outside of the enclosure. When the carrier is conveyed by opening the third door, it is possible to suppress leakage of a gas having a high oxygen concentration from the carrier accommodating portion into the enclosure.

This board processing device has a second lock that switches between a state that allows the opening of the second door and a state that prohibits the opening of the second door, and a state that allows the opening of the third door and prohibits the opening of the third door. A third lock for switching between the doors and a fifth oxygen concentration sensor for measuring the oxygen concentration in the carrier housing unit is further provided, and the control unit is provided with a control unit when the measurement result by the fifth oxygen concentration sensor is lower than a predetermined value. Control the second lock to prohibit the opening of the second door, and control the third lock to prohibit the opening of the third door when the measurement result by the fifth oxygen concentration sensor is higher than the predetermined value. And you may do more. In this case, the opening of the second door and the third door is prohibited until the oxygen concentration in the carrier accommodating portion is appropriately adjusted. Therefore, prior to the opening of the second door or the third door, the inside of the carrier accommodating portion is prohibited. The oxygen concentration can be adjusted more reliably.

According to the present disclosure, it is possible to provide a substrate processing apparatus useful for controlling the oxygen concentration during substrate processing.

FIG. 1 is a schematic view showing a schematic configuration of a substrate processing apparatus. FIG. 2 is a cross-sectional view taken along the line II-II of FIG. FIG. 3 is a side view showing a gas pipeline. 4 (a) and 4 (b) are schematic views showing an operation panel. FIG. 5 is a block diagram showing a functional configuration of the control unit. FIG. 6 is a block diagram showing a hardware configuration of the control unit. FIG. 7 is a flowchart showing the air conditioning processing procedure. FIG. 8 is a flowchart showing the first unlock processing procedure. FIG. 9 is a flowchart showing a carrier carry-in processing procedure. FIG. 10 is a flowchart showing a carrier carry-in processing procedure. FIG. 11 is a flowchart showing a carrier unloading processing procedure. FIG. 12 is a flowchart showing a carrier unloading processing procedure.

Hereinafter, embodiments will be described in detail with reference to the drawings. In the description, the same elements or elements having the same function are designated by the same reference numerals, and duplicate description will be omitted.

[Board processing equipment]
The substrate processing device 1 is a device that processes a substrate. The substrate processing apparatus 1 processes the substrate in an environment of normal pressure, for example. The normal pressure refers to a pressure range of 20% above and below the standard atmospheric pressure of 101325 Pa. The substrate to be processed is, for example, a semiconductor wafer W. Hereinafter, as an example, the substrate processing apparatus 1 for forming a photosensitive film on the wafer W will be described.

As shown in FIGS. 1 and 2, the substrate processing device 1 includes a coating device 2 for forming a photosensitive coating, an enclosure 20, a first air conditioning unit 30, a first pressure adjusting unit 40, and a second. It includes a pressure adjusting unit 50, an exhaust unit 51, a plurality of load locks 60, a delivery unit 67, a plurality of second air conditioning units 70, and a control unit 100. The coating device 2 has a carrier block 3 (carrier support portion), a processing block 4, and a housing 10.

In the carrier block 3, the carrier 11 for the wafer W can be installed. The carrier 11 accommodates, for example, a plurality of circular wafers W in a sealed state. The carrier block 3 has a built-in delivery arm A1. The transfer arm A1 takes out the wafer W from the carrier 11 and passes it to the processing block 4, receives the wafer W from the processing block 4, and returns it to the carrier 11.

The processing block 4 has a plurality of liquid processing units U1 (processing unit) for processing the wafer W, a plurality of heat treatment units U2 (processing unit), and a transfer arm A2 for transporting the wafer W to these units. There is. The liquid treatment unit U1 performs a treatment of applying the treatment liquid to the surface of the wafer W (hereinafter, referred to as “coating treatment”). The liquid treatment unit U1 has a cup C that accommodates the wafer W being coated and collects the treatment liquid. The heat treatment unit U2 performs heat treatment such as heating of the coating film formed by the above coating treatment. The heat treatment unit U2 has a chamber for accommodating the wafer W during heating of the coating film. A shelf unit U10 is provided on the carrier block 3 side in the processing block 4. The shelf unit U10 is divided into a plurality of cells arranged in the vertical direction.

The housing 10 accommodates a plurality of liquid treatment units U1, a plurality of heat treatment units U2, a shelf unit U10, a delivery arm A1 and a transfer arm A2. The housing 10 does not necessarily have to be integrally configured, and may be separable for each processing block, for example.

The enclosure 20 accommodates the housing 10 with a higher airtightness than the housing 10. The enclosure 20 includes a door 21 (first door), a lock 22 (first lock), and an operation panel 23. The door 21 is used for workers to enter and exit the enclosure 20 from outside the enclosure 20. The lock 22 switches between a state in which the door 21 is allowed to be opened (hereinafter referred to as “release state”) and a state in which the door 21 is prohibited from being opened (hereinafter referred to as “lock state”). The operation panel 23 is arranged near the door 21 on the external space side of the enclosure 20. The operation panel 23 has an input unit 23a (see FIG. 4A). The operation panel 23 is used to request the unlocking of the door 21 by inputting to the input unit 23a.

The first air conditioning unit 30 adjusts the oxygen concentration in the enclosure 20. The first air conditioning unit 30 includes a gas supply unit 31, a concentration adjusting unit 32, and a reflux unit 33. The first air conditioning unit 30 is configured to circulate the gas in the enclosure 20 by the gas supply unit 31, the concentration adjusting unit 32, and the reflux unit 33. The circulating gas includes, for example, an inert gas (eg, nitrogen) and air.

The gas supply unit 31 includes a blower 31a for pumping gas into the enclosure 20, pipelines L1 and L2, and filters 31b and 31c. The blower 31a has a temperature control unit 31d that adjusts the temperature of the gas to be pumped. Specific examples of the temperature control unit 31d include a heater, a cooling coil, and the like. The pipeline L1 (first gas pipeline) guides gas from the blower 31a into the enclosure 20. The pipeline L2 (second gas pipeline) guides gas from the blower 31a into each liquid treatment unit U1. For example, the pipeline L2 guides the gas to the cup C in each liquid treatment unit U1. The filter 31b is provided in the pipe line L1 and removes particles and the like in the gas flowing through the pipe line L1. The filter 31c is provided in the conduit L2 and removes particles and the like in the gas flowing through the conduit L2. Specific examples of the filters 31b and 31c include HEPA filters and the like.

The recirculation unit 33 recirculates gas from the inside of the enclosure 20 to the gas supply unit 31. For example, the reflux unit 33 includes pipelines L5 and L6 and filter units 33a, 33b, 33c, 33d. The pipeline L5 guides gas into the enclosure 20 and from the heat treatment unit U2 to the gas supply unit 31. The pipeline L6 guides gas from the liquid treatment unit U1 to the gas supply unit 31.

The filter units 33a and 33b are provided in the pipeline L5. The filter unit 33a includes a cooling unit C1 and a filter F1. The cooling unit C1 cools the gas by, for example, a cooling coil. The filter F1 is, for example, a HEPA filter, which removes particles and the like in the gas. The filter unit 33b is arranged between the filter unit 33a and the gas supply unit 31, and includes the filter F2. The filter F2 removes organic substances in the gas with activated carbon, for example.

The filter units 33c and 33d are provided in the pipeline L6. The filter unit 33c includes a cooling unit C3 and a filter F3. The cooling unit C3 cools the gas by, for example, a cooling coil. The filter F3 is, for example, a HEPA filter, which removes particles and the like in the gas. The filter unit 33d is arranged between the filter unit 33c and the gas supply unit 31, and includes the filter F4. The filter F4 removes organic substances in the gas with activated carbon, for example.

A blower f for gas pressure feeding may be provided in any of the filter units 33a, 33b, 33c, and 33d. For example, in the illustrated configuration, the filter units 33a, 33b, 33d are provided with a blower f.

The concentration adjusting unit 32 adjusts the oxygen concentration of the gas supplied by the gas supply unit 31. The concentration adjusting unit 32 includes, for example, pipelines L3 and L4 and valves 32a and 32b. The pipeline L3 introduces air into the gas flow path from the blower 31a into the enclosure 20. For example, the pipeline L3 extends from any one of the filter units 33a, 33b, 33c, and 33d (for example, the filter unit 33a), and air is introduced through the filter unit 33a.

The valve 32a is provided in the pipeline L3 and adjusts the opening degree of the flow path in the pipeline L3. The pipeline L4 introduces the inert gas into the gas flow path from the gas supply unit 31 into the enclosure 20. For example, the pipeline L4 connects the nitrogen gas supply source N and the blower 31a, and introduces nitrogen gas from the supply source N into the blower 31a. The valve 32b is provided in the pipeline L4 and adjusts the opening degree of the flow path in the pipeline L4. In addition, adjusting the opening degree of the flow path also includes blocking the flow path.

The first pressure adjusting unit 40 adjusts the air pressure inside the housing 10. The first pressure adjusting unit 40 has blower units 41 and 42. The blower 41 sends gas from the inside of the enclosure 20 into the housing 10. The blower unit 41 is, for example, a fan having a built-in filter (not shown), and sends gas from which particles and the like have been removed into the housing 10. The blower 42 sends gas from the inside of the housing 10 into the enclosure 20. The air pressure in the housing 10 rises when the amount of gas sent by the blower unit 41 is larger than the amount of gas sent by the blower unit 42, and decreases when the amount is smaller.

The second pressure adjusting unit 50 adjusts the air pressure in the enclosure 20. The second pressure adjusting unit 50 has a blowing unit 43 and an exhaust unit 52 (first exhaust unit). The blower 43 circulates gas in the enclosure 20. The exhaust section 52 includes a pipeline L9 and a damper 52a. The pipeline L9 guides gas from the inside of the enclosure 20 to the force equipment X for exhaust. The damper 52a is provided in the pipeline L9, and adjusts the opening degree of the flow path in the conduit L9. When the opening degree of the damper 52a increases, the displacement from the inside of the enclosure 20 increases and the air pressure inside the enclosure 20 decreases, and when the opening degree of the damper 52a decreases, the displacement from the inside of the enclosure 20 decreases and the enclosure The air pressure in 20 rises.

The exhaust section 51 (second exhaust section) has pipelines L7 and L8. The pipeline L7 (third gas pipeline) guides gas from the cup C in each liquid treatment unit U1 to the power equipment X. The pipeline L8 (third gas pipeline) guides gas from the chamber in each heat treatment unit U2 to the force equipment X. The pipelines L7 and L8 lead out gas to the side of the housing 10 (see FIG. 3).

A plurality of (for example, two) load locks 60 are provided between the peripheral wall of the enclosure 20 and the carrier block 3. The load lock 60 includes an accommodating portion 61 (carrier accommodating portion), doors 62 and 63, a lock 64 (second lock), an opening / closing drive unit 65, and an operation panel 66. The accommodating section 61 accommodates the carrier 11. The door 62 (second door) opens and closes the inside of the load lock 60 to the outside of the enclosure 20. The lock 64 is, for example, an electromagnetic lock, and switches between a state in which the door 62 is allowed to be opened (hereinafter referred to as “release state”) and a state in which the door 62 is prohibited from being opened (hereinafter referred to as “lock state”). ..

The door 63 (third door) opens and closes the inside of the accommodating portion 61 into the enclosure 20. The opening / closing drive unit 65 (third lock) switches between a state in which the door 63 is allowed to be opened and a state in which the door 63 is prohibited from being opened. The opening / closing drive unit 65 includes a power source (for example, an electric motor) for opening / closing the door 63, and also drives the opening / closing of the door 63.

The operation panel 66 is arranged near the door 62 on the external space side of the enclosure 20. The operation panel 66 has an input unit 66a and a display unit 66b (see FIG. 4B). The input unit 66a is used for inputting a lock request for the door 62, an unlock request for the door 62, a transport request for the carrier 11 from the accommodating unit 61 to the carrier block 3, and the like. The display unit 66b is used to indicate the presence or absence of the carrier 11 in the accommodating unit 61.

The delivery unit 67 delivers the carrier 11 between the carrier block 3 and each load lock 60. For example, the delivery unit 67 has a transfer robot A3. The transfer robot A3 takes out the carrier 11 from the accommodating portion 61 and conveys it to the carrier block 3, receives the carrier 11 from the carrier block 3, and conveys it into the accommodating portion 61.

A plurality of (for example, two) second air-conditioning units 70 adjust oxygen concentrations in the plurality of load locks 60, respectively. Each second air conditioning unit 70 includes pipelines L11, L12, L13, L14, valves 71, 72, 73, and a pump P. The pipeline L11 guides gas from the outside of the enclosure 20 into the accommodating portion 61. The pipeline L12 guides gas from the inside of the enclosure 20 into the accommodating portion 61. The pipeline L13 guides gas from the inside of the accommodating portion 61 to the pipeline L5. The pipeline L14 guides gas from the inside of the accommodating portion 61 to the force equipment X.

The valve 71 is provided in the pipeline L11 and adjusts the opening degree of the flow path in the pipeline L11. The valve 72 is provided in the pipeline L12, and adjusts the opening degree of the flow path in the pipeline L12. The valve 73 is provided in the pipeline L14, and adjusts the opening degree of the flow path in the pipeline L14. The pump P is provided in the pipe line L13, and pumps gas from the inside of the accommodating portion 61 to the pipe line L5. When the pump P is driven with the valves 71 and 73 closed and the valves 72 open, the gas in the enclosure 20 flows into the accommodating portion 61. When the valves 71 and 73 are opened with the valve 72 closed and the pump P stopped, the gas outside the enclosure 20 flows into the accommodating portion 61. In this way, by selectively inflowing the gas inside and outside the enclosure 20 into the accommodating portion 61, the oxygen concentration in the accommodating portion 61 is adjusted.

The substrate processing device 1 further includes oxygen concentration sensors D1 to D6, a volatile matter concentration sensor D7, pressure sensors D8 and D9, a carrier sensor D10, and a door opening / closing sensor D11.

The oxygen concentration sensor D1 (first oxygen concentration sensor) is installed in the enclosure 20 and measures the oxygen concentration in the enclosure 20. The substrate processing device 1 may be provided with oxygen concentration sensors D1 at a plurality of locations in the enclosure 20. The oxygen concentration sensor D2 (second oxygen concentration sensor) is installed in a space inside the housing 10 that can be opened to the outside. For example, the oxygen concentration sensor D2 is installed in the transfer region of the wafer W by the transfer arm A1 and the transfer arm A2. The oxygen concentration sensor D3 (third oxygen concentration sensor) is installed in the reflux unit 33. For example, the oxygen concentration sensor D3 is installed inside the filter units 33a, 33b, 33c, and 33d, respectively. The substrate processing device 1 may include a plurality of oxygen concentration sensors D3 in each of the filter units 33a, 33b, 33c, and 33d. The oxygen concentration sensor D4 (fourth oxygen concentration sensor) is installed in the gas supply unit 31. For example, the oxygen concentration sensor D4 may be arranged in the blower 31a. The substrate processing device 1 may include a plurality of oxygen concentration sensors D4 in the blower 31a. The oxygen concentration sensor D5 is installed in the cup C of the liquid processing unit U1. The oxygen concentration sensor D6 (fifth oxygen concentration sensor) is installed in the accommodating portion 61 of the load lock 60.

The volatile matter concentration sensor D7 measures the concentration of volatile matter flowing out into the enclosure 20 from the liquid treatment unit U1 or the heat treatment unit U2 (hereinafter, referred to as “volatile matter concentration in the enclosure 20”). The volatile matter concentration sensor D7 is provided in the exhaust unit 52.

The pressure sensor D8 is installed in the housing 10 and measures the pressure in the housing 10. The pressure sensor D9 is installed in the enclosure 20 and measures the pressure in the enclosure 20.

The carrier sensor D10 is installed in the accommodating portion 61 of the load lock 60, and detects the presence or absence of the carrier 11 in the accommodating portion 61. The door open / close sensor D11 detects the open / closed state of the door 21. The door open / close sensor D11 is installed in the vicinity of the door 21 in the enclosure 20. The door open / close sensor D12 detects the open / closed state of the door 62. The door open / close sensor D12 is installed in the vicinity of the door 62 in the accommodating portion 61 of the load lock 60.

The control unit 100 controls the first pressure adjusting unit 40 and the second pressure adjusting unit 50 so that the air pressure inside the enclosure 20 is kept lower than both the air pressure outside the enclosure 20 and the air pressure inside the housing 10. The control unit 100 may further control the first air conditioning unit 30 so as to keep the oxygen concentration inside the enclosure 20 lower than the oxygen concentration outside the enclosure 20. For example, when the control unit 100 keeps the oxygen concentration inside the enclosure 20 lower than the oxygen concentration outside the enclosure 20, the control unit 100 is sent from the gas supply unit 31 into the enclosure 20 as compared with the oxygen concentration outside the enclosure 20. The concentration adjusting unit 32 is controlled so as to lower the oxygen concentration of the gas.

Further, the control unit 100 controls the concentration adjusting unit 32 so as to increase the oxygen concentration of the gas sent from the gas supply unit 31 into the enclosure 20 as compared with the oxygen concentration in the enclosure 20, and also controls the oxygen concentration. Further, the lock 22 may be controlled so as to prohibit the opening of the door 21 when the measurement result of the oxygen concentration by the sensor D1 is lower than a predetermined value. The control unit 100 detects the oxygen concentration by the oxygen concentration sensor D4 when the measurement result of the oxygen concentration by the oxygen concentration sensor D2 is lower than the predetermined value and when the detection result of the oxygen concentration by the oxygen concentration sensor D3 is lower than the predetermined value. The lock 22 may be controlled so as to prohibit the opening of the door 21 even when the result is lower than the predetermined value or when the measurement result by the volatile concentration sensor D7 is higher than the predetermined value.

Further, the control unit 100 controls the second air conditioning unit 70 so that the oxygen concentration in the accommodating unit 61 approaches the oxygen concentration outside the enclosure 20 prior to opening the door 62, and prior to opening the door 63. Control the second air conditioner 70 so that the oxygen concentration in the load lock 60 approaches the oxygen concentration in the enclosure 20, and prohibit the opening of the door 62 when the measurement result by the oxygen concentration sensor D6 is lower than the predetermined value. Even if the lock 64 is controlled so as to be performed, and the opening / closing drive unit 65 is controlled so as to prohibit the opening of the door 63 when the measurement result by the oxygen concentration sensor D6 is higher than a predetermined value. Good.

For example, as shown in FIG. 5, the control unit 100 has a barometric pressure control unit 101, a primary oxygen concentration control unit 102, and a first lock control unit as functional configurations (hereinafter, referred to as “functional modules”). It has 103, a second oxygen concentration adjusting unit 104, a second lock control unit 105, a transport control unit 106, and a third lock control unit 107.

The atmospheric pressure adjusting unit 101 acquires the atmospheric pressure data in the housing 10 from the pressure sensor D8, and when the atmospheric pressure in the housing 10 is lower than the target atmospheric pressure, the amount of gas sent from the enclosure 20 to the housing 10. The blower 41 is controlled so as to increase. When the air pressure in the housing 10 is lower than the target air pressure, the air pressure adjusting unit 101 may control the air blowing unit 42 so as to reduce the amount of gas sent from the housing 10 into the enclosure 20. The target atmospheric pressure of the atmospheric pressure in the housing 10 is, for example, a value several Pa higher than the atmospheric pressure in the enclosure 20.

Further, the atmospheric pressure adjusting unit 101 acquires the atmospheric pressure data in the enclosure 20 from the pressure sensor D9, and when the atmospheric pressure in the enclosure 20 is higher than the target atmospheric pressure, guides it from the inside of the enclosure 20 to the force equipment X (exhaust path). The exhaust unit 52 is controlled so as to increase the amount of gas to be taken. For example, the atmospheric pressure adjusting unit 101 increases the opening degree of the damper 52a. The target atmospheric pressure of the atmospheric pressure inside the enclosure 20 is lower than both the atmospheric pressure outside the enclosure 20 and the atmospheric pressure inside the enclosure 10.

The first oxygen concentration adjusting unit 102 controls the first air conditioning unit 30 so as to keep the oxygen concentration inside the enclosure 20 lower than the oxygen concentration outside the enclosure 20. The first oxygen concentration adjusting unit 102 sends the oxygen concentration inside the enclosure 20 from the gas supply unit 31 to the inside of the enclosure 20 as compared with the oxygen concentration outside the enclosure 20 based on the measurement result of the oxygen concentration inside the enclosure 20 acquired from the oxygen concentration sensor D1. The concentration adjusting unit 32 is controlled so as to lower the oxygen concentration of the gas to be produced. Further, the first oxygen concentration adjusting unit 102 compares the oxygen concentration in the enclosure 20 with the oxygen concentration of the gas sent from the gas supply unit 31 into the enclosure 20 based on the information acquired from the first lock control unit 103. The concentration adjusting unit 32 is controlled so as to increase the concentration.

When lowering the oxygen concentration of the gas sent from the gas supply unit 31 into the enclosure 20, the primary oxygen concentration adjusting unit 102 adjusts the concentration so as to decrease the opening degree of the valve 32a and increase the opening degree of the valve 32b. The unit 32 is controlled. On the other hand, when increasing the oxygen concentration of the gas sent from the gas supply unit 31 into the enclosure 20, the primary oxygen concentration adjusting unit 102 increases the opening degree of the valve 32a and decreases the opening degree of the valve 32b. The concentration adjusting unit 32 is controlled.

The first lock control unit 103 controls the lock 22 based on whether or not there is a request for unlocking the input unit 23a, the measurement results of the oxygen concentration sensors D1 to D4, and the measurement results of the volatile matter concentration sensor D7. Specifically, the first lock control unit 103 opens the door 21 when the measurement result of the oxygen concentration by the oxygen concentration sensor D1 is lower than a predetermined value after the unlocking request is input to the input unit 23a. The lock 22 is controlled so as to prohibit. The first lock control unit 103 may control the lock 22 so as to prohibit the opening of the door 21 even when the measurement result of the oxygen concentration by the oxygen concentration sensors D2 to D4 is lower than a predetermined value. Further, the first lock control unit 103 may control the lock 22 so as to prohibit the opening of the door 21 even when the measurement result acquired from the volatile concentration sensor D7 is higher than the predetermined value.

The first lock control unit 103 holds a state in which the oxygen concentration measurement results of the oxygen concentration sensors D1 to D4 are equal to or higher than a predetermined value for a predetermined time or longer, and the volatile concentration measurement results of the volatile matter concentration sensor D7 are predetermined. The lock 22 is controlled so as to allow the door 21 to be opened when the state of being equal to or less than the value is held for a predetermined time or longer. The above-mentioned predetermined value of the oxygen concentration is set to a value close to the oxygen concentration in the air (for example, 19.5%). The above-mentioned predetermined value of the volatile matter concentration is appropriately set depending on the type of volatile matter and the like. The above-mentioned predetermined value of the volatile matter concentration is, for example, 5 ppm. The predetermined time is appropriately set in consideration of variations in measurement results and the like. The predetermined time is, for example, 1 minute.

The second oxygen concentration adjusting unit 104 controls the second air conditioning unit 70 so that the oxygen concentration in the accommodating unit 61 approaches the oxygen concentration outside the enclosure 20 prior to opening the door 62. Specifically, the second oxygen concentration adjusting unit 104 controls the second air conditioning unit 70 based on whether or not there is a request for unlocking the input unit 66a.

Further, the second oxygen concentration adjusting unit 104 controls the second air conditioning unit 70 so that the oxygen concentration in the accommodating unit 61 approaches the oxygen concentration in the housing 10 prior to opening the door 63. Specifically, the second oxygen concentration adjusting unit 104 controls the second air conditioning unit 70 based on whether or not there is a request for transporting the carrier 11 (transporting from the accommodating unit 61 to the carrier block 3) to the input unit 66a.

The second lock control unit 105 controls the lock 64 based on whether or not the input unit 66a is requested to release the lock and the measurement result by the oxygen concentration sensor D6. Specifically, the second lock control unit 105 prohibits the opening of the door 62 when the measurement result by the oxygen concentration sensor D6 is lower than the predetermined value after the unlock request is input to the input unit 66a. The lock 64 is controlled so as to. The second lock control unit 105 controls the lock 64 so as to allow the door 62 to be opened when the state in which the oxygen concentration measurement result by the oxygen concentration sensor D6 is equal to or higher than a predetermined value is held for a predetermined time or longer. The above-mentioned predetermined value of the oxygen concentration is set to a value close to the oxygen concentration in the air (for example, 19.5%). The predetermined time is appropriately set in consideration of variations in measurement results and the like. The predetermined time is, for example, 1 minute.

The transport control unit 106 includes the inside of the housing unit 61 and the carrier block 3 based on the presence / absence of a carrier transport request to the input unit 66a, the detection result by the carrier sensor D10, and the presence / absence of the carrier 11 to be carried out in the carrier block 3. The opening / closing drive unit 65 and the transfer robot A3 are controlled so as to transfer the carrier 11 to and from the carrier 11. Specifically, the transfer control unit 106 controls the transfer robot A3 so as to transfer the carrier 11 in the accommodating unit 61 to the carrier block 3 when a transfer request for the carrier 11 is input to the input unit 66a. The opening / closing drive unit 65 is controlled so as to open / close the door 63 according to the above. Further, when the carrier block 3 has a carrier 11 to be carried out, the transport control unit 106 controls the transport robot A3 so as to transport the carrier 11 to be carried out from the carrier block 3 into the accommodating unit 61. At the same time, the opening / closing drive unit 65 is controlled so as to open / close the door 63. At this time, the transport control unit 106 selects the accommodating unit 61 in which the carrier 11 is not detected by the carrier sensor D10 as the transport destination of the carrier 11.

Further, the transport control unit 106 controls the display unit 66b so as to display the detection result based on the detection result of the presence / absence of the carrier 11 in the load lock 60 acquired from the carrier sensor D10. For example, when the carrier sensor D10 detects the carrier 11 in the accommodating unit 61, the transport control unit 106 lights the display unit 66b corresponding to the accommodating unit 61, and the carrier sensor D10 lights the carrier in the accommodating unit 61. If 11 is not detected, the display unit 66b corresponding to the accommodating unit 61 is turned off.

The third lock control unit 107 controls the opening / closing drive unit 65 via the transport control unit 106 so as to prohibit the opening of the door 63 when the measurement result by the oxygen concentration sensor D6 is higher than a predetermined value. The third lock control unit 107 causes the transfer control unit 106 to allow the door 63 to be opened when the state in which the oxygen concentration measurement result by the oxygen concentration sensor D6 is equal to or less than a predetermined value is held for a predetermined time or longer. The opening / closing drive unit 65 is controlled via the opening / closing drive unit 65. The predetermined value of the oxygen concentration is set to be equivalent to the target value of the oxygen concentration in the enclosure 20. The predetermined time is appropriately set in consideration of variations in measurement results and the like. The predetermined time is, for example, 1 minute.

The control unit 100 is composed of one or a plurality of control computers. For example, as shown in FIG. 6, the control unit 100 has a circuit 91. The circuit 91 includes one or more processors 92, a memory 93, a storage 94, an input / output port 95, and a timer 96. The input / output ports 95 include valves 32a and 32b, blower 41, blower 42, exhaust 52, lock 22, valves 71, 72, 73, pump P, lock 64, open / close drive 65, transfer robot A3, and oxygen concentration. Electrical signals between sensors D1 to D4, volatile matter concentration sensor D7, pressure sensors D8, D9, input unit 23a, oxygen concentration sensor D6, carrier sensor D10, door open / close sensor D11, input unit 66a, display unit 66b, etc. Input and output. The timer 96 measures the elapsed time, for example, by counting a reference pulse having a fixed cycle.

The storage 94 has a storage medium that can be read by a computer, such as a hard disk. The storage medium records a program for configuring each functional module. The storage medium may be a removable medium such as a non-volatile semiconductor memory, a magnetic disk, or an optical disk. The memory 93 temporarily records the program loaded from the storage medium of the storage 94 and the calculation result by the processor 92. The processor 92 constitutes each functional module by executing the above program in cooperation with the memory 93.

The hardware configuration of the control unit 100 is not necessarily limited to the one in which each functional module is configured by a program. For example, each functional module of the control unit 100 may be configured by a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) in which the logic circuit is integrated.

[Board processing method]
Subsequently, as an example of the substrate processing method, the contents of the substrate processing executed by the substrate processing apparatus 1 will be described. This substrate processing includes a substrate processing in the coating device 2, an air conditioning process executed in association with the substrate processing, a carrier loading process into the enclosure 20, and a carrier 11 unloading process from the enclosure 20. The procedure of each process will be described below.

(Board processing procedure)
The coating device 2 executes the substrate processing in the following procedure. First, the transfer arm A1 conveys the wafer W in the carrier 11 to the shelf unit U10. Next, the transport arm A2 transports the wafer W of the shelf unit U10 to the liquid treatment unit U1, and the liquid treatment unit U1 applies a coating treatment to the wafer W. Next, the transport arm A2 transports the wafer W from the liquid treatment unit U1 to the heat treatment unit U2, and the heat treatment unit U2 heat-treats the wafer W. Next, the transfer arm A2 transfers the wafer W from the heat treatment unit U2 to the shelf unit U10, and the transfer arm A1 returns the wafer W from the shelf unit U10 into the carrier 11. This completes the coating process and heat treatment for one wafer W.

(Air conditioning)
FIG. 7 is a flowchart showing the air conditioning processing procedure. First, the control unit 100 executes step S01. In step S01, the primary oxygen concentration adjusting unit 102 confirms that the door 21 is in the locked state (the door 21 is closed and the opening of the door 21 is prohibited by the lock 22). When the door 21 is not in the locked state, the primary oxygen concentration adjusting unit 102 waits for the door 21 to be in the locked state.

After the door 21 is locked, the control unit 100 executes step S02. In step S02, the first air conditioning unit 30 (for example, the concentration adjusting unit 32) starts the circulation process in which the first oxygen concentration adjusting unit 102 keeps the oxygen concentration in the enclosure 20 lower than the oxygen concentration outside the enclosure 20. To control. Specifically, the primary oxygen concentration adjusting unit 102 controls the concentration adjusting unit 32 so as to decrease the opening degree of the valve 32a (for example, close the valve 32a) and increase the opening degree of the valve 32b, and each blower f. The first air-conditioning unit 30 is controlled so as to start pumping the gas by.

Subsequently, the control unit 100 executes steps S03 and S04 in order. In step S03, the barometric pressure adjusting unit 101 acquires the barometric pressure data in the housing 10 from the pressure sensor D8 and the barometric pressure data in the enclosure 20 from the pressure sensor D9. In step S04, the atmospheric pressure adjusting unit 101 determines whether or not the atmospheric pressure in the enclosure 20 is equal to or lower than the target atmospheric pressure based on the atmospheric pressure data acquired in step S03.

If it is determined in step S04 that the atmospheric pressure in the enclosure 20 is not equal to or lower than the target atmospheric pressure, the control unit 100 executes step S05. In step S05, the atmospheric pressure adjusting unit 101 controls the exhaust unit 52 so as to increase the opening degree of the damper 52a.

Next, the control unit 100 executes step S06. If it is determined in step S04 that the atmospheric pressure in the enclosure 20 is equal to or lower than the target atmospheric pressure, the control unit 100 executes step S06 without executing step S05. In step S06, the atmospheric pressure adjusting unit 101 determines whether or not the atmospheric pressure in the housing 10 is equal to or higher than the target atmospheric pressure.

If it is determined in step S06 that the atmospheric pressure inside the housing 10 is not equal to or higher than the target atmospheric pressure, the control unit 100 executes steps S07 and S08 in order. In step S07, the air pressure adjusting unit 101 controls the air blowing unit 41 so as to increase the amount of gas sent from the inside of the enclosure 20 to the inside of the housing 10. In step S08, the air pressure adjusting unit 101 controls the air blowing unit 42 so as to reduce the amount of gas sent from the inside of the housing 10 into the enclosure 20. The control unit 100 may execute steps S07 and S08 in a different order, or may execute steps S07 and S08 in parallel. Alternatively, the control unit 100 may execute only one of steps S07 and S08.

Next, the control unit 100 executes steps S09 and S10 in order. If it is determined in step S06 that the atmospheric pressure in the housing 10 is equal to or higher than the target atmospheric pressure, the control unit 100 executes steps S09 and S10 without executing steps S07 and S08. In step S09, the first oxygen concentration adjusting unit 102 acquires the measurement result of the oxygen concentration in the enclosure 20 from the oxygen concentration sensor D1. In step S10, the first oxygen concentration adjusting unit 102 determines whether or not the oxygen concentration in the enclosure 20 is lower than a predetermined value based on the measurement result acquired in step S09.

If it is determined in step S10 that the oxygen concentration in the enclosure 20 is higher than the predetermined value, the control unit 100 executes step S11. In step S11, the first oxygen concentration adjusting unit 102 controls the first air conditioning unit 30 so as to increase the opening degree of the valve 32b. The first oxygen concentration adjusting unit 102 may control the first air conditioning unit 30 so as to reduce the opening degree of the valve 32a.

Next, the control unit 100 executes step S12. In step S12, the first oxygen concentration adjusting unit 102 determines whether or not there is a request from the input unit 23a to unlock the door 21.

If it is determined in step S12 that there is no request for unlocking the door 21 from the input unit 23a, the control unit 100 returns the process to step S03. After that, in step S12, the control unit 100 adjusts the pressure in the housing 10 and the enclosure 20 and the oxygen concentration in the enclosure 20 until it is determined that the door 21 is requested to be unlocked. continue.

If it is determined in step S12 that there is a request for unlocking the door 21 from the input unit 23a, the control unit 100 executes step S13. In step S13, the control unit 100 executes the first unlock process. The specific content of the first unlock process will be described later. This completes the air conditioning treatment procedure.

FIG. 8 is a flowchart showing the first unlock processing procedure. As shown in FIG. 8, the control unit 100 first executes step S101. In step S101, the first oxygen concentration adjusting unit 102 controls the concentration adjusting unit 32 and the exhaust unit 52 so as to start the process of increasing the oxygen concentration in the enclosure 20. For example, the primary oxygen concentration adjusting unit 102 controls the concentration adjusting unit 32 so as to increase the opening degree of the valve 32a and decrease the opening degree of the valve 32b (for example, close the valve 32b), and adjust the opening degree of the damper 52a. The exhaust unit 52 is controlled so as to raise the valve.

Next, the control unit 100 executes steps S102 and S103 in order. In step S102, the first oxygen concentration adjusting unit 102 acquires the measurement result of the oxygen concentration in the enclosure 20 from the oxygen concentration sensors D1 to D4. In step S103, the first oxygen concentration adjusting unit 102 determines whether or not the measurement results of the oxygen concentration sensors D1 to D4 have a value equal to or less than a predetermined value based on the measurement result acquired in step S102.

When it is determined in step S103 that the measurement results of the oxygen concentration sensors D1 to D4 have a value equal to or less than a predetermined value, the control unit 100 returns the process to step S102. After that, the confirmation of the measurement results of the oxygen concentration sensors D1 to D4 is repeated until the measurement results of the oxygen concentration sensors D1 to D4 do not have a value equal to or less than a predetermined value.

If it is determined in step S103 that the measurement results of the oxygen concentration sensors D1 to D4 do not have a value equal to or less than a predetermined value, the control unit 100 executes steps S104 and S105 in order. In step S104, the primary oxygen concentration adjusting unit 102 acquires the measurement result of the volatile concentration in the enclosure 20 from the volatile concentration sensor D7. In step S105, the first oxygen concentration adjusting unit 102 determines whether or not the measurement result of the volatile matter concentration sensor D7 is equal to or less than a predetermined value.

When it is determined in step S105 that the measurement result of the volatile matter concentration sensor D7 is higher than the predetermined value, the control unit 100 returns the process to step S104. After that, the confirmation of the measurement result of the volatile matter concentration sensor D7 is repeated until the measurement result of the volatile matter concentration sensor D7 becomes equal to or less than a predetermined value.

When it is determined in step S105 that the measurement result of the volatile matter concentration sensor D7 is equal to or less than a predetermined value, the control unit 100 executes step S106. In step S106, the first lock control unit 103 controls the lock 22 so as to allow the door 21 to be opened. As described above, the first unlocking process is completed, and the door 21 can be opened. As a result, an operator or the like can enter the enclosure 20 and perform maintenance work.

(Carry-in processing procedure for carriers)
9 and 10 are flowcharts showing a carrier carry-in processing procedure. First, the control unit 100 executes step S21. In step S21, the second lock control unit 105 waits for the request for unlocking the door 62 to be input to the input unit 66a.

In step S21, after receiving a request from the input unit 66a to unlock the door 62, the control unit 100 executes steps S22 and S23 in order. In step S22, the second oxygen concentration adjusting unit 104 controls the second air conditioning unit 70 so as to start a process of bringing the oxygen concentration in the load lock 60 closer to the oxygen concentration outside the enclosure 20. The second oxygen concentration adjusting unit 104 increases the opening degree of the valve 71, decreases the opening degree of the valve 72 (for example, closes the valve 72), and raises the opening degree of the valve 73. Control. In step S23, the second lock control unit 105 determines whether or not the measurement result of the oxygen concentration in the load lock 60 acquired from the oxygen concentration sensor D6 is equal to or higher than a predetermined value.

When it is determined in step S23 that the measurement result of the oxygen concentration sensor D6 is lower than the predetermined value, the control unit 100 returns the process to step S22. After that, the confirmation of the measurement result of the oxygen concentration sensor D6 is repeated until the measurement result of the oxygen concentration sensor D6 becomes a predetermined value or more.

When it is determined in step S23 that the measurement result of the oxygen concentration sensor D6 is equal to or higher than a predetermined value, the control unit 100 executes step S24. In step S24, the second oxygen concentration adjusting unit 104 controls the second air conditioning unit 70 so as to stop the process of increasing the oxygen concentration in the load lock 60. For example, the second oxygen concentration adjusting unit 104 controls the second air conditioning unit 70 so as to close the valve 71, the valve 72, and the valve 73.

Next, the control unit 100 executes step S25. In step S25, the second lock control unit 105 releases the locked state (the state in which the door 62 is closed and the opening of the door 62 is prohibited by the lock 64) (the door 62 is closed and the door 62 is opened). The lock 64 is controlled so as to allow the opening of the door 62 by switching to a state (not prohibited by the lock 64).

Next, the control unit 100 executes step S26. In step S26, the transport control unit 106 waits for the carrier 11 to be carried into the accommodating unit 61. Specifically, the transport control unit 106 waits for the carrier sensor D10 in the accommodating unit 61 to detect the carrier 11.

When the carrier sensor D10 in the accommodating unit 61 detects the carrier 11, the control unit 100 executes step S27. In step S27, the transport control unit 106 controls the display unit 66b so as to indicate that the carrier 11 is inside the load lock 60.

As shown in FIG. 10, the control unit 100 then executes step S28. In step S28, the transfer control unit 106 waits for the transfer request of the carrier 11 to be input to the input unit 66a.

When the request for transport of the carrier 11 is input, the control unit 100 executes steps S29 and S30 in order. In step S29, the second lock control unit 105 confirms that the door 62 is closed. Specifically, the second lock control unit 105 confirms that the door open / close sensor D12 has detected that the door 62 is closed. If the door 62 is not closed, the second lock control unit 105 waits for the door 62 to be closed.

Next, the control unit 100 executes step S30. In step S30, the second lock control unit 105 switches the unlocked state to the locked state and controls the lock 64 so as to prohibit the opening of the door 62.

Next, the control unit 100 executes steps S31 and S32 in order. In step S31, the second oxygen concentration adjusting unit 104 controls the second air conditioning unit 70 so as to start the process of lowering the oxygen concentration in the load lock 60. The second oxygen concentration adjusting unit 104 lowers the opening degree of the valve 71 (for example, closes the valve 71), raises the opening degree of the valve 72, lowers the opening degree of the valve 73 (for example, closes the valve 73). The second air conditioning unit 70 is controlled so as to start pumping gas by the pump P. In step S32, the third lock control unit 107 determines whether or not the measurement result of the oxygen concentration in the load lock 60 acquired from the oxygen concentration sensor D6 is equal to or less than a predetermined value.

If it is determined in step S32 that the measurement result of the oxygen concentration sensor D6 is higher than the predetermined value, the control unit 100 returns the process to step S31. After that, the confirmation of the measurement result of the oxygen concentration sensor D6 is repeated until the measurement result of the oxygen concentration sensor D6 becomes equal to or less than a predetermined value.

If it is determined in step S32 that the measurement result of the oxygen concentration sensor D6 is equal to or less than a predetermined value, the control unit 100 executes step S33. In step S33, the second oxygen concentration adjusting unit 104 controls the second air conditioning unit 70 so as to stop the oxygen concentration lowering process in the load lock 60. For example, the second oxygen concentration adjusting unit 104 closes the valve 71, the valve 72, and the valve 73 so that the opening degree is 0, and controls the second air conditioning unit 70 so as to stop the pumping of gas by the pump P.

Next, the control unit 100 executes steps S34, S35, and S36 in order. In step S34, the third lock control unit 107 controls the opening / closing drive unit 65 so as to switch the locked state to the released state, and the transport control unit 106 controls the opening / closing drive unit 65 so as to open the door 63. In step S35, the transfer control unit 106 controls the transfer robot A3 so as to transfer the carrier 11 in the load lock 60 to the carrier block 3. In step S36, the transport control unit 106 controls the display unit 66b so as to indicate that there is no carrier 11 in the load lock 60. For example, the transport control unit 106 controls the display unit 66b so as to switch from the lit state to the extinguished state.

Next, the control unit 100 executes step S37. In step S37, the transport control unit 106 controls the opening / closing drive unit 65 so as to close the door 63, and the third lock control unit 107 controls the opening / closing drive unit 65 so as to switch the unlocked state to the locked state. With the above, the carrier carry-in process is completed.

(Carrier carry-out processing procedure)
11 and 12 are flowcharts showing a carrier unloading processing procedure. As shown in FIG. 11, the control unit 100 first executes step S41. In step S41, the second oxygen concentration adjusting unit 104 waits until the carrier 11 installed in the carrier block 3 becomes a target for removal. The carrier 11 to be taken out is, for example, a carrier 11 in which the coating process of all the accommodated wafers W has been completed.

Next, the control unit 100 executes steps S42 and S43 in order. In step S42, the second oxygen concentration adjusting unit 104 controls the second air conditioning unit 70 so as to start the process of lowering the oxygen concentration in the empty load lock 60 among the plurality of load locks 60. The second oxygen concentration adjusting unit 104 lowers the opening degree of the valve 71 (for example, closes the valve 71), raises the opening degree of the valve 72, lowers the opening degree of the valve 73 (for example, closes the valve 73). The second air conditioning unit 70 is controlled so as to start pumping gas by the pump P. In step S43, the third lock control unit 107 determines whether or not the measurement result of the oxygen concentration in the load lock 60 acquired from the oxygen concentration sensor D6 is equal to or less than a predetermined value.

If it is determined in step S43 that the measurement result of the oxygen concentration sensor D6 is higher than the predetermined value, the control unit 100 returns the process to step S42. After that, the confirmation of the measurement result of the oxygen concentration sensor D6 is repeated until the measurement result of the oxygen concentration sensor D6 becomes equal to or less than a predetermined value.

If it is determined in step S43 that the measurement result of the oxygen concentration sensor D6 is equal to or less than a predetermined value, the control unit 100 executes step S44. In step S44, the second oxygen concentration adjusting unit 104 controls the second air conditioning unit 70 so as to stop the oxygen concentration lowering process in the load lock 60. For example, the second oxygen concentration adjusting unit 104 closes the valve 71, the valve 72, and the valve 73 so that the opening degree is 0, and controls the second air conditioning unit 70 so as to stop the pumping of gas by the pump P.

Next, the control unit 100 executes steps S45, S46, and S47 in order. In step S45, the third lock control unit 107 controls the opening / closing drive unit 65 so as to switch the locked state to the released state, and the transport control unit 106 controls the opening / closing drive unit 65 so as to open the door 63. In step S46, the transfer control unit 106 controls the transfer robot A3 so as to transfer the carrier 11 of the carrier block 3 into the load lock 60. In step S47, the transport control unit 106 controls the display unit 66b so as to indicate that the carrier 11 is in the load lock 60. For example, the transport control unit 106 controls the display unit 66b so as to switch from the off state to the on state.

Next, the control unit 100 executes step S48. In step S48, the transport control unit 106 controls the open / close drive unit 65 so as to close the door 63, and the third lock control unit 107 controls the open / close drive unit 65 so as to switch the unlocked state to the locked state.

As shown in FIG. 12, the control unit 100 then executes step S49. In step S49, the second oxygen concentration adjusting unit 104 waits for the request for unlocking the door 62 to be input to the input unit 66a.

When the request for unlocking the door 62 is input, the control unit 100 executes steps S50 and S51 in order. In step S50, the second oxygen concentration adjusting unit 104 controls the second air conditioning unit 70 so as to start the process of increasing the oxygen concentration in the load lock 60. The second oxygen concentration adjusting unit 104 increases the opening degree of the valve 71, decreases the opening degree of the valve 72 (for example, closes the valve 72), and raises the opening degree of the valve 73. Control. In step S51, the second oxygen concentration adjusting unit 104 determines whether or not the measurement result of the oxygen concentration in the load lock 60 acquired from the oxygen concentration sensor D6 is equal to or higher than a predetermined value.

If it is determined in step S51 that the measurement result of the oxygen concentration sensor D6 is lower than the predetermined value, the control unit 100 returns the process to step S50. After that, the confirmation of the measurement result of the oxygen concentration sensor D6 is repeated until the measurement result of the oxygen concentration sensor D6 becomes a predetermined value or more.

If it is determined in step S51 that the measurement result of the oxygen concentration sensor D6 is equal to or higher than a predetermined value, the control unit 100 executes step S52. In step S52, the second oxygen concentration adjusting unit 104 controls the second air conditioning unit 70 so as to stop the process of increasing the oxygen concentration in the load lock 60. The second oxygen concentration adjusting unit 104 controls the valve 71, the valve 72, and the valve 73 so that the opening degree is 0.

Next, the control unit 100 executes steps S53 and S54 in order. In step S53, the second lock control unit 105 controls the lock 64 so as to switch the locked state to the released state. In step S54, the transport control unit 106 waits for the carrier sensor D10 to stop detecting the carrier 11.

When the carrier sensor D10 stops detecting the carrier 11, the control unit 100 executes step S55. In step S55, the transport control unit 106 controls the display unit 66b so as to indicate that there is no carrier 11 in the load lock 60. For example, the transport control unit 106 controls the display unit 66b so as to switch from the lit state to the extinguished state.

Next, the control unit 100 executes step S56. In step S56, the transport control unit 106 waits for the lock request of the door 62 to be input to the input unit 66a. When the request for locking the door 62 is input in step S56, the control unit 100 executes step S57. In step S57, the second lock control unit 105 confirms that the door 62 is closed by the second lock control unit 105. Specifically, the second lock control unit 105 confirms that the door open / close sensor D12 has detected that the door 62 is closed. If the door 62 is not closed, the second lock control unit 105 waits for the door 62 to be closed.

Next, the control unit 100 executes step S58. In step S58, the second lock control unit 105 switches the unlocked state to the locked state and controls the lock 64 so as to prohibit the opening of the door 62. With the above, the carrier unloading process is completed.

[Effect of this embodiment]
The substrate processing apparatus 1 includes a carrier block 3 in which a carrier 11 accommodating a plurality of wafers W can be installed, a liquid treatment unit U1 and a heat treatment unit U2 for processing the wafer W, and a carrier 11, a liquid treatment unit U1, and a heat treatment unit. The transport arm A2 that transports the wafer W to and from the U2, the housing 10 that houses the liquid treatment unit U1, the heat treatment unit U2, and the transport arm A2, and the housing 10 that is more airtight than the housing 10. The enclosure 20, the first pressure adjusting unit 40 that adjusts the air pressure inside the housing 10, the second pressure adjusting unit 50 that adjusts the air pressure inside the enclosure 20, and the air pressure inside the enclosure 20 are the air pressure outside the enclosure 20 and A control unit 100 that controls the first pressure adjusting unit 40 and the second pressure adjusting unit 50 so as to maintain a state lower than any of the atmospheric pressures in the housing 10 is provided.

According to this substrate processing device 1, the enclosure 20 is housed in an enclosure 20 that is more airtight than the enclosure 10, and the air pressure inside the enclosure 20 is lower than the air pressure outside the enclosure 20 and the air pressure inside the enclosure 10. By keeping the pressure at, it is possible to prevent the gas leaking from the inside of the housing 10 to the outside of the housing 10 from leaking to the outside of the enclosure 20. Therefore, it is possible to maintain the oxygen concentration in each part of the housing 10 such as the transport region and the liquid treatment unit U1 in a desired state. Therefore, the substrate processing apparatus 1 is useful for controlling the oxygen concentration during substrate processing.

The substrate processing device 1 further includes a first air conditioning unit 30 that adjusts the oxygen concentration inside the enclosure 20, and the control unit 100 keeps the oxygen concentration inside the enclosure 20 lower than the oxygen concentration outside the enclosure 20. Further control of the first air conditioning unit 30 may be performed. In this case, by adjusting the oxygen concentration in the enclosure 20 accommodating the housing 10, the oxygen concentration in each part in the housing 10 can be efficiently adjusted.

The first air conditioning unit 30 includes a gas supply unit 31 that supplies gas into the enclosure 20, a concentration adjustment unit 32 that adjusts the oxygen concentration of the gas sent from the gas supply unit 31 into the enclosure 20, and gas from inside the enclosure 20. The supply unit 31 has a recirculation unit 33 for recirculating the gas, and the control unit 100 adjusts the oxygen concentration outside the enclosure 20 to the oxygen concentration outside the enclosure 20 when maintaining the oxygen concentration inside the enclosure 20 lower than the oxygen concentration outside the enclosure 20. By comparison, the concentration adjusting unit 32 may be controlled so as to lower the oxygen concentration of the gas sent from the gas supply unit 31 into the enclosure 20. In this case, since the concentration-adjusted gas is sent from the gas supply unit 31 into the enclosure 20, the oxygen concentration in the enclosure 20 can be more reliably maintained. Further, since the gas in the enclosure 20 is returned to the gas supply unit 31 by the reflux unit 33, the gas having an adjusted oxygen concentration can be circulated and used, and the oxygen concentration can be efficiently maintained.

The first pressure adjusting unit 40 has a blowing unit 41 that sends gas from the inside of the enclosure 20 into the housing 10, and the second pressure adjusting unit 50 is an exhaust unit that guides a part of the gas in the enclosure 20 to the exhaust path. 52 may have. According to this configuration, it is possible to adjust the atmospheric pressure with a simple configuration.

The board processing device 1 has a door 21 for entering and exiting the enclosure 20, a lock 22 for switching between a state in which the door 21 is allowed to be opened and a state in which the door 21 is prohibited from being opened, and an oxygen concentration in the enclosure 20. Further provided with an oxygen concentration sensor D1 for measuring, the control unit 100 adjusts the concentration so that the oxygen concentration of the gas sent from the gas supply unit 31 into the enclosure 20 is higher than the oxygen concentration in the enclosure 20. Further, control of the unit 32 and control of the lock 22 so as to prohibit the opening of the door 21 when the measurement result of the oxygen concentration by the oxygen concentration sensor D1 is lower than a predetermined value may be further executed. .. In this case, the door 21 is prohibited from being opened by the lock 22 until the oxygen concentration in the enclosure 20 is adjusted to a predetermined value or more. Therefore, for example, prior to opening the door 21 when a person enters the enclosure 20 or the like. , The oxygen concentration in the enclosure 20 can be surely increased.

Further, the substrate processing device 1 further includes an oxygen concentration sensor D2 for measuring the oxygen concentration in the space inside the housing 10 that can be opened to the outside, and the control unit 100 further includes the measurement result of the oxygen concentration by the oxygen concentration sensor D2. The lock 22 may be controlled so as to prohibit the opening of the door 21 even when is lower than a predetermined value. In this case, the oxygen concentration can be reliably increased prior to opening the space of the housing 10 that can be opened to the outside.

Further, the substrate processing device 1 further includes an oxygen concentration sensor D3 for measuring the oxygen concentration in the reflux unit 33, and the control unit 100 further includes a case where the detection result of the oxygen concentration by the oxygen concentration sensor D3 is lower than a predetermined value. The lock 22 may be controlled so as to prohibit the opening of the door 21. In this case, since the door 21 is prohibited from being opened by the lock 22 until the oxygen concentration in the reflux portion 33 becomes equal to or higher than a predetermined value, the oxygen concentration in the enclosure 20 can be increased more reliably.

The oxygen concentration sensor D4 for measuring the oxygen concentration in the gas supply unit 31 is further provided, and the control unit 100 prohibits the opening of the door 21 even when the detection result of the oxygen concentration by the oxygen concentration sensor D4 is lower than a predetermined value. The lock 22 may be controlled as such. In this case, since the door 21 is prohibited from being opened by the lock 22 until the oxygen concentration in the gas supply unit 31 becomes equal to or higher than a predetermined value, the oxygen concentration in the enclosure 20 can be increased more reliably.

Further, the substrate processing device 1 further includes a volatile concentration sensor D7 for measuring the concentration of volatile substances flowing out from the liquid processing unit U1 and the heat treatment unit U2 into the enclosure 20, and the control unit 100 further includes a volatile matter concentration sensor D7. The lock 22 may be controlled so as to prohibit the opening of the door 21 even when the measurement result by the density sensor D7 is higher than the predetermined value. In this case, the door 21 is prohibited from being opened by the lock 22 until the volatile matter concentration in the enclosure 20 becomes equal to or less than a predetermined value, so that the volatile matter in the enclosure 20 can be surely reduced.

The volatile matter concentration sensor D7 may be provided in the exhaust unit 52. With this configuration, the exhaust unit 52 can be used to easily detect volatile substances. Further, when the opening degree of the damper 52a is the maximum, the amount of gas guided to the exhaust unit 52 increases, so that volatile substances can be detected more easily.

The gas supply unit 31 may include a pipeline L1 for guiding the gas into the enclosure 20, and a conduit L2 for guiding the gas into the liquid treatment unit U1 and the heat treatment unit U2. In this case, while guiding the gas through the conduit L1 into the enclosure 20, the gas is guided through the conduit L2 into the liquid treatment unit U1 and the heat treatment unit U2 as a separate route, so that oxygen in the liquid treatment unit U1 and the heat treatment unit U2 is introduced. The concentration can be adjusted more tightly.

An exhaust unit 51 that guides the gas in the liquid treatment unit U1 and the heat treatment unit U2 to the exhaust path may be further provided. In this case, since the gas in the liquid treatment unit U1 and the heat treatment unit U2 having a high volatile concentration is exhausted, it is possible to prevent the volatile concentration from becoming excessive. Further, the amount of volatiles removed by the filter units 33b and 33d of the reflux unit 33 is reduced as compared with the case where the gas in the liquid treatment unit U1 and the heat treatment unit U2 having a high volatile concentration is refluxed to the reflux unit 33. Therefore, it is possible to suppress an increase in the maintenance frequency of the filter units 33b and 33d.

The exhaust unit 51 may have pipelines L7 and L8 for leading out gas to the side of the housing 10. According to this configuration, it is easy to organize the exhaust pipes from the liquid treatment unit U1 and the heat treatment unit U2 in the enclosure 20.

The board processing device 1 includes a load lock 60 for accommodating the carrier 11, a door 62 for opening and closing the inside of the load lock 60 to the outside of the enclosure 20, a door 63 for opening and closing the inside of the load lock 60 inside the enclosure 20, and a load lock 60. A delivery unit 67 that transfers the carrier 11 between the carrier block 3 and the carrier block 3 and a second air conditioning unit 70 that adjusts the oxygen concentration in the load lock 60 are further provided, and the control unit 100 opens the door 62. The second air conditioner 70 is controlled so that the oxygen concentration in the load lock 60 approaches the oxygen concentration outside the enclosure 20 prior to the opening of the door 63, and the oxygen concentration in the load lock 60 is adjusted to the oxygen concentration in the enclosure 20 prior to opening the door 63. Controlling the second air conditioning unit 70 so as to approach the oxygen concentration may be further performed. According to this configuration, the door 62 can be opened to carry out the carrier 11 from the load lock 60, and the door 63 can be opened to store the carrier 11 in the load lock 60. Further, when carrying out and storing the carrier 11, the leakage of the gas having a high oxygen concentration from the inside of the load lock 60 to the outside of the enclosure 20 and the leakage of the gas having a low oxygen concentration from the inside of the load lock 60 into the enclosure 20 are combined. Can be suppressed.

The substrate processing device 1 has a lock 64 that switches between a state in which the door 62 is allowed to be opened and a state in which the door 62 is prohibited from being opened, and a state in which the door 63 is allowed to be opened and a state in which the door 63 is prohibited from being opened. The opening / closing drive unit 65 for switching and the oxygen concentration sensor D6 for measuring the oxygen concentration in the load lock 60 are further provided, and the control unit 100 is provided with the door 62 when the measurement result by the oxygen concentration sensor D6 is lower than a predetermined value. Further, the lock 64 is controlled so as to prohibit the opening, and the opening / closing drive unit 65 is controlled so as to prohibit the opening of the door 63 when the measurement result by the oxygen concentration sensor D6 is higher than a predetermined value. You may do it. In this case, since the opening of the door 62 and the door 63 is prohibited until the oxygen concentration in the load lock 60 is appropriately adjusted, the oxygen concentration in the load lock 60 is prohibited prior to the opening of the door 62 or the door 63. Can be adjusted more reliably.

Although the embodiments have been described above, the present disclosure is not necessarily limited to the above-described embodiments, and various changes can be made without departing from the gist thereof. For example, the substrate processing apparatus 1 may be configured to further expose the photosensitive coating and develop the photosensitive coating in addition to forming the photosensitive coating. The above-described configuration can be applied to a process performed on a substrate in an atmosphere other than low oxygen as long as the process is performed in a space maintained in a predetermined atmosphere. The substrate to be processed is not limited to the semiconductor wafer, and may be, for example, a glass substrate, a mask substrate, an FPD (Flat Panel Display), or the like.

The above embodiments will be added as follows.
(Appendix 1)
A carrier support unit on which a carrier containing multiple boards can be installed,
A processing unit that performs processing on the substrate and
A transport arm that transports the substrate between the carrier and the processing unit,
A housing that houses the processing unit and the transport arm,
An enclosure that houses the housing with higher airtightness than the housing,
The first pressure adjusting unit that adjusts the air pressure inside the housing,
A second pressure regulator that regulates the air pressure inside the enclosure,
A control unit that controls the first pressure adjusting unit and the second pressure adjusting unit so that the air pressure inside the enclosure is kept lower than both the air pressure outside the enclosure and the air pressure inside the enclosure. A substrate processing apparatus comprising.
(Appendix 2)
Further provided with a first air conditioning unit for adjusting the oxygen concentration in the enclosure,
The substrate processing apparatus according to Appendix 1, wherein the control unit further controls the first air-conditioning unit so as to maintain the oxygen concentration in the enclosure lower than the oxygen concentration outside the enclosure.
(Appendix 3)
The first air conditioning unit
A gas supply unit that supplies gas into the enclosure and
A concentration adjusting unit that adjusts the oxygen concentration of the gas sent from the gas supply unit into the enclosure,
It has a recirculation unit that recirculates gas from the inside of the enclosure to the gas supply unit.
When the control unit keeps the oxygen concentration in the enclosure lower than the oxygen concentration outside the enclosure, the control unit compares the oxygen concentration outside the enclosure with the oxygen concentration of the gas sent from the gas supply unit into the enclosure. The substrate processing apparatus according to Appendix 2, wherein the concentration adjusting unit is controlled so as to lower the oxygen concentration.
(Appendix 4)
The first pressure adjusting unit has a blower unit that sends gas from the inside of the enclosure to the inside of the housing.
The substrate processing apparatus according to Appendix 3, wherein the second pressure adjusting unit has a first exhaust unit that guides a part of the gas in the enclosure to an exhaust path.
(Appendix 5)
The first door for entering and exiting the enclosure,
A first lock that switches between a state that allows the opening of the first door and a state that prohibits the opening of the first door,
A primary oxygen concentration sensor for measuring the oxygen concentration in the enclosure is further provided.
The control unit
Controlling the concentration adjusting unit so as to increase the oxygen concentration of the gas sent from the gas supply unit into the enclosure as compared with the oxygen concentration in the enclosure.
Note 4 to further execute the control of the first lock so as to prohibit the opening of the first door when the measurement result of the oxygen concentration by the first oxygen concentration sensor is lower than a predetermined value. Board processing equipment.
(Appendix 6)
A secondary oxygen concentration sensor for measuring the oxygen concentration in the space inside the housing that can be opened to the outside is further provided.
The control unit controls the first lock so as to prohibit the opening of the first door even when the measurement result of the oxygen concentration by the second oxygen concentration sensor is lower than a predetermined value, as described in Appendix 5. Board processing equipment.
(Appendix 7)
A third oxygen concentration sensor for measuring the oxygen concentration in the reflux section is further provided.
The control unit controls the first lock so as to prohibit the opening of the first door even when the detection result of the oxygen concentration by the third oxygen concentration sensor is lower than a predetermined value. The substrate processing apparatus described.
(Appendix 8)
A fourth oxygen concentration sensor for measuring the oxygen concentration in the gas supply unit is further provided.
The control unit controls the first lock so as to prohibit the opening of the first door even when the detection result of the oxygen concentration by the fourth oxygen concentration sensor is lower than a predetermined value. The substrate processing apparatus according to any one item.
(Appendix 9)
Further provided with a volatile concentration sensor for measuring the concentration of volatile matter flowing out from the processing unit into the enclosure.
The control unit controls the first lock so as to prohibit the opening of the first door even when the measurement result by the volatile concentration sensor is higher than a predetermined value. The substrate processing apparatus described.
(Appendix 10)
The substrate processing apparatus according to Appendix 9, wherein the volatile substance concentration sensor is provided in the first exhaust unit.
(Appendix 11)
The gas supply unit
The first gas pipeline that guides gas into the enclosure,
The substrate processing apparatus according to any one of Supplementary note 4 to 10, further comprising a second gas pipeline for guiding gas into the processing unit.
(Appendix 12)
The substrate processing apparatus according to any one of Supplementary note 4 to 11, further comprising a second exhaust unit that guides the gas in the processing unit to the exhaust path.
(Appendix 13)
The substrate processing apparatus according to Appendix 12, wherein the second exhaust unit has a third gas pipeline for leading out gas to the side of the housing.
(Appendix 14)
A carrier accommodating portion for accommodating the carrier and
A second door that opens and closes the inside of the carrier housing to the outside of the enclosure,
A third door that opens and closes the inside of the carrier housing into the enclosure,
A delivery unit that transfers the carrier between the carrier accommodating unit and the carrier support unit, and a delivery unit.
A second air-conditioning unit for adjusting the oxygen concentration in the carrier accommodating unit is further provided.
The control unit
Prior to opening the second door, the second air-conditioning unit is controlled so that the oxygen concentration inside the carrier accommodating unit approaches the oxygen concentration outside the enclosure.
Any one of Appendix 1 to 13 further executes the control of the second air-conditioning unit so that the oxygen concentration in the carrier accommodating unit approaches the oxygen concentration in the housing prior to the opening of the third door. The substrate processing apparatus according to the section.
(Appendix 15)
A second lock that switches between a state that allows the opening of the second door and a state that prohibits the opening of the second door,
A third lock that switches between a state that allows the opening of the third door and a state that prohibits the opening of the third door.
Further provided with a fifth oxygen concentration sensor for measuring the oxygen concentration in the carrier accommodating portion.
The control unit
To control the second lock so as to prohibit the opening of the second door when the measurement result by the fifth oxygen concentration sensor is lower than a predetermined value.
The substrate treatment according to Appendix 14, further performing the control of the third lock so as to prohibit the opening of the third door when the measurement result by the fifth oxygen concentration sensor is higher than a predetermined value. apparatus.

1 ... Board processing device, 11 ... Carrier, 3 ... Carrier block (carrier support), 4 ... Processing block, 10 ... Housing, 20 ... Enclosure, 21 ... Door (first door), 22 ... Lock (first lock) ), 30 ... First air conditioning unit, 31 ... Gas supply unit, 32 ... Concentration adjustment unit, 33 ... Circulation unit, 40 ... First pressure adjustment unit, 41 ... Blower unit, 50 ... Second pressure adjustment unit, 51 ... Exhaust Part (second exhaust part), 52 ... exhaust part (first exhaust part), 61 ... accommodating part (carrier accommodating part), 62 ... door (second door), 63 ... door (third door), 64 ... lock (Second lock), 65 ... Open / close drive unit (third lock), 67 ... Delivery unit, 70 ... Second air conditioning unit, 100 ... Control unit, A2 ... Conveyor arm, D1 ... Oxygen concentration sensor (First oxygen concentration sensor) ), D2 ... Oxygen concentration sensor (second oxygen concentration sensor), D3 ... Oxygen concentration sensor (third oxygen concentration sensor), D4 ... Oxygen concentration sensor (fourth oxygen concentration sensor), D6 ... Oxygen concentration sensor (fifth oxygen) Concentration sensor), D7 ... Volatile concentration sensor, L1 ... Pipe line (first gas line line), L2 ... line line (second gas line line), L7, L8 ... line line (third gas line line), U1 ... Liquid processing unit (processing unit), U2 ... Heat treatment unit (processing unit), W ... Wafer (board), X ... Power equipment (exhaust path).

Claims (15)

A carrier support unit on which a carrier containing multiple boards can be installed,
A processing unit that performs processing on the substrate and
A transport arm that transports the substrate between the carrier and the processing unit,
A housing that houses the processing unit and the transport arm,
An enclosure that houses the housing with higher airtightness than the housing,
The first pressure adjusting unit that adjusts the air pressure inside the housing,
A second pressure regulator that regulates the air pressure inside the enclosure,
A control unit that controls the first pressure adjusting unit and the second pressure adjusting unit so that the air pressure inside the enclosure is kept lower than both the air pressure outside the enclosure and the air pressure inside the enclosure. A substrate processing apparatus comprising. Further provided with a first air conditioning unit for adjusting the oxygen concentration in the enclosure,
The substrate processing apparatus according to claim 1, wherein the control unit further controls the first air conditioning unit so as to maintain the oxygen concentration in the enclosure lower than the oxygen concentration outside the enclosure. The first air conditioning unit
A gas supply unit that supplies gas into the enclosure and
A concentration adjusting unit that adjusts the oxygen concentration of the gas sent from the gas supply unit into the enclosure,
It has a recirculation unit that recirculates gas from the inside of the enclosure to the gas supply unit.
When the control unit keeps the oxygen concentration in the enclosure lower than the oxygen concentration outside the enclosure, the control unit compares the oxygen concentration outside the enclosure with the oxygen concentration of the gas sent from the gas supply unit into the enclosure. The substrate processing apparatus according to claim 2, wherein the concentration adjusting unit is controlled so as to lower the oxygen concentration. The first pressure adjusting unit has a blower unit that sends gas from the inside of the enclosure to the inside of the housing.
The substrate processing apparatus according to claim 3, wherein the second pressure adjusting unit has a first exhaust unit that guides a part of the gas in the enclosure to an exhaust path. The first door for entering and exiting the enclosure,
A first lock that switches between a state that allows the opening of the first door and a state that prohibits the opening of the first door,
A primary oxygen concentration sensor for measuring the oxygen concentration in the enclosure is further provided.
The control unit
Controlling the concentration adjusting unit so as to increase the oxygen concentration of the gas sent from the gas supply unit into the enclosure as compared with the oxygen concentration in the enclosure.
4. The fourth aspect of the present invention is to further control the first lock so as to prohibit the opening of the first door when the measurement result of the oxygen concentration by the first oxygen concentration sensor is lower than a predetermined value. The substrate processing apparatus described. A secondary oxygen concentration sensor for measuring the oxygen concentration in the space inside the housing that can be opened to the outside is further provided.
The fifth aspect of the present invention, wherein the control unit controls the first lock so as to prohibit the opening of the first door even when the measurement result of the oxygen concentration by the second oxygen concentration sensor is lower than a predetermined value. Board processing equipment. A third oxygen concentration sensor for measuring the oxygen concentration in the reflux section is further provided.
The fifth aspect of the present invention, wherein the control unit controls the first lock so as to prohibit the opening of the first door even when the detection result of the oxygen concentration by the third oxygen concentration sensor is lower than a predetermined value. Board processing equipment. A fourth oxygen concentration sensor for measuring the oxygen concentration in the gas supply unit is further provided.
The fifth aspect of the present invention, wherein the control unit controls the first lock so as to prohibit the opening of the first door even when the detection result of the oxygen concentration by the fourth oxygen concentration sensor is lower than a predetermined value. Board processing equipment. Further provided with a volatile concentration sensor for measuring the concentration of volatile matter flowing out from the processing unit into the enclosure.
The substrate processing apparatus according to claim 5, wherein the control unit controls the first lock so as to prohibit the opening of the first door even when the measurement result by the volatile concentration sensor is higher than a predetermined value. The substrate processing apparatus according to claim 9, wherein the volatile substance concentration sensor is provided in the first exhaust unit. The gas supply unit
The first gas pipeline that guides gas into the enclosure,
The substrate processing apparatus according to claim 4, further comprising a second gas pipeline for guiding gas into the processing unit. The substrate processing apparatus according to claim 4, further comprising a second exhaust unit that guides the gas in the processing unit to the exhaust path. The substrate processing apparatus according to claim 12, wherein the second exhaust unit has a third gas pipeline for leading out gas to the side of the housing. A carrier accommodating portion for accommodating the carrier and
A second door that opens and closes the inside of the carrier housing to the outside of the enclosure,
A third door that opens and closes the inside of the carrier housing into the enclosure,
A delivery unit that transfers the carrier between the carrier accommodating unit and the carrier support unit, and a delivery unit.
A second air-conditioning unit for adjusting the oxygen concentration in the carrier accommodating unit is further provided.
The control unit
Prior to opening the second door, the second air-conditioning unit is controlled so that the oxygen concentration inside the carrier accommodating unit approaches the oxygen concentration outside the enclosure.
The substrate treatment according to claim 1, wherein the second air-conditioning unit is further controlled so that the oxygen concentration in the carrier accommodating unit approaches the oxygen concentration in the housing prior to opening the third door. apparatus. A second lock that switches between a state that allows the opening of the second door and a state that prohibits the opening of the second door,
A third lock that switches between a state that allows the opening of the third door and a state that prohibits the opening of the third door.
Further provided with a fifth oxygen concentration sensor for measuring the oxygen concentration in the carrier accommodating portion.
The control unit
To control the second lock so as to prohibit the opening of the second door when the measurement result by the fifth oxygen concentration sensor is lower than a predetermined value.
The substrate according to claim 14, further performing the control of the third lock so as to prohibit the opening of the third door when the measurement result by the fifth oxygen concentration sensor is higher than a predetermined value. Processing equipment.

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