TWI815699B - Picker hand - Google Patents

Abstract

The present invention relates to a picker hand. Specifically, according to an embodiment of the present invention, there may be provided a picker hand including: a hand; a picker unit detachably connected to the hand and configured to grip an electronic component disposed in a supine state; and a support configured to support the electronic component, wherein the picker unit includes a picker pad that is in a contact state in which one end portion of the picker pad is in contact with the electronic component, and in a grip state in which the picker pad grips the electronic component by moving toward the electronic component by a predetermined length so that a contact area between the picker pad and the electronic component is larger than that in the contact state, and wherein the support is spaced apart from the electronic component by the predetermined length when the picker pad is in the contact state, and comes into contact with the electronic component when the picker pad is in the grip state.

Description

picker tool

The present invention relates to a pick-up handpiece.

In order to test semiconductor components, a tester for testing electrically connected electronic components and a test processor are required. The test processor is a device for electrically connecting the electronic components and the tester.

At the same time, supplying electronic components to be tested in the test processor is performed in a state where the electronic components are loaded on a user tray. Typically, electronic components to be loaded onto a user tray are transported by a hand tool. The handpiece may include a picker for holding the electronic components. The picker can hold a semiconductor component included in the electronic component by vacuum adsorbing a surface of the semiconductor component. Additionally, pickers may be included in the hand to hold semiconductor components. The plurality of pickups are coupled in a handpiece and operate simultaneously.

In the prior art, a small number of semiconductor components with a front or rear flat wide surface are arranged on a PCB of an electronic component, and there is virtually no height or position difference between the semiconductor components. In addition, no sticker is attached to the semiconductor device, or a photosensitive sensor such as an optical sensor or a fingerprint recognition sensor is not included.

However, in recent years, as several configurations have been added to an electronic component, an electronic component having semiconductor elements arranged in different heights or configuration states on a PCB has been produced. When the electronic components with complex configurations are clamped by a conventional pick-up device, there is a problem of incomplete clamping of the semiconductor components.

For example, when a semiconductor element is held by a pickup pad included in the pickup, there is a problem that the pickup pad slides on one of the upper surfaces of the semiconductor element. Furthermore, even when a semiconductor component disposed in the central portion of the PCB is clamped by a picker pad, the electronic component is clamped such that a center of gravity of the electronic component is located on one side of the electronic component This is a problem when the electronic component is tilted relative to a horizontal direction. In addition, when one of the plurality of semiconductor elements with a relatively large height is clamped first, there is a problem that the electronic component is tilted toward the side where the semiconductor element with a relatively small height is arranged and the electronic component cannot be accurately clamped.

Embodiments of the present invention are invented in view of the above background, and an object of the present invention is to provide a picker hand that prevents a picker pad from sliding on a semiconductor device.

Another object of the present invention is to provide a picker hand that can stably hold an electronic component regardless of its center of gravity.

Another object of the present invention is to provide a picker hand that prevents an electronic component from tilting in a direction deviating from a horizontal direction when clamping a semiconductor component.

According to an aspect of the present invention, a pick-up handpiece is provided, which includes: a handpiece; a pick-up unit, which is detachably connected to the handpiece and assembled to hold an electronic component arranged in a lying state ; and a support member configured to support the electronic component, wherein the pick-up unit includes a pick-up pad that can be maintained in a contact state and a clamping state, and in the contact state, the pick-up pad One end of the pick-up pad contacts the electronic component, and in the clamping state, the pick-up pad clamps the electronic component by moving towards the electronic component by a predetermined length, so that there is a gap between the pick-up pad and the electronic component. A contact area is larger than the contact area when the pickup pad is in the contact state, and wherein the support member is separated from the electronic component by the predetermined length when the pickup pad is in the contact state and is separated from the electronic component when the pickup pad is in the contact state. Contact the electronic component while clamped.

In addition, the pickup unit may further include: a pickup body configured to support the pickup pad; and a connecting body disposed between the handpiece and the pickup body and connected to the pickup body. An upper part is connected, and the support member may include a dummy support member, which is separated from the pickup body in a horizontal direction, so that a center of the dummy support member is separated from a center of the pickup body. , and the dummy support member may include one or more dummy support members.

In addition, the pick-up handpiece may further include a joint that extends in an up-and-down direction and has a lower part detachably connected to the pick-up body and an upper part detachably connected to the connecting body. , wherein the connecting body can be indirectly connected to the upper part of the pickup body through the joint.

Furthermore, the pickup body may include one or more pickup bodies, and the pickup pad may include one or more pickup pads, each of the one or more pickup bodies including a first pickup body and a first pickup pad. Two pickup bodies, the first pickup body can be directly connected to the connecting body and the pickup pad, and the second pickup body can be indirectly connected to the connecting body through the joint, and is connected to the first pickup body A lower end of the pickup pad connected to the pickup body may be disposed above a lower end of the pickup pad connected to the second pickup body.

In addition, the pickup unit may further include: a pickup body configured to support the pickup pad; and a connecting body disposed between the handpiece and the pickup body and connected to the pickup body. An upper portion is connected, and the support may include a housing support disposed to surround at least a portion of the pickup body.

In addition, the pickup handpiece may further include: a joint extending in an up-and-down direction and having a lower portion detachably connected to the pickup pad, and the pickup unit may further include: a pickup body, It is assembled to support the pickup pad; and a connecting body, which is disposed between the handpiece and the pickup body and connected with an upper part of the joint and an upper part of the pickup body, the The upper portion of the connector is detachably connected to the connecting body, and the support member may include a housing support member configured to surround at least a portion of the connector.

In addition, a picker handpiece is provided, which includes: a handpiece; a picker unit, which is detachably connected to the handpiece and assembled to hold an electronic component arranged in a lying state; and a connector, which Detachably connected to the pickup unit, wherein the pickup unit includes: a pickup body assembled to support the pickup pad; a connecting body disposed between the handpiece and the pickup body and Connected to an upper part of the pickup body; and a pickup pad that can be maintained in a contact state and a clamping state. In the contact state, one end of the pickup pad contacts the electronic component, and In the clamping state, the picker pad clamps the electronic component by moving a predetermined length toward the electronic component, so that a contact area between the picker pad and the electronic component is larger than the contact area of the picker pad. The contact area in the state is large, and the joint extends in an up-and-down direction and has a lower portion detachably connected to at least one of the pickup body and the pickup pad and detachably connected to the connecting body The upper part.

The picker hand according to an embodiment of the present invention has an effect of preventing the picker pad from sliding on the semiconductor element.

In addition, the picker hand has an effect of stably holding the electronic component regardless of a center of gravity of the electronic component.

In addition, the picker hand has an effect of preventing the electronic component from tilting in a direction deviating from a horizontal direction when the electronic component is clamped.

Hereinafter, specific embodiments for implementing the spirit of the present invention will be described in detail with reference to the drawings.

When explaining the present disclosure, detailed descriptions of conventional configurations or functions may be omitted to clarify the present disclosure.

What you should know when talking about one element being "connected to", "supported by", "grabbed by" another element, "released from" another element or "adsorbed to" another element The element may be directly connected to, supported by, grasped by, released by, or adsorbed by another element, but other elements may be present in between.

The terminology used in this disclosure is for describing particular embodiments only and is not intended to limit the disclosure. Singular references include plural references unless the context clearly indicates otherwise.

Terms including ordinal numbers such as first and second may be used to describe various elements, but the corresponding elements are not limited to these terms. These terms are only used to distinguish one element from another element.

In this specification, it should be understood that terms such as "comprising" are intended to indicate the existence of certain features, regions, integers, steps, actions, components, combinations and/or groups thereof disclosed in the description, and are not intended to Excludes the possibility that one or more other certain features, regions, integers, steps, actions, components, combinations and/or groups thereof may exist or may be added.

Furthermore, in this disclosure, it should be noted that representations such as an upper part or an upper surface are illustrated based on the illustrations in the drawings, but may be modified if the direction or corresponding object is changed.

Hereinafter, a detailed configuration of a test processor 1 according to a first embodiment of the present invention will be described with reference to the drawings.

Please refer to Figure 1 below. According to the first embodiment of the present invention, the test processor 1 can test electronic components D produced through a process, classify the electronic components D according to the test results, and load the electronic components D. On a custom tray. In addition, the test processor 1 can be detachably coupled with a tester (not shown). The test processor 1 may include a processor body 10 , a picker hand module 20 and a processor transporter 30 for moving the processor body 10 .

The processor body 10 may be a frame supporting the picker hand module 20 . The processor body 10 can support multiple pickup handpiece modules 20 . In addition, the processor body 10 can be moved by the processor transporter 30 .

Please refer to FIG. 2 again. The picker hand module 20 can move various electronic components D to a desired position. The picker hand module 20 may include a picker hand support 21, a picker hand 22, a controller 23, a pneumatic device 24 and a tube (not shown) for a flow path.

The picker hand support 21 may be a frame connected to the picker hand 22 and may support the picker hand 22 . Furthermore, the picker hand support 21 may be configured to be connected with the processor body 10 and move together with the processor body 10 .

The picker hand 22 can use a vacuum adsorption method to hold or release a semiconductor component of an electronic component D lying opposite to the ground. The release indicates that the clamped semiconductor component deviates from a clamped state. The lying position of the electronic component D can represent a state in which a relatively wide surface of the electronic component D is placed parallel to the ground.

When the shape of the semiconductor element changes, the picker hand 22 can stably hold or release the semiconductor element according to the deformation of the semiconductor element. In other words, even when at least one of a width and a length of the semiconductor element changes or the shape of the semiconductor element changes, the picker hand 22 can stably hold or release the semiconductor element. In addition, the semiconductor element may have various shapes of semiconductor elements arranged on a PCB. A plurality of these pick-up tools 22 may be provided. For example, the plurality of pick-up hands 22 can be connected to the pick-up hand support 21 so that the plurality of pick-up hands 22 are arranged in one direction. The picker hand 22 may include a hand 100, a picker unit 200, a joint 300 and a support 400.

The handpiece 100 can suck or discharge a fluid through the pneumatic device 24 . For example, when the handpiece 100 sucks the fluid, the semiconductor element may be adsorbed on the pickup unit 200 and become a clamped state. In addition, when the handpiece 100 discharges the fluid, the semiconductor element may enter a clamping release state deviating from the clamping state, that is, a state in which the semiconductor element is adsorbed on the pickup unit 200 .

Please refer to FIG. 3 again. In a state where the handpiece 100 is connected to the picker unit 200, the handpiece 100 can move together with the picker unit 200 so that the semiconductor element can be picked up by the picker pad 260 as described below. Clamped at a predetermined position. The handpiece 100 may include a handpiece body 110, a latch portion 120 and a calibration portion 130.

When the handpiece 100 and the pickup unit 200 are connected to each other, the handpiece body 110 can support the pickup unit 200 . In addition, the handpiece body 110 may be provided with one or more handpiece flow paths 110a through which a fluid to be sucked or discharged relative to the outside flows. In addition, a fixing pin groove 110b into which one of the fixing pins 240 described below can be inserted may be formed in the handpiece body 110.

The handpiece flow path 110a may be a channel extending in a vertical direction through which the fluid flows. In the handpiece flow path 110a, an external fluid sucked by an absorber (not shown) can flow upward. In addition, in the handpiece flow path 110a, the fluid flowing in the handpiece flow path 110a can flow outward by a blower (not shown). In addition, a handpiece body 110 may be provided with a handpiece flow path 110a. When the handpiece 100 and the pickup unit 200 are separated from each other, the handpiece flow path 110a can be connected to the outside.

When the fixing pin 240 is inserted into the fixing pin groove 110b, the fixing pin 240 can be supported by the handpiece body 110. The fixing pin groove 110b may be formed on the other side of the handpiece body 110 in the front-rear direction. The front-to-back direction is defined as a direction in which the second connecting flow path 210b extends as described below, and one side in the front-to-back direction may represent, for example, a front side, and may represent the left side of the handpiece body 110 in FIG. 2 . In addition, the other side in the front-back direction may represent, for example, a back side, and may represent the right side of the handpiece body 110 in FIG. 2 .

The latch portion 120 allows the pickup unit 200 to be latched onto the handpiece body 110 . For example, the latch portion 120 may support the pickup unit 200 when the pickup unit 200 is latched. The latch portion 120 may be connected to one side of the handpiece body 110 in the front-to-back direction. One side in the front-rear direction may represent, for example, the front side and may represent the left side of the handpiece body 110 in FIG. 2 . For example, the latch portion 120 may be configured to rotate relative to the handpiece body 110 around a predetermined rotation axis disposed on one side of the handpiece body 110 in the front-to-back direction. The latch portion 120 may be assembled with the handpiece body 110 as a single component or as a separate component.

When the pickup unit 200 is connected to the handpiece body 110, the calibration portion 130 can improve the fit of the connection. In addition, the plurality of calibration parts 130 may be disposed and connected to a lower part of the handpiece body 110 . The calibration part 130 may include a first calibration pin 131 and a second calibration pin 132 . The first calibration pin 131 and the second calibration pin 132 may be disposed apart from each other. For example, the first calibration pin 131 and the second calibration pin 132 may be configured to be separated in the front-rear direction. In addition, the first calibration pin 131 may be configured to be inserted into one of the first calibration grooves 210e described below. In addition, the second calibration pin 132 can be configured to be inserted into one of the second calibration slots 210d described below. The picker unit 200 can hold or release the semiconductor component through the hand 100 in a ready state. The ready state is defined as a state in which the pickup unit 200 is disposed facing the lying semiconductor component and the pickup unit 200 is connected to the handpiece 100 . In addition, the pickup unit 200 connected to the handpiece 100 can be replaced. For example, the pickup unit 200 may be configured as a plurality of different pickup units 200 .

The picker unit 200 may include a connecting body 210, a locking jaw 220, a latch pin 230, the fixing pin 240, a picker body 250 and the picker pad 260.

The connecting body 210 can be disposed between the handpiece 100 and the pickup body 250 . The connecting body 210 can be detachably connected to the handpiece 100 . The connecting body 210 can be connected with the pickup body 250 . For example, an upper portion of the pickup body 250 can be connected to a lower portion of the connecting body 210 .

The connecting body 210 can transmit the fluid suction force of the handpiece 100 to aspirate fluid and the ejection force of the handpiece 100 to discharge fluid to the pickup pad 260 . The connecting body 210 may be provided with a connecting flow path that communicates with the handpiece flow path 110a in the ready state. The connecting flow path may be provided with a first connecting flow path 210a, a second connecting flow path 210b, a third connecting flow path 210c, the second calibration groove 210d and the first calibration groove 210e.

The first connecting flow path 210a may be a channel extending in a vertical direction. The first connection flow path 210a can be connected with the handpiece flow path 110a. The width of the first connection flow path 210a may be the same as the width of the handpiece flow path 110a. The first connecting flow path 210a may be formed below the handpiece flow path 110a. The first connecting flow path 210a may be a flow path branched upward from the second connecting flow path 210b.

The second connecting flow path 210b may be a channel extending in a horizontal direction. For example, the second connecting flow path 210b may be a channel extending perpendicularly to the first connecting flow path 210a and extending in a direction parallel to a direction in which the fixing pin 240 is inserted into the fixing pin groove 110b. The second connection flow path 210b can be connected with the first connection flow path 210a. In addition, the second connection flow path 210b may be connected with the third connection flow path 210c.

The third connecting flow paths 210c may be configured to correspond to the number of pickup pads 260. For example, when the number of the pickup pads 260 is two, the third connecting flow path 210c may be formed to correspond to each pickup body of the two pickup bodies 250. In other words, one or more third connection flow paths 210c may be provided on one picker hand 22. An upper side of the third connecting flow path 210c may be adjacent to the second connecting flow path 210b, and a lower side of the third connecting flow path 210c may be adjacent to the pickup body 250. The third connecting flow path 210c may be a flow path branched downward from the second connecting flow path 210b.

The second calibration pin 132 is selectively inserted into the second calibration groove 210d. For example, in the ready state, the second calibration pin 132 may be inserted into the second calibration slot 210d. The second calibration groove 210d may be formed on the upper side of the connecting body 210. The second calibration groove 210d may be formed in the connecting body 210 and correspond to the width of the second calibration pin 132. For example, the second calibration pin 132 may be press fit in the second calibration groove 210d.

The first calibration pin 131 is selectively inserted into the first calibration groove 210e. For example, in the ready state, the first calibration pin 131 may be inserted into the first calibration slot 210e. The first calibration groove 210e may be formed to be separated from the second calibration groove 210d by a predetermined distance on the upper side of the connecting body 210. The first alignment groove 210e may be formed to have a width larger than that of the first alignment pin 131. In other words, even when the first calibration pin 131 is inserted into the first calibration groove 210e, the first calibration pin 131 may not contact a portion of the connecting body 210 surrounding the first calibration groove 210e.

The first calibration slot 210e and the second calibration slot 210d may be a slot or a hole. Preferably, the first calibration groove 210e can be a slot hole and the second calibration groove 210d can be a hole.

In a ready state, the locking jaw 220 prevents the fixing pin 240 from moving more than a predetermined distance toward one side in the front, rear, and upward directions. In the ready state, the locking jaw 220 may have a shape protruding toward the fixing pin 240 . When the fixing pin 240 is locked on the locking jaw 220 or a distance between the locking jaw 220 and the fixing pin 240 in the front-rear direction is equal to or less than a predetermined distance, the hand can be released. The tool 100 and the pickup unit 200 are fixed.

The latch portion 120 can be snapped onto the latch pin 230 . The latch pin 230 is connected to the other side of the connecting body 210 , and the connecting body 210 can be supported by the latch part 120 through the latch pin 230 . In addition, the latch pin 230 can provide a predetermined rotation axis so that the connecting body 210 can rotate relative to the handpiece 100 . The rotation axis may be an imaginary straight line extending in a direction perpendicular to a direction in which the first connecting flow path 210a extends and a direction in which the second connecting flow path 210b extends. In the ready state, the latch pin 230 prevents the pickup unit 200 from moving relative to the handpiece 100 in the front-to-back direction. In other words, the height of a central portion of the latch portion 120 may be higher than the height of a lower end of the latch pin 230 , and the height of a lower end of the latch portion 120 may be higher than the height of the latch pin 230 . A height of a portion of one end of the latch portion 120 may be higher than a height of a lower end of the latch pin 230 .

The fixing pin 240 can fix the pickup unit 200 on the handpiece 100 . For example, when the fixing pin 240 is inserted into the fixing pin groove 110b, the pickup unit 200 can be fixedly supported by the handpiece 100. The fixing pin 240 can be bolted to the handpiece 100 . For example, a thread for bolting the securing pin 240 to the handpiece 100 may be formed in the handpiece 100 . The widths of the two ends of the fixing pins 240 may be different from each other. For example, the width of one end of the fixing pin 240 in the front-to-back direction may be larger than the width of the other end in the front-to-back direction. In addition, the width of the other end portion of the fixing pin 240 in the front-rear direction may be larger than the width of a central portion of the fixing pin 240 . When the fixing pin 240 moves a predetermined distance toward one side in the front-rear direction, the width of the other end of the fixing pin 240 in the front-rear direction allows the fixing pin 240 to be caught in the locking jaw. 220 on.

The pickup body 250 can be connected with the pickup pad 260 such that the pickup pad 260 is vertically separated from the connecting body 210 . For example, a lower portion of the pickup body 250 can be connected to the pickup pad 260 such that the pickup pad 260 is disposed below the connecting body 210 . The pickup body 250 can extend in a vertical direction.

In addition, a plurality of pickup bodies 250 may be provided. The plurality of pickup bodies 250 may be configured to be separated from each other in a horizontal direction. Some of the plurality of pickup bodies 250 may have an upper portion directly connected to the connecting body 210 and a lower portion directly connected to the pickup pad 260 . Some of the plurality of pickup bodies 250 may be called a first pickup body. At the same time, the upper part of other pickup bodies in the plurality of pickup bodies 250 can be indirectly connected to the connecting body 210 through the joint 300, and the lower part can be indirectly connected to the pickup pad 260 through the joint 300. Connection, or both the upper parts and the lower parts are connected to the connecting body 210 and the pickup pad 260 respectively through the joints 300. In other words, at least one of the upper and lower parts of other pickup bodies in the plurality of pickup bodies 250 can be connected to the connector 300 . Other pickup bodies among the plurality of pickup bodies 250 connected to the connector 300 may be referred to as second pickup bodies.

The pickup body 250 may be provided with a pickup flow path 250a. The pickup flow path 250a may be a channel extending in a vertical direction. The pickup flow path 250a can communicate with the third connection flow path 210c. In addition, the width of the pickup flow path 250a may be less than or equal to at least one of the handpiece flow path 110a, the first connection flow path 210a, the second connection flow path 210b, and the third connection flow path 210c. Width. Additionally, a pickup flow path 250a may be provided in a pickup body 250. However, the spirit of the present invention is not necessarily limited thereto, and a plurality of pickup flow paths 250a may be provided in one pickup body 250. Furthermore, the centers of the flow paths of the pickup flow path 250a, the handpiece flow path 110a, the first connection flow path 210a and the third connection flow path 210c can be located on the same line. In other words, the pickup flow path 250a, the handpiece flow path 110a, the first connection flow path 210a and the third connection flow path 210c may be formed as a single flow path extending in the vertical direction.

Please refer to FIGS. 4 and 5 again. The pickup pad 260 is in a contact state in which at least a part of the pickup pad 260 contacts the electronic component D, and the pickup pad 260 clamps the electronic component D in a clamping state. , or the picker pad 260 releases a clamping release state of the electronic component D. The contact state represents a state in which a lower end of the pickup pad 260 contacts the semiconductor element when the pickup pad 260 is disposed to face the semiconductor element of the electronic component D. The clamping state means that when the pickup pad 260 is in the contact state, the pickup pad 260 moves toward the semiconductor element by a predetermined length h1 so that a contact area between the pickup pad 260 and the electronic component D increases. The clamping release state represents a state deviating from the clamping state.

A plurality of pickup pads 260 may be provided on one electronic component D. Furthermore, one of the plurality of picker pads 260 may be connected to a lower portion of the first picker body, and another picker pad may be connected to a lower portion of the second picker body.

A pad flow path 260a may be formed in the pickup pad 260. The pad flow path 260a can communicate with the pickup flow path 250a. The pad flow path 260a may be formed in a direction parallel to the direction in which the pickup flow path 250a is formed. In addition, when the pickup pad 260 is in contact, a lower end of the pad flow path 260a may be vertically separated from the semiconductor element by a predetermined distance. For example, when the pickup pad 260 is in the clamping state, a separation distance between the lower end of the pad flow path 260a and the semiconductor element may be greater than when the pickup pad 260 is in the contact state. A separation distance between the semiconductor elements is small. In addition, when the pickup pad 260 is in the clamped state, the pad flow path 260a and the semiconductor element can be adjacent to each other without being separated from each other.

The picker pad 260 may be elastic. For example, the pickup pad 260 may be configured such that the contact area between the pickup pad 260 and the semiconductor element gradually increases when the pickup pad 260 changes from the contact state to the clamping state. The picker pad 260 may have a shape in which the circumference decreases from bottom to top. Additionally, a plurality of pickup pads 260 may be provided. The plurality of pickup pads 260 may be partially connected to the lower portion of each pickup body 250 arranged in the horizontal direction.

The joint 300 can adjust a separation distance between the pickup pad 260 and the connecting body 210 . The joint 300 can extend in the vertical direction. For example, the separation distance between the pickup pad 260 and the connecting body 210 may be determined by an extension length of the connector 300 . The connector 300 can increase the separation distance between the pickup pad 260 and the connection body 210 according to the relative reduction in the height of the semiconductor element of the electronic component D.

Meanwhile, in the figure according to this embodiment, the joint 300 is shown to have a vertical length smaller than the pickup body 250, but the spirit of the present invention is not necessarily limited thereto. Therefore, the joint 300 may have the same vertical length as the pickup body 250 or a larger vertical length than the pickup body 250 . Furthermore, the joint 300 may be formed to have the same length as the first pickup body and may be formed to have a smaller length than the second pickup body.

An upper part of the connector 300 can be connected to the connecting body 210 and a lower part can be connected to the pickup body 250 . In other words, the joint 300 can be disposed between the connecting body 210 and the pickup body 250 . A joint flow path 300a may be formed in the joint 300. The joint flow path 300a can communicate with the pickup flow path 250a and the pad flow path 260a. In addition, the joint flow path 300a can be connected with the first connection flow path 210a, the second connection flow path 210b and the third connection flow path 210c.

When the pick pad 260 is in the clamping state, the supporting member 400 can support the electronic component D. For example, the support member 400 can prevent the picker pad 260 from deviating from the clamped state due to the electronic component D tilting in a direction deviating from the horizontal direction after the picker pad 260 enters the clamped state. In other words, the support member 400 can maintain a state in which the semiconductor element of the electronic component D contacts the pickup pad 260 when facing the pickup pad 260 . The support member 400 may include a dummy support member 401 .

The false support member 401 can be separated from the pickup body 250 and the pickup pad 260 in a horizontal direction and connected with the connecting body 210 . A lower surface of the false support member 401 may be in the horizontal direction. For example, when the pickup pad 260 becomes the contact state, the lower surface of the dummy support 401 may be parallel to an upper surface of the semiconductor element.

When the pick pad 260 becomes the contact state, the dummy support 401 may be disposed to face the semiconductor element. For example, when the pick pad 260 becomes the contact state, the dummy support 401 may be disposed facing the semiconductor element and vertically separated from the semiconductor element by the predetermined length h1. The false support member 401 may be disposed such that a central axis of the false support member 401 and a central axis of at least one of the pickup body 250 and the pickup pad 260 are parallel to and separated from each other. Even when the fluid suction force of the handpiece 100 is not increased, the false support member 401 allows the electronic component D to be stably held by the picker hand 22 in a lying state.

When the pick pad 260 becomes the clamping state, the dummy support 401 can contact the semiconductor element and support the electronic component D. For example, when the lower end of the pad flow path 260a abuts the semiconductor device, the dummy support 401 may contact the semiconductor device. When the pickup pad 260 enters the clamping state, the false support member 401 can prevent the pickup pad 260 from deforming. In addition, the dummy support 401 may be configured to be separated from the pickup pad 260 in a horizontal direction when the pickup pad 260 becomes the clamped state.

In addition, when the pick pad 260 enters the clamping state, the false support member 401 can prevent the pick pad 260 from pressurizing the electronic component D beyond a predetermined pressure. In other words, when the pickup pad 260 contacts the semiconductor element, the dummy support 401 can prevent the pickup pad 260 from sliding in the horizontal direction.

Please refer to FIG. 6 again. The false support member 401 can extend in a vertical direction. A plurality of dummy supports 401 can be provided. The plurality of false supports 401 and the plurality of pickup bodies 250 may be arranged in the horizontal direction.

The controller 23 can control the pneumatic device 24 . The pneumatic device 24 can supply a fluid to the handpiece flow path 110a formed in the handpiece 100 or suck a fluid from the handpiece flow path 110a. The controller 23 can control the pneumatic device 24 so that the pneumatic device 24 sucks the fluid and the pickup pad 260 clamps the semiconductor component. In addition, the controller 23 can control the pneumatic device 24 such that the pneumatic device 24 supplies the fluid to the handpiece flow path 110a and the picker pad 260 releases the semiconductor element. The controller 23 may be implemented by a computing device including a microprocessor, and since an implementation method is obvious to those with ordinary skill in the art, further detailed description thereof is omitted. Tubing for a flow path may be disposed within the handpiece flow path 110a, the link flow path, and the pickup flow path 220a and connected to the pneumatic device.

Meanwhile, in addition to this configuration, according to a second embodiment of the present invention, the support member 400 may further include a cover support member 402. In addition, the connector 300 can be connected with the connecting body 210 and the pickup pad 260 . Hereinafter, the second embodiment of the present invention will be further described with reference to FIGS. 7 to 12 . In the description of the second embodiment, the differences between the above-mentioned embodiment and the second embodiment are mainly explained, and please refer to the above-mentioned embodiment for the same descriptions and symbols.

Referring to FIGS. 7 and 8 , the upper part of the connector 300 can be connected to the connecting body 210 , and the lower part of the connector 300 can be connected to the pickup pad 260 . The joint 300 can be configured to be separated from the pickup body 250 in a horizontal direction. The vertical length of the connector 300 may be different from the vertical length of the pickup body 250 . For example, when the vertical length of the connector 300 is larger than the vertical length of the pickup body 250, the vertical distance between the pickup pad 260 and the connecting body 210 connected to the connector 300 is larger than the vertical distance between the pickup pad 260 and the connecting body 250. The vertical distance between the pickup pad 260 and the connecting body 210 is large. One or more connectors 300 may be provided. For example, when a plurality of pickup bodies 250 are provided, a plurality of connectors 300 may be provided to correspond to the plurality of pickup bodies 250 . In a more detailed example, when a plurality of pickup bodies 250 are provided, one connector 300 is provided on any one of the plurality of pickup bodies 250 and the plurality of joints 300 can be provided on other pickup bodies 250 . In addition, the vertical length of the joint 300 provided on any one of the plurality of pickup bodies 250 may be different from the vertical length of the joint 300 provided on other pickup bodies 250 .

When two or more pick-up bodies 250 are required, the pick-up hand 22 has joints 300 appropriately installed on each of the pick-up bodies 250 to stably hold a plurality of pick-up bodies with different heights. An effect of configuring semiconductor components. In addition, the picker hand 22 has an effect of preventing a gap from being generated between the picker pads 260 and the semiconductor components through the connector 300 .

The pick-up pad connected to the pick-up body 250 in the pick-up pads may be called a first pick-up pad, and the pick-up pad connected to the connector 300 in the pick-up pads may be called a first pick-up pad. for a second picker pad.

Please refer to FIGS. 9 and 10 again. An upper portion of the cover support member 402 can be connected to the connecting body 210 . A lower surface of the housing support member 402 may be in the horizontal direction. For example, when the pickup pad 260 is in the contact state, the lower surface of the housing support 402 may be parallel to the upper surface of the semiconductor element.

When the pick pad 260 is in the contact state, the housing support 402 may be positioned to face the semiconductor device. For example, when the pick pad 260 is in the contact state, the housing support 402 may be disposed facing the semiconductor element and vertically separated from the semiconductor element by a predetermined length h2.

Please refer to FIGS. 11 and 12 again. When the pick pad 260 is in the clamping state, the housing support 402 can contact the semiconductor component and support the electronic component D. For example, when the lower end of the pad flow path 260a abuts the semiconductor device, the housing support 402 may contact the semiconductor device. In addition, when the pickup pad 260 is in the clamped state, the cover support 402 can prevent the pickup pad 260 from deforming.

Additionally, the housing support 402 may be configured to be separated from the pickup pad 260 in a horizontal direction when the pickup pad 260 is in the clamped state. A central axis of the cover support 402 may be the same as a central axis of at least one of the pickup body 250 and the pickup pad 260 . Through the cover support member 402, when the electronic component D is clamped, the electronic component D can be prevented from rotating around an axis perpendicular to the central axis of the pickup pad 260. For example, even when a front portion of the clamped electronic component D disposed on the front side of the picker pad 260 weighs more than a rear portion of the clamped electronic component D disposed on the rear side of the picker pad 260 When the electronic component D is large, the housing support member 402 can also be used to prevent the electronic component D from tilting forward and downward. Even when the fluid suction force of the handpiece 100 is not increased, the cover support 402 allows the electronic component D to be stably held by the picker hand 22 in a lying state.

The cover support member 402 may include a first cover support member and a second cover support member. The first housing support may be disposed to surround the pickup body 250 . Additionally, the second housing support may be provided to surround the connector 300 . In addition, the first housing support member and the second housing support member may extend to different lengths in a vertical direction. For example, when the vertical length of the pickup body 250 is smaller than the vertical length of the connector 300, the vertical length of the first housing support member may be smaller than the vertical length of the second housing support member. In a more detailed example, the difference between the vertical length of the pickup body 250 and the vertical length of the connector 300 may be the same as the difference between the first housing support member and the second housing support member.

The following describes the operation of the test processor 1 according to the embodiment of the present invention.

The test processor 1 can be moved by the processor transporter 30 so that the picker pad 260 faces the upper surface of the semiconductor component on which the electronic component D is laid. The pickup pad 260 may be in a contact state in which the lower end of the pickup pad 260 contacts the upper surface of the semiconductor element. The pickup pad 260 can move downward toward the electronic component D by the predetermined length h1 when in the contact state. When a lower surface of the pickup pad 260 completely contacts the electronic component D and controls the pneumatic device 24 to suck the fluid, the electronic component D can be clamped by the pickup pad 260 and the pickup pad 260 can become the Clamping state. In addition, when the pick pad 260 is in the clamping state, a lower surface of the support member 400 can contact the upper surface of the semiconductor element.

The electronic component D can be moved by the processor transporter 30 to a state where the picker pad 260 becomes the clamping state and the support member 400 contacts the semiconductor element. The electronic component D can move to a target position while maintaining the lying state.

The examples of the present disclosure are described above as specific embodiments, but these specific embodiments are only examples, and the present disclosure is not limited thereto and should be regarded as having the widest scope in accordance with the technical spirit disclosed in this specification. A person of ordinary skill in the art can combine/replace the disclosed embodiments to implement a pattern in an undisclosed shape without departing from the scope of the present disclosure. In addition, those with ordinary skill in the art can easily change or modify the disclosed embodiments based on this description, and it is understood that such changes or modifications also fall within the scope of the present disclosure.

1: Test processor 10:Processor body 20: Pickup tool module 21: Picker hand support piece 22: Picker Tool 23:Controller 24:Pneumatic device 30: Processor Transporter 100:Hands 110:Handpiece body 110a: Handpiece flow path 110b: Fixed pin groove 120:Latching part 130: Calibration part 131: First calibration pin 132: Second calibration pin 200: Pickup unit 210:Connect the body 210a: First connection flow path 210b: Second connection flow path 210c: Third link flow path 210d: Second calibration tank 210e: First calibration tank 220:Lock jaw 230:Latch pin 240: Fixed pin 250: Pickup body 250a: Pickup flow path 260: Picker pad 260a: Pad flow path 300:Connector 300a: Joint flow path 400:Supporting parts 401: Fake support parts 402: Cover support piece D: Electronic components h1, h2: predetermined length

FIG. 1 is a perspective view of a test processor according to a first embodiment of the present invention. FIG. 2 is a perspective view of a picker hand module according to the first embodiment of the present invention. Figure 3 is a cross-sectional view taken along line AA' of Figure 2. FIG. 4 is an enlarged view of B in FIG. 3 , showing a state in which a pickup pad contacts an electronic component. FIG. 5 is an enlarged view showing a state in which the electronic component is clamped by the pickup pad of FIG. 4 . FIG. 6 is a cross-sectional view showing a state in which a plurality of dummy supports are provided. FIG. 7 is a perspective view of a picker hand module according to a second embodiment of the present invention. FIG. 8 is an exploded perspective view of the picker hand module in FIG. 7 . Figure 9 is a cross-sectional view taken along line CC' of Figure 7 . Figure 10 is an enlarged view of D in Figure 9 . FIG. 11 is an enlarged view showing a state where one of the pickup pads in FIG. 10 is in a clamped state. FIG. 12 is a cross-sectional view showing a state in which an electronic component is clamped by a pick-up pad.

1: Test processor 10:Processor body 20: Pickup tool module 21: Picker hand support piece 22: Picker Tool 23:Controller 24:Pneumatic device 30: Processor Transporter 100:Hands 200: Pickup unit 210:Connect the body 250: Pickup body 260: Picker pad 400:Supporting parts 401: Fake support parts

Claims (7)

A picker hand tool containing: a hand tool; a picker unit removably connected to the handpiece and assembled to hold an electronic component disposed in a lying state; and a support member configured to support the electronic component, The pick-up unit includes a pick-up pad, and the pick-up pad can be maintained in a contact state and a clamping state. In the contact state, one end of the pick-up pad contacts the electronic component, and in the clamp In the holding state, the pickup pad clamps the electronic component by moving a predetermined length toward the electronic component, so that the contact area between the pickup pad and the electronic component is larger than when the pickup pad is in the contact state. The contact area is large and The support member is separated from the electronic component by the predetermined length when the pick pad is in the contact state and contacts the electronic component when the pick pad is in the clamping state. The pickup handpiece of claim 1, wherein the pickup unit further includes: a pickup body configured to support the pickup pad; and a connecting body disposed between the handpiece and the pickup body and connected to an upper part of the pickup body, Wherein the support member includes a dummy support piece, the dummy support piece is arranged separately from the pickup body in a horizontal direction, so that a center of the dummy support piece is separated from a center of the pickup body, and The dummy support part includes one or more dummy support parts. For example, the pickup tool of request item 2 further includes: a joint that extends in an up-and-down direction and has a lower part detachably connected to the pickup body and an upper part detachably connected to the connecting body, The connection system is indirectly connected to the upper part of the pickup body through the joint. The picker hand of claim 3, wherein the picker body includes one or more picker bodies, and the picker pad may include one or more picker pads, wherein each of the one or more pickup bodies includes a first pickup body and a second pickup body, wherein the first pickup system is directly connected to the connecting body and the pickup pad, and the second pickup system is indirectly connected to the connecting body through the joint, and A lower end of the pickup pad connected to the first pickup body is disposed above a lower end of the pickup pad connected to the second pickup body. The pickup handpiece of claim 1, wherein the pickup unit further includes: a pickup body configured to support the pickup pad; and a connecting body disposed between the handpiece and the pickup body and connected to an upper part of the pickup body, and The support member includes a cover support member configured to surround at least a portion of the pickup body. For example, the pickup tool of request item 1 further includes: a joint extending in an up-and-down direction and having a lower portion detachably connected to the pickup pad, The pickup unit further includes: a pickup body configured to support the pickup pad; and a connecting body, which is disposed between the handpiece and the pickup body and connected with an upper part of the joint and an upper part of the pickup body, wherein the upper part of the joint is detachably connected to the connecting body, and The support member includes a cover support member configured to surround at least a portion of the joint. A picker hand tool containing: a hand tool; a picker unit removably connected to the handpiece and assembled to hold an electronic component disposed in a lying state; and a connector removably connected to the pickup unit, The pickup unit includes: a pickup body assembled to support the pickup pad; a connecting body disposed between the handpiece and the pickup body and connected to an upper part of the pickup body; and A pick-up pad that can be maintained in a contact state and a clamping state. In the contact state, one end of the pick-up pad contacts the electronic component, and in the clamping state, the pick-up pad is Clamping the electronic component by moving a predetermined length toward the electronic component such that a contact area between the pickup pad and the electronic component is larger than the contact area when the pickup pad is in the contact state, and The joint extends in an up-down direction and has a lower part detachably connected to at least one of the pickup body and the pickup pad and an upper part detachably connected to the connecting body.