TW202429103A - Picker hand - Google Patents

Abstract

A picker hand includes a hand having a hand flow path through which a fluid flows, and a picker unit configured to be detachably connected to the hand. The picker unit includes one or more pickers each providing a picker flow path through which the fluid flows, and a link providing a link flow path communicating with the hand flow path and the picker flow path when the picker unit is connected to the hand. The picker unit grips or releases a semiconductor device of an electronic component disposed in a supine state depending on whether the fluid flows through the hand flow path, the picker flow path, and the link flow path.

Description

Picker Hand Tool

The present disclosure relates to a picker hand tool module.

In order to test semiconductor devices, a tester for testing a plurality of electrically connected electronic components and a test handler are required, the test handler being a device for electrically connecting the electronic components to the tester. In addition, in order to increase the processing capacity, the test handler uses a test tray that can transport a large number of electronic components at a time and load the electronic components in a matrix form.

At the same time, when the user tray is loaded with electronic components, the electronic components to be tested in the test processor are supplied. Generally speaking, the electronic components to be loaded onto the user tray can be transferred by a hand tool. The hand tool may include a picker for sucking the electronic components. Such a picker can suck the semiconductor device included in the electronic component by vacuum adsorption of a surface of the semiconductor device. In addition, a plurality of pickers can be provided in the hand tool to hold a plurality of semiconductor devices. The plurality of pickers are combined into one hand tool and operate simultaneously.

In conventional PCB boards of electronic components, a small number of semiconductor devices are arranged with a flat front or back surface, and the difference in height or position of these semiconductor devices is small. In addition, no sticker is attached to the semiconductor device, or sensitive sensors such as optical sensors or fingerprint recognition sensors are not provided on the semiconductor device.

However, recently, as various components are added to electronic assemblies, the height or configuration state of semiconductor devices on PCBs is different for each electronic assembly. When an electronic assembly configured with such a complex configuration is sucked with a conventional picker, the semiconductor device may not be completely sucked, and furthermore, when a sensitive sensor on the PCB is not properly sucked, the electronic assembly may be damaged.

In view of the above, the present disclosure provides a picker hand module that can completely absorb a plurality of electronic components each having a semiconductor device in response to a change in the horizontal direction of the configuration state of the semiconductor device on a PCB.

In addition, the present disclosure provides a picker hand module that is capable of completely sucking a plurality of electronic components each having a semiconductor device, each corresponding to a height of a plurality of semiconductor devices, even when the heights of the semiconductor devices are different from each other.

According to a first specific embodiment of the present disclosure, a picker handpiece is provided, comprising: a handpiece having a handpiece flow path for a fluid to flow through; and a picker unit assembled to be detachably connected to the handpiece, wherein the picker unit comprises one or more pickers and a connecting rod, the one or more pickers each providing a picker flow path for the fluid to flow through, and the connecting rod providing a connecting rod flow path communicating with the handpiece flow path and the picker flow path when the picker unit is connected to the handpiece, and wherein, depending on whether the fluid flows through the handpiece flow path, the picker flow path, and the connecting rod flow path, the picker unit absorbs or releases a semi-conductor device of an electronic component that is arranged to be in a supine state.

The connecting rod flow path may include: a first connecting rod flow path formed along a first direction; a second connecting rod flow path formed along a second direction different from the first direction; and a third connecting rod flow path communicating with the second connecting rod flow path and at least one of the picker flow paths.

The picker assembly can be configured such that, when the picker is configured to face the semiconductor device configured to be in the supine position and the picker unit is connected to the handpiece in a ready state, the semiconductor device can be sucked when the picker handpiece inhales the fluid and the semiconductor device can be released when the picker handpiece discharges the fluid, and the first direction can be a vertical direction, and the second direction can be a direction perpendicular to the first direction.

The picker may include a plurality of pickers, and the plurality of pickers hold or release the electronic component.

The plurality of pickers may be configured to independently adjust heights of the plurality of pickers in response to the heights of the plurality of semiconductor devices of the electronic assembly disposed in the supine position in the first direction.

The hand assembly can be configured to be separable from the picker unit having the plurality of pickers spaced apart from each other by a first separation distance and connectable to another picker unit having the plurality of pickers spaced apart from each other by a second separation distance, the second separation distance being different from the first separation distance, so as to hold a plurality of semiconductor devices having different configurations.

The picker may include a plurality of pickers, and each of the plurality of pickers includes the picker flow path, and the third connecting rod flow paths may be provided in a number corresponding to the number of the picker flow paths so as to be branched from the second connecting rod flow path to communicate with the picker flow paths.

According to a second specific embodiment of the present disclosure, a picker hand tool is provided, comprising: a hand tool configured to inhale or discharge a fluid and having a plurality of hand tool flow paths for the fluid to flow through; and a picker unit configured to be detachably connected to the hand tool, wherein the picker unit comprises: one or more pickers and a connecting rod, wherein the one or more pickers are configured to absorb or release an electronic component that is arranged in a supine state; The picker unit is provided with a semiconductor device, each of the pickers provides a picker flow path for the fluid to flow through; the connecting rod provides a connecting rod flow path that is connected to the plurality of hand tool flow paths and the picker flow path when the picker unit is connected to the hand tool, and wherein, depending on whether the fluid flows through the plurality of hand tool flow paths, the picker flow path, and the connecting rod flow path, the picker unit absorbs or releases the semiconductor device that is arranged to be in the supine state.

According to a specific embodiment of the present disclosure, the picker hand module can completely absorb the semiconductor device in response to the change of the configuration state of the semiconductor device in the horizontal direction.

Furthermore, even when the heights of a plurality of semiconductor devices are different from each other, the picker hand module can completely absorb the semiconductor devices by adjusting the height of the picker to respectively correspond to the heights of the semiconductor devices.

In addition, considering the size and center of gravity of the electronic component, regardless of the number of pickers, the picker hand module can stably hold the electronic component.

Hereinafter, several specific embodiments for implementing the spirit of the present disclosure will be described in detail with reference to the accompanying drawings.

In describing the present disclosure, detailed descriptions of known configurations or functions may be omitted to clarify the present disclosure.

When an element is said to be 'connected to' another element, 'supported by it, 'absorbed by it, 'flowed to' another element, 'released by it, or 'absorbed by it', it should be understood that the element may be directly connected to, supported by, absorbed by, flowed to, released by, or absorbed by another element, but other elements may exist in between. Moreover, 'absorbed' may mean pressing both sides of an electronic component or adsorbing on a surface of an electronic component.

The terms used in this disclosure are only used to describe specific embodiments and are not intended to limit the disclosure. Singular terms include plural terms unless the context clearly indicates otherwise.

Terms including ordinal numbers such as first and second may be used to describe various elements, but the corresponding elements are not limited to these terms. The purpose of using these terms is only to distinguish one element from another element.

In this patent specification, it should be understood that terms such as "including" are intended to indicate the existence of certain features, regions, integers, steps, actions, components, combinations, and/or groups thereof disclosed in this specification, and are not intended to exclude the possibility that one or more other features, regions, integers, steps, actions, components, combinations, and/or groups thereof may exist or may be added.

Furthermore, in the present disclosure, it should be noted that terms such as upper side and upper surface are described based on the illustrations in the accompanying drawings, but may be modified if the orientation of the corresponding object changes. Furthermore, the first direction may be defined as an up-down direction.

Below, the specific configuration of the picker hand tool module 1 according to the first specific embodiment of the present disclosure is described with reference to the accompanying drawings.

1 , a picker hand module 1 according to a first embodiment of the present disclosure can move various types of electronic components D to a desired position. The picker hand module 1 may include a picker hand 10, a picker hand support (not shown), a pneumatic device (not shown), a fluid hose (not shown), and a controller 20.

The picker hand 10 can absorb or release a semiconductor device of an electronic component D that is set in a supine state relative to the ground by a vacuum adsorption method. Release means that the sucked semiconductor device is released from the sucked state. The supine state refers to a state in which a semiconductor device with a relatively wide surface is placed parallel to the ground. When the shape of the semiconductor device changes, the picker hand 10 can stably absorb or release the semiconductor device in response to the changed shape of the semiconductor device. In other words, the picker hand 10 can stably absorb or release the semiconductor device even when at least one of the width and length of the semiconductor device changes or the shape of the semiconductor device changes. In addition, the semiconductor device may include various semiconductor devices configured on a PCB board. The picker hand 10 may include a hand 100 and a picker unit 200 .

The hand tool 100 may inhale or discharge a fluid. For example, when the hand tool 100 inhales a fluid, the semiconductor device may be adsorbed to the picker unit 200 and be in a suction state. Also, when the hand tool 100 discharges a fluid, the semiconductor device may be in a suction-release state in which the semiconductor device is released from the suction state in which the semiconductor device is adsorbed to the picker unit 200.

2, the hand 100 can be moved together with the picker unit 200 when connected to the picker unit 200 so that the semiconductor device is sucked by the picker 220 to be described later at a predetermined position. For example, the hand 100 can be configured to be movable while being supported by a picker hand support. The hand 100 can be installed as a plurality of hand 100. The hand 100 can include a hand body 110, a locking member 120, and a calibration unit 130.

When the hand 100 is connected to the picker unit 200, the hand body 110 can support the picker unit 200. In addition, the hand body 110 can provide one or more hand flow paths 110a through which a fluid sucked from or discharged to the outside flows. Moreover, a fixing pin hole 110b into which a fixing pin 240 to be described later can be inserted can be formed in the hand body 110.

The hand tool flow path 110a may be a path extending in the up-down direction for the fluid to flow through. In this hand tool flow path 110a, the external fluid sucked by the absorber (not shown) may flow upward. In addition, in the hand tool flow path 110a, the fluid flowing in the hand tool flow path 110a may flow to the outside by a blower (not shown). Moreover, a hand tool body 110 may provide a hand tool flow path 110a. When the hand tool 100 and the picker unit 200 are separated from each other, the hand tool flow path 110a may be connected to the outside.

When the fixing pin 240 is inserted into the fixing pin hole 110b, the fixing pin 240 may be supported by the hand tool body 110. The fixing pin hole 110b may be formed in one side of the hand tool body 110 in the second direction. The second direction is defined as an extending direction of a second connecting rod flow path 211b to be described later, and one side of the second direction may mean the left side of the hand tool body 110 in FIG. 2 .

The locking member 120 may allow the picker unit 200 to be locked to the hand tool body 110. For example, when the locking member 120 is locked by the picker unit 200, the locking member 120 may support the picker unit 200. The locking member 120 may be connected to the other side of the hand tool body 110 in the second direction. For example, the locking member 120 may be assembled to be rotatable around a rotation axis provided on the other side of the hand tool body 110 in the second direction relative to the hand tool body 110. The locking member 120 may be assembled to form a component together with the hand tool body 110, but may also be assembled as a component separate from the hand tool body 110.

When the picker unit 200 is connected to the hand tool body 110, the calibration unit 130 can improve the matching of the connection. In addition, the calibration unit 130 can be provided in a plurality to be connected to the lower part of the hand tool body 110. The calibration unit 130 may include a first calibration pin 131 and a second calibration pin 132. The first calibration pin 131 and the second calibration pin 132 may be provided to be spaced apart from each other. For example, the first calibration pin 131 and the second calibration pin 132 spaced apart in the second direction may be configured. In addition, the first calibration pin 131 may be configured to be inserted into a first calibration groove 211d to be described later. Moreover, the second calibration pin 132 may be configured to be inserted into a second calibration groove 211e to be described later.

When in a ready state, the picker unit 200 can hold or release the semiconductor device through the hand tool 100. The ready state is defined as a state in which the picker unit 200 is arranged to face the semiconductor device arranged in a supine state and the picker unit 200 is connected to the hand tool 100. In addition, the picker unit 200 connected to the hand tool 100 can be replaced. For example, the picker unit 200 can be installed as a plurality of different picker units 200. Accordingly, when the picker unit having a plurality of pickers 220 spaced apart from each other by a first separation distance in the horizontal direction is in a ready state, the mounted picker unit 200 can be replaced with a replacement picker unit having a plurality of pickers 220 spaced apart by a second separation distance, the second separation distance being different from the first separation distance. The replacement process of the picker unit 200 will be described in detail below when describing the operation of the picker handpiece 10. The picker unit 200 may include a connecting rod 210, a picker 220, a locking pin 230, and a fixing pin 240.

When in a ready state, the connecting rod 210 may be disposed between the hand tool 100 and the picker 220. The connecting rod 210 may transfer the suction force of the hand tool 100 sucking in the fluid and the ejection force of the hand tool 100 discharging the fluid to the picker 220. The connecting rod 210 may include a connecting rod body 211 and a stopper 212.

The connecting rod body 211 can provide a connecting rod flow path that is connected to the hand tool flow path 110a when in a ready state. The connecting rod flow path can provide a first connecting rod flow path 211a, a second connecting rod flow path 211b, a third connecting rod flow path 211c, a first calibration groove 211d, and a second calibration groove 211e.

The first connecting rod flow path 211a may be a channel extending in the up-down direction. The first connecting rod flow path 211a may be connected to the hand tool flow path 110a. The width of the first connecting rod flow path 211a may be the same as that of the hand tool flow path 110a. The first connecting rod flow path 211a may be formed under the hand tool flow path 110a. The first connecting rod flow path 211a may be a flow path branched upward from the second connecting rod flow path 211b. Moreover, only one first connecting rod flow path 211a may be formed in the connecting rod flow path.

The second connecting rod flow path 211b may be a channel extending in the horizontal direction. For example, the second connecting rod flow path 211b may be a channel extending perpendicularly to the first connecting rod flow path 211a and extending in a direction parallel to the direction in which the fixing pin 240 is inserted into the fixing pin hole 110b. The second connecting rod flow path 211b may be connected to the first connecting rod flow path 211a. In addition, the second connecting rod flow path 211b may be connected to the third connecting rod flow path 211c. Moreover, only one second connecting rod flow path 211b may be provided in the connecting rod flow path.

The third connecting rod flow path 211c may be provided corresponding to the number of pickers 220. For example, when the number of pickers 220 is two, the third connecting rod flow path 211c corresponding to each of the two pickers 220 may be formed. In other words, one or more third connecting rod flow paths 211c may be provided to one picker hand 10. The upper side of the third connecting rod flow path 211c may be adjacent to the second connecting rod flow path 211b, and the lower side of the third connecting rod flow path 211c may be adjacent to the picker 220. The third connecting rod flow path 211c may be a flow path branched downward from the second connecting rod flow path 211b.

The first calibration pin 131 may be selectively inserted into the first calibration groove 211d. For example, when in a ready state, the first calibration pin 131 may be inserted into the first calibration groove 211d. The first calibration groove 211d may be formed on an upper surface of the connecting rod body 211. The first calibration groove 211d may be formed in the connecting rod body 211 to have a width corresponding to the width of the first calibration pin 131. For example, the first calibration pin 131 may be pressed into the first calibration groove 211d. The first correction groove 211d may be a hole.

The second calibration pin 132 may be selectively inserted into the second calibration groove 211e. For example, when in a ready state, the second calibration pin 132 may be inserted into the second calibration groove 211e. A second calibration groove 211e may be formed on the upper surface of the connecting rod body 211 at a predetermined distance from the first calibration groove 211d. A second calibration groove 211e having a width greater than that of the second calibration pin 132 may be formed. In other words, even when the second calibration pin 132 is inserted into the second calibration groove 211e, the second calibration pin 132 may not contact the portion of the connecting rod body 211 surrounding the second calibration groove 211e. The second correction groove 211e may be a long hole.

When in the ready state, the stopper 212 may prevent the fixing pin 240 from moving to one side in the second direction beyond a predetermined distance. When in the ready state, the stopper 212 may have a shape protruding toward the fixing pin 240. When the fixing pin 240 is hooked on the stopper 212 or the distance between the stopper 212 and the fixing pin 240 in the second direction is less than a preset distance, the fixing of the handpiece 100 and the picker unit 200 may be released.

With further reference to FIGS. 3 and 4 , the picker 220 can move the semiconductor device to a predetermined position by moving to a predetermined position while sucking the semiconductor device that is set in a supine position and releasing the suction. One or more pickers 220 can be provided. A plurality of pickers 220 can be arranged to be spaced apart from each other in the second direction. The separation distance between the plurality of pickers 220 can be changed to correspond to the configuration state of the semiconductor devices. One or more pickers 220 can suck one semiconductor device. For example, a plurality of pickers 220 can suck one semiconductor device. The picker 220 can be detachably connected to the lower portion of the connecting rod 210.

With further reference to FIGS. 5 and 6 , each of the plurality of pickers 220 may have an adjustable height. For example, when in a ready state, the height of the picker 220 from the ground to the bottom may be adjusted to increase or decrease. For example, when a plurality of semiconductor devices are arranged on a PCB board and the heights of the plurality of semiconductor devices from the PCB board (hereinafter referred to as 'the heights of the semiconductor devices') are different from each other, the heights of the plurality of pickers 220 may be adjusted to correspond to the heights of the plurality of semiconductor devices, respectively. For example, when two semiconductor devices are to be sucked, a height difference L between one semiconductor device and another semiconductor device may exist. The height of the picker 220 facing a semiconductor device with a relatively high height may be a value corresponding to the height difference L compared to the height of the picker 220 facing a semiconductor device with a relatively low height.

In addition, the mounted picker 220 can be replaced with another picker 220 having a different height. In other words, after the picker unit 200 is separated from the hand tool 100 and one or more pickers 220 are removed from the connecting rod 210, pickers 220 having different heights can be mounted to correspond to semiconductor devices having different heights. Thereafter, the picker unit 200 having the replaced picker 220 can be connected to the hand tool 100.

Referring again to FIG. 5 , this picker 220 may provide a picker flow path 220a. The picker flow path 220a may be a channel extending in the up-down direction. The picker flow path 220a may be connected to the third connecting rod flow path 211c. In addition, the width of the picker flow path 220a may be less than or equal to the width of one of the following: the hand tool flow path 110a, the first connecting rod flow path 211a, the second connecting rod flow path 211b, and the third connecting rod flow path 211c. Moreover, one picker flow path 220a may be provided for one picker 220. However, the present disclosure is not necessarily limited thereto, and a plurality of picker flow paths 220a may be provided in one picker 220. In addition, the picker flow path 220a, the hand flow path 110a, the first connecting rod flow path 211a, and the third connecting rod flow path 211c may have flow path centers on the same line. In other words, the picker flow path 220a, the hand flow path 110a, the first connecting rod flow path 211a, and the third connecting rod flow path 211c may form a single flow path extending in the vertical direction.

The locking member 120 may be hooked on the locking pin 230. The locking pin 230 is connected to the other side of the connecting rod body 211, and the connecting rod 210 may be supported by the locking member 120 through the locking pin 230. In addition, the locking pin 230 may provide a rotation axis so that the connecting rod 210 may rotate relative to the hand tool 100. The rotation axis may be a virtual straight line extending in a direction perpendicular to the extending direction of the first connecting rod flow path 211a and the extending direction of the second connecting rod flow path 211b. When in the ready state, the locking pin 230 may prevent the picker unit 200 from moving relative to the hand tool 100 in the second direction. In other words, the height of the central portion of the locking member 120 may be higher than the height of the lower end of the locking pin 230, and the height of the end of the locking member 120 may be lower than the locking pin 230. The height of a portion of the end of the locking member 120 may be higher than the lower end of the locking pin 230.

The fixing pin 240 may fix the picker unit 200 to the hand tool 100. For example, when the fixing pin 240 is inserted into the fixing pin hole 110b, the picker unit 200 may be fixedly supported by the hand tool 100. The fixing pin 240 may be bolted to the hand tool 100. For example, the hand tool 100 may have a thread for bolting the fixing pin 240 and the hand tool 100 to each other. Both ends of the fixing pin 240 may have different widths. For example, the width of one end of the fixing pin 240 in the second direction may be greater than the width of the other end of the fixing pin 240 in the second direction. In addition, the width of the other end of the fixing pin 240 in the second direction may be greater than the width of the central portion of the fixing pin 240. When the fixing pin 240 moves a predetermined distance toward one side in the second direction, the stopping portion 212 may hook the other end of the fixing pin 240 .

The picker hand tool support can support the picker hand tool 10. For example, the picker hand tool support assembly can be configured to be movable while supporting the picker hand tool 10. The pneumatic device can supply fluid to the hand tool flow path 110a formed in the hand tool 100, or can suck fluid from the hand tool flow path 110a. The flow path hose can be provided in the hand tool flow path 110a, the connecting rod flow path, and the picker flow path 220a to be connected to the pneumatic device. For example, the controller 20 can control the pneumatic device so that the pneumatic device sucks fluid and the picker 220 sucks the semiconductor device. In addition, the controller 20 can control the pneumatic device so that the picker 220 releases the semiconductor device by supplying fluid to the hand tool flow path 110a.

Meanwhile, in addition to the above configuration, according to the second embodiment of the present disclosure, a handpiece 100 can provide a plurality of handpiece flow paths 110a. When describing the second embodiment, the difference from the above embodiment is mainly described, and the same descriptions and element symbols as those in the above embodiment are referred to.

The connecting rod 210 may provide the same number of first connecting rod flow paths 211a as the number of the plurality of hand tool flow paths 110a provided to one hand tool 100. The plurality of first connecting rod flow paths 211a may be branched from the second connecting rod flow paths 211b.

The following describes the operation and effects of the picker hand 10 according to a specific embodiment of the present disclosure.

When necessary, the picker hand 10 can replace the picker unit 200 to be connected to the hand 100. For example, when a semiconductor device of a different shape is operated, the mounted picker unit 200 can be replaced with a picker unit 200 pre-prepared to correspond to the shape of the semiconductor device.

7 and 8, the process of separating the picker unit 200 from the hand tool 100 will be described.

When the picker unit 200 is in the ready state, the fixing pin 240 is separated from the hand tool 100 so that the picker unit 200 can be released from the fixed state. For example, when the other end of the fixing pin 240 in the second direction is separated from the end portion of the hand tool body 110 in the second direction (unfixed state), the hand tool 100 and the picker unit 200 can be released from the fixed state.

In addition, when in the unfixed state, the picker unit 200 may rotate by a preset angle around the rotation axis provided by the locking pin 230. When the picker unit 200 rotates by the preset angle, the picker unit 200 may be separated from the hand tool 100 after moving upward by a preset distance. For example, after the picker unit 200 rotates, the picker unit 200 cannot be separated from the hand tool 100 when being hooked by the locking member 120 unless the picker unit 200 moves upward by the preset distance.

9 and 10 , the process of connecting the modified picker unit 200 to the hand tool 100 will be described.

The locking member 120 may be hooked by the locking pin 230 of the picker unit 200. In addition, in a state where the picker unit 200 is hooked by the locking member 120, the picker unit 200 may rotate around a rotation axis provided by the locking pin 230 in a direction closer to the hand tool 100. Furthermore, after the second calibration pin 132 is inserted into the second calibration groove 211e of the picker unit 200, the first calibration pin 131 may be inserted into the first calibration groove 211d. When the first calibration pin 131 is completely inserted into the first calibration groove 211d, the picker unit 200 and the hand tool 100 may be fixed by the fixing pin 240.

From the above discussion, it will be understood that the present invention can be embodied in a variety of forms, including but not limited to the following: Example 1. A picker hand tool, comprising: a hand tool having a hand tool flow path for a fluid to flow through; and a picker unit assembled to be detachably connected to the hand tool, wherein the picker unit includes one or more pickers and a connecting rod, the one or more pickers each providing a picker flow path for the fluid to flow through, and the connecting rod provides a connecting rod flow path connected to the hand tool flow path and the picker flow path when the picker unit is connected to the hand tool, and Wherein, depending on whether the fluid flows through the handpiece flow path, the picker flow path, and the connecting rod flow path, the picker unit absorbs or releases a semi-conductor device of an electronic component that is set in a supine state. Example 2. The picker handpiece of Example 1, wherein the connecting rod flow path includes: a first connecting rod flow path formed along a first direction; a second connecting rod flow path formed along a second direction different from the first direction; and a third connecting rod flow path connected to the second connecting rod flow path and at least one of the picker flow paths. Example 3. A picker hand tool as in Example 2, wherein the picker is configured to, when the picker is configured to face the semiconductor device configured to be in the supine position and the picker unit is connected to the hand tool in a ready state, the semiconductor device can be sucked when the picker hand tool inhales the fluid and the semiconductor device can be released when the picker hand tool discharges the fluid, and wherein the first direction is a vertical direction, and the second direction is a direction perpendicular to the first direction. Example 4. A picker hand tool as in Example 3, wherein the picker includes a plurality of pickers, and the plurality of pickers suck or release the electronic component. Example 5. A picker hand tool as in Example 4, wherein the plurality of pickers are configured to independently adjust the heights of the plurality of pickers in response to the heights of the plurality of semiconductor devices of the electronic component arranged in the supine position in the first direction. Example 6. A picker hand tool as in Example 4, wherein the hand tool is configured to be separable from the picker unit having the plurality of pickers separated from each other by a first separation distance and to be connected to another picker unit having the plurality of pickers separated from each other by a second separation distance, the second separation distance being different from the first separation distance, so as to absorb the plurality of semiconductor devices having different configurations. Embodiment 7. A picker hand tool as in Embodiment 3, wherein the picker includes a plurality of pickers, and each of the plurality of pickers includes the picker flow path, and wherein a number of the third connecting rod flow paths corresponding to the number of the picker flow paths is provided so as to be separated from the second connecting rod flow path to communicate with the picker flow paths. Embodiment 8. A picker hand tool, comprising: a hand tool, which is configured to inhale or discharge a fluid and has a plurality of hand tool flow paths for the fluid to flow through; and a picker unit configured to be detachably connected to the hand tool, wherein the picker unit includes: one or more pickers, which are configured to absorb or release a semi-conductor device of an electronic component arranged in a supine state, each of the pickers providing a picker flow path for the fluid to flow through; and a connecting rod, which provides a connecting rod flow path connected to the plurality of hand tool flow paths and the picker flow path when the picker unit is connected to the hand tool, and Wherein, depending on whether the fluid flows through the plurality of hand tool flow paths, the picker flow path, and the connecting rod flow path, the picker unit absorbs or releases the semiconductor device of the electronic component that is set in the supine position.

The embodiments of the present disclosure are described as specific specific embodiments above, but these are only embodiments, and the present disclosure is not limited thereto, and should be considered to have the broadest scope according to the technical spirit disclosed in this patent specification. A person skilled in the art can combine/replace the disclosed specific embodiments to implement undisclosed shape patterns, but this does not deviate from the scope of the present disclosure. In addition, a person skilled in the art can easily change or modify the disclosed specific embodiments based on this patent specification, and it is obvious that such changes or modifications also belong to the scope of the present disclosure.

1: Picker hand module 10: Picker hand 20: Controller 100: Hand 110: Hand main body 110a: Hand flow path 110b: Fixed pin hole 120: Locking part 130: Calibration unit 131: First calibration pin 132: Second calibration pin 200: Picker unit 210: Connecting rod 211: Connecting rod main body 211a: First connecting rod flow path 211b: Second connecting rod flow path 211c: Third connecting rod flow path 221d: First calibration groove 221e: Second calibration groove 212: Stopper 220: Picker 220a: Picker flow path 230: Locking pin 240: Fixing pin D: Electronic component L: Height difference between two semiconductor devices

FIG. 1 is a perspective view of a picker hand module according to a first specific embodiment of the present disclosure. FIG. 2 is a cross-sectional view drawn along the straight line A-A' of FIG. 1. FIG. 3 is a cross-sectional view showing a picker arranged at a different position from the picker of FIG. 2. FIG. 4 is a cross-sectional view showing a case where there is only one picker. FIG. 5 is a cross-sectional view showing that the picker flow path is placed on the same straight line as the hand flow path and the connecting rod flow path. FIG. 6 is a cross-sectional view showing that the lower ends of the plurality of pickers that hold the electronic components have different heights. FIG. 7 shows a state where the fixation of the hand and the picker unit is released by the fixing member of FIG. 1. FIG8 illustrates a state in which the picker unit is rotated by a predetermined angle around the rotation axis provided by the lock pin of FIG7. FIG9 illustrates a state in which the lock pin of a picker unit different from the picker unit of FIG8 is locked by a locking member. FIG10 illustrates a state in which the picker unit of FIG9 is fixed to a hand tool.

1: Picker tool module

10: Picker tool

20: Controller

100:Hand tools

110: Main body of the hand tool

120: Locking parts

200: Picker unit

210: Connecting rod

220: Picker

240:Fixed pin

D: Electronic components

Claims (8)

A picker hand tool, comprising: a hand tool having a hand tool flow path for a fluid to flow through; and a picker unit, wherein the picker unit includes one or more pickers and a connecting rod, the one or more pickers each providing a picker flow path for the fluid to flow through, and the connecting rod providing a connecting rod flow path connected to the hand tool flow path and the picker flow path when the picker unit is connected to the hand tool, and wherein, depending on whether the fluid flows through the hand tool flow path, the picker flow path, and the connecting rod flow path, the picker unit grasps or releases a semi-conductor device of an electronic component that is arranged in a supine state. A picker hand tool as claimed in claim 1, wherein the connecting rod flow path includes: a first connecting rod flow path formed along a first direction; a second connecting rod flow path formed along a second direction different from the first direction; and a third connecting rod flow path connected to the second connecting rod flow path and at least one of the picker flow paths. A picker hand tool as claimed in claim 2, wherein the picker assembly is configured to, when the picker is in a ready state with the picker arranged to face the semiconductor device arranged in the supine position and the picker unit connected to the hand tool, grasp the semiconductor device when the picker hand tool inhales the fluid and release the semiconductor device when the picker hand tool discharges the fluid, and wherein the first direction is a vertical direction, and the second direction is a direction perpendicular to the first direction. A picker hand tool as claimed in claim 3, wherein the picker comprises a plurality of pickers, and the plurality of pickers grasp or release the electronic component. A picker hand tool as claimed in claim 4, wherein the plurality of pickers are configured to independently adjust the heights of the plurality of pickers in response to the heights of the plurality of semiconductor devices of the electronic assembly arranged in the supine position in the first direction. A picker hand tool as claimed in claim 4, wherein the hand tool assembly is separated from the picker unit having the plurality of pickers separated from each other by a first separation distance, and connected to another picker unit having the plurality of pickers separated from each other by a second separation distance, wherein the second separation distance is different from the first separation distance, so as to grasp a plurality of semiconductor devices having different configurations. A picker hand tool as claimed in claim 3, wherein the picker includes a plurality of pickers, and each of the plurality of pickers includes the picker flow path, and wherein the third connecting rod flow path is provided in a number corresponding to the number of the picker flow paths so as to be separated from the second connecting rod flow path to communicate with the picker flow paths. A picker hand tool, comprising: a hand tool having a hand tool flow path for a fluid to flow through; and a picker unit, wherein the picker unit includes one or more pickers and a connecting rod, the one or more pickers each provide a picker flow path for the fluid to flow through, and the connecting rod provides a connecting rod flow path that communicates with the hand tool flow path and the picker flow path when the picker unit is connected to the hand tool, and wherein, depending on whether the fluid flows through the hand tool flow path, the picker flow path, and the connecting rod flow path, the picker unit grasps or releases a semi-conductor device of an electronic component that is arranged in a supine state, The one or more pickers are configured to independently adjust the height of the one or more pickers in response to the height of the multiple semiconductor devices of the electronic component arranged in the supine position in a vertical direction.

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