TW202318556A - Picker hand - Google Patents

Abstract

The present invention relates to a picker hand. Specifically, according to an embodiment of the present invention, there may be provided a picker hand including: a hand; a picker unit detachably connected to the hand and configured to grip an electronic component disposed in a supine state; and a support configured to support the electronic component, wherein the picker unit includes a picker pad that is in a contact state in which one end portion of the picker pad is in contact with the electronic component, and in a grip state in which the picker pad grips the electronic component by moving toward the electronic component by a predetermined length so that a contact area between the picker pad and the electronic component is larger than that in the contact state, and wherein the support is spaced apart from the electronic component by the predetermined length when the picker pad is in the contact state, and comes into contact with the electronic component when the picker pad is in the grip state.

Description

picker hand

The present invention relates to a picker hand.

In order to test semiconductor components, a tester for testing electrically connected electronic components and a test handler which is a device for electrically connecting the electronic components and the tester are required.

Meanwhile, supplying electronic components to be tested in the test handler is performed in a state where the electronic components are loaded on a user tray. Typically, electronic components to be loaded on a user tray are conveyed by a hand. The tool may include a picker for holding the electronic components. The picker can hold a semiconductor element included in the electronic component by vacuum suctioning a surface of the semiconductor element. In addition, multiple pickers can be included in the tool to hold multiple semiconductor components. The plurality of pick-ups are coupled in one handpiece and operate simultaneously.

In the prior art, a few semiconductor elements with a front or rear flat wide surface are arranged on a PCB of an electronic component, and there is substantially no height or position difference between these semiconductor elements. In addition, no stickers are attached to the semiconductor device, or photosensitive sensors such as an optical sensor or a fingerprint recognition sensor are not included.

However, in recent years, since several configurations have been added to an electronic component, an electronic component having semiconductor elements of different heights or arrangement states arranged on a PCB is produced. When clamping the electronic component configured in a complex configuration by a picker of the prior art, there is a problem of not fully clamping the semiconductor components.

For example, when a semiconductor component is held by a picker pad included in the picker, there is a problem that the picker pad slides on one of the upper surfaces of the semiconductor component. In addition, even when a semiconductor element disposed in the central portion of the PCB is held by a pick-up pad, the electronic component is held such that when a center of gravity of the electronic component is on one side of the electronic component A problem in a state where the electronic component is tilted relative to a horizontal direction. In addition, when one of the plurality of semiconductor elements having a relatively large height is clamped first, there is a problem that the electronic component is tilted toward the side where the semiconductor component having a relatively small height is disposed and the electronic component cannot be accurately clamped.

Embodiments of the present invention are invented in view of the above-mentioned background, and an object of the present invention is to provide a picker hand that prevents a picker pad from sliding on a semiconductor device.

Another object of the present invention is to provide a picker hand that can stably hold an electronic component irrespective of a center of gravity of the electronic component.

Yet another object of the present invention is to provide a picker tool that prevents an electronic component from tilting in a direction deviated from a horizontal direction when holding a semiconductor device.

According to one aspect of the present invention, there is provided a picker hand tool, which includes: a hand tool; a picker unit, which is detachably connected to the hand tool and assembled to clamp an electronic component arranged in a flat state and a support member configured to support the electronic component, wherein the pickup unit includes a pickup pad, the pickup pad can be maintained in a contact state and a clamping state, and in the contact state, the One end of the pick-up pad contacts the electronic component, and in the clamped state, the pick-up pad clamps the electronic component by moving toward the electronic component by a predetermined length, so that the gap between the pick-up pad and the electronic component is A contact area is larger than the contact area when the pick-up pad is in the contact state, and wherein the support member is separated from the electronic component by the predetermined length when the pick-up pad is in the contact state and the pick-up pad is in the contact state Access to the electronic component while clamped.

In addition, the pick-up unit may further include: a pick-up body configured to support the pick-up pad; and a connecting body disposed between the hand tool and the pick-up body and between the pick-up body An upper part connection, the support may include a dummy support that is spaced apart from the pickup body in a horizontal direction such that a center of the dummy support is separated from a center of the pickup body , and the dummy support may include one or more dummy supports.

In addition, the picker hand may further include a joint extending in an up-down direction and having a lower part detachably connected with the picker body and an upper part detachably connected with the connecting body , wherein the connection body can be indirectly connected to the upper part of the pickup body through the joint.

In addition, the picker body may include one or more picker bodies, and the picker pad may include one or more picker pads, each of the one or more picker bodies includes a first picker body and a first picker body. Two pickup bodies, the first pickup body can be directly connected with the connection body and the pickup pad, and the second pickup body can be indirectly connected with the connection body through the joint, and can be connected with the first pickup body A lower end of the pickup pad connected to the second pickup body may be disposed above a lower end of the pickup pad connected to the second pickup body.

In addition, the pick-up unit may further include: a pick-up body configured to support the pick-up pad; and a connecting body disposed between the hand tool and the pick-up body and between the pick-up body An upper portion is attached, and the support may include a housing support configured to surround at least a portion of the pickup body.

In addition, the picker hand may further include: a joint extending in an up-down direction and having a lower portion detachably connected to the picker pad, and the picker unit may further include: a picker body, It is assembled to support the picker pad; and a connecting body is disposed between the hand tool and the picker body and is connected with an upper portion of the joint and an upper portion of the picker body, the The upper part of the joint is detachably connected with the connection body, and the supporting member may include a cover supporting member arranged to surround at least a part of the joint.

In addition, a picker hand tool is provided, which includes: a hand tool; a picker unit, which is detachably connected to the hand tool and configured to clamp an electronic component arranged in a lying state; and a connector, which It is detachably connected with the picker unit, wherein the picker unit includes: a picker body, which is assembled to support the picker pad; a connecting body, which is arranged between the handle and the picker body and connected with an upper part of the pickup body; and a pickup pad, which can be maintained in a contact state and a clamping state, and in the contact state, one end of the pickup pad contacts the electronic component, and In the clamping state, the picker pad clamps the electronic component by moving toward the electronic component by a predetermined length, so that a contact area between the picker pad and the electronic component is larger than the contact area of the picker pad. The contact area in the state is large, and wherein the joint extends in a vertical direction and has a lower part detachably connected with at least one of the pickup body and the pickup pad and is detachably connected with the connecting body one of the upper part.

The picker tool according to an embodiment of the present invention has an effect of preventing the picker pad from sliding on the semiconductor device.

In addition, the picker hand has an effect of stably holding the electronic component irrespective of a center of gravity of the electronic component.

In addition, the picker hand has an effect of preventing the electronic component from tilting in a direction deviating from a horizontal direction when the electronic component is held.

Hereinafter, specific embodiments for implementing one spirit of the present invention will be described in detail with reference to the drawings.

When describing the present disclosure, detailed descriptions of conventional configurations or functions may be omitted to clarify the present disclosure.

When an element is referred to as being "connected to," "supported by," "held by," "released" by, or "attached" to, another element, it should be understood that Yes, the element may be directly connected to another element, supported by another element, caught by another element, released by another element, or attracted by another element, but other elements may exist in between.

The terms used in the present disclosure are for describing particular embodiments only, and are not intended to limit the present disclosure. A singular expression includes a plural expression unless the context clearly dictates otherwise.

Terms including ordinal numbers such as first and second may be used to describe various elements, but the corresponding elements are not limited to these terms. These terms are only used to distinguish one element from another.

In this specification, it should be understood that terms such as "comprising" are intended to indicate the presence of certain features, regions, integers, steps, actions, elements, combinations and/or groups thereof disclosed in the description, and are not intended to The possibility that one or more other certain features, regions, integers, steps, actions, elements, combinations and/or groups thereof may exist or may be added is excluded.

Furthermore, in this disclosure, it should be noted that representations such as an upper portion or an upper surface are described according to the representation of the figures, but may be modified if the orientation or corresponding object changes.

Hereinafter, a detailed configuration of a test processor 1 according to a first embodiment of the present invention will be described with reference to the drawings.

Hereinafter, referring to FIG. 1 , the test processor 1 according to the first embodiment of the present invention can test the electronic components D manufactured through a process, classify the electronic components D according to the test results, and load the electronic components D. On a custom tray. In addition, the test processor 1 can be detachably coupled with a tester (not shown). The test handler 1 may include a handler body 10 , a picker tool module 20 and a handler transporter 30 for moving the handler body 10 .

The processor body 10 can be a frame supporting the picker hand module 20 . The processor body 10 can support a plurality of picker hand modules 20 . In addition, the processor body 10 can be moved by the processor transporter 30 .

Please refer to FIG. 2 again, the picker hand module 20 can move various electronic components D to a desired position. The picker hand module 20 may include a picker hand support 21 , a picker hand 22 , a controller 23 , a pneumatic device 24 and a tube (not shown) for a path.

The picker hand support 21 can be a frame connected with the picker hand 22 and can support the picker hand 22 . In addition, the picker hand support 21 can be configured to be connected with the processor body 10 and move together with the processor body 10 .

The picker tool 22 can use a vacuum suction method to hold or release a semiconductor element of an electronic component D lying on the ground. The release indicates that the clamped semiconductor component deviates from a clamped state. The lying arrangement of the electronic component D may mean that a relatively wide surface of the electronic component D is placed parallel to the ground.

When the shape of the semiconductor device changes, the picker tool 22 can stably hold or release the semiconductor device according to the deformation of the semiconductor device. In other words, the picker hand 22 can stably hold or release the semiconductor element even when at least one of a width and a length of the semiconductor element changes or the shape of the semiconductor element changes. In addition, the semiconductor element may have a shape in which various semiconductor elements are arranged on a PCB. A plurality of such picker hands 22 may be provided. For example, the plurality of picker hands 22 may be connected to the picker hand support 21 such that the plurality of picker hands 22 are arranged in one direction. The picker hand 22 may include a hand tool 100 , a picker unit 200 , a joint 300 and a support 400 .

The hand tool 100 can suck or discharge a fluid through the pneumatic device 24 . For example, when the hand tool 100 sucks the fluid, the semiconductor device can be adsorbed on the picker unit 200 and become a holding state. In addition, when the hand tool 100 discharges the fluid, the semiconductor element may become a clamp release state deviated from the clamp state, that is, a state in which the semiconductor element is adsorbed on the picker unit 200 .

Please refer to FIG. 3 again. In a state where the hand tool 100 is connected to the picker unit 200, the hand tool 100 can move together with the picker unit 200 so that the semiconductor element can be picked up by the picker pad 260 described below. clamped in a predetermined position. The hand tool 100 may include a hand tool body 110 , a latch portion 120 and a calibration portion 130 .

When the hand tool 100 and the picker unit 200 are connected to each other, the hand tool body 110 can support the picker unit 200 . In addition, the handpiece body 110 may be provided with one or more handpiece flow paths 110a through which a fluid is sucked or discharged relative to the outside. In addition, a fixing pin groove 110b into which one of the fixing pins 240 described below may be inserted may be formed in the hand tool body 110 .

The hand flow path 110a may be a channel extending in a vertical direction through which the fluid flows. In the handpiece flow path 110a, an external fluid sucked by an adsorber (not shown) may flow upward. In addition, in the hand flow path 110a, the fluid flowing in the hand flow path 110a by a blower (not shown) can flow outward. In addition, one handpiece body 110 may be provided with one handpiece flow path 110a. When the hand tool 100 and the picker unit 200 are separated from each other, the hand flow path 110a can communicate with the outside.

When the fixing pin 240 is inserted into the fixing pin slot 110 b, the fixing pin 240 can be supported by the hand tool body 110 . The fixing pin slot 110b may be formed on the other side of the hand tool body 110 in a front-rear direction. The front-rear direction is defined as a direction in which a second connecting flow path 210b extends as described below, and one side in the front-rear direction may represent, for example, a front side, and may represent the left side of the hand tool body 110 in FIG. 2 . In addition, the other side in the front-rear direction may represent, for example, a back side, and may represent the right side of the hand tool body 110 in FIG. 2 .

The latch portion 120 allows the picker unit 200 to be locked on the handle body 110 . For example, the latch portion 120 can support the pickup unit 200 when the pickup unit 200 is engaged. The latch portion 120 may be connected to one side of the hand tool body 110 in the front-rear direction. One side in the front-rear direction may represent, for example, the front side and may represent the left side of the hand tool body 110 in FIG. 2 . For example, the latch portion 120 may be configured to be rotatable relative to the handle body 110 around a predetermined rotation axis, and the rotation axis is disposed on one side of the handle body 110 in the front-rear direction. The latch portion 120 can be combined with the handle body 110 as a single component or can also be combined as a separate component.

When the pick-up unit 200 is connected with the hand tool body 110, the calibration part 130 can improve the compatibility of the connection. In addition, a plurality of calibration parts 130 can be disposed and connected to a lower part of the hand tool body 110 . The calibration part 130 may include a first calibration pin 131 and a second calibration pin 132 . The first calibration pin 131 and the second calibration pin 132 can be disposed apart from each other. For example, the first alignment pin 131 and the second alignment pin 132 may be configured to be separated in the front-rear direction. In addition, the first alignment pin 131 can be configured to be inserted into one of the first alignment slots 210e described below. In addition, the second alignment pin 132 can be configured to be inserted into one of the second alignment slots 210d described below. The picker unit 200 can hold or release the semiconductor device through the hand tool 100 in a ready state. The ready state is defined as a state in which the picker unit 200 is arranged to face the lying semiconductor device and the picker unit 200 is connected to the hand tool 100 . In addition, the picker unit 200 connected to the hand tool 100 can be replaced. For example, the pickup unit 200 may be provided as a plurality of different pickup units 200 .

The picker unit 200 may include a connecting body 210 , a locking jaw 220 , a latch pin 230 , the fixing pin 240 , a picker body 250 and the picker pad 260 .

The connecting body 210 can be disposed between the hand tool 100 and the picker body 250 . The connecting body 210 can be detachably connected with the hand tool 100 . The connecting body 210 can be connected with the picker body 250 . For example, an upper portion of the picker body 250 can be connected with a lower portion of the connecting body 210 .

The coupling body 210 can transmit the fluid suction force of the hand 100 for sucking fluid and the ejection force of the hand 100 for discharging fluid to the pickup pad 260 . The connection body 210 can be provided with a connection flow path communicated with the hand flow path 110 a in the ready state. The connection flow path can be provided with a first connection flow path 210a, a second connection flow path 210b, a third connection flow path 210c, the second calibration groove 210d and the first calibration groove 210e.

The first connecting flow path 210a can be a channel extending in a vertical direction. The first connection flow path 210a can communicate with the hand flow path 110a. The width of the first connection flow path 210a may be the same as the width of the hand flow path 110a. The first connection flow path 210a may be formed under the hand flow path 110a. The first connecting flow path 210a may be a flow path branched upward from the second connecting flow path 210b.

The second connecting flow path 210b can be a channel extending in a horizontal direction. For example, the second connecting flow path 210b may be a channel extending perpendicularly to the first connecting flow path 210a and extending in a direction parallel to a direction in which the fixing pin 240 is inserted into the fixing pin groove 110b. The second connection flow path 210b can communicate with the first connection flow path 210a. In addition, the second connecting flow path 210b can communicate with the third connecting flow path 210c.

The third connection flow path 210c can be set to correspond to the number of the pickup pads 260 . For example, when the number of the pickup pads 260 is two, the third connecting flow path 210c may be formed to correspond to each of the two pickup bodies 250 . In other words, one or more third connecting flow paths 210c can be disposed on one picker tool 22 . An upper side of the third connection flow path 210c may adjoin the second connection flow path 210b , and a lower side of the third connection flow path 210c may adjoin the pickup body 250 . The third connection flow path 210c may be a flow path branched downward from the second connection flow path 210b.

The second alignment pin 132 is selectively inserted into the second alignment slot 210d. For example, in the ready state, the second alignment pin 132 can be inserted into the second alignment slot 210d. The second alignment groove 210d can be formed on the upper side of the connecting body 210 . The second alignment groove 210d can be formed in the connecting body 210 and corresponds to the width of the second alignment pin 132 . For example, the second alignment pin 132 may be press fit in the second alignment slot 210d.

The first alignment pin 131 is selectively inserted into the first alignment slot 210e. For example, in the ready state, the first alignment pin 131 can be inserted into the first alignment slot 210e. The first alignment groove 210e may be formed to be separated from the second alignment groove 210d by a predetermined distance on the upper side of the coupling body 210 . The first alignment groove 210e may be formed to have a larger width than the first alignment pin 131 . In other words, even when the first alignment pin 131 is inserted into the first alignment groove 210e, the first alignment pin 131 may not contact a portion of the coupling body 210 surrounding the first alignment groove 210e.

The first alignment groove 210e and the second alignment groove 210d can be a slot or a hole. Preferably, the first calibration groove 210e can be a slot hole and the second calibration groove 210d can be a hole.

In a ready state, the locking jaw 220 prevents the fixing pin 240 from moving more than a predetermined distance toward one side in the front-back direction. In the ready state, the locking jaw 220 may have a shape protruding towards the fixing pin 240 . When the fixing pin 240 is caught on the locking jaw 220 or a distance between the locking jaw 220 and the fixing pin 240 in the front-rear direction is equal to or less than a predetermined distance, the hand can be released. The tool 100 and the picker unit 200 are fixed.

The latch portion 120 can be locked on the latch pin 230 . The latch pin 230 is connected to the other side of the connecting body 210 , and the connecting body 210 can be supported by the latch part 120 through the latch pin 230 . In addition, the latch pin 230 can provide a predetermined rotation axis so that the connecting body 210 can rotate relative to the hand tool 100 . The rotation axis may be a virtual straight line extending in a direction perpendicular to a direction in which the first connecting flow path 210a extends and a direction in which the second connecting flow path 210b extends. In the ready state, the latch pin 230 prevents the picker unit 200 from moving relative to the hand tool 100 in the front-back direction. In other words, the height of a central portion of the latch portion 120 may be higher than that of a lower end of the latch pin 230 , and the height of a lower end of the latch portion 120 may be higher than that of the latch pin 230 . A height of a portion of one end of the latch portion 120 may be higher than a height of a lower end of the latch pin 230 .

The fixing pin 240 can fix the picker unit 200 on the hand tool 100 . For example, when the fixing pin 240 is inserted into the fixing pin groove 110 b, the picker unit 200 may be fixedly supported by the hand 100 . The fixing pin 240 can be bolted to the hand tool 100 . For example, a thread for fastening the securing pin 240 to the hand tool 100 may be formed in the hand tool 100 . The widths of the two ends of the fixing pins 240 may be different from each other. For example, a width at one end portion of the fixing pin 240 in the front-rear direction may be greater than a width at the other end portion in the front-rear direction. In addition, the width of the other end portion of the fixing pin 240 in the front-rear direction may be greater than the width of a center portion of the fixing pin 240 . When the fixing pin 240 moves a predetermined distance toward one side in the front-rear direction, the width of the other end portion of the fixing pin 240 in the front-rear direction allows the fixing pin 240 to be caught in the locking jaw. 220 on.

The picker body 250 may be connected with the picker pad 260 such that the picker pad 260 is vertically separated from the coupling body 210 . For example, a lower portion of the picker body 250 may be connected to the picker pad 260 so that the picker pad 260 is disposed below the connecting body 210 . The picker body 250 can extend in a vertical direction.

In addition, plural pickup bodies 250 may be provided. The plurality of pickup bodies 250 may be arranged to be separated from each other in a horizontal direction. Some of the plurality of picker bodies 250 may have an upper portion directly connected to the link body 210 and a lower portion directly connected to the picker pad 260 . Some of the plurality of pickup bodies 250 may be referred to as a first pickup body. At the same time, the upper part of other pickup bodies in the plurality of pickup bodies 250 can be indirectly connected to the connecting body 210 through the joint 300, and the lower part can be indirectly connected to the pickup pad 260 through the joint 300. connection, or both the upper parts and the lower parts are respectively connected to the link body 210 and the picker pad 260 through the joints 300. In other words, at least one of the upper and lower parts of other pickup bodies of the plurality of pickup bodies 250 can be connected with the joint 300 . The other pickup bodies of the plurality of pickup bodies 250 connected to the connector 300 may be referred to as second pickup bodies.

The pickup body 250 can be provided with a pickup flow path 250a. The pickup flow path 250a can be a channel extending in a vertical direction. The pickup flow path 250a can communicate with the third connecting flow path 210c. In addition, the picker flow path 250a may have a width less than or equal to at least one of the tool flow path 110a, the first connection flow path 210a, the second connection flow path 210b, and the third connection flow path 210c. width. In addition, one pickup flow path 250 a may be provided in one pickup body 250 . However, the spirit of the present invention is not necessarily limited thereto, and a plurality of pickup flow paths 250 a may be provided in one pickup body 250 . Moreover, the centers of the flow paths of the picker flow path 250a, the hand flow path 110a, the first connection flow path 210a and the third connection flow path 210c may be located on the same line. In other words, the picker flow path 250a, the hand flow path 110a, the first connection flow path 210a and the third connection flow path 210c can be formed as a single flow path extending toward the vertical direction.

Please refer to FIGS. 4 and 5 again, the picker pad 260 becomes a contact state where at least a part of the picker pad 260 contacts the electronic component D, and the picker pad 260 clamps the electronic component D in a clamping state. , or the picker pad 260 releases one of the electronic components D from the clamping release state. The contact state indicates a state in which a lower end of the picker pad 260 contacts the semiconductor device of the electronic component D when the picker pad 260 is disposed to face the semiconductor device. The clamping state means that when the picker pad 260 is in the contact state, the picker pad 260 moves toward the semiconductor device by a predetermined length h1 so that a contact area between the picker pad 260 and the electronic component D increases. The clamp release state indicates a state deviated from the clamp state.

A plurality of pickup pads 260 can be provided on one electronic component D. As shown in FIG. In addition, one of the plurality of pickup pads 260 may be connected to a lower portion of the first pickup body, and the other pickup pad may be connected to a lower portion of the second pickup body.

A pad flow path 260a may be formed in the pickup pad 260 . The pad flow path 260a may communicate with the pickup flow path 250a. The pad flow path 260a may be formed in a direction parallel to a direction in which the pickup flow path 250a is formed. In addition, when the pickup pad 260 is in a contact state, a lower end of the pad flow path 260a may be vertically separated from the semiconductor device by a predetermined distance. For example, when the pick-up pad 260 is in the clamping state, a separation distance between the lower end of the pad flow path 260a and the semiconductor element can be compared with the lower end of the pad flow path 260a and the lower end of the pad flow path 260a when the pick-up pad 260 is in the contact state. A separation distance between the semiconductor elements is small. In addition, when the pickup pad 260 is in the sandwiched state, the pad flow path 260a and the semiconductor element can be adjacent to each other without being separated from each other.

The picker pad 260 may have elasticity. For example, the picker pad 260 can be configured such that when the picker pad 260 changes from the contact state to the clamping state, the contact area between the picker pad 260 and the semiconductor device gradually increases. The picker pad 260 may have a shape whose circumference decreases from bottom to top. In addition, a plurality of picker pads 260 may be provided. The plurality of pickup pads 260 may be connected to the lower part of each pickup body 250 arranged in the horizontal direction.

The joint 300 can adjust a separation distance between the picker pad 260 and the connecting body 210 . The joint 300 can extend toward the vertical direction. For example, the separation distance between the pickup pad 260 and the connecting body 210 can be determined by an extension length of the connector 300 . The joint 300 can increase the separation distance between the pickup pad 260 and the connection body 210 according to the relative reduction in the height of the semiconductor element of the electronic component D. Referring to FIG.

Meanwhile, in the drawing according to the present embodiment, the joint 300 is shown to have a vertical length smaller than that of the pickup body 250, but the spirit of the present invention is not necessarily limited thereto. Therefore, the joint 300 can have the same vertical length as the pickup body 250 or a vertical length larger than the pickup body 250 . In addition, the joint 300 may be formed to have the same length as the first pickup body and may be formed to have a smaller length than the second pickup body.

An upper portion of the joint 300 can be connected with the connecting body 210 and a lower portion can be connected with the picker body 250 . In other words, the joint 300 can be disposed between the connecting body 210 and the picker body 250 . A joint flow path 300a may be formed in the joint 300 . The joint flow path 300a can communicate with the pickup flow path 250a and the pad flow path 260a. In addition, the joint flow path 300a can communicate with the first connection flow path 210a, the second connection flow path 210b and the third connection flow path 210c.

When the picker pad 260 is in the clamping state, the supporting member 400 can support the electronic component D. As shown in FIG. For example, the supporting member 400 can prevent the pickup pad 260 from deviating from the clamping state due to the electronic component D tilting in a direction that deviates from the horizontal direction after the picker pad 260 becomes the clamping state. In other words, the supporting member 400 can maintain a state where the semiconductor element of the electronic component D contacts the picker pad 260 when facing the picker pad 260 . The support 400 may include a dummy support 401 .

The dummy support 401 can be separated from the picker body 250 and the picker pad 260 in a horizontal direction and connected with the connecting body 210 . A lower surface of the dummy supporting member 401 may be in the horizontal direction. For example, when the pickup pad 260 is in the contact state, the lower surface of the dummy support 401 may be parallel to an upper surface of the semiconductor device.

When the pickup pad 260 becomes the contact state, the dummy supporter 401 may be disposed to face the semiconductor device. For example, when the pickup pad 260 becomes the contact state, the dummy supporter 401 may be disposed to face the semiconductor element and be vertically separated from the semiconductor element by the predetermined length h1. The dummy support 401 can be arranged such that a central axis of the dummy support 401 is parallel to and separated from a central axis of at least one of the pickup body 250 and the pickup pad 260 . Even when the fluid suction force of the hand tool 100 is not increased, the dummy support member 401 allows the electronic component D to be stably held by the picker hand tool 22 in a lying state.

When the picker pad 260 becomes the clamping state, the dummy supporter 401 can contact the semiconductor device and support the electronic component D. Referring to FIG. For example, the dummy support 401 may contact the semiconductor device when the lower end of the pad flow path 260a adjoins the semiconductor device. When the picker pad 260 becomes the clamping state, the dummy support 401 can prevent the picker pad 260 from being deformed. In addition, the dummy support member 401 may be disposed to be separated from the picker pad 260 in a horizontal direction when the picker pad 260 becomes the clamped state.

In addition, when the picker pad 260 becomes the clamping state, the dummy support member 401 can prevent the picker pad 260 from pressing the electronic component D beyond a predetermined pressure. In other words, when the picker pad 260 contacts the semiconductor device, the dummy support member 401 can prevent the picker pad 260 from sliding toward the horizontal direction.

Please refer to FIG. 6 again, the dummy supporting member 401 can extend in a vertical direction. A plurality of dummy supports 401 may be provided. The plurality of dummy supports 401 and the plurality of pickup bodies 250 can be arranged in the horizontal direction.

The controller 23 can control the pneumatic device 24 . The pneumatic device 24 can supply a fluid to or pump a fluid from the hand flow path 110a formed in the hand 100 . The controller 23 can control the pneumatic device 24 such that the pneumatic device 24 sucks the fluid and the picker pad 260 clamps the semiconductor device. In addition, the controller 23 can control the pneumatic device 24 so that the pneumatic device 24 supplies the fluid to the tool flow path 110a and the picker pad 260 releases the semiconductor device. The controller 23 can be implemented by a computing device including a microprocessor, and since an implementation method is obvious to those skilled in the art, further detailed description thereof is omitted. Tubing for a flow path may be provided within the hand flow path 110a, the link flow path, and the pickup flow path 220a and connected to the pneumatic device.

Meanwhile, in addition to this configuration, according to a second embodiment of the present invention, the supporting member 400 may further include a housing supporting member 402 . In addition, the joint 300 can be connected with the connecting body 210 and the picker pad 260 . Hereinafter, the second embodiment of the present invention will be further described with reference to FIGS. 7 to 12 . In the description of the second embodiment, the differences between the above-mentioned embodiment and the second embodiment are mainly explained, and the same explanations and symbols refer to the above-mentioned embodiment.

Referring to FIGS. 7 and 8 , the upper part of the joint 300 can be connected with the connection body 210 , and the lower part of the joint 300 can be connected with the pick-up pad 260 . The joint 300 can be configured to be separated from the pickup body 250 in a horizontal direction. The vertical length of the connector 300 may be different from the vertical length of the pickup body 250 . For example, when the vertical length of the connector 300 is greater than the vertical length of the pickup body 250, the vertical distance between the pickup pad 260 and the connection body 210 connected to the connector 300 is greater than that of the pickup body 250. The vertical distance between the picker pad 260 and the connecting body 210 is large. One or more connectors 300 may be provided. For example, when plural pickup bodies 250 are provided, plural joints 300 may be provided corresponding to the plural pickup bodies 250 . In a more detailed example, when a plurality of pickup bodies 250 are provided, one connector 300 is provided on any one of the plurality of pickup bodies 250 and the plurality of connectors 300 can be provided on other pickup bodies 250 . In addition, the vertical length of the connector 300 provided on any one of the plurality of pickup bodies 250 may be different from the vertical length of the connector 300 provided on the other pickup bodies 250 .

When two or more picker bodies 250 are needed, the picker handle 22 has a joint 300 that is properly installed on each of the plurality of picker bodies 250 to stably hold multiple pickers with different heights. An effect of configuring semiconductor elements. In addition, the picker handle 22 has an effect of preventing a gap between the picker pads 260 and the semiconductor devices through the joint 300 .

Among the plurality of pickup pads, the pickup pad connected to the pickup body 250 may be referred to as a first pickup pad, and among the plurality of pickup pads, the pickup pad connected to the joint 300 may be referred to as is a second pickup pad.

Referring to FIGS. 9 and 10 again, an upper portion of the cover support 402 can be connected with the connection body 210 . A lower surface of the cover supporting member 402 may be in the horizontal direction. For example, when the pickup pad 260 is in the contact state, the lower surface of the housing support 402 may be parallel to the upper surface of the semiconductor device.

When the picker pad 260 is in the contact state, the housing supporter 402 can be disposed to face the semiconductor device. For example, when the picker pad 260 is in the contact state, the housing support member 402 may be disposed to face the semiconductor device and be vertically separated from the semiconductor device by a predetermined length h2.

Please refer to FIGS. 11 and 12 again. When the picker pad 260 is in the clamping state, the housing supporting member 402 can contact the semiconductor device and support the electronic component D. Referring to FIG. For example, the housing support 402 may contact the semiconductor device when the lower end of the pad flow path 260a abuts the semiconductor device. In addition, when the picker pad 260 is in the clamping state, the cover support member 402 can prevent the picker pad 260 from being deformed.

In addition, the housing support 402 may be disposed to be separated from the picker pad 260 in a horizontal direction when the picker pad 260 is in the clamped state. A central axis of the housing support 402 may be the same as a central axis of at least one of the pickup body 250 and the pickup pad 260 . With the housing support 402, when the electronic component D is clamped, the electronic component D can be prevented from rotating around an axis perpendicular to the central axis of the picker pad 260. For example, even when a front portion of the clamped electronic component D disposed on the front side of the picker pad 260 weighs more than a rear portion of the clamped electronic component D disposed on the rear side of the picker pad 260 When it is large, the electronic component D can also be prevented from tilting forward and downward through the cover support member 402 . Even when the fluid suction force of the hand tool 100 is not increased, the housing support 402 allows the electronic component D to be stably held by the picker hand 22 in a lying state.

The cover support 402 may include a first cover support and a second cover support. The first housing support may be disposed to surround the pickup body 250 . Furthermore, the second housing support may be arranged to surround the joint 300 . In addition, the first cover supporter and the second cover supporter may extend different lengths in a vertical direction. For example, when the vertical length of the pickup body 250 is smaller than the vertical length of the joint 300, the vertical length of the first housing holder may be smaller than the vertical length of the second housing holder. In a more detailed example, the difference between the vertical length of the pickup body 250 and the vertical length of the connector 300 may be the same as the difference between the first housing support and the second housing support.

The operation of the test processor 1 according to the embodiment of the present invention will be described below.

The test handler 1 can be moved by the handler transporter 30 so that the picker pad 260 faces the upper surface of the semiconductor device of the lying electronic assembly D. The picker pad 260 can be in a contact state where the lower end of the picker pad 260 contacts the upper surface of the semiconductor device. The picker pad 260 can move downward toward the electronic component D by the predetermined length h1 when the picker pad 260 is in the contact state. When a lower surface of the pick-up pad 260 fully contacts the electronic component D and controls the pneumatic device 24 to suck the fluid, the electronic component D can be held by the pick-up pad 260 and the pick-up pad 260 can become the clamping state. In addition, when the picker pad 260 is in the clamping state, a lower surface of the supporting member 400 can contact the upper surface of the semiconductor device.

The electronic component D can be moved by the processor transporter 30 to a state where the picker pad 260 becomes the clamping state and the support member 400 contacts the semiconductor device. The electronic component D can move to a target position while maintaining the lying state.

The examples of the present disclosure have been described above as specific embodiments, but these specific embodiments are just examples, and the present disclosure is not limited thereto and should be considered to have the widest scope according to the technical spirit disclosed in this specification. Those skilled in the art may combine/substitute the disclosed embodiments to implement an undisclosed version of a shape without departing from the scope of the present disclosure. In addition, those skilled in the art can easily change or modify the disclosed embodiments according to the present description, and it can be understood that such changes or modifications also fall within the scope of the present disclosure.

1: Test Processor 10: Processor body 20: Pickup Hand Tool Mod 21: Pickup Handle Support 22: Pickup Grip 23: Controller 24: Pneumatic device 30: Processor Transporter 100: Hand tools 110: Tool body 110a: hand tool flow path 110b: fixed pin groove 120: Latch part 130: Calibration part 131: First calibration pin 132: Second calibration pin 200: Pickup unit 210: Link ontology 210a: the first connection flow path 210b: the second connection flow path 210c: the third connection flow path 210d: the second calibration slot 210e: the first calibration tank 220: Locking Jaws 230: Latch pin 240: fixed pin 250: Pickup body 250a: Pickup flow path 260: Pickup Pad 260a: pad flow path 300: Connector 300a: joint flow path 400: support piece 401: fake support 402: Outer cover support D: electronic components h1, h2: predetermined length

FIG. 1 is a perspective view of a test handler according to a first embodiment of the present invention. Fig. 2 is a perspective view of a picker hand module according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view taken along line AA' of FIG. 2 . FIG. 4 is an enlarged view of B in FIG. 3 , showing a state where a pick-up pad contacts an electronic component. FIG. 5 is an enlarged view showing a state where the electronic component is clamped by the pick-up pad of FIG. 4 . Fig. 6 is a cross-sectional view showing a state in which one of the plurality of dummy supports is set. FIG. 7 is a perspective view of a picker hand module according to a second embodiment of the present invention. FIG. 8 is an exploded perspective view of the picker tool module in FIG. 7 . Fig. 9 is a cross-sectional view taken along line CC' of Fig. 7 . FIG. 10 is an enlarged view of D in FIG. 9 . FIG. 11 is an enlarged view showing a state where one of the picker pads in FIG. 10 is brought into a clamping state. Fig. 12 is a cross-sectional view showing a state in which a pickup pad holds one of an electronic component.

1: Test Processor

10: Processor body

20: Pickup Hand Tool Mod

21: Pickup Handle Support

22: Pickup Grip

23: Controller

24: Pneumatic device

30: Processor Transporter

100: Hand tools

200: Pickup unit

210: Link ontology

250: Pickup body

260: Pickup Pad

400: support piece

401: fake support

Claims (7)

A picker hand comprising: a hand tool; a picker unit, which is detachably connected with the hand tool and configured to hold an electronic component arranged in a flat state; and a support member configured to support the electronic component, Wherein the pickup unit includes a pickup pad, the pickup pad can be maintained in a contact state and a clamping state, and in the contact state, one end of the pickup pad contacts the electronic component, and the pickup pad is in the clamping state In the holding state, the picker pad clamps the electronic component by moving toward the electronic component by a predetermined length, so that a contact area between the picker pad and the electronic component is smaller than that of the picker pad in the contact state. large contact area, and Wherein the support member is separated from the electronic component by the predetermined length when the picker pad is in the contact state and contacts the electronic component when the picker pad is in the clamping state. The picker tool according to claim 1, wherein the picker unit further includes: a pickup body configured to support the pickup pad; and a connecting body, which is arranged between the hand tool and the picker body and connected with an upper part of the picker body, Wherein the support includes a dummy support that is separated from the pickup body in a horizontal direction such that a center of the dummy support is separated from a center of the pickup body, and Wherein the false supports include one or more false supports. For example, the picker tool of claim 2 further includes: a joint extending in a vertical direction and having a lower portion detachably connected with the pickup body and an upper portion detachably connected with the linking body, Wherein the connecting body is indirectly connected with the upper part of the pickup body through the joint. The picker tool according to claim 3, wherein the picker body includes one or more picker bodies, and the picker pad may include one or more picker pads, wherein each of the one or more pickup bodies includes a first pickup body and a second pickup body, wherein the first pickup body is directly connected to the connection body and the pickup pad, and the second pickup body is indirectly connected to the connection body through the joint, and Wherein a lower end of the pickup pad connected with the first pickup body is arranged above a lower end of the pickup pad connected with the second pickup body. The picker tool according to claim 1, wherein the picker unit further includes: a pickup body configured to support the pickup pad; and a connecting body, which is arranged between the hand tool and the picker body and is connected to an upper part of the picker body, and Wherein the support includes a cover support arranged to surround at least a part of the pickup body. For example, the picker tool of claim 1 further includes: a joint extending in a vertical direction and having a lower portion detachably connected to the picker pad, Wherein the pickup unit further includes: a pickup body configured to support the pickup pad; and a connecting body, which is arranged between the hand tool and the picker body and connected with an upper part of the joint and an upper part of the picker body, wherein the upper portion of the connector is detachably connected to the connecting body, and Wherein the support includes a housing support disposed to surround at least a portion of the connector. A picker hand comprising: a hand tool; a picker unit, which is detachably connected with the hand tool and configured to hold an electronic component arranged in a flat state; and a joint, which is detachably connected to the pickup unit, Wherein the pickup unit includes: a pickup body configured to support the pickup pad; a connecting body disposed between the hand tool and the picker body and connected to an upper portion of the picker body; and A pickup pad capable of being maintained in a contact state in which one end of the pickup pad contacts the electronic component and in a clamping state in which the pickup pad is clamping the electronic component by moving a predetermined length toward the electronic component such that a contact area between the picker pad and the electronic component is larger than when the picker pad is in the contact state, and Wherein the joint extends in a vertical direction, and has a lower part detachably connected with at least one of the pickup body and the pickup pad and an upper part detachably connected with the connecting body.

Images