TWI812732B - Transporting device and transporting method - Google Patents

Abstract

[Issue] Suppressing the positional deviation of the processed substrate caused by gear backlash. [Solution] The conveying device includes: a base member; an arm; and a driving unit. The base member is rotatably installed in the transfer chamber. The arm is installed on the base member and supports the substrate to be processed. The driving part rotates the base member in the first rotational direction or the second rotational direction that is opposite to the first rotational direction by using the power transmitted from the power source through the gear. Furthermore, when the substrate to be processed supported by the arm is transported to the processing chamber, the driving unit rotates the base member so that the direction of the arm changes from the first radial direction to the second radial direction. The first radial direction is The second radial direction is a direction shifted by a predetermined angle toward the second rotation direction from the rotation center of the base member toward the processing chamber. Next, the driving part rotates the base member by a predetermined angle in the first rotation direction so that the direction of the arm changes from the second radial direction to the first radial direction.

Description

Transport device and transport method

Various aspects and embodiments of the present disclosure relate to conveyance devices and conveyance methods.

In order to improve the processing throughput in semiconductor manufacturing processes, a plurality of processing chambers for processing substrates to be processed may be used to process a plurality of substrates to be processed in parallel. The plurality of processing chambers are connected to a transfer chamber that transfers substrates to be processed. The transfer room is maintained at the specified vacuum level. A transfer arm is disposed in the transfer chamber, and the substrate to be processed is transferred from the transfer chamber to each processing chamber by the transfer arm. In addition, when a plurality of processing processes are performed on the substrate to be processed, the substrate to be processed is also transported between processing chambers that perform respective processing processes. The transfer arm can rotate in the transfer chamber by power transmitted from a power source such as a motor through gears.

In addition, in recent years, in order to reduce the manufacturing cost of semiconductors, the substrate to be processed has been increasing in size. For example, regarding glass substrates used in FPD (Flat Panel Display), as the size of the mother glass substrate increases, the number of panels that can be obtained from one piece increases, thereby reducing costs. Therefore, in recent years, mother glass substrates have been enlarged. In addition, as the size of the mother glass substrate increases, the equipment for manufacturing the glass substrate also increases in size every year. [Prior technical literature] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2018-26507

[Problem to be solved by the invention]

However, when the power from the power source is transmitted to the transfer arm through the gear, the rotation angle of the transfer arm is slightly shifted due to the backlash of the gear. The glass substrate used for FPD has a size of several m square. When such a glass substrate is transported by a transport arm, the rotation angle of the transport arm is shifted due to the backlash of the gear, and the position of the glass substrate may deviate by more than 1 mm from the expected position. . In addition, when a glass substrate is transported by a transport arm between a plurality of processing chambers, the deviation amount of the rotation angle caused by the gear backlash is accumulated, and the deviation from the expected position is further expanded. [Means to solve the problem]

A conveying device according to one aspect of the present disclosure is a conveying device that is installed in a conveying chamber with a plurality of processing chambers connected around it and carries out processing substrates between the respective processing chambers. The conveying device is provided with: a base member; Arm; and driving part. The base member is rotatably installed in the transfer chamber. The arm is installed on the base member and supports the substrate to be processed. The driving part rotates the base member in the first rotational direction or the second rotational direction that is opposite to the first rotational direction by using the power transmitted from the power source through the gear. Furthermore, when the substrate to be processed supported by the arm is transported to the processing chamber, the driving unit rotates the base member so that the direction of the arm changes from the first radial direction to the second radial direction. The first radial direction is The second radial direction is a direction shifted by a predetermined angle toward the second rotation direction from the rotation center of the base member toward the processing chamber. Next, the driving part rotates the base member by a predetermined angle in the first rotation direction so that the direction of the arm changes from the second radial direction to the first radial direction. [Effects of the invention]

According to various aspects and embodiments of the present disclosure, positional deviation of the substrate to be processed caused by gear backlash can be suppressed.

Hereinafter, embodiments of the disclosed conveying device and conveying method will be described in detail with reference to the drawings. In addition, the following embodiments are not intended to limit the disclosed conveying device and conveying method.

[Configuration of processing system 100] FIG. 1 shows a schematic plan view of an example of a processing system 100 in an embodiment of the present disclosure. FIG. 2 shows an example of the cross section of the transfer chamber 10 . The processing system 100 is a multi-chamber type as shown in FIG. 1 , for example, and includes a transfer chamber 10, a load lock chamber 20, a plurality of first processing chambers 30-1 to 30-2, and a plurality of second processing chambers 40-1 to 40. -3 and control device 80. In the following, the plurality of first processing chambers 30-1 to 30-2 are collectively referred to as the first processing chamber 30 without distinguishing them individually. The plurality of second processing chambers 40-1 to 40-3 are collectively referred to as the plurality of second processing chambers 40-1 to 40-3 without distinguishing them from each other. In this case, it is described as the second processing chamber 40. In addition, the first processing chamber 30 and the second processing chamber 40 are collectively referred to as processing chambers without distinguishing them.

Each first processing chamber 30 performs the first processing on the substrate S, which is an example of the substrate to be processed, in a predetermined reduced pressure atmosphere, for example. In this embodiment, the substrate S is, for example, a glass substrate for FPD. Each second processing chamber 40 performs a second processing different from the first processing on the substrate S that has been subjected to the first processing, for example, in a predetermined reduced pressure atmosphere. In this embodiment, the first process is, for example, a process of laminating a first film on the substrate S, and the second process is, for example, a process of laminating a second film on the substrate S on which the first film has been laminated.

In addition, the first treatment and the second treatment may be etching treatment, heat treatment, etc. in addition to the film formation treatment. In addition, the processing system 100 illustrated in FIG. 1 is provided with two first processing chambers 30 and three second processing chambers 40, but the number of the first processing chambers 30 and the second processing chambers 40 is not limited to this. For example, one first processing chamber 30 may be provided in the processing system 100, or three or more first processing chambers 30 may be provided. In addition, the processing system 100 may be provided with two or less second processing chambers 40 , or may be provided with four or more second processing chambers 40 . In addition, the total number of the first processing chamber 30 and the second processing chamber 40 may be 4 or less, or may be 6 or more.

The plurality of first processing chambers 30 and the plurality of second processing chambers 40 are respectively connected to the transfer chamber 10 via gate valves G. In this embodiment, the transfer chamber 10 has a hexagonal planar shape, and is connected to any one of the plurality of first processing chambers 30 and the plurality of second processing chambers 40 via gate valves G on five side surfaces of the transfer chamber 10 . Moreover, the load lock chamber 20 is connected to one of the side surfaces of the transfer chamber 10 via the gate valve G.

The transfer chamber 10 is maintained in a predetermined reduced pressure environment, and a transfer device 70 for transferring the substrate S is provided in the transfer room 10 . The conveying device 70 has a base 71, an arm 72, a support shaft 73, and a driving part 74 as shown in FIG. 2, for example. The base 71 supports the arm 72 . The arm 72 supports the substrate S and can move along the base 71 . The support shaft 73 supports the base 71 . In this embodiment, the support shaft 73 is arranged in the center of the transfer chamber 10 in a plan view.

The driving part 74 rotates the support shaft 73 around the central axis of the support shaft 73 by using power transmitted from a power source such as a motor through gears. Accordingly, the base 71 and the arm 72 rotate around the central axis of the support shaft 73 . In addition, in the control of the rotation start and rotation stop of the support shaft 73, the driving unit 74 controls the rotation of the support shaft 73 in a manner such as trapezoidal control or S-shaped control to gradually change the rotation speed of the support shaft 73. speed.

Furthermore, the arm 72 moves on the base 71 along the base 71 to unload the substrate S from the load lock chamber 20 , the first processing chamber 30 , or the second processing chamber 40 in the direction in which the base 71 faces. Furthermore, the arm 72 moves on the base 71 along the base 71 to carry the substrate S into the load lock chamber 20 , the first processing chamber 30 , or the second processing chamber 40 in the direction in which the base 71 faces.

The transfer chamber 60 is connected to the side surface of the load lock chamber 20 opposite to the side surface connected to the transfer chamber 10 via the gate valve G. A plurality of storage boxes 50 for storing the substrate S are connected to the transfer chamber 60 . The transfer chamber 60 is provided with a transfer device 61 that takes out the substrate S from the storage box 50 and transfers it to the load lock chamber 20 , and takes out the substrate S from the load lock chamber 20 and transfers it to the storage box 50 .

The control device 80 has a memory, a processor and an input/output interface. The processor controls various parts of the processing system 100 through the input/output interface by reading and executing programs or recipes stored in the memory. For example, the control device 80 controls the operation of the transport device 70 in the transport room 10 through the input/output interface by reading and executing a program or recipe stored in the memory.

[Operation of transport device 70] FIG. 3 is a diagram explaining an example of the operation of the transport device 70 . In this embodiment, the transport device 70 takes out the substrate S before processing from the load lock chamber 20 and transports it to any first processing chamber 30 . Next, the transport device 70 transports the substrate S that has been subjected to the first process in the first processing chamber 30 from the first processing chamber 30 to any of the second processing chambers 40 . The transport device 70 transports the substrate S that has been subjected to the second process in the second processing chamber 40 from the second processing chamber 40 to the load lock chamber 20 .

The base 71 of the conveying device 70 is rotated in a clockwise direction (CW) or a counterclockwise direction (CCW) in a plan view by the driving portion 74 . The direction of the base 71 when unloading or loading the substrate S is from the rotation center of the base 71 toward the base 71 of the load lock chamber 20 , the first processing chamber 30 , and the second processing chamber 40 respectively, is defined as the first radial direction. D. In addition, in this embodiment, the possible rotation range of the base 71 is not limited. For example, the base 71 can rotate in an angle range other than the angle range 90 shown in FIG. 3 . Therefore, in the transfer chamber 10 of this embodiment, the rotation direction of the transfer device 70 when transferring the substrate S from the load lock chamber 20 to the first processing chamber 30 is the same as the rotation direction of the transfer device 70 when transferring the substrate S from the first processing chamber 30 to the second processing chamber 40 . The rotation direction of the conveying device 70 is limited to one direction.

Specifically, when the unprocessed substrate S is transferred from the load lock chamber 20 to any of the first processing chambers 30 , the transfer device 70 rotates in the CW direction. On the other hand, when the substrate S on which the first process has been performed in the first processing chamber 30 is transported to any of the second processing chambers 40, the transport device 70 rotates toward the CCW.

The information on the rotation angle θ of the transport device 70 of each combination of the first processing chamber 30 and the second processing chamber 40 is, for example, stored in the table 81 in the memory of the control device 80 in advance. FIG. 4 is a diagram showing an example of the table 81 that stores information on the rotation angle of the base 71 during substrate transportation. In the rotation angle θ of each base 71 shown in Figure 4, CW is represented by "+" and CCW is represented by "-".

For example, when the substrate S is transported from the load lock chamber 20 to the first processing chamber 30 - 1 , as shown in FIG. 4 , the rotation angle θ of the base 71 is When the direction is used as a reference, it becomes "+θ _L1 ". That is, when the substrate S is transferred from the load lock chamber 20 to the first processing chamber 30-1, the base 71 rotates "θ _L1 " in the CW direction based on the direction of the base 71 at the time of unloading. "θ _L1 " is, for example, 60˚.

In addition, for example, when the first processed substrate S is transported from the first processing chamber 30-1 to the second processing chamber 40-1, as shown in FIG. 4, the rotation angle θ of the base 71 is determined by 1. When the direction of the base 71 when the processing chamber 30-1 is moved out is used as a reference, it becomes "-θ ₁₁ ". That is, when the substrate S is transported from the first processing chamber 30-1 to the second processing chamber 40-1, the base 71 is rotated CCW by "θ ₁₁ " based on the direction of the base 71 at the time of transfer. "θ ₁₁ " is, for example, 240˚.

Here, the driving part 74 rotates the base 71 and the arm 72 via the support shaft 73 by using power transmitted from a power source such as a motor through gears. Therefore, based on the tooth gap of the gear, the rotation angle of the base 71 is slightly offset. There are large substrates S such as glass substrates for FPD, which are several meters square in size. When such a substrate S is transported by the transport device 70, the distance from the central axis of the support shaft 73 to the load lock chamber 20, the first processing chamber 30, or the second processing chamber 40 into which the substrate S is transported also becomes longer. . Therefore, the rotation angle of the base 71 due to the backlash of the gear may shift by more than 1 mm from the expected position depending on the location of the substrate S. Furthermore, when the substrate S is transported between a plurality of processing chambers by the transport device 70, the deviation amount of the rotation angle caused by the gear backlash is accumulated, so that the deviation from the expected position is further expanded.

Here, in the transport device 70 of this embodiment, when the substrate S is transported to the processing chamber, the driving unit 74 is shifted in the direction of the arm 72 from the first radial direction D corresponding to the processing chamber to the CW. The base 71 is rotated in the direction of the predetermined angle α, that is, the second radial direction D'. The first radial direction D is the direction from the rotation center of the base 71 toward the corresponding processing chamber. Thereafter, the driving part 74 rotates the base 71 toward the CCW by a predetermined angle α so that the direction of the arm 72 changes from the second radial direction D' to the first radial direction D. The predetermined angle α is the same angle when the substrate S is transported to any processing chamber. CCW is an example of the first rotation direction, and CW is an example of the second rotation direction.

Specifically, when the substrate S is transported from the load lock chamber 20 to the first processing chamber 30-2, for example, as shown in FIG. 5, the driving unit 74 is aligned with the first processing chamber 30-2 in the direction of the arm 72. The base 71 is rotated in the second radial direction D'. The second radial direction D' corresponding to the first processing chamber 30-2 is a direction shifted CW by a predetermined angle α from the first radial direction D corresponding to the first processing chamber 30-2. For example, as shown in FIG. 6 , the driving unit 74 rotates the base 71 toward the CCW by a predetermined angle α so that the direction of the arm 72 changes from the second radial direction D' to the first radial direction D.

In addition, when the substrate S is transported from the first processing chamber 30-2 to the second processing chamber 40-3, for example, as shown in FIG. 7, the driving unit 74 becomes the second processing chamber 40-3 in the direction of the arm 72. The base 71 is rotated in the corresponding second radial direction D'. The second radial direction D' corresponding to the second processing chamber 40-3 is a direction shifted CW by a predetermined angle α from the first radial direction D corresponding to the second processing chamber 40-3. For example, as shown in FIG. 8 , the driving unit 74 rotates the base 71 toward the CCW by a predetermined angle α so that the direction of the arm 72 changes from the second radial direction D' to the first radial direction D.

Furthermore, when the driving unit 74 rotates the base 71 so that the direction of the arm 72 becomes the second radial direction D', the driving unit 74 rotates the base 71 at the first rotation speed. When the driving part 74 rotates the base 71 toward the CCW by a predetermined angle α in such a manner that the direction of the arm 72 changes from the second radial direction D' to the first radial direction D, the driving part 74 rotates the base 71 at a second rotational speed slower than the first rotational speed. 71 spins. The second rotation speed is the same rotation speed when the substrate S is transported to any processing chamber.

Here, in this embodiment, the second radial direction D' is a direction shifted by a predetermined angle α from the first radial direction D to the second rotation direction (that is, CW). However, the second radial direction D' is a direction shifted by a predetermined angle α from the first radial direction in the rotational direction, and is determined in accordance with the arrangement of the load lock chamber 20 , the first processing chamber 30 , and the second processing chamber 40 Decide.

For example, in this embodiment, a plurality of processing chambers include one or more first processing chambers 30 and one or more second processing chambers 40 . In the first processing chamber 30, when the base 71 is rotated by the driving part 74 so that the direction of the base 71 becomes the second radial direction D', the base 71 rotates in the third rotation direction. In the second processing chamber 40, when the driving part 74 rotates the base 71 so that the direction of the base 71 becomes the second radial direction D', the base 71 rotates in the direction opposite to the third rotation direction, that is, in the fourth rotation direction. .

Among the first processing chamber 30 and the second processing chamber 40, the third rotation direction or the fourth rotation direction corresponding to the larger one of the processing chambers is determined as the first rotation direction. Next, the second rotation direction, which is the opposite direction to the first rotation direction, is determined.

In this embodiment, when the substrate S is transported from the load lock chamber 20 to the respective first processing chamber 30, the direction of the arm 72 is the second radial direction D' corresponding to the first processing chamber 30, so there is no need to Rotate base 71 towards CW. That is, in this embodiment, the third rotation direction corresponding to the first processing chamber 30 is CW. On the other hand, in this embodiment, when the substrate S is transported from the first processing chamber 30 to the respective second processing chamber 40 , the direction of the arm 72 becomes the second radial direction corresponding to the second processing chamber 40 . D', so there is no need to rotate the base 71 towards the CCW. That is, in this embodiment, the fourth rotation direction corresponding to the second processing chamber 40 is CCW.

In addition, the processing system 100 of this embodiment is provided with two first processing chambers 30 and three second processing chambers 40 . Therefore, the rotation direction corresponding to the larger one of the first processing chambers 30 and the second processing chambers 40 is the fourth rotation direction, that is, CCW. Therefore, the first rotation direction is determined to be CCW, and the second rotation direction is determined to be CW.

Accordingly, when the base 71 is rotated so that the arm 72 is in the second radial direction D', the number of processing chambers that need to be rotated by the predetermined angle α more than the rotation angle θ in the first radial direction D is less than that. The starting rotation angle θ is the number of processing chambers that can be rotated by the specified angle α. Accordingly, the overall transportation time for the plurality of substrates S can be reduced, and the processing throughput can be improved.

[Deviation of position error] FIG. 9 is a diagram showing an example of experimental results of position errors on the substrate S. As shown in FIG. In the experimental results shown in FIG. 9 , the substrate S was transported from the load lock chamber 20 to the first processing chamber 30 , and the position error on the substrate S about 4 m away from the rotation center of the base 71 was measured multiple times. The experimental results of this plurality of measurement processes are shown. In addition, in the experimental results shown in Figure 9, the prescribed angle α is 0.5˚.

In the experimental results shown in Figure 9, the error range converges to within ±0.05mm. When the substrate S is further transported from the first processing chamber 30 to the second processing chamber 40, the range of the deviation of the position of the substrate S in the second processing chamber 40 becomes the range of the deviation of the error as shown in FIG. 9 2 times. However, even in this case, the deviation range of the position error of the substrate S in the second processing chamber 40 is within ±0.1 mm.

Here, assuming that the angle deviation of the gear caused by the backlash of the gear is 1/60˚=1 minute, at a position on the base plate S that is about 4m away from the rotation center of the base 71, 4000×tan (1/ 60)=1.2mm error. That is, when the deviation of the angle of the gear caused by the backlash of the gear is 1 point, the deviation range of the error in the position on the base plate S is ±0.6 mm. This error occurs when the positioned substrate S is transported from the load lock chamber 20 to the first processing chamber 30 . When the substrate S is further transported from the first processing chamber 30 to the second processing chamber 40, the position error of the substrate S in the second processing chamber 40 is doubled, and therefore the range of the deviation of the error is also doubled. That is, when the substrate S is transported from the load lock chamber 20 to the first processing chamber 30 and further from the first processing chamber 30 to the second processing chamber 40, the deviation range of the error will be ±1.2 mm.

On the other hand, in the transport device 70 of this embodiment, when the substrate S is transported to the processing chamber, the driving unit 74 is deflected in the direction of the arm 72 from the first radial direction D corresponding to the processing chamber to the CW direction. The base 71 is rotated to move in the direction of the predetermined angle α, that is, the second radial direction D'. Thereafter, the driving part 74 rotates the base 71 toward the CCW by a predetermined angle α so that the direction of the arm 72 changes from the second radial direction D' to the first radial direction D.

According to this, the deviation range of the position error of the substrate S in the first processing chamber 30 when the substrate S is transported from the load lock chamber 20 to the first processing chamber 30 can be suppressed to within ±0.05 mm. In addition, when the substrate S is further transported from the first processing chamber 30 to the second processing chamber 40, the deviation range of the position error of the substrate S in the second processing chamber 40 can be suppressed to within ±0.1 mm. Accordingly, among the substrates S, the variation in the processing performed in the first processing chamber 30 and the second processing chamber 40 can be reduced, and the variation in quality of the substrates S can be reduced.

[Specified angle and rotation speed] Next, experiments were conducted on the predetermined angle α and the rotation speed when rotating the predetermined angle α. FIG. 10 is a graph showing an example of error values for each combination of prescribed angle and rotational speed. In addition, the rotational speed shown in FIG. 10 represents the maximum value among the rotational speeds for performing trapezoidal control, S-shaped control, or the like. In the example shown in Figure 10, the low speed is 21˚/sec, the medium speed is twice the rotation speed of the low speed, and the high speed is four times the rotation speed of the low speed.

As shown in the example in Figure 10, at any rotation speed, the deviation range of the error converges to within approximately 0.05 mm. However, when referring to Figure 10, the average error values are lower in the order of low speed, medium speed, and high speed. Therefore, the rotation speed when rotating the predetermined angle α is preferably medium speed or low speed rather than high speed. In addition, in order to shorten the transportation time, it is preferable that the rotation speed when rotating the base 71 so that the direction of the arm 72 becomes the second radial direction D', that is, the first rotation speed is high. That is, the rotation speed when the base 71 is rotated by the predetermined angle α in the first rotation direction in such a manner that the direction of the arm 72 changes from the second radial direction D' to the first radial direction D, that is, the second rotation speed, is the first rotation speed. A rotation speed of less than 1/2 is preferred. In order to further reduce the backlash error, it is more preferable that the second rotational speed is 1/4 or less of the first rotational speed. Accordingly, it is possible to achieve both shortening of the transportation time of the substrate S and suppression of positional deviation of the substrate S caused by gear backlash.

Furthermore, as shown in the example of FIG. 10 , at any given angle α, the deviation range of the error converges within approximately 0.05 mm. Furthermore, theoretically, the predetermined angle α only needs to be the deviation of the angle of the gear caused by the backlash of the gear, which is 1 minute or more. However, referring to FIG. 10 , at low rotational speeds, if the predetermined angle α is too small, the error range expands to more than 0.04 mm. This is presumably because if the predetermined angle α is too small, it becomes difficult to control the minute angle with high precision. On the other hand, at low rotational speeds, as long as the specified angle α is 0.5 or 1.0˚, the error range will converge to less than 0.02mm. Therefore, the specified angle is preferably within the range of 0.5˚ to 1.0˚.

[Conveyance control] FIG. 11 is a flowchart showing an example of a method of transporting the substrate S. The flowchart illustrated in FIG. 11 is implemented by the control device 80 controlling each part of the processing system 100 . For example, when the substrate S is unloaded from the load lock chamber 20 of the transfer source, the first processing chamber 30 , or the second processing chamber 40 , the control device 80 starts the process shown in the flowchart of FIG. 11 .

First, the control device 80 controls the load lock chamber 20, the first processing chamber 30, or the second processing chamber 40 of the transfer source of the substrate S and the load lock chamber 20, the first processing chamber 30, and the transfer destination of the substrate S according to the recipe. Or the second processing chamber 40 is defined. Next, the control device 80 refers to the table 81 in the memory to define the rotation angle θ and the rotation direction of the base 71 corresponding to the defined transport source and transport destination (S100). The direction of rotation is represented in Table 81 by the symbol of the rotation angle θ.

Next, the control device 80 determines whether the rotation angle θ defined in step S100 is the first rotation direction (S101). The first rotation direction refers to the rotation direction when the base 71 is rotated by a predetermined angle α so that the direction of the base 71 faces the direction of the load lock chamber 20, the first processing chamber 30, or the second processing chamber 40 of the transfer destination. In this embodiment, the first rotation direction is CCW. When the rotation direction of the rotation angle θ defined in step S100 is the first rotation direction (S101: Yes), the control device 80 controls the drive unit 74 to rotate the base 71 in the first rotation direction minus the predetermined amount from the rotation angle θ. Angle amount after angle α (S102). Accordingly, the base 71 rotates in the first rotation direction by an angle amount (rotation angle θ - predetermined angle α), and the direction of the arm 72 changes from the first radial direction D to the second rotation direction shifted by the predetermined angle α. Radial D'.

Next, the control device 80 controls the driving part 74 to rotate the base 71 at a predetermined angle α in the first rotation direction at a predetermined rotation speed (S103). Accordingly, the base 71 rotates at a predetermined angle α in the first rotation direction at a predetermined rotation speed. Thereafter, the control device 80 controls the arm 72 so that the substrate S on the arm 72 is transferred to the load lock chamber 20, the first processing chamber 30, or the second processing chamber 40 of the transfer destination (S104). After that, the transfer method shown in the flowchart of FIG. 11 is completed.

Furthermore, when it is determined in step S100 that the rotation direction of the defined rotation angle θ is not the first rotation direction (S101: No), the control device 80 controls the driving unit 74 to rotate the base 71 in the second rotation direction by the rotation angle θ plus The angle amount after specifying the angle α (S105). The second rotation direction refers to the rotation direction opposite to the first rotation direction. In this embodiment, the second rotation direction is CW. Accordingly, the base 71 rotates in the second rotation direction (rotation angle θ + predetermined angle α), and the direction of the arm 72 changes from the first radial direction D to the second rotation direction shifted by the predetermined angle α. Radial D'. The control device 80 executes the process shown in step S103.

As above, one embodiment of the conveyance device 70 has been described. The transport device 70 in this embodiment is installed in the transport chamber 10 around which a plurality of processing chambers are connected, and transports the substrate S between the respective processing chambers. The conveying device 70 includes a base 71 , an arm 72 , and a driving unit 74 . The base 71 is rotatably installed in the transfer chamber 10 . The arm 72 is provided on the base 71 to support the substrate S. The driving part 74 uses the power transmitted from the power source through the gear to rotate the base 71 in the first rotation direction or the direction opposite to the first rotation direction, that is, the second rotation direction. Furthermore, when the substrate S supported by the arm 72 is transported to the processing chamber, the driving unit 74 rotates the base 71 so that the direction of the arm 72 changes from the first radial direction D to the second radial direction D'. The first radial direction D is a direction from the rotation center of the base 71 toward the processing chamber, and the second radial direction D' is a direction shifted by a predetermined angle α toward the second rotation direction. Thereafter, the driving part 74 rotates the base 71 by a predetermined angle α in the first rotation direction so that the direction of the arm 72 changes from the second radial direction D' to the first radial direction D. When the substrate S is transported between the respective processing chambers in this way, the base 71 rotates in the first rotation direction by a predetermined angle α and then stops. Therefore, the rotation direction just before the stop and the movement amount until the stop can be made the same. condition. Accordingly, the deviation of the rotation angle caused by the backlash of the gear that transmits power to the drive unit 74 can be suppressed, and the positional deviation of the substrate S can be suppressed.

Furthermore, in the above embodiment, the predetermined angle α is the same angle when the substrate S is transported in any one of the plurality of processing chambers. According to this, when the substrate S is processed in any one of the plurality of processing chambers, positional deviation of the substrate S caused by gear backlash can be suppressed.

Furthermore, in the above embodiment, the angle α is specified to be an angle within the range of 0.5˚ to 1.0˚. According to this, the positional deviation of the substrate S caused by the backlash of the gear can be suppressed.

Furthermore, in the above embodiment, the rotation speed when the driving part 74 rotates the base 71 by a predetermined angle α in the first rotation direction so that the direction of the arm 72 changes from the second radial direction D' to the first radial direction D, Compared with the first rotation speed, which is the rotation speed when the base 71 is rotated so that the direction of the arm 72 becomes the second radial direction D', the base 71 is rotated at a slower second rotation speed. Accordingly, it is possible to achieve both shortening of the transportation time of the substrate S and suppression of positional deviation of the substrate S caused by gear backlash.

Furthermore, in the above embodiment, the second rotational speed is preferably 1/2 or less of the first rotational speed. Accordingly, it is possible to achieve both shortening of the transportation time of the substrate S and suppression of positional deviation of the substrate S caused by gear backlash.

Furthermore, in the above embodiment, the second rotational speed is the same speed when the substrate S is transported in any one of the plurality of processing chambers. According to this, when the substrate S is processed in any one of the plurality of processing chambers, positional deviation of the substrate S caused by gear backlash can be suppressed.

Furthermore, in the above embodiment, the plurality of processing chambers are divided into a plurality of processing chambers. When the base 71 is rotated by the driving part 74 so that the direction of the arm 72 becomes the second radial direction D', the base 71 is rotated in the third rotation direction. 1. The processing chamber 30 and the second processing chamber 40 rotate together with the base 71 in the fourth rotation direction which is opposite to the third rotation direction. Furthermore, the third rotation direction or the fourth rotation direction corresponding to the larger one of the first processing chambers 30 and the second processing chambers 40 is set as the first rotation direction. Accordingly, the overall production capacity of processing a plurality of substrates S can be improved.

Moreover, in the above embodiment, the substrate S is a glass substrate for FPD. When transporting a large substrate S, positional deviation of the substrate S caused by gear backlash can be suppressed.

[other] In addition, the technology disclosed in this application is not limited to the above-mentioned embodiment, and various modifications can be made within the scope of the gist.

For example, in the above embodiment, an example of a transport device for transporting a substrate S such as a glass substrate for FPD is explained. However, the disclosed technology is not limited to this, and the disclosed technology is also applicable to transporting semiconductor substrates such as silicon wafers. transport device.

In addition, in the transport device 70 of the above embodiment, for example, as shown in FIG. 2 , one arm 72 is provided on the base 71 , but the disclosed technology is not limited to this, and a plurality of arms 72 may be provided on the base 71 .

In addition, in the above embodiment, the planar shape of the transfer chamber 10 is a hexagonal shape, but the disclosed technology is not limited to this. The planar shape of the transfer chamber 10 may be other polygonal shapes other than hexagonal shapes such as triangular shape, quadrangular shape, pentagonal shape, etc. .

In addition, all the embodiments disclosed this time are only examples and are not intended to be limiting. In fact, the above embodiments can be implemented in various forms. In addition, the above-described embodiments can be omitted, replaced, or modified in various forms without departing from the scope of the patent application and the spirit thereof.

D: 1st radial direction D’: 2nd radial direction G: Gate valve S:Substrate 100:Processing system 10:Transportation room 20:Load lock chamber 30: No. 1 processing room 40: No. 2 processing room 50: Storage box 60:Transportation room 61:Conveying device 70:Conveying device 71:Base 72:Arm 73:Support shaft 74:Drive Department 80:Control device 81:Table 90:Angle range

[Fig. 1] Fig. 1 is a schematic plan view showing an example of a processing system in an embodiment of the present disclosure. [Fig. 2] Fig. 2 is a diagram showing an example of the cross section of the transfer chamber. [Fig. 3] Fig. 3 is a diagram illustrating an example of the operation of the conveying device. [Fig. 4] Fig. 4 is a diagram illustrating an example of a table storing information on the rotation angle of the base during substrate transportation. [Fig. 5] Fig. 5 is a schematic diagram illustrating an example of the rotation angle of the base. [Fig. 6] Fig. 6 is a schematic diagram illustrating an example of the rotation angle of the base. [Fig. 7] Fig. 7 is a schematic diagram illustrating an example of the rotation angle of the base. [Fig. 8] Fig. 8 is a schematic diagram illustrating an example of the rotation angle of the base. [Fig. 9] Fig. 9 is a diagram showing an example of experimental results of position errors on a substrate. [Fig. 10] Fig. 10 is a graph showing an example of error values for each combination of prescribed angles and rotational speeds. [Fig. 11] Fig. 11 is a flowchart showing an example of a substrate transportation method.

10:Transportation room

100:Processing system

20:Load lock chamber

30-1~30-2: No. 1 processing room

40-1~40-3: 2nd processing room

50: Storage box

60:Transportation room

61:Conveying device

70:Conveying device

71:Base

72:Arm

80:Control device

G: Gate valve

S:Substrate

Claims (8)

A conveying device is installed in a conveying chamber with a plurality of processing chambers connected around it, and carries out processing substrates between the respective processing chambers. The conveying device is provided with a base member rotatably installed in the above-mentioned processing chambers. In the transfer chamber; an arm is installed on the base member and supports the substrate to be processed; and a driving unit uses power transmitted from a power source through a gear to move the base member in the first rotation direction or in conjunction with the first rotation direction. The direction of rotation is opposite to the direction of rotation, that is, the second rotation direction; the driving unit, when transporting the substrate to be processed supported by the arm to the processing chamber, rotates the base member so that the direction of the arm changes from The first radial direction is a direction from the rotation center of the base member toward the processing chamber, and the second radial direction is a direction shifted by a predetermined angle toward the second rotation direction. , after that, the base member is rotated by the predetermined angle in the first rotation direction, so that the direction of the arm is changed from the second radial direction to the first radial direction, and the substrate to be processed is for FPD (Flat Panel Display) of glass substrate. A transfer device is installed in a transfer chamber with a plurality of processing chambers connected around it, and transfers substrates to be processed between the respective processing chambers. The transport device includes: a base member that is rotatably installed in the transfer chamber; an arm that is installed on the base member and supports the substrate to be processed; and a drive unit that is driven by gear transmission from a power source. The power is used to rotate the base member in the first rotational direction or the second rotational direction which is the opposite direction to the first rotational direction; the driving unit transports the substrate to be processed supported by the arm to the processing chamber. In this case, the base member is rotated so that the direction of the arm changes from the first radial direction to the second radial direction. The first radial direction is the direction from the rotation center of the base member toward the processing chamber, and the second radial direction is changed to the second radial direction. 2. The radial direction is a direction shifted by a predetermined angle toward the second rotation direction. After that, the base member is rotated by the predetermined angle toward the first rotation direction, so that the direction of the arm changes from the second radial direction to the above-mentioned direction. In the first radial direction, the predetermined angle is the same angle when the substrate to be processed is transported in any one of the plurality of processing chambers. For example, if the conveying device of the patent scope 1 or 2 is applied for, the above-mentioned specified angle is an angle within the range of 0.5° or more and 1.0° or less. A transfer device is installed in a transfer chamber with a plurality of processing chambers connected around it, and transfers substrates to be processed between the respective processing chambers. The transport device includes: a base member that is rotatably installed in the transfer chamber; an arm that is installed on the base member and supports the substrate to be processed; and a drive unit that is driven by gear transmission from a power source. The power is used to rotate the base member in the first rotational direction or the second rotational direction which is the opposite direction to the first rotational direction; the driving unit transports the substrate to be processed supported by the arm to the processing chamber. In this case, the base member is rotated so that the direction of the arm changes from the first radial direction to the second radial direction. The first radial direction is the direction from the rotation center of the base member toward the processing chamber, and the second radial direction is changed to the second radial direction. 2. The radial direction is a direction shifted by a predetermined angle toward the second rotation direction. After that, the base member is rotated by the predetermined angle toward the first rotation direction, so that the direction of the arm changes from the second radial direction to the above-mentioned direction. In the first radial direction, the rotation speed of the driving unit when the base member is rotated in the first rotation direction in such a manner that the direction of the arm changes from the second radial direction to the first radial direction is, compared to The rotation speed when the base member is rotated so that the direction of the arm becomes the second radial direction, that is, the first rotation speed, is rotated at a slower second rotation speed. For example, in the conveying device of claim 1, 2 or 4, the second rotation speed is less than 1/2 of the first rotation speed. For example, in the conveying device of claim 1, 2 or 4, the second rotational speed is the same speed when the substrate to be processed is conveyed in any one of the plurality of processing chambers. A conveying device is installed in a conveying chamber with a plurality of processing chambers connected around it, and carries out processing substrates between the respective processing chambers. The conveying device is provided with a base member rotatably installed in the above-mentioned processing chambers. In the transfer chamber; an arm is installed on the base member and supports the substrate to be processed; and a driving unit uses power transmitted from a power source through a gear to move the base member in the first rotation direction or in conjunction with the first rotation direction. The direction of rotation is opposite to the direction of rotation, that is, the second rotation direction; the driving unit, when transporting the substrate to be processed supported by the arm to the processing chamber, rotates the base member so that the direction of the arm changes from The first radial direction is a direction from the rotation center of the base member toward the processing chamber, and the second radial direction is a direction shifted by a predetermined angle toward the second rotation direction. , after that, the base member is rotated by the predetermined angle in the first rotation direction, so that the direction of the arm is changed from the second radial direction to the first radial direction, and a plurality of the processing chambers are divided into by the above-mentioned The driving unit rotates the base member so that the direction of the arm becomes the second radial direction. When, the first processing chamber in which the base member rotates in the third rotation direction, and the second processing chamber in which the base member rotates in the fourth rotation direction that is opposite to the third rotation direction, the first processing chamber and Among the second processing chambers, the third rotation direction or the fourth rotation direction corresponding to the larger one of the processing chambers is set as the first rotation direction. A transportation method is a transportation method using a transportation device. The transportation device is provided with: a base member rotatably installed in a transportation chamber around which a plurality of processing chambers are connected; and an arm installed on the base member, and supports the substrate to be processed that is transported between the respective processing chambers; and a driving unit that drives the base member in the first rotational direction or in the opposite direction to the first rotational direction by the power transmitted from the power source through the gear. The transfer method includes: when the substrate to be processed supported by the arm is transferred to the processing chamber, the base member is rotated so that the direction of the arm changes from the first rotation direction to the processing chamber. The radial direction becomes a second radial direction. The first radial direction is a direction from the rotation center of the base member toward the processing chamber. The second radial direction is a direction shifted by a predetermined angle toward the second rotation direction. ; and rotating the base member by the predetermined angle in the first rotation direction so that the direction of the arm changes from the second radial direction to the first radial direction. In this project, the substrate to be processed is a glass substrate used for FPD (Flat Panel Display).