TWI812123B - Wafer stage - Google Patents
Wafer stage Download PDFInfo
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- TWI812123B TWI812123B TW111111690A TW111111690A TWI812123B TW I812123 B TWI812123 B TW I812123B TW 111111690 A TW111111690 A TW 111111690A TW 111111690 A TW111111690 A TW 111111690A TW I812123 B TWI812123 B TW I812123B
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- clamping
- clamping jaw
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- clamping jaws
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- 210000000078 claw Anatomy 0.000 claims abstract description 39
- 230000007246 mechanism Effects 0.000 claims abstract description 24
- 238000006073 displacement reaction Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 50
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000002457 bidirectional effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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- Transmission Devices (AREA)
- Jigs For Machine Tools (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
本發明係有關於晶圓製程設備,尤其是一種適用於夾持多種不同尺寸晶圓的晶圓載台。 The present invention relates to wafer processing equipment, in particular to a wafer stage suitable for holding wafers of various sizes.
現有的晶圓加工製程設備一般具有夾具以用於夾持晶圓,且進行晶圓表面噴灑製程時夾具旋轉晶圓使製程藥液或是清洗液均勻流佈晶圓表面。由於夾具為可旋轉的動件,因此不易在其上佈設氣、液管路或是其他機構件,因此夾具一般難以設計複雜的可動機構,通常也僅適用於夾持單一尺寸的晶圓。為了使製程設備快速改變工作晶圓尺寸,常見的作法係配置多個不同尺寸的夾具,因此設備體積龐大、建置成本高且多個夾具之間不易相互定位。 Existing wafer processing equipment generally has a fixture for clamping the wafer, and during the wafer surface spraying process, the fixture rotates the wafer to allow the process solution or cleaning solution to evenly distribute on the wafer surface. Since the clamp is a rotatable moving part, it is difficult to install gas and liquid pipelines or other mechanical components on it. Therefore, it is generally difficult to design a complex movable mechanism on the clamp, and it is usually only suitable for clamping wafers of a single size. In order to allow the process equipment to quickly change the size of the working wafer, a common practice is to configure multiple fixtures of different sizes. Therefore, the equipment is bulky, the construction cost is high, and the multiple fixtures are difficult to position relative to each other.
有鑑於此,本發明人遂針對上述現有技術,特潛心研究並配合學理的運用,盡力解決上述之問題點,即成為本發明人改良之目標。 In view of this, the inventor has devoted himself to research on the above-mentioned existing technology and cooperated with the application of academic theory to try his best to solve the above-mentioned problems, which has become the goal of the inventor's improvement.
本發明提供一種適用於夾持多種不同尺寸晶圓的晶圓載台。 The invention provides a wafer carrier suitable for clamping wafers of various sizes.
本發明提供一種晶圓載台,其包含一夾具、一旋轉機構及一致動機構。夾具包含一座體以及環列設置在座體的複數夾爪組,每一夾爪組分別包 含複數夾爪,夾具的各夾爪分別具有樞接座體的一旋轉軸以及相對於旋轉軸偏心配置的一爪部。旋轉機構連接座體以旋轉夾具。致動機構包含一致動器、一被動件、對應各夾爪組設置在被動件上的複數致動螺母、對應各夾爪組的複數致動螺桿。每一夾爪組的該些夾爪以一連桿組件相互連動,各致動螺桿分別螺接相對應的各致動螺母且各致動螺桿同軸連接相對應的夾爪組的其中一夾爪之旋轉軸,致動器對應被動件分離配置能夠沿致動螺桿之軸向推移被動件使各致動螺母線性位移,各致動螺母線性位移時驅動對應的各致動螺桿旋轉而帶動各夾爪旋轉。 The invention provides a wafer stage, which includes a clamp, a rotating mechanism and an actuating mechanism. The clamp includes a body and a plurality of clamping jaw groups arranged around the base body. Each clamping jaw group includes Containing a plurality of clamping jaws, each clamping jaw of the clamp has a rotation axis pivoted to the base body and a claw portion eccentrically arranged relative to the rotation axis. The rotating mechanism is connected to the base body to rotate the clamp. The actuation mechanism includes an actuator, a passive part, a plurality of actuation nuts provided on the passive part corresponding to each jaw group, and a plurality of actuation screw rods corresponding to each jaw group. The clamping jaws of each clamping jaw group are interconnected with each other through a connecting rod assembly. Each actuation screw is screwed to the corresponding actuation nut, and each actuation screw is coaxially connected to one of the clamping jaws of the corresponding clamping jaw group. The rotation axis, the actuator corresponding to the passive part is separated and configured to push the passive part along the axial direction of the actuation screw to linearly displace each actuation nut. When each actuation nut linearly displaces, it drives the corresponding actuation screw to rotate and drive each clamp. The claw spins.
本發明的晶圓載台,其每一夾爪組的夾爪至少包含一第一夾爪以及一第二夾爪,夾具的第一夾爪呈一環列配置且夾具的第二夾爪呈與第一夾爪同心的另一環列配置。 In the wafer carrier of the present invention, the clamping jaws of each clamping jaw group at least include a first clamping jaw and a second clamping jaw. The first clamping jaw of the clamping tool is arranged in a ring, and the second clamping jaw of the clamping tool is arranged in an array with the second clamping jaw. One clamping jaw is arranged in a concentric ring.
本發明的晶圓載台,其每一夾爪組的夾爪至少包含一第一夾爪以及一第二夾爪,夾具的第一夾爪等長,夾具的第二夾爪等長,夾具的各第二夾爪長於各第一夾爪,夾具的第一夾爪呈一環列配置且夾具的第二夾爪同心環繞第一夾爪配置。 In the wafer carrier of the present invention, the clamping jaws of each clamping jaw group include at least a first clamping jaw and a second clamping jaw. The first clamping jaws of the clamping jaws are of the same length, and the second clamping jaws of the clamping jaws are of the same length. Each second clamping jaw is longer than each first clamping jaw, the first clamping jaws of the clamp are arranged in a ring, and the second clamping jaws of the clamp are arranged concentrically around the first clamping jaw.
本發明的晶圓載台,其夾爪立設於座體且相互平行配置。 In the wafer carrier of the present invention, the clamping claws are erected on the base body and arranged parallel to each other.
本發明的晶圓載台,其每一夾爪包含有立設於座體的一柱體,夾爪的爪部設置在柱體末端的一端面。爪部的側面設有鄰接端面的一溝槽。 In the wafer carrier of the present invention, each clamping jaw includes a cylinder erected on the base body, and the claw portion of the clamping jaw is arranged on an end surface of the end of the cylinder. The side of the claw is provided with a groove adjacent to the end surface.
本發明的晶圓載台,其被動件為一環體,且致動螺母環列設置於環體上。 In the wafer carrier of the present invention, the passive component is a ring body, and the actuating nut is arranged in a ring on the ring body.
本發明的晶圓載台,其致動器為一氣壓缸或一電動缸。 The actuator of the wafer carrier of the present invention is a pneumatic cylinder or an electric cylinder.
本發明的晶圓載台,其座體與被動件之間連接有一彈性件,當致動器釋放被動件時,彈性件將座體與被動件回復至初始相對位置。彈性件驅動各夾爪旋轉使各爪部朝向夾具的旋轉中心軸線相對移動。 In the wafer carrier of the present invention, an elastic member is connected between the base and the passive member. When the actuator releases the passive member, the elastic member returns the base and the passive member to their initial relative positions. The elastic member drives each clamping claw to rotate so that each claw portion moves relatively toward the rotation center axis of the clamp.
本發明的晶圓載台,其中致動機構驅動各夾爪旋轉使各爪部相對於夾具的旋轉中心軸線遠離移動。 In the wafer stage of the present invention, the actuating mechanism drives each clamping claw to rotate so that each claw part moves away from the rotation center axis of the clamp.
10:晶圓 10:wafer
100:夾具 100: Fixture
101:旋轉中心軸線 101:Rotation center axis
110:座體 110: base body
120:夾爪組 120: Clamp set
121:第一夾爪 121:First clamping jaw
121a:旋轉軸 121a:Rotation axis
121b:爪部 121b:Claw
121c:端面 121c: End face
121d:溝槽 121d:Trench
121e:柱體 121e:Cylinder
122:第二夾爪 122:Second clamping jaw
122a:旋轉軸 122a:Rotation axis
122b:爪部 122b:Claw
122c:端面 122c: End face
122d:溝槽 122d:Trench
122e:柱體 122e:Cylinder
130:連桿組件 130: Connecting rod assembly
131:第一搖臂 131:First rocker arm
132:第二搖臂 132:Second rocker arm
133:連桿 133:Connecting rod
200:旋轉機構 200: Rotating mechanism
210:旋轉馬達 210: Rotary motor
300:致動機構 300: Actuating mechanism
311:致動器 311: Actuator
312:被動件 312: Passive parts
321:致動螺母 321: Actuation nut
322:致動螺桿 322: Actuating screw
323:緊固螺母 323: Fastening nut
324:凸緣 324:Flange
圖1係本發明較佳實施例之晶圓載台其夾具開啟狀態之立體示意圖。 FIG. 1 is a schematic three-dimensional view of the wafer carrier with its clamp in an open state according to the preferred embodiment of the present invention.
圖2係開啟狀態時夾具之立體示意圖。 Figure 2 is a three-dimensional schematic diagram of the clamp in the open state.
圖3係本發明較佳實施例之晶圓載台之立體分解示意圖。 FIG. 3 is an exploded three-dimensional view of the wafer carrier according to the preferred embodiment of the present invention.
圖4及圖5係本發明較佳實施例之晶圓載台其夾具開啟之動作示意圖。 4 and 5 are schematic diagrams of the opening of the clamp of the wafer carrier according to the preferred embodiment of the present invention.
圖6係關閉狀態時夾具之立體示意圖。 Figure 6 is a three-dimensional schematic diagram of the clamp in the closed state.
圖7及圖8係本發明較佳實施例之晶圓載台其夾具關閉之動作示意圖。 7 and 8 are schematic diagrams of the closing operation of the clamp of the wafer carrier according to the preferred embodiment of the present invention.
圖9係本發明較佳實施例之晶圓載台其夾具關閉狀態之立體示意圖。 FIG. 9 is a schematic three-dimensional view of the wafer carrier in a closed state with a clamp according to the preferred embodiment of the present invention.
參閱圖1至圖3,本發明的較佳實施例提供一種晶圓載台,其包含一夾具100、一旋轉機構200及一致動機構300。夾具100用於夾持一晶圓10,旋
轉機構200用於旋轉夾具100使晶圓10旋轉,致動機構300則用於致動夾具100開啟以釋放晶圓10。
Referring to FIGS. 1 to 3 , a preferred embodiment of the present invention provides a wafer stage, which includes a
於本實施例中,夾具100至少包含一座體110以及設置在座體110上的複數夾爪組120,且夾爪組120呈環狀排列。每一夾爪組120分別包含複數夾爪,且前述夾具100的每一夾爪皆具有樞接座體110的一旋轉軸121a/122a以及相對於旋轉軸121a/122a偏心配置的一爪部121b/122b。於本實施例中,該些夾爪立設於座體110且相互平行配置。具體而言,每一夾爪包含有立設於座體110的一柱體121e/122e,柱體121e/122e的一端延伸出前述的旋轉軸121a/122a以樞接座體110,柱體121e/122e另一端具有一端面121c/122c,夾爪的爪部121b/122b設置在此端面121c/122c上。
In this embodiment, the
於本實施例中,前述的夾爪組120對夾具100的旋轉中心軸線101呈環狀排列。每一夾爪組120的該些夾爪至少包含一第一夾爪121以及一第二夾爪122,夾具100的該些第一夾爪121配置呈一環列且該夾具100的該些第二夾爪122配置呈與該些第一夾爪121同心的另一環列。具體而言,前述夾具100中,該些第一夾爪121等長,該些第二夾爪122等長,各第二夾爪122長於各第一夾爪121,該些第二夾爪122同心環繞該些第一夾爪121。該些第一夾爪121及該些第二夾爪122分別用於夾持二種不同直徑大小的晶圓10。
In this embodiment, the
如圖7所示,於本實施例中,爪部121b/122b的側面設有鄰接該端面121c/122c的一溝槽121d/122d,當夾爪夾持晶圓10時,晶圓10的邊緣卡入溝槽121d/122d中且柱體121e/122e的端面121c/122c支撐在晶圓10的底面,夾具100藉此而夾持晶圓10。如圖4及圖5所示,當各夾爪以其旋轉軸121a/122a旋轉時,相對於旋轉軸121a/122a偏心配置的爪部121b/122b則以旋轉軸121a/122a為中心繞行,
因此能夠改變爪部121b/122b相對於夾爪的環狀排列中心之距離以開閉夾具100。具體而言,當使用第一夾爪121時,先旋轉各第一夾爪121使各第夾爪的爪部121b移動而遠離第一夾爪121的環列中心以容許對應直徑大小的晶圓10置入該些第一夾爪121之間,各第一夾爪121其柱體121e的端面121c支撐在晶圓10的底面。接著如圖7及圖8所示,反轉各第一夾爪121使各第夾爪的爪部121b向第一夾爪121的環列中心靠近使晶圓10的邊緣卡入各爪部121b的溝槽121d中而將晶圓10夾持固定。第二夾爪122的夾持方式如同第一夾爪121。
As shown in Figure 7, in this embodiment, a
如圖7及圖9所示,旋轉機構200至少包含有連接座體110的旋轉馬達210,且藉由旋轉馬達210能夠驅動夾具100的座體110旋轉,進而帶動該些夾爪及其夾持之晶圓10旋轉。
As shown in Figures 7 and 9, the
致動機構300至少包含一致動器311、一被動件312、對應各夾爪組120的複數致動螺母321以及對應各夾爪組120的複數致動螺桿322。於本實施例中,致動器311之形式可為氣壓缸或電動缸(線性致動器),但本發明不僅限於此,致動器311可以是其他可雙向直線作動或雙向擺動的之機械元件,致動器311作動時能夠觸動或釋放被動件312。致動螺母321設置在被動件312上,具體而言被動件312為一環體,因此該些致動螺母321可以對應環狀排列的該些夾爪組120而環狀列排於環體上。各致動螺母321之外壁設有凸緣324,各致動螺母321之外壁有外螺牙並且藉由外螺牙螺接一緊固螺母323。各致動螺母321貫穿插設在被動件312上,而且藉由凸緣324及緊固螺母323夾持被動件312而固定於被動件312上。各致動螺桿322分別螺接相對應的各致動螺母321且各致動螺桿322同軸連接相對應的夾爪組120的其中一夾爪,致動螺桿322較佳地連接於此夾爪
之旋轉軸121a。致動螺桿322及其對應螺接的致動螺母321能夠轉換致動螺桿322的旋轉動作及致動螺母321的線性位移。
The
如圖6及圖7所示,致動器311對應該被動件312配置且與被動件312分離而不連動;如圖2及圖4所示,致動器311作動時能夠沿致動螺桿322之軸向推移被動件312,藉此使得各致動螺母321沿著相螺接的致動螺桿322之軸向線性移動而驅動各致動螺桿322以其軸向為旋轉軸線而旋轉。因此,如圖4及圖5所示當致動器311推移被動件312時,各夾爪組120中與各致動螺桿322軸連接的夾爪被同時被驅動旋轉。
As shown in FIGS. 6 and 7 , the
如圖3所示,於本實施例中,每一夾爪組120的各夾爪以一連桿組件130相連動。因此,當夾爪組120的任一夾爪旋轉時,此夾爪組120的其他的各夾爪能夠藉由連桿組件130帶動而使此夾爪組120的所有夾爪同步旋轉。連桿組件130包含與對應的夾爪組120中的各夾爪相對應連接的複數搖臂以及連動該些搖臂的連桿133。於本實施例中,該些搖臂包含對應連接第一夾爪121的一第一搖臂131以及對應連接第二夾爪122的一第二搖臂132,而且連桿133分別樞接第一搖臂131以及第二搖臂132。
As shown in FIG. 3 , in this embodiment, the clamping jaws of each clamping
參閱圖4及圖5,於本實施例,當致動機構300將被動件312推向座體110時,被動件312上的各致動螺母321即驅動對應螺接的各致動螺桿322旋轉而驅動各夾爪旋轉,藉此使使各爪部121b相對於夾具100的旋轉中心軸線101遠離移動而將夾具100開啟。
Referring to FIGS. 4 and 5 , in this embodiment, when the
如圖6至圖9所示,座體110與被動件312之間連接有一彈性件330,當致動器311釋放被動件312時,彈性330件將座體110與被動件312回復至初始相對位置。也就是說,彈性件330將被動件312推離座體110,被動件312上
的各螺即驅動對應螺接的各致動螺桿322反轉而驅動各夾爪反轉,藉此使各爪部121b朝向夾具100的旋轉中心軸線101相對移動而將夾具100關閉。
As shown in FIGS. 6 to 9 , an
本發明的致動機構300包含致動器311以及分離配置在夾具100上的被動件312,因此使得致動器311之配置不受夾具100旋轉作之限制。而且,不同長度的夾爪藉由連桿組件130連動而同步作作動,當夾具100止時以致動器311推動被動件312即可驅動各夾爪作動,故不需對應各尺寸之夾爪分別配置致動器311。再者,對應不同直徑晶圓10的第一夾爪121及第二夾爪122長度相異,位於外側環列的第二夾爪122長於位於內側環列的第一夾爪121,第二夾爪122夾持大尺寸晶圓10時能避免對應小尺寸晶圓10的第一夾爪121干涉大尺寸晶圓10。
The
前述實施例以二種不同長度的第一夾爪121及第二夾爪122為例說明本明的晶圓載台如何適用二種不同尺寸的晶圓10。然而,各夾爪組120也可以增設更多不同長度的夾爪以適用更多不同尺寸的晶圓10,各長度的夾爪分列同心環列,且各列夾爪長於環列於其內側的夾爪且短於環列於其外側的夾爪而能夠避免干晶圓10。各夾爪組120中不同長度的夾爪藉由連桿組件130連動而同步開閉。而且,致動螺母321與致動螺桿322之間的動力傳動變化較穩定,更能夠避免不穩定的夾持動作損傷晶圓10。
The foregoing embodiments take the
以上所述僅為本發明之較佳實施例,非用以限定本發明之專利範圍,其他運用本發明之專利精神之等效變化,均應俱屬本發明之專利範圍。 The above descriptions are only preferred embodiments of the present invention and are not intended to limit the patent scope of the present invention. Other equivalent changes that apply the patent spirit of the present invention shall all fall within the patent scope of the present invention.
120:夾爪組 120: Clamp set
121:第一夾爪 121:First clamping jaw
121a:旋轉軸 121a:Rotation axis
121b:爪部 121b:Claw
121c:端面 121c: End face
121d:溝槽 121d:Trench
121e:柱體 121e:Cylinder
122:第二夾爪 122:Second clamping jaw
122a:旋轉軸 122a:Rotation axis
122b:爪部 122b:Claw
122c:端面 122c: End face
122d:溝槽 122d:Trench
122e:柱體 122e:Cylinder
130:連桿組件 130: Connecting rod assembly
131:第一搖臂 131:First rocker arm
132:第二搖臂 132:Second rocker arm
133:連桿 133:Connecting rod
300:致動機構 300: Actuating mechanism
311:致動器 311: Actuator
312:被動件 312: Passive parts
321:致動螺母 321: Actuation nut
322:致動螺桿 322: Actuating screw
323:緊固螺母 323: Fastening nut
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111111690A TWI812123B (en) | 2022-03-28 | 2022-03-28 | Wafer stage |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111111690A TWI812123B (en) | 2022-03-28 | 2022-03-28 | Wafer stage |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI812123B true TWI812123B (en) | 2023-08-11 |
TW202339101A TW202339101A (en) | 2023-10-01 |
Family
ID=88585580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111111690A TWI812123B (en) | 2022-03-28 | 2022-03-28 | Wafer stage |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI812123B (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM512211U (en) * | 2014-11-14 | 2015-11-11 | Ming-Sheng Chen | Substrate stage mechanism |
US20160141201A1 (en) * | 2014-11-14 | 2016-05-19 | Ebara Corporation | Substrate holding apparatus |
TW201703877A (en) * | 2015-03-30 | 2017-02-01 | Shibaura Mechatronics Corp | Rotation processing device suppressing the occurrence of dust and the positional deviation of the substrate in rotation |
US20180315624A1 (en) * | 2017-04-27 | 2018-11-01 | SCREEN Holdings Co., Ltd. | Substrate treating apparatus and substrate treating method |
US20200316742A1 (en) * | 2019-04-04 | 2020-10-08 | Ebara Corporation | Substrate support apparatus and substrate cleaning apparatus |
-
2022
- 2022-03-28 TW TW111111690A patent/TWI812123B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM512211U (en) * | 2014-11-14 | 2015-11-11 | Ming-Sheng Chen | Substrate stage mechanism |
US20160141201A1 (en) * | 2014-11-14 | 2016-05-19 | Ebara Corporation | Substrate holding apparatus |
TW201703877A (en) * | 2015-03-30 | 2017-02-01 | Shibaura Mechatronics Corp | Rotation processing device suppressing the occurrence of dust and the positional deviation of the substrate in rotation |
US20180315624A1 (en) * | 2017-04-27 | 2018-11-01 | SCREEN Holdings Co., Ltd. | Substrate treating apparatus and substrate treating method |
US20200316742A1 (en) * | 2019-04-04 | 2020-10-08 | Ebara Corporation | Substrate support apparatus and substrate cleaning apparatus |
Also Published As
Publication number | Publication date |
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TW202339101A (en) | 2023-10-01 |
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