TWI811664B - Vibration collection device - Google Patents

Vibration collection device Download PDF

Info

Publication number
TWI811664B
TWI811664B TW110113781A TW110113781A TWI811664B TW I811664 B TWI811664 B TW I811664B TW 110113781 A TW110113781 A TW 110113781A TW 110113781 A TW110113781 A TW 110113781A TW I811664 B TWI811664 B TW I811664B
Authority
TW
Taiwan
Prior art keywords
vibration
sensing unit
mass block
collecting device
vibration sensing
Prior art date
Application number
TW110113781A
Other languages
Chinese (zh)
Other versions
TW202210802A (en
Inventor
呂宏益
Original Assignee
皓博科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 皓博科技股份有限公司 filed Critical 皓博科技股份有限公司
Priority to CN202111055017.3A priority Critical patent/CN114184273A/en
Publication of TW202210802A publication Critical patent/TW202210802A/en
Application granted granted Critical
Publication of TWI811664B publication Critical patent/TWI811664B/en

Links

Images

Landscapes

  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Surgical Instruments (AREA)
  • Sorting Of Articles (AREA)
  • Fish Paste Products (AREA)

Abstract

The present invention provides a vibration collection device, comprising: a housing for contacting a vibration source and having a supporting part inside; a vibration sensing unit provided on the supporting part for sensing a vibration generated from the vibration source and transmitted through the supporting part to generate a vibration signal; and a mass provided between the housing and the vibration sensing unit, wherein the mass has a convex part to control the quality of the vibration signal.

Description

振動採集裝置 Vibration collection device

本發明涉及一種振動採集裝置,尤指一種可同時具備減少雜訊及提高訊號接收靈敏度之振動採集裝置。 The present invention relates to a vibration collection device, and in particular, to a vibration collection device that can simultaneously reduce noise and improve signal receiving sensitivity.

現有的壓電式振動感測器中,必須透過設置在其內部的質量塊(seismic mass)來獲得壓電訊號。例如,將感測器設置在待測物上,待測物之振動可傳遞至感測器內部之質量塊,使得質量塊因振動產生之機械能,可以經過壓電效應轉換為電能,並從中獲得壓電訊號。為了降低壓電訊號中的雜訊量,質量塊通常是整個貼附在壓電片上,這使得壓電片會因為質量塊太重而無法偵測到細微之振動,進而無法將現有的壓電式振動感測器加以活用至其他領域。 In existing piezoelectric vibration sensors, piezoelectric signals must be obtained through a seismic mass installed inside the sensor. For example, if a sensor is placed on the object to be measured, the vibration of the object to be measured can be transmitted to the mass block inside the sensor, so that the mechanical energy generated by the vibration of the mass block can be converted into electrical energy through the piezoelectric effect, and from there Obtain piezoelectric signals. In order to reduce the amount of noise in the piezoelectric signal, the mass block is usually completely attached to the piezoelectric sheet. This makes the piezoelectric sheet unable to detect subtle vibrations due to the mass block being too heavy, and thus the existing piezoelectric sheet cannot be used. Vibration sensors can be used in other fields.

因此,有必要提供一種新的振動採集裝置,以解決上述課題之其中之一。 Therefore, it is necessary to provide a new vibration collecting device to solve one of the above problems.

本發明之主要目的在於提供一種振動採集裝置,包括:殼體,用以接觸振動源,且內部具有支撐部;振動感測單元,設於該支撐部上,用以感 測該振動源所產生並經由該支撐部所傳遞之振動,以生成振動訊號;以及質量塊,設於該殼體與該振動感測單元之間,且具有凸部以控制該振動訊號之品質。 The main purpose of the present invention is to provide a vibration collecting device, which includes: a housing used to contact the vibration source and having a support part inside; a vibration sensing unit located on the support part for sensing Measure the vibration generated by the vibration source and transmitted through the support part to generate a vibration signal; and a mass block is provided between the housing and the vibration sensing unit and has a convex portion to control the quality of the vibration signal .

前述之振動採集裝置中,該質量塊藉由該凸部而部分接觸該振動感測單元。 In the aforementioned vibration collecting device, the mass block partially contacts the vibration sensing unit through the convex portion.

前述之振動採集裝置中,該凸部係接觸於該振動感測單元之邊緣。 In the aforementioned vibration collecting device, the convex portion is in contact with the edge of the vibration sensing unit.

前述之振動採集裝置中,該支撐部之設置位置係對應於該凸部,以使該振動感測單元之中央部位未受該凸部及該支撐部接觸而呈現自由狀態。 In the aforementioned vibration collecting device, the position of the supporting part is corresponding to the convex part, so that the central part of the vibration sensing unit is not in contact with the convex part and the supporting part and is in a free state.

前述之振動採集裝置中,該質量塊未接觸該振動感測單元。 In the aforementioned vibration collecting device, the mass block does not contact the vibration sensing unit.

前述之振動採集裝置中,該凸部為環形。 In the aforementioned vibration collecting device, the convex portion is annular.

前述之振動採集裝置中,該振動感測單元為圓形結構或多邊形結構(例如三角形結構、矩形結構)。 In the aforementioned vibration collection device, the vibration sensing unit is a circular structure or a polygonal structure (such as a triangular structure, a rectangular structure).

前述之振動採集裝置中,該振動感測單元為壓電材料所製成之感測器。 In the aforementioned vibration collecting device, the vibration sensing unit is a sensor made of piezoelectric material.

前述之振動採集裝置中,該振動為機械運動振動或聲音振動。 In the aforementioned vibration collecting device, the vibration is mechanical motion vibration or sound vibration.

前述之振動採集裝置中,更包括控制件,係穿設該殼體並連接該質量塊,用以移動該質量塊以控制該質量塊是否接觸該振動感測單元以及該質量塊接觸該振動感測單元之壓力大小。 The aforementioned vibration acquisition device further includes a control component that is passed through the housing and connected to the mass block for moving the mass block to control whether the mass block contacts the vibration sensing unit and whether the mass block contacts the vibration sensor. Measure the pressure of the unit.

1:振動採集裝置 1: Vibration collection device

10:殼體 10: Shell

101:支撐部 101:Support part

11:振動感測單元 11:Vibration sensing unit

111:中央部位 111:Central part

12:質量塊 12: Mass block

121:凸部 121:convex part

13:控制件 13:Control parts

2:振動源 2: Vibration source

圖1為本發明之振動採集裝置之一實施例之剖面示意圖。 Figure 1 is a schematic cross-sectional view of an embodiment of the vibration collecting device of the present invention.

圖2為本發明之振動採集裝置之另一實施例之剖面示意圖。 Figure 2 is a schematic cross-sectional view of another embodiment of the vibration collecting device of the present invention.

圖3為本發明之振動採集裝置中振動感測單元及質量塊之立體分解圖。 Figure 3 is a three-dimensional exploded view of the vibration sensing unit and the mass block in the vibration collection device of the present invention.

以下藉由特定之具體實施例加以說明本發明之實施方式,而熟悉此技術之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點和功效,亦可藉由其他不同的具體實施例加以施行或應用。 The following describes the implementation of the present invention through specific embodiments, and those familiar with the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification, and can also use other different specific embodiments. carry out or apply.

請參閱圖1,其為本發明之振動採集裝置之一實施例之剖面示意圖。本發明之振動採集裝置1包括殼體10、振動感測單元11以及質量塊12。殼體10用以接觸振動源2,而殼體10具體為中空狀,其內部可具有支撐部101,例如殼體10在接觸振動源2之一表面的相對內表面上可設有支撐部101。 Please refer to FIG. 1 , which is a schematic cross-sectional view of an embodiment of the vibration collecting device of the present invention. The vibration collecting device 1 of the present invention includes a housing 10, a vibration sensing unit 11 and a mass block 12. The housing 10 is used to contact the vibration source 2, and the housing 10 is specifically hollow, and can have a support portion 101 inside. For example, the housing 10 can have a support portion 101 on the opposite inner surface of one surface that contacts the vibration source 2. .

振動感測單元11可設於支撐部101上,用以感測振動源2所產生並經由支撐部101所傳遞之振動,而質量塊12可設於殼體10與振動感測單元11之間。具體而言,在圖1之實施例中,質量塊12可具有凸部121,並藉由凸部121而部分接觸振動感測單元11,例如,如圖3所示,質量塊12可為圓形,且凸部121為環形,且振動感測單元11為可對應該環形的圓形結構,使得凸部121可部分接觸振動感測單元11之邊緣。另外,支撐部101之設置位置亦可對應凸部121,例如支撐部101亦可為環形,以使得振動感測單元11之中央部位111未受凸部121及支撐部101接觸而呈現自由狀態。如此一來,當殼體10接觸振動源2時,振動源2所產生之振動經由支撐部101傳遞至振動感測單元11及質量塊12,使得質量塊12因振動產生之機械能可藉由所接觸之振動感測單元11之部分而轉換成電能,進而產生一第一訊號。另外,振動感測單元之中央部位111因未受凸部121及支撐 部101所接觸,故在振動源2所產生之振動傳遞至振動感測單元11時,中央部位111會因為振動而會上下運動,進而產生一第二訊號。此時第一訊號及第二訊號即可分別作為不同之振動訊號加以輸出,或是組合成單一之振動訊號來加以輸出。 The vibration sensing unit 11 can be disposed on the support part 101 to sense the vibration generated by the vibration source 2 and transmitted through the support part 101 , and the mass block 12 can be disposed between the housing 10 and the vibration sensing unit 11 . Specifically, in the embodiment of FIG. 1 , the mass block 12 may have a convex portion 121 , and partially contacts the vibration sensing unit 11 through the convex portion 121 . For example, as shown in FIG. 3 , the mass block 12 may be circular. shape, and the convex portion 121 is annular, and the vibration sensing unit 11 has a circular structure that can correspond to the annular shape, so that the convex portion 121 can partially contact the edge of the vibration sensing unit 11 . In addition, the position of the supporting part 101 may also correspond to the convex part 121. For example, the supporting part 101 may also be annular, so that the central part 111 of the vibration sensing unit 11 is not contacted by the convex part 121 and the supporting part 101 and is in a free state. In this way, when the housing 10 contacts the vibration source 2, the vibration generated by the vibration source 2 is transmitted to the vibration sensing unit 11 and the mass 12 through the support part 101, so that the mechanical energy generated by the vibration of the mass 12 can be transmitted through The contacted part of the vibration sensing unit 11 is converted into electrical energy, thereby generating a first signal. In addition, the central part 111 of the vibration sensing unit is not supported by the convex part 121 and The central part 111 is in contact with the part 101, so when the vibration generated by the vibration source 2 is transmitted to the vibration sensing unit 11, the central part 111 will move up and down due to the vibration, thereby generating a second signal. At this time, the first signal and the second signal can be outputted as different vibration signals respectively, or combined into a single vibration signal for output.

於一實施例中,質量塊12可為除了圓形以外之形狀,例如三角形、正方形或多邊形,而凸部121則可為相對應之三角環形、正方環形或多邊環形結構,而振動感測單元11及支撐部101亦可為相對應之結構(例如為三角形結構、矩形結構等多邊形結構),以與凸部121對接,但本發明並不以此為限。 In one embodiment, the mass block 12 can be in a shape other than a circle, such as a triangle, a square or a polygon, and the convex portion 121 can be a corresponding triangular ring, square ring or polygonal ring structure, and the vibration sensing unit 11 and the supporting portion 101 can also be corresponding structures (for example, polygonal structures such as triangular structures, rectangular structures, etc.) to connect with the protruding portions 121, but the invention is not limited thereto.

請參閱圖2,其為本發明之振動採集裝置之另一實施例之剖面示意圖。與前述之實施例相較,本實施例之不同處在於質量塊12未接觸振動感測單元11。雖然質量塊12未接觸振動感測單元11,但是振動源2所產生之振動仍可經由支撐部101傳遞至振動感測單元11,使得振動感測單元11之中央部位111會因為振動而會上下運動,進而產生振動訊號。 Please refer to FIG. 2 , which is a schematic cross-sectional view of another embodiment of the vibration collecting device of the present invention. Compared with the previous embodiment, the difference of this embodiment is that the mass block 12 does not contact the vibration sensing unit 11 . Although the mass 12 does not contact the vibration sensing unit 11, the vibration generated by the vibration source 2 can still be transmitted to the vibration sensing unit 11 through the support part 101, so that the central part 111 of the vibration sensing unit 11 will move up and down due to the vibration. Movement, thereby generating vibration signals.

圖2之實施例與圖1之實施例皆因為振動感測單元11之中央部位111呈現自由狀態,而可具備有較靈敏之感測能力,而圖1之實施例可將質量塊12部分接觸振動感測單元11,更可具備減少接收雜訊之功效。 Both the embodiment of FIG. 2 and the embodiment of FIG. 1 can have a more sensitive sensing capability because the central part 111 of the vibration sensing unit 11 is in a free state. The embodiment of FIG. 1 can partially contact the mass block 12 The vibration sensing unit 11 can also have the effect of reducing received noise.

請同時參閱圖1及圖2,本發明之振動採集裝置1更包括控制件13,控制件13穿設殼體10並連接質量塊12,且可用以移動質量塊12,例如,控制件13可控制質量塊12接觸振動感測單元11(如圖1所示),亦可控制質量塊12未接觸振動感測單元11(如圖2所示),甚至可在質量塊12接觸振動感測單元11時控制質量塊12接觸振動感測單元11之壓力大小,以控制雜訊之減少量以及所 生成之振動訊號之品質。於一實施例中,使用者可根據需求來操作該控制件13以得到不同品質之振動訊號。 Please refer to Figure 1 and Figure 2 at the same time. The vibration collecting device 1 of the present invention further includes a control member 13. The control member 13 passes through the housing 10 and is connected to the mass block 12, and can be used to move the mass block 12. For example, the control member 13 can The mass block 12 can be controlled to contact the vibration sensing unit 11 (as shown in Figure 1), or the mass block 12 can be controlled not to contact the vibration sensing unit 11 (as shown in Figure 2), or even the mass block 12 can contact the vibration sensing unit. At 11 o'clock, the pressure of the mass block 12 contacting the vibration sensing unit 11 is controlled to control the reduction of noise and the The quality of the vibration signal generated. In one embodiment, the user can operate the control member 13 according to needs to obtain vibration signals of different qualities.

於一實施例中,振動感測單元11可為壓電材料(晶體或陶瓷)所製成之感測器,但本發明並不以此為限。 In one embodiment, the vibration sensing unit 11 may be a sensor made of piezoelectric material (crystal or ceramic), but the invention is not limited thereto.

於一實施例中,振動源2所產生之振動可為機械運動振動或聲音振動,使用者可將本發明之振動採集裝置1直接貼附在所欲偵測之位置,例如物品上,或是音響、喇叭之出聲處等等,並可將本發明之振動採集裝置1所輸出之振動訊號轉換成如物品之振動頻率或聲音之振動頻率等易於使用者判讀之顯示模式。 In one embodiment, the vibration generated by the vibration source 2 can be mechanical motion vibration or sound vibration. The user can directly attach the vibration collection device 1 of the present invention to the desired detection location, such as an object, or The sound source of speakers and speakers, etc., can convert the vibration signal output by the vibration collecting device 1 of the present invention into a display mode that is easy for the user to interpret, such as the vibration frequency of an object or the vibration frequency of sound.

綜上所述,藉由本發明之振動採集裝置中振動感測單元與質量塊之間的結構設計,可使振動感測單元之中央部位呈現自由狀態而可具備較為靈敏之感測能力,並可藉由質量塊部分接觸振動感測單元而可具備減少接收雜訊之效果。因此,本發明之振動採集裝置不僅可偵測一般機械振動之外,亦可偵測如聲音、脈搏、心率等細微之振動,而可擴大應用領域。 To sum up, through the structural design between the vibration sensing unit and the mass block in the vibration collection device of the present invention, the central part of the vibration sensing unit can be presented in a free state and have a more sensitive sensing capability, and can By partially contacting the vibration sensing unit with the mass block, the effect of receiving noise can be reduced. Therefore, the vibration collecting device of the present invention can not only detect general mechanical vibrations, but also detect subtle vibrations such as sound, pulse, heart rate, etc., thereby expanding the application field.

上述實施形態僅為例示性說明本發明之技術原理、特點及其功效,並非用以限制本發明之可實施範疇,任何熟習此技術之人士均可在不違背本發明之精神與範疇下,對上述實施形態進行修飾與改變。然任何運用本發明所教示內容而完成之等效修飾及改變,均仍應為下述之申請專利範圍所涵蓋。而本發明之權利保護範圍,應如下述之申請專利範圍所列。 The above embodiments are only for illustrating the technical principles, characteristics and effects of the present invention, and are not intended to limit the scope of the present invention. Anyone familiar with this technology can implement the present invention without violating the spirit and scope of the present invention. Modifications and changes are made to the above embodiments. However, any equivalent modifications and changes accomplished by applying the teachings of the present invention should still be covered by the following patent application scope. The scope of protection of the rights of the present invention shall be as listed in the following patent application scope.

1:振動採集裝置 1: Vibration collection device

10:殼體 10: Shell

101:支撐部 101:Support part

11:振動感測單元 11:Vibration sensing unit

111:中央部位 111:Central part

12:質量塊 12: Mass block

121:凸部 121:convex part

13:控制件 13:Control parts

2:振動源 2: Vibration source

Claims (9)

一種振動採集裝置,包括:殼體,用以接觸振動源,且內部具有支撐部;振動感測單元,設於該支撐部上,用以感測該振動源所產生並經由該支撐部所傳遞之振動,以生成振動訊號,其中,該振動為機械運動振動或聲音振動;以及質量塊,設於該殼體與該振動感測單元之間,且具有凸部以控制該振動訊號之品質。 A vibration collection device includes: a shell used to contact a vibration source and a support part inside; a vibration sensing unit provided on the support part to sense the vibration generated by the vibration source and transmitted through the support part The vibration is to generate a vibration signal, wherein the vibration is a mechanical motion vibration or a sound vibration; and a mass block is provided between the housing and the vibration sensing unit and has a convex portion to control the quality of the vibration signal. 如請求項1所述之振動採集裝置,其中,該質量塊藉由該凸部而部分接觸該振動感測單元。 The vibration collecting device according to claim 1, wherein the mass block partially contacts the vibration sensing unit through the convex portion. 如請求項2所述之振動採集裝置,其中,該凸部係接觸於該振動感測單元之邊緣。 The vibration collecting device according to claim 2, wherein the convex portion is in contact with an edge of the vibration sensing unit. 如請求項3所述之振動採集裝置,其中,該支撐部之設置位置係對應於該凸部,以使該振動感測單元之中央部位未受該凸部及該支撐部接觸而呈現自由狀態。 The vibration collecting device according to claim 3, wherein the position of the supporting part corresponds to the convex part, so that the central part of the vibration sensing unit is not in contact with the convex part and the supporting part and is in a free state. . 如請求項1所述之振動採集裝置,其中,該質量塊未接觸該振動感測單元。 The vibration collecting device according to claim 1, wherein the mass block does not contact the vibration sensing unit. 如請求項1所述之振動採集裝置,其中,該凸部為環形。 The vibration collecting device according to claim 1, wherein the convex portion is annular. 如請求項1所述之振動採集裝置,其中,該振動感測單元為圓形結構或多邊形結構。 The vibration collecting device according to claim 1, wherein the vibration sensing unit is a circular structure or a polygonal structure. 如請求項1所述之振動採集裝置,其中,該振動感測單元為壓電材料所製成之感測器。 The vibration collecting device according to claim 1, wherein the vibration sensing unit is a sensor made of piezoelectric material. 如請求項1所述之振動採集裝置,更包括控制件,係穿設該殼體並連接該質量塊,用以移動該質量塊以控制該質量塊是否接觸該振動感測單元以及該質量塊接觸該振動感測單元之壓力大小。 The vibration collecting device as described in claim 1, further comprising a control component that is inserted through the housing and connected to the mass block for moving the mass block to control whether the mass block contacts the vibration sensing unit and the mass block. The amount of pressure touching the vibration sensing unit.
TW110113781A 2020-09-14 2021-04-16 Vibration collection device TWI811664B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111055017.3A CN114184273A (en) 2020-09-14 2021-09-09 Vibration collection device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202063077763P 2020-09-14 2020-09-14
US63/077,763 2020-09-14

Publications (2)

Publication Number Publication Date
TW202210802A TW202210802A (en) 2022-03-16
TWI811664B true TWI811664B (en) 2023-08-11

Family

ID=81746831

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110113781A TWI811664B (en) 2020-09-14 2021-04-16 Vibration collection device

Country Status (1)

Country Link
TW (1) TWI811664B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200937477A (en) * 2007-11-22 2009-09-01 Panasonic Elec Works Co Ltd Infrared sensor switch
TWM562892U (en) * 2018-03-30 2018-07-01 研能科技股份有限公司 Gas detecting module

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200937477A (en) * 2007-11-22 2009-09-01 Panasonic Elec Works Co Ltd Infrared sensor switch
TWM562892U (en) * 2018-03-30 2018-07-01 研能科技股份有限公司 Gas detecting module

Also Published As

Publication number Publication date
TW202210802A (en) 2022-03-16

Similar Documents

Publication Publication Date Title
CN210609708U (en) MEMS microphone and electronic equipment
US20080231612A1 (en) Touch sensitive device employing bending wave vibration sensing and excitation transducers
RU2012110600A (en) TACTICAL USER INTERFACE FOR ELECTRONIC DEVICE
JPH0475045A (en) Coordinate input device
CN107911782B (en) Optical fiber microphone probe and optical fiber microphone system
WO2003019204A3 (en) Sensor for non-contacting electrostatic detector
US7826310B2 (en) Acoustic navigation device and method of detecting movement of a navigation device
Liu et al. Realization of a composite MEMS hydrophone without left-right ambiguity
GB2235533A (en) Piezoelectric sensor device
TWI811664B (en) Vibration collection device
Zhang et al. Low-frequency optical fiber Fabry-Perot acoustic sensor based on all-phase cross-correlation demodulation
WO2003019203A8 (en) Sensor for non-contacting electrostatic detector
EP4102854A1 (en) Earphone and electronic device
WO2022000792A1 (en) Vibration sensor
CN212111478U (en) Piezoelectric acceleration sensor for integrated instrument
CN111735531A (en) Miniaturized MEMS capacitive composite co-vibration vector hydrophone
CN108260067B (en) A kind of vibrating member and sounding device for sounding device
CN213397350U (en) Vector hydrophone and vector hydrophone unit
CN213021930U (en) Miniaturized MEMS capacitive composite co-vibration vector hydrophone
CN208821089U (en) It is a kind of for detecting the U-shaped amplifier tube of sound wave
Xinjing et al. Low-cost, high-sensitivity hydrophone based on resonant air cavity
CN207763812U (en) A kind of compact optical fiber MEMS sound pressure sensors
JP2770488B2 (en) Semiconductor pressure gauge
Xu et al. AlN-on-SOI platform-based MEMS hydrophone with ultra-low operation frequency and ultra-high noise resolution
CN214250909U (en) Crack detection device