TWI809938B - Chip pressing device - Google Patents

Abstract

A chip pressing device is suitable for pressing a chip on a test body. It includes a supporting body, a pressing body, a clamping structure, and a clamping release structure. The pressing body is disposed on the supporting body and is in contact with the chip. The clamping structure is disposed on the support body and clamps the test body, so as to fix the position of the support body relative to the test body, and make the pressing body press the chip against the test body. The unlocking structure is disposed on the support body and is used for releasing the locking state of the locking structure and the testing body.

Description

Wafer pressing device

The invention relates to a wafer pressing device, in particular to a wafer pressing device for tightly pressing the wafer to be tested against a test body.

During the semiconductor manufacturing process, the chip (IC, chip) will be tested multiple times to ensure that the chip can operate normally. The test socket (Socket) for testing the chip will be set on the chip test equipment. The purpose of the test socket is to The wafer under test is positioned so that the electrical contact points on the wafer to be tested can be electrically connected with the test contact points, and subsequent electrical test items are performed.

The test seat of the traditional wafer testing equipment is all positioned on the test substrate. When the chip to be tested is placed on the test seat, the electrical contact point on the chip to be tested is in electrical contact with the test contact point on the test seat. Unstable, the chip to be tested must be pressed down to make the electrical contact point on the chip to be tested stable with the test contact point on the test seat. In the early stage of the electrical test of the chip, it will be used Fingers press down on the chip to be tested, but the electrical test of the chip will take a lot of time and has the disadvantage of labor-intensive. In addition, the force applied by the finger to press down is not stable, and it is easy to cause errors in the electrical test .

Although the lower pressing head can be set in the wafer test equipment, to use the lower pressing head to press the wafer to be tested during the test, to ensure that the electrical contact points on the wafer to be tested can be connected to the test contact points (probes) in the test socket. ) complete contact, and the lower indenter must continue to press the wafer to be tested during the entire test process, but the above-mentioned lower indenter and the corresponding moving structure will occupy a large amount of space in the wafer testing equipment, resulting in the test seat set on the wafer testing equipment The number is limited.

As can be seen from the above description, the current wafer testing technology has the following disadvantages:

1. The number of testing wafers is limited: Because the structure that can press down the wafer is very complicated at present, if a structure that can press down the wafer is set on the wafer inspection equipment, it will cause a large amount of space on the wafer inspection equipment to be occupied by the structure for pressing down the wafer, which will affect the measurement. Several seats are installed, and the problem that the number of wafers to be inspected is limited.

2. Easy to damage the chip: If you use your fingers to press down on the chip to be tested, while waiting for the electrical test of the chip (it usually takes 10 seconds to 30 seconds, or even longer), the force applied by the finger is not stable, and it is easy to make the electrode’s electric charge Sexual contact produces displacement, and metal wear is prone to occur and damage the wafer.

3. Inefficient testing: When fingers are used as a means for pressing down on the wafer, personnel cannot perform other tasks and can only wait quietly for the end of the wafer test. The efficiency of wafer testing is not good and has the disadvantage of consuming manpower.

Therefore, how to effectively simplify the structure for pressing down the wafer to be tested and to conduct the test in a manner that does not damage the wafer is an urgent goal for those skilled in the art.

In view of this, the object of the present invention is to provide a wafer pressing device.

The wafer pressing device is suitable for pressing a wafer to be tested on a test body.

The wafer pressing device includes a supporting body, a pressing body, a clamping structure, and a clamping structure.

The pressing body is arranged on the supporting body and is in contact with the wafer to be tested, and the engaging structure is arranged on the supporting body and is engaged with the testing body, so as to fix the position of the supporting body relative to the testing body, and make the The pressing main body presses the wafer to be tested against the testing main body, and the clamping release structure is arranged on the supporting main body for releasing the clamping state of the clamping structure and the testing main body.

Another technical means of the present invention is that the above-mentioned pressing body and the clamping structure are arranged on the same side of the supporting body, and the clamping structure includes a plurality of clamping fastening parts connected with the supporting body. The test The main body is provided with a plurality of recessed parts, and the plurality of fastening fastening parts respectively fasten the plurality of recessed parts.

Another technical means of the present invention is that the above-mentioned clamping structure further includes a plurality of clamping limiting parts connected with the supporting body, and the test body is further provided with a plurality of side parts, and the plurality of clamping limiting parts Do not abut the plural sides.

Yet another technical means of the present invention is that the above-mentioned plurality of fastening parts and the support body are spaced apart, and the plurality of fastening limit parts are respectively arranged between the plurality of fastening parts and the support body.

Yet another technical means of the present invention is that the above-mentioned release structure is used to bend the supporting body, so that the plurality of fastening fastening parts are separated from the plurality of recessed parts.

Another technical means of the present invention is that the above-mentioned clamping structure and the release structure are respectively arranged on opposite sides of the support body, and the release structure includes a plurality of release operations connected to the support body and arranged at intervals department.

Yet another technical means of the present invention is that the above-mentioned supporting body includes an elastic flat part, and at least one elastic adjustment part arranged on the elastic flat part, the pressing body, the engaging structure, and the releasing structure It is arranged on the elastic flat part.

Yet another technical means of the present invention is that the structure of the above-mentioned elastic adjustment part is selected from the protrusion provided on the elastic flat part and/or the opening provided on the elastic flat part.

Another technical means of the present invention is that the pressing main body includes a pressing buffer part connected with the supporting body, and a pressing extension part connected with the pressing buffer part.

Yet another technical measure of the present invention is that the above-mentioned pressing main body further includes an average pressing portion connected with the pressing extending portion.

The beneficial effect of the present invention is that the wafer pressing device fixes the supporting body on the testing body through the clamping structure, and there is no other pressing structure on the testing machine, which occupies the setting space of the machine. And the wafer pressing device can be separated from the test body by using the clamp release structure, so that the wafer to be tested can be separated from the test body.

The features and technical contents of the relevant patent applications of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. Before proceeding with the detailed description, it should be noted that like elements are denoted by the same reference numerals.

Referring to Fig. 1, Fig. 2, Fig. 3, and Fig. 4, it is a preferred embodiment of a wafer pressing device of the present invention, which is suitable for pressing a test object on a test body 31 (Socket). Chip A (IC, chip), wherein, the test body 31 is provided with a plurality of recessed parts 311 and a plurality of side parts 312, preferably, the test body 31 is arranged on a substrate 32, and the test body 31 includes an upper layer 313, a middle layer 314 connected to the upper layer 313, a lower layer 315 connected to the middle layer 314, the lower layer 315 is arranged on the substrate 32, a plurality of probes are arranged in the upper layer 313, the middle layer 314, and the lower layer 315 316, the upper layer 313 is provided with a guide portion 317, generally the guide portion 317 is a ceramic structure, the guide portion 317 is used to guide the position of the wafer A to be tested, because the test body 31 is a commonly used wafer The test structure will not be described in detail here, the plurality of side portions 312 are the sides of the test body 31 , and the plurality of depressions 311 are grooves disposed on the sides of the test body 31 .

The wafer pressing device includes a supporting body 41, a pressing main body 42, a clamping structure 43, and a clamping structure 44. In this preferred embodiment, the structure of the wafer pressing device is mainly composed of a metal plate Stamping, which has a simple structure and occupies a small volume. In actual implementation, the structure of the wafer pressing device can be integrally formed or a combined structure, and its material is selected from metal, plastic, rubber, glass fiber, composite materials, or It is other elastic structures and should not be limited to this.

The supporting body 41 includes an elastic flat part 411, and at least one elastic adjustment part 412 disposed on the elastic flat part 411, the pressing body 42, the engaging structure 43, and the releasing structure 44 are disposed on the elastic flat part 411, in this preferred embodiment, the elastic flat part 411 is provided with a plurality of elastic adjustment parts 412, and the structure of the plurality of elastic adjustment parts 412 is selected from the bumps and/or The opening provided on the elastic flat part 411, the protrusion provided on the elastic flat part 411 can enhance the rigidity of the elastic flat part 411 so that it is not easy to be bent, and the opening arranged on the elastic flat part 411 can make the elastic The reduced rigidity of the flat plate portion 411 makes it easier to be bent. In actual implementation, the elastic adjustment portion 412 can be other structures that can adjust the elastic flat portion 411. It should not be limited to this. In this preferred embodiment , the elastic adjustment part 412 of the protrusion is arranged on the elastic flat part 411 near the pressing body 42, so that the elastic flat part 411 near the pressing main body 42 is not easy to be bent, and the main purpose is to protect wafer, and the elastic adjustment part 412 of the opening is arranged on the elastic flat part 411 near the engaging structure 43, so that the elastic flat part 411 near the engaging structure 43 is easily bent by the releasing structure 44. In a preferred embodiment, the elastic adjustment portion 412 that presents an opening is an opening formed by metal stamping and forming the engaging structure 43 . In actual implementation, the shape and size of the opening can be customized and should not be limited thereto.

In addition, other equipment can be arranged above the wafer pressing device. For example, a mechanical arm can be installed on the wafer pressing device to automatically move and perform clamping and unclamping actions. A suction nozzle can also be provided above the device to suck the wafer A to be tested, so that the wafer A can be inserted or removed by using the wafer pressing device. Sensors, Display lights, or other structures or equipment, the added structures or elements can be arranged on the support body 41 of the wafer pressing device, or on the release structure 44 .

The pressing main body 42 is arranged on the supporting main body 41 and is in contact with the wafer A to be tested. The pressing main body 42 includes a pressing buffer part 421 connected with the elastic flat part 411 of the supporting main body 41, and a pressing buffer part 421 connected with the pressing main body 41. The pressing extension part 422 connected with the buffering part 421, and an average pressing part 423 connected with the pressing extending part 422, in this preferred embodiment, the pressing buffering part 421 is extended by the elastic plate part 411 The elastic plate can buffer the force pressed against the wafer A to be tested, so as to avoid the excessive force of pressing down the wafer A to be tested. The bottom of the average pressure applying part 423 is provided with a plane to abut against the upper surface of the wafer A to be tested. The main purpose of the average pressure part 423 is to evenly disperse the force of pressing down the wafer A to be tested, so as to avoid damaging the wafer A to be tested. In practice, the pressing body 42 may not be provided with the average pressure part. 423, and directly press against the wafer A to be tested by the contact part of the contact extension part 422, but it should not be limited thereto.

The clamping structure 43 is arranged on the support body 41 and clamped on the test body 31 to fix the position of the support body 41 relative to the test body 31, and make the pressing body 42 press the wafer A to be tested. Against the test body 31 , the pressing body 42 and the engaging structure 43 are arranged on the bottom side of the elastic flat part 411 of the supporting body 41 , and the engaging structure 43 includes a plurality of elastic flat parts connected to the supporting body 41 411 connected to the fastening fastening part 431, and a plurality of fastening limit parts 432 connected with the elastic plate part 411 of the support body 41, the structure of the multiple fastening fastening part 431 is a horizontal block protruding inward, The plurality of fastening fastening parts 431 buckle the plurality of concave parts 311 to fix the elastic flat part 411 above the test body 31 , and the inner sides of the plurality of snap-fit limiting parts 432 abut against the test body 31 respectively. The plurality of side parts 312 can be fixed in position so that the elastic flat part 411 will not shake left and right. In this preferred embodiment, the plurality of fastening fastening parts 431 are arranged at intervals from the supporting body 41, and the plurality of snap-fit limiting parts 432 are respectively arranged between the plurality of fastening fastening parts 431 and the supporting body 41. In practice, the setting positions of the fastening fastening parts 431 and the limiting parts 432 of the plurality of fastening fastenings should match the position of the test main body 31. Appearance, should not be limited to this.

The unlocking structure 44 is arranged on the supporting body 41, and is used to release the clamping state between the clamping structure 43 and the test body 31. The clamping structure 44 is used to bend the supporting body 41, so that the multiple clamping The fastening part 431 is separated from the plurality of recessed parts 311, the engaging structure 43 is arranged on the lower side of the supporting body 41, the releasing structure 44 is arranged on the upper side of the supporting body 41, and the releasing structure 44 includes a plurality of The main body 41 is connected to the card release operation part 441 arranged at intervals. In this preferred embodiment, the plurality of card release operation parts 441 are respectively arranged on the left and right sides of the elastic flat part 411 and extend upwardly. The unlocking structure 44 can be other structures for releasing the clamping state of the clamping structure 43, and should not be limited thereto. The plurality of unlocking operation parts 441 can provide the user's fingers to clamp inward to bend the elastic flat part 411 After the elastic flat part 411 is bent, the plurality of fastening parts 431 can be separated from the plurality of concave parts 311 of the test body 31, so that the wafer pressing device can leave the test body 31, and the wafer to be tested A can leave the test subject 31 .

Since the guide portion 317 of the general test body 31 is provided with a guide slope for guiding the position of the wafer A to be tested, when the wafer pressing device is arranged on the test body 31, the pressing body 42 will enter the guide part 317, and its position will also be guided to the top of the wafer A to be tested. When the plurality of fastening parts 431 respectively extend into the plurality of recessed parts 311, they will interact with the test body 31. interference, thereby fixing the position of the wafer pressing device on the test body 31 .

As can be seen from the above description, a wafer pressing device of the present invention does have the following effects:

1. The number of wafer tests can be increased: The structure of the wafer pressing device is mainly formed by stamping a metal plate. Its structure is simple and occupies a small volume. A plurality of test bodies 31 are provided, thereby increasing the number of wafer tests.

Two, can protect the chip: The structural length of the pressing extension part 422 matches the position where the wafer A to be tested is arranged on the test body 31, and the pressing buffer part 421 can buffer the downward force of the wafer A to be tested. When the average pressing part 423 When the wafer A to be tested is pressed, the downward pressure can be evenly distributed, so that the electrical contact point on the wafer A to be tested can be in complete contact with the probe 316 in the test body 31, and no displacement will occur. The wafer A to be tested is damaged.

3. It can improve the efficiency of electrical testing: The wafer pressing device replaces the traditional way of pressing down the wafer A to be tested with fingers, and manpower can be applied to other parts, for example, the wafer pressing device is installed on the wafer pressing device. When the wafer pressing device is installed on the test body 31, The operation of electrical testing can be automatically performed without wasting manpower in the process of electrical testing, and the efficiency of wafer electrical testing can be effectively improved.

In summary, the pressing body 42 can be pressed against the wafer A to be tested, and the engaging structure 43 can be engaged with the testing body 31 to fix the downward force of the pressing body 42 on the wafer A to be tested. amount, can make the electrical contact of the wafer A to be tested more complete, and will not damage the wafer A to be tested. In addition, the release structure 44 can provide the user to bend the pressing body 42 to The clamping structure 43 can be quickly disengaged from the wafer A to be tested, the wafer pressing device has a simple structure and is easy to operate, and does not occupy the space on the testing equipment, so the purpose of the present invention can indeed be achieved.

But what is described above is only a preferred embodiment of the present invention, and should not limit the scope of the present invention with this, that is, all simple equivalent changes and modifications made according to the patent scope of the present invention and the description of the invention , all still belong to the scope covered by the patent of the present invention.

A: Wafer to be tested

31: Test subject

311: depression

312: side part

313: upper layer

314: middle layer

315: lower layer

316: Probe

317: Guiding part

32: Substrate

41: Support body

411: elastic flat part

412:Elastic adjustment department

42: Press against the main body

421: Press against the buffer

422: pressed against the extension

423: Average pressure department

43: snap-in structure

431: Snap fastening part

432: snap-in limit part

44: Unlock the structure of the card

441:Unblock operation department

Fig. 1 is a schematic perspective view, which is a preferred embodiment of a wafer pressing device of the present invention, illustrating the three-dimensional appearance of the wafer pressing device installed on a test body; Fig. 2 is a schematic cross-sectional view illustrating a state in which the wafer pressing device is pressed against a wafer to be tested on the test body in the preferred embodiment; Fig. 3 is a schematic perspective view illustrating the three-dimensional appearance of the wafer pressing device in the preferred embodiment; and FIG. 4 is a schematic side view illustrating the side view of the wafer pressing device in the preferred embodiment.

41: Support body

411: elastic flat part

412:Elastic adjustment department

42: Press against the main body

421: Press against the buffer

422: pressed against the extension

423: Average pressure department

43: snap-in structure

431: Snap fastening part

432: snap-in limit part

44: Unlock the structure of the card

441:Unblock operation department

Claims (8)

A wafer pressing device is suitable for pressing against a wafer to be tested on a test body, the test body is provided with a plurality of depressions, which includes: a supporting body; a pressing body, which is arranged on the supporting body and connected with The wafer to be tested is in contact; a clamping structure is arranged on the supporting body and clamped to the testing body to fix the position of the supporting body relative to the testing body, and make the pressing body press the wafer to be tested against On the test body, the pressing body and the clamping structure are arranged on the same side of the supporting body, and the clamping structure includes a plurality of clamping fastening parts connected with the supporting body, and the multiple clamping fastening parts are respectively Buckle the plurality of depressions; a clamping release structure is provided on the supporting body for releasing the clamping state of the clamping structure and the test body, and the clamping structure is used for bending the supporting body so that the multiple The fastening part is disengaged from the plurality of recessed parts. The wafer pressing device as described in Claim 1, wherein the clamping structure further includes a plurality of clamping limiting parts connected to the supporting body, and the test body is further provided with a plurality of side parts, and the plurality of clamping limiting parts The portions abut against the plurality of side portions respectively. The wafer pressing device as described in Claim 2, wherein the plurality of fastening parts and the support body are spaced apart, and the plurality of fastening limit parts are respectively arranged between the plurality of fastening parts and the support body . The wafer pressing device as described in claim 1, wherein the clamping structure and the clamping release structure are respectively arranged on opposite sides of the support body, and the clamping release structure includes a plurality of clamping release structures connected to the support body and arranged at intervals operation department. The wafer pressing device according to claim 1, wherein the supporting body includes an elastic flat part, and at least one elastic adjustment part provided on the elastic flat part, the pressing main body, the engaging structure, and the releasing The structure is arranged on the elastic flat part. The wafer pressing device as claimed in claim 5, wherein the structure of the elastic adjustment part is selected from a protrusion provided on the elastic flat part and/or an opening provided on the elastic flat part. The wafer pressing device according to claim 1, wherein the pressing main body includes a pressing buffer part connected with the supporting body, and a pressing extension part connected with the pressing buffer part. The wafer pressing device as described in claim 7, wherein the pressing main body further includes an average pressing portion connected to the pressing extension portion.