TWI807749B - Bonding machine with horizontal correction function - Google Patents

Abstract

The present invention is a bonding machine with a horizontal correction function, which includes a first cavity, a second cavity, a pressing unit, a carrier, a plurality of level adjustment units and a plurality of distance measuring units. The first cavity is used for connecting with the second cavity to form a closed space therebetween. The pressing unit is arranged in the first cavity, and the carrier is arranged in the second cavity. The pressing unit faces the carrier and is used for bonding the substrates placed on the carrier. The leveling unit is arranged on the first cavity, and the distance measuring unit is arranged on the second cavity. The distance measuring unit is used for projecting a sensing beam to the pressing unit to measure the level of the pressing unit, and adjust the level of the pressing unit through the level adjusting unit.

Description

Bonding machine with horizontal correction function

The invention relates to a bonding machine with a level correction function, which can measure the level of the pressing unit during use and adjust the level of the pressing unit in real time.

The development of integrated circuit technology has matured, and the current electronic products are developing towards the trend of light, thin and small, high performance, high reliability and intelligence. The wafer in an electronic product has a significant impact on the performance of the electronic product, where the aforementioned performance is partly related to the thickness of the wafer. For example, thinner chips can improve heat dissipation efficiency, increase mechanical performance, improve electrical performance, and reduce package volume and weight.

In the semiconductor manufacturing process, the substrate thinning process, via hole etching process and back metallization process are usually performed on the backside (ie, the lower surface) of the wafer. However, during the substrate thinning process, when the thickness of the substrate is too thin (for example, less than or equal to 150 micrometers), the wafer may be broken or warped, thereby making the wafer unusable and reducing the yield of the wafer.

Therefore, before the substrate thinning process, the bonding process is performed first. The adhesive layer is mainly placed between the wafer and the carrier (for example, sapphire glass), and the laminated wafer and carrier are pressed through the pressing unit and the carrier, and the bonding of the wafer and the carrier is completed. After the substrate thinning process is completed, a debonding process is performed to separate the wafer from the carrier.

However, if the bonding unit and the carrier are not kept level during the bonding process, the bonding force of the bonding unit and the carrier to the wafer and the carrier may be uneven, resulting in The bonding layer between the substrate and the carrier has bonding bubbles and makes the total thickness variation (TTV) of the bonded wafer poor.

In order to solve the problems faced by the prior art, the present invention proposes a novel bonding machine with a level calibration function, which can measure the level of the pressing unit through a plurality of distance measuring units, and adjust the level of the pressing unit in real time according to the measurement results. The level between the pressing unit and the stage can be continuously maintained, and a uniform pressing force is applied to the first substrate and the second substrate between them, so as to avoid bonding bubbles between the first substrate and the second substrate.

An object of the present invention is to provide a bonding machine with a level correction function, which mainly includes a first cavity, a second cavity, a pressing unit, a carrier, a plurality of level adjustment units and a plurality of distance measurement units, wherein the first cavity is used to connect to the second cavity, and a closed space is formed between the two.

The pressing unit is connected to the first cavity, and the carrier is connected to the second cavity. The carrying surface of the stage is used for carrying the laminated first substrate and the second substrate, and the pressing unit faces the stage. The pressing unit can be used for displacement relative to the stage, and for pressing the first substrate and the second substrate on the stage to form a bonded substrate.

The distance measuring unit is arranged in the second cavity, and emits sensing light beams towards the pressing unit respectively. There can be three distance measuring units, and they are used to measure the distances of three points on the pressing unit that are not collinear. The level of the pressing unit can be judged by the distance difference between the three distance measuring units and the three non-collinear points on the pressing unit.

The level adjustment unit passes through the first cavity, wherein one end of the level adjustment unit is connected to the pressing unit, and the other end is located outside the first cavity and the closed space. When the pressing unit does not maintain water Normally, the pressing unit can be adjusted through the level adjustment unit located outside the confined space, so as to adjust the level of the pressing unit and the carrying surface of the carrier.

Specifically, the present invention can determine whether the pressing unit is maintained horizontally through the measurement result of the distance measuring unit, and adjust the level of the pressing unit in real time with the level adjusting unit. During the process of measuring and adjusting the level of the pressing unit, the closed space between the first cavity and the second cavity can maintain low pressure or vacuum to improve the accuracy of measuring and adjusting the level of the pressing unit. An object of the present invention is to provide a leveling method for a bonding machine platform, in which the leveling unit connected to the bonding unit is loosened in a low pressure or vacuum environment, so that the bonding unit is completely attached to the bearing surface of the carrier. The distance between the pressing unit and the pressing unit is measured through the three distance measuring units to reset the three distance measuring units to zero, and the horizontal adjustment unit is tightened to fix the position of the pressing unit.

Then the three distance measuring units can regularly measure the distance between the pressing unit and judge whether the pressing unit maintains a level through the measured distance difference. If it is judged that the pressing unit is not level, the level adjustment unit connected to the pressing unit can be released again, wherein the pressing unit will completely fit the bearing surface of the carrier, so that the pressing unit is horizontal to the bearing surface of the carrier.

Through the level calibration method described in the present invention, it is possible to continuously measure whether the pressing unit maintains the level during the bonding process. When the pressing unit is not level, it can be adjusted in real time through the level adjustment unit, which can effectively prevent bonding air bubbles between the first substrate and the second substrate.

In order to achieve the above object, the present invention proposes a bonding machine with a level correction function, comprising: a first cavity; a second cavity facing the first cavity, wherein the first cavity is used to connect the second cavity and form a closed space between the first cavity and the second cavity; a pressing unit is connected to the first cavity; a carrier is connected to the second cavity and includes a bearing surface facing the bonding A unit, wherein the supporting surface is used to carry a stacked first substrate and a second substrate; a plurality of horizontal adjustment units are arranged on the first cavity, and include an adjustment rod, wherein the adjustment rod passes through the first cavity and is connected to the pressing unit, and part of the adjustment rod is located outside the closed space, and forms an adjustment part on the first cavity; distance.

The present invention proposes a level calibration method for a bonding machine with a level calibration function, comprising: the first cavity is connected to the second cavity, and an airtight space is formed between the first cavity and the second cavity; the gas in the airtight space is drawn out, so that the airtight space is in a low-pressure state or a vacuum state; a plurality of level adjustment units are released, so that the pressing unit fits the bearing surface of the carrier; a plurality of distance measuring units measure the distance between the pressing unit and reset to zero; tighten the plurality of level adjustment units, and fix the pressing unit position; and a plurality of distance measuring units measure the distance from the pressing unit, and confirm whether the pressing unit is maintained horizontally.

In the bonding machine table with level correction function, the level adjustment unit includes a hanging rod connected to the pressing unit.

Said bonding machine with level correction function, wherein the level adjustment unit includes a housing, which is connected and fixed on the first cavity, while the adjustment rod and the suspension rod pass through the housing and the first cavity, and are connected to the pressing unit, wherein the adjustment rod and the suspension rod are respectively connected to the housing through a shaft seal unit.

In the bonding machine with level correction function, the adjustment lever includes a connecting part, a first elastic part and a first sleeve, one end of the connecting part is connected to the pressing unit, and the other end of the connecting part is connected to the adjusting part via the first elastic part, wherein the first sleeve is set outside the first elastic part, and one end of the first sleeve is connected to the pressing unit.

Said bonding machine with level correction function, wherein the distance measurement unit is a laser range finder.

In the bonding machine with horizontal correction function, the number of distance measuring units is three or more.

The bonding machine with horizontal correction function includes a pressing unit driver connected to the pressing unit, used to drive the pressing unit to approach or move away from the carrier, and use the pressing unit to press the first substrate and the second substrate carried by the carrier.

In the bonding machine table with horizontal correction function, a plurality of distance measuring units are located around the carrier.

In the bonding machine with horizontal correction function, the bonding unit includes a plurality of reflective parts corresponding to a plurality of distance measurement units, and the plurality of distance measurement units respectively project sensing beams to the plurality of reflective parts.

10: Bonding machine with horizontal correction function

111: the first cavity

112: confined space

113: Second cavity

121: The first substrate

123: Second substrate

13: Lamination unit

131:Plywood

133: Connection board

135: fixed rod body

137: Reflection Department

14: Alignment unit

15: Carrier

151: bearing surface

16: Air extraction motor

17: Horizontal adjustment unit

171: Adjustment lever

1711: Adjustment Department

1713: First elastic part

1715: connection part

1717: First sleeve

172: Shaft seal unit

173: hanging rod

1731: fixed end

1733: Second elastic part

1735: connection end

1737: Second sleeve

175: Shell

1761: First fixed unit

1763: Second fixed unit

18: Distance measurement unit

181: Processor

191: cavity driver

193:Pressing unit driver

L1: Sensing beam

[ FIG. 1 ] is a three-dimensional schematic view of an embodiment of a bonding machine with a horizontal correction function according to the present invention.

[ FIG. 2 ] is a schematic cross-sectional view of an embodiment of a bonding machine with a horizontal correction function according to the present invention.

[ FIG. 3 ] is a schematic partial cross-sectional view of an embodiment of a bonding machine with a horizontal correction function according to the present invention.

[ FIG. 4 ] is a top view of an embodiment of a stage and a distance measuring unit of a bonding machine with a horizontal correction function according to the present invention.

[ FIG. 5 ] is a three-dimensional schematic view of an embodiment of a bonding unit of a bonding machine with a horizontal correction function according to the present invention.

[ FIG. 6 ] is a flow chart of the steps of an embodiment of the level calibration method of the bonding machine of the present invention.

Please refer to FIG. 1 and FIG. 2 , which are respectively a schematic perspective view and a schematic cross-sectional view of an embodiment of a bonding machine with a horizontal correction function according to the present invention. As shown in the figure, the bonding machine 10 with a level correction function includes a first cavity 111, a second cavity 113, a pressing unit 13, a carrier 15, a plurality of level adjustment units 17 and a plurality of distance measurement units 18, wherein the first cavity 111 faces the second cavity 113, and the first cavity 111 can be displaced relative to the second cavity 113.

As shown in FIG. 2 , the pressing unit 13 is located in the first cavity 111 and connected to the first cavity 111 . The carrier 15 is located in the second cavity 113 and connected to the second cavity 113 . The carrying surface 151 of the stage 15 faces the pressing unit 13 . After the first cavity 111 is connected to the second cavity 113 , a closed space 112 is formed between them, and the pressing unit 13 and the stage 15 are located in the closed space 112 .

As shown in FIG. 1 , in an embodiment of the present invention, the first cavity 111 can be connected to a cavity driver 191 , wherein the cavity driver 191 is located outside the enclosed space 112 and connected to the first cavity 111 . The cavity driver 191 is used to drive the displacement of the first cavity 111 relative to the second cavity 113 , for example, the cavity driver 191 may be a linear actuator.

As shown in FIG. 3 , the first cavity 111 or the second cavity 113 can be provided with a suction motor 16, wherein the suction motor 16 is fluidly connected to the closed space 112, and is used to pump out the gas in the closed space 112 to reduce the pressure in the closed space 112, so that the closed space 112 maintains a vacuum or a low pressure state.

The carrying surface 151 of the stage 15 is used to carry a stacked first substrate 121 and a second substrate 123, for example, the first substrate 121 is a carrying substrate, and the second substrate 123 is a wafer, wherein the first substrate There is an adhesive layer between the board 121 and the second substrate 123 for bonding the first substrate 121 and the second substrate 123 .

As shown in FIG. 1 , the pressing unit driver 193 is located outside the closed space 112 and connected to the pressing unit 13 , for example, the pressing unit driver 193 may be a linear actuator. After the alignment of the first substrate 121 and the second substrate 123 is completed, the pressing unit driver 193 can drive the pressing unit 13 to approach the carrying surface 151 of the stage 15, and press the first substrate 121 and the second substrate 123 carried by the stage 15 to complete the bonding of the first substrate 121 and the second substrate 123.

As shown in FIG. 3 , the pressing unit 13 includes a pressing board 131 , a connecting board 133 and a plurality of fixing rods 135 , wherein the connecting board 133 is connected to the pressing board 131 through the fixing rods 135 . The pressing plate 131 faces the carrying surface 151 of the stage 15 and is used for pressing the first substrate 121 and the second substrate 123 placed on the stage 15 . The pressing unit 13 including the pressing plate 131 , the connecting plate 133 and the fixing rod 135 is only an embodiment of the present invention, and is not a limitation of the scope of the present invention.

A plurality of level adjustment units 17 are disposed on the first cavity 111 , wherein the level adjustment units 17 pass through the first cavity 111 and are connected to the pressing unit 13 in the enclosed space 112 . The horizontal adjustment unit 17 includes an adjustment rod 171 , wherein the adjustment rod 171 passes through the first cavity 111 and is connected to the pressing unit 13 .

The adjusting rod 171 may include an adjusting part 1711 and a connecting part 1715, wherein a part of the adjusting rod 171 is arranged on the first cavity 111 and is located outside the closed space 112 to form the adjusting part 1711 on the first cavity 111, and the part of the adjusting rod 171 located in the closed space 112 forms the connecting part 1715 and is used to connect the pressing unit 13. For example, a plurality of screw holes can be provided on the surface of the connecting plate 133 facing the first cavity 111 of the pressing unit 13 , and the connecting portion 1715 includes a screw and is screwed into the screw holes of the pressing unit 13 . When the user rotates the exposed adjustment lever 171, the connecting portion 1715 will also Rotate the pressing unit 13 and change the length of the connecting portion 1715 entering the screw hole to adjust the level of the pressing unit 13 .

In an embodiment of the present invention, the adjustment rod 171 may include a first elastic portion 1713 , wherein the connection portion 1715 is connected to the adjustment portion 1711 via the first elastic portion 1713 , for example, the first elastic portion 1713 may be a spring. When the length of the connecting portion 1715 entering the screw hole increases, the pressing unit 13 will displace upward or toward the first cavity 111 and compress the first elastic portion 1713 . When the length of the connecting portion 1715 entering the screw hole decreases, the pressing unit 13 will be displaced downward or away from the first cavity 111 , so that the first elastic portion 1713 is elongated. In addition, a first sleeve 1717 can be sleeved on the outside of the first elastic portion 1713 , wherein one end of the first sleeve 1717 is connected or fixed on the pressing unit 13 , and moves downward or upward along with the pressing unit 13 .

In another embodiment of the present invention, the level adjustment unit 17 may include a hanging rod 173 , wherein the hanging rod 173 passes through the first cavity 111 and is connected to the pressing unit 13 . The structure of the hanging rod 173 is similar to that of the adjusting rod 171, and includes a fixed end 1731 and a connecting end 1735, wherein the fixed end 1731 is the hanging rod 173 arranged outside the first cavity 111 and the closed space 112, while the connecting end 1735 is located in the closed space 112 and is used for connecting the pressing unit 13. In addition, a second elastic portion 1733 can be further provided between the fixed end 1731 and the connecting end 1735 , and a second sleeve 1737 can be sleeved outside the second elastic portion 1733 , wherein one end of the second sleeve 1737 is connected or fixed on the pressing unit 13 .

When the user adjusts the level of the pressing unit 13 through the adjusting rod 171 , the second elastic portion 1733 of the hanging rod 173 will also be compressed or stretched, and the second sleeve 1737 will also move downward or upward along with the pressing unit 13 . In addition, in an embodiment of the present invention, the connecting end 1735 of the hanging rod 173 can be fixed on the pressing unit 13 so that the hanging rod 173 will not rotate relative to the pressing unit 13 . In different embodiments, the hanging rod 173 can also be designed to be rotatable relative to the pressing unit 13 .

In addition, the horizontal adjustment unit 17 may include a housing 175 connected and fixed on the first cavity 111 , while the adjustment rod 171 and/or the hanging rod 173 passes through the housing 175 and the first cavity 111 , is fixed on the housing 175 , and is connected to the pressing unit 13 . For example, the adjustment rod 171 and/or the suspension rod 173 can be connected to the housing 175 via a shaft seal unit 172 and/or at least one bearing, so that the adjustment rod 171 and/or the suspension rod 173 can rotate relative to the housing 175 and the first cavity 111, and maintain the low pressure or vacuum state in the closed space 112.

Specifically, the adjusting part 1711 of the adjusting rod 171 and the fixed end 1731 of the hanging rod 173 can be respectively fixed on the housing 175 via a first fixing unit 1761 and a second fixing unit 1763, so that the adjusting rod 171 and/or the hanging rod 173 will not rotate relative to the housing 175 and/or the first cavity 111, and the height and level of the pressing unit 13 can be fixed. For example, the first and second fixing units 1761/1763 can be nuts .

As shown in FIG. 2 and FIG. 3 , a plurality of distance measuring units 18 are disposed on the second cavity 113 and facing the pressing unit 13 . Each distance measuring unit 18 respectively projects a sensing light beam L1 to the pressing unit 13 to measure the distance between the pressing unit 13 and each distance measuring unit 18 .

The distance measuring unit 18 of the present invention may be a laser range finder, preferably a high-precision laser range finder, for example, the distance measuring unit 18 may be a laser range finder using a triangulation measurement principle.

As shown in FIG. 4 , the number of distance measuring units 18 described in the present invention may be three or more, and they are arranged around the carrying platform 15 . For the convenience of description, three distance measurement units 18 are used for illustration in the embodiment of the present invention, and the number of distance measurement units 18 may be greater than three in actual application. The three distance measuring units 18 of the present invention are not arranged on the same straight line, And respectively project the sensing light beam L1 on three non-collinear measuring points of the pressing unit 13 or the pressing plate 131 .

In addition, in an embodiment of the present invention, a plurality of alignment units 14 can be disposed on the carrying surface 151 of the stage 15, wherein the plurality of alignment units 14 can be close to or far away from the first substrate 121 and the second substrate 123 on the stage 15, so that the second substrate 123 is aligned with the first substrate 121.

In an embodiment of the present invention, three distance measuring units 18 are equidistantly arranged around the carrier 15 . The equidistant arrangement of the three distance measurement units 18 is only one embodiment of the present invention, and in different embodiments, the three distance measurement units 18 may also be arranged in an unequal manner around the carrier 15 .

As shown in FIG. 2 , FIG. 3 and FIG. 5 , a plurality of reflecting parts 137 can be provided on the pressing unit 13 , for example, three reflecting parts 137 are arranged around the pressing plate 131 and protrude along the radial direction of the pressing plate 131 . The three reflecting parts 137 are not arranged on the same straight line, and correspond to the three distance measuring units 18 respectively, so that each distance measuring unit 18 can project the sensing light beam L1 to each reflecting part 137 respectively.

Specifically, the three distance measuring units 18 can respectively measure the distances to the three reflecting parts 137 or the three measuring points on the pressing board 131 . For example, the distances between the pressing unit 13 and the three distance measuring units 18 are measured as the first distance, the second distance and the third distance. If the first distance, the second distance and the third distance are equal, it means that the pressing unit 13 is horizontal.

The reflector 137 is not an essential component of the present invention, and the three distance measuring units 18 can directly project the sensing light beam L1 onto three non-collinear measuring points of the pressing plate 131 in practical application.

When the difference between the first distance, the second distance and/or the third distance is greater than a threshold value, it means that the pressing unit 13 is not level, and may cause the pressing unit 13 and the carrier 15 to the first substrate. The bonding force between the first substrate 121 and the second substrate 123 is not uniform, resulting in bonding bubbles in the adhesive layer between the first substrate 121 and the second substrate 123 .

In an embodiment of the present invention, the plurality of distance measuring units 18 can be electrically connected to a processor 181 or a computer. The processor 181 is configured to receive the distances measured by the distance measuring units 18 and calculate whether the difference between the distances is greater than a threshold. When the difference between any two distances is greater than the threshold value, the processor 181 can control a warning unit to issue a warning signal. For example, the warning unit can be a horn or a light emitting diode, and is used to generate sound or light to remind the user to adjust the level between the pressing unit 13 and the carrier 15.

As shown in FIG. 6, in order to apply the horizontal calibration method of the bonding machine 10 with the horizontal calibration function described in the embodiment of the present invention, please refer to FIG. 1 to FIG.

The air in the enclosed space 112 is pumped out through the air suction motor 16 , so that the enclosed space 112 is in a low-pressure state or a vacuum state, as shown in step 22 .

The pressing unit 13 is driven towards the stage 15 through the pressing unit driver 193 , and the pressing plate 131 of the pressing unit 13 contacts the carrying surface 151 of the stage 15 . Then release the horizontal adjustment unit 17 , for example, the first fixing unit 1761 and the second fixing unit 1763 , so that the pressing plate 131 is completely attached to the bearing surface 151 of the stage 15 , as shown in step 23 .

When performing the horizontal calibration method described in the embodiment of the present invention, no substrate is placed on the carrying surface 151 of the stage 15 . Therefore, after the horizontal adjustment unit 17 connecting the pressing unit 13 is loosened, the pressing plate 131 of the pressing unit 13 will completely fit the bearing surface 151 of the carrier 15, so that the pressing plate 131 is in contact with the carrier. The bearing surface 151 of the stage 15 is horizontal, for example, the pressing surface of the pressing plate 131 is parallel to the bearing surface 151 of the stage 15 .

In addition, when the airtight space 112 maintains a vacuum or a low pressure state, other substances or particles can be avoided between the pressing plate 131 and the bearing surface 151 of the carrier 15, which can further ensure that the pressing unit 13 is completely attached to the bearing surface 151 of the carrier 15, and improve the accuracy of the horizontal calibration of the pressing unit 13.

A plurality of distance measuring units 18 measure the distances to the pressing unit 13 and perform zero reset, as shown in step 24 . For example, when the lamination unit 13 is completely attached to the bearing surface 151 of the stage 15 , the distances of the lamination unit 13 measured by the plurality of distance measurement units 18 are defined as zero, so as to complete the zeroing correction of each distance measurement unit 18 .

After completing the zeroing of the plurality of distance measuring units 18 , the horizontal adjustment unit 17 can be tightened to fix the position of the pressing unit 13 , as shown in step 25 . In actual application, the order of step 24 and step 25 can be exchanged, for example, the pressing unit 13 is fixed first, and then the distance measuring unit 18 is reset to zero.

After step 25 is completed, the level adjustment and correction between the pressing unit 13 and the stage 15 has been completed. The first substrate 121 and the second substrate 123 can be stacked on the carrying surface 151 of the stage 15 , and the first substrate 121 and the second substrate 123 are pressed by the pressing unit 13 to perform bonding of the first substrate 121 and the second substrate 123 .

Specifically, the pressing unit 13 can move away from the stage 15 and rise to a position ready for bonding. Then the plurality of distance measuring units 18 can measure the distance between the pressing unit 13 again, and ensure that the level adjustment unit 17 has firmly fixed the pressing unit 13, so that the pressing unit 13 will not be unable to maintain the level or shake due to the vertical displacement. After determining that the pressing unit 13 has been fixed by the level adjustment unit 17 After being fixed, the first substrate 121 and the second substrate 123 can be placed between the pressing unit 13 and the stage 15 for bonding.

During the bonding process using the bonding machine 10 with a level correction function, a plurality of distance measuring units 18 will measure the distance to the pressing plate 131 of the pressing unit 13, and confirm whether the pressing unit 13 and the carrier 15 are level according to the measurement results, as shown in step 26.

In practical applications, the plurality of distance measuring units 18 can continuously measure the distance to the pressing unit 13 , and can also measure the distance to the pressing unit 13 within a fixed time period.

When the difference between the distances measured by any two of the distance measuring units 18 is greater than the threshold value, it means that the pressing unit 13 is not level with the stage 15, and the level of the pressing unit 13 needs to be adjusted, such as repeating steps 21 to 25.

What is described above is only one of the preferred embodiments of the present invention, and is not used to limit the scope of the present invention. That is, all equal changes and modifications made according to the shape, structure, characteristics and spirit described in the scope of the patent application of the present invention should be included in the scope of the patent application of the present invention.

10: Bonding machine with horizontal correction function

111: the first cavity

112: confined space

113: Second cavity

13: Lamination unit

137: Reflection Department

15: Carrier

17: Horizontal adjustment unit

18: Distance measurement unit

L1: Sensing beam

Claims (8)

A bonding machine with a horizontal correction function, comprising: a first cavity; a second cavity facing the first cavity, wherein the first cavity is used to connect the second cavity and form a closed space between the first cavity and the second cavity; a pressing unit is connected to the first cavity and is located in the closed space; a carrier is connected to the second cavity and is located in the closed space. A base plate and a second base plate; a plurality of horizontal adjustment units, arranged on the first cavity, and including an adjustment rod, wherein the adjustment rod passes through the first cavity, and is connected to the pressing unit, and a part of the adjustment rod is located outside the closed space, and forms an adjustment part on the first cavity, wherein the level adjustment unit includes a hanging rod, and the hanging rod is connected to the pressing unit; and a plurality of distance measuring units, arranged on the second cavity, and used to project a sensing beam to the pressing unit, to measure the distance between the pressing unit and the plurality of distance measuring units. The bonding machine with level correction function as described in Claim 1, wherein the level adjustment unit includes a housing, which is connected and fixed on the first cavity, and the adjustment rod and the suspension rod pass through the housing and the first cavity, and are connected to the pressing unit, wherein the adjustment rod and the suspension rod are respectively connected to the housing through a shaft seal unit. The bonding machine with horizontal calibration function as described in Claim 1, wherein the distance measuring unit is a laser rangefinder. The bonding machine with horizontal correction function as described in Claim 1, wherein the number of the distance measuring units is three or more. The bonding machine platform with horizontal correction function as described in claim 1, comprising a pressing unit driver connected to the pressing unit for driving the pressing unit to approach or move away from the carrier, and using the pressing unit to press the first substrate and the second substrate carried by the carrier. The bonding machine platform with horizontal calibration function as claimed in Claim 1, wherein the plurality of distance measuring units are located around the carrier. The bonding machine with horizontal calibration function as described in Claim 1, wherein the pressing unit includes a plurality of reflective parts corresponding to the plurality of distance measurement units, and the plurality of distance measurement units respectively project the sensing beams to the plurality of reflective parts. A bonding machine with a horizontal correction function, comprising: a first cavity; a second cavity facing the first cavity, wherein the first cavity is used to connect the second cavity and form a closed space between the first cavity and the second cavity; a pressing unit is connected to the first cavity and is located in the closed space; a carrier is connected to the second cavity and is located in the closed space. A base plate and a second base plate; a plurality of horizontal adjustment units, arranged on the first cavity, and including an adjustment rod, wherein the adjustment rod passes through the first cavity, and is connected to the pressing unit, and a part of the adjustment rod is located outside the closed space, and forms an adjustment part on the first cavity; and a plurality of distance measuring units, arranged on the second cavity, and used to project a sensing beam to the pressing unit to measure the distance between the pressing unit and the plurality of distance measuring units, wherein The adjusting rod includes a connecting portion, a first elastic portion and a first sleeve, one end of the connecting portion is connected to the pressing unit, and the other end of the connecting portion is connected to the adjusting portion through the first elastic portion, wherein the first sleeve is sleeved outside the first elastic portion, and one end of the first sleeve is connected to the pressing unit.

Images