TWI805387B - Soldering materials providing device, soldering system and automatic control method for blowing - Google Patents

Soldering materials providing device, soldering system and automatic control method for blowing Download PDF

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TWI805387B
TWI805387B TW111120313A TW111120313A TWI805387B TW I805387 B TWI805387 B TW I805387B TW 111120313 A TW111120313 A TW 111120313A TW 111120313 A TW111120313 A TW 111120313A TW I805387 B TWI805387 B TW I805387B
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solder
gas
pipe
welding
smoke
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TW111120313A
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TW202315694A (en
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陳鴻欣
丁仁峰
張晉綸
邱時雍
張耿寧
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台達電子工業股份有限公司
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Abstract

A soldering materials providing device, a soldering system and an automatic control method for blowing. The soldering materials providing device has a providing pipe for materials and gas as a gas internal flow channel and a casing. The providing pipe for materials and gas has a gas-providing pipe and a material-providing pipe. The casing covers the end of the providing pipe for materials and gas, and has an output opening to output the soldering materials and flowing gas. The providing pipe for materials and gas penetrates into the casing. The present disclosed can reduce a device volume, and effectively dissipate the smoke caused by soldering, thereby improving the soldering quality.

Description

焊料供應裝置、焊接系統及吹氣的自動控制方法Automatic control method of solder supply device, welding system and gas blowing

本發明係與裝置、系統與方法有關,特別有關於一種焊料供應裝置、焊接系統與吹氣的自動控制方法。The present invention is related to devices, systems and methods, in particular to a solder supply device, a welding system and an automatic control method for gas blowing.

為了提升去除金屬表面的氧化物來焊接品質,焊料中通常會添加松香或其他有機物質作為助焊劑。In order to improve the quality of soldering by removing oxides on the metal surface, rosin or other organic substances are usually added to the solder as flux.

然而,於焊接過程中,這些有機物質被加熱後會以煙霧形式散發,這些煙霧會對雷射儀、攝影機與測溫儀等焊接設備造成干擾。並且,操作人員若長期吸入這些有毒煙霧,會提高肺部病變之風險。However, during the welding process, these organic substances will be released in the form of smoke after being heated, and the smoke will interfere with welding equipment such as lasers, cameras, and thermometers. Moreover, if the operator inhales these toxic fumes for a long time, the risk of lung disease will be increased.

為解決上述問題,現有的焊接設備是增設排煙裝置或吹氣裝置來驅散煙霧。然而,上述方式必須增設排煙裝置或吹氣裝置,在狹小的焊接空間中增加干擾焊接的風險。In order to solve the above problems, existing welding equipment is to add a smoke exhaust device or an air blowing device to disperse the smoke. However, in the above method, a smoke exhaust device or an air blowing device must be added, which increases the risk of interfering with welding in a narrow welding space.

是以,現有焊接設備存在上述問題,而亟待更有效的方案被提出。Therefore, the existing welding equipment has the above-mentioned problems, and a more effective solution is urgently needed to be proposed.

本發明之主要目的,係在於提供一種焊料供應裝置、焊接系統與吹氣的自動控制方法,可使用同一裝置來供應焊料與吹氣。The main purpose of the present invention is to provide a solder supply device, a welding system and an automatic control method for blowing gas, so that the same device can be used for supplying solder and blowing gas.

於一實施例中,一種焊料供應裝置,包含一料氣供應管及一殼體。該料氣供應管包含一供料管及一供氣管,該供料管用以運輸一焊料並連接供應該焊料的一供料裝置,該供氣管用以運輸流動氣體,並連接供應該流動氣體的一供氣裝置。該料氣供應管為一同軸管,該供料管為該同軸管的一內管,該供氣管為該同軸管的一外管,該外管與該內管間的一間隙形成一流動氣體運輸通道,並且該流動氣體運輸通道環繞該內管的外圍。該殼體包覆該料氣供應管的末端,該殼體開設有一出口來輸出該焊料及該流動氣體,該料氣供應管從該殼體所開設的一入口穿入該殼體的內部。In one embodiment, a solder supply device includes a gas supply tube and a casing. The material gas supply pipe includes a material supply pipe and a gas supply pipe, the material supply pipe is used to transport a solder and is connected to a supply device that supplies the solder, the gas supply pipe is used to transport the flowing gas, and is connected to a device that supplies the flowing gas A gas supply device. The material gas supply pipe is a coaxial pipe, the feed pipe is an inner pipe of the coaxial pipe, the gas supply pipe is an outer pipe of the coaxial pipe, and a gap between the outer pipe and the inner pipe forms a flowing gas transport channel, and the flowing gas transport channel surrounds the periphery of the inner tube. The shell covers the end of the material gas supply pipe, and the shell is provided with an outlet to output the solder and the flowing gas, and the material gas supply pipe penetrates into the inside of the housing from an inlet provided by the case.

於一實施例中,一種焊料供應裝置,包含一料氣供應管及一殼體。該料氣供應管包含一供料管及一供氣管,該供料管用以運輸一焊料並連接供應該焊料的一供料裝置,該供氣管用以運輸流動氣體,並連接供應該流動氣體的一供氣裝置。該殼體包覆該料氣供應管的末端,該殼體開設有一出口來輸出該焊料及該流動氣體,該料氣供應管從該殼體所開設的一入口穿入該殼體的內部,其中該供氣管在該殼體外的管壁厚度大於在該殼體內的管壁厚度。In one embodiment, a solder supply device includes a gas supply tube and a casing. The material gas supply pipe includes a material supply pipe and a gas supply pipe, the material supply pipe is used to transport a solder and is connected to a supply device that supplies the solder, the gas supply pipe is used to transport the flowing gas, and is connected to a device that supplies the flowing gas A gas supply device. The housing covers the end of the material gas supply pipe, and the housing is provided with an outlet to output the solder and the flowing gas, and the material gas supply pipe penetrates into the interior of the housing from an inlet provided by the housing, Wherein the wall thickness of the gas supply pipe outside the shell is greater than the wall thickness inside the shell.

於一實施例中,一種焊接系統,包含:如上所述的焊料供應裝置、一煙霧感測裝置、一燒焊裝置、一供料裝置、一供氣裝置及連接該煙霧感測裝置、該燒焊裝置、該供料裝置及該供氣裝置的一控制裝置。該焊料供應裝置用來提供該焊料至一焊接位置。該煙霧感測裝置用以感測一煙霧濃度。該燒焊裝置用以對該焊接位置進行加熱。該供料裝置,連接該焊料供應裝置的該供料管,用來供應該焊料。該供氣裝置連接該焊料供應裝置的該供氣管,用來供應該流動氣體。該控制裝置被設定來於該煙霧濃度符合一排煙條件時,控制該供氣裝置輸送該流動氣體,以使該流動氣體從該焊料供應裝置的該出口排出來驅散煙霧。In one embodiment, a welding system includes: the above-mentioned solder supply device, a smoke sensing device, a welding device, a material supply device, a gas supply device and connected to the smoke sensing device, the burner A control device for the welding device, the feeding device and the gas supply device. The solder supply device is used to supply the solder to a soldering position. The smoke sensing device is used for sensing a smoke concentration. The welding device is used for heating the welding position. The feeding device is connected to the feeding tube of the solder supply device, and is used to supply the solder. The gas supply device is connected to the gas supply pipe of the solder supply device for supplying the flowing gas. The control device is set to control the air supply device to deliver the flow gas when the smoke concentration meets a smoke exhaust condition, so that the flow gas is discharged from the outlet of the solder supply device to disperse the smoke.

於一實施例中,一種吹氣的自動控制方法,應用於一焊接系統,該焊接系統包含如上所述的焊料供應裝置,包含:a) 透過該焊料供應裝置來對一焊接位置提供該焊料;b) 對該焊接位置進行加熱以熔化該焊料;c) 感測一煙霧濃度;及,d) 於該煙霧濃度符合一排煙條件時,透過該焊料供應裝置輸出該流動氣體,來降低該煙霧濃度。In one embodiment, an automatic control method of air blowing is applied to a welding system, the welding system includes the above-mentioned solder supply device, including: a) providing the solder to a welding position through the solder supply device; b) heating the soldering location to melt the solder; c) sensing a smoke level; and, d) outputting the flowing gas through the solder supply device to reduce the smoke when the smoke level meets a smoke exhaust condition concentration.

本發明透過將供應焊料與吹氣整合於同一裝置,能降低裝置體積,並能有效驅散焊接造成的煙霧,進而提升焊接品質。The present invention can reduce the volume of the device by integrating the solder supply and air blowing into the same device, and can effectively disperse the smoke caused by welding, thereby improving the welding quality.

茲就本發明之一較佳實施例,配合圖式,詳細說明如後。A preferred embodiment of the present invention will be described in detail below in conjunction with the drawings.

請參閱圖1,為本發明一實施例的焊料供應裝置的架構圖。本發明提出一種具有氣體內流道的焊料供應裝置1,用來提供焊接用焊料17(如錫絲或其他材質的焊料)並吹氣來驅散煙霧。Please refer to FIG. 1 , which is a structural diagram of a solder supply device according to an embodiment of the present invention. The present invention proposes a solder supply device 1 with a gas inner channel for supplying solder 17 for soldering (such as tin wire or solder of other materials) and blowing air to disperse the smoke.

具體而言,焊料供應裝置1包含料氣供應管10與殼體13。料氣供應管10包含供料管11及供氣管12。Specifically, the solder supply device 1 includes a gas supply pipe 10 and a housing 13 . The feed gas supply pipe 10 includes a feed pipe 11 and a gas supply pipe 12 .

供料管11作為焊料17的運輸通道,連接供料裝置31(如圖3所示),並用來運輸該供料裝置31所提供的焊料17至焊料供應裝置1以進行焊接。The supply pipe 11 is used as a delivery channel for the solder 17 , connected to the supply device 31 (as shown in FIG. 3 ), and used to transport the solder 17 provided by the supply device 31 to the solder supply device 1 for soldering.

於一實施例中,供料管11的材質包含鐵氟龍。透過低摩擦係數的鐵氟龍內層,焊料17可以容易在供料管11中被推出或抽回。In one embodiment, the material of the supply tube 11 includes Teflon. Through the Teflon inner layer with low friction coefficient, the solder 17 can be easily pushed out or withdrawn in the supply tube 11 .

供氣管12作為氣體的運輸通道,連接供氣裝置32(如圖3所示),並用來運輸供氣裝置32所提供的流動氣體(如高壓氣體)至焊料供應裝置1以進行吹氣。The gas supply pipe 12 is used as a gas transport channel, connected to the gas supply device 32 (as shown in FIG. 3 ), and used to transport the flowing gas (such as high-pressure gas) provided by the gas supply device 32 to the solder supply device 1 for blowing.

殼體13包覆料氣供應管10的末端。殼體13開設有出口14與入口15。料氣供應管10(包含供料管11與供氣管12)從入口15穿入殼體13的內部。並且,於殼體13的內部,料氣供應管10可朝向出口14設置。藉此,當供料裝置31開始供料及/或供氣裝置32開始供氣時,焊料17與流動氣體將可從出口14被輸出。The shell 13 covers the end of the gas supply pipe 10 . The casing 13 defines an outlet 14 and an inlet 15 . The gas supply pipe 10 (including the gas supply pipe 11 and the gas supply pipe 12 ) penetrates into the housing 13 from the inlet 15 . Moreover, inside the casing 13 , the material gas supply pipe 10 may be disposed toward the outlet 14 . Thereby, when the material supply device 31 starts to supply material and/or the gas supply device 32 starts to supply gas, the solder 17 and the flowing gas can be output from the outlet 14 .

於一實施例中,供氣管15的末端開口在殼體13中並透過殼體13的內壁連通至出口14,這使得供氣管15末端排出的流動氣體可沿內壁流動至出口14,並驅散出口14周圍的煙霧。In one embodiment, the end of the gas supply pipe 15 is opened in the housing 13 and communicates with the outlet 14 through the inner wall of the housing 13, so that the flowing gas discharged from the end of the air supply pipe 15 can flow to the outlet 14 along the inner wall, and Dispel the smoke around exit 14.

於一實施例中,殼體13為筆形,其一端的截面積逐漸縮減來形成出口14(如圖1的左半部所示)。In one embodiment, the casing 13 is in the shape of a pen, and the cross-sectional area of one end thereof is gradually reduced to form the outlet 14 (as shown in the left half of FIG. 1 ).

於一實施例中,出口14的直徑大於焊料17的直徑。藉此出口14可允許同時輸出焊料17與氣體。舉例來說,當採用直徑為1 mm的錫絲作為焊料17時,出口14的直徑可設定為1.3 mm。In one embodiment, the diameter of the outlet 14 is larger than the diameter of the solder 17 . The outlet 14 thereby allows the output of the solder 17 and the gas at the same time. For example, when a tin wire with a diameter of 1 mm is used as the solder 17, the diameter of the outlet 14 can be set to 1.3 mm.

於一實施例中,如圖1所示,供料管11及供氣管12可以為同軸管。舉例來說,供料管11為內管,其內部空間18是作為焊料運輸通道。並且,供氣管12為外管,外管與內管之間的間隙16則是用來作為流動氣體運輸通道。In one embodiment, as shown in FIG. 1 , the feed pipe 11 and the air supply pipe 12 may be coaxial pipes. For example, the supply pipe 11 is an inner pipe, and the inner space 18 thereof is used as a channel for transporting solder. Moreover, the air supply pipe 12 is an outer pipe, and the gap 16 between the outer pipe and the inner pipe is used as a flow gas transport channel.

並且,供氣管12(外管)相比供料管11(內管),是具有更高強度與更低可撓性,藉以對內管提供保護。Moreover, the air supply pipe 12 (outer pipe) has higher strength and lower flexibility than the feed pipe 11 (inner pipe), so as to provide protection for the inner pipe.

並且,於殼體13外的至少部分管線中(如圖5所示焊料供應裝置1至三通接頭51之間的管線),供氣管12是完全包覆供料管11來保護內管的焊料17免於被撓彎。And, in at least part of the pipeline outside the housing 13 (the pipeline between the solder supply device 1 and the tee joint 51 as shown in FIG. 17 free from being bent.

於一實施例中,如圖1所示,於殼體13外部的供氣管12的管線是具有較厚的管壁厚度來提供足夠的保護,但於進入殼體13內部後,由於殼體13具有保護功能,供氣管12的管壁厚度可被降低來減少所占用體積。In one embodiment, as shown in FIG. 1 , the pipeline of the air supply pipe 12 outside the casing 13 has a thicker pipe wall thickness to provide sufficient protection, but after entering the inside of the casing 13, due to the casing 13 With a protective function, the wall thickness of the gas supply pipe 12 can be reduced to reduce the occupied volume.

於一實施例中,如圖1所示,供料管11於殼體13中的開口未被供氣管12包覆,即供料管11於殼體13中的長度可大於供氣管12於殼體13中的長度。In one embodiment, as shown in FIG. 1 , the opening of the feed pipe 11 in the housing 13 is not covered by the air supply pipe 12 , that is, the length of the feed pipe 11 in the housing 13 can be greater than that of the air supply pipe 12 in the housing. Body 13 in length.

具體而言,於殼體13內部,供氣管12的開口是設置在縮減處,而使得流動氣體可沿著縮減內壁從出口14排出。並且,供料管11的開口是延伸至出口14,而使得焊料17可直接從供氣管12的開口被擠出出口14,而不會被殼體16的內壁卡住。Specifically, inside the casing 13 , the opening of the gas supply pipe 12 is set at the narrowing position, so that the flowing gas can be discharged from the outlet 14 along the narrowing inner wall. Moreover, the opening of the supply pipe 11 extends to the outlet 14 , so that the solder 17 can be directly squeezed out of the outlet 14 from the opening of the air supply pipe 12 without being stuck by the inner wall of the housing 16 .

本發明透過以同軸管的方式來輸送焊料17與流動氣體,並將供料管11延伸至開口14,可避免高壓的流動氣體於管線或殼體13中吹歪焊料17,而造成焊料17或內壁受損。The present invention transports the solder 17 and the flowing gas in a coaxial tube, and extends the supply pipe 11 to the opening 14, so as to prevent the high-pressure flowing gas from blowing the solder 17 in the pipeline or the shell 13, causing the solder 17 or The inner wall is damaged.

請參閱圖2,為本發明一實施例的焊料供應裝置的架構圖。於圖2的實施例中,運輸焊料17的供料管11及運輸流動氣體的供氣管12是以不同管線從相同或不同的入口15穿設至殼體13,並透過相同的出口14來輸出焊料17與流動氣體。Please refer to FIG. 2 , which is a structural diagram of a solder supply device according to an embodiment of the present invention. In the embodiment of FIG. 2 , the feed pipe 11 for transporting the solder 17 and the gas supply pipe 12 for transporting the flowing gas are passed through the same or different inlets 15 to the housing 13 through different pipelines, and output through the same outlet 14 Solder 17 with flowing gas.

本發明透過將供應焊料與吹氣整合於同一裝置,能降低裝置體積,並能有效驅散焊接造成的煙霧,進而提升焊接品質。The present invention can reduce the volume of the device by integrating the solder supply and air blowing into the same device, and can effectively disperse the smoke caused by welding, thereby improving the welding quality.

於一實施例中,焊料供應裝置1可透過對現有供錫模組進行改裝來加以獲得。In one embodiment, the solder supply device 1 can be obtained by modifying an existing tin supply module.

舉例來說,如圖1所示,現有供錫模組僅有配置供料管12,本發明可將供錫模組的供料管12更換為前述同軸管,並可將同軸管中的內管連接至供料裝置31,將外管連接至供氣裝置32。For example, as shown in Figure 1, the existing tin supply module only has a feed tube 12. The present invention can replace the feed tube 12 of the tin supply module with the aforementioned coaxial tube, and can replace the inner tube in the coaxial tube. The tube is connected to a feeding device 31 and the outer tube is connected to an air supply device 32 .

於另一例子中,如圖2所示,供錫模組的供料管12不做變動,但本發明可於供錫模組上額外設至連接至供氣裝置32的供氣管12,來使供錫模組增添吹氣功能。In another example, as shown in FIG. 2, the feed pipe 12 of the tin supply module remains unchanged, but the present invention can be additionally provided with an air supply pipe 12 connected to the air supply device 32 on the tin supply module to Add air blowing function to the tin supply module.

本發明的焊料供應裝置1可透過改裝現有供錫模組來獲得,而可以大幅節省製造成本與製造時間。並且,本發明不須改變供錫模組的元件規格,可提供較低的系統複雜度。The solder supply device 1 of the present invention can be obtained by modifying an existing tin supply module, thereby greatly saving manufacturing cost and manufacturing time. Moreover, the present invention does not need to change the component specifications of the tin supply module, and can provide lower system complexity.

請一併參閱圖1至圖3,圖3為本發明一實施例的焊接系統的架構圖。本發明還提出一種焊接系統,可透過前述的焊料供應裝置1來執行焊接。並且,本發明的焊接系統可於焊接過程中感測煙霧濃度,並於煙霧濃度過高時執行吹氣來驅散煙霧。Please refer to FIG. 1 to FIG. 3 together. FIG. 3 is a structure diagram of a welding system according to an embodiment of the present invention. The present invention also proposes a soldering system, which can perform soldering through the aforementioned solder supply device 1 . Moreover, the welding system of the present invention can sense the smoke concentration during the welding process, and perform air blowing to disperse the smoke when the smoke concentration is too high.

具體而言,焊接系統可包含前述任一實施例的具有氣體內流道的焊料供應裝置1、供料裝置31、供氣裝置32、燒焊裝置33、煙霧感測裝置34與連接上述裝置的控制裝置30。Specifically, the welding system may include the solder supply device 1 with a gas inner flow channel, the material supply device 31, the gas supply device 32, the welding device 33, the smoke sensing device 34 and the connection between the above-mentioned devices. Control device 30 .

焊料供應裝置1受操作來使出口14移動至指定的焊接位置,並提供焊料17至焊接位置。焊料供應裝置1還可受操作來對焊接位置進行吹氣。The solder supply device 1 is operated to move the outlet 14 to a designated soldering position and supply solder 17 to the soldering position. The solder supply device 1 is also operable to blow air over the soldering site.

供料裝置31連接供料管11,並透過供料管11供應焊料17至焊料供應裝置1。於一實施例中,供料裝置31可為餵錫機,並於供料管11中推送或抽回錫絲。The supply device 31 is connected to the supply pipe 11 and supplies the solder 17 to the solder supply device 1 through the supply pipe 11 . In one embodiment, the feeding device 31 can be a tin feeder, and pushes or draws back the tin wire in the feeding tube 11 .

供氣裝置32連接供氣管12,並透過供氣管12供應流動氣體至焊料供應裝置1。供氣裝置32可包含分別用來提供不同類型的流動氣體的一或多個氣體源。The gas supply device 32 is connected to the gas supply pipe 12 and supplies flowing gas to the solder supply device 1 through the gas supply pipe 12 . The gas supply device 32 may include one or more gas sources for respectively providing different types of flowing gas.

舉例來說,供氣裝置32可包含高壓氣體源、高壓氮氣源、常溫高壓氣體源、高溫高壓氣體源、低溫高壓氣體源、常溫高壓氮氣源、高溫高壓氮氣源、低溫高壓氮氣源或其他高壓氣體源。高壓氣體源用來提供高壓氣體,高壓氮氣源用來提供高壓氮氣、常溫高壓氣體源用來提供常溫高壓氣體、高溫高壓氣體源用來提供高溫高壓氣體、低溫高壓氣體源用來提供低溫高壓氣體、常溫高壓氮氣源用來提供常溫高壓氮氣、高溫高壓氮氣源用來提供高溫高壓氮氣、低溫高壓氮氣源用來提供低溫高壓氮氣。For example, the gas supply device 32 may include a high-pressure gas source, a high-pressure nitrogen source, a normal temperature and high pressure gas source, a high temperature and high pressure gas source, a low temperature and high pressure gas source, a normal temperature and high pressure nitrogen source, a high temperature and high pressure nitrogen source, a low temperature and high pressure nitrogen source or other high pressure gas source. High pressure gas source is used to provide high pressure gas, high pressure nitrogen source is used to provide high pressure nitrogen, normal temperature and high pressure gas source is used to provide normal temperature and high pressure gas, high temperature and high pressure gas source is used to provide high temperature and high pressure gas, low temperature and high pressure gas source is used to provide low temperature and high pressure gas 1. The normal temperature and high pressure nitrogen source is used to provide normal temperature and high pressure nitrogen, the high temperature and high pressure nitrogen source is used to provide high temperature and high pressure nitrogen, and the low temperature and high pressure nitrogen source is used to provide low temperature and high pressure nitrogen.

於一實施例中,本發明可針對焊接中不同用途,使用上述不同性質的流動氣體。舉例來說,常溫氣體可用來吹散焊接生成的煙霧,高溫氣體可用來對焊接目標40進行預熱,低溫氣體可用來冷卻焊接完成的焊點,氮氣氣體可避免氧化反應或其他化學反應等。In one embodiment, the present invention can use the above-mentioned flowing gases with different properties for different purposes in welding. For example, the normal temperature gas can be used to blow away the fumes generated by welding, the high temperature gas can be used to preheat the welding target 40 , the low temperature gas can be used to cool the solder joint after welding, and the nitrogen gas can avoid oxidation reaction or other chemical reactions.

於一實施例中,本發明可透過啟閉電閥(如圖5所示的電控閥52及/或電磁閥53)來切換氣體源進行供氣,並可控制所切換的氣體源的供氣壓力與供氣體積。In one embodiment, the present invention can switch the gas source for gas supply by opening and closing electric valves (such as the electric control valve 52 and/or solenoid valve 53 shown in FIG. 5 ), and can control the supply of the switched gas source. Air pressure and air volume.

燒焊裝置33用來對焊接目標40(如焊接位置的焊料17及/或焊盤)進行加熱來熔化焊料17,而使熔化的焊料17包覆焊盤與電子元件的接腳。燒焊裝置33可包含雷射焊接用的雷射模組、火焰焊接用的氣體焰模組、電弧焊接用的電弧模組或其他焊接類型的加熱模組。The soldering device 33 is used to heat the soldering target 40 (such as the solder 17 and/or the soldering pad at the soldering position) to melt the solder 17 , so that the melted solder 17 covers the soldering pad and the pin of the electronic component. The welding device 33 may include a laser module for laser welding, a gas flame module for flame welding, an arc module for arc welding or other welding heating modules.

煙霧感測裝置34用來感測焊接位置的煙霧濃度。The smoke sensing device 34 is used to sense the smoke concentration at the welding position.

於一實施例中,煙霧感測裝置34可包含用來感測煙霧濃度的煙霧探測器,煙霧探測器可為游離煙霧探測器或光電煙霧探測器,而可透過導電性或光遮蔽率來感測煙霧濃度。In one embodiment, the smoke sensing device 34 may include a smoke detector used to sense smoke concentration. Measure smoke concentration.

於一實施例中,煙霧感測裝置34可包含影像擷取裝置340(如圖5所示),影像擷取裝置340連接控制裝置30,並可拍攝焊接位置來獲得焊接影像。控制裝置30可透過電腦視覺來分析焊接影像來計算煙霧濃度。In one embodiment, the smoke sensing device 34 may include an image capture device 340 (as shown in FIG. 5 ). The image capture device 340 is connected to the control device 30 and can capture a welding position to obtain a welding image. The control device 30 can analyze the welding image through computer vision to calculate the smoke concentration.

控制裝置30用來控制焊接系統,並可控制焊接系統執行焊接及/或後述的吹氣的自動控制方法。The control device 30 is used to control the welding system, and can control the welding system to perform welding and/or an automatic control method of blowing gas described later.

於一實施例中,控制裝置30可被設定來於煙霧濃度符合預設的排煙條件時,控制供氣裝置32輸送流動氣體至焊料供應裝置1,來使流動氣體從焊料供應裝置1的出口排出來驅散煙霧。前述排煙條件可為煙霧濃度達到預設濃度、煙霧面積達到預設面積或預設百分比等。In one embodiment, the control device 30 can be set to control the gas supply device 32 to deliver the flow gas to the solder supply device 1 when the smoke concentration meets the preset smoke exhaust conditions, so that the flow gas flows from the outlet of the solder supply device 1 Exhaust to disperse fumes. The aforementioned smoke exhaust conditions may be that the smoke concentration reaches a preset concentration, the smoke area reaches a preset area or a preset percentage, and the like.

於一實施例中,控制裝置30可為工業電腦,並可包含處理器、輸入/輸出介面、網路介面、儲存器等電腦裝置。In one embodiment, the control device 30 can be an industrial computer, and can include computer devices such as a processor, an input/output interface, a network interface, and a storage.

請一併參閱圖1至圖4,圖4為本發明一實施例的控制裝置的架構圖。於圖4的實施例中,控制裝置30可包含處理器(圖未標示),處理器可包含模組300-304,這些模組300-304分別被設定來實做不同的功能。Please refer to FIG. 1 to FIG. 4 together. FIG. 4 is a structure diagram of a control device according to an embodiment of the present invention. In the embodiment of FIG. 4 , the control device 30 may include a processor (not shown in the figure), and the processor may include modules 300-304, and these modules 300-304 are respectively configured to implement different functions.

焊接控制模組300,用來控制焊接程序的進行。具體而言,於焊接程序中,焊接控制模組300可控制焊料供應裝置1的移動與供料,並可控制燒焊裝置33的加熱功率。The welding control module 300 is used to control the progress of the welding procedure. Specifically, during the welding process, the welding control module 300 can control the movement and supply of the solder supply device 1 , and can control the heating power of the soldering device 33 .

於一實施例中,焊接控制模組300可取得目前的焊接目標40的一或多個焊接參數,前述各焊接參數分別對應各焊接階段的加熱功率。In one embodiment, the welding control module 300 can obtain one or more welding parameters of the current welding target 40 , and each welding parameter corresponds to the heating power of each welding stage.

以三階段焊接為例,第一焊接階段的第一焊接功率可使焊接目標40穩定提升至接近熔點,第二焊接階段的第二焊接功率可使焊料17熔化,冷卻階段的冷卻功率則可使熔化焊料17冷卻成形。前述第二焊接功率可為最高,第一焊接功率次之,冷卻功率最低或為零。Taking the three-stage welding as an example, the first welding power in the first welding stage can make the welding target 40 steadily increase to close to the melting point, the second welding power in the second welding stage can melt the solder 17, and the cooling power in the cooling stage can make the The molten solder 17 is cooled and formed. The aforementioned second welding power may be the highest, followed by the first welding power, and the cooling power may be the lowest or zero.

預熱控制模組301,用來控制預熱程序的進行。具體而言,於焊接程序前,預熱程序被執行來將焊接目標40加熱至接近預設的工作溫度,來降低焊接目標40的溫差(如焊料17與焊盤的溫差),並減少焊接程序的加熱時間。於預熱程序,焊接控制模組300可控制焊料供應裝置1的移動與供料,並可以預設的預熱功率作為燒焊裝置33的加熱功率。The preheating control module 301 is used to control the progress of the preheating program. Specifically, before the soldering process, the preheating process is executed to heat the soldering target 40 to a preset operating temperature to reduce the temperature difference between the soldering target 40 (such as the temperature difference between the solder 17 and the pad), and reduce the soldering process. heating time. In the preheating process, the welding control module 300 can control the movement and supply of the solder supply device 1 , and can use the preset preheating power as the heating power of the soldering device 33 .

於一實施例中,焊接控制模組300可取得目前的焊接目標40的一或多個預熱參數,前述各預熱參數分別對應各預熱階段的加熱功率,即預熱功率。In one embodiment, the welding control module 300 can obtain one or more preheating parameters of the current welding target 40 , and each of the aforementioned preheating parameters corresponds to the heating power of each preheating stage, ie, the preheating power.

於一實施例中,前述預熱功率是低於前述焊接功率,並高於冷卻功率。In one embodiment, the aforementioned preheating power is lower than the aforementioned welding power and higher than the cooling power.

吹氣控制模組302,用來控制不同的氣體源之間的切換,來使焊料供應裝置1基於不同預設條件吹出不同類型的流動氣體。吹氣控制模組302還可控制提供流動氣體的供氣壓力、供氣體積、供氣時間等參數。The gas blowing control module 302 is used to control switching between different gas sources, so that the solder supply device 1 can blow out different types of flowing gas based on different preset conditions. The air blowing control module 302 can also control parameters such as air supply pressure, air supply volume, and air supply time of the flowing gas.

煙霧分析模組303,分析煙霧濃度,並可判斷煙霧濃度是否達到排煙條件。The smoke analysis module 303 analyzes the smoke concentration and can determine whether the smoke concentration meets the smoke exhaust condition.

於一實施例中,當煙霧感測裝置34包含煙霧探測器時,煙霧分析模組303可取得煙霧探測器的感測值來計算煙霧濃度。In one embodiment, when the smoke sensing device 34 includes a smoke detector, the smoke analysis module 303 can obtain the sensing value of the smoke detector to calculate the smoke concentration.

於一實施例中,當煙霧感測裝置34包含影像擷取裝置340時,煙霧分析模組303可取得影像擷取裝置340所拍攝的焊接影像,並透過分析焊接影像來計算煙霧濃度。In one embodiment, when the smoke sensing device 34 includes the image capture device 340 , the smoke analysis module 303 can obtain the welding image captured by the image capture device 340 , and calculate the smoke concentration by analyzing the welding image.

前述模組300-303是相互連接(可為電性連接與資訊連接),並可為硬體模組(例如是電子電路模組、積體電路模組、SoC等等)、軟體模組(例如是韌體、作業系統或應用程式)或軟硬體模組混搭,不加以限定。The aforementioned modules 300-303 are connected to each other (which may be electrical connection and information connection), and may be hardware modules (such as electronic circuit modules, integrated circuit modules, SoC, etc.), software modules ( For example, firmware, operating system, or application program) or a mix of software and hardware modules, without limitation.

值得一提的是,當前述模組300-303為軟體模組(例如是韌體、作業系統或應用程式)時,控制裝置30的儲存器(圖未標示)可包含非暫態電腦可讀取記錄媒體(圖未標示),前述非暫態電腦可讀取記錄媒體儲存有電腦程式,電腦程式記錄有電腦可執行之程式碼,當控制裝置30的處理器執行前述程式碼後,可實做對應模組300-303之功能。It is worth mentioning that when the aforementioned modules 300-303 are software modules (such as firmware, operating system or application program), the storage (not shown) of the control device 30 may include non-transitory computer-readable Take the recording medium (not shown in the figure), the above-mentioned non-transitory computer-readable recording medium stores a computer program, and the computer program records a computer-executable program code. After the processor of the control device 30 executes the aforementioned program code, it can realize Do the functions corresponding to modules 300-303.

請參閱圖1至圖5,圖5為本發明一實施例的焊接系統的架構圖。圖5的實施例中,焊接系統為結合電腦視覺的雷射燒焊系統。Please refer to FIG. 1 to FIG. 5 . FIG. 5 is a structure diagram of a welding system according to an embodiment of the present invention. In the embodiment of Fig. 5, the welding system is a laser welding system combined with computer vision.

燒焊裝置33可包含雷射模組330與雷射光路331(如雷射鏡頭)。雷射模組330可受控制裝置30控制來發射雷射光L1至雷射光路331,並透過雷射光路331折射及/或反射雷射光L2至焊接目標40所在的焊接位置,以進行雷射燒焊。The welding device 33 may include a laser module 330 and a laser optical path 331 (such as a laser lens). The laser module 330 can be controlled by the control device 30 to emit the laser light L1 to the laser light path 331, and refract and/or reflect the laser light L2 through the laser light path 331 to the welding position where the welding target 40 is located for laser burning. weld.

焊接目標40可包含電路印刷版(PCB)41上的焊盤、欲焊接至電路印刷版41的電子元件與焊料供應裝置1擠出的焊料17。焊料供應裝置1可為錫槍,焊料17可為錫絲。The soldering target 40 may include pads on a printed circuit board (PCB) 41 , electronic components to be soldered to the printed circuit board 41 and the solder 17 extruded by the solder supply device 1 . The solder supply device 1 can be a tin gun, and the solder 17 can be tin wire.

煙霧感測裝置34包含影像擷取裝置340。影像擷取裝置340包括光學鏡頭與影像感測器,可將從焊接位置來的可見光Im1轉換為影像訊號Im2,並發送影像訊號Im2至煙霧分析模組303作為焊接影像,來透過電腦視覺分析焊接影像的煙霧濃度。The smoke sensing device 34 includes an image capturing device 340 . The image capture device 340 includes an optical lens and an image sensor, which can convert the visible light Im1 from the welding position into an image signal Im2, and send the image signal Im2 to the smoke analysis module 303 as a welding image to analyze the welding through computer vision The smoke density of the image.

於一實施例中,雷射模組330、雷射光路331與影像擷取裝置340可設置在同一承載台50,並透過分光結構的設置來實現雷射光路與影像擷取光路的同軸。前述分光結構可將紅外線波長的雷射光L1、L2導引至焊接位置,並將可見光波長的可見光Im1導引至影像擷取裝置340。In one embodiment, the laser module 330 , the laser optical path 331 and the image capture device 340 can be set on the same platform 50 , and the coaxiality of the laser optical path and the image capture optical path can be realized through the arrangement of the light splitting structure. The aforementioned light splitting structure can guide the laser light L1 and L2 of infrared wavelength to the welding position, and guide the visible light Im1 of visible light wavelength to the image capture device 340 .

於一實施例中,焊接系統可包含電性連接控制裝置30的移動裝置54,如機械手臂。移動裝置54連接焊料供應裝置1,用來移動焊料供應裝置1,使出口14對準焊接位置,而可將焊料17擠至焊接位置。In one embodiment, the welding system may include a moving device 54 , such as a robot arm, electrically connected to the control device 30 . The moving device 54 is connected to the solder supply device 1 and is used to move the solder supply device 1 so that the outlet 14 is aligned with the soldering position, so that the solder 17 can be squeezed to the soldering position.

更進一步地,焊接控制模組300可發出移動控制訊號C1(例如為機器人座標)至移動裝置54,來控制移動裝置54移動至指定位置/姿態。Furthermore, the welding control module 300 can send a movement control signal C1 (such as robot coordinates) to the mobile device 54 to control the mobile device 54 to move to a specified position/posture.

於一實施例中,焊料供應裝置1的料氣供應管10連接至三通接頭51。透過三通接頭51的分接,供料管11延伸連接至供料裝置31,供氣管12延伸連接至供氣裝置32。In one embodiment, the gas supply pipe 10 of the solder supply device 1 is connected to the tee joint 51 . Through the branching of the three-way joint 51 , the supply pipe 11 is extended and connected to the supply device 31 , and the air supply pipe 12 is extended and connected to the air supply device 32 .

供料裝置31連接控制裝置30,並可基於焊接控制模組300發出的出料控制訊號C4來提供焊料17至焊料供應裝置1,或從焊料供應裝置1抽回焊料。The supply device 31 is connected to the control device 30 , and can supply the solder 17 to the solder supply device 1 or withdraw solder from the solder supply device 1 based on the discharge control signal C4 sent by the solder control module 300 .

於一實施例中,供氣管12連接至電控閥52,並透過電控閥52連接至供氣裝置32。電控閥52連接控制裝置30,可例如為電控伺服比例閥,可基於吹氣控制模組302發出的比例控制訊號C2來調整管道中流動氣體的氣壓,來調整焊料供應裝置1的吹出的流動氣體的供氣壓力與供氣體積(壓力越大,單位時間流出的氣體體積越高)。In one embodiment, the air supply pipe 12 is connected to the electric control valve 52 and connected to the air supply device 32 through the electric control valve 52 . The electronically controlled valve 52 is connected to the control device 30, and may be, for example, an electronically controlled servo proportional valve, which can adjust the air pressure of the flowing gas in the pipeline based on the proportional control signal C2 sent by the air blowing control module 302 to adjust the blowing rate of the solder supply device 1. The gas supply pressure and gas supply volume of the flowing gas (the higher the pressure, the higher the gas volume flowing out per unit time).

具體而言,電控閥52是被設定來降低供氣壓力。本發明透過設置電控閥52來降低供氣壓力,可避免供氣壓力過大而導致焊接目標40降溫或吹壞焊接目標40,並可避免氣體的浪費。Specifically, the electronically controlled valve 52 is set to reduce the air supply pressure. The present invention reduces the gas supply pressure by setting the electric control valve 52 , which can prevent the welding target 40 from cooling down or blowing the welding target 40 due to excessive gas supply pressure, and avoid waste of gas.

於一實施例中,供氣裝置32可包括多個氣體源,如高壓氣體源320與高溫氣體源321。高壓氣體源320可用來提供高壓的流動氣體(如常溫高壓氣體),高溫氣體源321可用來提供高溫的流動氣體(如高溫氮氣)。In one embodiment, the gas supply device 32 may include multiple gas sources, such as a high-pressure gas source 320 and a high-temperature gas source 321 . The high-pressure gas source 320 can be used to provide high-pressure flowing gas (such as normal-temperature high-pressure gas), and the high-temperature gas source 321 can be used to provide high-temperature flowing gas (such as high-temperature nitrogen).

更進一步地,常溫高壓氣體可用來吹散煙霧,並可讓冷卻更加順暢,提高晶格形成品質。高溫氮氣可將焊接位置預熱,提高焊接穩定性。此外,由於氮氣為惰性氣體,可避免焊接程序中發生劇烈氧化現象。Furthermore, the normal temperature and high pressure gas can be used to blow away the smoke, and can make the cooling smoother and improve the quality of the crystal lattice formation. High-temperature nitrogen can preheat the welding position and improve welding stability. In addition, since nitrogen is an inert gas, severe oxidation during welding procedures can be avoided.

於一實施例中,焊接系統可包含連接控制裝置30的電磁閥53,電磁閥53連接多個氣體源,如高壓氣體源320與高溫氣體源321。電磁閥53可基於吹氣控制模組302的切換控制訊號C3來於多個氣體源之間進行切換,來使指定的氣體源接上供氣管12,來提供對應類型的流動氣體至焊料供應裝置1。吹氣控制模組302還可透過電磁閥53來控制供氣時間與供氣體積(供氣時間越長,流出的氣體體積越高)。In one embodiment, the welding system may include a solenoid valve 53 connected to the control device 30 , and the solenoid valve 53 is connected to multiple gas sources, such as a high-pressure gas source 320 and a high-temperature gas source 321 . The solenoid valve 53 can switch between multiple gas sources based on the switching control signal C3 of the blowing control module 302, so that the designated gas source is connected to the gas supply pipe 12 to provide the corresponding type of flowing gas to the solder supply device 1. The air blowing control module 302 can also control the air supply time and air supply volume through the solenoid valve 53 (the longer the air supply time, the higher the outflow air volume).

於一實施例中,電磁閥53包含至少三個開口與至少三種相位。三個開口分別連接高壓氣體源320、高溫氣體源321與供氣管12,三種相位分別對應兩種氣體源的供氣與不供氣三種狀態。In one embodiment, the solenoid valve 53 includes at least three openings and at least three phases. The three openings are respectively connected to the high-pressure gas source 320 , the high-temperature gas source 321 and the gas supply pipe 12 , and the three phases correspond to the gas supply and non-supply states of the two gas sources respectively.

於一實施例中,電磁閥53可為五口三位電磁閥,但不以此限定。In one embodiment, the solenoid valve 53 can be a five-port three-position solenoid valve, but it is not limited thereto.

於一實施例中,吹氣控制模組302被設定來於氣體加熱條件滿足時,控制控制電磁閥53切換至由高溫氣體源320提供高溫的流動氣體至焊料供應裝置1,於排煙條件滿足時控制電磁閥53切換至由高壓氣體源320提供高壓的流動氣體至焊料供應裝置1,於排煙條件與氣體加熱條件都不滿足時控制電磁閥53切換至停止提供所有種類的流動氣體至焊料供應裝置1。In one embodiment, the air blowing control module 302 is set to control the solenoid valve 53 to switch to the high temperature gas source 320 to provide high temperature flowing gas to the solder supply device 1 when the gas heating condition is met, and when the smoke exhaust condition is met When the control solenoid valve 53 is switched to provide high-pressure flow gas to the solder supply device 1 by the high-pressure gas source 320, the control solenoid valve 53 is switched to stop supplying all types of flow gas to the solder when the smoke exhaust condition and the gas heating condition are not satisfied. Supply device 1.

藉此,控制裝置30可控制移動裝置54移動焊料供應裝置1,控制供料裝置31提供焊料17至焊料供應裝置1,控制雷射模組330進行燒焊,並透過影像擷取裝置340與電腦視覺來偵測即時的煙霧濃度。In this way, the control device 30 can control the mobile device 54 to move the solder supply device 1, control the material supply device 31 to provide solder 17 to the solder supply device 1, control the laser module 330 to perform welding, and communicate with the computer through the image capture device 340 Visually detect the real-time smoke level.

並且,控制裝置30可依據即時的煙霧濃度,透過電磁閥53切換至高壓氣體源320來開始供應高壓的流動氣體,透過電控閥52的來調整流動氣體的供氣壓力,並透過焊料供應裝置1的出口14排出流動氣體來驅散煙霧並降低煙霧濃度。Moreover, the control device 30 can switch to the high-pressure gas source 320 through the solenoid valve 53 to start supplying high-pressure flowing gas according to the real-time smoke concentration, adjust the gas supply pressure of the flowing gas through the electric control valve 52, and use the solder supply device The outlet 14 of 1 discharges flowing gas to disperse smog and reduce the concentration of smog.

於一實施例中,本發明可依據不同的煙霧濃度設定不同的供氣壓力。具體而言,本發明可事先量測,在不同煙霧濃度下,於指定的供氣時間內讓煙霧濃度降低至預設濃度所需的供氣壓力,並據以設定各煙霧濃度的供氣壓力。In one embodiment, the present invention can set different air supply pressures according to different smoke concentrations. Specifically, the present invention can measure in advance the air supply pressure required to reduce the smoke concentration to a preset concentration within a specified air supply time under different smoke concentrations, and set the air supply pressure for each smoke concentration accordingly .

舉例來說,若以煙霧面積表示煙霧濃度,於煙霧面積分別為11.2 mm2、30 mm2、47 mm2時,1秒內讓煙霧面積下降至3.5 mm2所需的最小供氣壓力分別為0.2 bar、0.6 bar、0.8 bar。For example, if the smoke concentration is represented by the smoke area, when the smoke area is 11.2 mm2, 30 mm2, and 47 mm2, the minimum air supply pressure required to reduce the smoke area to 3.5 mm2 within 1 second is 0.2 bar, 0.6 bar, 0.8 bar.

更進一步地,透過上述資料可進一步算出最小供氣壓力與煙霧面積之間的回歸關係式,例如為:最小供氣壓力=0.0168*煙霧面積+0.0383。透過將不同的煙霧面積套入所獲得的回歸關係式,即可獲得對應的最小供氣壓力。Furthermore, the regression relationship between the minimum air supply pressure and the smoke area can be further calculated through the above data, for example: minimum air supply pressure=0.0168*smoke area+0.0383. By inserting different smoke areas into the obtained regression relationship, the corresponding minimum air supply pressure can be obtained.

前述回歸關係式的斜率(0.0168)即為供氣增益值,若煙霧面積低於預設面積(如3.5 mm2)則不供應流動氣體(供氣增益值為零)。The slope (0.0168) of the aforementioned regression relation is the gas supply gain value. If the smoke area is lower than the preset area (such as 3.5 mm2), no flowing gas will be supplied (the gas supply gain value is zero).

於一實施例中,控制裝置30還可依據不同的條件與狀況來設定不同的供氣時間,In one embodiment, the control device 30 can also set different air supply times according to different conditions and situations,

舉例來說,錫絲熔點為攝氏250度,本發明可事先量測預熱到攝氏200度(工作溫度)所需的高溫氮氣的吹氣時間(如10秒),並設定此時間為於預熱程序中的高溫氮氣的供氣時間。For example, the melting point of tin wire is 250 degrees Celsius. The present invention can measure in advance the blowing time (such as 10 seconds) of high-temperature nitrogen required for preheating to 200 degrees Celsius (working temperature), and set this time as Gas supply time of high temperature nitrogen in thermal program.

於另一例子中,本發明可事先量測從熔點溫度250度降低至室溫(如攝氏25度)所需的常溫高壓氣體的吹氣時間(如5秒),並設定此時間為於冷卻階段的常溫高壓氣體的供氣時間。In another example, the present invention can measure in advance the blowing time (such as 5 seconds) of normal-temperature high-pressure gas required for cooling down to room temperature (such as 25 degrees Celsius) from the melting point temperature of 250 degrees, and set this time as cooling The gas supply time of the normal temperature and high pressure gas in the stage.

請同時參閱圖1至圖6,圖6為本發明一實施例的焊接程序的流程圖。本發明還提出一種吹氣的自動控制方法,應用於前述任一實施例的焊接系統,焊接系統包含前述的具有氣體內流道的焊料供應裝置1。Please refer to FIG. 1 to FIG. 6 at the same time. FIG. 6 is a flowchart of a welding procedure according to an embodiment of the present invention. The present invention also proposes an automatic control method for blowing gas, which is applied to the welding system of any one of the aforementioned embodiments, and the welding system includes the aforementioned solder supply device 1 with a gas inner flow channel.

本發明的自動控制方法包含於焊接程序中執行的步驟S10-S15。The automatic control method of the present invention includes steps S10-S15 performed in the welding procedure.

步驟S10:焊接控制模組300透過焊料供應裝置1來對焊接位置提供焊料17。Step S10 : the welding control module 300 supplies the solder 17 to the welding position through the solder supply device 1 .

於一實施例中,焊接控制模組300可控制移動裝置54來移動焊料供應裝置1的出口14至焊接位置,並控制供料裝置31開始提供焊料17。In one embodiment, the welding control module 300 can control the moving device 54 to move the outlet 14 of the solder supply device 1 to the welding position, and control the supply device 31 to start supplying the solder 17 .

步驟S11:煙霧分析模組303透過煙霧感測裝置34開始持續地感測焊接位置的煙霧濃度。Step S11: The smoke analysis module 303 starts to continuously sense the smoke concentration at the welding position through the smoke sensing device 34 .

步驟S12:焊接控制模組300控制燒焊裝置33對焊接位置進行加熱以熔化焊料17來開始進行焊接。Step S12: The welding control module 300 controls the welding device 33 to heat the welding position to melt the solder 17 to start welding.

步驟S11與步驟S12可同時執行或先後執行,不加以限定。Step S11 and step S12 can be executed simultaneously or successively, without limitation.

步驟S13:吹氣控制模組302持續判斷當前的煙霧濃度是否符合排煙條件。Step S13: The air blowing control module 302 continues to judge whether the current smoke concentration meets the smoke exhaust conditions.

當煙霧感測裝置34為煙霧探測器時,排煙條件可為感測到的煙霧濃度超過預設濃度。When the smoke sensing device 34 is a smoke detector, the smoke exhaust condition may be that the sensed smoke concentration exceeds a preset concentration.

當煙霧感測裝置34為影像擷取裝置34時,可基於焊接影像計算煙霧面積或煙霧色差作為煙霧濃度。煙霧面積可透過計算煙霧影像的像素數量來加以獲得,煙霧色差可透過計算煙霧造成的像素差值來加以獲得。When the smoke sensing device 34 is an image capture device 34 , the smoke area or the color difference of the smoke can be calculated as the smoke concentration based on the welding image. The smoke area can be obtained by calculating the number of pixels of the smoke image, and the smoke color difference can be obtained by calculating the pixel difference caused by the smoke.

並且,排煙條件可為煙霧面積超過預設面積或畫面的預設百分比,或煙霧色差達到預設像素差值。Moreover, the smoke exhaust condition may be that the smoke area exceeds a preset area or a preset percentage of the screen, or the color difference of the smoke reaches a preset pixel difference.

若煙霧濃度符合排煙條件,則步驟S14被執行;否則,步驟S15被執行。If the smoke concentration meets the smoke exhaust condition, step S14 is executed; otherwise, step S15 is executed.

步驟S14:吹氣控制模組30透過焊料供應裝置1輸出流動氣體,來降低煙霧濃度。Step S14: The air blowing control module 30 outputs flowing air through the solder supply device 1 to reduce the smoke concentration.

於一實施例中,吹氣控制模組30可控制電磁閥53來切換至高壓氣體源320開始供氣,直到滿足設定的供氣時間後切換至停止供氣。並且,吹氣控制模組30可以所設定的供氣壓力控制電控閥52調整流動氣體的壓力。In one embodiment, the blowing control module 30 can control the solenoid valve 53 to switch to the high-pressure gas source 320 to start supplying gas, and switch to stop supplying gas after the set gas supply time is met. In addition, the air blowing control module 30 can control the electric control valve 52 to adjust the pressure of the flowing air with the set air supply pressure.

步驟S15:焊接控制模組300判斷焊接是否完成。Step S15: The welding control module 300 determines whether the welding is completed.

於一實施例中,焊接控制模組300可透過影像擷取裝置34所拍攝的焊接影像分析焊接是否完成。In one embodiment, the welding control module 300 can analyze whether the welding is completed through the welding image captured by the image capture device 34 .

於一實施例中,焊接控制模組300可於所有焊接階段(包括焊接階段與冷卻階段)結束後判定焊接完成。In one embodiment, the welding control module 300 can determine that the welding is completed after all the welding stages (including the welding stage and the cooling stage) are completed.

若焊接完成,則結束焊接程序。否則,繼續焊接,並且步驟S13被被再次執行。If the welding is completed, the welding procedure is ended. Otherwise, welding is continued, and step S13 is performed again.

藉此,本發明可自動完成焊接,並可於焊接過程中自動控制吹氣來驅散煙霧,而提升焊接品質。Thereby, the present invention can automatically complete the welding, and can automatically control the air blowing to disperse the smoke during the welding process, so as to improve the welding quality.

請參閱圖1至圖7,圖7為本發明一實施例的預熱程序的流程圖。本實施例的自動控制方法可於焊接程序(步驟S27)前執行初始設定(步驟S20)與預熱程序(步驟S21-S26)。Please refer to FIG. 1 to FIG. 7 . FIG. 7 is a flowchart of a preheating procedure according to an embodiment of the present invention. The automatic control method of this embodiment can execute the initial setting (step S20 ) and the preheating procedure (steps S21 - S26 ) before the welding procedure (step S27 ).

步驟S20:執行初始化設定。具體而言,焊接控制模組300可初始化焊接程序的焊接參數,焊接參數可例如為各階段的焊接功率與對應供氣種類、單次供氣時間與供氣壓力。Step S20: Execute initialization settings. Specifically, the welding control module 300 can initialize the welding parameters of the welding procedure. The welding parameters can be, for example, the welding power at each stage, the corresponding gas supply type, the single gas supply time, and the gas supply pressure.

並且,預熱控制模組301可初始化預熱程序的預熱參數,預熱參數可例如為預熱功率與對應供氣種類、單次供氣時間與供氣壓力。Moreover, the preheating control module 301 can initialize the preheating parameters of the preheating program, and the preheating parameters can be, for example, the preheating power and the corresponding air supply type, a single air supply time, and the air supply pressure.

步驟S21:預熱控制模組301判斷是否需要執行預熱程序,例如是判斷目前的焊接目標40是否需要預熱程序來提升焊接品質,或者是否用戶有設定要執行預熱程序。Step S21: The preheating control module 301 determines whether to execute the preheating procedure, for example, whether the current welding target 40 needs the preheating procedure to improve the welding quality, or whether the user has set to execute the preheating procedure.

若需要執行預熱程序,則執行步驟S22;否則,執行步驟S27。If it is necessary to execute the preheating program, execute step S22; otherwise, execute step S27.

步驟S22:吹氣控制模組302控制電磁閥53切換為由高溫氣體源321提供高溫的流動氣體至焊料供應裝置1。Step S22 : the air blowing control module 302 controls the electromagnetic valve 53 to switch to provide high temperature flowing gas from the high temperature gas source 321 to the solder supply device 1 .

步驟S23:預熱控制模組301控制燒焊裝置33以預熱功率來對焊接目標40進行預加熱,來提升焊接目標40至工作溫度。Step S23: The preheating control module 301 controls the welding device 33 to preheat the welding target 40 with the preheating power, so as to raise the welding target 40 to the working temperature.

值得一提的是,步驟S23並非本發明的必要步驟。於一實施例中,步驟S23可不被執行,而僅執行步驟S24-S25來透過吹出高溫的流動氣體實現預熱功能。It is worth mentioning that step S23 is not a necessary step of the present invention. In one embodiment, step S23 may not be executed, but only steps S24-S25 are executed to realize the preheating function by blowing out high-temperature flowing gas.

步驟S24:吹氣控制模組302判斷氣體加熱條件滿足。氣體加熱條件可例如為焊接目標40的溫度低於預熱目標溫度,或吹氣動作未完成等。Step S24: The gas blowing control module 302 judges that the gas heating condition is satisfied. The gas heating condition may be, for example, that the temperature of the welding target 40 is lower than the preheating target temperature, or the gas blowing action is not completed.

若氣體加熱條件滿足,則執行步驟S25;否則,執行步驟S26。If the gas heating condition is satisfied, execute step S25; otherwise, execute step S26.

步驟S25:吹氣控制模組302基於預熱參數控制電磁閥53的啟閉來控制供氣時間與供氣體積,並控制電控閥52調整供氣壓力與供氣體積,以從焊料供應裝置1吹出符合預熱參數的高溫的流動氣體,來提升焊接目標40(包括焊料17)的溫度。Step S25: The air blowing control module 302 controls the opening and closing of the electromagnetic valve 53 based on the preheating parameters to control the air supply time and air supply volume, and controls the electric control valve 52 to adjust the air supply pressure and air supply volume, so as to obtain from the solder supply device 1 Blow out high-temperature flowing gas that meets the preheating parameters to increase the temperature of the soldering target 40 (including the solder 17 ).

步驟S26:預熱控制模組301判斷預熱程序是否完成,例如是判斷焊接目標40是否達到工作溫度。Step S26: The preheating control module 301 judges whether the preheating procedure is completed, for example, judges whether the welding target 40 has reached the working temperature.

若預熱程序完成,則執行步驟S26;否則,執行步驟S27。If the preheating procedure is completed, execute step S26; otherwise, execute step S27.

接著,於完成預熱程序或者不需要執行預熱程序時,執行步驟S27:焊接控制模組300執行焊接程序,例如是執行圖6的步驟S10-S15。Next, when the preheating procedure is completed or the preheating procedure does not need to be executed, step S27 is executed: the welding control module 300 executes the welding procedure, for example, steps S10-S15 in FIG. 6 are executed.

本發明透過預熱程序的執行,可降低焊接目標40與環境的溫差並提升焊接品質。The present invention can reduce the temperature difference between the welding target 40 and the environment and improve the welding quality through the execution of the preheating program.

請一併參閱圖1至圖8,圖8為本發明一實施例的計算煙霧濃度的流程圖。本實施例的自動控制方法是使用電腦視覺來偵測焊接煙霧的產生與煙霧濃度,藉以根據不同的煙霧濃度調整適當的供氣壓力、供氣體積及/或供氣時間。Please refer to FIG. 1 to FIG. 8 together. FIG. 8 is a flow chart of calculating smoke concentration according to an embodiment of the present invention. The automatic control method of this embodiment uses computer vision to detect the generation of welding fumes and the concentration of the fumes, so as to adjust the appropriate gas supply pressure, gas supply volume and/or gas supply time according to different smoke concentrations.

具體而言,於本實施例中,步驟S11可以包含以下步驟。Specifically, in this embodiment, step S11 may include the following steps.

步驟S30:煙霧分析模組303取得焊接位置的背景影像。前述背景影像可以是於開始焊接前所拍攝,而不會包含任何煙霧影像。Step S30: The smoke analysis module 303 obtains the background image of the welding position. The above-mentioned background image may be taken before starting welding without including any smoke image.

步驟S31:於焊接過程中,煙霧分析模組303取得焊接位置的焊接影像。Step S31: During the welding process, the smoke analysis module 303 obtains a welding image of the welding position.

接著,煙霧分析模組303可基於當前的焊接影像計算煙霧面積來作為煙霧濃度。具體而言,煙霧分析模組303可執行以下步驟來計算煙霧濃度。Next, the smoke analysis module 303 can calculate the smoke area as the smoke concentration based on the current welding image. Specifically, the smoke analysis module 303 can perform the following steps to calculate the smoke concentration.

步驟S32:煙霧分析模組303對焊接影像與背景影像執行相減處理來獲得差影像。前述差影像的各像素的像素值即為焊接影像與背景影像的對應位置的像素差值。Step S32: The smoke analysis module 303 performs a subtraction process on the welding image and the background image to obtain a difference image. The pixel value of each pixel of the aforementioned difference image is the pixel difference value of the corresponding position between the welding image and the background image.

於一實施例中,煙霧分析模組303可進一步執行擷取處理(步驟S33),來從差影像中擷取出對應焊接位置的子影像,以排除與焊接低相關或無相關的區域。In one embodiment, the smoke analysis module 303 may further perform an extraction process (step S33 ) to extract a sub-image corresponding to the welding position from the difference image, so as to exclude areas with little or no correlation with welding.

具體而言,煙霧分析模組303取得影像遮罩。前述影像遮罩設定有至少一組有效區域,各有效區域是對應焊接位置。Specifically, the smoke analysis module 303 obtains the image mask. The aforementioned image mask is set to have at least one group of effective areas, and each effective area corresponds to a welding position.

接著,煙霧分析模組303基於影像遮罩對焊接影像執行擷取處理,以擷取焊接影像的有效區域的多個像素。舉例來說,煙霧分析模組303可將影像遮罩套用在焊接影像上,來使焊接影像的有效區域以外的像素值被設定為排除值(如0、255或其他可明顯辨識的值)。這些被排除的像素將不會列入煙霧面積的計算。Next, the smoke analysis module 303 performs an extraction process on the welding image based on the image mask, so as to extract a plurality of pixels in the effective area of the welding image. For example, the smoke analysis module 303 can apply an image mask on the welding image, so that pixel values outside the valid area of the welding image are set as exclusion values (such as 0, 255 or other clearly identifiable values). These excluded pixels will not be included in the calculation of the smoke area.

藉此,本發明可以減少處理資料量,並提升計算準確度。In this way, the present invention can reduce the amount of data to be processed and improve calculation accuracy.

步驟S34:煙霧分析模組303基於差影像計算多個煙霧像素的煙霧面積作為煙霧濃度。Step S34: The smoke analysis module 303 calculates the smoke area of a plurality of smoke pixels as the smoke concentration based on the difference image.

於一實施例中,煙霧分析模組303於差影像中識別煙霧影像的煙霧像素的數量與分佈,並依據像素數量與分佈計算對應的煙霧面積作為煙霧濃度,如基於影像擷取裝置340的鏡頭焦段將像素數量與分佈轉換為立體空間的面積值。In one embodiment, the smoke analysis module 303 recognizes the number and distribution of smoke pixels in the smoke image in the difference image, and calculates the corresponding smoke area as the smoke concentration according to the number and distribution of pixels, such as based on the lens of the image capture device 340 The focal length converts the number and distribution of pixels into an area value in a three-dimensional space.

於一實施例中,煙霧分析模組303是於差影像中選擇值(像素差值)大於預設差值的像素作為煙霧像素。In one embodiment, the smoke analysis module 303 selects pixels whose value (pixel difference) is greater than a preset difference value in the difference image as smoke pixels.

於一實施例中,煙霧分析模組303可基於未執行擷取處理的差影像來計算煙霧面積,亦可基於已執行擷取處理的差影像來計算煙霧面積,不加以限定。In one embodiment, the smoke analysis module 303 may calculate the smoke area based on the difference image without capture processing, or calculate the smoke area based on the difference image after capture processing, without limitation.

本發明透過電腦視覺來計算煙霧濃度,可有效偵測煙霧是否影響光學動作(如雷射加熱),並可省下煙霧測器的設置成本。The invention calculates the smoke concentration through computer vision, can effectively detect whether the smoke affects the optical action (such as laser heating), and can save the installation cost of the smoke detector.

以上所述僅為本發明之較佳具體實例,非因此即侷限本發明之申請專利範圍,故舉凡運用本發明內容所為之等效變化,均同理皆包含於本發明之範圍內,合予陳明。The above descriptions are only preferred specific examples of the present invention, and are not intended to limit the patent scope of the present invention. Therefore, all equivalent changes made by using the content of the present invention are all included in the scope of the present invention in the same way. Chen Ming.

1:焊料供應裝置 10:料氣供應管 11:供料管 12:供氣管 13:殼體 14:出口 15:入口 16:間隙 17:焊料 18:空間 30:控制裝置 300:焊接控制模組 301:預熱控制模組 302:吹氣控制模組 303:煙霧分析模組 31:供料裝置 32:供氣裝置 320:高壓氣體源 321:高溫氣體源 33:燒焊裝置 330:雷射模組 331:雷射光路 34:煙霧感測裝置 340:影像擷取裝置 40:焊接目標 41:電路印刷板 L1、L2:雷射光 Im1:可見光 Im2:影像訊號 50:承載台 51:三通接頭 52:電控閥 53:電磁閥 54:移動裝置 C1-C4:控制訊號 S10-S15:焊接步驟 S20-S27:預熱步驟 S30-S34:煙霧濃度計算步驟 1: Solder supply device 10: Gas supply pipe 11: Feed pipe 12: air supply pipe 13: Shell 14: Export 15: Entrance 16: Gap 17: Solder 18: space 30: Control device 300: welding control module 301: Preheat control module 302: Air blowing control module 303: Smoke analysis module 31: Feeding device 32: Air supply device 320: High pressure gas source 321: High temperature gas source 33: Welding device 330: Laser Module 331: Laser light path 34: Smoke sensing device 340: Image capture device 40: Weld target 41: Circuit printed board L1, L2: laser light Im1: visible light Im2: video signal 50: carrying platform 51: Tee joint 52: Electric control valve 53: Solenoid valve 54: Mobile device C1-C4: control signal S10-S15: Welding steps S20-S27: Preheating steps S30-S34: Smoke concentration calculation steps

圖1為本發明一實施例的焊料供應裝置的架構圖。FIG. 1 is a structural diagram of a solder supply device according to an embodiment of the present invention.

圖2為本發明一實施例的焊料供應裝置的架構圖。FIG. 2 is a structural diagram of a solder supply device according to an embodiment of the present invention.

圖3為本發明一實施例的焊接系統的架構圖。FIG. 3 is a structural diagram of a welding system according to an embodiment of the present invention.

圖4為本發明一實施例的控制裝置的架構圖。FIG. 4 is a structural diagram of a control device according to an embodiment of the present invention.

圖5為本發明一實施例的焊接系統的架構圖。FIG. 5 is a structural diagram of a welding system according to an embodiment of the present invention.

圖6為本發明一實施例的焊接程序的流程圖。FIG. 6 is a flowchart of a welding procedure according to an embodiment of the present invention.

圖7為本發明一實施例的預熱程序的流程圖。FIG. 7 is a flowchart of a preheating procedure according to an embodiment of the present invention.

圖8為本發明一實施例的計算煙霧濃度的流程圖。FIG. 8 is a flow chart of calculating smoke concentration according to an embodiment of the present invention.

1:焊料供應裝置 10:料氣供應管 11:供料管 12:供氣管 13:殼體 14:出口 15:入口 16:間隙 17:焊料 18:空間 1: Solder supply device 10: Gas supply pipe 11: Feed pipe 12: air supply pipe 13: Shell 14: Export 15: Entrance 16: Gap 17: Solder 18: space

Claims (10)

一種焊料供應裝置,包括: 一料氣供應管,包括一供料管及一供氣管,該供料管用以運輸一焊料並連接供應該焊料的一供料裝置,該供氣管用以運輸流動氣體,並連接供應該流動氣體的一供氣裝置,其中該料氣供應管為一同軸管,該供料管為該同軸管的一內管,該供氣管為該同軸管的一外管,該外管與該內管間的一間隙形成一流動氣體運輸通道,並且該流動氣體運輸通道環繞該內管的外圍;及 一殼體,包覆該料氣供應管的末端,該殼體開設有一出口來輸出該焊料及該流動氣體,該料氣供應管從該殼體所開設的一入口穿入該殼體的內部。 A solder supply device comprising: A material gas supply pipe, including a material supply pipe and a gas supply pipe, the material supply pipe is used to transport a solder and connected to a supply device that supplies the solder, the gas supply pipe is used to transport the flowing gas, and is connected to supply the flowing gas A gas supply device, wherein the material gas supply pipe is a coaxial pipe, the feed pipe is an inner pipe of the coaxial pipe, the gas supply pipe is an outer pipe of the coaxial pipe, and the distance between the outer pipe and the inner pipe is a gap forming a flow gas transport channel, and the flow gas transport channel surrounds the periphery of the inner tube; and A shell covering the end of the material gas supply pipe, the shell is provided with an outlet to output the solder and the flowing gas, and the material gas supply pipe penetrates into the interior of the housing from an inlet provided by the housing . 如請求項1所述之焊料供應裝置, 其中該供料管的一端穿入該殼體內部,另一端用來連接該供料裝置,以作為該供料裝置至該殼體之間的該焊料的運輸通道;及 其中,該供氣管的至少部份管線是完全包覆該供料管,該供氣管一端穿入該殼體內部,另一端用來連接該供氣裝置。 The solder supply device as described in Claim 1, wherein one end of the feeding tube penetrates into the housing, and the other end is used to connect the feeding device to serve as a transportation channel for the solder between the feeding device and the housing; and Wherein, at least part of the pipeline of the air supply pipe is completely covering the supply pipe, one end of the air supply pipe penetrates into the interior of the housing, and the other end is used for connecting the air supply device. 如請求項2所述之焊料供應裝置,其中該供料管於該殼體中的開口未被該供氣管包覆; 其中,該供料管於該殼體中的長度大於該供氣管於該殼體中的長度; 其中,該供氣管於該殼體中的開口透過該殼體的內壁連通至該殼體的該出口。 The solder supply device as claimed in item 2, wherein the opening of the supply tube in the casing is not covered by the gas supply tube; Wherein, the length of the feed pipe in the casing is greater than the length of the air supply pipe in the casing; Wherein, the opening of the air supply pipe in the casing communicates with the outlet of the casing through the inner wall of the casing. 一種焊料供應裝置,包括: 一料氣供應管,包括一供料管及一供氣管,該供料管用以運輸一焊料並連接供應該焊料的一供料裝置,該供氣管用以運輸流動氣體,並連接供應該流動氣體的一供氣裝置;及 一殼體,包覆該料氣供應管的末端,該殼體開設有一出口來輸出該焊料及該流動氣體,該料氣供應管從該殼體所開設的一入口穿入該殼體的內部,其中該供氣管在該殼體外的管壁厚度大於在該殼體內的管壁厚度。 A solder supply device comprising: A material gas supply pipe, including a material supply pipe and a gas supply pipe, the material supply pipe is used to transport a solder and connected to a supply device that supplies the solder, the gas supply pipe is used to transport the flowing gas, and is connected to supply the flowing gas a gas supply device; and A shell covering the end of the material gas supply pipe, the shell is provided with an outlet to output the solder and the flowing gas, and the material gas supply pipe penetrates into the interior of the housing from an inlet provided by the housing , wherein the pipe wall thickness of the air supply pipe outside the housing is greater than the pipe wall thickness inside the housing. 如請求項4所述之焊料供應裝置, 其中該供料管及該供氣管為同軸管; 其中,該供料管作為內管,一端穿入該殼體內部,另一端用來連接該供料裝置,以作為該供料裝置至該殼體之間的該焊料的運輸通道;及 其中,該供氣管的至少部份管線是完全包覆該供料管以作為外管,該供氣管一端穿入該殼體內部,另一端用來連接該供氣裝置,該供料管與該供氣管之間的間隙是用來作為該流動氣體的運輸通道。 The solder supply device as described in Claim 4, wherein the feed pipe and the gas supply pipe are coaxial pipes; Wherein, the feeding pipe is used as an inner pipe, one end of which penetrates into the housing, and the other end is used to connect the feeding device, so as to serve as a transportation channel for the solder between the feeding device and the housing; and Wherein, at least part of the pipeline of the air supply pipe is completely covered with the feed pipe as an outer pipe, one end of the air supply pipe penetrates into the housing, and the other end is used to connect the air supply device, the feed pipe and the The gaps between the gas supply pipes are used as transport channels for the flowing gas. 如請求項5所述之焊料供應裝置,其中該供料管於該殼體中的開口未被該供氣管包覆; 其中,該供料管於該殼體中的長度大於該供氣管於該殼體中的長度; 其中,該供氣管於該殼體中的開口透過該殼體的內壁連通至該殼體的該出口。 The solder supply device as described in claim 5, wherein the opening of the supply tube in the casing is not covered by the gas supply tube; Wherein, the length of the feed pipe in the casing is greater than the length of the air supply pipe in the casing; Wherein, the opening of the air supply pipe in the casing communicates with the outlet of the casing through the inner wall of the casing. 一種焊接系統,包括: 如請求項1或請求項4所述的焊料供應裝置,用來提供該焊料至一焊接位置; 一煙霧感測裝置,用以感測一煙霧濃度; 一燒焊裝置,用以對該焊接位置進行加熱; 一供料裝置,連接該焊料供應裝置的該供料管,用來供應該焊料; 一供氣裝置,連接該焊料供應裝置的該供氣管,用來供應該流動氣體;及 一控制裝置,連接該煙霧感測裝置、該燒焊裝置、該供料裝置及該供氣裝置,該控制裝置被設定來於該煙霧濃度符合一排煙條件時,控制該供氣裝置輸送該流動氣體,以使該流動氣體從該焊料供應裝置的該出口排出來驅散煙霧。 A welding system comprising: The solder supply device as described in claim 1 or claim 4, used to provide the solder to a soldering position; A smoke sensing device for sensing a smoke concentration; A welding device for heating the welding position; a feeding device connected to the feeding tube of the solder supply device for supplying the solder; a gas supply device connected to the gas supply pipe of the solder supply device for supplying the flowing gas; and A control device, connected to the smoke sensing device, the welding device, the material supply device and the gas supply device, the control device is set to control the gas supply device to deliver the flowing gas so that the flowing gas is discharged from the outlet of the solder supply device to disperse fumes. 如請求項7所述之焊接系統,其中該煙霧感測裝置包括一影像擷取裝置,連接該控制裝置並用以拍攝該焊接位置來獲得一焊接影像; 該控制裝置包括一煙霧分析模組,被設定來基於該焊接影像計算一煙霧面積,作為該煙霧濃度。 The welding system as described in claim 7, wherein the smoke sensing device includes an image capture device connected to the control device and used to photograph the welding position to obtain a welding image; The control device includes a smoke analysis module, which is set to calculate a smoke area based on the welding image as the smoke concentration. 一種吹氣的自動控制方法,應用於一焊接系統,該焊接系統包括如請求項1或請求項4所述的焊料供應裝置,包括: a) 透過該焊料供應裝置來對一焊接位置提供該焊料; b) 對該焊接位置進行加熱以熔化該焊料; c) 感測一煙霧濃度;及 d) 於該煙霧濃度符合一排煙條件時,透過該焊料供應裝置輸出該流動氣體,來降低該煙霧濃度。 An automatic control method for air blowing, applied to a welding system, the welding system includes the solder supply device as described in claim 1 or claim 4, including: a) supplying the solder to a soldering location through the solder supply device; b) applying heat to the soldering location to melt the solder; c) sensing a smoke level; and d) When the smoke concentration meets a smoke exhaust condition, output the flowing gas through the solder supply device to reduce the smoke concentration. 如請求項9所述之吹氣的自動控制方法,其中該步驟c)包括: c1) 取得該焊接位置的一焊接影像; c2) 基於該焊接影像計算一煙霧面積,作為該煙霧濃度。 The automatic control method of blowing as described in claim item 9, wherein the step c) comprises: c1) Obtain a welding image of the welding position; c2) Calculate a smoke area based on the welding image as the smoke concentration.
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