TWI803613B - Load port and equipment front end module - Google Patents
Load port and equipment front end module Download PDFInfo
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- TWI803613B TWI803613B TW108112022A TW108112022A TWI803613B TW I803613 B TWI803613 B TW I803613B TW 108112022 A TW108112022 A TW 108112022A TW 108112022 A TW108112022 A TW 108112022A TW I803613 B TWI803613 B TW I803613B
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Abstract
本發明提供裝載端口及設備前端模組,實現門清洗處理所需的時間的縮短且不使導致搬運對象物即晶片的性能變化的不希望的氣體流入搬運室內的構造。具備密封配置於基座(21)前方預定位置的(FOUP4)與基座(21)之間的第一密封部(5)、密封處於封閉開口部(21a)的關閉狀態的裝載端口門(22)與基座(21)之間的第二密封部(6)及氣體注入部(71),在將容器門與裝載端口門(22)的間隙且由第一密封部(5)及第二密封部(6)分隔的密閉空間(DS)置換為氣體的門清洗處理時通過使密閉空間(DS)處於正壓使第一密封部5的優先敞開部分(X)比第二密封部(6)優先敞開,能通過該敞開的部分至少排出密閉空間(DS)的氣體。 The present invention provides a load port and an equipment front-end module that shorten the time required for door cleaning and prevent unwanted gas that causes changes in the performance of wafers, which are objects to be transported, from flowing into the transport chamber. Equipped with a first sealing portion (5) sealingly arranged between (FOUP 4 ) at a predetermined position in front of the base (21) and the base (21), and a loading port door (22) sealed in a closed state for sealing the opening portion (21a). ) and the second sealing part (6) and the gas injection part (71) between the base (21), in the gap between the container door and the loading port door (22) and by the first sealing part (5) and the second When the closed space (DS) separated by the sealing part (6) is replaced by gas door cleaning process, by making the closed space (DS) under positive pressure, the preferential opening part (X) of the first sealing part 5 is more open than the second sealing part (6). ) is preferentially opened, through which at least the gas in the closed space (DS) can be discharged.
Description
本發明涉及將容納在容器中的搬運對象物交接到搬運空間的作為接口部發揮功能的裝載端口以及具備裝載端口的EFEM。 The present invention relates to a loadport functioning as an interface for delivering a conveyance object contained in a container to a conveyance space, and an EFEM provided with the loadport.
例如在半導體的製造工序中,為了提高成品率、品質,進行潔淨室內的晶片的處理。近年來,採用僅對晶片周圍的局部的空間進一步提高清潔度的“小型圍繞方式”,並採用進行晶片的搬運及其它處理的措施。在小型圍繞方式中,在箱體的內部與搬運室相鄰地設有裝載端口(Load Port),該裝載端口構成大致封閉的晶片搬運室(以下為搬運室)的壁面的一部分,並且載置高清潔的內部空間收納有晶片等搬運對象物的搬運容器(以下為“容器”),並具有使容器的門(以下為“容器門”)開閉的功能。以下將能夠與容器門卡合併使容器門開閉的裝載端口的門設為“裝載端口門”。 For example, in a semiconductor manufacturing process, wafers are processed in a clean room in order to improve yield and quality. In recent years, the "mini-surrounding method" in which the cleanliness is further improved only in a local space around the wafer has been adopted, and measures for carrying and other processing of the wafer have been adopted. In the small enclosure method, a load port (Load Port) is provided adjacent to the transfer chamber inside the box, and the load port constitutes a part of the wall surface of the substantially closed wafer transfer chamber (hereinafter referred to as the transfer chamber), and places The high-clean internal space accommodates a transport container (hereinafter referred to as "container") for objects to be transported such as wafers, and has a function of opening and closing the door of the container (hereinafter referred to as "container door"). Hereinafter, a door of a load port that can be engaged with the container door to open and close the container door is referred to as a "load port door".
裝載端口是用於在與搬運室之間進行搬運對象物的出入的裝置,作為搬運室與容器(例如FOUP(Front-Opening Unified Pod))之間的接口部發揮功能。並且,夠成為,在隔著預定的間隙使裝載端口門與FOUP的門(以下為“FOUP門”)對置的狀態下,若這些FOUP門以及裝載端口門同時打開,則通過配置在搬運室內的搬運機器人(晶片搬運裝置),能夠向搬運室內取出FOUP內的搬運對象物、或者將搬運對象物從搬運室內收納到FOUP內。 The load port is a device for loading and unloading objects to and from the transfer chamber, and functions as an interface between the transfer chamber and a container (for example, FOUP (Front-Opening Unified Pod)). In addition, in the state where the loading port door and the door of the FOUP (hereinafter referred to as "FOUP door") are opposed to each other with a predetermined gap, if these FOUP doors and the loading port door are opened at the same time, the The transfer robot (wafer transfer device) can take out the transfer object in the FOUP into the transfer chamber, or store the transfer object from the transfer chamber into the FOUP.
為了適當地維持晶片周邊的氣氛,使用稱為FOUP的密閉式的保存筒來作為容器,在FOUP的內部容納晶片來進行管理。並且,為了在對晶片進行處理的處理裝置與FOUP之間進行晶片的交接,利用了使用搬運室和裝載端口而構成的EFEM(Equipment Front End Module:設備前端模組)。 In order to properly maintain the atmosphere around the wafer, a sealed storage tube called a FOUP is used as a container, and the wafer is housed in the FOUP for management. Furthermore, an EFEM (Equipment Front End Module: Equipment Front End Module) configured using a transfer chamber and a load port is used to transfer wafers between a processing apparatus that processes wafers and a FOUP.
近年來,促進了元件的高集成化、電路的細微化,要求將晶片周邊維持為高清潔度,以免產生顆粒、水分向晶片表面的附著。因此,為了不使晶片表面氧化等表面的性能發生變化,在FOUP的內部填充氮氣,使晶片周邊處於作為惰性氣體的氮氣氣氛、或者處於真空狀態。 In recent years, the high integration of components and the miniaturization of circuits have been promoted, and it is required to maintain a high degree of cleanliness around the wafer so that particles and moisture do not adhere to the wafer surface. Therefore, in order not to change the performance of the surface such as oxidation of the wafer surface, nitrogen gas is filled inside the FOUP, and the periphery of the wafer is kept in a nitrogen gas atmosphere as an inert gas or in a vacuum state.
並且,在晶片的最先進的工序中,作為從配置在搬運室上部的風扇過濾器單元不斷流出的直流使用的清潔的大氣所含的氧氣、水分等有可能使晶片的性能發生變化。因此如專利文獻1那樣,要求使惰性氣體在EFEM內循環的技術的實用化。專利文獻1所記載的系統是為了使容器門(FOUP門)與裝載端口門之間成為密閉空間而在裝載端口的適當部位設置密封部件的結構。
In addition, in the most advanced process of the wafer, the performance of the wafer may be changed by the oxygen, moisture, etc. contained in the clean air used as a direct flow from the fan filter unit arranged in the upper part of the transfer chamber. Therefore, as in
然而,如果是設置了密封部件的上述結構,則在密閉空間殘留有大氣、顆粒,在使裝載端口門隔著預定的間隙與FOUP門對置的狀態下,在這些FOUP門以及裝載端口門同時打開時,殘留在密閉空間的大氣、顆粒混入FOUP內、搬運室,由此存在晶片的性能在要求低氧氣濃度、低濕度的EFEM發生變化的擔憂。 However, in the above-mentioned structure provided with a sealing member, air and particles remain in the closed space, and the load port door and the FOUP door are opposed to each other through a predetermined gap, and the FOUP door and the load port door are simultaneously closed. When opened, air and particles remaining in the closed space may be mixed into the FOUP and the transfer chamber, which may cause changes in the performance of the wafer in EFEM, which requires low oxygen concentration and low humidity.
因此,本申請人提出了如下結構:使用向FOUP門與裝載端口門之間的密閉空間注入氣體的氣體注入噴嘴、和排出密閉空間的氣體的氣體排出噴嘴,除去密閉空間的大氣並填充氮氣(進行清洗)(專利文獻2)。這樣,通過用氮氣置換(以下稱為門清洗。)形成於FOUP門與裝載端口門之間的密閉空間的氣體,可實現抑制附著於FOUP門的顆粒等在門敞開時流入到EFEM搬運室 內的事態、FOUP門與裝載端口之間的微小空間所含的氧氣流入到EFEM搬運室內。 Therefore, the present applicant proposed a structure in which the atmosphere in the closed space is removed and filled with nitrogen gas ( cleaning) (Patent Document 2). In this way, by replacing the gas formed in the closed space between the FOUP door and the load port door with nitrogen gas (hereinafter referred to as door cleaning), it is possible to suppress the particles, etc. attached to the FOUP door from flowing into the EFEM transfer chamber when the door is opened. Oxygen contained in the tiny space between the FOUP door and the load port flows into the EFEM transfer chamber.
現有技術文獻 prior art literature
專利文獻 patent documents
專利文獻1:日本特開2014-112631號公報 Patent Document 1: Japanese Patent Laid-Open No. 2014-112631
專利文獻2:國際公開2017/022431號公報 Patent Document 2: International Publication No. 2017/022431
然而,為了實現間隔時間的縮短化,門清洗(密閉空間的氮氣置換處理)所需要的時間被限定。因此,若增加相對於密閉空間的氮氣的供給量,則密閉空間中的壓力變高,其結果,相對於處於封閉了基座的開口部的狀態的裝載端口門作用從密閉空間朝向EFEM搬運室側的押壓力,若裝載端口門的封閉力不足,則無法維持裝載端口門側的密閉性,引起密閉空間的含有氧氣的氣體、顆粒流入到EFEM搬運室內的事態。 However, in order to shorten the interval time, the time required for door cleaning (nitrogen replacement process in a closed space) is limited. Therefore, if the supply amount of nitrogen gas to the closed space is increased, the pressure in the closed space will increase, and as a result, the action of the load port door closing the opening of the susceptor will move from the closed space toward the EFEM transfer chamber. If the sealing force of the load port door is insufficient, the pressure on the side of the load port door cannot be maintained, and the oxygen-containing gas and particles in the closed space will flow into the EFEM transfer chamber.
另一方面,為了避免這樣的事態的發生,也考慮對密閉空間內的氣體氣氛進行抽吸的結構,但若置換氣體的供給與抽吸的平衡毀壞而抽吸量比供給量多,則密閉空間成為負壓。其結果認為,FOUP門被牽拉到密閉空間側而與容器主體的密閉性下降,FOUP內的氣體流入到密閉空間。在此,為了對FOUP內進行清洗處理(底部清洗處理),在FOUP的底部設有氮氣供給端口、和從FOUP內自然排出氣體的排氣端口,如果門清洗處理所使用的氣體抽吸量比氣體供給量多,則氣體(大氣)從底部清洗處理用的排氣端口被抽吸到FOUP內而倒流,有可能流入密閉空間甚至EFEM搬運室內。 On the other hand, in order to avoid the occurrence of such a situation, the structure of suctioning the gas atmosphere in the closed space is also considered, but if the balance between the supply and suction of the replacement gas is destroyed and the suction volume is larger than the supply volume, the airtight space will be closed. The space becomes negative pressure. As a result, it is considered that the FOUP door was pulled to the closed space side, the airtightness with the container main body was lowered, and the gas in the FOUP flowed into the closed space. Here, in order to clean the inside of the FOUP (bottom cleaning treatment), a nitrogen gas supply port and an exhaust port for naturally exhausting gas from the inside of the FOUP are provided at the bottom of the FOUP. If the amount of gas supplied is large, the gas (atmosphere) will be sucked into the FOUP from the exhaust port for cleaning the bottom and flow back, and may flow into the closed space or even the EFEM transfer chamber.
本發明是著眼於這樣的課題而提出的方案,主要的目的在於提供實現門清洗處理或者以門清洗處理為基準的密閉空間清潔化處理所需要的時間的縮短化、並且不會使導致搬運對象物(晶片)的性能變化的不希望的氣體流入搬運室內的構造的裝載端口、以及具備這樣的裝載端口的EFEM。此外,本發明是能夠應用於能與FOUP以外的容器對應的裝載端口以及EFEM的技術。 The present invention is proposed in view of such a problem, and its main purpose is to shorten the time required for the door cleaning process or the closed space cleaning process based on the door cleaning process without causing damage to the transported object. A load port of a structure that prevents unwanted gas that changes the performance of objects (wafers) from flowing into the transfer chamber, and an EFEM provided with such a load port. In addition, the present invention is a technique applicable to loadports and EFEMs that can handle containers other than FOUPs.
即、本發明以裝載端口為基本結構,該裝載端口具備:基座,其構成將搬運空間與外部空間隔離的壁的一部分,而且具有能夠使搬運對象物通過的開口部;裝載端口門,其能夠與容納搬運對象物的容器所具有的容器門卡合,而且能夠開閉基座的開口部;第一密封部,其對配置在基座的前方的預定位置的容器與該基座之間進行密封;以及第二密封部,其對處於封閉了開口部的關閉狀態的裝載端口門與基座之間進行密封,構成為,在裝載端口門處於關閉狀態而且經由第一密封部使容器與基座抵接的狀態下,裝載端口門與容器門隔著預定尺寸的間隙而對置的空間成為由第一密封部以及第二密封部分隔出的密閉空間。 That is, the present invention takes the loadport as the basic structure, and the loadport includes: a base that constitutes a part of a wall that isolates the transport space from the outside space, and has an opening through which the object to be transported can pass; a load port door that It can be engaged with the container door of the container containing the object to be transported, and can open and close the opening of the base; a seal; and a second seal portion, which seals between the loadport door in the closed state that closes the opening portion and the base, and is configured to connect the container and the base via the first seal portion when the loadport door is in the closed state. In a state where the seats are in contact, the space where the load port door and the container door face each other with a gap of a predetermined size is a sealed space partitioned by the first seal portion and the second seal portion.
並且,本發明的裝載端口在這樣的基本結構中,其中,還具備相對於密閉空間注入氣體的氣體注入部,構成為,將第一密封部的一部分或者全部設定為在將密閉空間置換為氣體的門清洗處理時通過使密閉空間處於正壓而比第二密封部優先敞開的優先敞開部分,能夠使密閉空間的至少氣體通過該敞開的部分排出。 In addition, in the basic structure of the load port of the present invention, a gas injection part for injecting gas into the sealed space is further provided, and a part or the whole of the first sealing part is set so as to replace the sealed space with gas. During the door cleaning process, at least the gas in the closed space can be discharged through the open part by making the closed space under positive pressure and opening the preferential opening portion prior to the second sealing portion.
在此,在本發明中,在密閉空間處於正壓狀態的情況下,比第二密封部優先敞開的部分既可以是第一密封部的一部分、也可以是第一密封部的全部。也就是,預先設定在密閉空間處於正壓狀態的情況下至少由第一密封部的一個部位解除密封狀態的部分(容易排氣的部分),這是以前從未想到的本 發明特有的結構。另外,本發明也包含以下這兩方的結構:在密閉空間成為正壓的時刻,第一密封部的優先敞開部分成為比第二密封部優先敞開的狀態的結構;在密閉空間成為正壓的時刻以後的適當的時刻(例如密閉空間成為預定值以上的壓力的時刻等),第一密封部的優先敞開部分成為比第二密封部優先敞開的狀態的結構。 Here, in the present invention, when the sealed space is under a positive pressure state, the portion that opens prior to the second sealing portion may be a part of the first sealing portion or the entire first sealing portion. That is to say, it is previously unthinkable to set in advance the portion (portion that is easy to exhaust) from at least one part of the first sealing portion to release the sealing state when the closed space is in a positive pressure state. Invent unique structures. In addition, the present invention also includes both of the following configurations: when the closed space becomes positive pressure, the preferential opening part of the first sealing part is opened more than the second sealing part; At an appropriate time after the time (for example, when the pressure in the sealed space becomes higher than a predetermined value, etc.), the preferential opening portion of the first sealing portion is opened more preferentially than the second sealing portion.
本發明的裝載端口發揮能夠通過氣體注入部將容器門與裝載端口門之間的間隙而且被第一密封部以及第二密封部密封的密閉空間置換為氣體的門清洗功能,能夠防止或者抑制附著於容器門的顆粒、存在於容器門與裝載端口門之間並包含使晶片氧化等有可能使晶片的性能發生變化的氧氣、水分、顆粒等的氣在敞開裝載端口門時流入到搬運空間以及容器的內部的事態。也就是,在敞開容器門而密閉空間敞開之前,能夠排除密閉空間的氧氣、水分、顆粒。 The load port of the present invention exhibits a door cleaning function that can replace the closed space between the container door and the load port door and sealed by the first sealing part and the second sealing part with gas through the gas injection part, and can prevent or suppress adhesion. Particles in the container door, gas that exists between the container door and the load port door and contains oxygen, moisture, particles, etc. that may change the performance of the wafer, such as oxidizing the wafer, flows into the transfer space when the load port door is opened, and The internal state of the container. That is, before the container door is opened to open the closed space, oxygen, moisture, and particles in the closed space can be excluded.
並且,本發明的裝載端口構成為,在門清洗處理時通過使密閉空間處於正壓從而使設定於第一密封部的一部分或者全部的優先敞開部分比第二密封部優先敞開,能夠使密閉空間的至少氣體通過該敞開的部分排出(門清洗處理執行前也有包含存在於密閉空間的空氣、顆粒等的情況),因此能夠防止因密閉空間成為正壓而裝載端口門的封閉力變弱,在門清洗處理執行前的時刻,附著於容器門的顆粒、存在於容器門與裝載端口門之間的包含氧氣、水分、顆粒等的大氣從密閉空間流入到搬運空間的事態。由此,能夠維持容器內、密閉空間以及搬運空間的清潔度,並且允許在短時間內對密閉空間大量地供給氣體而使密閉空間處於正壓狀態,與一邊一點一點向密閉空間供給氣體來調整壓力一邊除去密閉空間內的垃圾等的形態相比較,能夠實現間隔時間的縮短化。 In addition, the load port of the present invention is configured such that a part or all of the preferential opening portions set in the first sealing portion are opened more preferentially than the second sealing portion by making the closed space under a positive pressure during the door cleaning process, so that the closed space can be opened. At least the gas is discharged through the open part (there may be air, particles, etc. present in the closed space before the door cleaning process is performed), so it is possible to prevent the sealing force of the load port door from being weakened due to the positive pressure in the closed space. A situation in which particles adhering to the container door and air containing oxygen, moisture, particles, etc. existing between the container door and the load port door flow from the closed space into the transfer space immediately before the door cleaning process is executed. Thus, it is possible to maintain the cleanliness of the inside of the container, the airtight space, and the conveying space, and it is allowed to supply a large amount of gas to the airtight space in a short time so that the airtight space is in a positive pressure state, which is different from supplying gas to the airtight space bit by bit. Compared with the form of removing garbage in the closed space while adjusting the pressure, the interval time can be shortened.
除此以外,如果是本發明的裝載端口,則不需要使密閉空間的壓力變得與其它空間的壓力均等的特別的控制,不需要用於進行控制的控制設備(閥、配管類),從而能夠實現成本降低、間隔時間的縮短化。 In addition, if it is the load port of the present invention, no special control is required to make the pressure of the closed space equal to the pressure of other spaces, and no control equipment (valve, piping, etc.) for control is required. Cost reduction and shortening of lead time can be realized.
尤其是,如果本發明的裝載端口具備排出密閉空間的氣體的氣體排出部,則與不具備氣體排出部的結構相比較,能夠防止或者抑制在密閉空間內產生難以調換氣體的場所的事態。除此以外,在這樣的裝載端口中,如果採用在優先敞開部分的附近而且在密閉空間之外的大氣壓下設置排氣單元的結構,則在密閉空間的壓力變高的情況下,能夠利用排氣單元效率良好地排出從設定於作為容器側的密封部件的第一密封部的優先敞開部分向密閉空間之外洩漏的至少門清洗用氣體等氣體。 In particular, if the loadport of the present invention includes a gas discharge unit for discharging gas from a closed space, it is possible to prevent or suppress the occurrence of a situation where it is difficult to exchange gas in the closed space, compared to a structure without a gas discharge unit. In addition, in such a load port, if the structure in which the exhaust unit is provided near the preferential opening part and under the atmospheric pressure outside the closed space, when the pressure in the closed space becomes high, it is possible to utilize the exhaust gas. The air unit efficiently discharges at least gas such as door cleaning gas leaking out of the closed space from the preferential opening portion of the first sealing portion set as the sealing member on the container side.
另外,本發明的裝載端口除了上述的基本結構以外還具備排出密閉空間的氣體的排出部,其中,將第二密封部的一部分或者全部設定為在由排出部對密閉空間進行排氣的密閉空間清潔化處理時通過使密閉空間處於負壓來比第一密封部優先敞開的優先敞開部分。 In addition, the load port of the present invention is provided with a discharge part for discharging gas from a closed space in addition to the above-mentioned basic structure, wherein part or all of the second sealing part is set in the closed space where the discharge part exhausts the closed space. A preferential opening portion that is opened prior to the first sealing portion by making the closed space under negative pressure during the cleaning process.
在此,在本發明中,在密閉空間處於負壓狀態的情況下,比第一密封部優先敞開的部分既可以是第二密封部的一部分、也可以是第二密封部的全部。也就是,預先設定在密閉空間處於負壓狀態的情況下至少由第二密封部的一個部位解除密封狀態的部分(容易排氣的部分),這是以前從未想到的本發明特有的結構。另外,本發明也包含以下結構這兩方的結構:在密閉空間成為負壓的時刻,第二密封部的優先敞開部分成為比第一密封部優先敞開的狀態的結構;在密閉空間成為負壓的時刻以後的適當的時刻(例如密閉空間成為預定值以下的壓力的時刻等),第二密封部的優先敞開部分成為比第一密封部優先敞開的狀態的結構。 Here, in the present invention, when the sealed space is in a negative pressure state, the portion that opens preferentially to the first sealing portion may be a part of the second sealing portion or the entirety of the second sealing portion. That is, it is a unique structure of the present invention that presets at least one portion of the second sealing portion (portion that is easy to exhaust) when the sealed space is under a negative pressure state. In addition, the present invention also includes both of the following structures: when the closed space becomes negative pressure, the preferential opening part of the second sealing part is in a state of opening preferentially compared with the first sealing part; At an appropriate timing after the timing (for example, timing when the pressure in the sealed space becomes a predetermined value or less), the preferential opening portion of the second sealing portion is preferentially opened over the first sealing portion.
本發明的裝載端口發揮通過排出部對容器門與裝載端口門之間的間隙而且被第一密封部以及第二密封部密封的密閉空間進行排氣來清潔化的功能,因此能夠防止或者抑制附著於容器門的顆粒、存在於容器門與裝載端口門之間並包含使晶片氧化等有可能使晶片的性能發生變化的氧氣、水分、顆粒等的大氣在敞開裝載端口門時流入到搬運空間以及容器的內部的事態。也就是,在敞開容器門而密閉空間敞開之前,能夠排除密閉空間的氧氣、水分、顆粒。 The load port of the present invention has the function of cleaning the airtight space between the container door and the load port door and sealed by the first seal part and the second seal part through the discharge part, so that adhesion can be prevented or suppressed. Particles in the container door, air that exists between the container door and the load port door and contains oxygen, moisture, particles, etc. that may change the performance of the wafer, such as oxidizing the wafer, flows into the transfer space when the load port door is opened, and The internal state of the container. That is, before the container door is opened to open the closed space, oxygen, moisture, and particles in the closed space can be excluded.
並且,本發明的裝載端口為了實現間隔時間的縮短化,若在短時間內大量地進行從密閉空間向密閉空間外的排氣來使密閉空間處於負壓狀態,則設定為第二密封部的一部分或者全部的優先敞開部分比第一密封部優先敞開,氣體通過該敞開部分從搬運空間流入密閉空間,能夠完全防止以下事態:由於密閉空間成為負壓而容器門的封閉力變弱,在使用了排出部的密閉空間的清潔化處理執行前的時刻,附著於容器門的顆粒、存在於容器門與裝載端口門之間的包含氧氣、水分、顆粒等的大氣從密閉空間流入到容器內的事態;由於密閉空間成為負壓而容器門的封閉力變弱,形成通過容器門與容器主體的間隙從容器的內部朝向密閉空間的氣流,導致氣體(大氣)從容器底部的排氣端口向容器內、或者密閉空間倒流的事態。由此,能夠維持容器內、密閉空間以及搬運空間的高清潔度,並且允許相對於密閉空間在短時間內大量地排氣而使密閉空間處於負壓狀態,與一邊一點一點排氣來對密閉空間進行壓力調整一邊除去密閉空間內的垃圾等的形態相比較,能夠實現間隔時間的縮短化。 And, in order to shorten the interval time, the loading port of the present invention is set as the second sealing portion if a large amount of air is exhausted from the closed space to the outside of the closed space in a short time to make the closed space be in a negative pressure state. A part or all of the preferential opening part is opened first than the first sealing part, and the gas flows from the conveying space into the closed space through the open part, which can completely prevent the following situation: the sealing force of the container door becomes weak due to the negative pressure in the closed space, and the Before the cleaning process of the closed space of the discharge part is performed, particles adhering to the container door, and air containing oxygen, moisture, particles, etc. existing between the container door and the loading port door flow into the container from the closed space Situation; As the closed space becomes negative pressure and the closing force of the container door becomes weak, an airflow from the inside of the container to the closed space is formed through the gap between the container door and the container body, causing gas (atmosphere) to flow from the exhaust port at the bottom of the container to the container inside, or backflow in a confined space. Thus, it is possible to maintain a high degree of cleanliness in the container, the enclosed space, and the conveying space, and allow a large amount of exhaust gas in a short period of time relative to the enclosed space, so that the enclosed space is in a negative pressure state. It is possible to shorten the interval time compared with the form of removing garbage and the like in the closed space while adjusting the pressure in the closed space.
除此以外,如果是本發明的裝載端口,則不需要使密閉空間的壓力變得與其它空間的壓力均等的特別的控制,不需要用於進行控制的控制設備(閥、配管類),從而能夠實現成本降低、間隔時間的縮短化。 In addition, if it is the load port of the present invention, no special control is required to make the pressure of the closed space equal to the pressure of other spaces, and no control equipment (valve, piping, etc.) for control is required. Cost reduction and shortening of lead time can be realized.
尤其是,本發明的裝載端口如果具備相對於密閉空間注入氣體的氣體注入部,發揮將密閉空間內置換為氣體的門清洗功能,能夠防止或者抑制在門清洗處理時在密閉空間內產生難以調換氣體的場所的事態。除此以外,在本發明的裝載端口中,如果採用在對密閉空間內進行抽吸的抽吸路徑的預定部位設置排氣單元的結構,則在密閉空間成為負壓狀態的情況下,能夠利用排氣單元效率良好地將密閉空間的氣體(如果是構成氣體注入部的結構則包含門清洗用氣體)排出到密閉空間外,還能夠消除如果成為過度的負壓狀態而能夠產生的事態、即、基於容器門的容器內的密閉程度下降,從而大氣從設置在容器內的排氣端口向容器內倒流的事態。 In particular, if the load port of the present invention is equipped with a gas injection part for injecting gas into the closed space, and performs a door cleaning function of replacing the closed space with gas, it is possible to prevent or suppress the occurrence of difficult replacement in the closed space during the door cleaning process. The state of affairs in the place of gas. In addition, in the load port of the present invention, if the exhaust unit is provided at a predetermined position of the suction path for sucking the airtight space, when the airtight space becomes a negative pressure state, it can utilize The exhaust unit efficiently discharges the gas in the closed space (including the door cleaning gas in the case of the structure constituting the gas injection part) to the outside of the closed space, and can also eliminate the situation that may occur if it becomes an excessive negative pressure state, that is, . The airtightness in the container due to the container door is lowered, and the atmosphere flows back into the container from the exhaust port provided in the container.
另外,本發明的EFEM的特徵在於,具備:具有上述的結構的裝載端口;以及在搬運空間配置有搬運機器人的搬運室。如果是這樣的EFEM,則能夠利用搬運機器人使晶片等搬運對象物出入於放置在裝載端口的容器與搬運室之間,比該出入處理靠前的時刻,在進行門清洗處理或者密閉空間清潔化處理時,通過使密閉空間處於正壓或者負壓來使優先敞開部分敞開,通過採用該結構,能夠使密閉空間的氣體(門清洗用氣體)通過敞開部分向密閉空間外排出,或者氣體能夠通過敞開部分從搬運空間流入密閉空間,從而能夠在維持容器內、密閉空間以及搬運空間的高清潔度的狀態下進行出入處理。尤其是,在本發明的EFEM中,如果搬運室具備使氣體在搬運空間循環的循環通道,則能夠使預定的氣體(例如惰性氣體或者氮氣等環境氣體)在搬運空間循環來維持為清潔的狀態。該情況下,搬運空間相對於搬運空間之外的外部空間(大氣壓下)的差壓較佳為+3~500Pa(G)。 In addition, the EFEM of the present invention is characterized by comprising: a load port having the above-mentioned structure; and a transfer chamber in which a transfer robot is arranged in the transfer space. According to such an EFEM, it is possible to use a transfer robot to bring objects to be transferred such as wafers in and out between the container placed in the load port and the transfer chamber, and to perform door cleaning or closed space cleaning before the entry and exit processing. During processing, the closed space is placed under positive pressure or negative pressure to open the preferential opening part. By adopting this structure, the gas in the closed space (gas for cleaning the door) can be discharged to the outside of the closed space through the open part, or the gas can pass through the closed space. The open part flows into the closed space from the conveyance space, so that it is possible to carry out in-and-out processing while maintaining a high degree of cleanliness in the container, the closed space, and the conveyance space. In particular, in the EFEM of the present invention, if the transfer chamber is equipped with a circulation passage for circulating gas in the transfer space, a predetermined gas (for example, an ambient gas such as an inert gas or nitrogen) can be circulated in the transfer space to maintain a clean state. . In this case, it is preferable that the differential pressure of the conveyance space with respect to the external space (atmospheric pressure) other than the conveyance space is +3-500Pa(G).
發明的效果如下。 The effects of the invention are as follows.
根據本發明,利用第一密封部以及第二密封部形成的雙重密封構造將配置於基座的前方的預定位置的容器的容器門與裝載端口門的間隙在這些 門彼此面對的前後方向上設定為密閉空間,構成在密閉空間的壓力與大氣壓之間產生壓力差,並設定為在產生了壓力差的狀態下,第一密封部或者第二密封部的任一方的一部分或者全部優先地敞開,因此能夠提供實現門清洗處理或者密閉空間清潔化處理所需要的時間的縮短化、並且不會使導致搬運對象物(晶片等)的性能變化的不希望的氣體流入搬運室內的構造的裝載端口、以及具備這樣的裝載端口的EFEM。 According to the present invention, the gap between the container door and the loading port door of the container arranged at a predetermined position in front of the base is reduced by the double sealing structure formed by the first sealing part and the second sealing part. The front and rear directions where the doors face each other are set as a closed space, and a pressure difference is generated between the pressure of the closed space and the atmospheric pressure, and it is set so that any of the first sealing part or the second sealing part is closed under the pressure difference. A part or all of one side is preferentially opened, so it is possible to shorten the time required for the door cleaning process or the closed space cleaning process, and to prevent unwanted gas that causes changes in the performance of the object to be transported (wafers, etc.) A load port of a structure that flows into the transfer chamber, and an EFEM equipped with such a load port.
1‧‧‧設備前端模組(EFEM) 1‧‧‧Equipment Front-End Module (EFEM)
2‧‧‧裝載端口 2‧‧‧Load port
2C‧‧‧控制部 2C‧‧‧Control Department
3‧‧‧搬運室 3‧‧‧Transportation room
3A‧‧‧前壁面 3A‧‧‧Front wall
3B‧‧‧後壁面 3B‧‧‧rear wall
3C‧‧‧控制部 3C‧‧‧Control Department
3S‧‧‧空間 3S‧‧‧Space
4‧‧‧FOUP 4‧‧‧FOUP
4S‧‧‧空間 4S‧‧‧Space
5‧‧‧第一密封部 5‧‧‧The first sealing part
5A‧‧‧上邊部分 5A‧‧‧upper part
5B‧‧‧下邊部分 5B‧‧‧lower part
5C‧‧‧側邊部分 5C‧‧‧side part
6‧‧‧第二密封部 6‧‧‧Second sealing part
6A‧‧‧上邊部分 6A‧‧‧upper part
6B‧‧‧下邊部分 6B‧‧‧lower part
6C‧‧‧側邊部分 6C‧‧‧side part
8‧‧‧排氣單元 8‧‧‧exhaust unit
21‧‧‧基座 21‧‧‧base
21a‧‧‧開口部 21a‧‧‧opening
21b‧‧‧插通孔 21b‧‧‧Through hole
21A‧‧‧前面 21A‧‧‧front
21B‧‧‧後面 21B‧‧‧behind
22‧‧‧裝載端口門 22‧‧‧Loading port door
23‧‧‧載置台 23‧‧‧Placing table
24‧‧‧腳部 24‧‧‧Foot
25‧‧‧水平基台 25‧‧‧horizontal abutment
26‧‧‧底部清洗部 26‧‧‧Bottom cleaning part
27‧‧‧門移動機構 27‧‧‧Door moving mechanism
28‧‧‧罩 28‧‧‧cover
31‧‧‧搬運機器人 31‧‧‧Transportation robot
32‧‧‧風扇過濾器單元 32‧‧‧Fan filter unit
41‧‧‧搬出入口 41‧‧‧Exit entrance
42‧‧‧FOUP主體 42‧‧‧FOUP subject
42B‧‧‧後面 42B‧‧‧behind
43‧‧‧FOUP門 43‧‧‧FOUP door
45‧‧‧凸邊部 45‧‧‧Knurling part
71‧‧‧氣體注入部 71‧‧‧Gas injection part
71a‧‧‧氣體注入閥 71a‧‧‧Gas injection valve
72‧‧‧氣體排出部 72‧‧‧gas discharge part
72a‧‧‧氣體排出閥 72a‧‧‧Gas discharge valve
81‧‧‧排氣口 81‧‧‧exhaust port
82‧‧‧抽吸箱 82‧‧‧Suction box
211‧‧‧支柱 211‧‧‧Pillar
212‧‧‧基座主體 212‧‧‧Base body
213‧‧‧窗部 213‧‧‧window
214‧‧‧窗單元 214‧‧‧window unit
215‧‧‧開口部 215‧‧‧opening
216‧‧‧窗框部 216‧‧‧Window frame
216A‧‧‧前面 216A‧‧‧front
216B‧‧‧後面 216B‧‧‧behind
221‧‧‧連結機構 221‧‧‧Affiliated institutions
231‧‧‧突起 231‧‧‧Protrusion
232‧‧‧鎖定爪 232‧‧‧Locking Claw
261‧‧‧噴嘴 261‧‧‧Nozzle
271‧‧‧支撐框架 271‧‧‧Supporting frame
272‧‧‧滑動支撐部 272‧‧‧Sliding support part
273‧‧‧可動塊 273‧‧‧movable block
274‧‧‧滑動導軌 274‧‧‧Slide rail
321‧‧‧循環通道 321‧‧‧circulation channel
431‧‧‧面 431‧‧‧face
C‧‧‧全閉位置 C‧‧‧Fully closed position
D‧‧‧前後方向 D‧‧‧Forward and backward direction
D1‧‧‧圓形彈性體 D1‧‧‧Circular elastic body
D2‧‧‧非圓形彈性體 D2‧‧‧Non-circular elastomer
L‧‧‧移動限制部 L‧‧‧Movement Restriction Department
L1‧‧‧卡合片 L1‧‧‧Clip
L2‧‧‧拉入部 L2‧‧‧Pull in
M‧‧‧處理裝置 M‧‧‧processing device
MC‧‧‧控制部 MC‧‧‧Control Department
MS‧‧‧內部空間 MS‧‧‧Internal space
GS‧‧‧外部空間 GS‧‧‧External space
DS‧‧‧密閉空間 DS‧‧‧confined space
W‧‧‧晶片 W‧‧‧chip
O‧‧‧敞開位置 O‧‧‧open position
H‧‧‧垂直方向 H‧‧‧vertical direction
X‧‧‧優先敞開部分 X‧‧‧Priority open part
Y‧‧‧非敞開部分 Y‧‧‧non-open part
圖1是表示具備本發明的一個實施方式的裝載端口的EFEM及其周邊裝置的相對位置關係的示意性地表示的側視圖。 FIG. 1 is a schematic side view showing the relative positional relationship between an EFEM including a loadport and its peripheral devices according to an embodiment of the present invention.
圖2是局部省略地表示實施方式的裝載端口的立體圖。 FIG. 2 is a perspective view showing a load port according to the embodiment with parts omitted.
圖3是圖2的x方向向視圖。 FIG. 3 is a view taken along the x-direction of FIG. 2 .
圖4是圖2的y方向向視圖。 FIG. 4 is a y-direction view of FIG. 2 .
圖5是示意性地表示容器從框架離開而且裝載端口門處於全閉位置的狀態的該實施方式的裝載端口的側剖面的圖。 5 is a diagram schematically showing a side cross-section of the loadport of the embodiment in a state where the container is separated from the frame and the loadport door is in a fully closed position.
圖6是與圖5對應地表示容器經由第一密封部與框架抵接而且裝載端口門處於全閉位置的狀態的圖。 FIG. 6 is a diagram corresponding to FIG. 5 and showing a state where the container is in contact with the frame via the first sealing portion and the load port door is in the fully closed position.
圖7是與圖5對應地表示裝載端口門處於敞開位置的狀態的圖。 FIG. 7 is a diagram corresponding to FIG. 5 and showing a state where the load port door is in an open position.
圖8是該實施方式中的窗單元的整體立體圖。 Fig. 8 is an overall perspective view of the window unit in this embodiment.
圖9是圖6的主要部分放大圖,而且是示意性地表示維持第一密封部以及第二密封部的密封狀態的時刻的圖。 FIG. 9 is an enlarged view of a main part of FIG. 6 , and is a diagram schematically showing the timing at which the sealed state of the first sealing portion and the second sealing portion is maintained.
圖10是與圖9對應地表示在該實施方式中解除第一密封部的密封狀態的時刻的圖。 FIG. 10 is a diagram corresponding to FIG. 9 and showing the timing at which the sealing state of the first sealing portion is released in this embodiment.
圖11是與圖9對應地表示本發明的第二實施方式的裝載端口的主要部分的圖。 FIG. 11 is a diagram corresponding to FIG. 9 and showing a main part of a loadport according to a second embodiment of the present invention.
圖12是與圖11對應地表示在該實施方式中解除第二密封部的密封狀態的時刻的圖。 FIG. 12 is a diagram corresponding to FIG. 11 and showing the timing at which the sealing state of the second sealing portion is released in this embodiment.
以下,參照附圖對本發明的一個實施方式進行說明。 Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
本實施方式的裝載端口2例如在半導體的製造工序中使用,如圖1所示,在潔淨室內,構成搬運室3的壁面的一部分,且用於在搬運室3與容器4之間進行被搬運物的出入。在以下的說明中,對構成本發明的EFEM(Equipment Front End Module)的一部分的裝載端口2、即對使作為被搬運物的例如晶片W在容器4(例如在本實施方式中為FOUP)與搬運室3(晶片搬運室)之間進行出入處理的形態進行說明。此外,利用EFEM處理的晶片的尺寸作為SEMI(Semiconductor Equipment and Materials International)規格而標準化,但根據提高生產性的觀點,促進晶片的大直徑化,並推進從以往的直徑300mm向直徑450mm至直徑500mm的晶片的過度。
The
在以下的說明中,在FOUP4、裝載端口2、搬運室3以該順序排列的前後方向D,將搬運室3側定義為“後方”,將FOUP4側定義為“前方”,將與前後方向D以及垂直方向H正交的方向定義為“側方”。因此,在本實施方式中,搬運室3中配置了裝載端口2的壁面3A能夠看作前壁面。
In the following description, in the front-rear direction D in which
如圖1、圖5以及圖9所示,本實施方式中的FOUP4具備:通過形成於後面42B(基座21側的面)的搬出入口41而能夠使內部空間4S僅向後方敞開的FOUP主體42;以及能夠開閉搬出入口41的FOUP門43(相當於本發明的“容
器門”)。FOUP4是習知的結構,構成為,在內部沿上下方向H呈多層狀地容納多枚作為被搬運物的晶片W,經由搬出入口41能夠使這些晶片W出入。
As shown in FIG. 1 , FIG. 5 and FIG. 9 , the
FOUP主體42一體地具有前壁、左右一對側壁、上壁以及底壁。在由這些各壁包圍的內部空間4S具備多層能夠以預定間距載置晶片W的擱板部(晶片載置部)。在上壁的朝上的面的中央部,設置被容器搬運裝置(例如OHT:Over Head Transport)等把持的凸緣部。在FOUP主體42的後端部,設置比其它部分更靠上方以及兩側方突出的凸邊部45。也就是,在FOUP主體42中配置有FOUP門43的區域的周圍部分設置凸邊部45。
The FOUP
FOUP門43在載置於裝載端口2的後述的載置台23的狀態下,與裝載端口2的裝載端口門22對置,大致呈板狀。FOUP門43的高度尺寸設定為與裝載端口門22中隔著預定的間隙而與FOUP門43對置的面的高度尺寸大致相等。此外,圖5等中,示意性地表示設定為比裝載端口門22中隔著預定的間隙而與FOUP門43對置的面的高度尺寸稍大的高度尺寸的FOUP門43。在FOUP門43,設置能將該FOUP門43鎖定於FOUP主體42的閂鎖部(省略圖示)。在FOUP門43的朝內的面431中,在由FOUP門43封閉了搬出入口41的狀態下,在與FOUP主體42接觸或者接近的預定的部分設置墊圈(省略圖示)。並且,構成為,通過使墊圈比FOUP門43的朝內的面431優先與FOUP主體42接觸而彈性變形,從而能夠密閉FOUP4的內部空間4S。
The
如圖1至圖4所示,本實施方式的裝載端口2具備:基座21,其呈板狀,構成搬運室3的前壁面3A的一部分,而且形成有用於敞開搬運室3的內部空間3S的開口部21a;裝載端口門22,其開閉基座21的開口部21a;以及載置台23,其以大致水平姿勢設置在基座21。在此,用於敞開搬運室3的內部空間3S的開口部21a是為了敞開由基座21分隔的空間即搬運室3的內部空間3S而形成於基座21的開口。
As shown in FIGS. 1 to 4 , the
基座21呈大致矩形板狀,以起立姿勢配置,具有能夠與載置於載置台23上的FOUP4的搬出入口41連通的大小的開口部21a。本實施方式的裝載端口2能夠在使基座21與搬運室3貼緊的狀態下使用。另外,在基座21的下端,設置具有滾動輪以及設置腳的腳部24。在本實施方式中,應用基座21,該基座21具備:在兩側方起立的支柱211;由這些支柱211支撐的基座主體212;以及安裝於以大致矩形向基座主體212敞開的窗部213的窗單元214。
The
窗單元214設置在與FOUP門43對置的位置,設置在該窗單元214的開口部215相當於本發明的“能夠使搬運對象物通過的開口部”。
The
在此,本實施方式中所說的大致矩形是指以具備四邊的長方形為基本形狀,並且由圓弧平滑地連接四個角而成的形狀。此外,雖然未圖示,但在基座主體212中搬運室3側的面(前面)的外周附近,設置形成為矩形框狀的作為彈性件的墊圈,通過使墊圈與搬運室3中裝配有基座21的開口的緣部附近接觸,來消除基座主體212與搬運室3的間隙,抑制氣體通過基座主體212與搬運室3的間隙從搬運室3的內部空間3S向外部GS洩漏。
Here, the substantially rectangular shape in this embodiment refers to a shape in which the basic shape is a rectangle having four sides and the four corners are smoothly connected by circular arcs. In addition, although not shown, a gasket formed in a rectangular frame shape as an elastic member is provided near the outer periphery of the surface (front surface) of the transfer chamber 3 in the
裝載端口2的載置台23設置在水平基台25(支撐台)的上部,該水平基台25(支撐台)以大致水平姿勢配置在基座21中比高度方向中央稍微靠上方的位置。該載置台23能夠以使FOUP門43與裝載端口門22對置的朝向載置FOUP4,該FOUP門43能夠開閉FOUP主體42的內部空間4S。另外,如圖5以及圖6所示,載置台23構成為,能夠在FOUP門43與基座21的開口部21a接近的預定的對接位置(參照圖6)、和使FOUP門43相比對接位置從基座21離開預定距離的位置(參照圖5)之間相對於基座21進退移動。如圖2所示,載置台23具有向上突出的多個突起(銷)231,通過使這些突起231與形成於FOUP4的底面的孔(省略圖示)卡合,從而實現載置台23上的FOUP4的定位。此外,圖5以及圖6等中,作為載置台23上的FOUP4的載置狀態,示出了FOUP4的底面與載置台23的上表
面接觸的狀態。然而,實際上,通過載置台23的比上表面更向上方突出的多個定位用突起231與形成於FOUP4的底面的有底的孔卡合來支撐FOUP4,載置台23的上表面與FOUP4的底面相互不接觸,規定為在載置台23的上表面與FOUP4的底面之間形成有預定的間隙。另外,設置用於相對於載置台23固定FOUP4的鎖定爪232。通過將該鎖定爪232牽拉到設於FOUP4的底面的被鎖定部(省略圖示)而處於固定的鎖定狀態,從而能夠與定位用的突起231協作地將FOUP4引導至載置台23上的適當的位置並且固定。另外,通過解除鎖定爪232相對於設置在FOUP4的底面的被鎖定部的鎖定狀態,從而能夠使FOUP4處於能夠從載置台23離開的狀態。
The mounting table 23 of the
本實施方式的裝載端口2在載置台23上的預定部位設置多個噴嘴261。這些噴嘴261從FOUP4的底面側向該FOUP4內注入氮氣、惰性氣體或者乾燥空氣等適當選擇的氣體即環境氣體(也稱為清洗氣體,主要使用氮氣、乾燥空氣),構成能夠將FOUP4內的氣體氣氛置換為環境氣體的底部清洗部26。這些多個噴嘴261作為將環境氣體注入到FOUP4內的底部清洗注入用噴嘴、將FOUP4內的氣體氣氛排出的底部清洗排出用噴嘴發揮功能,例如能夠設置為在沿載置台23的寬度方向離開的位置上成對。另外,這些多個噴嘴261能夠以嵌合的狀態與設置在FOUP4的底部的注入口以及排出口(均省略圖示)連結。各噴嘴261(底部清洗注入用噴嘴、底部清洗排出用噴嘴)或者注入口以及排出口具有限制氣體的倒流的閥功能。各噴嘴261(底部清洗注入用噴嘴、底部清洗排出用噴嘴)與FOUP4的注入口以及排出口的嵌合部分通過設於噴嘴261的襯墊等而成為密閉狀態。此外,本實施方式的裝載端口2如果是在載置台23上未載置FOUP4的狀態,則將各噴嘴261(底部清洗注入用噴嘴、底部清洗排出用噴嘴)定位於比載置台23的上表面靠下方。並且,構成為,在檢測到FOUP4中的底面部按壓設置於載置台23的例如加壓傳感器的被按壓部的情況時,根據來自控制
部2C的信號,使各噴嘴261(底部清洗注入用噴嘴、底部清洗排出用噴嘴)向上方推進而分別與FOUP4的注入口和排出口連結。
In the
裝載端口門22具備連結機構221,該連結機構221能夠在蓋連結狀態與蓋連結解除狀態之間進行切換,該蓋連結狀態是將該裝載端口門22連結於FOUP門43並能夠將FOUP門43從FOUP主體42拆下的狀態,該蓋連結解除狀態是解除相對於FOUP門43的連結狀態,而且將FOUP門43安裝於FOUP主體42的狀態(參照圖4)。裝載端口門22在通過連結機構221以一體化的狀態保持FOUP門43的狀態下能夠沿預定的移動路徑移動。如圖5以及圖6所示,本實施方式的裝載端口2構成為能夠使裝載端口門22至少在全閉位置C與敞開位置O之間移動,該全閉位置C是由該裝載端口門22所保持的FOUP門43密閉FOUP主體42的內部空間4S的位置,該敞開位置O是使該裝載端口門22所保持的FOUP門43從FOUP主體42離開而使該FOUP主體42的內部空間4S朝向搬運室3內敞開的位置。本實施方式的裝載端口2構成為,能夠在維持定位於圖5以及圖6所示的全閉位置C的裝載端口門22的起立姿勢的狀態下移動至圖7所示的敞開位置O,並且,能夠在從圖7所示的敞開位置O至未圖示的全開位置維持起立姿勢的狀態向下方向移動。即、全閉位置C與全開位置之間的裝載端口門22的移動路徑包括:使位於全閉位置C的裝載端口門22在維持其高度位置的狀態下向搬運室3側移動至敞開位置O的路徑(水平路徑);以及使位於敞開位置O的裝載端口門22在維持其前後位置的狀態下向下方移動的路徑(鉛垂路徑),在作為水平路徑與鉛垂路徑相交的點的敞開位置O,裝載端口門22的移動方向從水平方向切換為鉛垂方向、或者從鉛垂方向切換為水平方向。保持在定位於敞開位置O的裝載端口門22的FOUP門43與裝載端口門22一起定位於比基座21靠後方的位置(從FOUP主體42完全離開,且配置於搬運室3的內部空間3S的位置),以便定位於敞開位置O的裝載端口門22能夠向鉛垂方向以及水平方向的任意方向移動。
The
這樣的裝載端口門22的移動通過設置在裝載端口2的門移動機構27來實現。如圖5至圖7所示,門移動機構27具備:支撐裝載端口門22的支撐框架271;經由滑動支撐部272能夠在前後方向D上移動地支撐支撐框架271的可動塊273;能夠在上下方向H上移動地支撐可動塊273的滑動導軌274;以及用於進行裝載端口門22沿水平路徑的前後方向D的移動、以及沿鉛垂路徑的上下方向H的移動的驅動源(例如未圖示的驅動器)。通過從控制部2C對該驅動器給與驅動指令,從而能夠使裝載端口門22在前後方向D以及上下方向H上移動。此外,既可以是分別具備前後移動用的驅動器和上下移動用的驅動器的形態,也可以是將共用的驅動器作為驅動源來進行前後移動以及上下移動的形態。
Such movement of the
支撐框架271支撐裝載端口門22的後部下方。該支撐框架271是朝向下方延伸後、通過形成於基座21的狹縫狀的插通孔21b並向搬運室3的外側(載置台23側)伸出的大致曲柄狀的構件。在本實施方式中,將用於對支撐框架271進行支撐的滑動支撐部272、可動塊273以及滑動導軌274配置在搬運室3的外側。這些滑動支撐部272、可動塊273、滑動導軌274成為使裝載端口門22移動時的滑動部位。在本實施方式中,通過將上述部件配置在搬運室3的外側,從而即使在裝載端口門22移動時萬一產生了顆粒的情況下,通過將插通孔21b設定為微小的狹縫狀,也能夠防止或抑制顆粒進入搬運室3內的事態。另外,設置罩28,該罩28覆蓋門移動機構27中配置在搬運室3的外側的零件、部分、具體而言支撐框架271的一部分、滑動支撐部272、可動塊273以及滑動導軌274。由此,設定為搬運室3內的環境氣體不通過形成於基座21的上述插通孔21b而向EFEM1的外部GS流出
The
如圖5以及圖9等所示,本實施方式的裝載端口2具備設置在開口部21a的周緣附近的第一密封部5和第二密封部6,構成為在裝載端口門22位於關閉狀態而且經由第一密封部5使FOUP門43與基座21抵接的狀態下,形成有密閉
空間DS,該密閉空間DS通過第一密封部5、第二密封部6將FOUP門43以及裝載端口門22在前後方向D上隔開預定的間隙地對置的空間與外部GS分隔開。在本實施方式中,將第一密封部5以及第二密封部6作為上述窗單元214而單元化。
As shown in FIG. 5 and FIG. 9, etc., the
如圖2至圖4以及圖8所示,窗單元214構成為以框形狀的窗框部216為主體,該框形狀的窗框部216在該窗單元214中與FOUP門43對置的位置(在圖示例中為窗單元214的中央部分)具有大致矩形的開口部215。
As shown in FIGS. 2 to 4 and 8 , the
在本實施方式中,構成為,將窗框部216的開口部215設定為比FOUP門43的外周(外部尺寸)稍大的開口尺寸,FOUP門43能夠以保持於裝載端口門22的狀態通過該開口部215向搬運室3內移動。窗框部216的開口部215是基座21的開口部21a本身。
In this embodiment, the
第一密封部5以環繞開口部21a的方式設置在基座21的前面中的開口部21a的開口緣附近區域,在將載置了FOUP4的載置台23定位於對接位置時,對基座21的開口部21a的周緣與FOUP4之間進行密封(參照圖6以及圖9等)。在採用了在基座21安裝窗單元214的結構的本實施方式中,在窗框部216的前面216A中的開口部215的開口緣附近區域,在環繞開口部215的位置設置第一密封部5(參照圖8)。具體而言,在窗框部216的前面216A中、與作為FOUP主體42的後面42B的FOUP密封面(FOUP主體42中設定於FOUP門43的周圍部分的面)對置的位置,環繞地安裝第一密封部5。以環繞開口部215的方式配置在呈矩形的開口部215的開口緣附近的第一密封部5從FOUP4側觀察時呈大致矩形。因此,如圖8所示,第一密封部5大致區分為配置在開口部215的開口上緣附近的上邊部分5A、配置在開口部215的開口下緣附近的下邊部分5B、分別配置在開口部215的開口兩側緣附近的側邊部分5C。以具備這四個邊部分5A、5B、5C的長方形為基本形狀的本實施方式的第一密封部5具有由圓弧平滑地連接四個角而成的形狀。
The
並且,在本實施方式中,如圖9所示,第一密封部5的大部分由剖面形狀為大致圓形的彈性體(圓形彈性體D1)形成,一部分由剖面形狀為比大致圓形的彈性體更容易彈性變形的彈性體(非圓形彈性體D2)形成。具體而言,第一密封部5中包含下邊部分5B整體、左右兩側邊部分5C整體、以及上邊部分5A的寬度方向兩端部的預定部分由圓形彈性體D1形成,第一密封部5中上邊部分5A的寬度方向中央部分由非圓形彈性體D2形成。本實施方式的非圓形彈性體D2是剖面形狀為棒形狀(剖面觀察時長度方向的尺寸比大致圓形的彈性體的直徑大的棒形狀)而且是以帶圓形的前端部分隨著朝向前方而逐漸向上方位移的姿勢(跳起的姿勢、前端部分向朝向密閉空間DS之外GS的方向位移的姿勢)配置的彈性體。此外,在圖5至圖8中,示意性地示出第一密封部5而未明確地區別為圓形彈性體D1和非圓形彈性體D2。
In addition, in this embodiment, as shown in FIG. 9 , most of the
在將載置FOUP4的載置台23定位於對接位置時,這樣的第一密封部5介於基座21的開口部21a的周緣與FOUP4之間發揮密封功能。在發揮密封功能的狀態下,在包含第一密封部5的密封區域的密閉空間DS與外部GS(大氣壓下)的壓力差例如在500Pa(G)以下、較佳在300Pa(G)以下的情況下,如圖10所示,第一密封部5中由非圓形彈性體D2形成的部分比由圓形彈性體D1形成的部分優先解除密封狀態而敞開。以下,將第一密封部5中由非圓形彈性體D2形成的部分作為優先敞開部分X,將由圓形彈性體D1形成的部分作為非敞開部分Y。
Such a
在圖9中,示出第一密封部5(優先敞開部分X以及非敞開部分Y的兩方)與載置在定位於預定的對接位置的載置台23上的FOUP4彈性接觸的狀態。本實施方式的裝載端口2以使第一密封部5向裝載端口門22中比最接近FOUP4的端面更靠FOUP4側突出預定尺寸(例如0.1mm以上且3mm以下)的形
態配置。因此,FOUP門43以及裝載端口門22相互不接觸,能夠由第一密封部5維持形成於基座21與裝載端口門22之間的密閉空間DS的高密閉性。
9 shows a state in which the first seal portion 5 (both the open portion X and the non-open portion Y) is in elastic contact with the
即、如圖9所示,第一密封部5與載置在定位於預定的對接位置的載置台23上的FOUP主體42的後面42B彈性接觸。尤其是,第一密封部5的優先敞開部分X與FOUP4彈性接觸,由此,相比於與FOUP4彈性接觸前的時刻,前端部分以向上方(朝向密閉空間DS之外GS的方向)被頂起的形態彈性變形。另外,第一密封部5中的非敞開部分Y通過與載置在定位於預定的對接位置的載置台23上的FOUP主體42的後面42B彈性接觸,從而相比於與FOUP4彈性接觸前的時刻,以在前後方向D上被壓癟的形態彈性變形。通過維持這樣的第一密封部5與FOUP4的彈性接觸狀態,從而能夠形成良好的密封區域。
That is, as shown in FIG. 9 , the
此外,在圖5至圖7中,用塗黑的大致橢圓形狀的標記示意性地表示第一密封部5以及第二密封部6。另外,在圖6以及圖7中,FOUP主體42的後面42B(密封面)與基座21(窗單元214)接觸,但實際上,FOUP主體42的密封面與基座21(窗單元214)不接觸,如上所述,第一密封部5介於FOUP主體42的密封面與基座21(窗單元214)之間。
In addition, in FIGS. 5 to 7 , the
第二密封部6以環繞開口部21a的方式設置在基座21的後面21B中的開口部21a的開口緣附近區域。在採用了在基座21安裝窗單元214的結構的本實施方式中,在窗框部216的後面216B中的開口部215的開口緣附近區域,在環繞開口部215的位置設置第二密封部6。具體而言,在窗框部216的後面216B中、與裝載端口門22的前面、也就是設定於基座的整面21A的預定部分的密封面(裝載端口門22中的設定於外緣部分的面)對置的位置,環繞地安裝第二密封部6。在本實施方式中,在裝載端口門22的外緣部分形成凸邊狀的薄壁部,將該薄壁部設定於裝載端口門22的密封面。以環繞開口部215的方式配置在呈矩形的開口部215的開口緣附近的第二密封部6從搬運室3側觀察呈大致矩形。
The
在本實施方式中,作為第二密封部6,應用剖面形狀為大致圓形的O型圈,遍及第二密封部6的上邊部分6A、下邊部分6B、左右的兩側邊部分6C配置共用的O型圈。這樣,在本實施方式中,第二密封部6的全部由剖面形狀為大致圓形的彈性體(圓形彈性體D1)形成,第二密封部6的全部設定於“非敞開部分Y”。並且,在將裝載端口門22定位於關閉位置時,裝載端口門22(更具體地為薄壁部)經由第二密封部6成為與窗框部216的後面216B抵接的狀態,第二密封部6對基座21的開口部21a的周緣與裝載端口門22之間進行密封(參照圖9)。其結果,在將裝載端口門22定位於關閉位置的狀態下,能夠抑制氣體從搬運室3的內部空間3S向搬運室3的外部的流出、氣體從搬運室3的外部向搬運室3的內部空間3S的流入。此外,裝載端口門22中作為除薄壁部以外的部分的中央部分是厚度比薄壁部厚的較大的厚壁部,該厚壁部以從基座21的開口部21a(窗框部216的開口部215)朝向前方伸出的形態,設定為面朝開口部21a(開口部215)。
In the present embodiment, as the
在本實施方式的裝載端口2,在窗框部216的前面216A以及後面216B分別以環繞開口部215的開口緣附近的方式,形成剖面成為凹形的安裝槽(在圖9以及圖10中,供第一密封部5、第二密封部6嵌入的凹部)。在將第一密封部5、第二密封部6分別插入到各密封安裝槽的狀態下緊密地安裝。尤其是,供第一密封部5中的優先敞開部分X安裝的密封安裝槽設定為朝向槽的進深方向而逐漸擴展的剖面梯形,在使設置在優先敞開部分X的基端部的插入部嵌合於該梯形的密封安裝槽的狀態下,通過粘接劑等適當的措施來固定。由此,防止第一密封部5的優先敞開部分X從密封安裝槽脫落的事態。在該安裝狀態下,第一密封部5以及第二密封部6中未容納於安裝槽的部分向安裝槽外露出。
In the
另外,本實施方式的裝載端口2具備移動限制部L,該移動限制部L限制定位於對接位置的載置台23上的FOUP4向離開基座21的方向(後方)移動。在本實施方式中,將移動限制部L作為窗單元214而單元化。
In addition, the
移動限制部L能夠在移動限制狀態與移動允許狀態之間切換,該移動限制狀態是限制定位於對接位置的載置台23上的FOUP4向離開基座21的方向(後方)移動的狀態,該移動允許狀態是允許定位於對接位置的載置台23上的FOUP4向離開基座21的方向移動的狀態。即、移動限制部L通過成為移動限制狀態而能夠保持載置在定位於預定的對接位置的載置台23上的FOUP4。
The movement restricting part L can be switched between a movement restricting state in which the
如圖8等所示,本實施方式中的移動限制部L具備:能夠與FOUP主體42中設於FOUP門43的周圍部分的凸邊部45卡合的卡合片L1;以及在使卡合片L1與凸邊部45卡合的狀態下向基座21側移動的拉入部L2。這樣的移動限制部L發揮能夠以將FOUP主體42的凸邊部45夾入卡合片L1與基座21之間的狀態來保持的夾緊功能。在本實施方式中,在基座21設置窗單元214。因此,移動限制部L具有將FOUP主體42的凸邊部45夾入卡合片L1與窗單元214的窗框部216之間的功能。
As shown in FIG. 8 etc., the movement restricting portion L in this embodiment includes: an engaging piece L1 capable of engaging with a
卡合片L1包含前端的整體能夠在前後方向D上不面對FOUP4的非面對姿勢、與面對FOUP4的面對姿勢(圖8所示的姿勢)之間變更姿勢。本實施方式的裝載端口2通過使卡合片L1處於非面對姿勢,而能夠使載置FOUP4的載置台23在FOUP門43接近開口部215的預定的對接位置、和與對接位置相比從搬運室3離開預定距離的位置之間移動。即、移動限制部L通過使卡合片L1處於非面對姿勢而成為移動允許狀態。
The entire engagement piece L1 including the front end can change its posture between a non-facing posture that does not face the
這樣的移動限制部L在使卡合片L1處於非面對姿勢的狀態下,在使處於門對接位置的載置台23以載置有FOUP4的狀態向對接位置移動的時刻以後,使處於非面對姿勢的卡合片L1向拉入至搬運室3側的方向移動而從非面對姿
勢變更為面對姿勢。於是,能夠使卡合片L1與在FOUP主體42的後面42B向外側方伸出的凸邊部45卡合。並且,通過由拉入部L2向搬運室3側拉入卡合片L1,從而在維持卡合片L1與FOUP4的凸邊部45的卡合狀態的狀態下,卡合片L1被拉入至搬運室3側(後方)。其結果,成為將FOUP4的凸邊部45夾入卡合片L1與基座21之間的狀態,從而能夠限制定位於對接位置的載置台23上的FOUP4向離開基座21的方向移動。即、移動限制部L使卡合片L1從非面對姿勢變更為面對姿勢,通過由拉入部L2將該卡合片L1拉入至基座21側而成為移動限制狀態(圖8所示的狀態)。
Such a movement restricting portion L makes the engaging piece L1 in the non-facing posture, and after the moment when the mounting table 23 in the door abutting position is moved to the abutting position with the
在本實施方式的裝載端口2中,如圖2以及圖8所示,將這樣的移動限制部L分別配置在基座21中呈大致矩形的開口部21a的兩側中的上端附近以及下端附近的合計四個部位。具體而言,在窗單元214中的窗框部216中呈大致矩形的開口部215的兩側部,且在上下方向上離開的合計四個部位配置移動限制部L。
In the
在本實施方式中,如圖9所示,載置在定位於對接位置的載置台23上的FOUP4中的FOUP主體42的後面42B隔著預定尺寸的間隙而與基座21的前面21A(窗框部216的前面216A)接近,並構成為能夠由第一密封部5密封該間隙。另外,就本實施方式的裝載端口2而言,在將載置台23定位於預定的對接位置的時刻以後,如果裝載端口門22處於關閉狀態,則FOUP門43與裝載端口門22隔著預定尺寸的間隙而接近,並且構成為能夠由第二密封部6密封裝載端口門22與基座21之間。因此,裝載端口門22與FOUP門43隔著預定尺寸的間隙而對置的空間成為由第一密封部5以及第二密封部6分隔出的密閉空間DS。
In this embodiment, as shown in FIG. 9 , the
如圖5以及圖9等所示,本實施方式的裝載端口門22具備:相對於密閉空間DS注入氣體的氣體注入部71;以及排出密閉空間DS的氣體的氣體排出部72。氣體注入部71例如使用長尺寸的噴嘴而構成,使噴嘴的一端(氣體注入
方向下游端)到達至裝載端口門22的外表面,並且在噴嘴的另一端(氣體注入方向上游端)附近連接氣體注入閥71a。同樣,氣體排出部72例如也使用噴嘴而構成,使噴嘴的一端(氣體排出方向上游端)到達至裝載端口門22的外表面,並且在噴嘴的另一端(氣體排出方向下游端)附近連接氣體排出閥72a。根據這樣的結構,通過利用氣體注入部71向密閉空間DS供給環境氣體(本實施方式中為氮氣),並利用氣體排出部72對密閉空間DS進行排氣,從而能夠對密閉空間DS進行氣體清洗。將FOUP門43以及裝載端口門22隔著預定間隙而對置的密閉空間DS置換為氣體的氣體清洗處理是本發明中的“門清洗處理”。
As shown in FIGS. 5 and 9 , the
如圖5所示,氣體注入部71的氣體注入方向上游端、氣體注入閥71a、氣體排出部72的氣體排出方向下游端、氣體排出閥72a由上述罩28覆蓋。此外,構成氣體注入部71以及氣體排出部72的各噴嘴的預定部分沿厚度方向(前後方向D)貫通裝載端口門22。對裝載端口門22中噴嘴所貫通的部分實施適當的密封處理。在本實施方式中,應用撓性或者伸縮性(也包含褶皺類型)優異的噴嘴。也能夠用管來代替噴嘴的一部分或者全部。圖5等中,氣體注入部71以及氣體排出部72中向搬運空間3S露出的部分實際上收納於從搬運室3側覆蓋裝載端口門22的門罩(省略圖示)內。
As shown in FIG. 5 , the upstream end in the gas injection direction of the
這樣構成的裝載端口2通過從控制部2C向各部給與驅動指令來執行預定的動作。本實施方式的EFEM1沿搬運室3的前壁面3A並排配置多個(例如3台)這樣的裝載端口2。
The
如圖1所示,EFEM1以在共用的潔淨室內設置在相互相鄰的位置的裝載端口2以及搬運室3為主體而構成。EFEM1的工作由裝載端口2的控制器(圖2所示的控制部2C)、EFEM1整體的控制器(圖1所示的控制部3C)來控制。
As shown in FIG. 1 , the
在搬運室3中與配置裝載端口2的前壁面3A對置的後壁面3B相鄰地設有例如處理裝置M(半導體處理裝置)。在潔淨室,處理裝置M的內部空間
MS、搬運室3的內部空間3S以及載置在裝載端口2上的FOUP4的內部空間4S維持為高清潔度。另一方面,配置裝載端口2的空間、換言之,處理裝置M外、EFEM1外相對成為低清潔度。此外,圖1是示意性地表示裝載端口2以及搬運室3的相對位置關係、以及具備裝載端口2以及搬運室3的EFEM1、與處理裝置M的相對位置關係的側視圖。
In the transfer chamber 3 , for example, a processing device M (semiconductor processing device) is provided adjacent to a
處理裝置M具備:配置在離搬運室3相對較近的位置的裝載鎖定室;以及配置在離搬運室3相對較遠的位置的處理裝置主體。在本實施方式中,如圖1所示,在EFEM1的前後方向D,使裝載端口2、搬運室3、處理裝置M配置為以該順序相互緊密接觸。此外,處理裝置M的工作由處理裝置M的控制器(圖1所示的控制部MC)來控制。在此,作為處理裝置M整體的控制器的控制部MC、作為EFEM1整體的控制器的控制部3C是裝載端口2的控制部2C的上位控制器。
The processing apparatus M includes: a load lock chamber arranged relatively close to the transfer chamber 3 ; and a processing apparatus main body arranged relatively far from the transfer chamber 3 . In the present embodiment, as shown in FIG. 1 , the
搬運室3在內部空間3S設置有搬運機器人31,該搬運機器人31能夠在FOUP4與處理裝置M之間搬運作為被搬運物的晶片W。搬運機器人31例如將多個連杆要素連結成能夠相互水平回轉,具備在前端部設置手的臂、和能夠回轉地支撐構成臂的基端部的臂基座而且沿搬運室3的寬度方向(裝載端口2的並列方向)行走的行走部,是在臂長成為最小的折疊狀態與臂長成為比折疊狀態時更長的伸長狀態之間改變形狀的連杆構造(多關節構造)。此外,也能夠構成在搬運室3的側面配置緩衝位、對準器的任一方或者兩方的EFEM。
The transfer chamber 3 is provided with a
搬運室3通過裝載端口2以及處理裝置M連接從而內部空間3S成為大致密閉的狀態。搬運室3內通過使用未圖示的氣體供給口以及氣體排出口來進行預定的氣體(惰性氣體或者氮氣等環境氣體)的清洗處理,能夠提高環境氣體濃度。並且,在晶片搬運室3的上部設置風扇過濾器單元32來朝向下方送出氣體,利用設置在下部的化學過濾器進行氣體的抽吸。抽吸的氣體經由循環通道321朝向上部的風扇過濾器單元32返回。這樣,在搬運室3的內部空間3S形成
從上方朝向下方的氣流即直流。因此,能夠使搬運室3內的環境氣體循環而維持為清潔的狀態。另外,即使在搬運室3的內部空間3S存在污染晶片W的表面的顆粒的情況下,也能夠利用直流向下方壓下顆粒,能夠抑制顆粒附著於搬運中的晶片W的表面。圖1中用箭頭示意性地示出風扇過濾器單元32的氣體的流動。
The transfer chamber 3 is connected to the processing device M through the
本實施方式的裝載端口2通過從控制部2C向各部給與驅動指令來執行預定的動作。在本實施方式中,構成為從裝載端口2所具有的控制部2C向各部給與驅動指令。控制部2C由具備CPU、存儲器以及接口的通常的微處理器等構成,在存儲器預先儲存處理所需要的程序,CPU逐次取出必要的程序並執行,與周邊硬件協作來實現所希望的功能。
The
以下,與具備裝載端口2的EFEM1的使用方法以及作用一起來說明EFEM1的動作流程。
Hereinafter, the operation flow of the EFEM1 will be described together with the usage and function of the EFEM1 provided with the
首先,FOUP4利用在搬運室3中沿配置裝載端口2的共用的前壁面3A延伸的直線上的搬運線(作業線)上工作的OHT等容器搬運裝置被搬運至裝載端口2的上方,並載置在載置台23上。此時,例如設置在載置台23上的定位用突起231嵌入FOUP4的定位用凹部。另外,控制部2C使載置台23上的鎖定爪232處於鎖定狀態(鎖定處理)。具體而言,通過相對於設置在FOUP4的底面的被鎖定部(省略圖示)牽拉並固定載置台23上的鎖定爪232而處於鎖定狀態。由此,能夠將FOUP4載置並固定於載置台23上的預定的正規位置。在本實施方式中,能夠在沿搬運室3的寬度方向並排配置有3台裝載端口2的載置台23上分別載置FOUP4。另外,也能夠構成為利用檢測FOUP4是否載置在載置台23上的預定的位置的落座傳感器(省略圖示)來檢測FOUP4載置在載置台23上的正規位置的情況。
First, the
接著,在本實施方式的裝載端口2,控制部2C使處於圖5所示的位置的載置台23移動至圖6所示的對接位置(對接處理)。即、使處於圖5所示
的位置的載置台23朝向基座21移動,使FOUP4的後面(相互成為同一面的FOUP主體42的後面42B以及FOUP門43的朝外的面)向基座21中的開口部21a的周緣中的最接近FOUP主體42的基座最前面21A接近至預定距離。移動限制部L將卡合片L1維持為處於非面對姿勢的移動允許狀態,直至進行該對接處理。此外,圖5等中的符號21B所指的面是在基座21中的開口部21a(窗框部216的開口部215)的周緣離FOUP主體42最遠的基座最後面。
Next, in the
並且,若使載置台23移動至預定的對接位置,則在本實施方式的裝載端口2中,控制部2C進行使用移動限制部L來保持並固定FOUP4的至少兩側的處理。具體而言,利用移動限制部L的拉入部L2將卡合片L1拉入至基座21側。於是,卡合片L1從非面對姿勢切換為面對姿勢,成為與FOUP主體42的凸邊部45卡合的狀態。在該狀態下,能夠將定位於對接位置的載置台23上的FOUP4的凸邊部45夾入移動限制部L的卡合片L1與基座最前面21A(窗框部216的前面216A)之間。即、容器夾緊處理通過使移動限制部L從移動允許狀態切換為移動限制狀態的處理來實現。
Then, when the mounting table 23 is moved to a predetermined docking position, in the
此外,將移動限制部L從移動允許狀態切換為移動限制狀態的時機在將載置台23定位於對接位置的時刻以後即可,也可以做成將載置台23定位於對接位置之後不久、將移動限制部L從移動允許狀態切換為移動限制狀態的結構。另外,也可以做成從將載置台23定位於對接位置起經過預定時間後、將移動限制部L從移動允許狀態切換為移動限制狀態的結構。 In addition, the timing of switching the movement restricting part L from the movement-allowed state to the movement-restricted state may be after the moment when the mounting table 23 is positioned at the docking position, or it may be made to move immediately after the mounting table 23 is positioned at the docking position. The restricting part L is configured to switch from a movement-allowed state to a movement-restricted state. In addition, a configuration may be adopted in which the movement restricting portion L is switched from the movement permitted state to the movement restricted state after a predetermined time has elapsed since the mounting table 23 was positioned at the docking position.
並且,在本實施方式的裝載端口2中,在結束了容器夾緊處理的時刻,在基座21的開口部21a(窗框部216的開口部215)的附近,載置在定位於對接位置的載置台23上的FOUP4中設定為密封面的FOUP主體42的後面42B與基座21的第一密封部5彈性接觸,能夠通過第一密封部5的彈性變形來在FOUP4與基座21之間形成良好的密封區域。即、在本實施方式的裝載端口2中,通過實施
容器夾緊處理,能夠同時實施在FOUP4與基座21之間形成良好的密封區域的處理(密封處理)。
In addition, in the
具體而言,第一密封部5所彈性接觸的部分是FOUP主體42的後面42B中環繞FOUP4的搬出入口41的附近的部分。在本實施方式的裝載端口2中,將FOUP主體42的後面42B作為密封面,形成即使因振動等而密封面變動的情況下也能夠立即追隨的密封區域。在本實施方式的裝載端口2中,經過容器夾緊處理,能夠維持利用移動限制部L固定定位於對接位置的載置台23上的FOUP4的狀態。因此,能夠防止與第一密封部5彈性接觸的FOUP4向離開基座21的方向移動、或者傾斜轉動的事態。尤其是,在本實施方式中,利用配置在呈大致矩形的開口部215的兩側的上端附近以及下端附近的合計四個部位的移動限制部L,能夠固定FOUP主體42的前端部中的兩側的上端附近以及下端附近的合計四個部位。
Specifically, the portion that the
在本實施方式的裝載端口2中,控制部2C繼容器夾緊處理以及密封處理之後,進行向密閉空間DS供給氮氣並且利用氣體排出部72排出至此停留在密閉空間DS的氣體(大氣)的處理(門清洗處理)。門清洗處理是將從適當的氣體供給源供給的氮氣注入密閉空間DS內,將密閉空間DS內置換為氮氣的處理。具體而言,是如下處理:打開門清洗用氣體注入閥71a,由此從氣體注入部71向密閉空間DS供給氮氣,同時,打開門清洗用氣體排出閥72a,利用氣體排出部72排出至此停留在密閉空間DS的氣體(大氣)。在此,大氣包含使晶片W氧化等有可能使晶片W的性能發生變化的氧氣、水分、顆粒等。此外,如果是FOUP門43的內部為中空,並且FOUP門43的內部空間通過形成於FOUP門43的後面的孔(門保持用孔等)與密閉空間DS連通的結構,就能夠通過本實施方式的門清洗處理來將FOUP門43的內部空間置換為氮氣。
In the
在本實施方式中,設定為在門清洗處理時使氮氣的供給量比氮氣的排出量多,由此使密閉空間DS處於正壓。並且,如圖10所示,在密閉空間DS成為正壓的時刻以後的適當的時機,第一密封部5中的優先敞開部分X(在本實施方式中為上邊部分5A的寬度方向中央部分)成為比第一密封部5的其它部分以及第二密封部6也就是非敞開部分Y優先敞開的狀態。即、使第一密封部5中的前端部分以跳起的形態與FOUP4的密封面彈性接觸的優先敞開部分X被充滿於密閉空間DS的氮氣按壓而彈性變形,通過優先敞開部分X的前端部向跳起的方向變形,從而解除相對於FOUP4的密封面的彈性接觸狀態。其結果,本實施方式的裝載端口2能夠從第一密封部5中敞開的(解除了彈性接觸狀態的)部分、即優先敞開部分X排出密閉空間DS內的氮氣(圖10中用箭頭示意性表示排氣方向)。從第一密封部5的優先敞開部分X能夠排出氮氣的時刻以後也繼續進行相對於密閉空間DS的氮氣的供給以及氮氣的排出,繼續向密閉空間DS填充氣體。從門清洗處理開始經過預定時間後,關閉門清洗用氣體注入閥71a以及門清洗用氣體排出閥72a,由此結束向密閉空間DS填充氣體。此外,也可以反復進行從氣體注入部71向密閉空間DS注入氣體的氣體注入動作、和利用氣體排出部72從密閉空間DS排出氣體的排出動作。本實施方式的裝載端口2在門清洗處理中也能夠維持第一密封部5的非敞開部分Y以及第二密封部6的非敞開部分Y的密封狀態。
In the present embodiment, the closed space DS is set to have a positive pressure by making the supply amount of nitrogen gas larger than the discharge amount of nitrogen gas during the door cleaning process. And, as shown in FIG. 10 , at an appropriate timing after the time when the closed space DS becomes positive pressure, the preferential opening portion X (in this embodiment, the central portion in the width direction of the
本實施方式的裝載端口2在第一密封部5中的優先敞開部分X的附近,而且在密閉空間DS之外GS的大氣壓下設置排氣單元8(圖9以及圖10中用雙點劃線表示)。排氣單元8具備:設定為能夠覆蓋第一密封部5中的密閉空間DS處於正壓時敞開的部分(優先敞開部分X)的開口尺寸的排氣口81;以及抽吸通過排氣口81的氣體的抽吸箱82。另外,排氣單元8與設置有EFEM1的工廠的排氣鼓風機等排氣系統(省略圖示)連接,並構成為能夠強制性地抽吸以及排
出剩餘氣體。此外,構成為,通過在排氣鼓風機與排氣單元8之間配置適當的流量調整閥或者遮蔽閥,從而能夠調整排氣單元8的抽吸力或者排出量。
The
因此,本實施方式的裝載端口2能夠以通過第一密封部5中的敞開的(解除了彈性接觸狀態的)優先敞開部分X向排氣單元8內引導從密閉空間DS內向密閉空間DS之外GS洩漏的氮氣的方式進行排氣、抽吸。此外,在執行門清洗處理的過程中,在比密閉空間DS內成為正壓的時刻靠後的適當的時機,只要能夠維持密閉空間DS的正壓(使密閉空間DS從正壓減壓為接近大氣壓),就能通過降低相對於密閉空間DS的氮氣的供給量,來限制氣體使用量以及氣體使用時間,從而能夠實現成本的削減。另外,通過設置對排氣單元8內的氧氣濃度進行測量的氧氣濃度計,從而能夠把握排氣單元8內的氧氣濃度。在構成為能夠向控制部輸入氧氣濃度計的檢測值的情況下,能夠進行與氧氣濃度計的檢測值相應的適當的控制。
Therefore, the
在本實施方式的裝載端口2中,控制部2C繼門清洗處理之後,將連結機構221切換為蓋連結狀態(蓋連結處理)。通過該處理,利用連結機構221將FOUP門43連結於預先在全閉位置C待機的裝載端口門22,能夠以隔著預定的間隙對置的狀態來保持。另外,成為能夠從FOUP主體42拆下FOUP門43的狀態。另外,在本實施方式的裝載端口2中,在FOUP4載置在載置台23上的正規位置的時刻,控制部2C檢測FOUP4中的底面部按壓設置在載置台23上的例如加壓傳感器的被按壓部的情況。以此為契機,控制部2C給與使設置在載置台23的噴嘴261(包含作為氣體導入部發揮功能的噴嘴在內的全部噴嘴261)向比載置台23的上表面靠上方推進的驅動命令(信號)。其結果,將這些各噴嘴261分別與FOUP4的注入口和排出口連結,來向FOUP4的內部空間4S供給氮氣,並且排出FOUP4內的氣體氣氛,將FOUP4的內部空間4S置換為氮氣,使FOUP4內的水分濃度以
及氧氣濃度分別下降至預定值以下,從而使FOUP4內的晶片W的周圍環境處於低濕度環境以及低氧氣環境(底部清洗處理)。
In the
並且,在本實施方式的裝載端口2中,控制部2C繼蓋連結處理之後,執行使FOUP門43與裝載端口門22一起移動,並且敞開基座21的開口部21a以及FOUP4的搬出入口41,並解除FOUP4內的密閉狀態的處理(容器密閉解除處理)。具體而言,如圖7所示,控制部2C利用門移動機構27使裝載端口門22在腔室5的內部空間5S從全閉位置C朝向搬運室3側沿上述的水平路徑移動至上述敞開位置O,並且,使到達上述敞開位置O的裝載端口門22沿上述鉛垂路徑下降預定距離而定位於全開位置(省略圖示)。在該容器密閉解除處理的執行開始時刻,由於密閉空間DS以及FOUP4的內部空間4S通過上述門清洗處理以及底部清洗處理(容器內清洗處理)而被填充有氮氣,因此在使裝載端口門22向搬運室3的內部空間3S側移動的處理時,能夠防止在門清洗處理執行前的時刻附著於FOUP門43的顆粒等飛舞。
In addition, in the
由此,FOUP主體42的內部空間4S以及搬運室3的內部空間3S成為相互連通的狀態。在搬運空間3S內產生的下降氣流的氮氣也維持為清潔。在此,在實施容器密閉解除處理時,若密閉空間DS的體積(容積)增加,則密閉空間DS容易變成負壓,存在大氣從外部空間GS進入密閉空間DS的擔憂。因此,在本實施方式中,在密閉空間DS相對於外部空間GS為正壓的狀態下,實施容器密閉解除處理。具體而言,在執行容器密閉解除處理的時刻,也繼續從氣體注入部71供給氮氣。這樣,在本實施方式中,設定為,在密閉空間DS至少不是負壓的狀態下進行容器密閉解除處理。另外,容器密閉解除處理較佳密閉空間DS相對於搬運空間3S以同程度的壓力敞開。此外,外部空間GS與搬運空間3S的壓力差為3至500Pa(G),較佳為5至100Pa(G)。在通過容器密閉解除處理來使FOUP主體42的內部空間4S與搬運室3的內部空間3S連通的狀態下,設置在搬運
室3的內部空間3S的搬運機器人31訪問FOUP4內,實施相對於晶片W的搬運處理(搬運處理)。在搬運處理中能夠實施的搬運處理內容是搬運機器人31用手取出FOUP4內的晶片W的處理、將結束了處理裝置M的適當的處理後的已處理晶片W用手放入FOUP4內的處理。例如在通過搬運處理將FOUP4內的晶片W搬運到搬運室3內的情況下,搬運到搬運室3內的晶片W由搬運機器人31搬運到處理裝置M(具體而言為裝載鎖定室)、或者搬運到緩衝位或者對準器。另外,結束了處理裝置M的適當的處理後的已處理的晶片W由搬運機器人31從處理裝置M的內部空間MS直接收納到FOUP4的內部空間4S、或者經由緩衝位後依次收納到FOUP4的內部空間4S。
Thereby, the
並且,在本實施方式的裝載端口2中,在執行搬運機器人31相對於FOUP4的下一次的訪問的情況下,反復進行搬運處理。在本實施方式的裝載端口2中,若結束FOUP4內的晶片W全部由處理裝置M進行的處理工程,則控制部2C執行利用門移動機構27使裝載端口門22向全閉位置C移動,封閉基座21的開口部21a以及FOUP4的搬出入口41,從而密封FOUP4的內部空間4S的處理(容器密閉處理)。
In addition, in the
接著,控制部2C執行將連結機構221從蓋連結狀態切換為蓋連結解除狀態的處理(蓋連結解除處理)。通過該處理,解除基於連結機構221的裝載端口門22與FOUP門43的連結狀態(蓋連結狀態),從而能夠在FOUP主體42安裝FOUP門43。其結果,基座21的開口部21a以及FOUP4的搬出入口41分別由裝載端口門22、FOUP門43封閉,從而FOUP4的內部空間4S成為密閉狀態。
Next, the
在本實施方式的裝載端口2中,若停止門清洗處理,則密閉空間DS不處於正壓狀態,第一密封部5中在門清洗處理時敞開的部分(優先敞開部分X)恢復彈性,並與FOUP4的密封面彈性接觸。然而,為了避免上述密閉空間
DS不處於正壓狀態引起的不良狀況的產生,保持密閉空間DS的正壓狀態是重要的。
In the
接著,在本實施方式的裝載端口2中,控制部2C進行解除基於移動限制部L的FOUP4的固定狀態(夾緊狀態)的容器夾緊解除處理。具體而言,使處於由移動限制部L的拉入部L2拉入到基座21側的位置的卡合片L1向離開基座21的方向移動。於是,卡合片L1從面對姿勢自動地切換為非面對姿勢,解除卡合片L1相對於FOUP主體42的凸邊部45的卡合狀態,從而能夠解除基於移動限制部L的FOUP4的固定狀態。即、容器夾緊解除處理通過使移動限制部L從移動限制狀態切換為移動允許狀態的處理而能夠實現。
Next, in the
接著,在本實施方式的裝載端口2中,控制部2C執行使載置台23向離開基座21的方向移動的處理(對接解除處理)。另外,控制部2C解除由載置台23上的鎖定爪232鎖定FOUP4的狀態(鎖定解除處理)。具體而言解除鎖定爪232相對於設置在FOUP4的底面的被鎖定部的鎖定狀態。由此,儲存有結束了預定的處理的晶片W的FOUP4從各裝載端口2的載置台23上被交接到容器搬運裝置,向下一工程運出。
Next, in the
如上所述,本實施方式的裝載端口2構成為,在裝載端口門22處於關閉狀態而且經由第一密封部5使容器4與基座21抵接的狀態下,使裝載端口門22與FOUP門43隔著預定尺寸的間隙而對置的空間成為由第一密封部5以及第二密封部6分隔出的密閉空間DS,並且還具備相對於該密閉空間DS注入氣體的氣體注入部71,由於能夠執行將密閉空間DS置換為氣體的門清洗處理,因此能夠防止或抑制附著於FOUP門43的顆粒、存在於FOUP門43與裝載端口門22之間並含有使晶片W氧化等有可能使晶片W的性能發生變化的氧氣、水分、顆粒等的大氣在敞開裝載端口門22時流入搬運空間3S以及FOUP4的內部的事態。也就
是,在敞開FOUP門43而密閉空間DS敞開之前,能夠排除密閉空間DS的氧氣、水分、顆粒。
As described above, the
除此以外,本實施方式的裝載端口2構成為,將第一密封部5以及第二密封部6中作為FOUP4側的密封部的第一密封部5的一部分或者全部設定為在門清洗處理時通過使密閉空間DS處於正壓而比第二密封部6優先敞開的優先敞開部分X,從而能夠使密閉空間DS的至少氣體通過該敞開的部分(門清洗處理執行前還有包含存在於密閉空間DS的空氣、顆粒等的情況)向外部GS排出,因此能夠防止因密閉空間DS成為正壓而裝載端口門22的封閉力變弱,在門清洗處理執行前的時刻,附著於FOUP門43的顆粒、存在於FOUP門43與裝載端口門22之間的包含氧氣、水分、顆粒等的大氣從密閉空間DS流入搬運空間3S的事態。由此,能夠維持FOUP4內、密閉空間DS以及搬運空間3S的高清潔度,並且允許在短時間內相對於密閉空間DS大量地供給氣體來使密閉空間DS處於正壓狀態,與一邊向密閉空間DS一點一點供給氣體來調整壓力一邊除去密閉空間DS內的垃圾等的形態相比較,能夠實現間隔時間的縮短化。
In addition, the
並且,根據本實施方式的裝載端口2,不需要使密閉空間DS的壓力變得與其它空間(FOUP4的內部空間4S、搬運空間3S等)的壓力均等的特別的控制,不需要用於控制的控制設備(閥、配管類),從而能夠實現成本降低、間隔時間的縮短化。
Furthermore, according to the
尤其是,本實施方式的裝載端口2是在優先敞開部分X的附近且密閉空間DS之外GS即大氣壓下設置排氣單元8的結構,因此在密閉空間DS的壓力變高的情況下,也能夠利用排氣單元8效率良好地排出從設定於FOUP4側的密封部即第一密封部5的優先敞開部分X向密閉空間DS之外GS洩漏的至少門清洗用氣體等氣體。尤其是,在本實施方式中,為了形成密閉空間DS內的氣體的流動,將排出密閉空間DS的氣體的氣體排出部72與氣體注入部71配套設置。在此,
在採用了未設置排出密閉空間DS的氣體的氣體排出部72的結構的情況下,密閉空間DS內的氣體僅從密閉空間DS中敞開了密封狀態的部分(優先敞開部分X)透出,在密閉空間DS內有可能存在難以調換氣體的場所。另一方面,在本實施方式中,由於採用具備積極地排出密閉空間DS的氣體的氣體排出部72的結構,因此與不具備氣體排出部72的結構相比較,能夠防止或抑制在密閉空間DS內產生難以調換氣體的場所的事態。此外,氣體排出部72並非是進行抽吸的必須要件,也可以是大氣敞開。在大氣敞開的情況下,較佳使形成氣體排出部72的配管(排氣管)的直徑較大,更具體而言,較佳使直徑比形成氣體注入部71的配管(供給管)大。另外,通過採用設置多個氣體注入部71、氣體排出部72的形態,能夠以更高的概率防止或者抑制在密閉空間DS內產生難以調換氣體的場所的事態。此外,作為本實施方式的EFEM的一例,本發明也包含不具備氣體排出部72的結構。
In particular, the
在將以上說明的實施方式作為第一實施方式的情況下,以下對本發明的第二實施方式的裝載端口2進行說明。
With the embodiment described above as the first embodiment, the
第二實施方式的裝載端口2是與第一實施方式的裝載端口2大致相同的結構,以下方面不同:將第二密封部6的一部分或者全部設定為在將密閉空間DS置換為氣體的門清洗處理時通過使密閉空間DS處於負壓而比第二密封部6優先敞開的優先敞開部分X。在以下的說明以及圖11、圖12中,對與第一實施方式的裝載端口2的各部、各部分對應的部位標注相同符號。
The
第二實施方式的裝載端口2所具備的的第一密封部5以環繞開口部21a的方式設置在基座21的前面21A中的開口部21a的開口緣附近區域,在將FOUP4定位於基座2的前方的預定位置時,對基座21的開口部21a的周緣與FOUP4之間進行密封(參照圖11)。在採用了在基座21安裝窗單元214的結構的本實施方式中,在窗框部216的前面216A中的開口部215的開口緣附近區域,在
環繞開口部215的位置設置第一密封部5。具體而言,在窗框部216的前面216A中、與作為FOUP主體42的後面42B的FOUP密封面(FOUP主體42中設定在FOUP門43的周圍部分的面)對置的位置,環繞地安裝第一密封部5。以環繞開口部215的方式配置在呈矩形的開口部215的開口緣附近的第一密封部5從FOUP4側觀察時呈大致矩形。因此,第一密封部5大致區分為配置在開口部215的開口上緣附近的上邊部分5A、配置在開口部215的開口下緣附近的下邊部分5B、分別配置在開口部215的開口兩側緣附近的側邊部分5C。以具備這四個邊部分的長方形為基本形狀的本實施方式的第一密封部5具有由圓弧平滑地連接四個角而成的形狀。
The
並且,在本實施方式中,作為第一密封部5,應用剖面形狀為大致圓形的O型圈,遍及第一密封部5的上邊部分5A、下邊部分5B、左右的兩側邊部分5C配置共用的O型圈。這樣,在本實施方式中,第一密封部5的全部由剖面形狀為大致圓形的彈性體(圓形彈性體D1)形成,第一密封部5的全部設定於“非敞開部分Y”。
In addition, in this embodiment, as the
這樣的第一密封部5介於載置在定位於對接位置的載置台23上的FOUP4與基座21的開口部21a的周緣之間,發揮密封功能。
Such a
圖11表示第一密封部5與載置在定位於預定的對接位置的載置台23上的FOUP4彈性接觸的狀態。本實施方式的裝載端口2以使第一密封部5向裝載端口門22中比最接近FOUP4的端面更靠FOUP4側突出預定尺寸(例如0.1mm以上且3mm以下)的形態配置。因此,FOUP門43以及裝載端口門22相互不接觸,能夠由第一密封部5維持形成於基座21與裝載端口門22之間的密閉空間DS的高密閉性。
FIG. 11 shows a state where the
即、如圖11所示,第一密封部5與載置在定位於預定的對接位置的載置台23上的FOUP主體42的後面42B彈性接觸。具體而言,第一密封部5的整體與載置在定位於預定的對接位置的載置台23上的FOUP主體42的後面42B彈性
接觸,由此,相比與FOUP4彈性接觸前的時刻,以在前後方向D上被壓癟的形態彈性變形。通過維持這樣的第一密封部5與FOUP4的彈性接觸狀態,從而能夠形成良好的密封區域。
That is, as shown in FIG. 11 , the
第二密封部6以環繞開口部21a的方式設置在基座21的後面21B中的開口部21a的開口緣附近區域。在採用了在基座21安裝窗單元214的結構的本實施方式中,在窗框部216的後面216B中的開口部215的開口緣附近區域,在環繞開口部215的位置設置第二密封部6。具體而言,在窗框部216的後面216B中與裝載端口門22的前面、也就是設定於基座的整面21A的預定部分的密封面(設定於裝載端口門22的外緣部分的面)對置的位置環繞地安裝第二密封部6。在本實施方式中,將形成於裝載端口門22的外周緣部的凸邊狀的薄壁部設定為裝載端口門22的密封面。在呈矩形的開口部215的開口緣附近以環繞開口部215的方式配置的第二密封部6從搬運室3側觀察時呈大致矩形。
The
在本實施方式中,第二密封部6的大部分由剖面形狀為大致圓形的彈性體(圓形彈性體D1)形成,一部分由剖面形狀比大致圓形的彈性體更容易彈性變形的彈性體(非圓形彈性體D2)形成。具體而言,第二密封部6中包含下邊部分6B整體、左右兩側邊部分6C整體、以及上邊部分6A的寬度方向兩端部的預定部分由圓形彈性體D1形成,第二密封部6中的上邊部分6A的寬度方向中央部分由非圓形彈性體D2形成。本實施方式的非圓形彈性體D2是剖面形狀為棒形狀(剖面觀察時長度方向的尺寸比大致圓形的彈性體的直徑大的棒形狀)而且以帶圓形的前端部分隨著朝向後方(搬運室3側)而逐漸向下方位移的姿勢(下垂那樣的姿勢、前端部分朝向密閉空間DS內變形的姿勢)配置的彈性體。
In the present embodiment, most of the
並且,在將裝載端口門22定位於關閉位置時,裝載端口門22(更具體而言為薄壁部)成為經由第二密封部6而與窗框部216的後面216B抵接的狀態,第二密封部6對基座21的開口部21a的周緣與裝載端口門22之間進行密封(參
照圖11)。尤其是,第二密封部6的優先敞開部分X與裝載端口門22彈性接觸,由此,相比與裝載端口門22彈性接觸前的時刻,前端部分以向下方(朝向密閉空間DS內的方向)被壓下的形態彈性變形。其結果,在將裝載端口門22定位於關閉位置的狀態下,能夠抑制氣體從搬運室3的內部空間3S向搬運室3的外部的流出、氣體從搬運室3的外部向搬運室3的內部空間3S的流入。在第二密封部6發揮密封功能的狀態下,第二密封部6在包含第二密封部6的密封區域的密閉空間DS與搬運室3的內部空間3S之間受到預定的壓力,如圖12所示,第二密封部6中的優先敞開部分X比非敞開部分Y優先地解除密封狀態而敞開。
In addition, when the
在本實施方式的裝載端口2,在窗框部216的前面216A以及後面216B,以分別環繞開口部215的開口緣附近的方式,形成剖面成為凹形的安裝槽(在圖11以及圖12中,供第一密封部5、第二密封部6嵌入的凹部)。在將第一密封部5、第二密封部6分別插入到各密封安裝槽的狀態下緊密地安裝。尤其是,供第二密封部6中的優先敞開部分X安裝的密封安裝槽設定於朝向槽的進深方向而逐漸擴展的剖面梯形,在使設置於優先敞開部分X的基端部的插入部嵌合於該梯形的密封安裝槽的狀態下,通過粘接劑等適當的措施來固定。由此,防止第二密封部6的優先敞開部分X從密封安裝槽脫落的事態。在該安裝狀態下,第一密封部5以及第二密封部6中未容納於安裝槽的部分向安裝槽外露出。
In the
在本實施方式中,在將載置台23定位於預定的對接位置時,FOUP主體42的後面42B隔著預定尺寸的間隙而與基座21的前面21A(窗框部216的前面216A)接近,並構成為能夠由第一密封部5密封該間隙。另外,就本實施方式的裝載端口2而言,在將載置台23定位於預定的對接位置的時刻以後,如果裝載端口門22處於關閉狀態,則FOUP門43與裝載端口門22隔著預定尺寸的間隙而接近,並且構成為能夠由第二密封部6密封裝載端口門22與基座21之間。因此,裝
載端口門22與FOUP門43隔著預定尺寸的間隙而對置的空間成為由第一密封部5以及第二密封部6分隔出的密閉空間DS。
In this embodiment, when the mounting table 23 is positioned at a predetermined docking position, the
第二實施方式的裝載端口門22具備:相對於密閉空間DS注入氣體的氣體注入部71;以及排出密閉空間DS的氣體的氣體排出部72(相當於本發明的“排出部”),利用氣體注入部71向密閉空間DS供給乾燥氮氣等氣體,並利用氣體排出部72排出密閉空間DS的氣體(包含氣體),由此能夠對密閉空間DS進行氣體清洗。
The
並且,在本實施方式的裝載端口2中,在結束了容器夾緊處理的時刻,在基座21的開口部21a(窗框部216的開口部215)的附近,載置在定位於對接位置的載置台23上的FOUP4中設定為密封面的FOUP主體42的後面42B與基座21的第一密封部5彈性接觸,通過第一密封部5的彈性變形,能夠在FOUP4與基座21之間形成良好的密封區域。即、在本實施方式的裝載端口2中,通過實施容器夾緊處理,能夠同時實施在FOUP4與基座21之間形成良好的密封區域的處理(密封處理)。
In addition, in the
在本實施方式的裝載端口2中,控制部2C繼容器夾緊處理以及密封處理之後,進行向密閉空間DS供給氮氣並且利用氣體排出部72排出至此停留在密閉空間DS的氣體(大氣)的處理(門清洗處理)。在本實施方式中,設定為在門清洗處理時使氮氣的排出量比氮氣的供給量多,由此使密閉空間DS處於負壓。
In the
並且,如圖12所示,在密閉空間DS成為負壓的時刻以後的適當的時機,第二密封部6中的優先敞開部分X(在本實施方式中為上邊部分6A的寬度方向中央部分)成為比第二密封部6的其它部分以及第一密封部5、也就是非敞開部分Y優先敞開的狀態。即、在第二密封部6中以前端部分下垂的形態與裝載端口門22的密封面彈性接觸的優先敞開部分X被充滿於密閉空間DS的氮氣按
壓而彈性變形,並且向優先敞開部分X的前端部被壓下的方向(朝向密閉空間DS內的方向)變形,由此解除相對於裝載端口門22的密封面的彈性接觸狀態。其結果,本實施方式的裝載端口2中,形成通過第二密封部6中的敞開的(解除了彈性接觸狀態)部分、即優先敞開部分X從搬運室3的內部空間3S朝向密閉空間DS的氣流(圖12中用箭頭示意性地表示從搬運室3的內部空間3S朝向密閉空間DS的氣流)。形成通過第二密封部6的優先敞開部分X的氣流的時刻以後也繼續進行相對於密閉空間DS的氮氣的供給以及氮氣的排出,繼續向密閉空間DS填充氣體。從門清洗處理開始經過預定時間後,關閉門清洗用氣體注入閥以及門清洗用氣體排出閥,由此結束向密閉空間DS填充氣體。此外,也可以反復進行從氣體注入部71向密閉空間DS注入氣體的氣體注入動作、和利用氣體排出部72從密閉空間DS排出氣體的排出動作。
And, as shown in FIG. 12 , at an appropriate timing after the time when the closed space DS becomes negative pressure, the preferential opening portion X (in this embodiment, the central portion in the width direction of the upper side portion 6A) in the
在本實施方式的裝載端口2中,由氣體排出部72構成對密閉空間DS內進行抽吸的抽吸路徑,將排出部72作為排氣單元發揮功能。排氣單元與設置有EFEM1的工廠的排氣鼓風機等排氣系統(省略圖示)連接,並構成為能夠強制性地抽吸以及排出剩餘氣體。此外,構成為,通過在排氣鼓風機與排氣單元之間配置適當的流量調整閥或者遮蔽閥,從而能夠調整排氣單元的抽吸力或者排出量。
In the
就本實施方式的裝載端口2而言,在執行門清洗處理的過程中,在比密閉空間DS內成為負壓的時刻靠後的適當的時機,只要能夠維持密閉空間DS的負壓狀態,就能通過降低相對於密閉空間DS的氮氣的供給量,來限制氣體使用量以及氣體使用時間,從而能夠實現成本的削減。另外,通過設置對排氣單元內的氧氣濃度進行測量的氧氣濃度計,從而能夠把握排氣單元內的氧氣濃度,在構成為能夠向控制部輸入氧氣濃度計的檢測值的情況下,能夠進行與氧氣濃度計的檢測值相應的適當的控制。此外,在實施容器密閉解除處理時,由
於密閉空間DS是負壓狀態,因此有大氣從外部空間GS進入密閉空間DS的擔憂。因此,在本實施方式中,較佳在密閉空間DS相對於外部空間GS為正壓的狀態下,實施容器密閉解除處理。具體而言,在執行容器密閉解除處理的時刻,也繼續從氣體注入部71供給氮氣,在密閉空間DS至少不是負壓的狀態下能夠進行容器密閉解除處理。
In the case of the
這樣的第二實施方式的裝載端口2通過發揮門清洗功能,能夠防止或者抑制附著於FOUP門43的顆粒、存在於FOUP門43與裝載端口門22之間並包含使晶片W氧化等有可能使晶片W的性能發生變化的氧氣、水分、顆粒等的大氣在敞開裝載端口門22時流入到搬運空間3S以及FOUP4的內部的事態。也就是,在敞開FOUP門43而密閉空間DS敞開之前,能夠排除密閉空間DS的氧氣、水分、顆粒。
The
並且,就第二實施方式的裝載端口2而言,將第一密封部5以及第二密封部6中作為搬運室3側的密封部的第二密封部6的一部分或者全部設定為在門清洗處理時通過使密閉空間DS處於負壓而比第一密封部5優先敞開的優先敞開部分X,能夠形成通過該敞開的部分從搬運空間3S朝向密閉空間DS的氣流,能夠完全防止以下事態:由於密閉空間DS成為負壓而FOUP門43的封閉力變弱,從而在門清洗處理執行前的時刻,附著於FOUP門43的顆粒、存在於FOUP門43與裝載端口門22之間的包含氧氣、水分、顆粒等的大氣從密閉空間DS流入到FOUP4內的事態;由於密閉空間DS成為負壓而FOUP門43的封閉力變弱,從而形成通過FOUP門43與FOUP主體42的間隙從FOUP4的內部朝向密閉空間DS的氣流,導致氣體(大氣)從FOUP底部的排氣端口向FOUP4內或者密閉空間DS倒流的事態。由此,能夠維持FOUP4內、密閉空間DS以及搬運空間3S的高清潔度,並且允許在短時間內相對於密閉空間DS大量地排出氣體而使密閉空間DS處
於負壓狀態,與一邊向密閉空間DS一點一點地供給氣體來調整壓力一邊除去密閉空間DS內的垃圾等的形態相比較,能夠實現間隔時間的縮短化。
In addition, in the
除此以外,根據第二實施方式的裝載端口2,不需要使密閉空間DS的壓力變得與其它空間(FOUP4的內部空間4S、搬運空間3S)的壓力均等的特別的控制,不需要用於進行控制的控制設備(閥、配管類),從而能夠實現成本降低、間隔時間的縮短化。
In addition, according to the
尤其是,第二實施方式的裝載端口2採用了在對密閉空間DS內進行抽吸的抽吸路徑的預定部位設置排氣單元的結構,因此在密閉空間DS成為負壓狀態的情況下,能夠利用排氣單元效率良好地將密閉空間DS的氣體(門清洗用氣體)排出到密閉空間DS之外GS,還能夠消除如果成為過度的負壓狀態而可能發生的事態、即、基於FOUP門43的FOUP4內的密閉程度下降,從而大氣從設置在FOUP4內的排氣端口向FOUP4內倒流的事態。
In particular, the
另外,第一本實施方式以及第二實施方式的EFEM1具備:具有上述結構的裝載端口2;以及在搬運空間3S配置有搬運機器人的搬運室3,因此能夠利用搬運機器人使晶片W等搬運對象物出入於放置在裝載端口2的FOUP4與搬運室3之間,通過在比該出入處理更靠前的時刻進行門清洗處理,從而能夠在維持FOUP4內、密閉空間DS以及搬運空間3S的高清潔度的狀態下進行出入處理。另外,得到裝載端口2所起的上述的作用效果,能夠消除密閉空間DS成為正壓狀態或者負壓狀態引起的不良狀況(裝載端口門22的封閉力的下降、FOUP門43的封閉力的下降、甚至搬運室3內的污染、FOUP4內的污染),並且能夠實現門清洗處理時間的縮短化、間隔時間的縮短化。
In addition, since the
此外,本發明並不限定於上述的各實施方式。 In addition, this invention is not limited to each embodiment mentioned above.
在密閉空間處於正壓狀態的情況下,比第二密封部優先敞開的部分(優先敞開部分)既可以是第一密封部的一部分、也可以是第一密封部的全 部。也就是,在密閉空間處於正壓狀態的情況下,通過預先設定受到從密閉空間內朝向密閉空間外的壓力而至少由第一密封部的一個部位解除密封狀態的部分(密封容易撕裂的部分),從而能夠得到與上述的第一實施方式的裝載端口大致相同的作用效果。因此,也能夠採用在第一密封部的多個部位設定了優先敞開部分的結構。 When the closed space is under a positive pressure state, the part that opens prior to the second sealing part (priority opening part) may be a part of the first sealing part or the entirety of the first sealing part. department. That is, when the sealed space is in a positive pressure state, by setting in advance the portion that receives the pressure from the inside of the sealed space toward the outside of the sealed space, at least one part of the first sealing portion releases the sealed state (the portion where the seal is easily torn) ), it is possible to obtain substantially the same effect as that of the load port of the first embodiment described above. Therefore, it is also possible to employ a configuration in which preferential opening portions are set at a plurality of locations of the first sealing portion.
另外,本發明也可以是以下結構中的任意結構:在密閉空間成為正壓的時刻,第一密封部的優先敞開部分成為比第二密封部優先敞開狀態的結構;在密閉空間成為正壓的時刻以後的適當的時刻(例如密閉空間成為預定值以上的壓力的時刻等),第一密封部的優先敞開部分成為比第二密封部優先敞開的狀態的結構。 In addition, the present invention may be any of the following configurations: when the closed space becomes positive pressure, the preferential opening part of the first sealing part is opened more preferentially than the second sealing part; At an appropriate time after the time (for example, when the pressure in the sealed space becomes higher than a predetermined value, etc.), the preferential opening portion of the first sealing portion is opened more preferentially than the second sealing portion.
同樣,在密閉空間處於負壓狀態的情況下,比第一密封部優先敞開的部分既可以是第二密封部的一部分、也可以是第二密封部的全部。也就是,在密閉空間處於負壓狀態的情況下,通過預先設定在密閉空間內受到抽吸的力而至少由第二密封部的部位解除密封狀態的部分(密封容易撕裂的部分),從而能夠得到與上述的第二實施方式的裝載端口大致相同的作用效果。因此,也能夠採用在第二密封部的多個部位設定了優先敞開部分的結構。 Similarly, when the sealed space is under a negative pressure state, the portion that is opened prior to the first sealing portion may be a part of the second sealing portion or the entirety of the second sealing portion. That is, when the closed space is in a negative pressure state, the part of the sealed state (the part where the seal is easily torn) is released at least from the position of the second sealing part by the force of the suction in the closed space is set in advance, thereby It is possible to obtain substantially the same effects as those of the load port of the second embodiment described above. Therefore, it is also possible to adopt a configuration in which preferential opening portions are set at a plurality of locations of the second sealing portion.
另外,本發明也可以是以下結構中的任意結構:在密閉空間成為負壓的時刻,第二密封部的優先敞開部分成為比第一密封部優先敞開的狀態的結構;在密閉空間成為負壓的時刻以後的適當的時刻(例如密閉空間成為預定值以下的壓力的時刻等),第二密封部的優先敞開部分成為比第一密封部優先敞開的狀態的結構。 In addition, the present invention may be any of the following configurations: when the closed space becomes negative pressure, the preferential opening part of the second sealing part is opened more preferentially than the first sealing part; At an appropriate timing after the timing (for example, timing when the pressure in the sealed space becomes a predetermined value or less), the preferential opening portion of the second sealing portion is preferentially opened over the first sealing portion.
第一密封部以及第二密封部的優先敞開部分、非敞開部分的剖面形狀及材料也不限於上述的實施方式的形狀以材料,是擔保密封性(密閉性)的部件即可,能夠適當變更、選擇。作為一個例子,能夠列舉使用通過流體的 導入或者排出來進行膨脹或者收縮的中空密封部構成優先敞開部分或者非敞開部分的兩方或者任意一方的形態。 The cross-sectional shape and material of the preferential opening part and the non-opening part of the first sealing part and the second sealing part are not limited to the shape and material of the above-mentioned embodiment, and it is enough to ensure the sealing performance (airtightness), and can be changed appropriately. ,choose. As an example, one can cite the use of passing fluid The hollow sealing portion that is introduced or discharged to expand or contract constitutes either or both of the preferentially opened portion and the non-opened portion.
供第一密封部、第二密封安裝的密封安裝槽的形狀也能夠根據密封部的基端部(安裝端部)的形狀等而適當變更。 The shape of the seal mounting groove in which the first seal portion and the second seal are mounted can also be appropriately changed according to the shape of the base end portion (mounting end portion) of the seal portion, and the like.
排氣單元能夠適當選擇自然排氣類型或者抽吸排氣(負壓排氣)類型的任意類型。根據第一密封部中在密閉空間處於正壓狀態的情況下比第二密封部優先敞開的部分(優先敞開部分)的位置、大小、個數等來設定排氣單元的排氣口的位置、大小、個數等即可。 The exhaust unit can appropriately select any type of a natural exhaust type or a suction exhaust (negative pressure exhaust) type. The position of the exhaust port of the exhaust unit is set based on the position, size, number, etc. Size, number, etc. can be.
在上述的實施方式中,採用了晶片搬運中所使用的FOUP來作為容器。但是本發明中的容器並不限定於此,能夠採用MAC(Multi Application Carrier)、H-MAC(Horizontal-MAC)、FOSB(Front Open Shipping Box)等。另外,容器並不限定於晶片容納容器,也可以是容納以填充了惰性氣體的狀態搬運的電子器件那樣的容納物(搬運對象物)的密閉容器。 In the above-described embodiments, the FOUP used for wafer transfer is used as the container. However, the container in the present invention is not limited thereto, and MAC (Multi Application Carrier), H-MAC (Horizontal-MAC), FOSB (Front Open Shipping Box) and the like can be used. In addition, the container is not limited to the wafer storage container, and may be an airtight container that accommodates a container (object to be transported) such as an electronic device that is filled with an inert gas and transported.
在上述的實施方式中,例示了將裝載端口安裝於EFEM的形態,但也能夠應用於具備搬運室的分類器、將加工裝置自身作為搬運室並在加工裝置自身安裝裝載端口的裝置,其中,搬運室用於載置在裝載端口的容器內的搬運對象物的排序、與裝載在其它裝載端口的容器的搬運對象物進行更換。 In the above-mentioned embodiment, the form in which the loading port is attached to the EFEM was exemplified, but it can also be applied to a sorter equipped with a transfer chamber, or a device that uses the processing device itself as the transfer chamber and attaches the loading port to the processing device itself. The transfer chamber is used for sorting the objects to be transferred in the container placed in the load port, and for exchanging objects to be transferred with those in the container loaded in the other load port.
在實施方式中,作為門清洗處理等所使用的環境氣體以氮氣為例,但並不限定於此,能夠使用乾燥氣體、氬氣等所希望的氣體(惰性氣體)。 In the embodiment, nitrogen gas is used as an example of the ambient gas used in the door cleaning process, but it is not limited thereto, and desired gas (inert gas) such as dry gas and argon gas can be used.
在實施方式中,例示了分別具備第一密封部和第二密封部的形態,但也可以是具備共用的密封部的裝載端口,該共用的密封部一體地具有配置在基座的前面的第一密封部、配置在基座的後面的第二密封部、以及以在厚度方向上貫通基座的姿勢配置並連結第一密封部以及第二密封部的連結部分。 In the embodiment, the form in which the first sealing part and the second sealing part are separately provided is exemplified, but the load port may be provided with a common sealing part integrally provided with the first sealing part arranged on the front surface of the base. A sealing portion, a second sealing portion arranged behind the base, and a connecting portion that is arranged to pass through the base in a thickness direction and connects the first sealing portion and the second sealing portion.
也可以設置從密封撕裂的部位(優先敞開部分)向排氣單元引導氣體的導向件。另外,如果在門清洗處理執行中從處於正壓狀態的密閉空間通過優先敞開部分向密閉空間外洩漏的氣體量為微量(作業者沒有危險的程度的量),則能夠省略排氣單元。 It is also possible to provide a guide that guides gas from the portion where the seal is torn (preferentially the open portion) to the exhaust unit. Also, if the amount of gas leaking out of the closed space from the positive-pressurized closed space through the preferentially open portion during the execution of the door cleaning process is a small amount (an amount that does not endanger the operator), the exhaust unit can be omitted.
在上述的實施方式中例示了將第二密封部設置在基座的後面的形態,但也可以將第二密封部設置在裝載端口門的前面(例如上述的實施方式中的薄壁部的前面),並利用第二密封部對處於封閉了基座的開口部的關閉狀態的裝載端口門與基座之間進行密封的形態。 In the above-mentioned embodiment, the form in which the second sealing part is provided on the back of the base is exemplified, but the second sealing part may be provided on the front of the load port door (for example, in the front of the thin-walled part in the above-mentioned embodiment). ), and use the second seal portion to seal between the base and the loadport door in the closed state closing the opening of the base.
能夠由沿基座的厚度方向(容器、基座、搬運室排列的前後方向)的第一密封部密封的間隙尺寸也就是配置在基座的前方的預定位置的容器與基座的間隙、與能夠由沿基座的厚度方向的第二密封部密封的間隙尺寸也就是處於封閉了開口部的關閉狀態的裝載端口門與基座的間隙既可以是相同程度、也可以較大地不同。通過根據能夠密封的間隙尺寸來適當變更密封部的形狀、材料等便能夠對應。 The size of the gap that can be sealed by the first sealing portion along the thickness direction of the base (the front-rear direction in which the container, the base, and the transfer chamber are arranged) is the gap between the container and the base arranged at a predetermined position in front of the base, and The size of the gap that can be sealed by the second seal portion along the thickness direction of the base, that is, the gap between the loadport door in the closed state that closes the opening and the base may be the same or may be greatly different. It can respond by appropriately changing the shape, material, and the like of the sealing portion according to the size of the gap that can be sealed.
裝載端口門也可以在從關閉位置向全開位置移動的過程暫時處於傾斜姿勢(伴隨部分圓弧狀的軌跡的動作)。 The loadport door may also be temporarily in a tilted posture (movement accompanied by a partially arcuate trajectory) in the process of moving from the closed position to the fully opened position.
另外,在上述的第一實施方式中,作為裝載端口,例示了具備氣體供給部以及氣體排出部的結構,但作為該實施方式的裝載端口的變形例,能夠列舉不具備氣體排出部的結構。即使是這樣的構成的裝載端口也能夠執行基於氣體供給部的門清洗處理或者以門清洗處理為基準的密閉空間清潔化處理,起到以第一實施方式的裝載端口為基準的作用效果。 In addition, in the above-mentioned first embodiment, a configuration including a gas supply unit and a gas discharge unit was exemplified as the load port, but a modification of the load port of this embodiment can include a configuration that does not include a gas discharge unit. Even the loadport configured in this way can perform the door cleaning process by the gas supply unit or the closed space cleaning process based on the door cleaning process, and achieves the same effect as the load port of the first embodiment.
另外,在上述的第二實施方式中,作為裝載端口,例示了具備氣體供給部以及氣體排出部的結構,但作為該實施方式的裝載端口的變形例,能夠列舉不具備氣體供給部的結構。即使是這樣的結構的裝載端口,通過由排出 部(氣體外出部)排出密閉空間的氣體,從而也能夠執行對密閉空間進行清潔化的處理(密閉空間清潔化處理),起到以第二實施方式的裝載端口為基準的作用效果。 In addition, in the second embodiment described above, a configuration including a gas supply unit and a gas discharge unit was exemplified as the load port, but a modification of the load port of this embodiment may include a configuration that does not include a gas supply unit. Even with this configuration of the load port, the discharge by the The closed space can also be cleaned (closed space cleaning process) by exhausting the gas in the closed space through the gas outlet part (gas outlet part), which has the effect based on the load port of the second embodiment.
除此以外,關於各部的具體的結構也不限於上述實施方式,在不脫離本發明的主旨的範圍內能夠進行各種變形。 In addition, the specific structure of each part is not limited to the above-mentioned embodiment, and various deformation|transformation is possible in the range which does not deviate from the summary of this invention.
3S‧‧‧空間 3S‧‧‧Space
4‧‧‧FOUP 4‧‧‧FOUP
4S‧‧‧空間 4S‧‧‧Space
5‧‧‧第一密封部 5‧‧‧The first sealing part
5A‧‧‧上邊部分 5A‧‧‧upper part
5B‧‧‧下邊部分 5B‧‧‧lower part
5C‧‧‧側邊部分 5C‧‧‧side part
6‧‧‧第二密封部 6‧‧‧Second sealing part
6A‧‧‧上邊部分 6A‧‧‧upper part
6B‧‧‧下邊部分 6B‧‧‧lower part
6C‧‧‧側邊部分 6C‧‧‧side part
8‧‧‧排氣單元 8‧‧‧exhaust unit
21‧‧‧基座 21‧‧‧base
21a‧‧‧開口部 21a‧‧‧opening
21A‧‧‧前面 21A‧‧‧front
21B‧‧‧後面 21B‧‧‧behind
22‧‧‧裝載端口門 22‧‧‧Loading port door
23‧‧‧載置台 23‧‧‧Placing table
41‧‧‧搬出入口 41‧‧‧Exit entrance
42‧‧‧FOUP主體 42‧‧‧FOUP subject
42B‧‧‧後面 42B‧‧‧behind
43‧‧‧FOUP門 43‧‧‧FOUP door
45‧‧‧凸邊部 45‧‧‧Knurling part
71‧‧‧氣體注入部 71‧‧‧Gas injection part
72‧‧‧氣體排出部 72‧‧‧gas discharge part
81‧‧‧排氣口 81‧‧‧exhaust port
82‧‧‧抽吸箱 82‧‧‧Suction box
211‧‧‧支柱 211‧‧‧Pillar
212‧‧‧基座主體 212‧‧‧Base body
214‧‧‧窗單元 214‧‧‧window unit
215‧‧‧開口部 215‧‧‧opening
216‧‧‧窗框部 216‧‧‧Window frame
216A‧‧‧前面 216A‧‧‧front
216B‧‧‧後面 216B‧‧‧behind
C‧‧‧全閉位置 C‧‧‧Fully closed position
D‧‧‧前後方向 D‧‧‧Forward and backward direction
D1‧‧‧圓形彈性體 D1‧‧‧Circular elastic body
D2‧‧‧非圓形彈性體 D2‧‧‧Non-circular elastomer
DS‧‧‧密閉空間 DS‧‧‧confined space
GS‧‧‧外部空間 GS‧‧‧External space
X‧‧‧優先敞開部分 X‧‧‧Priority open part
Y‧‧‧非敞開部分 Y‧‧‧non-open part
Claims (8)
Applications Claiming Priority (2)
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JP2018072021A JP7125591B2 (en) | 2018-04-04 | 2018-04-04 | Loadport and EFEM |
JP2018-072021 | 2018-04-04 |
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TW201943007A TW201943007A (en) | 2019-11-01 |
TWI803613B true TWI803613B (en) | 2023-06-01 |
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TW108112022A TWI803613B (en) | 2018-04-04 | 2019-04-03 | Load port and equipment front end module |
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JP (1) | JP7125591B2 (en) |
KR (1) | KR20190116103A (en) |
CN (1) | CN110349893B (en) |
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JP7422577B2 (en) | 2020-03-23 | 2024-01-26 | 平田機工株式会社 | Load port and control method |
CN112242338B (en) * | 2020-12-18 | 2021-03-02 | 西安奕斯伟硅片技术有限公司 | Load port and front end module capable of maintaining cleanliness of FOUP lid |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2013118278A (en) * | 2011-12-02 | 2013-06-13 | Shin Etsu Polymer Co Ltd | Substrate housing container |
TW201707121A (en) * | 2015-08-04 | 2017-02-16 | Sinfonia Technology Co Ltd | Door opening/closing system, and load port equipped with door opening/closing system |
Family Cites Families (8)
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US5169272A (en) * | 1990-11-01 | 1992-12-08 | Asyst Technologies, Inc. | Method and apparatus for transferring articles between two controlled environments |
JP6024980B2 (en) | 2012-10-31 | 2016-11-16 | Tdk株式会社 | Load port unit and EFEM system |
US9136149B2 (en) * | 2012-11-16 | 2015-09-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Loading port, system for etching and cleaning wafers and method of use |
JP2015115517A (en) * | 2013-12-13 | 2015-06-22 | シンフォニアテクノロジー株式会社 | Wafer transport device and efem |
JP6291878B2 (en) * | 2014-01-31 | 2018-03-14 | シンフォニアテクノロジー株式会社 | Load port and EFEM |
JP2016178133A (en) * | 2015-03-19 | 2016-10-06 | シンフォニアテクノロジー株式会社 | Door switchgear, carrier device, sorter device, and docking method for housing container |
KR101739518B1 (en) | 2015-08-20 | 2017-05-26 | 비알 컨설팅 인코포레이티드 | Composition comprising the extracts of dendropanax morbifera |
JP6687840B2 (en) * | 2016-03-29 | 2020-04-28 | シンフォニアテクノロジー株式会社 | Load port |
-
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2019
- 2019-04-03 TW TW108112022A patent/TWI803613B/en active
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2013118278A (en) * | 2011-12-02 | 2013-06-13 | Shin Etsu Polymer Co Ltd | Substrate housing container |
TW201707121A (en) * | 2015-08-04 | 2017-02-16 | Sinfonia Technology Co Ltd | Door opening/closing system, and load port equipped with door opening/closing system |
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JP7125591B2 (en) | 2022-08-25 |
TW201943007A (en) | 2019-11-01 |
JP2019186293A (en) | 2019-10-24 |
CN110349893A (en) | 2019-10-18 |
CN110349893B (en) | 2023-11-14 |
KR20190116103A (en) | 2019-10-14 |
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