TWI801765B - Circuit board material, prepreg, and circuit board - Google Patents

Abstract

A circuit board material, a prepreg, and a circuit board are provided. The circuit board material includes a resin composition. The resin composition includes 10 phr to 75 phr of polyphenylene ether thermosetting resin, 5 phr to 40 phr of polybutadiene thermosetting resin, and a 5 phr to 35 phr of compatibilizer. The polyphenylene ether thermosetting resin has at least one modified group. The at least one modified group is selected from the group consisting of hydroxyl group, amino group, vinyl group, styryl group, methacrylate group, and epoxy group. The compatibilizer is a linear olefin polymer.

Description

Circuit substrate materials, prepreg base materials and circuit substrates

The invention relates to a circuit substrate material, a prepreg base material and a circuit substrate, in particular to a resin composition-based circuit substrate material, a prepreg base material and a circuit substrate.

In recent years, the related technologies of wireless network and satellite communication have gradually improved. In order to transmit signals in a larger amount and faster, electronic equipment is gradually developing towards high-speed and high-frequency. The network infrastructure devices, handheld devices, routers (Routers), network base stations, servers and large computers that realize signal transmission are also committed to the direction of high-speed and high-frequency signal transmission, large capacity and high integrity. Therefore, under the trend of high-speed and high-frequency development, it is necessary to correspondingly improve the performance of the printed circuit board (PCB) mounted on the electronic equipment to reduce the loss of signal transmission and meet the application requirements of high-frequency signals.

The resin composition for circuit substrate mentioned in U.S. Patent No. 7838576 is mainly made of polyphenylene ether with a number average molecular weight between 1000g/mol and 7000g/mol, and a crosslinking agent, a flame retardant and a filler are added. The resin composition has good melt fluidity. However, the electrical properties and heat resistance are poor.

US Patent No. 5223568 discloses a resin composition, wherein polybutadiene or polyisoprene resin with a molecular weight of less than 5000 g/mol is used as the main material, and a circuit board with good physical properties can be prepared. However, the curing temperature of this resin composition is higher than 250°C, and traditional circuit board manufacturing equipment The temperature limit cannot be met. Moreover, the film made of polybutadiene or polyisoprene resin has high viscosity, which is not easy to store or transport, and is not conducive to the automatic process of pressing circuit substrates.

U.S. Patent No. 4,784,917 discloses a resin composition that can be used as a circuit substrate material. It is based on polybutadiene as the main resin, and a prepolymer containing brominated poly(p-hydroxystyrene) (molecular weight: 150,000 g/mol) is added. to reduce film viscosity. However, whether adding other resins to modify polybutadiene, or using polybutadiene resins to modify other resins, will affect the overall characteristics of the resin composition, and cannot take into account viscosity and other properties such as melt flow ability and chemical resistance. , heat resistance, mechanical properties and electrical properties.

The technical problem to be solved by the present invention is to provide a circuit substrate material, a prepreg base material and a circuit substrate in view of the deficiencies in the prior art.

In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a circuit substrate material, the circuit substrate material includes a resin composition, the resin composition includes: 10 parts by weight (phr) to 75 parts by weight of polyphenylene The ether thermosetting resin, the polybutadiene thermosetting resin in 5 to 40 parts by weight, and the compatibilizer in 5 to 35 parts by weight. The polyphenylene ether thermosetting resin has at least one modification group, and the at least one modification group is selected from the group consisting of hydroxyl group, amine group, vinyl group, styrene group, methacrylate group and epoxy group . The compatibilizer is a linear olefin polymer.

In some embodiments, opposite ends of the polyphenylene ether thermosetting resin have the same modification group.

In some embodiments, the resin composition further includes: 10 parts by weight to 40 parts by weight of a cross-linking agent, and the cross-linking agent includes alkenyl phenyl groups.

In some embodiments, the crosslinking agent includes triallyl cyanurate, triene Propyl isocyanurate, diallyl phthalate, divinylbenzene, triallyl benzenetricarboxylate, or any combination thereof.

In some embodiments, the polybutadiene thermosetting resin has at least one alkenyl-containing side chain, and the content of alkenyl groups in the polybutadiene thermosetting resin is greater than or equal to 20 wt%.

In some embodiments, the alkenyl-containing side chain in the polybutadiene thermosetting resin has 2 to 10 carbon atoms.

In some embodiments, the alkenyl-containing side chains in the polybutadiene thermosetting resin are selected from the group consisting of vinyl, acryl, styrene and any combination thereof.

In some embodiments, the compatibilizer is selected from the group consisting of polyethylene copolymers, polypropylene copolymers, methylstyrene copolymers, cyclic olefin copolymers, and any combination thereof.

In some embodiments, the compatibilizer has at least one alkenyl-containing side chain, and the carbon number of the alkenyl-containing side chain of the compatibilizer is 2-10.

In some embodiments, the alkenyl-containing side chains in the compatibilizer are selected from the group consisting of vinyl, propenyl, styryl, and any combination thereof.

In some embodiments, the compatibilizer does not contain hydroxyl groups.

In some embodiments, the circuit substrate material further includes a filler, and the total weight of the filler is 0.4 to 2.5 times the total weight of the resin composition.

In some embodiments, the inorganic filler is selected from the group consisting of aluminum hydroxide, aluminum oxide, magnesium hydroxide, silicon dioxide, and any combination thereof.

In some embodiments, the circuit substrate material further includes a flame retardant, and the total weight of the flame retardant is 0.2 to 1.5 times the total weight of the resin composition.

In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is A prepreg base material is provided, and the prepreg base material includes a reinforcing material and a circuit substrate material. The circuit substrate material is arranged on the reinforcing material, the circuit substrate material includes a resin composition, and the resin composition includes: 10 to 75 parts by weight of polyphenylene ether thermosetting resin, 5 to 40 parts by weight of polybutadiene thermosetting resin Resin and compatibilizer of 5 to 35 parts by weight. The polyphenylene ether thermosetting resin has at least one modification group, and the at least one modification group is selected from the group consisting of hydroxyl group, amine group, vinyl group, styrene group, methacrylate group and epoxy group . The compatibilizer is a linear olefin polymer.

In some embodiments, the reinforcing material has pores, and the reinforcing material is selected from glass fiber, carbon fiber, Kevlar fiber, polyester fiber, quartz fiber or any combination thereof. Wherein, the circuit substrate material fills in the pores of the reinforcing material or covers the surface of the reinforcing material.

In order to solve the above technical problems, another technical solution adopted by the present invention is to provide a circuit substrate, which includes a prepreg base material and at least one circuit layer. At least one circuit layer is disposed on the surface of the prepreg substrate. The prepreg base material includes a reinforcing material and a circuit substrate material, and the circuit substrate material is arranged on the reinforcing material. The circuit substrate material includes a resin composition, and the resin composition material includes: 10 to 75 parts by weight of polyphenylene ether thermosetting resin, 5 to 40 parts by weight of polybutadiene thermosetting resin and 5 to 35 parts by weight the compatibilizer. The compatibilizer is a linear olefin polymer. The end of the polyphenylene ether thermosetting resin has at least one modification group, at least one modification group is selected from the group consisting of: hydroxyl group, amino group, vinyl group, styrene group, methacrylate group and ring Oxygen. The compatibilizer is a linear olefin polymer.

One of the beneficial effects of the present invention is that the circuit substrate material, prepreg base material and circuit substrate provided by the present invention can pass the "resin composition comprising polyphenylene ether thermosetting resin, polybutadiene thermosetting resin and compatibilizer "Technical solution to reduce the dielectric constant and dielectric loss factor of the circuit substrate.

In order to enable a further understanding of the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention, but the provided drawings are only for reference and description, and It is not intended to limit the invention.

1: Prepreg substrate

10: Reinforcing material

20: Circuit substrate material

30: Line layer

2: Circuit board

FIG. 1 is a schematic perspective view of a prepreg substrate of the present invention.

FIG. 2 is a schematic cross-sectional side view of a circuit substrate according to one embodiment of the present invention.

FIG. 3 is a schematic side sectional view of a circuit substrate according to another embodiment of the present invention.

The following is a description of the implementation of the "circuit substrate material, prepreg base material and circuit substrate" disclosed by the present invention through specific specific examples. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification . The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

The invention discloses a circuit substrate material, which mainly includes a resin composition.

The resin composition comprises 10 parts by weight (parts by weight) to 75 parts by weight of a polyphenylene ether thermosetting resin, 5 parts by weight to 40 parts by weight of a polybutadiene thermosetting resin, 5 parts by weight to 35 parts by weight of a compatibilizer and 10 parts by weight. Parts by weight to 40 parts by weight of a crosslinking agent.

The polyphenylene ether thermosetting resin has at least one modification group, and the modification group can be selected from the group consisting of: hydroxyl group, amine group, vinyl group, styrene group, methacrylate group, ring Oxygen and combinations thereof. The modified group of the polyphenylene ether thermosetting resin can provide unsaturated bonds for cross-linking reaction to form an insulating layer material with a high glass transition temperature (Glass Transition Temperature, Tg) and good heat resistance.

In this embodiment, the opposite ends of the molecular structure of the polyphenylene ether thermosetting resin each have a modification group, and the above two modification groups are the same. For example, the polyphenylene ether thermosetting resin can be MX90 (the modified group at the two ends is a hydroxyl group) or MX9000 (the modified group at the two ends is a methacrylate group) produced by Saudi Basic Industries Corporation (SABIC), or OPE-2St (modified group at both ends is styrene group), OPE-2EA (modified group at both ends is methacrylate group) or OPE-2Gly (modified group at both ends) produced by Mitsubishi Gas Chemical Co., Ltd. (MGC) The modified group is epoxy group). However, the present invention is not limited thereto.

In this embodiment, the weight average molecular weight of the polyphenylene ether thermosetting resin is 1000 g/mol to 5000 g/mol. The preferred amount of the polyphenylene ether thermosetting resin can be further defined as 20 parts by weight to 60 parts by weight.

The polybutadiene thermosetting resin has at least one alkenyl-containing side chain (Side Chain). The alkenyl-containing side chain in the polybutadiene thermosetting resin can provide unsaturated bonds for cross-linking reaction, which can improve the cross-linking effect. The bridging density of the resin composition has good heat resistance. Moreover, the alkenyl-containing side chains in the polybutadiene thermosetting resin can improve the fluidity of the resin composition and further optimize the glue filling property of the resin composition.

In this embodiment, the alkenyl content in the polybutadiene thermosetting resin is greater than or equal to 20 weight percent (wt%). In a preferred embodiment, the content of alkenyl in the polybutadiene thermosetting resin is 20% by weight to 40% by weight. Specifically, the carbon number of the alkenyl-containing side chain in the polybutadiene thermosetting resin is 2 to 10, and the alkenyl-containing side chain is selected from the group consisting of vinyl, propenyl, benzene Vinyl and any combination thereof. For example, the polybutadiene thermosetting resin can be Ricon150, Ricon153, Ricon154 or Ricon184 produced by SARTOMER company, or It is PB-1000, PB-2000 or PB-3000 manufactured by Nippon Soda. However, the present invention is not limited thereto.

In this embodiment, the polybutadiene thermosetting resin has a weight average molecular weight of 3000 g/mol to 50000 g/mol, and it can be solid or liquid at normal temperature. The preferred amount of the polybutadiene thermosetting resin can be further defined as 10 parts by weight to 30 parts by weight.

A compatibilizer is a non-polar polymer that helps improve the miscibility of polyphenylene ether thermoset resins and polybutadiene thermoset resins. The form of the compatibilizer varies depending on the molecular weight. When the carbon number is 5 to 16, the compatibilizer is usually liquid. When the carbon number increases, the compatibilizer can also be solid.

In this embodiment, the compatibilizer is a linear olefin polymer, and a plurality of polymer units will form a linear polymer after polymerization, but the structure of the polymer units is not limited. In other words, the compatibilizer is a linear polymer (Linear Polymer), not a branched polymer (Branched Polymer), a network polymer (Network Polymer) or a cyclic polymer (Macrocyclic Polymer). Additionally, the compatibilizer would not be a polybutadiene thermosetting resin.

Specifically, the compatibilizer may be polyethylene copolymer, polypropylene copolymer, methylstyrene copolymer, cyclic olefin copolymer (Cyclic Olefin Copolymer) or any combination thereof, but is not limited thereto.

In this embodiment, the compatibilizer has at least one alkenyl-containing side chain with 2 to 10 carbon atoms. The alkenyl-containing side chain in the compatibilizer can help the polyphenylene ether thermosetting resin and the polybutadiene thermosetting resin to be miscible, and reduce the hygroscopicity, dielectric constant and dielectric loss factor of the resin composition. In a preferred embodiment, the alkenyl-containing side chain may be selected from the group consisting of vinyl, propenyl, styryl and any combination thereof. In another preferred embodiment, the compatibilizer does not have hydroxyl groups. If the compatibilizer has a hydroxyl group, the heat resistance and electrical properties of the resin composition will decrease, and the hygroscopicity will increase.

For example, the compatibilizer can be G1643, G1645, G1762, MD1648 or MD6951 produced by Kraton, or RB810, RB820, RB830, RB840, or TPX resin, TAFMER resin, APEL resin, FTR resin, HIWAX resin or EXCEREX resin produced by Mitsui Chemicals, or DERCOLYTE resin or Pentalyn resin produced by French DRT company, or TOPAS resin produced by Japan Polyplastics.

In this embodiment, the weight average molecular weight of the compatibilizer is 1000 g/mol to 10000 g/mol, and it can be solid or liquid at normal temperature. The preferred amount of the compatibilizer can be further defined as 5 parts by weight to 20 parts by weight.

The addition of crosslinking agent can improve the crosslinking degree of polyphenylene ether thermosetting resin. In this embodiment, the crosslinking agent includes allyl group. For example, the crosslinking agent can be triallyl cyanurate (Trallyl Cyanurate, TAC), triallyl isocyanurate (Triallyl Isocyanurate, TAIC), diallyl phthalate ( Diallyl Phthalate), Divinylbenzene, Triallyl Trimellitate, or any combination thereof. However, the present invention is not limited thereto.

The material of the circuit board material may optionally include a filler, a flame retardant, and a hardening initiator in addition to the resin composition.

In this embodiment, the filler is an inorganic filler, such as but not limited to: aluminum hydroxide, aluminum oxide, magnesium hydroxide, silicon dioxide or any combination thereof. The total weight of the filler is 0.4 to 2.5 times the total weight of the resin composition. In a preferred embodiment, the total weight of the filler is 0.6 to 2.25 times the total weight of the resin composition.

In this embodiment, the flame retardant may be a phosphorus flame retardant or a brominated flame retardant.

Brominated flame retardants can be ethylene bistetrabromophthalimide (Ethylene Bistetrabromophthalimide), bis(pentabromophenoxy) tetrabromobenzene (Tetradecabromodiphenoxy Benzene), decabromodiphenyl oxide (Decabromo Diphenoxy Oxide) ) or any combination thereof, but not limited to. For example, the brominated flame retardant can be Saytex BT 93W (Ethylene Bistetrabromophthalimide) flame retardant, Saytex 120 (Tetradecabromodiphenoxy Benzene) flame retardant, Saytex 8010 (Ethane-1,2-bis (pentabromophenyl)) flame retardant or Saytex 102 (Decabromo Diphenoxy oxidd) flame retardant.

The phosphorus-based flame retardant may be Sulphosuccinic Acid Ester, Phosphazene, Ammonium Polyphosphate, Melamine Polyphosphate or Melamine Cyanurate. Phosphate lipids include triphenyl phosphate (Triphenyl Phosphate, TPP), resorcinol bisphosphate (Tetraphenyl Resorcinol Bis (diphenylphosphate), RDP), bisphenol A bis (diphenyl) phosphate (Bisphenol A Bis ( diphenyl phosphate), BPAPP), bisphenol A bis (dimethyl) phosphate (BBC), resorcinol diphosphate (such as CR-733S produced by DAIHACHI), resorcinol bis (di-2,6 -dimethylphenyl phosphate) (for example, PX-200 produced by Daihachi Chemical Co., Ltd.).

In this embodiment, the total weight of the flame retardant is 0.2 to 1.5 times the total weight of the resin composition. In a preferred embodiment, the total weight of the flame retardant is 0.3 to 1.25 times the total weight of the resin composition.

Hardening initiators can be used to accelerate the crosslinking reaction. When the hardening initiator is heated, it will decompose to form free radicals, inducing the polymerization reaction to occur. In this embodiment, the hardening initiator is an organic peroxide, such as but not limited to: tert-butylcumyl peroxide, dicumyl peroxide (Dicumyl Peroxide, DCP), benzoyl peroxide (Benzoyl Peroxide, BPO), 2,5-Dimethyl-2,5-di(tert-butylperoxy)hexane (2,5-Dimethyl-2,5-di(tert-butylperoxy)hexane), 2,5-Dimethyl-2,5-di(tert-butylperoxy)hexyne (2,5-Dimethyl-2,5-di(tert-butylperoxy)hexyne), 1,1-di(tert-butylperoxy)hexyne Butylperoxy)-3,3,5-trimethylcyclohexane (1,1-Di-(tert-butylperoxy)-3,3,5-trimethylcyclohexane), di-tert-butylperoxyisopropyl Benzene (Di(tert-butylperoxyisopropyl)benzene).

In this embodiment, the total weight of the hardening initiator is the total weight of the resin composition 0.5wt% to 1.5wt%.

The present invention further provides a prepreg 1 , as shown in FIG. 1 , the prepreg 1 includes a reinforcing material 10 and a circuit board material 20 . The circuit board material 20 is disposed on the reinforcing material 10 . In this embodiment, the reinforcing material 10 has pores. The circuit substrate material 20 fills the pores of the reinforcing material 10 and covers the surface of the reinforcing material 10 , that is, the circuit substrate material 20 covers the reinforcing material 10 .

In this embodiment, the prepreg base material 1 includes 10wt% to 50wt% of the reinforcing material 10, 20wt% to 50wt% of the resin composition, 20wt% to 50wt% of the filler and 10wt% to 30wt% of the flame retardant .

The reinforcing material 10 may be glass fiber, carbon fiber, Kelvar ^® Fiber, polyester fiber, quartz fiber or any combination thereof, but is not limited thereto. In this embodiment, the reinforcing material may be glass fiber. For example, the glass fiber can be Electronic Glass Fabric (Electronic Glass Fabric), Electronic Glass Fabrics-Ultra Thin Cloth (Electronic Glass Fabrics-Ultra Thin Cloth) or Electronic Glass Fabrics -Low Dielectric Cloth). The reinforcing material 10 can be made of different thicknesses or types of glass fiber cloth according to different needs, for example: Nan Ya Plastic Company’s model is 7628, 1080 or 106 electronic grade general-purpose glass fiber cloth, and Nan Ya Plastic Company’s model is 2116. Electronic grade low dielectric glass fiber cloth. However, the present invention is not limited thereto.

The total weight of the reinforcing material 10 may be 0.2 to 2.5 times the total weight of the resin composition.

Referring to FIG. 2 , the present invention discloses a circuit substrate 2 . The circuit substrate 2 includes a prepreg base material 1 and at least one circuit layer 30 . At least one circuit layer 30 is disposed on the surface of the prepreg substrate 1 , and the material of the at least one circuit layer 30 may include but not limited to copper, aluminum, silver or an alloy containing the above metals. In this embodiment, the circuit substrate 2 is a copper clad laminate (CCL), which means that the material of the wiring layer 30 includes copper.

In this embodiment, the circuit substrate 2 has a circuit layer 30 disposed on the surface of the prepreg substrate 1 . In other embodiments, the circuit substrate 2 may have two circuit layers 30 , and the two circuit layers 30 are respectively disposed on two opposite surfaces of the prepreg substrate 1 , as shown in FIG. 3 .

In order to prove the effectiveness of the present invention, the following will describe the preparation method of the circuit board 2 in detail, and enumerate the composition and ratio of the varnish in a plurality of embodiments and comparative examples, and make a comparison of the circuit boards prepared in the plurality of embodiments and comparative examples 2. Conduct tests to obtain data test results of the circuit substrate 2 in multiple embodiments and comparative examples.

The manufacturing method of the circuit board 2 of the present invention at least includes the following steps: in step S1, mixing polyphenylene ether thermosetting resin, polybutadiene thermosetting resin, compatibilizer and crosslinking agent, and stirring to form a resin composition. In step S2, a filler, a flame retardant, and a hardening initiator are sequentially added to the resin composition to prepare a varnish. In step S3, the reinforcing material 10 is dipped in the varnish for impregnation treatment (Impregnation Treatment). In this embodiment, the electronic-grade low-dielectric glass fiber cloth with a model number of 2116 from Nanya Plastics Co., Ltd. is used as the reinforcing material 10 . In step S4 , the reinforcing material 10 impregnated with varnish is semi-cured at a temperature of 130° C. to form a prepreg base material 1 . In step S5, after stacking six pieces of prepreg base material 1, a 1 ounce (Ounce) copper foil is covered on the upper and lower sides as the circuit layer ³⁰ . The circuit substrate 2 was obtained by hot pressing under a pressure of cm ² for three hours. In the examples of the present invention, hot pressing is carried out at a temperature of 195° C. and a pressure of 30 kg/cm ² (equivalent to 426 psi).

The components of the varnishes in Examples 1 to 5 of the present invention and Comparative Examples 1 to 3 are listed in Table 1 below. The difference between Examples 1 to 5 and Comparative Examples 1 to 3 lies in whether the resin composition has polyphenylene ether thermosetting resin, polybutadiene thermosetting resin and compatibilizer at the same time. Specifically, the resin composition of Comparative Example 1 does not include polybutadiene thermosetting resin and compatibilizer, the resin composition of Comparative Example 2 does not include polybutadiene thermosetting resin, and the resin composition of Comparative Example 3 Does not include compatibilizers.

The components of the varnishes in Examples 6 to 13 of the present invention are listed in Table 2 below. Examples 6 to 13 The difference lies in: the use of different types of compatibilizers, and the regulation of different additions of polyphenylene ether thermosetting resins, compatibilizers and crosslinking agents.

In addition, the circuit substrates of Examples 1 to 13 and Comparative Examples 1 to 3 were tested for peel strength (Peel Strength), dielectric constant (Dielectric Constant, Dk), dielectric loss factor (Dissipation Factor, Df), glass transition temperature (Glass Transition Temperature, Tg), moisture absorption (Water absorption), solder heat resistance (Solder Heat Resistance) and flame retardancy (Flammability) tests. The data test results of Examples 1 to 5 and Comparative Examples 1 to 3 are listed in Table 1, and the data test results of Examples 6 to 13 are listed in Table 2.

According to the results of Table 1 and Table 2, it can be seen that compared with Comparative Examples 1 to 3, the circuit substrate 2 of the present invention has a lower dielectric constant and a dielectric loss factor, that is, it has excellent electrical properties, and can be applied In high-frequency circuit substrates. In addition, the circuit substrate 2 of the present invention has a high glass transition temperature, high Features of heat resistance and low moisture absorption rate. The prepreg substrate 1 of the present invention has a low viscosity at room temperature, has the advantages of easy storage and transportation, has good fluidity in a high-temperature molten state, is suitable for automatic manufacturing processes, and has good hole-filling properties, which is beneficial to the manufacturing process. The varnish of the present invention has the property that the solution is stable without precipitation.

[Advantageous Effects of Embodiment]

One of the beneficial effects of the present invention is that the circuit substrate material 20, the prepreg base material 1 and the circuit substrate 2 provided by the present invention can pass the "resin composition comprising polyphenylene ether thermosetting resin, polybutadiene thermosetting resin and Compatibilizer" technical solution to reduce the dielectric constant and dielectric loss factor of the circuit substrate 2.

Furthermore, the present invention can increase the cross-linking density of the resin composition after hardening through the technical scheme of "polyphenylene ether thermosetting resin has at least one modification group" and "the cross-linking agent contains phenylene groups", so as to provide The circuit substrate 2 has excellent high temperature resistance characteristics.

Furthermore, the present invention can improve the fluidity and filling properties of the resin composition at high temperature through the technical solution of "the polybutadiene thermosetting resin has at least one alkenyl-containing side chain".

Furthermore, the present invention can increase the compatibility of polyphenylene ether thermosetting resin and polybutadiene thermosetting resin through the technical solution of "the compatibilizer has at least one alkenyl-containing side chain", so as to improve the stability of the varnish .

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

1: Prepreg substrate

10: Reinforcing material

20: Circuit substrate material

Claims (15)

A circuit substrate material, which includes a resin composition, the resin composition includes: 10 to 75 parts by weight of polyphenylene ether thermosetting resin, the polyphenylene ether thermosetting resin has at least one modification group, at least one The modifying group is selected from the group consisting of: hydroxyl group, amino group, vinyl group, styrene group, methacrylate group and epoxy group; 5 parts by weight to 40 parts by weight of polybutadiene Thermosetting resin, the polybutadiene thermosetting resin has at least one alkenyl-containing side chain, the content of alkenyl in the polybutadiene thermosetting resin is 20% by weight to 40% by weight; and 5 parts by weight to 35 parts by weight Parts of compatibilizer, the compatibilizer is a linear olefin polymer, the compatibilizer has at least one alkenyl-containing side chain, the at least one alkenyl-containing side chain is selected from the following The group formed: vinyl, propenyl, styryl and any combination thereof. The circuit substrate material according to claim 1, wherein the opposite ends of the polyphenylene ether thermosetting resin have the same modification group. The circuit substrate material according to claim 1, wherein the resin composition further comprises: 10 parts by weight to 40 parts by weight of a cross-linking agent, and the cross-linking agent contains phenylene groups. The circuit substrate material as claimed in item 3, wherein the crosslinking agent includes triallyl cyanurate, triallyl isocyanurate, diallyl phthalate, divinyl Benzene, Triallyl Tricarboxylate, or any combination thereof. The circuit substrate material according to claim 1, wherein the alkenyl-containing side chain in the polybutadiene thermosetting resin has 2 to 10 carbon atoms. The circuit substrate material according to claim 1, wherein the alkenyl-containing side chain in the polybutadiene thermosetting resin is selected from the group consisting of: Vinyl, propenyl, styryl, and any combination thereof. The circuit substrate material as claimed in item 1, wherein the compatibilizer is selected from the group consisting of: polyethylene copolymer, polypropylene copolymer, methyl styrene copolymer, cyclic olefin Copolymers and any combination thereof. The circuit substrate material according to claim 1, wherein the alkenyl-containing side chain of the compatibilizer has 2 to 10 carbon atoms. The circuit substrate material according to claim 1, wherein the compatibilizer does not contain hydroxyl groups. The circuit substrate material according to claim 1, wherein the circuit substrate material further includes a filler, and the total weight of the filler is 0.4 to 2.5 times the total weight of the resin composition. The circuit substrate material according to claim 10, wherein the inorganic filler is selected from the group consisting of aluminum hydroxide, aluminum oxide, magnesium hydroxide, silicon dioxide, and any combination thereof. The circuit substrate material according to claim 1, wherein the circuit substrate material further includes a flame retardant, and the total weight of the flame retardant is 0.2 to 1.5 times the total weight of the resin composition. A prepreg base material, which includes: a reinforcing material; and a circuit substrate material, the circuit substrate material is arranged on the reinforcing material, the circuit substrate material includes a resin composition, and the resin composition includes: 10 parts by weight to 75 parts by weight of polyphenylene ether thermosetting resin, the end of the polyphenylene ether thermosetting resin has at least one modification group, at least one modification group is selected from the group consisting of hydroxyl group, amino group, vinyl group, A group consisting of styrene group, methacrylate group and epoxy group; 5 parts by weight to 40 parts by weight of polybutadiene thermosetting resin, the polybutadiene The alkene thermosetting resin has at least one alkenyl-containing side chain, and the content of the alkene group in the polybutadiene thermosetting resin is 20% by weight to 40% by weight; and 5 parts by weight to 35 parts by weight of a compatibilizer, the The compatibilizer is a linear olefin polymer having at least one alkenyl-containing side chain selected from the group consisting of vinyl , propenyl, styryl, and any combination thereof. The prepreg substrate according to claim 13, wherein the reinforcing material has pores, and the reinforcing material is selected from: glass fiber, carbon fiber, Kevlar fiber, polyester fiber, quartz fiber or any combination thereof ; Wherein, the circuit substrate material fills the pores of the reinforcing material or covers the surface of the reinforcing material. A circuit substrate, which includes: a prepreg base material, the prepreg base material includes a reinforcing material and a circuit substrate material, the circuit substrate material is arranged on the reinforcing material, and the circuit substrate material includes a resin composition The resin composition material includes: 10 parts by weight to 75 parts by weight of polyphenylene ether thermosetting resin, the end of the polyphenylene ether thermosetting resin has at least one modification group, and at least one modification group is selected from A group consisting of hydroxyl group, amino group, vinyl group, styrene group, methacrylate group and epoxy group; 5 parts by weight to 40 parts by weight of polybutadiene thermosetting resin, the polybutadiene thermosetting resin The resin has at least one alkenyl-containing side chain, and the content of alkenyl in the polybutadiene thermosetting resin is 20 to 40 weight percent; and 5 to 35 parts by weight of a compatibilizer, the compatibilizer The agent is a linear olefin polymer, the compatibilizer has at least one alkenyl-containing side chain, and the at least one alkenyl-containing side chain is selected from the group consisting of vinyl, propylene styryl, styryl, and any combination thereof; and At least one circuit layer, at least one circuit layer is arranged on the surface of the prepreg base material.

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