TWI801756B - Light-emitting module and light-emitting appratus using the smae - Google Patents

Abstract

A light-emitting apparatus includes a first light-emitting module and a second light-emitting module. The first light-emitting module includes a first circuit carrier board, a plurality of first light-emitting units disposed on the first circuit carrier board, and a first encapsulate body disposed on the first circuit carrier board and covering the plurality of first light-emitting units. The second light-emitting module includes a second circuit carrier board, a plurality of second light-emitting units disposed on the second circuit carrier board, and a second encapsulate body disposed on the second circuit carrier board and covering the plurality of second light-emitting units. The bottom surface of the first circuit carrier board has a first outermost position, the top surface of the first encapsulate body has a second outermost position, the bottom surface of the second circuit carrier board has a third outermost position, and the top surface of the second encapsulate body has a fourth outermost position. The second outermost position is directly connected to the fourth outermost position, and the first outermost position is separated from the third outermost position.

Description

Light-emitting module and light-emitting device spliced by the light-emitting module

The present invention relates to a light-emitting module, and in particular to a light-emitting module that can be spliced into a light-emitting device and a manufacturing method thereof.

With the rapid development of light-emitting diode (Light-Emitting Diode, LED) display technology, LED displays are more and more widely used.

Large-size displays need to be achieved by splicing a plurality of light-emitting modules. In order to reduce the light interference between the multiple light-emitting modules at the splicing intersection, the splicing technology of the light-emitting modules is particularly important. The invention provides a design and manufacturing method of a light-emitting module, which is used to improve the phenomenon of uneven light intensity at the splicing intersection of the light-emitting module.

In the present invention, the LED chip is directly fixed on the circuit carrier board, and then the LED chip is integrally molded with encapsulation colloid to form a light-emitting module, which reduces the volume of the light-emitting module.

In order to reduce the phenomenon of non-uniform light emission at the edge of the encapsulant, by adjusting the spacing between adjacent circuit substrates, the sides of the encapsulant of multiple light-emitting modules are connected to each other, so as to provide seamless splicing display characteristics.

An object of the present invention is to provide a light emitting module assembly applied to a display to achieve the effects of high contrast, high brightness, high heat dissipation and local dimming.

In order to achieve at least one of the above objectives, a light emitting device including a first light emitting module and a second light emitting module is disclosed according to an embodiment of the present invention. The first light-emitting module includes a first circuit carrier, a plurality of first light-emitting units on the first circuit carrier, and a first encapsulant on the first circuit carrier to cover the plurality of first light-emitting units. The second light-emitting module includes a second circuit carrier, a plurality of second light-emitting units on the second circuit carrier, and a second encapsulant on the second circuit carrier to cover the plurality of second light-emitting units. Wherein, the lower surface of the first circuit carrier has a first outermost position, the upper surface of the first encapsulant has a second outermost position, the lower surface of the second circuit carrier has a third outermost position, and the second encapsulant The upper surface of has a fourth outermost position. The second outermost position and the fourth outermost position are engaged with each other, and the first outermost position and the third outermost position are separated from each other.

In order to make the description of the present invention more detailed and complete, please refer to the description of the following embodiments together with the relevant figures. However, the embodiments shown below are used to illustrate the light-emitting module assembly of the present invention, and the present invention is not limited to the following embodiments. In addition, the dimensions, materials, shapes, relative arrangements, etc. of the constituent parts described in the embodiments in this specification are not limited, and the scope of the present invention is not limited thereto, but is merely illustrative. In addition, the size and positional relationship of components shown in the drawings may be exaggerated for clarity. In addition, in the following description, in order to omit detailed description appropriately, the same name and symbol are used for the same or similar member.

Light-emitting devices need different sizes in different environments and different display specifications. By combining and splicing multiple light-emitting modules, various sizes and specifications can be flexibly provided to meet the needs. FIG. 1A , FIG. 1B , and FIG. 2 are the manufacturing method of the light-emitting module disclosed according to an embodiment of the present invention. As shown in FIG. 1A, a plurality of light-emitting units 1001 can be flip-chip chips, which are fixed on the original circuit carrier 102 by flip chip bonding through COB packaging (Chip on Board) technology. An electrical connection is made to the initial circuit carrier 102 . In another embodiment, the plurality of light-emitting units 1001 may be a vertical chip, a horizontal chip or a combination of the above two types of chips, and are electrically connected to the initial circuit carrier 102 by bonding wires. A plurality of light emitting units 1001 are arranged in an array on the initial circuit carrier 102 with a fixed pitch.

The light-emitting module of the present invention can be applied to lighting, backlight, or display (directly used as pixels). According to needs, a plurality of light-emitting units 1001 include red light-emitting diodes, green light-emitting diodes and/or blue light-emitting diodes, for example, light-emitting units 1001 can be blue light-emitting diodes The polar body (the blue light-emitting diode can emit white light when matched with appropriate phosphor powder), and the light-emitting unit 1001 includes red, green and blue light-emitting diodes when it is applied to a display.

As shown in FIG. 1A, the plurality of light-emitting units 1001 are flip-chip chips, and each light-emitting unit 1001 can be fixed on the initial circuit carrier 102 by conductive materials (not shown), for example, solder, anisotropic conductive adhesive. . In another embodiment, when the plurality of light emitting units 1001 are vertical wafers or horizontal wafers (both positive and negative poles face upward, or both positive and negative poles face away from the circuit carrier 102), each light emitting unit 1001 can be suitably An adhesive material (not shown) is fixed on the initial circuit carrier 102 . For example, when the light emitting unit 1001 is a vertical chip, the adhesive material is solder, isotropic conductive adhesive, etc.; when the light emitting unit 1001 is a horizontal chip, the adhesive material is silver glue, epoxy resin, silicon glue, etc.

The initial circuit carrier 102 includes a printed circuit board (Printed Circuit Board, PCB), a flexible printed circuit board (Flexible Printed Circuit Board, FPCB), a transparent organic material substrate, or glass.

As shown in Figure 1A, the glue dispenser 1004 pours an encapsulant 1003 on the upper surface of the initial circuit carrier 102 carrying the light emitting unit 1001 according to the preset flow coating method, so that each light emitting unit 1001 and the initial circuit carrier The upper surfaces of 102 are covered by encapsulant 1003 . Subsequently, a baking process is performed to cure the encapsulant 1003 . In another embodiment, the encapsulant 1003 can also be a film structure, which is formed on the initial circuit carrier by a molding method. In another embodiment, the encapsulant 1003 can also be molded and then baked.

The above-mentioned encapsulant 1003 includes light-transmitting materials, such as epoxy resin or silicone resin, but the application is not limited thereto. In another embodiment, the encapsulant 1003 contains carbon black particles, which can absorb light from the external environment, so as to reduce the light reflected by the initial circuit carrier 102 when the external light penetrates the encapsulant.

According to the size of the light-emitting device, a corresponding number and size of circuit substrates 1002 and corresponding specifications of the light-emitting unit 1001 are provided. The initial circuit carrier 102 can be cut into small circuit carriers according to the size requirements of the light emitting module. FIG. 1B shows a top view of one area of circuit carrier 1002 in FIG. 1A. That is, the initial circuit carrier 102 includes a plurality of circuit carriers 1002 . As shown in FIG. 1B, in order to avoid damage to the components on the original circuit carrier 102 during the subsequent cutting process, such as the light-emitting unit 1001, a cutting portion 101A in the direction YY' and a direction X are formed around the circuit carrier 1002. -X' cutout 101B. The cutouts 101A, 101B do not have the light emitting unit 1001 disposed thereon.

Fig. 2 is a schematic diagram of cutting and removing the cutting part disclosed according to an embodiment of the present invention. After the encapsulant 1003 is formed, the cutter 1010 is used to cut and remove the upper surface and/or the lower surface of the original circuit carrier 102 along the cutting parts 101A and 101B, so that the adjacent circuit carrier 1002 is The cutouts 101A, 101B are separated from each other. The detaching action can optionally include splitting. That is, a plurality of light-emitting modules 1 are formed, and each light-emitting module 1 includes a circuit carrier 1002 and a plurality of light-emitting units 1001 located on the circuit carrier 1002 . Viewed from a side view of the cutter 1010, the shape of the blade includes trapezoidal, rectangular or V-shaped. In another embodiment, the cutter cuts halfway from the lower surface of the original circuit carrier 102 relative to the light emitting unit 1001 , that is, the encapsulant 1003 is not cut through. Then splitting is performed to separate the circuit carrier 1002 from each other to form a plurality of light emitting modules.

In another embodiment (not shown in the figure), before the encapsulant 1003 is formed, the upper surface and/or the lower surface of the original circuit carrier 102 are cut along the cutting parts 101A and 101B by a cutter. remove. It should be noted that during this step, the cut portions 101A, 101B are not cut through. Then, the encapsulant 1003 is formed on the initial circuit carrier 102 , so that the encapsulant 1003 covers the light emitting unit 1001 , the upper surface of the initial circuit carrier 102 , and the walkways formed after the cutouts 101A and 101B are removed. Finally, the separation operation is performed from the positions of the cutting parts 101A and 101B on the lower surface of the initial circuit carrier 102 . The act of separation may include cutting and/or cleaving by a knife. That is, a plurality of light-emitting modules 1 are formed, and each light-emitting module 1 includes a circuit carrier 1002 and a plurality of light-emitting units 1001 located on the circuit carrier 1002 .

Fig. 3 is a schematic diagram of a device for cutting and removing a cut portion disclosed according to an embodiment of the present invention. In this embodiment, a milling cutter cutting device 1050 is controlled by a computer host (not shown in the figure) to cut and remove the cutting parts 101A and 101B of the initial circuit carrier 102 . The milling cutter can cut various shapes such as straight lines and arcs on the initial circuit carrier 102 with high cutting precision.

FIG. 4A is a side view of a light emitting module according to an embodiment disclosed in the present invention. FIG. 4A shows that the light-emitting module 1 a includes a circuit carrier 1002 , a plurality of light-emitting units 1001 , and an encapsulant 1003 . The circuit carrier 1002 includes an upper surface 1023 , a lower surface 1022 , and a side surface 1021 located between the upper surface 1023 and the lower surface 1022 . A plurality of light emitting units 1001 are located on the upper surface 1023 of the circuit carrier 1002 . The encapsulant 1003 includes a side surface 1031 and an upper surface 1033 , and is located on the circuit carrier 1002 and covers a plurality of light emitting units 1001 . As shown in FIG. 4A , after cutting, the side surface 1031 of the encapsulant 1003 and/or the side surface 1021 of the circuit carrier 1002 includes an inclined surface and/or a serrated surface. There is a first angle θ ₁ between the top surface 1033 and the side surface 1031 of the encapsulant 1003 , and the first angle θ ₁ is between 60 degrees and 90 degrees. The upper surface 1033 of the encapsulant 1003 has an outermost position 1033P, and the lower surface 1022 of the circuit carrier 1002 has an outermost position 1022P. The first angle _θ1 refers to the slope (or oblique line) formed by the outermost position 1033P and the outermost position 1022P and the acute angle formed with the upper surface 1033 of the encapsulant 1003 . There is a second angle θ ₂ between the side surface 1021 of the circuit carrier 1002 and the lower surface 1022 of the carrier, and the second angle θ ₂ is between 120 degrees and 160 degrees. The second angle θ ₂ is an obtuse angle formed between the slope (or oblique line) formed by the outermost position 1033P and the outermost position 1022P and the lower surface 1022 of the circuit carrier 1002 . In a cross-sectional view, the outermost position 1033P of the upper surface 1033 of the encapsulant 1003 protrudes outwardly than the outermost position 1022P of the lower surface 1022 of the circuit carrier 1002 . In a cross-sectional view, the side surface of the circuit carrier 1002 has an outermost position 1021P, and the outermost position 1033P of the upper surface 1033 of the encapsulant 1003 protrudes from the outermost position 1021P of the side surface of the circuit carrier 1002 . In another embodiment, the outermost position 1033P of the upper surface 1033 of the encapsulant 1003 and the outermost position 1021P of the side surface of the circuit carrier 1002 are substantially located at the same normal position relative to the upper surface 1023 .

FIG. 4B is a side view of a light emitting module according to an embodiment disclosed in the present invention. As shown in FIG. 4B, the light-emitting module 1b and the light-emitting module 1a have the same name and label structure, indicating the same structure, the same material, or the same function, and the description will be omitted here or not. Let me repeat. As shown in FIG. 4B , the side surface 1021 of the circuit carrier 1002 includes an upper portion 10211 and a lower portion 10212 , and there is a third angle θ ₃ between the upper portion 10211 and the lower portion 10212 , which is larger than 90 degrees. The encapsulant 1003 covers the upper surface 1023 and part of the side surface 1021 of the circuit carrier 1002 . In detail, the encapsulant 1003 completely covers the light emitting unit 1001 , the upper surface 1023 of the circuit carrier 1002 , and the upper portion 10211 of the side surface 1021 of the circuit carrier 1002 . In a cross-sectional view, the outermost position 1033P of the upper surface 1033 of the encapsulant 1003 protrudes outwardly than the outermost position 1022P of the lower surface 1022 of the circuit carrier 1002 . In a cross-sectional view, the encapsulant side 1031 protrudes out of the lower portion 10212 of the side surface 1021 of the circuit carrier 1002 . In a cross-sectional view, the side surface of the circuit carrier 1002 has an outermost position 1021P, and the outermost position 1033P of the upper surface 1033 of the encapsulant 1003 protrudes from the outermost position 1021P of the side surface of the circuit carrier 1002 . In another embodiment, the outermost position 1033P of the upper surface 1033 of the encapsulant 1003 and the outermost position 1021P of the side surface of the circuit carrier 1002 are substantially located at the same normal position relative to the upper surface 1023 . FIG. 4C is a side view of a light emitting module according to an embodiment disclosed in the present invention. As shown in Figure 4C, the light-emitting module 1c and the light-emitting module 1a have the same name and label structure, indicating the same structure, the same material, or the same function, and the description will be omitted here or not. Let me repeat. The light emitting module 1 c includes a circuit carrier 1002 , a plurality of light emitting units 1001 , and an encapsulant 1003 . The circuit carrier 1002 has an upper surface 1023 , a side surface 1021 , and a lower surface 1022 . A plurality of light emitting units 1001 are located on the upper surface 1023 of the carrier. The encapsulant 1003 has a side surface 1031 and an upper surface 1033 , and is located on the circuit carrier 1002 and covers a plurality of light emitting units 1001 , the upper surface 1023 of the circuit carrier, and part of the side surface 1021 . There is a fourth angle θ ₄ between the side surface 1031 and the upper surface 1033 of the encapsulant 1003, and the fourth angle θ ₄ is between 70 degrees and 110 degrees, preferably between 80 degrees and 100 degrees, and more The best is between 85 degrees and 95 degrees. The side surface 1021 of the circuit carrier 1002 includes an upper part 10211 , a lower part 10212 , and a connecting part 10213 connecting the upper part 10211 and the lower part 10212 . There is a fifth angle θ ₅ between the upper portion 10211 of the circuit carrier 1002 and the upper surface 1023 , and the fifth angle θ ₅ is an obtuse angle between 95° and 135°. There is a sixth angle θ ₆ between the upper portion 10211 and the connecting portion 10213 , and the sixth angle θ ₆ is an obtuse angle between 95 degrees and 135 degrees. There is a seventh angle θ ₇ between the lower portion 10212 and the lower surface 1022 , and the seventh angle θ ₇ is an obtuse angle between 95 degrees and 135 degrees. There is an eighth angle θ ₈ between the lower portion 10212 and the connecting portion 10213 , and the eighth angle θ ₈ is an obtuse angle ranging from 95° to 135°.

The encapsulant 1003 covers the upper surface 1023 and part of the side surface 1021 of the circuit carrier 1002 . In detail, the encapsulant completely covers the light-emitting element 1001 , the upper surface 1023 of the circuit carrier 1002 , and the upper portion 10211 of the side surface of the circuit carrier. The side surface 1031 of the encapsulant 1003 can be flush with the connecting portion 10213 of the side surface 1021 of the circuit carrier 1002 . In another embodiment (not shown), the side surface 1031 of the encapsulant 1003 protrudes out of the connection portion 10213 of the side surface 1021 of the circuit carrier 1002 . In a cross-sectional view, the outermost position 1033P of the upper surface 1033 of the encapsulant 1003 protrudes outwardly than the outermost position 1022P of the lower surface 1022 of the circuit carrier 1002 . In a cross-sectional view, the side surface of the circuit carrier 1002 has an outermost position 1021P, and the outermost position 1033P of the upper surface 1033 of the encapsulant 1003 protrudes from the outermost position 1021P of the side surface of the circuit carrier 1002 . In another embodiment, the outermost position 1033P of the upper surface 1033 of the encapsulant 1003 and the outermost position 1021P of the side surface of the circuit carrier 1002 are substantially located at the same normal position relative to the upper surface 1023 .

FIG. 4D is a side view of a light emitting module according to an embodiment disclosed in the present invention. As shown in FIG. 4D, the light-emitting module 1d and the light-emitting module 1a have the same name and label structure, indicating the same structure, the same material, or the same function, and the description will be omitted here or not. Let me repeat. As shown in FIG. 4D , the side surface 1021 of the circuit carrier 1002 is a curved surface and has an outermost position 1021P. The encapsulant 1003 completely covers the light emitting element 1001 , the upper surface 1023 of the circuit carrier 1002 , and part of the side surface 1021 of the circuit carrier 1002 . In a cross-sectional view, the outermost position 1033P of the upper surface 1033 of the encapsulant 1003 protrudes outwardly than the outermost position 1022P of the lower surface 1022 of the circuit carrier 1002 . In a cross-sectional view, the side surface 1021 of the circuit carrier 1002 has an outermost position 1021P, and the outermost position 1033P of the upper surface 1033 of the encapsulant 1003 protrudes from the outermost position 1021P of the side surface 1021 of the circuit carrier 1002 . In another embodiment, the outermost position 1033P of the upper surface 1033 of the encapsulant 1003 and the outermost position 1021P of the side surface of the circuit carrier 1002 are substantially located at the same normal position relative to the upper surface 1023 .

FIG. 5 is a schematic diagram of a light emitting device 100 disclosed by an embodiment of the present invention. As shown in FIG. 5 , the light emitting device 100 is formed by splicing a plurality of light emitting modules 1 . When the light emitted by the light-emitting unit 1001 exits through the encapsulant, the light enters the optically thinner medium from the optically denser medium. If there is a gap between the encapsulants of adjacent light-emitting modules, part of the light will be reflected at the side of the encapsulant at the joint. In other words, the light intensity at the junction of two adjacent light emitting modules will be different from the light intensity at other positions. The present invention connects the side surfaces 1031 of the encapsulant 1003 of a plurality of light-emitting modules 1 to each other by adjusting the structure of the four sides of the circuit carrier of the light-emitting module 1 and/or utilizing the deformability of the encapsulant 1003 to reduce the size. The distance between two adjacent packaging colloids reduces the phenomenon of uneven light emission at the edge of the packaging colloids, so as to provide a light emitting device 100 with seamless splicing. The structure of the light emitting module 1 can be the aforementioned light emitting module 1a, 1b, 1c, or 1d.

FIGS. 6A-6D are partial side views of the junction of the light emitting device 100 in FIG. 5 at position A or position B disclosed by different embodiments of the present invention. For the convenience of description, two light-emitting modules arranged adjacent to each other among the plurality of light-emitting modules are referred to as the first light-emitting module 11 and the second light-emitting module 12 to distinguish them.

The light-emitting modules 11 and 12 in FIG. 6A have the structure of the light-emitting module 1a in FIG. 4A. The light-emitting modules 11 and 12 in FIG. 6B have the structure of the light-emitting module 1b in FIG. 4B. The light-emitting modules 11 and 12 in FIG. 6C have the structure of the light-emitting module 1c in FIG. 4C. The light-emitting modules 11 and 12 in FIG. 6D have the structure of the light-emitting module 1d in FIG. 4D. Referring to FIGS. 6A˜6D , the first light-emitting module 11 includes a first circuit carrier 1102 , a plurality of first light-emitting elements 1101 , and a first encapsulant 1103 . The first circuit carrier 1102 includes an upper surface 1123 , a lower surface 1122 , and a side surface 1121 . The plurality of first light emitting units 1101 are located on the upper surface 1123 of the first circuit carrier 1102 . The first encapsulant 1103 includes a side surface 1131 covering the plurality of first light emitting units 1101 and the upper surface 1123 of the first circuit carrier 1102 . The second light-emitting module 12 includes a second circuit carrier 1202 , a plurality of second light-emitting elements 1201 , and a second encapsulant 1203 . The second circuit carrier 1202 includes an upper surface 1223 , a lower surface 1222 , and a side surface 1221 . The plurality of second light emitting units 1201 are located on the upper surface 1223 of the second circuit carrier 1202 . The second encapsulant 1203 includes a side surface 1231 covering the plurality of second light emitting units 1201 and the upper surface 1223 of the second circuit carrier 1202 .

The gap between the joint of the first encapsulant 1103 and the second encapsulant 1203 will cause the light at the joint to have uneven brightness compared with other positions. In order to reduce this uneven phenomenon, the encapsulants of adjacent light-emitting modules must be seamlessly spliced. In the present invention, the side surface 1131 of the first encapsulant 1103 is in contact with the side surface 1231 of the second encapsulant 1103 by adjusting the spacing between adjacent circuit carriers and the deformability of the encapsulant to reduce the adjacent The gaps between the light-emitting modules further reduce brightness unevenness, such as bright lines.

Referring to FIGS. 6A-6D , the side surface 1031 of the first encapsulant and the side surface 1031 of the second encapsulant may include a flat surface, an inclined surface, and/or a zigzag surface, and are fully/or partially in contact or fitted together. The outermost position 1133P of the upper surface 1133 of the first encapsulant 1103 is bonded to the outermost position 1233P of the upper surface 1233 of the second encapsulant 1203 . Therefore, in a top view, the joint of the first encapsulant 1103 and the second encapsulant 1203 is seamless or nearly seamless. In other words, in a top view, the junction of the first encapsulant 1103 and the second encapsulant 1203 is a continuous surface. In one embodiment, the junction of the first encapsulant 1103 and the second encapsulant 1203 is a plane. In one embodiment, the junction of the first encapsulant 1103 and the second encapsulant 1203 has a raised portion due to the extrusion of the encapsulants on both sides. In one embodiment, in a cross-sectional view, the first encapsulant side surface 1131 and the second encapsulant side surface 1231 are in partial contact, and have a maximum distance of the second distance D2 (as shown in FIGS. 6A-6B . ). The side surface 1121 of the first circuit carrier may be partially in contact with or completely not in contact with the side surface 1221 of the second circuit carrier. The first circuit carrier side surface 1121 and the second circuit carrier side surface 1221 are inclined to the first circuit carrier lower surface 1122 and the second circuit carrier lower surface 1222 respectively. The lower surface 1122 of the first circuit carrier 1102 is separated from the lower surface 1222 of the second circuit carrier 1202 with a first distance D1 between them, wherein the first distance D1 is greater than the second distance D2. In other words, the outermost position 1122P of the lower surface 1122 of the first circuit carrier 1102 is separated from the outermost position 1222P of the lower surface 1222 of the second circuit carrier 1202 . The pitch P1 between any two adjacent first light emitting units 1101 on the first circuit carrier 1102 or the pitch P2 between any two adjacent second light emitting units 1201 on the second circuit carrier 1202 is 0.15~ 0.25 mm. The pitch P between the first light-emitting unit 1101 closest to the side surface 1121 of the first circuit carrier and the second light-emitting unit 1201 closest to the side surface 1221 of the second circuit carrier is the same or similar to the pitch P1 and/or the pitch P2, To provide a uniform display picture, light pattern, and/or color distribution. In one embodiment, when the light emitting device 100 is used as a backlight source, the pitch P/P1/P2 may correspond to the pixel pitch of the liquid crystal or be larger than the pixel pitch of the liquid crystal. In another embodiment, when the light-emitting device 100 is used as a display pixel, a plurality of first light-emitting units 1101 and a plurality of second light-emitting units 1201 are combined to form a plurality of groups of pixels, and the pitch P1 and/or the pitch P2 are each The distance between each sub-pixel (light emitting unit) in a pixel. Pitch P is the distance between pixels, then P1 and/or P2 can be greater than, less than or equal to P.

Referring to FIG. 6A , in a cross-sectional view, the side surface 1131 of the first encapsulant and the side surface 1231 of the second encapsulant are partly in contact, and partly not in contact. The side surface 1121 of the first circuit carrier is not in contact with the side surface 1221 of the second circuit carrier at all.

Referring to FIG. 6B , in a cross-sectional view, the side surface 1131 of the first encapsulant and the side surface 1231 of the second encapsulant are partly in contact and partly not in contact. The first carrier side 1121 may be partially in contact with the second carrier side 1221 and partially not in contact.

Referring to FIG. 6C , in a cross-sectional view, the first encapsulant side surface 1131 and the second encapsulant side surface 1231 are in complete contact. A part of the side surface 1121 of the first circuit carrier is in contact with the side surface 1221 of the second circuit carrier, and a part is not in contact with the side surface 1221 of the second circuit carrier.

Referring to FIG. 6D , in a cross-sectional view, the first encapsulant side surface 1131 and the second encapsulant side surface 1231 are in complete contact. A part of the side surface 1121 of the first circuit carrier is in contact with the side surface 1221 of the second circuit carrier, and a part is not in contact with the side surface 1221 of the second circuit carrier.

The light-emitting module of the present invention can be applied to full-color image display devices or backlight sources. Such as LED display. It can also be used in LCD TVs of various sizes as a backlight source for LED TVs.

FIG. 7 is a schematic structural diagram of a backlight module 2 disclosed by an embodiment of the present invention. A backlight module 2 includes a first frame 500 ; a liquid crystal display 200 ; a brightness enhancement film 300 ; an optical module 400 ; a backlight source 800 ; and a second frame 700 . The backlight 800 may be the aforementioned light emitting device 100 in FIGS. 5-6 .

In an embodiment of the present invention, the backlight module 2 further includes a wavelength conversion layer 600 on the backlight 800 . The backlight 800 includes a light emitting unit capable of emitting blue light. The wavelength converting layer 600 includes phosphor, quantum dot (QD), or a combination thereof, and is located on the backlight 800 . In one embodiment, the wavelength conversion layer 600 can be excited by blue light to emit yellow light, yellow-green light, or yellow-red light.

FIG. 8 is a schematic structural diagram of a display 3 disclosed by an embodiment of the present invention. A display 3 includes an LED light-emitting board 10 ; a current source (not shown in the figure); and a bracket 20 to support the LED light-emitting board 10 , wherein the LED light-emitting board 10 includes the above-mentioned light-emitting device 100 .

The various embodiments listed in the present invention are only used to illustrate the present invention, and are not intended to limit the scope of the present invention. Any obvious modifications or changes made by anyone to the present invention will not depart from the spirit and scope of the present invention.

1: Light emitting module 1a, 1b, 1c, 1d: Light emitting module 2: Backlight module 3: Display 10: LED light emitting board 11: First light emitting module 12: Second light emitting module 20: Bracket 100: Light emitting device 101A, 101B: cutting part 102: initial circuit carrier 200: liquid crystal display 300: brightness enhancement film 400: optical module 500: first frame 600: wavelength conversion layer 700: second frame 800: backlight 1001: light emitting Unit 1002: Circuit carrier 1003: Encapsulation glue 1004: Dispenser 1010: Cutter 1021, 1031, 1121, 1131, 1221, 1231: Side surface 1022, 1122, 1222: Lower surface 1023, 1033, 1123, 1133, 1223, 1233: upper surface 1021P, 1022P, 1033P, 1122P, 1133P, 1222P, 1233P: outermost position 1050: cutting device 1101: first light-emitting unit 1102: first circuit carrier 1103: first encapsulant 1201: second light-emitting unit 1202: second circuit carrier 1203: second encapsulant 10211, 11211: upper part 10212, 11212: lower part 10213, 11213, 12213: connection part θ ₁ : first angle θ ₂ : second angle θ ₃ : third angle θ ₄ : fourth angle θ ₅ : fifth angle θ ₆ : sixth angle θ ₇ : seventh angle θ ₈ eighth angle D1: first pitch D2: second pitch P, P1, P2: pitch

FIG. 1A and FIG. 1B are the manufacturing method of the light-emitting module disclosed according to an embodiment of the present invention. FIG. 2 is a schematic diagram of steps of dividing a light-emitting module according to an embodiment of the present invention. Fig. 3 is a schematic diagram of a dividing device disclosed according to an embodiment of the present invention. FIG. 4A is a side view of a light emitting module disclosed according to an embodiment of the present invention. FIG. 4B is a side view of a light emitting module 4 disclosed according to another embodiment of the present invention. FIG. 4C is a side view of a light emitting module disclosed according to another embodiment of the present invention. FIG. 4D is a side view of a light emitting module disclosed according to another embodiment of the present invention. Fig. 5 is a schematic diagram of a light emitting device disclosed according to an embodiment of the present invention. 6A-6D are partial side views of the light emitting device 100 disclosed in different embodiments of the present invention at the joint. FIG. 7 is a schematic diagram of a backlight module 2 disclosed according to an embodiment of the present invention. FIG. 8 is a schematic diagram of a display 3 disclosed according to an embodiment of the present invention.

11: The first lighting module

12: The second lighting module

100: Lighting device

1101: the first light emitting unit

1201: the second light emitting unit

1102: The first circuit carrier board

1202: Second circuit carrier board

1103: The first packaging colloid

1203: The second packaging colloid

1121, 1131, 1221, 1231: side surface

1122, 1222: lower surface

1123, 1133, 1223, 1233: upper surface

1122P, 1133P, 1233P, 1222P: the outermost position

1201: the second light emitting unit

1202: Second circuit carrier board

θ1: first angle

θ2: second angle

D1: the first distance

D2: second spacing

P, P1, P2: Pitch

Claims (9)

A light-emitting device, including: a first light-emitting module, including: a first circuit carrier, including a first lower surface, the first lower surface has a first outermost position; a plurality of first light-emitting units are located on the the first circuit carrier; and a first encapsulant, including a first upper surface, located on the first circuit carrier, covering the plurality of first light-emitting units, the first upper surface has a second most An outer position; and a second light-emitting module, including: a second circuit carrier, including a second lower surface, the second lower surface has a third outermost position; a plurality of second light-emitting units are located on the second a circuit carrier; and a second encapsulant, including a second upper surface, located on the second circuit carrier and covering the plurality of second light-emitting units, the second upper surface has a fourth outermost position , wherein the second outermost position and the fourth outermost position are engaged with each other, the first outermost position and the third outermost position are separated from each other, wherein the first circuit carrier has a third side surface, The second circuit carrier has a fourth side surface not in contact with the third side surface. The light-emitting device according to claim 1 of the patent application, wherein the first encapsulant has a first side surface, and the second encapsulant has a second side surface contacting the first side surface. The light-emitting device as described in item 2 of the scope of the patent application, wherein there is a first distance between the first lower surface and the second lower surface, and there is a first distance between the first side surface and the second side surface. Two intervals, the first interval is greater than the second interval. The light-emitting device according to claim 1 of the patent claims, wherein the third side surface is inclined to the first lower surface. The light-emitting device according to claim 1 of the patent application, wherein the third side surface has a fifth outermost position, and the second outermost position protrudes outward from the fifth outermost position. The light-emitting device as described in claim 1 of the scope of the patent application, wherein the third side surface has a fifth outermost position, and the second outermost position and the fifth outermost position are substantially located relative to the first uppermost position. at the same normal position on the surface. The light-emitting device according to claim 1, wherein the third side surface has an upper part and a lower part, and the first encapsulant covers the upper part. The light-emitting device as described in claim 7 of the patent application, wherein there is an included angle between the upper part and the lower part, and the included angle is greater than 90 degrees. The light-emitting device according to claim 7 of the patent application, wherein the third side surface has a connecting portion connecting the upper portion and the lower portion.

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