TWI801017B - 液冷散熱裝置、具有該液冷散熱裝置的液冷散熱系統及電子裝置 - Google Patents

液冷散熱裝置、具有該液冷散熱裝置的液冷散熱系統及電子裝置 Download PDF

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Publication number
TWI801017B
TWI801017B TW110145486A TW110145486A TWI801017B TW I801017 B TWI801017 B TW I801017B TW 110145486 A TW110145486 A TW 110145486A TW 110145486 A TW110145486 A TW 110145486A TW I801017 B TWI801017 B TW I801017B
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TW
Taiwan
Prior art keywords
liquid cooling
cooling device
electronic device
cooling system
electronic
Prior art date
Application number
TW110145486A
Other languages
English (en)
Other versions
TW202323749A (zh
Inventor
簡瑋謙
葉記廷
Original Assignee
建準電機工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 建準電機工業股份有限公司 filed Critical 建準電機工業股份有限公司
Priority to TW110145486A priority Critical patent/TWI801017B/zh
Priority to CN202111538133.0A priority patent/CN116234228A/zh
Priority to CN202123160930.8U priority patent/CN216566086U/zh
Application granted granted Critical
Publication of TWI801017B publication Critical patent/TWI801017B/zh
Publication of TW202323749A publication Critical patent/TW202323749A/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW110145486A 2021-12-06 2021-12-06 液冷散熱裝置、具有該液冷散熱裝置的液冷散熱系統及電子裝置 TWI801017B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW110145486A TWI801017B (zh) 2021-12-06 2021-12-06 液冷散熱裝置、具有該液冷散熱裝置的液冷散熱系統及電子裝置
CN202111538133.0A CN116234228A (zh) 2021-12-06 2021-12-15 液冷散热装置、液冷散热系统及电子装置
CN202123160930.8U CN216566086U (zh) 2021-12-06 2021-12-15 液冷散热装置、液冷散热系统及电子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110145486A TWI801017B (zh) 2021-12-06 2021-12-06 液冷散熱裝置、具有該液冷散熱裝置的液冷散熱系統及電子裝置

Publications (2)

Publication Number Publication Date
TWI801017B true TWI801017B (zh) 2023-05-01
TW202323749A TW202323749A (zh) 2023-06-16

Family

ID=81542981

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110145486A TWI801017B (zh) 2021-12-06 2021-12-06 液冷散熱裝置、具有該液冷散熱裝置的液冷散熱系統及電子裝置

Country Status (2)

Country Link
CN (2) CN216566086U (zh)
TW (1) TWI801017B (zh)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5168919A (en) * 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
US20110192574A1 (en) * 2008-10-29 2011-08-11 Minoru Yoshikawa Cooling structure, electronic device using same, and cooling method
CN112050671A (zh) * 2019-06-07 2020-12-08 株式会社理光 蒸发器、环路型热管及电子设备
CN214592558U (zh) * 2021-02-17 2021-11-02 建准电机工业股份有限公司 整合式冷却模块及具有该整合式冷却模块的电子装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5168919A (en) * 1990-06-29 1992-12-08 Digital Equipment Corporation Air cooled heat exchanger for multi-chip assemblies
US20110192574A1 (en) * 2008-10-29 2011-08-11 Minoru Yoshikawa Cooling structure, electronic device using same, and cooling method
CN112050671A (zh) * 2019-06-07 2020-12-08 株式会社理光 蒸发器、环路型热管及电子设备
CN214592558U (zh) * 2021-02-17 2021-11-02 建准电机工业股份有限公司 整合式冷却模块及具有该整合式冷却模块的电子装置

Also Published As

Publication number Publication date
CN216566086U (zh) 2022-05-17
CN116234228A (zh) 2023-06-06
TW202323749A (zh) 2023-06-16

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