TWI800880B - 具有改良連線負載的電路模組 - Google Patents

具有改良連線負載的電路模組 Download PDF

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Publication number
TWI800880B
TWI800880B TW110128541A TW110128541A TWI800880B TW I800880 B TWI800880 B TW I800880B TW 110128541 A TW110128541 A TW 110128541A TW 110128541 A TW110128541 A TW 110128541A TW I800880 B TWI800880 B TW I800880B
Authority
TW
Taiwan
Prior art keywords
circuit module
line load
improved line
improved
load
Prior art date
Application number
TW110128541A
Other languages
English (en)
Other versions
TW202308315A (zh
Inventor
連南鈞
朱俐瑋
張廷瑋
Original Assignee
円星科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 円星科技股份有限公司 filed Critical 円星科技股份有限公司
Priority to TW110128541A priority Critical patent/TWI800880B/zh
Priority to CN202111294069.6A priority patent/CN115910139A/zh
Priority to US17/521,894 priority patent/US11742000B2/en
Publication of TW202308315A publication Critical patent/TW202308315A/zh
Application granted granted Critical
Publication of TWI800880B publication Critical patent/TWI800880B/zh
Priority to US18/221,111 priority patent/US20230352060A1/en

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/02Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/025Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/06Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • G11C5/063Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C5/00Details of stores covered by group G11C11/00
    • G11C5/02Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1051Data output circuits, e.g. read-out amplifiers, data output buffers, data output registers, data output level conversion circuits
    • G11C7/1057Data output buffers, e.g. comprising level conversion circuits, circuits for adapting load
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1051Data output circuits, e.g. read-out amplifiers, data output buffers, data output registers, data output level conversion circuits
    • G11C7/1069I/O lines read out arrangements
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1078Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits
    • G11C7/1084Data input buffers, e.g. comprising level conversion circuits, circuits for adapting load
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/10Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
    • G11C7/1078Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits
    • G11C7/1096Write circuits, e.g. I/O line write drivers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Logic Circuits (AREA)
TW110128541A 2021-08-03 2021-08-03 具有改良連線負載的電路模組 TWI800880B (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW110128541A TWI800880B (zh) 2021-08-03 2021-08-03 具有改良連線負載的電路模組
CN202111294069.6A CN115910139A (zh) 2021-08-03 2021-11-03 具有改良连线负载的电路模块
US17/521,894 US11742000B2 (en) 2021-08-03 2021-11-09 Circuit module with improved line load
US18/221,111 US20230352060A1 (en) 2021-08-03 2023-07-12 Circuit module with improved line load

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110128541A TWI800880B (zh) 2021-08-03 2021-08-03 具有改良連線負載的電路模組

Publications (2)

Publication Number Publication Date
TW202308315A TW202308315A (zh) 2023-02-16
TWI800880B true TWI800880B (zh) 2023-05-01

Family

ID=85153773

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110128541A TWI800880B (zh) 2021-08-03 2021-08-03 具有改良連線負載的電路模組

Country Status (3)

Country Link
US (2) US11742000B2 (zh)
CN (1) CN115910139A (zh)
TW (1) TWI800880B (zh)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6134163A (en) * 1997-05-29 2000-10-17 Nec Corporation Semiconductor memory device with independently operating memory banks
US20080253210A1 (en) * 2007-04-11 2008-10-16 Hynix Semiconductor Inc. Semiconductor memory apparatus
CN106373615A (zh) * 2015-07-20 2017-02-01 毛冬冬 一种读出速度可通过位线负载调节的otp存储器设计
US20190214066A1 (en) * 2018-01-05 2019-07-11 Winbond Electronics Corp. Memory device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3860403B2 (ja) * 2000-09-25 2006-12-20 株式会社東芝 半導体メモリ装置
JP5178182B2 (ja) * 2007-12-25 2013-04-10 株式会社東芝 半導体記憶装置
CN101866580B (zh) * 2010-06-21 2011-11-16 旭曜科技股份有限公司 转压器
US9337842B1 (en) * 2014-11-24 2016-05-10 Via Alliance Semiconductor Co., Ltd. Low voltage differential signaling (LVDS) driving circuit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6134163A (en) * 1997-05-29 2000-10-17 Nec Corporation Semiconductor memory device with independently operating memory banks
US20080253210A1 (en) * 2007-04-11 2008-10-16 Hynix Semiconductor Inc. Semiconductor memory apparatus
CN106373615A (zh) * 2015-07-20 2017-02-01 毛冬冬 一种读出速度可通过位线负载调节的otp存储器设计
US20190214066A1 (en) * 2018-01-05 2019-07-11 Winbond Electronics Corp. Memory device

Also Published As

Publication number Publication date
US20230040348A1 (en) 2023-02-09
US20230352060A1 (en) 2023-11-02
TW202308315A (zh) 2023-02-16
CN115910139A (zh) 2023-04-04
US11742000B2 (en) 2023-08-29

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