TWI800782B - Circuit board structure and manufacturing method thereof - Google Patents

Circuit board structure and manufacturing method thereof Download PDF

Info

Publication number
TWI800782B
TWI800782B TW110101060A TW110101060A TWI800782B TW I800782 B TWI800782 B TW I800782B TW 110101060 A TW110101060 A TW 110101060A TW 110101060 A TW110101060 A TW 110101060A TW I800782 B TWI800782 B TW I800782B
Authority
TW
Taiwan
Prior art keywords
manufacturing
circuit board
board structure
circuit
board
Prior art date
Application number
TW110101060A
Other languages
Chinese (zh)
Other versions
TW202209940A (en
Inventor
曾子章
李少謙
劉漢誠
鄭振華
譚瑞敏
Original Assignee
欣興電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 欣興電子股份有限公司 filed Critical 欣興電子股份有限公司
Priority to US17/191,559 priority Critical patent/US11540396B2/en
Priority to US17/319,109 priority patent/US20220069489A1/en
Priority to US17/342,550 priority patent/US11808787B2/en
Priority to US17/448,893 priority patent/US20220071010A1/en
Publication of TW202209940A publication Critical patent/TW202209940A/en
Application granted granted Critical
Publication of TWI800782B publication Critical patent/TWI800782B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
TW110101060A 2020-08-28 2021-01-12 Circuit board structure and manufacturing method thereof TWI800782B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
US17/191,559 US11540396B2 (en) 2020-08-28 2021-03-03 Circuit board structure and manufacturing method thereof
US17/319,109 US20220069489A1 (en) 2020-08-28 2021-05-13 Circuit board structure and manufacturing method thereof
US17/342,550 US11808787B2 (en) 2020-08-28 2021-06-09 Probe card testing device
US17/448,893 US20220071010A1 (en) 2020-08-28 2021-09-26 Circuit board structure and manufacturing method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202063071369P 2020-08-28 2020-08-28
US63/071,369 2020-08-28

Publications (2)

Publication Number Publication Date
TW202209940A TW202209940A (en) 2022-03-01
TWI800782B true TWI800782B (en) 2023-05-01

Family

ID=80359215

Family Applications (2)

Application Number Title Priority Date Filing Date
TW109142148A TWI741891B (en) 2020-08-28 2020-12-01 Circuit board structure and manufacturing method thereof
TW110101060A TWI800782B (en) 2020-08-28 2021-01-12 Circuit board structure and manufacturing method thereof

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW109142148A TWI741891B (en) 2020-08-28 2020-12-01 Circuit board structure and manufacturing method thereof

Country Status (2)

Country Link
CN (2) CN114126190A (en)
TW (2) TWI741891B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI810885B (en) * 2021-04-16 2023-08-01 旺矽科技股份有限公司 Circuit boards for semiconductor testing

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102076180A (en) * 2009-11-20 2011-05-25 南亚电路板股份有限公司 Circuit board structure and forming method thereof
US20120055706A1 (en) * 2010-09-03 2012-03-08 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same
US20160154924A1 (en) * 2014-12-02 2016-06-02 Socionext Inc. Semiconductor design method and computer-readable recording medium
TW202002742A (en) * 2018-06-08 2020-01-01 欣興電子股份有限公司 Circuit carrier board structure and manufacturing method thereof
TWI698972B (en) * 2019-12-16 2020-07-11 欣興電子股份有限公司 Circuit substrate
TWI701981B (en) * 2019-05-07 2020-08-11 欣興電子股份有限公司 Circuit carrier board and manufacturing method thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201101444A (en) * 2009-06-24 2011-01-01 Phoenix Prec Technology Corp Package substrate device and method for fabricating the same
JP2012191101A (en) * 2011-03-14 2012-10-04 Panasonic Corp Manufacturing method of circuit board
TWI430717B (en) * 2011-07-15 2014-03-11 Lite On Electronics Guangzhou Substrate strcuture, array of semiconductor devices and semiconductor device thereof
JP2014107433A (en) * 2012-11-28 2014-06-09 Ibiden Co Ltd Multiple piece forming substrate
DE112016006058T5 (en) * 2015-12-25 2018-09-06 Taiyo Yuden Co., Ltd. PCB and camera module
US10163834B2 (en) * 2016-09-09 2018-12-25 Powertech Technology Inc. Chip package structure comprising encapsulant having concave surface
CN109451655B (en) * 2018-11-16 2023-12-19 深圳市正基电子有限公司 Method for producing PCB control panel body size and warping and structure thereof
US10772205B1 (en) * 2019-02-26 2020-09-08 Taiwan Semiconductor Manufacturing Co., Ltd. Circuit board, semiconductor device including the same, and manufacturing method thereof
CN209787552U (en) * 2019-03-01 2019-12-13 奥特斯(中国)有限公司 Component carrier structure
CN111465198B (en) * 2020-05-26 2021-07-02 胜宏科技（惠州）股份有限公司 Manufacturing method for improving circuit board warping plate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102076180A (en) * 2009-11-20 2011-05-25 南亚电路板股份有限公司 Circuit board structure and forming method thereof
US20120055706A1 (en) * 2010-09-03 2012-03-08 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and method of manufacturing the same
US20160154924A1 (en) * 2014-12-02 2016-06-02 Socionext Inc. Semiconductor design method and computer-readable recording medium
TW202002742A (en) * 2018-06-08 2020-01-01 欣興電子股份有限公司 Circuit carrier board structure and manufacturing method thereof
TWI701981B (en) * 2019-05-07 2020-08-11 欣興電子股份有限公司 Circuit carrier board and manufacturing method thereof
TWI698972B (en) * 2019-12-16 2020-07-11 欣興電子股份有限公司 Circuit substrate

Also Published As

Publication number Publication date
TW202209938A (en) 2022-03-01
TWI741891B (en) 2021-10-01
CN114126190A (en) 2022-03-01
CN114126208A (en) 2022-03-01
TW202209940A (en) 2022-03-01

Similar Documents

Publication Publication Date Title
EP3934390A4 (en) Circuit board, circuit board manufacturing method and electronic device
TWI799796B (en) Integrated circuit and method for manufacturing integrated circuit
EP3767650A4 (en) Magnetic wiring circuit board and method for manufacturing same
EP3958656A4 (en) Embedded circuit board manufacturing method, embedded circuit board, and application
EP3968459A4 (en) Wiring board and method for manufacturing wiring board
EP3920670A4 (en) Flexible circuit board and manufacturing method therefor, and electronic apparatus module and electronic apparatus
EP3912437A4 (en) Integrated printed circuit boards and methods of fabrication
EP4096371A4 (en) Circuit board structure and electronic device
EP3697182A4 (en) Printed circuit board assembly and method for manufacturing same
EP3920672A4 (en) Flexible circuit board, manufacturing method, electronic device module, and electronic device
EP3806140A4 (en) Glass circuit board and method of manufacturing same
EP4037443A4 (en) Printed wiring board and manufacturing method for printed wiring board
TWI800782B (en) Circuit board structure and manufacturing method thereof
KR102286323B9 (en) Stretchable circuit board and stretchable circuit board fabricating method
EP4089724A4 (en) Circuit board
EP3944272A4 (en) Circuit board manufacturing method
EP3979308A4 (en) Printed wiring board and method for manufacturing printed wiring board
EP4135489A4 (en) Composite circuit board and manufacturing method therefor
EP3986093A4 (en) Multilayer circuit substrate and method for manufacturing the same
EP4185079A4 (en) Circuit board assembly, manufacturing method and electronic device
EP4145965A4 (en) Circuit board, electronic device, and production method for circuit board
EP3979774A4 (en) Multilayer circuit board and method for manufacturing same
EP4017225A4 (en) Embedded circuit board and preparation method therefor
EP3763174A4 (en) Printed circuit board and manufacturing method thereof
EP3996474A4 (en) Circuit board, method for manufacturing circuit board, and electronic device