TWI800648B - 控制電子束之方法及系統,以及非暫時性電腦可讀儲存媒體 - Google Patents
控制電子束之方法及系統,以及非暫時性電腦可讀儲存媒體 Download PDFInfo
- Publication number
- TWI800648B TWI800648B TW108117023A TW108117023A TWI800648B TW I800648 B TWI800648 B TW I800648B TW 108117023 A TW108117023 A TW 108117023A TW 108117023 A TW108117023 A TW 108117023A TW I800648 B TWI800648 B TW I800648B
- Authority
- TW
- Taiwan
- Prior art keywords
- storage medium
- readable storage
- transitory computer
- electron beams
- controlling electron
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/026—Means for avoiding or neutralising unwanted electrical charges on tube components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/153—Electron-optical or ion-optical arrangements for the correction of image defects, e.g. stigmators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/06—Electron sources; Electron guns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/10—Lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/10—Lenses
- H01J37/14—Lenses magnetic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/147—Arrangements for directing or deflecting the discharge along a desired path
- H01J37/1471—Arrangements for directing or deflecting the discharge along a desired path for centering, aligning or positioning of ray or beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/21—Means for adjusting the focus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/22—Optical or photographic arrangements associated with the tube
- H01J37/222—Image processing arrangements associated with the tube
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/22—Optical or photographic arrangements associated with the tube
- H01J37/224—Luminescent screens or photographic plates for imaging ; Apparatus specially adapted therefor, e.g. cameras, TV-cameras, photographic equipment, exposure control; Optical subsystems specially adapted therefor, e.g. microscopes for observing image on luminescent screen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/244—Detectors; Associated components or circuits therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/15—Means for deflecting or directing discharge
- H01J2237/1501—Beam alignment means or procedures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/153—Correcting image defects, e.g. stigmators
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/153—Correcting image defects, e.g. stigmators
- H01J2237/1532—Astigmatism
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/153—Correcting image defects, e.g. stigmators
- H01J2237/1534—Aberrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/21—Focus adjustment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/2443—Scintillation detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/2446—Position sensitive detectors
- H01J2237/24465—Sectored detectors, e.g. quadrants
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/282—Determination of microscope properties
- H01J2237/2826—Calibration
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862677551P | 2018-05-29 | 2018-05-29 | |
US62/677,551 | 2018-05-29 | ||
US16/112,832 US11087950B2 (en) | 2018-05-29 | 2018-08-27 | Charge control device for a system with multiple electron beams |
US16/112,832 | 2018-08-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202004175A TW202004175A (zh) | 2020-01-16 |
TWI800648B true TWI800648B (zh) | 2023-05-01 |
Family
ID=68694204
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108117023A TWI800648B (zh) | 2018-05-29 | 2019-05-17 | 控制電子束之方法及系統,以及非暫時性電腦可讀儲存媒體 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11087950B2 (zh) |
CN (1) | CN112074925B (zh) |
IL (1) | IL278808A (zh) |
TW (1) | TWI800648B (zh) |
WO (1) | WO2019231866A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CA3168745A1 (en) * | 2020-02-20 | 2021-08-26 | Arjen Benjamin Storm | Tool for testing an electron-optical assembly |
CN111584332A (zh) * | 2020-06-17 | 2020-08-25 | 西安中科英威特光电技术有限公司 | 一种电子轰击成像型光电器件及高速相机 |
US11640896B2 (en) * | 2021-05-13 | 2023-05-02 | Nuflare Technology, Inc. | Method and apparatus for Schottky TFE inspection |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040159787A1 (en) * | 2002-08-30 | 2004-08-19 | Mamoru Nakasuji | Electron beam system |
US20150083911A1 (en) * | 2013-09-26 | 2015-03-26 | Carl Zeiss Microscopy Gmbh | Method of Detecting Electrons, an Electron-Detector and an Inspection System |
TW201614706A (en) * | 2014-09-04 | 2016-04-16 | Univ Delft Tech | Multi electron beam inspection apparatus |
US20180040452A1 (en) * | 2015-02-05 | 2018-02-08 | Ebara Corporation | Inspection device |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09139184A (ja) * | 1995-11-15 | 1997-05-27 | Nikon Corp | 静電偏向器の製造方法 |
EP1150327B1 (en) * | 2000-04-27 | 2018-02-14 | ICT, Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Multi beam charged particle device |
US6552340B1 (en) * | 2000-10-12 | 2003-04-22 | Nion Co. | Autoadjusting charged-particle probe-forming apparatus |
JP4390096B2 (ja) * | 2001-07-06 | 2009-12-24 | 富士フイルム株式会社 | 内視鏡装置 |
JP2004363085A (ja) | 2003-05-09 | 2004-12-24 | Ebara Corp | 荷電粒子線による検査装置及びその検査装置を用いたデバイス製造方法 |
US7146084B2 (en) * | 2003-06-16 | 2006-12-05 | Cmc Electronics, Inc. | Fiber optic light source for display devices |
EP2575143B8 (en) * | 2003-09-05 | 2019-05-22 | Carl Zeiss Microscopy GmbH | Particle-optical systems and arrangements and particle-optical components for such systems and arrangements |
TWI458967B (zh) * | 2005-02-17 | 2014-11-01 | Ebara Corp | 電子射線裝置 |
US7504622B2 (en) * | 2006-04-03 | 2009-03-17 | Applied Materials, Israel, Ltd. | High throughput multi beam detection system and method |
JP2007335125A (ja) | 2006-06-13 | 2007-12-27 | Ebara Corp | 電子線装置 |
US8536538B2 (en) * | 2011-02-16 | 2013-09-17 | Kla-Tencor Corporation | Multiple-pole electrostatic deflector for improving throughput of focused electron beam instruments |
US9691588B2 (en) * | 2015-03-10 | 2017-06-27 | Hermes Microvision, Inc. | Apparatus of plural charged-particle beams |
CN107533943B (zh) * | 2015-05-08 | 2019-12-10 | 科磊股份有限公司 | 用于电子束系统中像差校正的方法及系统 |
WO2017053812A1 (en) * | 2015-09-23 | 2017-03-30 | Kla-Tencor Corporation | Method and system for focus adjustment a multi-beam scanning electron microscopy system |
US9620329B1 (en) * | 2015-11-20 | 2017-04-11 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Electrostatic multipole device, electrostatic multipole arrangement, charged particle beam device, and method of manufacturing an electrostatic multipole device |
US9754759B2 (en) * | 2015-11-20 | 2017-09-05 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Electrostatic multipole device, electrostatic multipole arrangement, and method of manufacturing an electrostatic multipole device |
-
2018
- 2018-08-27 US US16/112,832 patent/US11087950B2/en active Active
-
2019
- 2019-05-17 TW TW108117023A patent/TWI800648B/zh active
- 2019-05-26 CN CN201980029660.3A patent/CN112074925B/zh active Active
- 2019-05-26 WO PCT/US2019/034082 patent/WO2019231866A1/en active Application Filing
-
2020
- 2020-11-18 IL IL278808A patent/IL278808A/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040159787A1 (en) * | 2002-08-30 | 2004-08-19 | Mamoru Nakasuji | Electron beam system |
US20150083911A1 (en) * | 2013-09-26 | 2015-03-26 | Carl Zeiss Microscopy Gmbh | Method of Detecting Electrons, an Electron-Detector and an Inspection System |
TW201614706A (en) * | 2014-09-04 | 2016-04-16 | Univ Delft Tech | Multi electron beam inspection apparatus |
US20180040452A1 (en) * | 2015-02-05 | 2018-02-08 | Ebara Corporation | Inspection device |
Also Published As
Publication number | Publication date |
---|---|
US11087950B2 (en) | 2021-08-10 |
IL278808A (en) | 2021-01-31 |
CN112074925A (zh) | 2020-12-11 |
US20190371566A1 (en) | 2019-12-05 |
TW202004175A (zh) | 2020-01-16 |
CN112074925B (zh) | 2022-06-07 |
KR20210002360A (ko) | 2021-01-07 |
WO2019231866A1 (en) | 2019-12-05 |
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