TWI800299B - 超音波檢查裝置、超音波檢查方法及程式 - Google Patents

超音波檢查裝置、超音波檢查方法及程式 Download PDF

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Publication number
TWI800299B
TWI800299B TW111108927A TW111108927A TWI800299B TW I800299 B TWI800299 B TW I800299B TW 111108927 A TW111108927 A TW 111108927A TW 111108927 A TW111108927 A TW 111108927A TW I800299 B TWI800299 B TW I800299B
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TW
Taiwan
Prior art keywords
ultrasonic inspection
program
inspection device
inspection method
ultrasonic
Prior art date
Application number
TW111108927A
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English (en)
Other versions
TW202235871A (zh
Inventor
酒井薫
小林昌幸
菅谷夏樹
菊川耕太郎
Original Assignee
日商日立電力解決方案股份有限公司
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Publication of TW202235871A publication Critical patent/TW202235871A/zh
Application granted granted Critical
Publication of TWI800299B publication Critical patent/TWI800299B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0654—Imaging
    • G01N29/069—Defect imaging, localisation and sizing using, e.g. time of flight diffraction [TOFD], synthetic aperture focusing technique [SAFT], Amplituden-Laufzeit-Ortskurven [ALOK] technique
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/043—Analysing solids in the interior, e.g. by shear waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/06—Visualisation of the interior, e.g. acoustic microscopy
    • G01N29/0609—Display arrangements, e.g. colour displays
    • G01N29/0645—Display representation or displayed parameters, e.g. A-, B- or C-Scan
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/36—Detecting the response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/38—Detecting the response signal, e.g. electronic circuits specially adapted therefor by time filtering, e.g. using time gates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4409—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison
    • G01N29/4436—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison with a reference signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids
    • G01N2291/0231—Composite or layered materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/0289—Internal structure, e.g. defects, grain size, texture
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/04—Wave modes and trajectories
    • G01N2291/044—Internal reflections (echoes), e.g. on walls or defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/269—Various geometry objects
    • G01N2291/2697—Wafer or (micro)electronic parts

Landscapes

  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
TW111108927A 2021-02-09 2022-03-11 超音波檢查裝置、超音波檢查方法及程式 TWI800299B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021018817A JP2022121859A (ja) 2021-02-09 2021-02-09 超音波検査装置、超音波検査方法及びプログラム
JP2021-018817 2021-02-09

Publications (2)

Publication Number Publication Date
TW202235871A TW202235871A (zh) 2022-09-16
TWI800299B true TWI800299B (zh) 2023-04-21

Family

ID=82838392

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111108927A TWI800299B (zh) 2021-02-09 2022-03-11 超音波檢查裝置、超音波檢查方法及程式

Country Status (6)

Country Link
US (1) US20240036010A1 (zh)
JP (1) JP2022121859A (zh)
KR (1) KR20230130054A (zh)
DE (1) DE112022000587T5 (zh)
TW (1) TWI800299B (zh)
WO (1) WO2022173062A1 (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201713946A (zh) * 2015-10-08 2017-04-16 Hitachi Power Solutions Co Ltd 缺陷檢查方法及其裝置
CN108603862A (zh) * 2017-01-24 2018-09-28 住友化学株式会社 模拟缺陷样品及其制造方法、超声波探伤测定条件的调整方法、靶原材料的检查方法、以及溅射靶的制造方法
TW201944069A (zh) * 2018-04-12 2019-11-16 日商日立電力解決方案股份有限公司 超音波檢查裝置及超音波檢查方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5629865A (en) * 1995-10-23 1997-05-13 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Pulse-echo ultrasonic imaging method for eliminating sample thickness variation effects
JP2003121426A (ja) * 2001-10-15 2003-04-23 Nippon Steel Corp 超音波探傷装置及び超音波探傷方法
JP5221314B2 (ja) * 2007-12-26 2013-06-26 パナソニック株式会社 超音波測定方法、及び、電子部品製造方法
JP5507751B1 (ja) 2013-10-25 2014-05-28 株式会社日立パワーソリューションズ 超音波検査装置
JP6608292B2 (ja) * 2016-01-20 2019-11-20 株式会社日立パワーソリューションズ 超音波検査方法及び装置
JP6602449B1 (ja) * 2018-12-05 2019-11-06 株式会社日立パワーソリューションズ 超音波検査方法、超音波検査装置及び超音波検査プログラム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201713946A (zh) * 2015-10-08 2017-04-16 Hitachi Power Solutions Co Ltd 缺陷檢查方法及其裝置
CN108603862A (zh) * 2017-01-24 2018-09-28 住友化学株式会社 模拟缺陷样品及其制造方法、超声波探伤测定条件的调整方法、靶原材料的检查方法、以及溅射靶的制造方法
TW201944069A (zh) * 2018-04-12 2019-11-16 日商日立電力解決方案股份有限公司 超音波檢查裝置及超音波檢查方法

Also Published As

Publication number Publication date
JP2022121859A (ja) 2022-08-22
DE112022000587T5 (de) 2023-10-26
TW202235871A (zh) 2022-09-16
US20240036010A1 (en) 2024-02-01
WO2022173062A1 (ja) 2022-08-18
KR20230130054A (ko) 2023-09-11

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