TWI799976B - Processing liquid supply device, substrate processing device, and processing liquid supply method - Google Patents

Processing liquid supply device, substrate processing device, and processing liquid supply method Download PDF

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Publication number
TWI799976B
TWI799976B TW110132371A TW110132371A TWI799976B TW I799976 B TWI799976 B TW I799976B TW 110132371 A TW110132371 A TW 110132371A TW 110132371 A TW110132371 A TW 110132371A TW I799976 B TWI799976 B TW I799976B
Authority
TW
Taiwan
Prior art keywords
liquid supply
processing liquid
processing
supply method
substrate
Prior art date
Application number
TW110132371A
Other languages
Chinese (zh)
Other versions
TW202228201A (en
Inventor
有馬直子
鰍場真樹
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW202228201A publication Critical patent/TW202228201A/en
Application granted granted Critical
Publication of TWI799976B publication Critical patent/TWI799976B/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
TW110132371A 2020-09-16 2021-09-01 Processing liquid supply device, substrate processing device, and processing liquid supply method TWI799976B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020155583A JP7540923B2 (en) 2020-09-16 2020-09-16 Processing liquid supplying apparatus, substrate processing apparatus, and processing liquid supplying method
JP2020-155583 2020-09-16

Publications (2)

Publication Number Publication Date
TW202228201A TW202228201A (en) 2022-07-16
TWI799976B true TWI799976B (en) 2023-04-21

Family

ID=80777307

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110132371A TWI799976B (en) 2020-09-16 2021-09-01 Processing liquid supply device, substrate processing device, and processing liquid supply method

Country Status (3)

Country Link
JP (1) JP7540923B2 (en)
TW (1) TWI799976B (en)
WO (1) WO2022059414A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115338181A (en) * 2022-07-26 2022-11-15 泸州龙芯微科技有限公司 Surface cleaning device behind chip scribing

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW420829B (en) * 1997-05-22 2001-02-01 Tokyo Electron Ltd Treatment device and method, impurity removing apparatus
US20050074704A1 (en) * 2003-10-06 2005-04-07 Matsushita Electric Industrial Co., Ltd. Semiconductor fabrication apparatus and pattern formation method using the same
TW200822209A (en) * 2006-09-05 2008-05-16 Dainippon Screen Mfg Substrate processing apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003059884A (en) 2001-08-20 2003-02-28 Tokyo Electron Ltd Substrate treatment apparatus and substrate treatment method
JP2007039845A (en) 2005-08-04 2007-02-15 Teijin Fibers Ltd Polyester fiber structure and method for producing the same
JP4668079B2 (en) 2006-01-30 2011-04-13 大日本スクリーン製造株式会社 Substrate processing equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW420829B (en) * 1997-05-22 2001-02-01 Tokyo Electron Ltd Treatment device and method, impurity removing apparatus
US20050074704A1 (en) * 2003-10-06 2005-04-07 Matsushita Electric Industrial Co., Ltd. Semiconductor fabrication apparatus and pattern formation method using the same
TW200822209A (en) * 2006-09-05 2008-05-16 Dainippon Screen Mfg Substrate processing apparatus

Also Published As

Publication number Publication date
JP7540923B2 (en) 2024-08-27
TW202228201A (en) 2022-07-16
WO2022059414A1 (en) 2022-03-24
JP2022049394A (en) 2022-03-29

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