TWI799904B - 電子裝置之製造方法 - Google Patents

電子裝置之製造方法 Download PDF

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Publication number
TWI799904B
TWI799904B TW110123592A TW110123592A TWI799904B TW I799904 B TWI799904 B TW I799904B TW 110123592 A TW110123592 A TW 110123592A TW 110123592 A TW110123592 A TW 110123592A TW I799904 B TWI799904 B TW I799904B
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TW
Taiwan
Prior art keywords
manufacturing
electronic device
electronic
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TW110123592A
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English (en)
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TW202301739A (zh
Inventor
倪慶羽
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大陸商青島新核芯科技有限公司
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Priority to TW110123592A priority Critical patent/TWI799904B/zh
Publication of TW202301739A publication Critical patent/TW202301739A/zh
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TW110123592A 2021-06-28 2021-06-28 電子裝置之製造方法 TWI799904B (zh)

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TW110123592A TWI799904B (zh) 2021-06-28 2021-06-28 電子裝置之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW110123592A TWI799904B (zh) 2021-06-28 2021-06-28 電子裝置之製造方法

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TW202301739A TW202301739A (zh) 2023-01-01
TWI799904B true TWI799904B (zh) 2023-04-21

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140071021A1 (en) * 2012-09-12 2014-03-13 International Business Machines Corporation Hybrid on-chip and package antenna
TW201721774A (zh) * 2015-12-04 2017-06-16 乾坤科技股份有限公司 具有天線的半導體封裝及其製作方法
TW201725674A (zh) * 2016-01-11 2017-07-16 矽品精密工業股份有限公司 電子封裝件
WO2021056859A1 (zh) * 2019-09-29 2021-04-01 上海先方半导体有限公司 一种集成天线结构的2.5d多芯片封装结构及制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140071021A1 (en) * 2012-09-12 2014-03-13 International Business Machines Corporation Hybrid on-chip and package antenna
TW201721774A (zh) * 2015-12-04 2017-06-16 乾坤科技股份有限公司 具有天線的半導體封裝及其製作方法
TW201725674A (zh) * 2016-01-11 2017-07-16 矽品精密工業股份有限公司 電子封裝件
WO2021056859A1 (zh) * 2019-09-29 2021-04-01 上海先方半导体有限公司 一种集成天线结构的2.5d多芯片封装结构及制造方法

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