TWI799709B - 快速分類在製造組件之子組件中的缺陷的方法及設備 - Google Patents
快速分類在製造組件之子組件中的缺陷的方法及設備 Download PDFInfo
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- TWI799709B TWI799709B TW109118091A TW109118091A TWI799709B TW I799709 B TWI799709 B TW I799709B TW 109118091 A TW109118091 A TW 109118091A TW 109118091 A TW109118091 A TW 109118091A TW I799709 B TWI799709 B TW I799709B
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- subcomponents
- manufactured component
- classifying defects
- rapidly classifying
- rapidly
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
- G06V10/764—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
- G06V10/77—Processing image or video features in feature spaces; using data integration or data reduction, e.g. principal component analysis [PCA] or independent component analysis [ICA] or self-organising maps [SOM]; Blind source separation
- G06V10/774—Generating sets of training patterns; Bootstrap methods, e.g. bagging or boosting
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
- G06F18/24—Classification techniques
- G06F18/241—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
- G06F18/24—Classification techniques
- G06F18/241—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches
- G06F18/2411—Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches based on the proximity to a decision surface, e.g. support vector machines
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20081—Training; Learning
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20084—Artificial neural networks [ANN]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V2201/00—Indexing scheme relating to image or video recognition or understanding
- G06V2201/06—Recognition of objects for industrial automation
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Artificial Intelligence (AREA)
- Evolutionary Computation (AREA)
- Databases & Information Systems (AREA)
- Software Systems (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Computing Systems (AREA)
- Multimedia (AREA)
- Medical Informatics (AREA)
- Data Mining & Analysis (AREA)
- Quality & Reliability (AREA)
- Life Sciences & Earth Sciences (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Bioinformatics & Computational Biology (AREA)
- Evolutionary Biology (AREA)
- General Engineering & Computer Science (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201962854775P | 2019-05-30 | 2019-05-30 | |
US62/854,775 | 2019-05-30 | ||
US16/830,108 US11475556B2 (en) | 2019-05-30 | 2020-03-25 | Method and apparatus for rapidly classifying defects in subcomponents of manufactured component |
US16/830,108 | 2020-03-25 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202107071A TW202107071A (zh) | 2021-02-16 |
TWI799709B true TWI799709B (zh) | 2023-04-21 |
Family
ID=73550425
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109118091A TWI799709B (zh) | 2019-05-30 | 2020-05-29 | 快速分類在製造組件之子組件中的缺陷的方法及設備 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11475556B2 (zh) |
KR (1) | KR20220015415A (zh) |
CN (1) | CN114207624A (zh) |
TW (1) | TWI799709B (zh) |
WO (1) | WO2020242763A1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11521309B2 (en) * | 2019-05-30 | 2022-12-06 | Bruker Nano, Inc. | Method and apparatus for rapid inspection of subcomponents of manufactured component |
CN113344929B (zh) * | 2021-08-09 | 2021-11-05 | 深圳智检慧通科技有限公司 | 一种焊点视觉检测识别方法、可读存储介质及设备 |
US11769270B2 (en) * | 2022-01-18 | 2023-09-26 | Smart Radar System, Inc. | Method and apparatus for measuring eccentricity of blind via hole formed in printed circuit board |
EP4254325A1 (en) * | 2022-03-30 | 2023-10-04 | Siemens Aktiengesellschaft | Inspection of printed circuit board assemblies |
CN117078620B (zh) * | 2023-08-14 | 2024-02-23 | 正泰集团研发中心(上海)有限公司 | Pcb焊点缺陷检测方法、装置、电子设备和存储介质 |
Citations (4)
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CN101785009A (zh) * | 2007-08-20 | 2010-07-21 | 恪纳腾公司 | 确定实际缺陷是潜在系统性缺陷还是潜在随机缺陷的计算机实现的方法 |
US20140270491A1 (en) * | 2013-03-14 | 2014-09-18 | Navteq B.V. | Acceleration of Linear Classifiers |
TW201838052A (zh) * | 2017-03-30 | 2018-10-16 | 義守大學 | 適用於三維晶片的缺陷測試方法及系統 |
TW201901113A (zh) * | 2017-05-11 | 2019-01-01 | 美商克萊譚克公司 | 用於對準以不同模態所獲取之影像之以學習為基礎之方法 |
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US6923067B2 (en) | 1999-03-19 | 2005-08-02 | Betriebsforschungsinstitut Vdeh Institut Fur Angewandte Forschung Gmbh | Defect type classifying method |
US6456899B1 (en) | 1999-12-07 | 2002-09-24 | Ut-Battelle, Llc | Context-based automated defect classification system using multiple morphological masks |
JP3978098B2 (ja) | 2002-08-12 | 2007-09-19 | 株式会社日立製作所 | 欠陥分類方法及びその装置 |
US7602962B2 (en) | 2003-02-25 | 2009-10-13 | Hitachi High-Technologies Corporation | Method of classifying defects using multiple inspection machines |
US7346470B2 (en) * | 2003-06-10 | 2008-03-18 | International Business Machines Corporation | System for identification of defects on circuits or other arrayed products |
US6980873B2 (en) | 2004-04-23 | 2005-12-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment |
JP4317805B2 (ja) | 2004-09-29 | 2009-08-19 | 株式会社日立ハイテクノロジーズ | 欠陥自動分類方法及び装置 |
KR100687090B1 (ko) | 2005-05-31 | 2007-02-26 | 삼성전자주식회사 | 결함 분류 방법 |
JP4776308B2 (ja) | 2005-09-05 | 2011-09-21 | 株式会社東京精密 | 画像欠陥検査装置、画像欠陥検査システム、欠陥分類装置及び画像欠陥検査方法 |
JP2007141943A (ja) * | 2005-11-15 | 2007-06-07 | Matsushita Electric Ind Co Ltd | クリティカルエリア算出方法及び歩留まり算出方法 |
JP5479782B2 (ja) | 2009-06-02 | 2014-04-23 | 株式会社日立ハイテクノロジーズ | 欠陥画像処理装置、欠陥画像処理方法、半導体欠陥分類装置および半導体欠陥分類方法 |
KR101448967B1 (ko) | 2009-06-19 | 2014-10-13 | 케이엘에이-텐코어 코오포레이션 | 상이한 피치들을 갖는 다수의 어레이 구역들을 동시에 검사하기 위한 방법 및 장치 |
US8595666B2 (en) | 2009-07-09 | 2013-11-26 | Hitachi High-Technologies Corporation | Semiconductor defect classifying method, semiconductor defect classifying apparatus, and semiconductor defect classifying program |
US8692246B2 (en) | 2011-09-15 | 2014-04-08 | International Business Machines Corporation | Leakage measurement structure having through silicon vias |
US9129715B2 (en) | 2012-09-05 | 2015-09-08 | SVXR, Inc. | High speed x-ray inspection microscope |
US9430743B2 (en) | 2014-03-06 | 2016-08-30 | Kla-Tencor Corp. | Composite defect classifier |
US9613411B2 (en) | 2014-03-17 | 2017-04-04 | Kla-Tencor Corp. | Creating defect classifiers and nuisance filters |
US20170069075A1 (en) | 2015-09-04 | 2017-03-09 | Canon Kabushiki Kaisha | Classifier generation apparatus, defective/non-defective determination method, and program |
US10713534B2 (en) | 2017-09-01 | 2020-07-14 | Kla-Tencor Corp. | Training a learning based defect classifier |
US20190236415A1 (en) * | 2018-01-30 | 2019-08-01 | Beamr Imaging Ltd. | Method of classification of an object and system thereof |
KR20200123858A (ko) * | 2018-03-21 | 2020-10-30 | 케이엘에이 코포레이션 | 합성 이미지를 사용한 머신 러닝 모델 트레이닝 |
US10692184B2 (en) * | 2018-07-05 | 2020-06-23 | SVXR, Inc. | Super-resolution X-ray imaging method and apparatus |
-
2020
- 2020-03-25 US US16/830,108 patent/US11475556B2/en active Active
- 2020-05-13 WO PCT/US2020/032698 patent/WO2020242763A1/en active Application Filing
- 2020-05-13 CN CN202080052326.2A patent/CN114207624A/zh active Pending
- 2020-05-13 KR KR1020217041573A patent/KR20220015415A/ko unknown
- 2020-05-29 TW TW109118091A patent/TWI799709B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101785009A (zh) * | 2007-08-20 | 2010-07-21 | 恪纳腾公司 | 确定实际缺陷是潜在系统性缺陷还是潜在随机缺陷的计算机实现的方法 |
US20140270491A1 (en) * | 2013-03-14 | 2014-09-18 | Navteq B.V. | Acceleration of Linear Classifiers |
TW201838052A (zh) * | 2017-03-30 | 2018-10-16 | 義守大學 | 適用於三維晶片的缺陷測試方法及系統 |
TW201901113A (zh) * | 2017-05-11 | 2019-01-01 | 美商克萊譚克公司 | 用於對準以不同模態所獲取之影像之以學習為基礎之方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20220015415A (ko) | 2022-02-08 |
WO2020242763A1 (en) | 2020-12-03 |
TW202107071A (zh) | 2021-02-16 |
US20200380654A1 (en) | 2020-12-03 |
US11475556B2 (en) | 2022-10-18 |
CN114207624A (zh) | 2022-03-18 |
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