TWI799709B - 快速分類在製造組件之子組件中的缺陷的方法及設備 - Google Patents

快速分類在製造組件之子組件中的缺陷的方法及設備 Download PDF

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TWI799709B
TWI799709B TW109118091A TW109118091A TWI799709B TW I799709 B TWI799709 B TW I799709B TW 109118091 A TW109118091 A TW 109118091A TW 109118091 A TW109118091 A TW 109118091A TW I799709 B TWI799709 B TW I799709B
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subcomponents
manufactured component
classifying defects
rapidly classifying
rapidly
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TW109118091A
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TW202107071A (zh
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愛德華 R 雷特尼爾
安德魯 喬治 雷德
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美商布魯克奈米公司
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/70Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/764Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/70Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/77Processing image or video features in feature spaces; using data integration or data reduction, e.g. principal component analysis [PCA] or independent component analysis [ICA] or self-organising maps [SOM]; Blind source separation
    • G06V10/774Generating sets of training patterns; Bootstrap methods, e.g. bagging or boosting
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00Pattern recognition
    • G06F18/20Analysing
    • G06F18/24Classification techniques
    • G06F18/241Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00Pattern recognition
    • G06F18/20Analysing
    • G06F18/24Classification techniques
    • G06F18/241Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches
    • G06F18/2411Classification techniques relating to the classification model, e.g. parametric or non-parametric approaches based on the proximity to a decision surface, e.g. support vector machines
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/001Industrial image inspection using an image reference approach
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/20Special algorithmic details
    • G06T2207/20081Training; Learning
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/20Special algorithmic details
    • G06T2207/20084Artificial neural networks [ANN]
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30148Semiconductor; IC; Wafer
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V2201/00Indexing scheme relating to image or video recognition or understanding
    • G06V2201/06Recognition of objects for industrial automation

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Artificial Intelligence (AREA)
  • Evolutionary Computation (AREA)
  • Databases & Information Systems (AREA)
  • Software Systems (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Computing Systems (AREA)
  • Multimedia (AREA)
  • Medical Informatics (AREA)
  • Data Mining & Analysis (AREA)
  • Quality & Reliability (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Bioinformatics & Computational Biology (AREA)
  • Evolutionary Biology (AREA)
  • General Engineering & Computer Science (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
TW109118091A 2019-05-30 2020-05-29 快速分類在製造組件之子組件中的缺陷的方法及設備 TWI799709B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201962854775P 2019-05-30 2019-05-30
US62/854,775 2019-05-30
US16/830,108 US11475556B2 (en) 2019-05-30 2020-03-25 Method and apparatus for rapidly classifying defects in subcomponents of manufactured component
US16/830,108 2020-03-25

Publications (2)

Publication Number Publication Date
TW202107071A TW202107071A (zh) 2021-02-16
TWI799709B true TWI799709B (zh) 2023-04-21

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Country Link
US (1) US11475556B2 (zh)
KR (1) KR20220015415A (zh)
CN (1) CN114207624A (zh)
TW (1) TWI799709B (zh)
WO (1) WO2020242763A1 (zh)

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US11521309B2 (en) * 2019-05-30 2022-12-06 Bruker Nano, Inc. Method and apparatus for rapid inspection of subcomponents of manufactured component
CN113344929B (zh) * 2021-08-09 2021-11-05 深圳智检慧通科技有限公司 一种焊点视觉检测识别方法、可读存储介质及设备
US11769270B2 (en) * 2022-01-18 2023-09-26 Smart Radar System, Inc. Method and apparatus for measuring eccentricity of blind via hole formed in printed circuit board
EP4254325A1 (en) * 2022-03-30 2023-10-04 Siemens Aktiengesellschaft Inspection of printed circuit board assemblies
CN117078620B (zh) * 2023-08-14 2024-02-23 正泰集团研发中心(上海)有限公司 Pcb焊点缺陷检测方法、装置、电子设备和存储介质

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US7602962B2 (en) 2003-02-25 2009-10-13 Hitachi High-Technologies Corporation Method of classifying defects using multiple inspection machines
US7346470B2 (en) * 2003-06-10 2008-03-18 International Business Machines Corporation System for identification of defects on circuits or other arrayed products
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US20140270491A1 (en) * 2013-03-14 2014-09-18 Navteq B.V. Acceleration of Linear Classifiers
TW201838052A (zh) * 2017-03-30 2018-10-16 義守大學 適用於三維晶片的缺陷測試方法及系統
TW201901113A (zh) * 2017-05-11 2019-01-01 美商克萊譚克公司 用於對準以不同模態所獲取之影像之以學習為基礎之方法

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KR20220015415A (ko) 2022-02-08
WO2020242763A1 (en) 2020-12-03
TW202107071A (zh) 2021-02-16
US20200380654A1 (en) 2020-12-03
US11475556B2 (en) 2022-10-18
CN114207624A (zh) 2022-03-18

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