TWI799498B - Method for forming multilayer wiring, device for forming multilayer wiring, and storage medium - Google Patents
Method for forming multilayer wiring, device for forming multilayer wiring, and storage medium Download PDFInfo
- Publication number
- TWI799498B TWI799498B TW108102198A TW108102198A TWI799498B TW I799498 B TWI799498 B TW I799498B TW 108102198 A TW108102198 A TW 108102198A TW 108102198 A TW108102198 A TW 108102198A TW I799498 B TWI799498 B TW I799498B
- Authority
- TW
- Taiwan
- Prior art keywords
- multilayer wiring
- forming multilayer
- storage medium
- forming
- wiring
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018018473 | 2018-02-05 | ||
JP2018-018473 | 2018-02-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201935586A TW201935586A (en) | 2019-09-01 |
TWI799498B true TWI799498B (en) | 2023-04-21 |
Family
ID=67479249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108102198A TWI799498B (en) | 2018-02-05 | 2019-01-21 | Method for forming multilayer wiring, device for forming multilayer wiring, and storage medium |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6910480B2 (en) |
TW (1) | TWI799498B (en) |
WO (1) | WO2019151023A1 (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07122644A (en) * | 1993-10-26 | 1995-05-12 | Nec Corp | Semiconductor device and fabrication thereof |
JP2000150647A (en) * | 1998-11-11 | 2000-05-30 | Sony Corp | Wiring structure and its manufacture |
JP2002285343A (en) * | 2000-12-11 | 2002-10-03 | Ebara Corp | Electroless plating apparatus |
JP2006303062A (en) * | 2005-04-19 | 2006-11-02 | Sony Corp | Manufacturing method of semiconductor device |
JP2016156039A (en) * | 2015-02-23 | 2016-09-01 | 東京エレクトロン株式会社 | Semiconductor device, plating treatment method, plating treatment system and storage medium |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4945865B2 (en) * | 2001-08-27 | 2012-06-06 | ソニー株式会社 | Multilayer wiring structure or electrode extraction structure, electric circuit device, and manufacturing method thereof |
US7005379B2 (en) * | 2004-04-08 | 2006-02-28 | Micron Technology, Inc. | Semiconductor processing methods for forming electrical contacts |
JP6404174B2 (en) * | 2015-04-16 | 2018-10-10 | 東京エレクトロン株式会社 | Plating processing method, storage medium, and plating processing system |
-
2019
- 2019-01-21 TW TW108102198A patent/TWI799498B/en active
- 2019-01-21 JP JP2019569021A patent/JP6910480B2/en active Active
- 2019-01-21 WO PCT/JP2019/001710 patent/WO2019151023A1/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07122644A (en) * | 1993-10-26 | 1995-05-12 | Nec Corp | Semiconductor device and fabrication thereof |
JP2000150647A (en) * | 1998-11-11 | 2000-05-30 | Sony Corp | Wiring structure and its manufacture |
JP2002285343A (en) * | 2000-12-11 | 2002-10-03 | Ebara Corp | Electroless plating apparatus |
JP2006303062A (en) * | 2005-04-19 | 2006-11-02 | Sony Corp | Manufacturing method of semiconductor device |
JP2016156039A (en) * | 2015-02-23 | 2016-09-01 | 東京エレクトロン株式会社 | Semiconductor device, plating treatment method, plating treatment system and storage medium |
Also Published As
Publication number | Publication date |
---|---|
JP6910480B2 (en) | 2021-07-28 |
WO2019151023A1 (en) | 2019-08-08 |
JPWO2019151023A1 (en) | 2021-01-28 |
TW201935586A (en) | 2019-09-01 |
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