TWI797977B - Package structure - Google Patents

Abstract

A package structure includes a base, a chip, a sealing ring, a lid and a reinforcing part. The chip is arranged on the base and is electrically connected to the base. The sealing ring is arranged on the base. The lid is arranged on the sealing ring and covers the chip. The reinforcing part is arranged on the base or the lid. The sealing ring makes the package structure have an airtight cavity, and the sealing ring surrounds the chip and the reinforcing part.

Description

Package structure

The invention relates to a packaging structure with a reinforcing part.

In the current packaging structure, the base (base) and the lid (lid) are usually bonded in a plane-to-plane manner by bonding materials (such as metal materials or glass frit). However, the above-mentioned bonding methods have surface bonding force. Weaker problem, so when stress occurs, the base and the upper cover are easy to separate, thereby increasing the probability of damage to the package structure.

The invention provides a packaging structure, which can improve the bonding force and reduce the probability of damage.

A packaging structure of the present invention includes a base, a chip, a sealing ring, an upper cover and a reinforcing part. The chip is arranged on the base and electrically connected with the base. The sealing ring is arranged on the base. The upper cover is arranged on the sealing ring and covers the wafer. The reinforcing part is arranged on the base or the upper cover. The sealing ring enables the packaging structure to have an airtight cavity, and the sealing ring surrounds the chip and the reinforcing part.

In an embodiment of the present invention, the above-mentioned base has a groove and a frame surrounding the groove. The wafer is located in the groove, and the sealing ring is arranged on the frame.

In an embodiment of the present invention, the ratio of the height of the reinforcing portion to the height of the sealing ring is between 1/4 and 1/3.

In an embodiment of the present invention, the ratio of the width of the reinforcing portion to the width of the sealing ring is between 1/2 to 1/3.

In an embodiment of the present invention, the above-mentioned sealing ring covers part of the sidewall of the upper cover.

In an embodiment of the present invention, the above-mentioned reinforcement part is protruded on the upper cover or the base.

In an embodiment of the present invention, the above-mentioned reinforcement part is embedded in the upper cover or the base.

In an embodiment of the present invention, viewed from above, the above-mentioned reinforcing portion is a closed annular contour corresponding to the sealing ring.

In an embodiment of the present invention, viewed from a top view, the above-mentioned reinforcing portion is formed of a plurality of contours, and there is a gap between adjacent contours, and part of the sealing ring is located in the gap.

In an embodiment of the present invention, the above-mentioned reinforcing part is integrally formed with any one of the sealing ring, the upper cover or the base.

Based on the above, the present invention increases the joint surface area and surface joint strength of the joint surface of the base and the upper cover through the design of the reinforcement part, and improves the ability of the overall structure to resist stress. Therefore, when stress occurs, the base and the upper cover are less likely to be separated. Thus, the probability of damage to the packaging structure is reduced.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

Exemplary embodiments of the present invention will be fully described below with reference to the drawings, but the invention may also be embodied in many different forms and should not be construed as limited to the embodiments described herein. In the drawings, for the sake of clarity, the sizes and thicknesses of regions, parts and layers may not be drawn in actual scale. In order to facilitate understanding, the same components in the following description will be described with the same symbols.

Directional terms (eg, up, down, right, left, front, back, top, bottom) as used herein are used pictorially by reference only and are not intended to imply absolute orientation.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

1A , 2A , 3 , 4 , 5 , and 6 are schematic cross-sectional views of packaging structures according to some embodiments of the present invention. FIG. 1B and FIG. 1C are schematic top views of some embodiments of FIG. 1A . 2B and 2C are schematic top views of some embodiments of FIG. 2A . It should be noted that, for clarity, FIG. 2B and FIG. 2C omit showing the upper cover, glue and chip.

Please refer to FIG. 1A, FIG. 1B and FIG. 1C, the package structure 100 of the present embodiment includes a base 110, a chip 120, a sealing ring 130, an upper cover 140 and a reinforcement part 150, wherein the chip 120 is arranged on the base 110 and is connected to the base 110 is electrically connected, the sealing ring 130 is disposed on the base 110 , and the upper cover 140 is disposed on the sealing ring 130 and covers the wafer 120 . In addition, in this embodiment, the reinforcing part 150 is disposed on the upper cover 140 , the sealing ring 130 makes the package structure 100 have an airtight cavity C, and the sealing ring 130 surrounds the chip 120 and the reinforcing part 150 . Accordingly, the design of the reinforcing part 150 in this embodiment increases the joint surface area and surface joint strength of the joint surface between the base 110 and the upper cover 140, and improves the ability of the overall structure to resist stress. Therefore, when stress occurs, the base 110 and the upper cover 140 The upper cover 140 is less likely to be separated, thereby reducing the probability of damage to the packaging structure 100 . Furthermore, under the same conditions, when the package structure with a reinforced part and the package structure without a reinforced part are tested and an external force of 100 Pa (Pa) is applied to compare the stress at the same position, from the point of view of the position of maximum stress, the bonding interface has The stress (shear force) of the present embodiment is reduced from 61 Pa to 44 Pa, which proves that the design of the reinforcement part 150 in this embodiment can effectively improve the ability of the package structure 100 to resist stress. It should be noted that in other embodiments, the manner in which the reinforcing part is disposed on the base will be further described.

In this embodiment, the reinforcement part 150 can be protruded on the upper cover 140, and the reinforcement part 150 can be provided in the form of a bump, so the reinforcement part 150 can further block the stress from the edge of the package structure 100, but this The invention is not limited thereto, and in other embodiments, the reinforcing part 150 may have different implementation styles. Here, the reinforcing part 150 may be an additional element (such as tungsten (W), quartz, ceramics or metal (such as Kovar Alloy)) disposed on the upper cover 140 , but the invention is not limited thereto.

In some embodiments, the ratio of the height 150h of the reinforcing portion 150 to the height 130h of the sealing ring 130 is between 1/4 and 1/3 (as shown in FIG. 1A ), and the width 150w of the reinforcing portion 150 is the same as that of the sealing ring The ratio of the width 130w of 130 is between 1/2 to 1/3 (as shown in FIG. 1B and FIG. 1C ), but the present invention is not limited thereto, and the aforementioned height and width can be adjusted according to actual design requirements.

In some embodiments, the material of the base 110 includes ceramics, quartz, PCB or metal (such as Kovar Alloy), and the material of the upper cover 140 includes metal (such as iron (Fe), cobalt (Co) or nickel (Ni) ), quartz, PCB or ceramic. For example, the packaging structure 100 of this embodiment uses a ceramic base 110 and a metal upper cover 140, so the upper cover 140 can be flat, but the present invention is not limited thereto. In other embodiments, the base 110 and the upper cover 140 can be made of other materials. In addition, the wafer 120 is, for example, a quartz wafer (quartz blank) or other suitable wafers, and the material of the sealing ring 130 is, for example, a metal material or glass frit, wherein the metal material is, for example, gold/tin alloy (Au/Sn) .

In some embodiments, the base 110 has a groove 112 and a frame 114 surrounding the groove 112 , the wafer 120 is located in the groove 112 , and the sealing ring 130 is disposed on the frame 114 . Here, the chip 120 can be disposed on the mount pad 111 in the groove 112 by a glue 160, wherein the glue 160 is, for example, silver glue, but the invention is not limited thereto.

In some embodiments, since the sealing ring 130 can be formed by heating and melting the aforementioned materials, the sealing ring 130 can cover part of the sidewall 140s of the upper cover 140 , but the invention is not limited thereto.

In some embodiments, as shown in FIG. 1B , viewed from a top view, the reinforcing portion 150 is a closed annular contour (such as a rectangular contour) corresponding to the sealing ring 130 , but the present invention is not limited thereto. In alternative embodiments, As shown in FIG. 1C , in the package structure 100A, in a top view, the reinforcing portion 150A is composed of multiple contours, and there is a gap 150g between adjacent contours, and part of the sealing ring 130 is located in the gap 150g.

It must be noted here that the following embodiments continue to use the component numbers and part of the content of the above-mentioned embodiments, wherein the same or similar numbers are used to indicate the same or similar components, and the description of the same technical content is omitted, and the description of the omitted part Reference can be made to the aforementioned embodiments, and the following embodiments will not be repeated.

Please refer to FIG. 2A . Compared with the packaging structure 100 in FIG. 1A , the reinforcing portion 250 of the packaging structure 200 of this embodiment is protruded on the base 110 . In addition, in this embodiment, as shown in FIG. 2B , viewed from above, the reinforcing portion 250 is a closed annular contour corresponding to the sealing ring 130, but the present invention is not limited thereto. In an alternative embodiment, as shown in FIG. 2C As shown, in the package structure 200A, viewed from above, the reinforcing portion 250A is composed of multiple contours, and there is a gap 250g between adjacent contours, and part of the sealing ring 130 is located in the gap 250g, but the present invention is not limited thereto.

Please refer to FIG. 3 . Compared with the package structure 100 in FIG. 1A , the reinforcement part 350 of the package structure 300 of this embodiment is embedded in the upper cover 340 . Furthermore, the reinforcing part 350 can be formed by filling the sealing ring 330 into the groove 340 a of the upper cover 340 , so the reinforcing part 350 and the sealing ring 330 can be integrally formed, but the present invention is not limited thereto. In addition, the embedded reinforcing portion 350 may also have a closed annular profile or a multi-segment profile similar to the reinforcing portion 150 .

Please refer to FIG. 4 . Compared with the package structure 300 in FIG. 3 , the reinforcement part 450 of the package structure 400 of this embodiment is embedded in the base 410 . Furthermore, the reinforcing part 450 can be formed by filling the sealing ring 430 into the groove 414 a of the frame 414 of the base 410 , so the reinforcing part 450 and the sealing ring 430 can be integrally formed, but the invention is not limited thereto. In addition, the embedded reinforcing portion 450 may also have a closed annular profile or a multi-segment profile similar to the reinforcing portion 250 .

Please refer to FIG. 5 . Compared with the packaging structure 200 in FIG. 2A , the packaging structure 500 of this embodiment uses a structure of a quartz base 510 and a quartz upper cover 540 , so the upper cover 540 may be in an inverted U shape. In addition, the reinforcing part 550 of the package structure 500 of this embodiment can be formed by etching the base 510, so the reinforcing part 550 and the base 510 can be an integrated structure, in other words, the reinforcing part 550 and the base 510 The materials used will be the same, but the present invention is not limited thereto.

In this embodiment, the base 510 and the upper cover 540 have a concavo-convex complementary joint interface, that is, the upper cover 540 has a recess corresponding to the reinforcing portion of the base 510 . In addition, the sealing ring 530 between the base 510 and the upper cover 540 is, for example, metal film bonding, wherein the metal is, for example, Au or AuSn, but the invention is not limited thereto.

Please refer to FIG. 6 . Compared with the package structure 500 in FIG. 5 , the package structure 600 of the present embodiment has a step-shaped concavo-convex complementary bonding interface between the base 610 and the upper cover 640 . In addition, the reinforcing part 650 of the package structure 600 of this embodiment can be formed by etching the upper cover 640, so the reinforcing part 650 and the upper cover 640 can be an integrated structure, in other words, the reinforcing part 650 and the upper cover 640 use The materials will be the same, but the invention is not limited thereto.

It should be noted that the sealing rings in each of the above aspects can surround the reinforcing part, and the present invention is not limited to the above-mentioned embodiments, as long as the packaging structure has a reinforcing part disposed on the base or the upper cover, the sealing ring makes the packaging structure have an airtight The airtight cavity, and the sealing ring enclosing the chip and the reinforcing part all belong to the protection scope of the present invention.

In summary, the present invention increases the joint surface area and surface joint strength of the joint surface of the base and the upper cover through the design of the reinforcing part (set on the base or the upper cover), and improves the ability of the overall structure to resist stress. Therefore, when there is a stress The base and the upper cover are less likely to be separated during production, thereby reducing the probability of damage to the packaging structure.

Although the present invention has been disclosed above with the embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field may make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention should be defined by the scope of the appended patent application.

100, 100A, 200, 200A, 300, 400, 500, 600: package structure

110, 410, 510, 610: base

111: joint pad

112: Groove

114, 414: frame

120: chip

130, 330, 430, 530: sealing ring

140, 340, 540, 640: upper cover

140s: side wall

150, 150A, 250, 250A, 350, 450, 550, 650: reinforcement

150g, 250g: Gap

160: Glue

130h, 150h: height

130w, 150w: width

340a, 414a: slots

C: airtight cavity

1A , 2A , 3 , 4 , 5 , and 6 are schematic cross-sectional views of packaging structures according to some embodiments of the present invention. FIG. 1B and FIG. 1C are schematic top views of some embodiments of FIG. 1A . 2B and 2C are schematic top views of some embodiments of FIG. 2A .

100: Package structure

110: Base

112: Groove

114: frame

120: chip

130: sealing ring

140: upper cover

140s: side wall

150: Strengthening Department

160: Glue

130h, 150h: height

C: airtight cavity

Claims (10)

A packaging structure, comprising: a base; a chip, arranged on the base and electrically connected to the base; a sealing ring, arranged on the base; an upper cover, arranged on the sealing ring and covering the chip; and a reinforcing part protruding from the upper cover or the base, wherein the sealing ring makes the packaging structure have an airtight cavity, and the sealing ring surrounds the chip and the reinforcing part department. The package structure according to claim 1, wherein the base has a groove and a frame surrounding the groove, the chip is located in the groove, and the sealing ring is disposed on the frame. The package structure according to claim 1, wherein the ratio of the height of the reinforcing part to the height of the sealing ring is between 1/4 and 1/3. The package structure according to claim 1, wherein the ratio of the width of the reinforcing portion to the width of the sealing ring is between 1/2 and 1/3. The package structure according to claim 1, wherein the sealing ring covers part of the sidewall of the upper cover. The package structure according to claim 1, wherein the reinforcing part is further embedded in a recess of the base or the upper cover, and has a concavo-convex complementary bonding interface. The package structure according to claim 1, wherein the reinforcing portion is a closed annular contour corresponding to the sealing ring in a plan view. The packaging structure according to claim 1, wherein the reinforcing portion is formed of a plurality of contours in a plan view, and there is a gap between adjacent contours, and part of the sealing ring is located in the gap. The packaging structure according to claim 1, wherein the reinforcing part is integrally formed with any one of the sealing ring, the upper cover or the base. The package structure according to claim 6, wherein the concave-convex complementary bonding interface is stepped.

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