TWI796397B - Detergent composition for resin mask peeling - Google Patents

Abstract

The present invention provides a cleaning composition for resin mask peeling which is excellent in resin mask removability and has a small waste water treatment load. In one aspect, the present invention relates to a cleaning composition for resin mask peeling, which contains an inorganic base (component A), a surfactant (component B) represented by the following general formula (I), and water ( Component C), and the HLB of component B obtained by the Davis method is 4.9 or more and 7.9 or less. R ¹ -O-(EO) _n (PO) _m -H (I) wherein, in the formula (I), R ¹ represents a linear or branched alkyl group and a carbon number selected from 8 to 14 carbon numbers At least one kind of straight-chain or branched alkenyl group of 8 or more and 14 or less, EO means ethoxyl, n is the average addition mole number of EO and is a number of 5 or more and 12 or less, PO means propylene Oxygen group, m is the average added mole number of PO, and is a number of 0 to 4.

Description

Detergent composition for resin mask peeling

The present invention relates to a cleaning agent composition for stripping a resin mask, a method for cleaning a resin mask using the cleaning agent composition, and a method for manufacturing electronic parts.

In recent years, with regard to personal computers and various electronic devices, low power consumption, high-speed processing speed, and miniaturization are progressing, and the wiring mounted on such packaging substrates and the like is gradually being miniaturized year by year. Until now, the metal mask method has been mainly used to form such fine wiring and connection terminals such as pillars and bumps. However, due to low versatility or difficulty in coping with the miniaturization of wiring, etc., other new methods are being shifted.

As one of the new methods, there is known a method of using a dry film resist as a thick-film resin mask instead of a metal mask. The resin mask is eventually peeled off and removed, and an alkaline peeling cleaner is used at this time. As such a cleaning agent for stripping, for example, Patent Document 1 discloses a resist stripping agent composition containing (A) an amine compound having 1 to 4 nitrogen atoms, (B) a molecular weight of 301 to 5000 The non-ionic surfactant, and (C) water.

Patent Document 2 discloses a cleaning solution for semiconductor devices, which contains a reducing agent and a surfactant, and has a pH value of 10-14.

Patent Document 3 discloses a photoresist stripping solution containing (A) 1% by mass to 30% by mass of a surfactant, (B) 0.05% by mass to 10% by mass of a corrosion inhibitor, (C) 5 mass % or more of water and 60 mass % or less, and (D) 30 mass % or more of water-soluble organic solvents and 95 mass % or less.

Patent Document 4 discloses a thinner composition for resist removal, which is characterized in that it is used to remove the edge of the resist film coated on the substrate or the useless film components formed on the rear surface of the substrate. Resist to prevent corrosion of equipment, containing: a) 0.1 to 5% by weight of inorganic alkali compound, b) 0.1 to 5% by weight of organic amine, c) 0.1 to 30% by weight of organic solvent, d) 1:5 to 25 The weight ratio of surfactant containing anionic surfactant and nonionic surfactant is 0.01 to 5% by weight, and e) water is 60 to 99% by weight. prior art literature patent documents

Patent Document 1: Japanese Patent Application Laid-Open No. 11-311867 Patent Document 2: Japanese Patent Application Laid-Open No. 2009-260249 Patent Document 3: Japanese Patent Application Laid-Open No. 2008-58624 Patent Document 4: Japanese Patent Application Publication No. 2005-509693

[Problem to be solved by the invention]

When forming fine wiring on a printed circuit board, etc., in order to reduce not only the residue of the resin mask, but also the residue of the additives contained in the solder or plating solution used for fine wiring or bump formation, etc., the cleaning agent is combined Materials require higher detergency. The resin mask is formed using a resist whose physical properties such as solubility in a developer are changed by light or electron beams. In addition, resists are roughly classified into negative type and positive type in terms of the reaction method with light or electron beams. Negative-type resist has the property that the solubility of the developing solution decreases when exposed to light, and the layer containing the negative-type resist (hereinafter, also referred to as "negative-type resist layer") is exposed to light after exposure and development. part is used as a resin mask. Positive-type resists have the property of increasing solubility in developing solutions when exposed to light, and the layer containing positive-type resists (hereinafter, also referred to as "positive-type resist layers") is exposed after exposure and development. Parts are removed, and the unexposed parts are used as resin masks. By using a resin mask having such characteristics, it is possible to form fine connection portions of circuit boards such as metal wiring, metal pillars, and solder bumps. However, the properties of the resin mask are changed by the plating treatment or heat treatment used when forming these connection parts, and it is difficult to remove the resin mask in the cleaning step of the next step. In particular, negative-type resists have the property of hardening by reacting with light or electron beams, so the resin mask formed using negative-type resists will be affected by the plating process or heating used when forming the connection. Treatment etc. harden more than necessary, cannot be completely removed in the cleaning step, or cause damage to the substrate or metal surface due to the very long time taken for removal. As mentioned above, the resin mask that has been plated and/or heat-treated is not easy to peel off, so the cleaning composition is required to have high resin mask removability.

On the other hand, in various fields, electronization is advancing, and the production volume of printed circuit boards and the like is increasing. Furthermore, in order to miniaturize the equipment or equipment used, increase the processing speed, and reduce power consumption, there are wiring miniaturization, multilayering, stripping, increased cleaning steps, and increased usage of detergent compositions. tendency. As the use of the detergent composition increases, the load of wastewater treatment of the detergent composition or flushing water, or the eutrophication of lakes and marshes caused by the inflow of waste liquid also increases, so it is strongly required A cleaning composition that has a small load on wastewater treatment, does not contain nitrogen and phosphorus that cause eutrophication of lakes and marshes, and can efficiently remove resin masking. However, in the methods described in the above-mentioned patent documents, it is difficult to achieve both high resin mask removability and low waste water treatment load.

Therefore, the present invention provides a cleaning composition for removing a resin mask having excellent resin mask removability and a small drain treatment load, a method of removing a resin mask using the cleaning composition, and a method of manufacturing a substrate. [Technical means to solve the problem]

In one aspect, the present invention relates to a cleaning composition for resin mask peeling, which contains an inorganic base (component A), a surfactant (component B) represented by the following general formula (I), and water ( Component C), and the HLB (Hydrophilic-Lipophilic Balance) obtained by the Davis method of component B is not less than 4.9 and not more than 7.9. R ¹ -O-(EO) _n (PO) _m -H (I) wherein, in the formula (I), R ¹ represents a linear or branched alkyl group and a carbon number selected from 8 to 14 carbon numbers At least one kind of straight-chain or branched alkenyl group of 8 or more and 14 or less, EO means ethoxyl, n is the average addition mole number of EO and is a number of 5 or more and 12 or less, PO means propylene Oxygen group, m is the average added mole number of PO, and is a number of 0 to 4.

In another aspect, the present invention relates to a method for removing a resin mask, which includes the step of cleaning the object to be cleaned to which the resin mask is attached using the detergent composition of the present invention.

In another aspect, the present invention relates to a method of manufacturing electronic components, which includes the step of cleaning the object to be cleaned with a resin mask attached by using the cleaning agent composition of the present invention.

In another aspect, the present invention relates to the use of the detergent composition of the present invention for the manufacture of electronic parts.

In another aspect, the present invention relates to a set used in any one of the removal method of the present invention and the method of manufacturing electronic parts of the present invention; and components A to C constituting the cleaning composition of the present invention Among them, the set includes the first liquid containing component A and the second liquid containing component B in a state where they are not mixed with each other, and at least one of the first liquid and the second liquid further contains component C. [Effect of Invention]

According to this invention, the cleaning composition for resin mask peeling which is excellent in resin mask removability and has a small waste water treatment load can be provided in one aspect.

The present invention is based on the insight that by using a cleaning composition for resin mask peeling containing an inorganic base (component A), a specific surfactant (component B) and water (component C), the waste water treatment load can be reduced. It is relatively low, and it is also possible to efficiently remove the resin mask, especially the resin mask that has been plated and/or heat-treated. Furthermore, the present invention is based on the knowledge that eutrophication of lakes and marshes can be suppressed by removing nitrogen-containing compounds and phosphorus-containing compounds from the detergent composition.

That is, in one aspect, the present invention relates to a cleaning composition for resin mask peeling (hereinafter also referred to as "the cleaning composition of the present invention") containing an inorganic base (component A), the above-mentioned The surfactant (component B) and water (component C) represented by the general formula (I), and the HLB of the component B obtained by the Davis method is not less than 4.9 and not more than 7.9.

According to the present invention, it is possible to provide a cleaning composition having excellent resin mask removability and a small load on wastewater treatment. Therefore, the cleaning composition of the present invention can efficiently remove resin masks, especially resin masks that have been plated and/or heat-treated, even if the waste water treatment load is low. And, by using the detergent composition of the present invention, high-quality electronic parts can be obtained with higher yield. Furthermore, by using the cleaning composition of this invention, the electronic component which has a fine wiring pattern can be manufactured efficiently.

Although the details of the mechanism of action of the effect of the detergent composition of the present invention are unclear, it is estimated as follows. Generally, the peeling of the resin mask is considered to be caused by the interfacial pressure generated by the penetration of the components of the detergent composition into the resin mask and swelling of the resin mask. In the detergent composition of the present invention, by making component A (inorganic base) and component C (water) soak into the resin mask, thereby promoting the dissociation of the alkali-soluble resin formulated into the resin mask, and then by producing The charge repulsion promotes the peeling of the resin mask. At this time, it is inferred that the surfactant (ingredient B) with a specific structure and HLB within a specific range acts between the substrate surface and the resin mask, reducing the adhesion between the substrate and the resin, and further promoting the resin mask. The removal of the resin mask is significantly improved. In addition, it is generally known that nonionic surfactants have a lower critical micelle concentration (CMC) than surfactants having a charge such as anionic surfactants. Since the component B in the present invention is a non-ionic surfactant with a low critical cell concentration (CMC), it is inferred that even if it is added in a small amount, it can effectively act and promote component A (inorganic base) and component C (water) The penetration into the resin mask can reduce the content of organic matter in the detergent composition, and can suppress the increase of the waste water treatment load. From this, it is thought that a fine circuit (wiring pattern) can be efficiently formed on a board|substrate with high cleanliness. However, the present invention may also be interpreted without being limited to this mechanism.

In the present invention, the so-called resin mask refers to a mask that protects the surface of a substance from etching, plating, heating and other treatments, that is, a mask that functions as a protective film. As the resin mask, in one or more embodiments, a resist layer after an exposure or development step, and at least one treatment of exposure and development (hereinafter also referred to as "exposure and/or development treatment") can be mentioned. ”), or a hardened resist layer. As a resin material which forms a resin mask, the photosensitive resin of a film form, or a resist film is mentioned in one or several embodiment. A general-purpose one can be used for the resist film.

[Component A: Inorganic base] The detergent composition of the present invention contains an inorganic base (component A). Component A may be used alone or in combination of two or more.

Component A includes, for example, one or a combination of two or more selected from sodium hydroxide, potassium hydroxide, lithium hydroxide, calcium hydroxide, sodium carbonate, potassium carbonate, sodium silicate, and potassium silicate. From the viewpoint of improving the resin mask removability, it is preferably a combination of one or two or more selected from sodium hydroxide, potassium hydroxide, sodium carbonate, and potassium carbonate, more preferably sodium hydroxide and potassium hydroxide at least one of them.

The content of component A in use of the detergent composition of the present invention is preferably at least 0.1% by mass, more preferably at least 0.3% by mass, and still more preferably 0.5% by mass, from the viewpoint of improving the resin mask removability % or more, and, from the viewpoint of improving the resin mask removability, it is preferably 15 mass % or less, more preferably 10 mass % or less, and still more preferably 7.5 mass % or less. More specifically, the content of component A when used in the detergent composition of the present invention is preferably from 0.1% by mass to 15% by mass, more preferably from 0.3% by mass to 10% by mass, and still more preferably It is 0.5 mass % or more and 7.5 mass % or less. When component A contains two or more kinds of inorganic bases, the content of component A means the total content of them.

In the present invention, "the content of each component at the time of use of the detergent composition" refers to the content of each component at the time of washing, that is, when the detergent composition is used for washing.

[Component B: Surfactant] The surfactant (ingredient B) contained in the detergent composition of the present invention is a surfactant represented by the following general formula (I), and has an HLB of 4.9 or more and 7.9 or less according to the Davis method. Component B can be used 1 type or in combination of 2 or more types.

R ¹ -O-(EO) _n (PO) _m -H (I) wherein, in formula (1), R ¹ represents a straight-chain or branched alkyl group and a carbon number selected from 8 to 14 carbons At least one kind of straight-chain or branched alkenyl group of 8 or more and 14 or less, EO means ethoxyl, n is the average addition mole number of EO and is a number of 5 or more and 12 or less, PO means propylene Oxygen group, m is the average added mole number of PO, and is a number of 0 to 4.

In the formula (I), R is at least ^one selected from a straight-chain or branched alkyl group with a carbon number of 8 to 14 and a straight-chain or branched alkenyl group with a carbon number of 8 to 14. From the viewpoint of improving the resin mask peelability and shortening the peeling time, a linear alkyl group having 8 to 14 carbon atoms and a linear alkenyl group having 8 to 14 carbon atoms are preferable. From the same viewpoint, the carbon number of ^R1 is 8 or more, preferably 9 or more, more preferably 10 or more, and 14 or less, preferably 12 or less, more preferably 11 or less. That is, R ¹ has a carbon number of 8 to 14, preferably 9 to 12, more preferably 10 to 11, and still more preferably 10. Specific examples of ^R include those selected from octyl, 2-ethylhexyl, decyl, isodecyl, 2-propylheptyl, dodecyl, tridecyl, and tetradecyl. At least 1 species.

In formula (I), (EO) _n (PO) _m may consist of ethoxyl alone, or may include ethoxyl and propoxyl. When (EO) _n (PO) _m includes the case of ethoxyl and propoxyl, the addition form of PO and EO can be random arrangement or block arrangement, and the addition form of EO and PO The sequence is not limited.

In the formula (I), n is 5 or more, preferably 6, more preferably 7 or more, and 12 or less, preferably 11 or less, from the viewpoint of improving resin mask peelability and shortening the peeling time. Preferably, it is 10 or less, More preferably, it is 9 or less. That is, n is a number of 5 or more and 12 or less, preferably 5 or more and 11 or less, more preferably 6 or more and 10 or less, still more preferably 7 or more and 9 or less.

In the formula (I), m is not less than 0 and not more than 4, preferably not more than 3, more preferably not more than 2, from the viewpoint of shortening the peeling time. That is, m is a number from 0 to 4, preferably from 0 to 3, more preferably from 0 to 2.

Specific examples of component B include polyethylene glycol (9) lauryl ether, polyethylene glycol (8) 2-ethylhexyl ether, polyethylene glycol (6) 2-ethylhexyl ether, polyethylene glycol (8) Alcohol (7) decyl ether, polyethylene glycol (8.5) isodecyl ether, polyethylene glycol (10) tridecyl ether, polyethylene glycol (9) decyl ether, pentaethylene glycol monocaprylether , polyethylene glycol (12) alkyl (secondary lauryl and secondary tetradecyl mixed) ether, etc. Values in parentheses represent average added moles.

Component B has an HLB of 4.9 or more and 7.9 or less according to the Davis method. The so-called HLB obtained according to the Davis method refers to the base number determined by using the functional group recorded in Davis, J.T.; Proc. The sum of the base numbers - the sum of the base numbers of the lipophilic groups" is the value obtained by defining the HLB value. From the viewpoint of improving the peelability of the resin mask and shortening the peeling time, the HLB is 4.9 or more, preferably 5.5 or more, and more preferably 5.5 or more. 6 or more, more preferably 6.15 or more, and 7.9 or less, preferably 6.9 or less, more preferably 6.7 or less, still more preferably 6.5 or less. More specifically, the HLB is 4.9 to 7.9, preferably 5.5 to 6.9, more preferably 6 to 6.7, still more preferably 6.15 to 6.5.

In one or more embodiments, the critical cell concentration (CMC) of component B is preferably 0.00001% by mass or more, more preferably 0.00005% by mass or more, from the viewpoint of improving the peelability of the resin mask and shortening the peeling time , and more preferably 0.0001 mass % or more, and, from the same viewpoint, preferably 0.1 mass % or less, more preferably 0.05 mass % or less, still more preferably 0.01 mass % or less. More specifically, the critical cell concentration (CMC) of component B is preferably at least 0.00001% by mass and not more than 0.1% by mass, more preferably at least 0.00005% by mass and not more than 0.05% by mass, still more preferably at least 0.0001% by mass and not more than 0.0001% by mass. 0.01% by mass or less.

The content of component B in use of the detergent composition of the present invention is preferably at least 0.0001% by mass, more preferably at least 0.001% by mass, and still more preferably from the viewpoint of improving the peelability of the resin mask and shortening the peeling time. Preferably at least 0.01% by mass, more preferably at least 0.1% by mass, and, from the same point of view, preferably at most 10% by mass, more preferably at most 3% by mass, further preferably at most 2% by mass, and further preferably at most 2% by mass. More preferably, it is 1.2 mass % or less. More specifically, the content of component B when used in the detergent composition of the present invention is preferably from 0.0001% by mass to 10% by mass, more preferably from 0.001% by mass to 10% by mass, and still more preferably 0.01% by mass to 10% by mass, more preferably 0.1% by mass to 10% by mass, more preferably 0.1% by mass to 3% by mass, still more preferably 0.1% by mass to 2% by mass % or less, more preferably not less than 0.1% by mass and not more than 1.2% by mass. When component B contains two or more types of surfactants, the content of component B is the total content of them.

The mass ratio (A/B) of component A to component B in the detergent composition of the present invention is preferably 0.3 or more, more preferably 0.4, from the viewpoint of improving the peelability of the resin mask and shortening the peeling time or more, more preferably 0.5 or more, and, from the same viewpoint, preferably 50,000 or less, more preferably 1,000 or less, further preferably 100 or less, still more preferably 80 or less. More specifically, the mass ratio (A/B) is preferably from 0.3 to 50000, more preferably from 0.4 to 1000, still more preferably from 0.5 to 100, still more preferably from 0.5 to 80.

[ingredient C: water] The detergent composition of the present invention contains water (component C). As the component C (water), ion-exchanged water, RO (reverse osmosis, reverse osmosis) water, distilled water, pure water, and ultrapure water can be used. The content of water may be appropriately set according to the usage of the detergent composition of the present invention.

The content of Component C in use of the detergent composition of the present invention is preferably at least 84% by mass, more preferably at least 85% by mass, and still more preferably from the viewpoint of improving the peelability of the resin mask and shortening the peeling time. It is preferably at least 90% by mass, more preferably at least 95% by mass, and from the same viewpoint, it is preferably at most 99.5% by mass, more preferably at most 99.4% by mass. More specifically, the content of component C when used in the detergent composition of the present invention is preferably from 84% by mass to 99.5% by mass, more preferably from 85% by mass to 99.5% by mass, and still more preferably It is 90 mass % or more and 99.4 mass % or less, More preferably, it is 95 mass % or more and 99.4 mass % or less.

[optional ingredient] The detergent composition of the present invention may further contain optional components other than the above-mentioned components A to C as necessary. Examples of optional components include components that can be used in general detergents, such as surfactants other than component B, chelating agents, thickeners, dispersants, rust inhibitors, alkaline substances, organic solvents, polymers Compounds, cosolvents, antioxidants, preservatives, defoamers, antibacterial agents, etc. The content of the optional components when used in the detergent composition of the present invention is preferably from 0% by mass to 2.0% by mass, more preferably from 0% by mass to 1.5% by mass, still more preferably at least 0% by mass And 1.3 mass % or less, More preferably, it is 0 mass % or more and 1.0 mass % or less.

The total content of organic matter derived from component B and optional components when the detergent composition of the present invention is used is preferably at most 10% by mass, more preferably at most 3% by mass, from the viewpoint of reducing the load on wastewater treatment, Furthermore, it is more preferably 2 mass % or less, still more preferably 1 mass % or less, still more preferably 0.5 mass % or less, and, from the viewpoint of improving resin mask peelability and shortening peeling time, preferably 0.0001 mass % % or more, more preferably at least 0.01% by mass, and still more preferably at least 0.1% by mass. More specifically, when the detergent composition of the present invention is used, the total content of organic matter derived from component B and any component is preferably from 0.0001% by mass to 10% by mass, more preferably from 0.01% by mass to 3 mass % or less, more preferably 0.01 mass % or more and 2 mass % or less, still more preferably 0.01 mass % or more and 1 mass % or less, still more preferably 0.1 mass % or more and 0.5 mass % or less.

It is preferable that the cleaning composition of the present invention does not substantially contain nitrogen-containing compounds and phosphorus-containing compounds from the viewpoint of reducing drainage treatment load and suppressing eutrophication of drainage areas. In the present invention, "substantially not containing nitrogen-containing compounds and phosphorus-containing compounds" means that the total content of nitrogen-containing compounds and phosphorus-containing compounds in the detergent composition of the present invention is less than 0.1% by mass. From the viewpoint of reducing the load of drainage treatment and suppressing eutrophication of drainage areas, the total content of nitrogen-containing compounds and phosphorus-containing compounds in the detergent composition of the present invention is preferably 0.05% by mass or less, more preferably 0.01% by mass. Mass % or less, More preferably, it is 0 mass %. Examples of the nitrogen-containing compound include nitrogen-containing compounds widely used in detergent compositions, for example, at least one or a combination of two or more selected from amines and their salts, ammonia, and ammonium salts. As said amine, amino alcohols, such as monoethanolamine and diethanolamine, are mentioned, for example. As said ammonium salt, a quaternary ammonium salt, such as tetramethyl ammonium hydroxide (TMAH, Tetramethyl Ammonium Hydroxide), is mentioned, for example. As the phosphorus-containing compound, there are listed phosphorus-containing compounds widely used in detergent compositions, for example, inorganic phosphoric acids selected from phosphoric acid and its salts, pyrophosphoric acid, polyphosphoric acid, metaphosphoric acid and other condensed phosphoric acids and their salts, and organic phosphoric acids. At least one or a combination of phosphoric acid and phosphoric acid ester.

The detergent composition of the present invention may further contain a reducing agent in one embodiment, and may substantially not contain a reducing agent in another embodiment. In the present invention, "substantially not containing a reducing agent" means that the content of the reducing agent at the time of use of the cleaning composition of the present invention is less than 0.01% by mass.

[Manufacturing method of detergent composition] The detergent composition of the present invention can be produced by preparing the above-mentioned components A to C and optionally the above-mentioned arbitrary components by a known method. For example, the cleaning composition of this invention can be set as what mix|blended the said component A-C at least. Therefore, the present invention relates to a method for producing a detergent composition, which includes at least the steps of formulating the above-mentioned components A to C. In the present invention, "preparation" includes mixing components A to C and other components if necessary simultaneously or in any order. In the manufacturing method of the detergent composition of this invention, the preferable compounding quantity of each component can be made the same as the preferable content of each component of the detergent composition of this invention mentioned above.

The detergent composition of the present invention can also be prepared as a concentrate in which the amount of water in the component C is reduced within the range that the storage stability is not impaired due to separation or precipitation. The concentrate of the detergent composition is preferably a concentrate with a dilution ratio of 3 times or more from the viewpoint of transportation and storage, and a concentration with a dilution ratio of 10 times or less from the viewpoint of storage stability. of concentrates. The concentrate of the detergent composition can be used by diluting with water so that Components A to C have the above-mentioned content (that is, the content at the time of washing) at the time of use. Furthermore, the concentrate of a detergent composition can also add each component separately and use it at the time of use. In the present invention, "when in use" or "when washing" of the detergent composition of the concentrate refers to a state where the concentrate of the detergent composition is diluted.

When the detergent composition of the present invention is a concentrate, the content of component A in the concentrate of the detergent composition is preferably 1% by mass or more from the viewpoint of improving resin mask peelability, More preferably at least 2% by mass, more preferably at least 5% by mass, even more preferably at least 10% by mass, and, from the viewpoint of suppressing metal corrosion and storage stability, preferably at most 40% by mass, more preferably at most 40% by mass. Preferably, it is 30 mass % or less, More preferably, it is 20 mass % or less, More preferably, it is 15 mass % or less. More specifically, the content of component A in the concentrate of the detergent composition of the present invention is preferably from 1% by mass to 40% by mass, more preferably from 2% by mass to 30% by mass, and even more preferably Preferably, it is 5 mass % or more and 20 mass % or less, More preferably, it is 10 mass % or more and 15 mass % or less.

When the detergent composition of the present invention is a concentrate, the content of component B in the concentrate of the detergent composition is preferably 0.0003% by mass or more from the viewpoint of improving resin mask peelability, More preferably at least 0.01% by mass, still more preferably at least 0.1% by mass, still more preferably at least 0.5% by mass, and from the standpoint of storage stability and reduction in wastewater treatment load, preferably at most 30% by mass, More preferably, it is 10 mass % or less, More preferably, it is 5 mass % or less, More preferably, it is 2 mass % or less. More specifically, the content of component B in the concentrate of the detergent composition of the present invention is preferably from 0.0003% by mass to 30% by mass, more preferably from 0.01% by mass to 10% by mass, and even more preferably Preferably, it is 0.1 mass % or more and 5 mass % or less, More preferably, it is 0.5 mass % or more and 2 mass % or less.

When the detergent composition of the present invention is a concentrate, the content of component C in the concentrate of the detergent composition improves the resin mask peelability, shortens the peeling time, and stabilizes the detergent composition. From the viewpoint of chemical composition, it is preferably at least 50% by mass, more preferably at least 60% by mass, further preferably at least 70% by mass, and, from the same viewpoint, is preferably at most 95% by mass, more preferably at most 95% by mass. 90% by mass or less, more preferably 85% by mass or less. More specifically, the content of component C in the concentrate of the detergent composition of the present invention is preferably from 50% by mass to 95% by mass, more preferably from 60% by mass to 90% by mass, and even more preferably Preferably, it is not less than 70% by mass and not more than 85% by mass.

[to be washed] In one or a plurality of embodiments, the detergent composition of the present invention can be used for cleaning objects to be cleaned to which a resin mask is attached. Examples of the object to be cleaned include electronic parts and intermediates for their manufacture. Examples of electronic components include at least one component selected from metal plates such as printed circuit boards, wafers, copper plates, and aluminum plates. The above-mentioned manufacturing intermediates are intermediate products in the manufacturing steps of electronic components, including intermediate products after resin masking treatment. As a specific example of the object to be cleaned with a resin mask attached, for example, by using a resin mask to perform soldering or plating treatment (copper plating, aluminum plating, nickel plating, etc.) Electronic parts, etc., with wiring or connection terminals formed on the surface.

In one or more embodiments, from the viewpoint of cleaning effect, the cleaning composition of the present invention can be well used for resin masks, or resin masks that have been plated and/or heat-treated. Washing of the object to be washed. The resin mask may be, for example, a negative resin mask or a positive resin mask, and a negative resin mask is preferable from the viewpoint of easily exhibiting the effect of the present invention. As a negative resin mask, the negative dry film resist which processed exposure and/or image development is mentioned, for example. In the present invention, the so-called negative-type resin mask refers to what is formed using a negative-type resist, for example, a negative-type resist layer subjected to exposure and/or development treatment can be mentioned. In the present invention, the so-called positive-type resin mask is formed using a positive-type resist, for example, a positive-type resist layer that has been exposed and/or developed.

[Resin mask removal method] In one aspect, the present invention relates to a method for removing a resin mask (hereinafter, also referred to as "the removal method of the present invention"), which includes making the object to be cleaned with the resin mask attached and the cleaning method of the present invention The step of contacting the agent composition. The removal method of the present invention has a step of cleaning the object to be cleaned to which the resin mask is attached using the cleaning composition of the present invention. Examples of the object to be cleaned include the above-mentioned object to be cleaned. As a method of contacting the object to be cleaned with the cleaning composition of the present invention, or using the cleaning composition of the present invention to clean the object to be cleaned, for example, the following method can be cited: A method of contacting a cleaning bath containing a detergent composition, or a method of spraying a detergent composition into contact (spray method), ultrasonic cleaning in which ultrasonic radiation is applied during immersion net method etc. The detergent composition of the present invention can be directly used for cleaning without dilution. The removal method of the present invention preferably includes a step of rinsing with water and drying the object to be cleaned after contacting it with the cleaning composition. According to the removal method of the present invention, it is possible to efficiently remove a resin mask, especially a resin mask subjected to plating treatment and/or heat treatment. From the viewpoint of easily exerting the detergency of the detergent composition of the present invention, the removal method of the present invention is preferably a method of irradiating ultrasonic waves when the detergent composition of the present invention is in contact with the object to be cleaned, More preferably, the ultrasound is relatively high frequency. From the same viewpoint, the irradiation conditions of the above-mentioned ultrasonic waves are, for example, preferably 26-72 kHz, 80-1500 W, more preferably 36-72 kHz, 80-1500 W.

[Manufacturing method of electronic parts] In one aspect, the manufacturing method of the electronic component of the present invention includes the step of cleaning the object to be cleaned to which the resin mask is attached using the cleaning agent composition of the present invention. Examples of the object to be cleaned include the above-mentioned object to be cleaned. The manufacturing method of the electronic parts of the present invention can suppress the corrosion of the metal and effectively remove the resin mask attached to the electronic parts by using the cleaning agent composition of the present invention for cleaning, so it is possible to manufacture highly reliable electronic parts. Furthermore, by performing the removal method of the present invention, it is easy to remove the resin mask adhering to the electronic parts, so the cleaning time can be shortened, and the manufacturing efficiency of the electronic parts can be improved.

[set] The present invention relates to a set (hereinafter also referred to as "the set of the present invention") used in any one of the removal method of the present invention and the method of manufacturing an electronic component of the present invention. As an embodiment of the kit of the present invention, for example, a first liquid containing component A and a second liquid containing component B are included in a state where they are not mixed with each other, and at least one of the first liquid and the second liquid is further A set containing component C (2-component detergent composition). Liquid 1 and Liquid 2 can be mixed at the time of use and diluted as needed. Each of the first liquid and the second liquid may contain any of the above-mentioned optional components as necessary. According to the kit of the present invention, a cleaning composition having excellent resin mask removability and a small load on wastewater treatment can be obtained.

From the viewpoint of availability and workability, as the set of the present invention, the following set is preferably mentioned: a set having the first component A containing 30 mass % or more and 50 mass % or less and component C as the remainder. liquid, and the second liquid containing only Component B; the first liquid containing 30% by mass to 50% by mass of Component A and the remainder of Component C, and the first liquid containing 1% by mass to 99% by mass A second liquid containing Component B and the remainder of Component C; or a first liquid containing 30% by mass to 50% by mass of Component A and the remainder of Component C, and 1% by mass to 99% by mass % or less Component B and the remainder as the optional component and the second liquid of Component C. These kits may further have a third liquid containing component C, and it is more preferable to use the third liquid to dilute the mixture of the first liquid and the second liquid to an arbitrary concentration.

The present invention further relates to the following cleaning composition, removal method, and production method. <1> A cleaning agent composition for resin mask peeling, which contains an inorganic base (component A), a surfactant represented by the following general formula (I) (component B) and water (component C), and the component B's HLB obtained by the Davis method is 4.9 or more and 7.9 or less. R ¹ -O-(EO) _n (PO) _m -H (I) wherein, in the formula (I), R ¹ represents a linear or branched alkyl group and a carbon number selected from 8 to 14 carbon numbers At least one kind of straight-chain or branched alkenyl group of 8 or more and 14 or less, EO means ethoxyl, n is the average addition mole number of EO and is a number of 5 or more and 12 or less, PO means propylene Oxygen group, m is the average added mole number of PO, and is a number of 0 to 4.

<2> The detergent composition as described in <1>, wherein in formula (I), R ¹ is selected from linear or branched alkyl groups having 8 or more and 14 or less carbon atoms and alkyl groups having 8 or more carbon atoms and At least one kind of linear or branched alkenyl group having 14 or less, preferably a linear alkyl group having 8 to 14 carbon atoms and a linear alkenyl group having 8 to 14 carbon atoms. <3> The detergent composition as described in <1> or <2>, wherein in formula (I), R ¹ has a carbon number of 8 or more, preferably 9 or more, more preferably 10 or more. <4> The detergent composition described in any one of <1> to <3>, wherein in the formula (I), the carbon number of ^R1 is 14 or less, preferably 12 or less, more preferably 11 the following. <5> The detergent composition described in any one of <1> to <4>, wherein in formula (I), R ¹ has a carbon number of 8 to 14, preferably 9 to 12 or less, more preferably 10 or more and 11 or less, still more preferably 10 or less. <6> The detergent composition as described in any one of <1> to <5>, wherein ^R in formula (I) is selected from octyl, 2-ethylhexyl, decyl, and isodecyl At least one of 2-propylheptyl, dodecyl, tridecyl, and tetradecyl. <7> The detergent composition as described in any one of <1> to <6>, wherein in formula (I), the addition form of EO and PO is random arrangement or block arrangement. Yes, and the addition order of EO and PO is not limited. <8> The detergent composition according to any one of <1> to <7>, wherein in formula (I), n is 5 or more, preferably 6 or more, more preferably 7 or more. <9> The detergent composition described in any one of <1> to <8>, wherein in formula (I), n is 12 or less, preferably 11 or less, more preferably 10 or less, and even more Preferably less than 9. <10> The detergent composition according to any one of <1> to <9>, wherein in formula (I), n is a number from 5 to 12, preferably from 5 to 11, More preferably, it is 6 or more and 10 or less, Still more preferably, it is 7 or more and 9 or less. <11> The detergent composition according to any one of <1> to <10>, wherein in formula (I), m is a number between 0 and 4, preferably between 0 and 3, More preferably, it is 0 or more and 2 or less. <12> The detergent composition as described in any one of <1> to <11>, wherein the HLB of component B is 4.9 or higher, preferably 5.5 or higher, more preferably 6 or higher, still more preferably 6.15 above. <13> The detergent composition as described in any one of <1> to <12>, wherein the HLB of component B is 7.9 or less, preferably 6.9 or less, more preferably 6.7 or less, still more preferably 6.5 the following. <14> The detergent composition described in any one of <1> to <13>, wherein the HLB of component B is 4.9 to 7.9, preferably 5.5 to 6.9, more preferably 6 or more and 6.7 or less, and more preferably 6.15 or more and 6.5 or less. <15> The detergent composition according to any one of <1> to <14>, wherein the critical microcellular concentration (CMC) of component B is preferably at least 0.00001% by mass, more preferably at least 0.00005% by mass , and more preferably at least 0.0001% by mass. <16> The detergent composition according to any one of <1> to <15>, wherein the critical microcellular concentration (CMC) of component B is preferably at most 0.1% by mass, more preferably at most 0.05% by mass , and more preferably 0.01% by mass or less. <17> The detergent composition as described in any one of <1> to <16>, wherein the critical microcellular concentration (CMC) of component B is preferably at least 0.00001% by mass and at most 0.1% by mass, more preferably at most 0.1% by mass It is 0.00005 mass % or more and 0.05 mass % or less, More preferably, it is 0.0001 mass % or more and 0.01 mass % or less. <18> The detergent composition as described in any one of <1> to <17>, wherein the content of component A when the detergent composition is used is preferably at least 0.1% by mass, more preferably 0.3% by mass mass % or more, and more preferably 0.5 mass % or more. <19> The detergent composition according to any one of <1> to <18>, wherein the content of component A when the detergent composition is used is preferably 15% by mass or less, more preferably 10% by mass. mass % or less, more preferably 7.5 mass % or less. <20> The detergent composition as described in any one of <1> to <19>, wherein the content of component A when the detergent composition is used is preferably at least 0.1% by mass and at most 15% by mass , more preferably not less than 0.3% by mass and not more than 10% by mass, still more preferably not less than 0.5% by mass and not more than 7.5% by mass. <21> The detergent composition according to any one of <1> to <20>, wherein the content of component B in the detergent composition is preferably at least 0.0001% by mass, more preferably 0.001% by mass. % by mass or more, more preferably at least 0.01 mass %, still more preferably at least 0.1 mass %. <22> The detergent composition as described in any one of <1> to <21>, wherein the content of component B when the detergent composition is used is preferably 10% by mass or less, more preferably 3 Mass % or less, More preferably, it is 2 mass % or less, More preferably, it is 1.2 mass % or less. <23> The detergent composition as described in any one of <1> to <22>, wherein the content of component B when the detergent composition is used is preferably 0.0001% by mass or more and 10% by mass or less , more preferably at least 0.001 mass % and at most 10 mass %, more preferably at least 0.01 mass % and at most 10 mass %, still more preferably at least 0.1 mass % and at most 10 mass %, still more preferably at least 0.1 mass % And 3 mass % or less, More preferably, it is 0.1 mass % or more and 2 mass % or less, More preferably, it is 0.1 mass % or more and 1.2 mass % or less. <24> The detergent composition according to any one of <1> to <23>, wherein the content of component A when the detergent composition is used is 0.1% by mass to 15% by mass, and Content of the component B at the time of use of a detergent composition is 0.0001 mass % or more and 10 mass % or less. <25> The detergent composition according to any one of <1> to <24>, wherein the mass ratio (A/B) of component A to component B is preferably at least 0.3, more preferably at least 0.4 , and more preferably 0.5 or more. <26> The detergent composition according to any one of <1> to <25>, wherein the mass ratio (A/B) of component A to component B is preferably 50,000 or less, more preferably 1,000 or less , and more preferably 100 or less, and still more preferably 80 or less. <27> The detergent composition as described in any one of <1> to <26>, wherein the mass ratio (A/B) of component A to component B is preferably 0.3 or more and 50000 or less, more preferably It is 0.4 or more and 1000 or less, more preferably 0.5 or more and 100 or less, still more preferably 0.5 or more and 80 or less. <28> The detergent composition as described in any one of <1> to <27>, wherein the content of component C when the detergent composition is used is preferably at least 84% by mass, more preferably 85% by mass % by mass or more, more preferably at least 90% by mass, even more preferably at least 95% by mass. <29> The detergent composition as described in any one of <1> to <28>, wherein the content of component C when the detergent composition is used is preferably at most 99.5% by mass, more preferably 99.4% by mass Mass% or less. <30> The detergent composition as described in any one of <1> to <29>, wherein the content of component C when the detergent composition is used is preferably at least 84% by mass and at most 99.5% by mass , more preferably 85% by mass to 99.5% by mass, more preferably 90% by mass to 99.4% by mass, still more preferably 95% by mass to 99.4% by mass. <31> The cleaning composition according to any one of <1> to <30>, wherein the total organic content of the cleaning composition is preferably 10% by mass or less, more preferably 3 Mass % or less, More preferably, it is 2 mass % or less, More preferably, it is 1 mass % or less, Still more preferably, it is 0.5 mass % or less. <32> The cleaning composition as described in any one of <1> to <31>, wherein the total content of organic matter in use of the cleaning composition is preferably at least 0.0001% by mass, more preferably 0.01% by mass % by mass or more, and more preferably at least 0.1% by mass. <33> The cleaning composition as described in any one of <1> to <32>, wherein the total content of organic matter in use of the cleaning composition is preferably at least 0.0001% by mass and at most 10% by mass , more preferably at least 0.01 mass % and at most 3 mass %, more preferably at least 0.01 mass % and at most 2 mass %, still more preferably at least 0.01 mass % and at most 1 mass %, still more preferably at least 0.1 mass % And 0.5% by mass or less. <34> The cleaning composition according to any one of <1> to <33>, which does not substantially contain nitrogen-containing compounds and phosphorus-containing compounds. <35> The detergent composition according to any one of <1> to <34>, wherein the total content of nitrogen-containing compounds and phosphorus-containing compounds in the detergent composition is preferably 0.05% by mass or less, More preferably, it is 0.01 mass % or less, More preferably, it is 0 mass %. <36> The cleaning composition according to any one of <1> to <35>, wherein the resin mask is a negative dry film resist subjected to at least one of exposure and development. <37> A method for removing a resin mask, comprising the step of cleaning the object to be cleaned to which the resin mask is attached using the cleaning composition described in any one of <1> to <36>. <38> The removal method as described in <37>, wherein the object to be cleaned is an intermediate in the manufacture of electronic parts. <39> A method of manufacturing an electronic component, comprising the step of cleaning an object to be cleaned with a resin mask attached thereto using the detergent composition described in any one of <1> to <36>. <40> Use of the detergent composition according to any one of <1> to <36> for the manufacture of electronic parts. <41> A set, which is used in any one of the removal method described in <37> or <38> and the method of manufacturing electronic parts described in <39>, and is constituted as in <1> to <36 >Among components A to C of the detergent composition described in any one of them, the set contains the first liquid containing component A and the second liquid containing component B in a state that they are not mixed with each other, and the first At least one of the liquid and the second liquid further contains component C. Example

Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited by these examples.

1. Preparation of the cleaning composition of Examples 1-19 and Comparative Examples 1-14 In a 100 mL glass beaker, 4.00 g of sodium hydroxide (component A), 1.00 g of polyethylene glycol (9) lauryl ether (component B), and 95.00 g of water (component C) were prepared in terms of active ingredients. Stir to mix uniformly, thereby preparing the detergent composition of Example 1. In addition, by the same method as in Example 1, when ingredients other than components A to C were contained, they were also formulated at the same time, and Examples 2 to 19 were prepared at the composition ratio to become the effective amount shown in Table 1. And the detergent compositions of Comparative Examples 1-14. Table 1 shows the content (mass %, effective amount) of each component of each detergent composition.

As a component of the cleaning composition of Examples 1-19 and Comparative Examples 1-14, the following components were used. Sodium hydroxide (ingredient A) [manufactured in Kanto Chemical Co., Ltd., deer special grade, solid content 48% by mass] Potassium hydroxide (ingredient A) [manufactured in Kanto Chemical Co., Ltd., deer special grade, solid content 48% by mass] Tetramethylammonium hydroxide (non-ingredient A) [manufactured by Showa Denko Co., Ltd., TMAH (25%)] B1: Polyethylene glycol (9) lauryl ether (ingredient B) [manufactured by Aoki Oil Industry Co., Ltd., BLAUNON EL-1509P] B3: Polyethylene glycol (6) 2-ethylhexyl ether (component B) [manufactured by Aoki Oil Industry Co., Ltd., BLAUNON EH-6] B4: Polyethylene glycol (7) decyl ether (ingredient B) [manufactured by Aoki Oil Industry Co., Ltd., FINESURF D-1370] B5: Polyethylene glycol (8.5) isodecyl ether (component B) [manufactured by Aoki Oil Industry Co., Ltd., FINESURF D-85] B6: Polyethylene glycol (10) tridecyl ether (component B) [manufactured by Aoki Oil Industry Co., Ltd., FINESURF TD-100] B8: polyethylene glycol (9) decyl (Guerbet, Guerbet) ether (component B) [manufactured by BASF, Lutensol XL90] B9: Pentaethylene glycol monocaprylyl ether (component B) [manufactured by Sigma-Aldrich] B10: Polyethylene glycol (12) alkyl (mixture of secondary dodecyl and secondary tetradecyl) ether (ingredient B) [manufactured by Nippon Shokubai Co., Ltd., SOFTANOL 120] B11: Triethylene glycol monobutyl ether (not component B) [manufactured by Nippon Emulsifier Co., Ltd., Butyl Tri Glycol (BTG)] B12: Polyethylene glycol (3) lauryl ether (non-ingredient B) [manufactured by Aoki Oil Industry Co., Ltd., BLAUNON EL-1503P] B13: Macrogol (5) lauryl ether (non-ingredient B) [manufactured by Aoki Oil Industry Co., Ltd., BLAUNON EL-1505] B14: Macrogol (40) lauryl ether (non-ingredient B) [manufactured by Aoki Oil Industry Co., Ltd., BLAUNON EL-1540P] B15: Polyethylene glycol (7) oil ether (not component B) [manufactured by Aoki Oil Industry Co., Ltd., BLAUNON EN-1507] B16: Polyethylene glycol (4) 2-ethylhexyl ether (non-ingredient B) [manufactured by Aoki Oil Industry Co., Ltd., BLAUNON EH-4] Benzotriazole [manufactured by Tokyo Chemical Industry Co., Ltd., 1,2,3-benzotriazole] 2-Ethylhexanoic acid [manufactured by Tokyo Chemical Industry Co., Ltd.] Hydroxylamine [manufactured by Wako Pure Chemical Industries, Ltd., 50% hydroxylamine solution] Water (component C) [Pure water below 1 μS/cm produced by the pure water device G-10DSTSET manufactured by Organo Co., Ltd.] In addition, the numerical value in () in a compound name shows the average addition mole number.

Synthesis Example 1 (Surfactant B2 (Component B)) Hexaethylene glycol mono-2-ethylhexyl ether (1 mole, "BLAUNON EH-6" manufactured by Aoki Oil Industry Co., Ltd.) and a catalytic amount of hydrogen Potassium oxide (manufactured by Nacalai Tesque Co., Ltd.) was placed in an autoclave, replaced with nitrogen, and then dehydrated under reduced pressure to reduce the moisture in the system to 0.2% or less, and added ethylene oxide at 160°C and 0.3 MPa or less Alkane (2 moles) and matured to obtain EO adduct (surfactant B2). If the obtained surfactant B2 is represented by formula (I), R ¹ : 2-ethylhexyl, n: 8, m: 0.

Synthesis Example 2 (Surfactant B7 (Component B)) Lauryl alcohol (0.7 mol, "Kalcol 2098", manufactured by Kao Co., Ltd.), myristyl alcohol (0.3 mol, "Kalcol 4098", manufactured by Kao Co., Ltd.) , and a catalyst amount of potassium hydroxide (manufactured by Nacalai Tesque Co., Ltd.) were put into the autoclave. Below MPa, ethylene oxide (5 mol) is added and matured to obtain the EO adduct. Then add propylene oxide (1.5 mol) at 125°C and below 0.3 MPa and mature to obtain EO-PO adduct. Furthermore, ethylene oxide (5 mol) was added and matured at 160° C. and 0.3 MPa or lower to obtain an EO-PO-EO adduct (surfactant B7). If the obtained surfactant B7 is represented by formula (I), R ¹ : dodecyl or tetradecyl, n: 10, m: 1.5.

Synthesis example 3 (surfactant B17 (non-ingredient B)) polyethylene glycol (9) alkyl (secondary lauryl and secondary tetradecyl mixed) ether (1 mole, "SOFTANOL 90" Nippon Shokubai Co., Ltd.) and potassium hydroxide (manufactured by Nacalai Tesque Co., Ltd.) in the amount of catalyst were put into the autoclave, and after nitrogen replacement, dehydration was carried out under reduced pressure, so that the moisture in the system became 0.2%. Thereafter, propylene oxide (5 mol) was added and aged at 125° C. and 0.3 MPa or less to obtain an EO-PO adduct (surfactant B17). If the obtained surfactant B17 is represented by formula (I), then R ¹ : dodecyl or tetradecyl, n: 9, m: 5.

Synthesis Example 4 (Surfactant B18 (non-component B)) Put octanol (1 mole, "Kalcol 0898" manufactured by Kao Co., Ltd.) and potassium hydroxide (manufactured by Nacalai Tesque Co., Ltd.) in a catalytic amount into After nitrogen replacement in an autoclave, dehydration is carried out under reduced pressure to reduce the moisture in the system to 0.2% or less, then add propylene oxide (3 moles) at 125°C and 0.3 MPa or less, and mature to obtain PO addition body (surfactant B18). If the obtained surfactant B18 is represented by formula (I), R ¹ : octyl, n: 0, m: 3.

Synthesis Example 5 (Surfactant B19 (non-component B)) Lauryl alcohol (0.7 mol, "Kalcol 2098" manufactured by Kao Co., Ltd.), myristyl alcohol (0.3 mol, "Kalcol 4098" manufactured by Kao Co., Ltd. ), and a catalytic amount of potassium hydroxide (manufactured by Nacalai Tesque Co., Ltd.) were put into the autoclave, and after nitrogen replacement, dehydration was carried out under reduced pressure so that the moisture in the system was below 0.2%. Add propylene oxide (5 moles) below 0.3 MPa and mature to obtain PO adduct (surfactant B19). If the obtained surfactant B19 is represented by formula (I), then R ¹ : dodecyl or tetradecyl, n: 0, m: 5.

2. Evaluation of detergent composition The resin mask removability of the prepared detergent compositions of Examples 1-19 and Comparative Examples 1-14 was evaluated.

[Preparation of samples] A photosensitive film for direct imaging (direct writing) (manufactured by Hitachi Chemical Co., Ltd.) was laminated on the surface of a glass epoxy multilayer substrate (manufactured by Hitachi Chemical Co., Ltd., MCL-E-679FG) under the following conditions , Photec RD-1225, negative dry film resist), after selectively performing exposure treatment to harden the exposed part (exposure step), remove the unexposed part by performing development treatment (development step), and obtain a The substrate of the resist pattern (the negative resin mask of the following 5 pattern shapes). Then, a copper plating treatment was performed on the region where the unexposed portion was removed by the above-mentioned development treatment, whereby a sample (4 cm×4.5 cm) was obtained. (1) Lamination: Use a cleaning roller (manufactured by RAYON INDUSTRIAL Co., Ltd., RY-505Z) and a vacuum applicator (manufactured by Rohm and Haas, VA7024/HP5) at a roller temperature of 50°C, a roller pressure of 1.4 Bar, and a treatment time of 30 seconds for lamination. (2) Exposure: Exposure was performed at an exposure amount of 15 mJ/cm ² using a direct writing device for printed substrates (manufactured by SCREEN Graphic and Precision Solutions Co., Ltd., Mercurex LI-9500). (3) Pattern shape: 5 of the following patterns Full pattern (full coating): Partial striped pattern with an area of 30 μm×30 μm or more 1: Ratio of line width L to line spacing S (L/S) Stripe pattern = 30 μm/30 μm Stripe pattern 2: L/S = 25 μm/25 μm Stripe pattern Stripe pattern 3: L/S = 20 μm/20 μm Stripe pattern Stripe pattern 4 : Striped pattern of L/S=15 μm/15 μm (4) Development: Use a developing device for the substrate (manufactured by Yangbo Technology Co., Ltd., LT-980366) and 1% sodium carbonate aqueous solution at 30°C to spray The resin mask of the unexposed part was removed under the conditions of pressure 0.2 MPa and 47 seconds.

8 mm×25 mm)以轉數300 rpm進行了攪拌，於該狀態下將試樣浸漬3分鐘。並且，將試樣浸漬於在100 mL玻璃燒杯中添加有水100 g之漂洗槽漂洗後，進行自然乾燥。[Cleaning Test 1] Add 100 g of each detergent composition of Examples 1 to 19 and Comparative Examples 1 to 14 to a 100 mL glass beaker, heat to 50°C, and use a rotor (fluororesin (PTFE, polytetra-fluoroethylene , polytetrafluoroethylene),

8 mm×25 mm) was stirred at a rotation speed of 300 rpm, and the sample was immersed in this state for 3 minutes. Then, the sample was immersed in a rinsing tank in which 100 g of water was added to a 100 mL glass beaker, rinsed, and then naturally dried.

[Washing test 2] 100 g of each detergent composition of Examples 1 to 19 and Comparative Examples 1 to 14 was added to a 100 mL glass beaker, heated to 30° C., and the sample was immersed without stirring or shaking.

[Resin mask removability evaluation 1 (peelability)] Using an optical microscope "Digital Microscope VHX-2000" (manufactured by Keyence Co., Ltd.), magnify 300 times and visually confirm the presence or absence of resin mask remaining on each part of the sample after washing test 1, thereby evaluating resin masking. Hood removal. The L/S values of the completely removed stripe patterns among the stripe patterns 1 to 4 were measured and evaluated according to the following evaluation criteria, and the results are shown in Table 1. ＜Evaluation criteria＞ 1: All striped patterns are completely peeled off 2: Striped patterns 1 to 3 are completely peeled off 3: Striped patterns 1 to 2 are completely peeled off 4: Only striped pattern 1 is completely peeled off 5: None of the striped patterns were peeled off

[Resin mask removability evaluation 2 (peeling time)] The cleaning test 2 was performed, and the time (second) until the pattern was completely coated (full coating) was peeled off from the sample was measured visually. The results are shown in Table 1.

[Table 1]

According to the results in Table 1, it can be seen that the detergent compositions of Examples 1-19 containing inorganic base (component A) and specific surfactant (component B) are compared with those without inorganic base (component A) or specific surfactant. The detergent compositions of Comparative Examples 1 to 14 of the surfactant (component B) were able to efficiently remove the resin mask. [Industrial availability]

By using the present invention, the resin mask can be efficiently removed without increasing the waste water treatment load. Therefore, the cleaning agent composition of the present invention is useful as a cleaning agent composition used in the manufacturing steps of electronic parts, and can realize the shortening of the cleaning steps of the electronic parts with the resin mask attached and the quality of the manufactured electronic parts. The improvement of performance and reliability can improve the productivity of semiconductor devices.

Claims (11)

A cleaning agent composition for resin mask stripping, which contains an inorganic base (component A), a surfactant (component B) represented by the following general formula (I) and water (component C), and the basis of component B is The HLB obtained by Weiss method is not less than 4.9 and not more than 7.9, and the content of component A when the detergent composition is used is not less than 0.1% by mass and not more than 15% by mass; R ¹ -O-(EO) _n (PO) _m -H (I) wherein, in formula (I), R ¹ represents an alkyl group selected from a straight chain or branched chain with 8 to 14 carbons and a straight or branched chain with 8 to 14 carbons. At least one alkenyl group, EO means ethoxyl group, n means the average addition mole number of EO and is a number between 5 and 12, PO means propoxyl group, m means the average addition mole number of PO number and is a number between 0 and 4. The detergent composition according to claim 1, wherein the content of component B when the detergent composition is used is not less than 0.0001% by mass and not more than 10% by mass. The detergent composition according to claim 1, wherein the content of component C when the detergent composition is used is 84% by mass or more and 99.5% by mass or less. The detergent composition according to any one of claims 1 to 3, wherein the total organic content of the detergent composition during use is 10% by mass or less. The detergent composition according to any one of claims 1 to 3, which substantially does not contain nitrogen-containing compounds substances and phosphorus compounds. The cleaning composition according to any one of claims 1 to 3, wherein the resin mask is a negative dry film resist subjected to at least one of exposure and development. A method for removing a resin mask, which includes the step of cleaning the object to be cleaned with the resin mask attached by using the cleaning composition according to any one of claims 1 to 6. The removal method as claimed in claim 7, wherein the object to be cleaned is an intermediate product for the manufacture of electronic parts. A method of manufacturing electronic parts, which includes the step of cleaning the object to be cleaned with a resin mask attached by using the cleaning composition according to any one of claims 1 to 6. A use of the detergent composition according to any one of Claims 1 to 6, which is used in the manufacture of electronic parts. A set, which is used in any one of the removal method according to claim 7 or 8 and the manufacturing method of electronic parts according to claim 9, and constitutes the cleaning composition according to any one of claims 1 to 6 Among the components A~C, the set contains the first liquid containing the component A and the second liquid containing the component B in a non-mixed state, and at least one of the first liquid and the second liquid further contains the component c.