TWI796226B - Electrical testing equipment and electrical testing method thereof - Google Patents
Electrical testing equipment and electrical testing method thereof Download PDFInfo
- Publication number
- TWI796226B TWI796226B TW111118276A TW111118276A TWI796226B TW I796226 B TWI796226 B TW I796226B TW 111118276 A TW111118276 A TW 111118276A TW 111118276 A TW111118276 A TW 111118276A TW I796226 B TWI796226 B TW I796226B
- Authority
- TW
- Taiwan
- Prior art keywords
- pressure sensing
- electrical testing
- testing device
- sensing element
- metal contact
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Emergency Protection Circuit Devices (AREA)
Abstract
Description
本發明是關於一種電性測試設備及相應的電性測試方法。The invention relates to an electrical testing device and a corresponding electrical testing method.
隨著現今科技的進步,不同的電子產品已成為人們生活中不可或缺的部分,因而也造就了一個龐大的消費市場。With the advancement of today's technology, different electronic products have become an indispensable part of people's life, thus creating a huge consumer market.
為了獲得消費者的青睞,電子產品的廠商除了紛紛投入資源,以研發及提升產品的效能及作業表現外,如何在品質控管方面加強把關,無疑也是廠商不能忽視的重要一環。In order to win the favor of consumers, manufacturers of electronic products not only invest resources in research and development and improve product performance and performance, but how to strengthen quality control is undoubtedly an important part that manufacturers cannot ignore.
本發明之目的之一在於提供一種電性測試設備,其能提高電性測試結果的可靠性。One of the objectives of the present invention is to provide an electrical testing device, which can improve the reliability of electrical testing results.
根據本發明的一實施方式,一種電性測試設備包含主體、第一軟性基板、第二軟性基板、複數個壓力感測元件以及複數個金屬接觸墊。第一軟性基板包含相對之第一表面以及第二表面。第二軟性基板包含相對之第三表面以及第四表面,第四表面連接主體。壓力感測元件分別連接於第二表面與第三表面之間。金屬接觸墊設置於第一表面並與壓力感測元件至少部分位置重疊,金屬接觸墊配置以抵接待測物。According to an embodiment of the present invention, an electrical testing device includes a main body, a first flexible substrate, a second flexible substrate, a plurality of pressure sensing elements, and a plurality of metal contact pads. The first flexible substrate includes opposite first surfaces and second surfaces. The second flexible substrate includes a third surface and a fourth surface opposite to each other, and the fourth surface is connected to the main body. The pressure sensing elements are respectively connected between the second surface and the third surface. The metal contact pad is arranged on the first surface and at least partially overlaps with the pressure sensing element, and the metal contact pad is configured to abut against the object to be tested.
在本發明一或多個實施方式中,上述之電性測試設備更包含支撐部以及軟性支撐元件。支撐部連接主體。軟性支撐元件連接於第四表面與支撐部之間,軟性支撐元件對齊壓力感測元件,並與主體彼此分離。In one or more embodiments of the present invention, the above-mentioned electrical testing equipment further includes a supporting portion and a flexible supporting element. The supporting part is connected to the main body. The soft support element is connected between the fourth surface and the supporting part, the soft support element is aligned with the pressure sensing element, and separated from the main body.
在本發明一或多個實施方式中,上述之壓力感測元件為電阻式壓力感測元件。In one or more embodiments of the present invention, the pressure sensing element mentioned above is a resistive pressure sensing element.
在本發明一或多個實施方式中,上述之壓力感測元件為電容式壓力感測元件。In one or more embodiments of the present invention, the pressure sensing element mentioned above is a capacitive pressure sensing element.
在本發明一或多個實施方式中,上述之電性測試設備更包含黏著材料。黏著材料連接於第二表面與第三表面之間,並至少部分圍繞壓力感測元件。In one or more embodiments of the present invention, the above-mentioned electrical testing device further includes an adhesive material. The adhesive material is connected between the second surface and the third surface and at least partially surrounds the pressure sensing element.
在本發明一或多個實施方式中,上述之電性測試設備更包含複數個第一線路以及複數個第二線路。第一線路設置於第二表面,並分別電性連接對應之壓力感測元件。第二線路設置於第三表面,並分別電性連接對應之壓力感測元件。In one or more embodiments of the present invention, the above electrical testing equipment further includes a plurality of first circuits and a plurality of second circuits. The first circuit is arranged on the second surface, and is electrically connected to the corresponding pressure sensing element respectively. The second circuit is arranged on the third surface, and is electrically connected to the corresponding pressure sensing element respectively.
在本發明一或多個實施方式中,上述之電性測試設備更包含第一保護層以及第二保護層。第一線路至少部分位於第一保護層與第二表面之間。第二線路至少部分位於第二保護層與第三表面之間。In one or more embodiments of the present invention, the above-mentioned electrical testing equipment further includes a first protection layer and a second protection layer. The first circuit is at least partially located between the first protection layer and the second surface. The second circuit is at least partially located between the second protection layer and the third surface.
在本發明一或多個實施方式中,上述之第二線路彼此連接。In one or more embodiments of the present invention, the above-mentioned second lines are connected to each other.
在本發明一或多個實施方式中,上述之電性測試設備更包含複數個第三線路以及第三保護層。第三線路設置於第一表面,並分別電性連接對應之金屬接觸墊。第三線路至少部分位於第三保護層與第一表面之間。In one or more embodiments of the present invention, the above-mentioned electrical testing equipment further includes a plurality of third lines and a third protection layer. The third circuit is disposed on the first surface and electrically connected to the corresponding metal contact pads respectively. The third line is at least partially located between the third protection layer and the first surface.
在本發明一或多個實施方式中,上述之壓力感測元件包含第一子壓力感測元件以及第二子壓力感測元件。第一子壓力感測元件連接第二表面。第二子壓力感測元件連接第三表面,並對齊第一子壓力感測元件,第一子壓力感測元件與第二子壓力感測元件之間定義間隙。In one or more embodiments of the present invention, the above-mentioned pressure sensing element includes a first sub-pressure sensing element and a second sub-pressure sensing element. The first sub-pressure sensing element is connected to the second surface. The second sub-pressure sensing element is connected to the third surface and aligned with the first sub-pressure sensing element, and a gap is defined between the first sub-pressure sensing element and the second sub-pressure sensing element.
在本發明一或多個實施方式中,上述之電性測試設備更包含複數個第一線路以及複數個第二線路。第一線路設置於第二表面,並分別電性連接對應之壓力感測元件。第二線路設置於第二表面,並分別電性連接對應之壓力感測元件,第二線路與第一線路彼此分離。In one or more embodiments of the present invention, the above electrical testing equipment further includes a plurality of first circuits and a plurality of second circuits. The first circuit is arranged on the second surface, and is electrically connected to the corresponding pressure sensing element respectively. The second circuit is arranged on the second surface and is electrically connected to the corresponding pressure sensing element, and the second circuit is separated from the first circuit.
在本發明一或多個實施方式中,上述之電性測試設備更包含第一保護層。第一線路及第二線路至少部分位於第一保護層與第二表面之間。In one or more embodiments of the present invention, the above-mentioned electrical testing equipment further includes a first protective layer. The first circuit and the second circuit are at least partially located between the first protection layer and the second surface.
在本發明一或多個實施方式中,上述之第二線路彼此連接。In one or more embodiments of the present invention, the above-mentioned second lines are connected to each other.
在本發明一或多個實施方式中,上述之電性測試設備更包含導電層。導電層設置於第三表面與壓力感測元件之間。In one or more embodiments of the present invention, the above electrical testing device further includes a conductive layer. The conductive layer is disposed between the third surface and the pressure sensing element.
根據本發明的一實施方式,一種電性測試設備包含主體、支撐部、軟性基板、複數個感應金屬墊、軟性支撐元件以及複數個金屬接觸墊。支撐部連接主體。軟性基板包含相對之第一表面以及第二表面,第二表面連接主體。感應金屬墊連接於第二表面,並與主體彼此分離。軟性支撐元件連接於感應金屬墊與支撐部之間,且軟性支撐元件與主體彼此分離。金屬接觸墊設置於第一表面並與感應金屬墊至少部分位置重疊,金屬接觸墊配置以抵接待測物。According to an embodiment of the present invention, an electrical testing device includes a main body, a supporting portion, a flexible substrate, a plurality of sensing metal pads, a flexible supporting element, and a plurality of metal contact pads. The supporting part is connected to the main body. The flexible substrate includes opposite first surfaces and second surfaces, and the second surfaces are connected to the main body. The sensing metal pad is connected to the second surface and separated from the main body. The soft support element is connected between the induction metal pad and the support part, and the soft support element is separated from the main body. The metal contact pad is arranged on the first surface and at least partially overlaps with the sensing metal pad, and the metal contact pad is configured to abut against the object to be tested.
在本發明一或多個實施方式中,上述之電性測試設備更包含複數個第一線路。第一線路設置於第二表面,並分別電性連接對應之感應金屬墊。In one or more embodiments of the present invention, the above electrical testing equipment further includes a plurality of first circuits. The first circuit is disposed on the second surface and electrically connected to the corresponding sensing metal pads respectively.
在本發明一或多個實施方式中,上述之電性測試設備更包含複數個第二線路以及保護層。第二線路設置於第一表面,並分別電性連接對應之金屬接觸墊。第二線路至少部分位於保護層與第一表面之間。In one or more embodiments of the present invention, the above-mentioned electrical testing equipment further includes a plurality of second circuits and a protective layer. The second circuit is disposed on the first surface and electrically connected to the corresponding metal contact pads respectively. The second circuit is at least partially located between the protection layer and the first surface.
本發明之目的之一在於提供一種電性測試方法,其能提高電性測試結果的可靠性。One of the objectives of the present invention is to provide an electrical testing method, which can improve the reliability of electrical testing results.
根據本發明的一實施方式,一種電性測試方法包含:以複數個金屬接觸墊沿作業方向抵接待測物;以及分別感測金屬接觸墊於抵接待測物時沿作業方向所承受之反作用力。According to an embodiment of the present invention, an electrical testing method includes: contacting the object under test with a plurality of metal contact pads along the working direction; and respectively sensing the reaction force borne by the metal contact pads along the working direction when contacting the object under test .
在本發明一或多個實施方式中,上述之感測反作用力之步驟更包含:以電阻式壓力感測元件通過電阻變化而得出反作用力。In one or more embodiments of the present invention, the step of sensing the reaction force further includes: using a resistive pressure sensing element to obtain the reaction force through resistance changes.
在本發明一或多個實施方式中,上述之感測反作用力之步驟更包含:以電容式壓力感測元件通過電容變化而得出反作用力。In one or more embodiments of the present invention, the above-mentioned step of sensing the reaction force further includes: using a capacitive pressure sensing element to obtain the reaction force through capacitance changes.
本發明上述實施方式至少具有以下優點:由於壓力感測元件可分別感測對應之金屬接觸墊於抵接待測物上不同的導電部時所承受之反作用力的大小,因此,根據壓力感測元件所感測出反作用力的大小,使用者可簡單容易地得知個別的金屬接觸墊與待測物在進行電性測試時是否處於良好的接觸狀態,以提高電性測試結果的可靠性。The above-mentioned embodiment of the present invention has at least the following advantages: since the pressure sensing element can respectively sense the magnitude of the reaction force that the corresponding metal contact pad bears when abutting against different conductive parts on the object to be tested, therefore, according to the pressure sensing element The magnitude of the sensed reaction force allows the user to simply and easily know whether the individual metal contact pads and the object under test are in a good contact state during the electrical test, so as to improve the reliability of the electrical test results.
以下將以圖式揭露本發明之複數個實施方式,為明確說明起見,許多實務上的細節將在以下敘述中一併說明。然而,應瞭解到,這些實務上的細節不應用以限制本發明。也就是說,在本發明部分實施方式中,這些實務上的細節是非必要的。此外,為簡化圖式起見,一些習知慣用的結構與元件在圖式中將以簡單示意的方式繪示之,而在所有圖式中,相同的標號將用於表示相同或相似的元件。且若實施上為可能,不同實施例的特徵係可以交互應用。Several embodiments of the present invention will be disclosed in the following figures. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some commonly used structures and elements will be shown in a simple schematic way in the drawings, and in all the drawings, the same reference numerals will be used to represent the same or similar elements . And if possible in practice, the features of different embodiments can be used interchangeably.
除非另有定義,本文所使用的所有詞彙(包括技術和科學術語)具有其通常的意涵,其意涵係能夠被熟悉此領域者所理解。更進一步的說,上述之詞彙在普遍常用之字典中之定義,在本說明書的內容中應被解讀為與本發明相關領域一致的意涵。除非有特別明確定義,這些詞彙將不被解釋為理想化的或過於正式的意涵。Unless otherwise defined, all terms (including technical and scientific terms) used herein have their ordinary meanings that can be understood by those skilled in the art. Furthermore, the definitions of the above-mentioned words in the commonly used dictionaries should be interpreted in the content of this specification as meanings consistent with the relevant fields of the present invention. Unless specifically defined, these terms are not to be interpreted in an idealized or overly formal sense.
請參照第1~2圖。第1圖為繪示依照本發明一實施方式之電性測試設備100的側視剖面圖。第2圖為繪示第1圖沿線段A-A的剖面圖。在本實施方式中,如第1~2圖所示,電性測試設備100包含主體110、第一軟性基板120、第二軟性基板130、複數個壓力感測元件140以及複數個金屬接觸墊150。第一軟性基板120包含相對之第一表面121以及第二表面122。第二軟性基板130包含相對之第三表面131以及第四表面132,第四表面132連接主體110。壓力感測元件140分別連接於第一軟性基板120的第二表面122與第二軟性基板130的第三表面131之間。金屬接觸墊150設置於第一軟性基板120的第一表面121,且金屬接觸墊150與壓力感測元件140位置重疊。再者,金屬接觸墊150配置以抵接待測物200。舉例而言,如第2圖所示,金屬接觸墊150與壓力感測元件140的數量彼此相同,但本發明並不以此為限。根據實際狀況,在其他實施方式中,金屬接觸墊150與壓力感測元件140的數量則不一定相同。具體而言,金屬接觸墊150分別抵接待測物200上不同的導電部210。舉例而言,待測物200可為發光二極體(light-emitting diode;LED)顯示器,但本發明並不以此為限。Please refer to Figures 1 and 2. FIG. 1 is a side cross-sectional view illustrating an
在實務的應用中,當操作電性測試設備100時,使用者使電性測試設備100沿作業方向DO朝向待測物200移動,並使金屬接觸墊150分別沿作業方向DO抵接待測物200上不同的導電部210,從而對待測物200進行電性測試。當金屬接觸墊150沿作業方向DO分別抵接待測物200上不同的導電部210時,金屬接觸墊150藉由壓向待測物200而分別對待測物200施加若干作用力,同時,待測物200則對個別的金屬接觸墊150產生與作用力方向相反但力度相同的反作用力。由於金屬接觸墊150分別位置區域對齊對應之壓力感測元件140,因此接觸區域的反作用力可使對應的壓力感測元件140受壓,而壓力感測元件140可根據受壓的程度而得出反作用力的大小。換句話說,壓力感測元件140可分別感測對應之金屬接觸墊150於抵接待測物200上不同的區域導電部210時所承受之反作用力的大小。如此一來,根據壓力感測元件140所感測出反作用力的大小,使用者可簡單容易地得知個別的金屬接觸墊150與待測物200在進行電性測試時是否處於良好的接觸狀態,以提高電性測試結果的可靠性。In practical applications, when operating the
進一步而言,如第1~2圖所示,電性測試設備100更包含支撐部160以及軟性支撐元件165。支撐部160連接主體110,而軟性支撐元件165連接於第二軟性基板130的第四表面132與支撐部160之間,且軟性支撐元件165對齊壓力感測元件140,並與主體110彼此分離。如此一來,當金屬接觸墊150承受反作用力時,反作用力會依序傳遞至第一軟性基板120、壓力感測元件140及第二軟性基板130,而支撐部160及軟性支撐元件165可對第二軟性基板130提供支撐,以使壓力感測元件140可通過受壓而準確感測反作用力的大小。由於軟性支撐元件165位於第二軟性基板130與支撐部160之間,因此可降低第二軟性基板130於抵壓軟性支撐元件165而被軟性支撐元件165支撐時造成刮損的機會。Furthermore, as shown in FIGS. 1-2 , the
在實務的應用中,壓力感測元件140可為電阻式壓力感測元件,其通過受壓時的電阻變化而得出反作用力。請參照第3圖。第3圖為繪示第1圖沿線段B-B的剖面圖。在本實施方式中,如第1~3圖所示,當壓力感測元件140為電阻式壓力感測元件時,電性測試設備100更包含黏著材料170。黏著材料170連接於第一軟性基板120的第二表面122與第二軟性基板130的第三表面131之間,並至少部分圍繞壓力感測元件140。In practical application, the
再者,如第1~3圖所示,電性測試設備100更包含複數個第一線路181。第一線路181設置於第一軟性基板120的第二表面122,並分別電性連接對應之壓力感測元件140。Moreover, as shown in FIGS. 1 to 3 , the
請參照第4圖。第4圖為繪示第1圖沿線段C-C的剖面圖。在本實施方式中,如第1~2、4圖所示,電性測試設備100更包含複數個第二線路182。第二線路182設置於第二軟性基板130的第三表面131,並分別電性連接對應之壓力感測元件140。Please refer to Figure 4. Figure 4 is a cross-sectional view along the line segment C-C in Figure 1. In this embodiment, as shown in FIGS. 1 to 2 and 4 , the
藉由第一線路181與第二線路182分別電性連接對應之壓力感測元件140,壓力感測元件140在受壓時的電阻變化可通過第一線路181與第二線路182傳送至處理器(圖未示),而處理器繼而可根據通過第一線路181與第二線路182傳送而來的訊號,計算出壓力感測元件140在受壓時所承受的反作用力的大小。換句話說,根據壓力感測元件140所感測出反作用力的大小,處理器便可判斷出個別的金屬接觸墊150與待測物200在進行電性測試時是否處於良好的接觸狀態,以提高電性測試結果的可靠性。By electrically connecting the corresponding
再者,如第1、3圖所示,電性測試設備100更包含第一保護層186,而第一線路181至少部分位於第一保護層186與第一軟性基板120的第二表面122之間。如此一來,第一保護層186可對第一線路181提供保護且絕緣,避免第一線路181刮傷受損與短路。Moreover, as shown in FIGS. 1 and 3 , the
相似地,如第1、4圖所示,電性測試設備100更包含第二保護層187,而第二線路182至少部分位於第二保護層187與第二軟性基板130的第三表面131之間。如此一來,第二保護層187可對第二線路182提供保護且絕緣,避免第二線路182刮傷受損與短路。Similarly, as shown in FIGS. 1 and 4 , the
再者,如第1~2圖所示,電性測試設備100更包含複數個第三線路183以及第三保護層188(第三保護層188請見第1圖)。第三線路183設置於第一軟性基板120的第一表面121,並分別電性連接對應之金屬接觸墊150,以讓金屬接觸墊150對待測物200進行電性測試並獲得電性測試的結果。第三線路183至少部分位於第三保護層188與第一軟性基板120的第一表面121之間,因此第三保護層188可對第三線路183提供保護且絕緣,避免第三線路183刮傷受損與短路。Moreover, as shown in FIGS. 1-2 , the
請參照第5圖。第5圖為繪示依照本發明另一實施方式之電性測試設備100的剖面圖,其中第二線路182彼此連接。在本實施方式中,如第5圖所示,設置於第二軟性基板130的第三表面131的第二線路182彼此連接,因此第二線路182的數量可以減少。Please refer to Figure 5. FIG. 5 is a cross-sectional view illustrating an
請參照第6圖。第6圖為繪示依照本發明再一實施方式之電性測試設備100的局部放大側視圖,其中壓力感測元件140包含第一子壓力感測元件141以及第二子壓力感測元件142。在本實施方式中,如第6圖所示,壓力感測元件140包含第一子壓力感測元件141以及第二子壓力感測元件142。第一子壓力感測元件141連接第一軟性基板120的第二表面122,第二子壓力感測元件142則連接第二軟性基板130的第三表面131,並對齊第一子壓力感測元件141,而第一子壓力感測元件141與第二子壓力感測元件142之間定義間隙G。當金屬接觸墊150承受從待測物200而來的反作用力時,第一子壓力感測元件141受到金屬接觸墊150及第一軟性基板120的推壓而朝向第二子壓力感測元件142移動,直至第一子壓力感測元件141接觸第二子壓力感測元件142而使間隙G消失。此時,第一子壓力感測元件141與第二子壓力感測元件142彼此電性連接。Please refer to Figure 6. FIG. 6 is a partially enlarged side view of an
請參照第7~8圖。第7圖為繪示依照本發明又一實施方式之電性測試設備100的局部放大側視圖,其中第一線路181與第二線路182皆設置於該第二表面122。第8圖為繪示第7圖沿線段D-D的剖面圖。在本實施方式中,如第7~8圖所示,第一線路181設置於第一軟性基板120的第二表面122,並分別電性連接對應之壓力感測元件140,而第二線路182亦設置於第一軟性基板120的第二表面122,並分別電性連接對應之壓力感測元件140,第二線路182與第一線路181彼此分離,亦即第二線路182與第一線路181並不直接接觸。Please refer to Figures 7-8. FIG. 7 is a partially enlarged side view of an
再者,如第7~8圖所示,電性測試設備100更包含第一保護層186。第一線路181及第二線路182至少部分位於第一保護層186與第二表面122之間。如此一來,第一保護層186可對第一線路181及第二線路182提供保護且絕緣,避免第一線路181及第二線路182刮傷受損與短路。Moreover, as shown in FIGS. 7-8 , the
請參照第9圖。第9圖為繪示依照本發明另一實施方式之電性測試設備100的剖面圖,其中第一線路181與第二線路182皆設置於該第二表面122,而第二線路182彼此連接。在本實施方式中,如第9圖所示,設置於第一軟性基板120的第二表面122的第二線路182彼此連接,因此第二線路182的數量可以減少。Please refer to Figure 9. FIG. 9 is a cross-sectional view illustrating an
請參照第10圖。第10圖為繪示依照本發明再一實施方式之電性測試設備100的局部放大側視圖,其中電性測試設備100更包含導電層190。在本實施方式中,如第10圖所示,當第一線路181與第二線路182皆設置於第一軟性基板120的第二表面122時,電性測試設備100更包含導電層190,而導電層190設置於第二軟性基板130的第三表面131與壓力感測元件140之間。Please refer to Figure 10. FIG. 10 is a partially enlarged side view of an
在實務的應用中,壓力感測元件140亦可為電容式壓力感測元件,其通過受壓時的電容變化而得出反作用力。請參照第11圖。第11圖為繪示依照本發明又一實施方式之電性測試設備100的局部放大側視圖,其中壓力感測元件140為電容式壓力感測元件。在本實施方式中,如第11圖所示,當壓力感測元件140為電容式壓力感測元件時,電性測試設備100並不包含上述的黏著材料170。In practical application, the
請參照第12~13圖。第12圖為繪示依照本發明另一實施方式之電性測試設備100的側視圖。第13圖為繪示第12圖沿線段E-E的剖面圖。在本實施方式中,如第12~13圖所示,電性測試設備100包含主體110、支撐部160、第一軟性基板120、複數個感應金屬墊143、軟性支撐元件165以及複數個金屬接觸墊150。支撐部160連接主體110。第一軟性基板120包含相對之第一表面121以及第二表面122,第二表面122連接主體110。感應金屬墊143連接於第一軟性基板120的第二表面122,並與主體110彼此分離。軟性支撐元件165連接於感應金屬墊143與支撐部160之間,且軟性支撐元件165與主體110彼此分離。金屬接觸墊150設置於第一軟性基板120的第一表面121並與感應金屬墊143至少部分位置重疊。舉例而言,如第13圖所示,金屬接觸墊150與感應金屬墊143的數量彼此相同,但本發明並不以此為限。根據實際狀況,在其他實施方式中,金屬接觸墊150與感應金屬墊143的數量則不一定相同。再者,金屬接觸墊150配置以抵接待測物200。具體而言,金屬接觸墊150分別抵接待測物200上不同的導電部210。Please refer to Figures 12-13. FIG. 12 is a side view illustrating an
再者,如第12~13圖所示,電性測試設備100更包含複數個第一線路181。第一線路181設置於第一軟性基板120的第二表面122,並分別連接對應之感應金屬墊143。具體而言,支撐部160使用可導電金屬材質並且接地,而軟性支撐元件165使用適當介電係數之軟性材料。當軟性支撐元件165受壓縮時,感應金屬墊143偵測與支撐部160間電容變化量,故感應金屬墊143實際上為電容式壓力感測元件。Furthermore, as shown in FIGS. 12-13 , the
進一步而言,如第12圖所示,電性測試設備100更包含複數個第三線路183以及第一保護層186。第三線路183設置於第一軟性基板120的第一表面121,並分別電性連接對應之金屬接觸墊150。第三線路183至少部分位於第一保護層186與第一軟性基板120的第一表面121之間。如此一來,第一保護層186可對第三線路183提供保護且絕緣,避免第三線路183刮傷受損與短路。Furthermore, as shown in FIG. 12 , the
綜上所述,本發明上述實施方式所揭露的技術方案至少具有以下優點:由於壓力感測元件可分別感測對應之金屬接觸墊於抵接待測物上不同的導電部時所承受之反作用力的大小,因此,根據壓力感測元件所感測出反作用力的大小,使用者可簡單容易地得知個別的金屬接觸墊與待測物在進行電性測試時是否處於良好的接觸狀態,以提高電性測試結果的可靠性。To sum up, the technical solutions disclosed in the above-mentioned embodiments of the present invention have at least the following advantages: since the pressure sensing element can respectively sense the reaction force that the corresponding metal contact pad bears when abutting against different conductive parts on the object under test Therefore, according to the magnitude of the reaction force sensed by the pressure sensing element, the user can simply and easily know whether the individual metal contact pad and the object under test are in a good contact state during the electrical test, so as to improve Reliability of electrical test results.
雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed above in terms of implementation, it is not intended to limit the present invention. Anyone skilled in this art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be defined by the appended patent application scope.
100:電性測試設備 110:主體 120:第一軟性基板 121:第一表面 122:第二表面 130:第二軟性基板 131:第三表面 132:第四表面 140:壓力感測元件 141:第一子壓力感測元件 142:第二子壓力感測元件 143:感應金屬墊 150:金屬接觸墊 160:支撐部 165:軟性支撐元件 170:黏著材料 181:第一線路 182:第二線路 183:第三線路 186:第一保護層 187:第二保護層 188:第三保護層 190:導電層 200:待測物 210:導電部 A-A,B-B,C-C,D-D,E-E:線段 DO:作業方向 G:間隙 100: Electrical testing equipment 110: subject 120: The first flexible substrate 121: first surface 122: second surface 130: Second flexible substrate 131: third surface 132: The fourth surface 140: pressure sensing element 141: the first sub-pressure sensing element 142: the second sub-pressure sensing element 143: induction metal pad 150: metal contact pad 160: support part 165: soft support element 170: Adhesive material 181: The first line 182: second line 183: The third line 186: The first protective layer 187: Second protective layer 188: The third protective layer 190: conductive layer 200: The object to be tested 210: conductive part A-A, B-B, C-C, D-D, E-E: line segment DO: direction of work G: Gap
第1圖為繪示依照本發明一實施方式之電性測試設備的側視剖面圖。 第2圖為繪示第1圖沿線段A-A的剖面圖。 第3圖為繪示第1圖沿線段B-B的剖面圖。 第4圖為繪示第1圖沿線段C-C的剖面圖。 第5圖為繪示依照本發明另一實施方式之電性測試設備的剖面圖,其中第二線路彼此連接。 第6圖為繪示依照本發明再一實施方式之電性測試設備的局部放大側視圖,其中壓力感測元件包含第一子壓力感測元件以及第二子壓力感測元件。 第7圖為繪示依照本發明又一實施方式之電性測試設備的局部放大側視圖,其中第一線路與第二線路皆設置於該第二表面。 第8圖為繪示第7圖沿線段D-D的剖面圖。 第9圖為繪示依照本發明另一實施方式之電性測試設備的剖面圖,其中第一線路與第二線路皆設置於該第二表面,而第二線路彼此連接。 第10圖為繪示依照本發明再一實施方式之電性測試設備的局部放大側視圖,其中電性測試設備更包含導電層。 第11圖為繪示依照本發明又一實施方式之電性測試設備的局部放大側視圖,其中壓力感測元件為電容式壓力感測元件。 第12圖為繪示依照本發明另一實施方式之電性測試設備的側視圖。 第13圖為繪示第12圖沿線段E-E的剖面圖。 FIG. 1 is a side sectional view illustrating an electrical testing device according to an embodiment of the present invention. Figure 2 is a cross-sectional view along line A-A in Figure 1. Fig. 3 is a cross-sectional view along line B-B in Fig. 1 . Figure 4 is a cross-sectional view along the line segment C-C in Figure 1. FIG. 5 is a cross-sectional view illustrating an electrical testing device according to another embodiment of the present invention, wherein the second lines are connected to each other. FIG. 6 is a partially enlarged side view of an electrical testing device according to yet another embodiment of the present invention, wherein the pressure sensing element includes a first sub-pressure sensing element and a second sub-pressure sensing element. FIG. 7 is a partial enlarged side view of an electrical testing device according to another embodiment of the present invention, wherein both the first circuit and the second circuit are disposed on the second surface. Fig. 8 is a cross-sectional view along line D-D in Fig. 7 . FIG. 9 is a cross-sectional view illustrating an electrical testing device according to another embodiment of the present invention, wherein both the first circuit and the second circuit are disposed on the second surface, and the second circuits are connected to each other. FIG. 10 is a partial enlarged side view of an electrical testing device according to yet another embodiment of the present invention, wherein the electrical testing device further includes a conductive layer. FIG. 11 is a partial enlarged side view of an electrical testing device according to another embodiment of the present invention, wherein the pressure sensing element is a capacitive pressure sensing element. Fig. 12 is a side view showing an electrical testing device according to another embodiment of the present invention. Figure 13 is a cross-sectional view along line E-E in Figure 12.
國內寄存資訊(請依寄存機構、日期、號碼順序註記) 無 國外寄存資訊(請依寄存國家、機構、日期、號碼順序註記) 無 Domestic deposit information (please note in order of depositor, date, and number) none Overseas storage information (please note in order of storage country, institution, date, and number) none
100:電性測試設備 100: Electrical testing equipment
110:主體 110: subject
120:第一軟性基板 120: The first flexible substrate
121:第一表面 121: first surface
122:第二表面 122: second surface
130:第二軟性基板 130: Second flexible substrate
131:第三表面 131: third surface
132:第四表面 132: The fourth surface
140:壓力感測元件 140: pressure sensing element
150:金屬接觸墊 150: metal contact pad
160:支撐部 160: support part
165:軟性支撐元件 165: soft support element
170:黏著材料 170: Adhesive material
181:第一線路 181: The first line
182:第二線路 182: second line
183:第三線路 183: The third line
186:第一保護層 186: The first protective layer
187:第二保護層 187: Second protective layer
188:第三保護層 188: The third protective layer
200:待測物 200: The object to be tested
210:導電部 210: conductive part
A-A,B-B,C-C:線段 A-A,B-B,C-C: line segment
DO:作業方向 DO: direction of work
Claims (18)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111118276A TWI796226B (en) | 2022-05-16 | 2022-05-16 | Electrical testing equipment and electrical testing method thereof |
CN202211237930.XA CN115542051A (en) | 2022-05-16 | 2022-10-10 | Electrical test equipment and electrical test method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW111118276A TWI796226B (en) | 2022-05-16 | 2022-05-16 | Electrical testing equipment and electrical testing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI796226B true TWI796226B (en) | 2023-03-11 |
TW202346890A TW202346890A (en) | 2023-12-01 |
Family
ID=84734114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW111118276A TWI796226B (en) | 2022-05-16 | 2022-05-16 | Electrical testing equipment and electrical testing method thereof |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN115542051A (en) |
TW (1) | TWI796226B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5357062A (en) * | 1993-01-28 | 1994-10-18 | Calcomp Inc. | Pressure sensing apparatus for digitizer pen tip |
CN1475783A (en) * | 2002-07-05 | 2004-02-18 | ������������ʽ���� | Resistance sensor |
CN205302226U (en) * | 2014-08-28 | 2016-06-08 | 苹果公司 | Electronic equipment with force transducer |
US20200003635A1 (en) * | 2017-03-08 | 2020-01-02 | Tohoku University | Pressure sensor device and method for manufacturing pressure sensor device |
-
2022
- 2022-05-16 TW TW111118276A patent/TWI796226B/en active
- 2022-10-10 CN CN202211237930.XA patent/CN115542051A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5357062A (en) * | 1993-01-28 | 1994-10-18 | Calcomp Inc. | Pressure sensing apparatus for digitizer pen tip |
CN1475783A (en) * | 2002-07-05 | 2004-02-18 | ������������ʽ���� | Resistance sensor |
US7064561B2 (en) * | 2002-07-05 | 2006-06-20 | Nitta Corporation | Resistance type sensor |
CN205302226U (en) * | 2014-08-28 | 2016-06-08 | 苹果公司 | Electronic equipment with force transducer |
US20200003635A1 (en) * | 2017-03-08 | 2020-01-02 | Tohoku University | Pressure sensor device and method for manufacturing pressure sensor device |
Also Published As
Publication number | Publication date |
---|---|
CN115542051A (en) | 2022-12-30 |
TW202346890A (en) | 2023-12-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102012771B (en) | Sensor device and information processing device | |
TWI607356B (en) | A three-dimensional touch control device | |
JP3197776B2 (en) | Stress sensitive transducer and method of mounting the same | |
US8816970B2 (en) | Touch panel, touch display panel, and touch sensing method | |
US20160062517A1 (en) | Multi-Layer Transparent Force Sensor | |
CN114237415A (en) | Touch display device, stylus pen and detection method of stylus pen | |
TWI545472B (en) | Pressure detecting unit and information input device having pressure detecting unit | |
US20170242518A1 (en) | Touch display panel and touch display device | |
US20110057905A1 (en) | Touch Panel and Inspection Method Thereof | |
US11733109B2 (en) | Force sensor and manufacturing method thereof | |
CN107016328B (en) | Fingerprint identification device | |
JP2005508533A (en) | Force sensor and touch panel using the same | |
US20230189437A1 (en) | Flexible circuit package | |
US8322224B2 (en) | Pressure sensor with fixed deformable area | |
TWI796226B (en) | Electrical testing equipment and electrical testing method thereof | |
US11573668B2 (en) | Touch-sensing panel | |
US8714020B2 (en) | Pressure measurement member | |
TWI398808B (en) | Touch panel and detecting method of touch panel | |
US20200333937A1 (en) | Input device | |
CN111399681B (en) | Touch panel and electronic device | |
CN101661358A (en) | Electronic device | |
TWI537808B (en) | Touch sensing unit and method for fabricating the same | |
US7573277B2 (en) | Thin film probe card | |
TWM587744U (en) | Pressure sensing system | |
TWI695304B (en) | Pressure sensing system and setting method thereof |