TWI790530B - Manufacturing method of circuit module - Google Patents

Abstract

A circuit module includes a circuit board, an electronic component mounted on the circuit board and a bundled wire body. The binding wire body is wound on the electronic component, and the end is soldered and fixed on the circuit board, and is not electrically connected to the electronic component. With the arrangement of the binding wire body, the electronic component can be easily and effectively fixed on the circuit board, and the electronic component can be easily removed when necessary.

Description

Manufacturing method of circuit module

The invention relates to a circuit module and its manufacturing method, in particular to a circuit module for fixing electronic components on a circuit board by binding wires and its manufacturing method.

The current method of fixing electronic components such as capacitors on the circuit board is usually to fix the electronic components on the circuit board by dispensing glue or with a specific buckle structure. However, fixing the electronic components by dispensing will not be easy to replace or remove when the electronic components fail or need to be recycled because the glue is not easy to remove after curing. In addition, if the electronic components are fixed by the buckle structure, it is necessary to design corresponding buckle structures for electronic components with different specifications, and there is a problem of high development cost.

Therefore, one object of the present invention is to provide a circuit module capable of solving the aforementioned problems.

Therefore, in some embodiments of the present invention, the circuit module includes a circuit board, an electronic component mounted on the circuit board, and a bundled wire body. The binding wire body is wound on the electronic component, and the end is soldered and fixed on the circuit board, and is not electrically connected to the electronic component.

In some embodiments, the electronic component includes a cylindrical component body, the binding wire body includes a metal wire, and the metal wire has a bundle that is bound around the periphery of the component body in a ring shape section, and two fixed sections respectively connected to the two ends of the bundled section, the fixed sections are twisted into one strand, protrude from the main body of the component and are welded to the circuit board.

In some implementation aspects, the electronic component includes a cylindrical component body, the binding wire body includes two metal wires, each metal wire has a binding section bound around a part of the periphery of the component body, and two respectively The fixed sections connecting the two ends of the bundled section, each fixed section of one of the metal wires is twisted with a corresponding fixed section of the other of the metal wires respectively, and protrudes from the main body of the element and soldered to the circuit board.

In some embodiments, the wire core of the metal wire is made of metal, and has a surface coating covering the wire core as a welding molten metal.

In some implementation aspects, at least a part of the metal wire is flat, and the surface is textured.

In some embodiments, the fixed sections of each metal wire extend oppositely from two opposite sides of the component body, and then extend toward the circuit board to form an L shape.

Another object of the present invention is to provide a method for manufacturing a circuit module.

The manufacturing method of the circuit module of the present invention includes the following steps: (A) providing a circuit board, an electronic component and a bundled wire body, the bundled wire body includes at least one metal wire, and the metal wire has a bundled section and two fixed sections respectively connecting the two ends of the bundled section; (B) wrapping the bundled section of the metal wire around the electronic component so that the fixed sections of the metal wire protrude from the electronic component; and ( C) disposing the electronic component on the circuit board, and welding and fixing the fixing sections on the circuit board.

In some embodiments, the electronic component in step (A) includes a cylindrical component Main body; in step (B), the binding section is bound around the periphery of the element main body to form a ring shape, and the fixed sections are twisted into one strand; in step (C), the fixed sections are The ends are soldered to the circuit board.

In some embodiments, in step (B), the electronic component and the metal wire are placed on a bending roller, so that the metal wire is located between the electronic component and the bending roller, and the bending roller Move along a track around the periphery of the electronic component to press the bundled section of the metal wire against the periphery of the component body.

In some implementation aspects, in step (B), a clamping jaw clamps the ends of the fixing segments, and the rotation of the clamping jaw drives the fixing segments to twist into one strand.

In some embodiments, in step (A), the electronic component includes a cylindrical component body, and the bundled wire body includes two metal wires; in step (B), the bundled sections of the metal wires are bundled separately around part of the periphery of the element body, and twist each fixed section of one of the metal wires with a corresponding fixed section of the other of the metal wires respectively, so that the fixed sections are respectively protruding from the component body; in step (C), the ends of the fixing sections are soldered to the circuit board.

In some implementations, in step (B), the electronic component and the metal wires are placed on two bending rollers, so that the metal wires are respectively located on the opposite sides of the electronic component and between the bends Between the folding rollers and the electronic component, the bending rollers move along two opposite tracks around the periphery of the electronic component respectively, so as to press the bundled section of each metal wire against the wire wrapped around the main body of the component. part of the periphery, and let the fixed sections of the metal wires be adjacent to each other and correspondingly arranged.

In some implementations, in step (B), the end sections of the two corresponding fixed sections of the metal wires are respectively clamped by the two jaws, and the fixed sections are respectively driven by the rotation of the clamping jaws. wrapped around Twist into one strand.

In some embodiments, in the step (B), the two moving rollers respectively exert pressure on the intertwined fixed sections, so that the fixed sections are bent into an L-shape.

In some embodiments, in the step (A), at least a part of the metal wire is compressed by an embossing roller to be flattened and have textures formed on the surface.

The present invention has at least the following effects: through the setting of the binding wire body, the electronic component can be easily and effectively fixed on the circuit board, and the electronic component can be easily removed when necessary. In addition, using the binding wire body to fix the electronic component is applicable to electronic components of different specifications, which can save the cost of developing a buckle structure for electronic components of specific specifications.

100: circuit module

1: circuit board

2: Electronic components

21: Component body

22: pin

3: Bundle wire body

31: metal wire

311: bundle section

312: fixed section

91: Coil

92: clamping roller

93: Embossing roller

94: track

95: Bending Roller

96: Gripper

97: Move the roller

S1~S3: Process steps

Other features and functions of the present invention will be clearly presented in the implementation manner with reference to the drawings, wherein: Fig. 1 is a side view, illustrating the first embodiment of the circuit module of the present invention; Fig. 2 is the first embodiment Fig. 3 is a flow chart illustrating the process steps of making the circuit module; Fig. 4 to Fig. 8 are schematic diagrams illustrating the manufacturing process of the first embodiment; Fig. 9 is a side view illustrating the present invention The second embodiment of the circuit module; FIG. 10 is a front view of the second embodiment; FIG. 11 to FIG. 14 are schematic diagrams illustrating the manufacturing process of the second embodiment.

Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numerals.

Referring to FIG. 1 and FIG. 2 , it is a first embodiment of the circuit module 100 of the present invention. The circuit module 100 can be a part of any electronic device, and includes a circuit board 1 , an electronic component 2 and a bundled wire body 3 . In practice, the circuit module 100 usually has a plurality of electronic components 2 and a plurality of binding wires 3 , but a single one is used as an example in the subsequent description and drawings.

The circuit board 1 is, for example, a general rigid printed circuit board or a flexible circuit board, the type of which depends on actual needs. The electronic component 2 is, for example, an electrolytic capacitor or other electronic parts, and includes a cylindrical component body 21 and a plurality of pins 22 extending outward from the component body 21 and electrically connected to the circuit board 1 . The number of the pins 22 in this embodiment is, for example, two, and they are inserted and fixed on the circuit board 1 by means of paste-in-hole (PIH). In addition, the pins 22 can also be mounted on the circuit board 1 by surface-mount technology (SMT), which is not limited to a specific embodiment.

Referring to Fig. 1, Fig. 2 and Fig. 7, the binding wire body 3 is wound on the electronic component 2, and the end is welded and fixed to the circuit board 1, and does not form electrical conduction with the electronic component 2, which can be easily The electronic component 2 is perfectly fixed on the circuit board 1 in a manner. In detail, the binding wire body 3 includes a metal wire 31, the metal wire 31 has a binding section 311 that is annular around the periphery of the component body 21, and two The fixed section 312 at the end. The fixing sections 312 are twisted into a strand and protrude from the component body 21 , and are welded on the circuit board 1 at the ends, so as to provide the function of fixing the electronic component 2 . In a specific embodiment, the core of the metal wire 31 is made of metal, And it has the surface coating that wraps the wire core as the welding molten metal, so the surface coating can be directly used as the bonding material required for welding. In addition, in another specific embodiment, a part of the metal wire 31 (for example, the bundling section 311 ) or the whole is flat, and the surface is textured, so that the metal wire 31 is not easy to dislodge from the electronic component 2 Slip on.

Referring to FIG. 3 to FIG. 8 , the manufacturing method of the circuit module 100 will be described below.

Referring to FIG. 3 to FIG. 5 , firstly, in step S1 , the circuit board 1 , the electronic component 2 and the metal wire 31 of the binding wire body 3 are provided. The circuit board 1 and the electronic component 2 can be prepared in a general manner or can be selected as finished products. The metal wire 31 can be taken out by a wire roll 91 as shown in FIG. 4 , clamped and fixed by a clamping roller 92 , and then cut according to the required length. In addition, when necessary, the metal wire 31 can also be squeezed after being clamped by an embossing roller 93 as shown in FIG. texture.

Referring to Fig. 3, Fig. 6 to Fig. 8, then, in step S2, the binding section 311 of the metal wire 31 will be bound around the periphery of the electronic component 2 to form a ring, and the metal wire 31 will be The fixing section 312 protrudes from the electronic component 2 after being wound into a strand.

Specifically, the above steps are to place the electronic component 2 and the metal wire 31 on a bending roller 95 as shown in FIG. 6 , and let the metal wire 31 be located between the electronic component 2 and the bending roller 95 . Then, as shown in FIG. 7 , the bending roller 95 can be moved along a track 94 around the periphery of the electronic component 2 to press the bundled section 311 of the metal wire 31 against the periphery of the component body 21 . Then, as shown in Figure 8, the ends of these fixed sections 312 are clamped by a jaw 96, and the rotation of the jaws 96 drives these fixed sections 312 to be twisted into one strand, so that the automatic processing method is completed. The metal wire 31 of this binding wire body 3 is wrapped around Around the processing steps of the electronic component 2.

Finally, in step S3, the electronic component 2 can be placed on the circuit board 1, and the fixing sections 312 can be soldered and fixed on the circuit board 1 by over-board fixing or surface-mounting, and the circuit module 100 is completed. production process.

The above-mentioned processing method of fixing the electronic component 2 on the circuit board 1 through the metal wire 31 of the bundled wire body 3 is not only simple and convenient, but also can be applied to electronic components 2 of different shapes and specifications, and has a wide range of applications. It can effectively save the cost required for developing the buckle structure of electronic components 2 of various specifications. In addition, when the electronic component 2 needs to be replaced or removed, it is only necessary to re-melt the welding part of the binding wire body 3, and the binding wire body 3 can also be removed from the electronic component 2, which is convenient for the Replacement of electronic components 2.

Referring to FIG. 9 and FIG. 10 , it is a second embodiment of the circuit module 100 of the present invention. In the second embodiment, the electronic component 2 is also fixed by the binding wire body 3 , but the implementation manner of the binding wire body 3 is different from the first embodiment, which is described as follows.

In the second embodiment, the circuit module 100 includes a circuit board 1 , an electronic component 2 and a bundled wire body 3 . The implementation of the circuit board 1 and the electronic component 2 is the same as the first embodiment, but the binding wire body 3 of the second embodiment includes two metal wires 31 . Specifically, in the second embodiment, each metal wire 31 has a binding section 311 that wraps a part of the periphery of the component body 21 as shown in FIG. 12 , and two fixing sections 312 that connect the two ends of the binding section 311 respectively. Each of the fixed segments 312 of one of the metal wires 31 is twisted with a corresponding fixed segment 312 of the other of the metal wires 31 as shown in FIG. Soldered on the circuit board 1. Thus, by using the metal wires 31, the same The same can realize the function of fixing the electronic component 2.

More specifically, in the second embodiment, the binding section 311 of one of the metal wires 31 of the binding wire body 3 is bound around the upper half periphery of the electronic component 2, and the binding section 311 of the other metal wire 31 is Bundled around the lower half of the electronic component 2 , the fixing sections 312 of the metal wires 31 extend horizontally from two opposite sides of the component body 21 in opposite directions, and then vertically extend toward the circuit board 1 to form an L shape. In this way, the binding wire body 3 can be firmly wrapped around the electronic component 2 through the binding sections 311, and can be fixed to the circuit board through the fixing sections 312 through board fixing or surface adhesion. 1 on.

Referring to FIG. 3 , and FIG. 11 to FIG. 14 , the manufacturing method of the circuit module 100 of the second embodiment will be described below.

Referring to Fig. 3, the execution method of step S1 is roughly the same as that of the first embodiment, all of which are to provide the circuit board 1, the electronic component 2 and the bundled wire body 3, but the second embodiment needs to provide two metal wires in advance 31 as the main structure of the binding wire body 3.

Referring to Fig. 3, Fig. 11 ~ Fig. 14, in step S2, the binding section 311 of these metal wires 31 will be bound respectively around the part of the periphery of the element main body 21, and one of these metal wires 31 Each fixing section 312 is twisted with a corresponding fixing section 312 of the other one of the metal wires 31 respectively, so that the fixing sections 312 respectively protrude from the component main body 21 .

Specifically, step S2 of the second embodiment is to place the electronic component 2 and the metal wires 31 on two oppositely arranged bending rollers 95 as shown in FIG. 2 and between the bending rollers 95 and the electronic component 2 respectively. Then, as shown in FIG. 12, the bending rollers 95 are respectively along two opposite tracks 94 around the periphery of the electronic component 2. Move to press the binding section 311 of each metal wire 31 against a part of the peripheral edge of the component body 21 , and make the fixing sections 312 of the metal wires 31 adjacent to each other and correspond to each other. Subsequently, as shown in Figure 13, the end sections of the two corresponding fixed sections 312 of the metal wires 31 are respectively clamped by two oppositely arranged jaws 96, and the fixed sections are respectively driven by the rotation of the jaws 96. The sections 312 are twisted into one strand. At this time, the fixed sections 312 form two strands located at two sides of the electronic component 2 . Finally, as shown in FIG. 14 , the two moving rollers 97 respectively apply pressure to the fixed sections 312 twisted with each other, so that the fixed sections 312 are bent into an L shape, and the processing procedure of step S2 is completed.

Referring to Fig. 3 and Fig. 11, in step S3, after completing the foregoing procedures, the electronic components 2 that have been wound with these metal wires 31 can be fixed on the circuit board 1, specifically the pins 22 and the fixed The section 312 is fixed on the circuit board 1 by means of over-board fixing or surface adhesion, and the fabrication of the circuit module 100 is completed. In the implementation of the second embodiment, this manufacturing method can also be applied to the fixing of electronic components 2 of different shapes and specifications, has a wide range of applications, and is also convenient to replace or disassemble the electronic components 2, and can realize Same effect as the first embodiment.

Based on the foregoing description, the two embodiments of the circuit module 100 and its manufacturing method of the present invention can easily and effectively fix the electronic component 2 on the circuit board 1 through the setting of the binding wire body 3 , and It is convenient to remove the electronic component 2 when necessary. In addition, using the binding wire body 3 to fix the electronic component 2 can be applied to the fixing of electronic components 2 of different specifications, thus saving the cost of developing the buckle structure for the electronic components 2 of different specifications. Therefore, the above embodiments can indeed achieve the object of the present invention.

But what is described above is only an embodiment of the present invention, and should not limit the present invention. All simple equivalent changes and modifications made according to the patent scope of the present invention and the content of the patent specification are still within the scope covered by the patent of the present invention.

100: circuit module

1: circuit board

2: Electronic components

21: Component body

22: pin

3: Bundle wire body

31: metal wire

311: bundle section

312: fixed section

Claims (7)

A method for manufacturing a circuit module, comprising the following steps: (A) providing a circuit board, an electronic component and a bundled wire body, the electronic component includes a cylindrical component body, and the bundled wire body includes at least one metal wire, the metal wire has a bundling section and two fixed sections respectively connecting the two ends of the bundling section; (B) placing the electronic component and the metal wire on a bending roller so that the metal wire is positioned on the electronic component and the bending roller, the bending roller moves along a track around the periphery of the electronic component to press the bundled section of the metal wire against the periphery of the component body, so that the metal wire The bundled section is wrapped around the periphery of the electronic component in a ring shape, and the fixed sections are twisted into one strand so that the fixed sections of the metal wire protrude from the electronic component; and (C) the The electronic components are arranged on the circuit board, and the ends of the fixing sections are welded and fixed on the circuit board. The manufacturing method of the circuit module as described in Claim 1, wherein, in step (B), the ends of the fixed segments are clamped by a jaw, and the rotation of the clamp drives the fixed segments to be twisted into one share. A method for manufacturing a circuit module, comprising the following steps: (A) providing a circuit board, an electronic component, and a bundled wire body, the electronic component includes a cylindrical component body, and the bundled wire body includes two metal wires , each metal wire has a bundled section and two fixed sections respectively connecting the two ends of the bundled section; each fixed section of one of the wires is twisted in one strand with a corresponding fixed section of the other of the metal wires so that the fixed sections respectively protrude from the body of the element; and (C) disposing the electronic component on the circuit board, and soldering the ends of the fixing sections to the circuit board. The manufacturing method of the circuit module as described in claim 3, wherein, in step (B), the electronic component and the metal wires are placed on two bending rollers, so that the metal wires are respectively located on the sides of the electronic component On the opposite side and respectively between the bending rollers and the electronic component, the bending rollers move along two opposite tracks around the periphery of the electronic component respectively, so as to bend the bundled section of each metal wire Pressing against and wrapping around a part of the peripheral edge of the element body, and making the fixing sections of the metal wires adjacent to each other correspondingly arranged. The manufacturing method of the circuit module as described in claim 4, wherein, in step (B), the end sections of the corresponding two fixed sections of the metal wires are respectively clamped by two clamping jaws, and the clamping jaws Respectively rotate to respectively drive the fixed sections to twist into one strand. The manufacturing method of the circuit module as described in Claim 5, wherein in the step (B), the two moving rollers respectively exert pressure on the mutually twisted fixed sections, so that the fixed sections are bent into an L-shape. The method for manufacturing a circuit module according to Claim 3, wherein in step (A), at least a part of the metal wire is extruded by an embossing roller to become flat and have textures formed on the surface.

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