TWI790530B - Manufacturing method of circuit module - Google Patents

Manufacturing method of circuit module Download PDF

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TWI790530B
TWI790530B TW110102078A TW110102078A TWI790530B TW I790530 B TWI790530 B TW I790530B TW 110102078 A TW110102078 A TW 110102078A TW 110102078 A TW110102078 A TW 110102078A TW I790530 B TWI790530 B TW I790530B
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electronic component
fixed
circuit board
sections
metal wire
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TW110102078A
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TW202231145A (en
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方聖元
葉俊昭
鄭冰愉
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香港商冠捷投資有限公司
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Abstract

一種電路模組,包含一電路板、一裝設於該電路板上的電子元件及一捆束線體。該捆束線體纏繞於該電子元件上,且末端焊接固定於該電路板,並且未與該電子元件形成電性導通。藉由該捆束線體的設置,能夠簡便有效地將該電子元件固定於該電路板上,並且在有需要時便於將該電子元件拆除。 A circuit module includes a circuit board, an electronic component mounted on the circuit board and a bundled wire body. The binding wire body is wound on the electronic component, and the end is soldered and fixed on the circuit board, and is not electrically connected to the electronic component. With the arrangement of the binding wire body, the electronic component can be easily and effectively fixed on the circuit board, and the electronic component can be easily removed when necessary.

Description

電路模組的製造方法 Manufacturing method of circuit module

本發明是有關於一種電路模組及其製造方法,特別是指一種藉由捆束線體將電子元件固定在電路板上的電路模組及其製造方法。 The invention relates to a circuit module and its manufacturing method, in particular to a circuit module for fixing electronic components on a circuit board by binding wires and its manufacturing method.

目前將電容等電子元件固定於電路板的方式,通常是藉由點膠方式或是配合特定的卡扣結構來將電子元件固定於電路板處。然而,藉由點膠方式來固定電子元件,會因為膠體固化後不易去除的緣故,導致電子元件故障或需要回收再利用時,不易進行電子元件的更換或拆除。此外,藉由卡扣結構來固定電子元件,則需要針對不同規格的電子元件來設計相應的卡扣結構,存在開發成本較高的問題。 The current method of fixing electronic components such as capacitors on the circuit board is usually to fix the electronic components on the circuit board by dispensing glue or with a specific buckle structure. However, fixing the electronic components by dispensing will not be easy to replace or remove when the electronic components fail or need to be recycled because the glue is not easy to remove after curing. In addition, if the electronic components are fixed by the buckle structure, it is necessary to design corresponding buckle structures for electronic components with different specifications, and there is a problem of high development cost.

因此,本發明之其中一目的,即在提供一種能解決前述問題的電路模組。 Therefore, one object of the present invention is to provide a circuit module capable of solving the aforementioned problems.

於是,本發明電路模組在一些實施態樣中,包含一電路板、一裝設於該電路板上的電子元件及一捆束線體。該捆束線體纏繞於該電子元件上,且末端焊接固定於該電路板,而且未與該電子元件形成電性導通。 Therefore, in some embodiments of the present invention, the circuit module includes a circuit board, an electronic component mounted on the circuit board, and a bundled wire body. The binding wire body is wound on the electronic component, and the end is soldered and fixed on the circuit board, and is not electrically connected to the electronic component.

在一些實施態樣中,該電子元件包括一圓柱狀的元件主體,該捆束線體包括一金屬線,該金屬線具有一捆繞該元件主體之周緣而呈環狀的捆束 段,以及兩分別連接該捆束段兩端的固定段,該等固定段纏捻為一股而從該元件主體突出並焊接於該電路板。 In some embodiments, the electronic component includes a cylindrical component body, the binding wire body includes a metal wire, and the metal wire has a bundle that is bound around the periphery of the component body in a ring shape section, and two fixed sections respectively connected to the two ends of the bundled section, the fixed sections are twisted into one strand, protrude from the main body of the component and are welded to the circuit board.

在一些實施態樣中,該電子元件包括一圓柱狀的元件主體,該捆束線體包括兩金屬線,每一金屬線具有一捆繞該元件主體之部分周緣的捆束段,以及兩分別連接該捆束段兩端的固定段,該等金屬線的其中一者的各固定段分別與該等金屬線的另一者的一相應固定段纏捻為一股,而從該元件主體突出並焊接於該電路板。 In some implementation aspects, the electronic component includes a cylindrical component body, the binding wire body includes two metal wires, each metal wire has a binding section bound around a part of the periphery of the component body, and two respectively The fixed sections connecting the two ends of the bundled section, each fixed section of one of the metal wires is twisted with a corresponding fixed section of the other of the metal wires respectively, and protrudes from the main body of the element and soldered to the circuit board.

在一些實施態樣中,該金屬線的線芯為金屬材質,且具有包覆線芯而作為焊接熔融金屬的表面鍍層。 In some embodiments, the wire core of the metal wire is made of metal, and has a surface coating covering the wire core as a welding molten metal.

在一些實施態樣中,該金屬線的至少一部分呈扁平狀,且表面形成紋路。 In some implementation aspects, at least a part of the metal wire is flat, and the surface is textured.

在一些實施態樣中,各金屬線的該等固定段從該元件主體的兩相反側反向延伸,再往該電路板延伸而呈L狀。 In some embodiments, the fixed sections of each metal wire extend oppositely from two opposite sides of the component body, and then extend toward the circuit board to form an L shape.

本發明的另一目的,在提供一種電路模組的製造方法。 Another object of the present invention is to provide a method for manufacturing a circuit module.

本發明電路模組的製造方法,包含以下步驟:(A)提供一電路板、一電子元件及一捆束線體,該捆束線體包括至少一金屬線,該金屬線具有一捆束段及兩分別連接該捆束段兩端的固定段;(B)將該金屬線的該捆束段捆繞於該電子元件,並讓該金屬線的該等固定段從該電子元件突出;及(C)將該電子元件設置於該電路板,並將該等固定段焊接固定在該電路板上。 The manufacturing method of the circuit module of the present invention includes the following steps: (A) providing a circuit board, an electronic component and a bundled wire body, the bundled wire body includes at least one metal wire, and the metal wire has a bundled section and two fixed sections respectively connecting the two ends of the bundled section; (B) wrapping the bundled section of the metal wire around the electronic component so that the fixed sections of the metal wire protrude from the electronic component; and ( C) disposing the electronic component on the circuit board, and welding and fixing the fixing sections on the circuit board.

在一些實施態樣中,於步驟(A)該電子元件包括一圓柱狀的元件 主體;於步驟(B)是將該捆束段捆繞於該元件主體的周緣而呈環狀,並將該等固定段纏捻為一股;於步驟(C)是將該等固定段的末端焊接於該電路板。 In some embodiments, the electronic component in step (A) includes a cylindrical component Main body; in step (B), the binding section is bound around the periphery of the element main body to form a ring shape, and the fixed sections are twisted into one strand; in step (C), the fixed sections are The ends are soldered to the circuit board.

在一些實施態樣中,於步驟(B)是將該電子元件及該金屬線放置於一彎折滾輪處,讓該金屬線位於該電子元件及該彎折滾輪之間,由該彎折滾輪沿一環繞該電子元件外圍的軌道移動,以將該金屬線的該捆束段壓抵捆繞於該元件主體的周緣。 In some embodiments, in step (B), the electronic component and the metal wire are placed on a bending roller, so that the metal wire is located between the electronic component and the bending roller, and the bending roller Move along a track around the periphery of the electronic component to press the bundled section of the metal wire against the periphery of the component body.

在一些實施態樣中,於步驟(B)是由一夾爪夾持該等固定段的末端,並由該夾爪的旋轉帶動該等固定段纏捻為一股。 In some implementation aspects, in step (B), a clamping jaw clamps the ends of the fixing segments, and the rotation of the clamping jaw drives the fixing segments to twist into one strand.

在一些實施態樣中,於步驟(A)該電子元件包括一圓柱狀的元件主體,該捆束線體包括兩金屬線;於步驟(B)是將該等金屬線的捆束段分別捆繞該元件主體的部分周緣,並將該等金屬線的其中一者的各固定段分別與該等金屬線的另一者的一相應固定段纏捻為一股,而讓該等固定段分別從該元件主體突出;於步驟(C)是將該等固定段的末端焊接於該電路板。 In some embodiments, in step (A), the electronic component includes a cylindrical component body, and the bundled wire body includes two metal wires; in step (B), the bundled sections of the metal wires are bundled separately around part of the periphery of the element body, and twist each fixed section of one of the metal wires with a corresponding fixed section of the other of the metal wires respectively, so that the fixed sections are respectively protruding from the component body; in step (C), the ends of the fixing sections are soldered to the circuit board.

在一些實施態樣中,於步驟(B)是將該電子元件及該等金屬線放置於兩彎折滾輪處,讓該等金屬線分別位於該電子元件的相反側並且分別介於該等彎折滾輪與該電子元件之間,再由該等彎折滾輪分別沿兩個相對地環繞該電子元件外圍的軌道移動,以將各金屬線的該捆束段壓抵捆繞於該元件主體的部分周緣,並讓該等金屬線的該等固定段相互鄰近地對應設置。 In some implementations, in step (B), the electronic component and the metal wires are placed on two bending rollers, so that the metal wires are respectively located on the opposite sides of the electronic component and between the bends Between the folding rollers and the electronic component, the bending rollers move along two opposite tracks around the periphery of the electronic component respectively, so as to press the bundled section of each metal wire against the wire wrapped around the main body of the component. part of the periphery, and let the fixed sections of the metal wires be adjacent to each other and correspondingly arranged.

在一些實施態樣中,於步驟(B)還由兩夾爪分別夾持該等金屬線的相對應的兩固定段的末段,並由該等夾爪分別旋轉而分別帶動該等固定段纏 捻為一股。 In some implementations, in step (B), the end sections of the two corresponding fixed sections of the metal wires are respectively clamped by the two jaws, and the fixed sections are respectively driven by the rotation of the clamping jaws. wrapped around Twist into one strand.

在一些實施態樣中,於步驟(B)還由兩移動滾輪分別施壓於相互纏捻的該等固定段,使該等固定段彎折為L狀。 In some embodiments, in the step (B), the two moving rollers respectively exert pressure on the intertwined fixed sections, so that the fixed sections are bent into an L-shape.

在一些實施態樣中,於步驟(A)該金屬線的至少一部分受一壓花滾輪的壓擠加工處理而呈扁平狀且表面形成紋路。 In some embodiments, in the step (A), at least a part of the metal wire is compressed by an embossing roller to be flattened and have textures formed on the surface.

本發明至少具有以下功效:藉由該捆束線體的設置,能夠簡便有效地將該電子元件固定於該電路板上,並且在有需要時便於將該電子元件拆除。此外,使用該捆束線體來固定該電子元件,適用於不同規格的電子元件,如此能夠節省針對特定規格之電子元件開發卡扣結構所需的費用。 The present invention has at least the following effects: through the setting of the binding wire body, the electronic component can be easily and effectively fixed on the circuit board, and the electronic component can be easily removed when necessary. In addition, using the binding wire body to fix the electronic component is applicable to electronic components of different specifications, which can save the cost of developing a buckle structure for electronic components of specific specifications.

100:電路模組 100: circuit module

1:電路板 1: circuit board

2:電子元件 2: Electronic components

21:元件主體 21: Component body

22:引腳 22: pin

3:捆束線體 3: Bundle wire body

31:金屬線 31: metal wire

311:捆束段 311: bundle section

312:固定段 312: fixed section

91:線捲 91: Coil

92:夾持滾輪 92: clamping roller

93:壓花滾輪 93: Embossing roller

94:軌道 94: track

95:彎折滾輪 95: Bending Roller

96:夾爪 96: Gripper

97:移動滾輪 97: Move the roller

S1~S3:流程步驟 S1~S3: Process steps

本發明之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中:圖1是一側視圖,說明本發明電路模組的第一實施例;圖2是該第一實施例的前視圖;圖3是一流程圖,說明製作該電路模組的流程步驟;圖4至圖8是示意圖,說明該第一實施例的製作過程;圖9是一側視圖,說明本發明電路模組的第二實施例;圖10是該第二實施例的前視圖;圖11至圖14是示意圖,說明該第二實施例的製作過程。 Other features and functions of the present invention will be clearly presented in the implementation manner with reference to the drawings, wherein: Fig. 1 is a side view, illustrating the first embodiment of the circuit module of the present invention; Fig. 2 is the first embodiment Fig. 3 is a flow chart illustrating the process steps of making the circuit module; Fig. 4 to Fig. 8 are schematic diagrams illustrating the manufacturing process of the first embodiment; Fig. 9 is a side view illustrating the present invention The second embodiment of the circuit module; FIG. 10 is a front view of the second embodiment; FIG. 11 to FIG. 14 are schematic diagrams illustrating the manufacturing process of the second embodiment.

在本發明被詳細描述之前,應當注意在以下的說明內容中,類似的元件是以相同的編號來表示。 Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numerals.

參閱圖1與圖2,為本發明電路模組100的第一實施例。該電路模組100可以是任意的電子裝置的一部分,且包含一電路板1、一電子元件2及一捆束線體3。在實施上,該電路模組100通常具有多個電子元件2及多個捆束線體3,但在後續說明及圖式中均以單個作為示例。 Referring to FIG. 1 and FIG. 2 , it is a first embodiment of the circuit module 100 of the present invention. The circuit module 100 can be a part of any electronic device, and includes a circuit board 1 , an electronic component 2 and a bundled wire body 3 . In practice, the circuit module 100 usually has a plurality of electronic components 2 and a plurality of binding wires 3 , but a single one is used as an example in the subsequent description and drawings.

該電路板1例如為一般的硬式印刷電路板或是可撓式電路板,其類型視實際需要而定。該電子元件2例如為電解電容或其他電子零件,並包括一呈圓柱狀的元件主體21及多個自該元件主體21向外延伸而電連接於該電路板1的引腳22。該等引腳22於本實施例的數量例如為兩根,並且是藉由過板固定(paste-in-hole,PIH)之方式插設固定於該電路板1上。此外,該等引腳22也可以藉由表面黏著(surface-mount technology,SMT)方式裝設於該電路板1上,不以特定實施方式為限。 The circuit board 1 is, for example, a general rigid printed circuit board or a flexible circuit board, the type of which depends on actual needs. The electronic component 2 is, for example, an electrolytic capacitor or other electronic parts, and includes a cylindrical component body 21 and a plurality of pins 22 extending outward from the component body 21 and electrically connected to the circuit board 1 . The number of the pins 22 in this embodiment is, for example, two, and they are inserted and fixed on the circuit board 1 by means of paste-in-hole (PIH). In addition, the pins 22 can also be mounted on the circuit board 1 by surface-mount technology (SMT), which is not limited to a specific embodiment.

參閱圖1、圖2及圖7,該捆束線體3纏繞於該電子元件2上,且末端焊接固定於該電路板1,並且未與該電子元件2形成電性導通,能以簡便的方式將該電子元件2完善地固定在該電路板1上。詳細來說,該捆束線體3包括一金屬線31,該金屬線31具有一捆繞該元件主體21之周緣而呈環狀的捆束段311,以及兩分別連接該捆束段311兩端的固定段312。該等固定段312係纏捻為一股而從該元件主體21突出,並且由末端焊接於該電路板1上,藉以對該電子元件2提供固定之功用。在特定的實施態樣中,該金屬線31的線芯為金屬材質, 且具有包覆線芯而作為焊接熔融金屬的表面鍍層,因而能由表面鍍層直接作為焊接處理時所需的接著材料。此外,在另一特定的實施方式中,該金屬線31的一部分(例如該捆束段311)或是整體呈扁平狀,且表面形成紋路,如此能讓該金屬線31不易從該電子元件2上滑脫。 Referring to Fig. 1, Fig. 2 and Fig. 7, the binding wire body 3 is wound on the electronic component 2, and the end is welded and fixed to the circuit board 1, and does not form electrical conduction with the electronic component 2, which can be easily The electronic component 2 is perfectly fixed on the circuit board 1 in a manner. In detail, the binding wire body 3 includes a metal wire 31, the metal wire 31 has a binding section 311 that is annular around the periphery of the component body 21, and two The fixed section 312 at the end. The fixing sections 312 are twisted into a strand and protrude from the component body 21 , and are welded on the circuit board 1 at the ends, so as to provide the function of fixing the electronic component 2 . In a specific embodiment, the core of the metal wire 31 is made of metal, And it has the surface coating that wraps the wire core as the welding molten metal, so the surface coating can be directly used as the bonding material required for welding. In addition, in another specific embodiment, a part of the metal wire 31 (for example, the bundling section 311 ) or the whole is flat, and the surface is textured, so that the metal wire 31 is not easy to dislodge from the electronic component 2 Slip on.

參閱圖3至圖8,以下說明該電路模組100的製造方法。 Referring to FIG. 3 to FIG. 8 , the manufacturing method of the circuit module 100 will be described below.

參閱圖3至圖5,首先,於步驟S1是要提供該電路板1、該電子元件2及該捆束線體3的金屬線31。該電路板1及該電子元件2可依一般方式製備或選用已製備完成的產品。該金屬線31可由如圖4的一線捲91抽取,並由一夾持滾輪92夾持固定,再依據所需長度進行裁剪。此外,在有需要時該金屬線31還能如圖5般藉由一壓花滾輪93夾持後進行壓擠加工處理,使得處理後的該金屬線31的一部分或整體呈扁平狀且表面形成紋路。 Referring to FIG. 3 to FIG. 5 , firstly, in step S1 , the circuit board 1 , the electronic component 2 and the metal wire 31 of the binding wire body 3 are provided. The circuit board 1 and the electronic component 2 can be prepared in a general manner or can be selected as finished products. The metal wire 31 can be taken out by a wire roll 91 as shown in FIG. 4 , clamped and fixed by a clamping roller 92 , and then cut according to the required length. In addition, when necessary, the metal wire 31 can also be squeezed after being clamped by an embossing roller 93 as shown in FIG. texture.

參閱圖3、圖6至圖8,隨後,於步驟S2是要將該金屬線31的該捆束段311捆繞於該電子元件2的周緣而成環狀,並讓該金屬線31的該等固定段312纏繞為一股後從該電子元件2突出。 Referring to Fig. 3, Fig. 6 to Fig. 8, then, in step S2, the binding section 311 of the metal wire 31 will be bound around the periphery of the electronic component 2 to form a ring, and the metal wire 31 will be The fixing section 312 protrudes from the electronic component 2 after being wound into a strand.

具體來說,上述步驟是如圖6般將該電子元件2及該金屬線31放置於一彎折滾輪95處,並讓該金屬線31位於該電子元件2及該彎折滾輪95之間。隨後,可如圖7般由該彎折滾輪95沿一環繞該電子元件2外圍的軌道94移動,以將該金屬線31的該捆束段311壓抵捆繞於該元件主體21的周緣。而後,再如圖8般由一夾爪96夾持該等固定段312的末端,並由該夾爪96的旋轉帶動該等固定段312纏捻為一股,如此便完成以自動化加工方式將該捆束線體3的金屬線31纏 繞於該電子元件2之處理步驟。 Specifically, the above steps are to place the electronic component 2 and the metal wire 31 on a bending roller 95 as shown in FIG. 6 , and let the metal wire 31 be located between the electronic component 2 and the bending roller 95 . Then, as shown in FIG. 7 , the bending roller 95 can be moved along a track 94 around the periphery of the electronic component 2 to press the bundled section 311 of the metal wire 31 against the periphery of the component body 21 . Then, as shown in Figure 8, the ends of these fixed sections 312 are clamped by a jaw 96, and the rotation of the jaws 96 drives these fixed sections 312 to be twisted into one strand, so that the automatic processing method is completed. The metal wire 31 of this binding wire body 3 is wrapped around Around the processing steps of the electronic component 2.

最後,於步驟S3可將該電子元件2設置於該電路板1,並將該等固定段312以過板固定或表面黏著之方式焊接固定在該電路板1上,便完成該電路模組100的製作流程。 Finally, in step S3, the electronic component 2 can be placed on the circuit board 1, and the fixing sections 312 can be soldered and fixed on the circuit board 1 by over-board fixing or surface-mounting, and the circuit module 100 is completed. production process.

上述藉由該捆束線體3的金屬線31將該電子元件2固定在該電路板1的加工方式不僅過程簡便,而且可運用於不同形狀、規格的電子元件2,具有廣泛的應用範疇,能有效節省開發各種規格電子元件2之卡扣結構所需的成本。此外,當需要更換或拆除該電子元件2時,只要將該捆束線體3的焊接處重新熔融即可,且該捆束線體3亦能夠從該電子元件2上拆下,便於進行該電子元件2的拆換作業。 The above-mentioned processing method of fixing the electronic component 2 on the circuit board 1 through the metal wire 31 of the bundled wire body 3 is not only simple and convenient, but also can be applied to electronic components 2 of different shapes and specifications, and has a wide range of applications. It can effectively save the cost required for developing the buckle structure of electronic components 2 of various specifications. In addition, when the electronic component 2 needs to be replaced or removed, it is only necessary to re-melt the welding part of the binding wire body 3, and the binding wire body 3 can also be removed from the electronic component 2, which is convenient for the Replacement of electronic components 2.

參閱圖9及圖10,為本發明電路模組100的第二實施例。在該第二實施例中,同樣是藉由該捆束線體3來進行該電子元件2之固定,然而該捆束線體3的實施方式與第一實施例有所不同,說明如下。 Referring to FIG. 9 and FIG. 10 , it is a second embodiment of the circuit module 100 of the present invention. In the second embodiment, the electronic component 2 is also fixed by the binding wire body 3 , but the implementation manner of the binding wire body 3 is different from the first embodiment, which is described as follows.

在第二實施例中,該電路模組100包含一電路板1、一電子元件2及一捆束線體3。該電路板1及該電子元件2的實施方式與第一實施例相同,但第二實施例的捆束線體3包括兩金屬線31。具體來說,第二實施例中每一金屬線31具有一如圖12般捆繞該元件主體21之部分周緣的捆束段311,以及兩分別連接該捆束段311兩端的固定段312。該等金屬線31的其中一者的各固定段312分別如圖13所示與該等金屬線31的另一者的一相應固定段312纏捻為一股,而從該元件主體21突出並焊接於該電路板1。如此,藉由該等金屬線31的使用,同 樣能實現固定該電子元件2的功用。 In the second embodiment, the circuit module 100 includes a circuit board 1 , an electronic component 2 and a bundled wire body 3 . The implementation of the circuit board 1 and the electronic component 2 is the same as the first embodiment, but the binding wire body 3 of the second embodiment includes two metal wires 31 . Specifically, in the second embodiment, each metal wire 31 has a binding section 311 that wraps a part of the periphery of the component body 21 as shown in FIG. 12 , and two fixing sections 312 that connect the two ends of the binding section 311 respectively. Each of the fixed segments 312 of one of the metal wires 31 is twisted with a corresponding fixed segment 312 of the other of the metal wires 31 as shown in FIG. Soldered on the circuit board 1. Thus, by using the metal wires 31, the same The same can realize the function of fixing the electronic component 2.

更具體來說,第二實施例中該捆束線體3的其中一條金屬線31的捆束段311是捆繞該電子元件2的上半周緣,另一條金屬線31的捆束段311是捆繞該電子元件2的下半周緣,該等金屬線31的該等固定段312從該元件主體21的兩相反側往相反方向水平延伸,再往該電路板1垂直延伸而呈L狀。如此,便能由該等捆束段311讓該捆束線體3牢固地捆繞於該電子元件2,並能藉由該等固定段312以過板固定或表面黏著方式固定於該電路板1上。 More specifically, in the second embodiment, the binding section 311 of one of the metal wires 31 of the binding wire body 3 is bound around the upper half periphery of the electronic component 2, and the binding section 311 of the other metal wire 31 is Bundled around the lower half of the electronic component 2 , the fixing sections 312 of the metal wires 31 extend horizontally from two opposite sides of the component body 21 in opposite directions, and then vertically extend toward the circuit board 1 to form an L shape. In this way, the binding wire body 3 can be firmly wrapped around the electronic component 2 through the binding sections 311, and can be fixed to the circuit board through the fixing sections 312 through board fixing or surface adhesion. 1 on.

參閱圖3、圖11~圖14,以下說明該第二實施例之該電路模組100的製造方法。 Referring to FIG. 3 , and FIG. 11 to FIG. 14 , the manufacturing method of the circuit module 100 of the second embodiment will be described below.

參閱圖3,步驟S1的執行方式大致與第一實施例相同,都是要提供該電路板1、該電子元件2及該捆束線體3,唯第二實施例需要預先提供兩條金屬線31來作為該捆束線體3的主體結構。 Referring to Fig. 3, the execution method of step S1 is roughly the same as that of the first embodiment, all of which are to provide the circuit board 1, the electronic component 2 and the bundled wire body 3, but the second embodiment needs to provide two metal wires in advance 31 as the main structure of the binding wire body 3.

參閱圖3、圖11~圖14,於步驟S2中,要將該等金屬線31的捆束段311分別捆繞該元件主體21的部分周緣,並將該等金屬線31的其中一者的各固定段312分別與該等金屬線31的另一者的一相應固定段312纏捻為一股,而讓該等固定段312分別從該元件主體21突出。 Referring to Fig. 3, Fig. 11 ~ Fig. 14, in step S2, the binding section 311 of these metal wires 31 will be bound respectively around the part of the periphery of the element main body 21, and one of these metal wires 31 Each fixing section 312 is twisted with a corresponding fixing section 312 of the other one of the metal wires 31 respectively, so that the fixing sections 312 respectively protrude from the component main body 21 .

具體來說,第二實施例的步驟S2是如圖11般將該電子元件2及該等金屬線31放置於兩相對設置的彎折滾輪95處,讓該等金屬線31分別位於該電子元件2的相反側並且分別介於該等彎折滾輪95與該電子元件2之間。然後,再如圖12般由該等彎折滾輪95分別沿兩個相對地環繞該電子元件2外圍的軌道94 移動,以將各金屬線31的該捆束段311壓抵捆繞於該元件主體21的部分周緣,並讓該等金屬線31的該等固定段312相互鄰近地對應設置。隨後,再如圖13般由兩相對設置的夾爪96分別夾持該等金屬線31的相對應的兩固定段312的末段,並由該等夾爪96分別旋轉而分別帶動該等固定段312纏捻為一股,此時該等固定段312形成兩股位於該電子元件2兩側的線狀結構。最後,如圖14般由兩移動滾輪97分別施壓於相互纏捻的該等固定段312,使該等固定段312彎折為L狀,便完成步驟S2的加工程序。 Specifically, step S2 of the second embodiment is to place the electronic component 2 and the metal wires 31 on two oppositely arranged bending rollers 95 as shown in FIG. 2 and between the bending rollers 95 and the electronic component 2 respectively. Then, as shown in FIG. 12, the bending rollers 95 are respectively along two opposite tracks 94 around the periphery of the electronic component 2. Move to press the binding section 311 of each metal wire 31 against a part of the peripheral edge of the component body 21 , and make the fixing sections 312 of the metal wires 31 adjacent to each other and correspond to each other. Subsequently, as shown in Figure 13, the end sections of the two corresponding fixed sections 312 of the metal wires 31 are respectively clamped by two oppositely arranged jaws 96, and the fixed sections are respectively driven by the rotation of the jaws 96. The sections 312 are twisted into one strand. At this time, the fixed sections 312 form two strands located at two sides of the electronic component 2 . Finally, as shown in FIG. 14 , the two moving rollers 97 respectively apply pressure to the fixed sections 312 twisted with each other, so that the fixed sections 312 are bent into an L shape, and the processing procedure of step S2 is completed.

參閱圖3及圖11,於步驟S3,完成前述程序後,便可將已纏繞該等金屬線31的電子元件2固定於該電路板1上,具體是將該等引腳22及該等固定段312透過過板固定或表面黏著等方式固定於該電路板1上,便完成該電路模組100的製作。在第二實施例的實施方式中,該製造方法同樣可運用於不同形狀、規格的電子元件2的固定,具有廣泛的應用範疇,並且同樣便於進行該電子元件2的更換或拆卸,而能實現與第一實施例相同的效果。 Referring to Fig. 3 and Fig. 11, in step S3, after completing the foregoing procedures, the electronic components 2 that have been wound with these metal wires 31 can be fixed on the circuit board 1, specifically the pins 22 and the fixed The section 312 is fixed on the circuit board 1 by means of over-board fixing or surface adhesion, and the fabrication of the circuit module 100 is completed. In the implementation of the second embodiment, this manufacturing method can also be applied to the fixing of electronic components 2 of different shapes and specifications, has a wide range of applications, and is also convenient to replace or disassemble the electronic components 2, and can realize Same effect as the first embodiment.

綜合前述說明,本發明電路模組100及其製造方法的兩個實施例,可藉由該捆束線體3的設置,簡便有效地將該電子元件2固定於該電路板1上,並且在有需要時便於將該電子元件2拆除。此外,使用該捆束線體3來固定該電子元件2,能夠運用於不同規格的電子元件2的固定,因此能夠節省針對不同規格之電子元件2開發卡扣結構所需的費用。因此,上述實施方式確實能達成本發明的目的。 Based on the foregoing description, the two embodiments of the circuit module 100 and its manufacturing method of the present invention can easily and effectively fix the electronic component 2 on the circuit board 1 through the setting of the binding wire body 3 , and It is convenient to remove the electronic component 2 when necessary. In addition, using the binding wire body 3 to fix the electronic component 2 can be applied to the fixing of electronic components 2 of different specifications, thus saving the cost of developing the buckle structure for the electronic components 2 of different specifications. Therefore, the above embodiments can indeed achieve the object of the present invention.

惟以上所述者,僅為本發明之實施例而已,當不能以此限定本發 明實施之範圍,凡是依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。 But what is described above is only an embodiment of the present invention, and should not limit the present invention. All simple equivalent changes and modifications made according to the patent scope of the present invention and the content of the patent specification are still within the scope covered by the patent of the present invention.

100:電路模組 100: circuit module

1:電路板 1: circuit board

2:電子元件 2: Electronic components

21:元件主體 21: Component body

22:引腳 22: pin

3:捆束線體 3: Bundle wire body

31:金屬線 31: metal wire

311:捆束段 311: bundle section

312:固定段 312: fixed section

Claims (7)

一種電路模組的製造方法,包含以下步驟:(A)提供一電路板、一電子元件及一捆束線體,該電子元件包括一圓柱狀的元件主體,該捆束線體包括至少一金屬線,該金屬線具有一捆束段及兩分別連接該捆束段兩端的固定段;(B)將該電子元件及該金屬線放置於一彎折滾輪處,讓該金屬線位於該電子元件及該彎折滾輪之間,由該彎折滾輪沿一環繞該電子元件外圍的軌道移動,以將該金屬線的該捆束段壓抵捆繞於該元件主體的周緣,使該金屬線的該捆束段捆繞於該電子元件的周緣而呈環狀,並將該等固定段纏捻為一股而讓該金屬線的該等固定段從該電子元件突出;及(C)將該電子元件設置於該電路板,並將該等固定段的末端焊接固定在該電路板上。 A method for manufacturing a circuit module, comprising the following steps: (A) providing a circuit board, an electronic component and a bundled wire body, the electronic component includes a cylindrical component body, and the bundled wire body includes at least one metal wire, the metal wire has a bundling section and two fixed sections respectively connecting the two ends of the bundling section; (B) placing the electronic component and the metal wire on a bending roller so that the metal wire is positioned on the electronic component and the bending roller, the bending roller moves along a track around the periphery of the electronic component to press the bundled section of the metal wire against the periphery of the component body, so that the metal wire The bundled section is wrapped around the periphery of the electronic component in a ring shape, and the fixed sections are twisted into one strand so that the fixed sections of the metal wire protrude from the electronic component; and (C) the The electronic components are arranged on the circuit board, and the ends of the fixing sections are welded and fixed on the circuit board. 如請求項1所述之電路模組的製造方法,其中,於步驟(B)是由一夾爪夾持該等固定段的末端,並由該夾爪的旋轉帶動該等固定段纏捻為一股。 The manufacturing method of the circuit module as described in Claim 1, wherein, in step (B), the ends of the fixed segments are clamped by a jaw, and the rotation of the clamp drives the fixed segments to be twisted into one share. 一種電路模組的製造方法,包含以下步驟:(A)提供一電路板、一電子元件及一捆束線體,該電子元件包括一圓柱狀的元件主體,該捆束線體包括兩金屬線,每一金屬線具有一捆束段及兩分別連接該捆束段兩端的固定段;(B)將該等金屬線的捆束段分別捆繞該元件主體的部分周緣,並將該等金屬線的其中一者的各固定段分別與該等金屬線的另一者的一相應固定段纏捻為一股,而讓該等固定段分別從該元件主體突出;及 (C)將該電子元件設置於該電路板,並將該等固定段的末端焊接於該電路板。 A method for manufacturing a circuit module, comprising the following steps: (A) providing a circuit board, an electronic component, and a bundled wire body, the electronic component includes a cylindrical component body, and the bundled wire body includes two metal wires , each metal wire has a bundled section and two fixed sections respectively connecting the two ends of the bundled section; each fixed section of one of the wires is twisted in one strand with a corresponding fixed section of the other of the metal wires so that the fixed sections respectively protrude from the body of the element; and (C) disposing the electronic component on the circuit board, and soldering the ends of the fixing sections to the circuit board. 如請求項3所述之電路模組的製造方法,其中,於步驟(B)是將該電子元件及該等金屬線放置於兩彎折滾輪處,讓該等金屬線分別位於該電子元件的相反側並且分別介於該等彎折滾輪與該電子元件之間,再由該等彎折滾輪分別沿兩個相對地環繞該電子元件外圍的軌道移動,以將各金屬線的該捆束段壓抵捆繞於該元件主體的部分周緣,並讓該等金屬線的該等固定段相互鄰近地對應設置。 The manufacturing method of the circuit module as described in claim 3, wherein, in step (B), the electronic component and the metal wires are placed on two bending rollers, so that the metal wires are respectively located on the sides of the electronic component On the opposite side and respectively between the bending rollers and the electronic component, the bending rollers move along two opposite tracks around the periphery of the electronic component respectively, so as to bend the bundled section of each metal wire Pressing against and wrapping around a part of the peripheral edge of the element body, and making the fixing sections of the metal wires adjacent to each other correspondingly arranged. 如請求項4所述之電路模組的製造方法,其中,於步驟(B)還由兩夾爪分別夾持該等金屬線的相對應的兩固定段的末段,並由該等夾爪分別旋轉而分別帶動該等固定段纏捻為一股。 The manufacturing method of the circuit module as described in claim 4, wherein, in step (B), the end sections of the corresponding two fixed sections of the metal wires are respectively clamped by two clamping jaws, and the clamping jaws Respectively rotate to respectively drive the fixed sections to twist into one strand. 如請求項5所述之電路模組的製造方法,其中,於步驟(B)還由兩移動滾輪分別施壓於相互纏捻的該等固定段,使該等固定段彎折為L狀。 The manufacturing method of the circuit module as described in Claim 5, wherein in the step (B), the two moving rollers respectively exert pressure on the mutually twisted fixed sections, so that the fixed sections are bent into an L-shape. 如請求項3所述之電路模組的製造方法,其中,於步驟(A)該金屬線的至少一部分受一壓花滾輪的壓擠加工處理而呈扁平狀且表面形成紋路。 The method for manufacturing a circuit module according to Claim 3, wherein in step (A), at least a part of the metal wire is extruded by an embossing roller to become flat and have textures formed on the surface.
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