TWI789506B - Curable adhesive composition, adhesive sheet using the composition, laminate containing the adhesive sheet, and manufacturing method thereof - Google Patents

Curable adhesive composition, adhesive sheet using the composition, laminate containing the adhesive sheet, and manufacturing method thereof Download PDF

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TWI789506B
TWI789506B TW108109010A TW108109010A TWI789506B TW I789506 B TWI789506 B TW I789506B TW 108109010 A TW108109010 A TW 108109010A TW 108109010 A TW108109010 A TW 108109010A TW I789506 B TWI789506 B TW I789506B
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aforementioned
adhesive sheet
adhesive
resin
mass
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TW201942307A (en
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谷井翔太
森野彰規
金川善典
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日商迪愛生股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • C09J175/06Polyurethanes from polyesters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • C09J175/08Polyurethanes from polyethers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)

Abstract

本發明所欲解決的課題係提供一種硬化性黏接劑組成物,即使在短時間且低溫仍可完成施工並進行接合,且即使對2個以上之活性能量射線不會透射而在構件表面具有撓曲(deflection)、凹凸之被黏接體仍可理想地予以接合,並提供使用此組成物之黏接片、含有此黏接片之疊層體及其製造方法。 本發明關於一種硬化性黏接劑組成物,係使用於將2個以上之具有活性能量射線不會透射的面之被黏接體予以接合之用途,其含有光硬化性樹脂(A)、熱塑性樹脂(B)及光聚合起始劑,且前述光硬化性樹脂(A)及前述熱塑性樹脂(B)具有聚合性不飽和雙鍵以外之聚合性官能基,並關於使用此組成物之黏接片、含有此黏接片之疊層體及其製造方法。The problem to be solved by the present invention is to provide a hardening adhesive composition, which can complete the construction and join even in a short time and at low temperature, and even if it does not transmit more than two active energy rays, it has Adhered bodies with deflection and unevenness can still be bonded ideally, and an adhesive sheet using the composition, a laminate containing the adhesive sheet, and a manufacturing method thereof are provided. The present invention relates to a curable adhesive composition, which is used for bonding two or more adherends having surfaces that do not transmit active energy rays, and contains a photocurable resin (A), a thermoplastic The resin (B) and the photopolymerization initiator, and the above-mentioned photocurable resin (A) and the above-mentioned thermoplastic resin (B) have polymerizable functional groups other than polymerizable unsaturated double bonds, and the adhesive using this composition sheet, a laminate containing the adhesive sheet, and a manufacturing method thereof.

Description

硬化性黏接劑組成物、使用此組成物之黏接片、含有此黏接片之疊層體及其製造方法Curable adhesive composition, adhesive sheet using the composition, laminate containing the adhesive sheet, and manufacturing method thereof

本發明關於可使用於活性能量射線不易透射之被黏接體的疊層之硬化性黏接劑組成物、使用此組成物之黏接片、含有此黏接片之疊層體及其製造方法。The present invention relates to a curable adhesive composition that can be used for lamination of adherends that are difficult to transmit active energy rays, an adhesive sheet using the composition, a laminate containing the adhesive sheet, and a manufacturing method thereof .

近年,液晶顯示裝置廣泛地使用作為電視、智慧型手機、個人助理裝置(PAD)、平板電腦、汽車導航系統等的顯示裝置。 就前述液晶顯示裝置而言,已知通常具備疊層有如下構件之結構:液晶顯示面板、重疊配置於該液晶顯示面板的背面之用以照明液晶顯示面板之面狀照明裝置(背光裝置)、電路板(基板)、或安裝有其他電子零件之底盤(chassis)、將零件所產生的熱發散之散熱片等。In recent years, liquid crystal display devices have been widely used as display devices for televisions, smartphones, personal assistant devices (PADs), tablet computers, car navigation systems, and the like. The above-mentioned liquid crystal display device is generally known to have a structure in which the following members are stacked: a liquid crystal display panel, a planar lighting device (backlight device) for illuminating the liquid crystal display panel arranged on the backside of the liquid crystal display panel, Circuit boards (substrates), or chassis with other electronic components installed, heat sinks that dissipate heat generated by components, etc.

為了將前述液晶顯示裝置之構件彼此疊層,例如常用如下方法:在欲疊層之構件表面有撓曲(deflection)、凹凸時,會塗佈黏接劑並使黏接劑隨附於撓曲、凹凸後,為了去除塗佈面之厚度不均勻,而刮平已塗佈之黏接劑使塗佈有黏接劑的面平滑化,然後再疊層另一側之構件(例如參照專利文獻1)。 又,使前述構件彼此接合之方法中,例如具有如下步驟:在欲疊層之構件表面有撓曲、凹凸時,會塗佈黏接劑並使黏接劑隨附於撓曲、凹凸後,為了去除塗佈面之厚度不均勻,而刮平已塗佈之黏接劑使塗佈有黏接劑的面平滑化,然後疊層另一側之構件(例如參照專利文獻2)。In order to laminate the components of the above-mentioned liquid crystal display device, for example, the following method is commonly used: when the surface of the components to be laminated has deflection or unevenness, an adhesive is applied and the adhesive is attached to the deflection. , After unevenness, in order to remove the uneven thickness of the coated surface, scrape off the coated adhesive to smooth the surface coated with the adhesive, and then laminate the components on the other side (for example, refer to patent documents 1). Also, in the method of joining the above-mentioned members, for example, there is a step of: when the surface of the members to be laminated has flexures or irregularities, an adhesive is applied and the adhesive is attached to the flexures or irregularities, In order to remove the uneven thickness of the coated surface, the coated adhesive is scraped to smooth the surface coated with the adhesive, and then the members on the other side are laminated (for example, refer to Patent Document 2).

在目前的製造中,為了確保前述疊層步驟所需要的施工時間,必須使用硬化時間長的黏接劑。其結果導致前述疊層步驟後之黏接劑在直到顯現足夠的接合強度為止需要長時間熟成之步驟。 就加速前述疊層步驟後之黏接劑的硬化之進行的方法而言,雖然業已探討黏接劑之高溫條件下的加熱硬化,但存在硬化時的熱造成前述液晶顯示裝置之構件損傷的疑慮。又,由於每個構件的熱膨脹差而在冷卻時所產生之構件間的應變致使有構件變形、或接合材與構件間產生裂紋、剝離等問題,並於使用了黏接劑之接合方法中存在著課題。In current manufacturing, in order to ensure the construction time required for the aforementioned lamination steps, it is necessary to use an adhesive with a long hardening time. As a result, the adhesive after the aforementioned lamination step needs to be matured for a long time until sufficient bonding strength is developed. Regarding the method of accelerating the hardening of the adhesive after the aforementioned lamination step, heat hardening of the adhesive under high-temperature conditions has been considered, but there is a concern that the heat during hardening may cause damage to the components of the liquid crystal display device. . In addition, due to the difference in thermal expansion of each member, the strain between the members during cooling causes deformation of the members, or cracks and peeling between the joining material and the members, and there are problems in the joining method using adhesives. topic.

又,為了使前述硬化時間縮短,若使用常溫下之硬化性優良的黏接劑的話,則無法確保前述疊層步驟所需要的施工時間,且硬化在疊層前即已進行,故疊層時有時會有無法顯現足夠的接合強度的情況。 另外,就於低溫短時間完成硬化之方法而言,雖然業已探討利用光的照射所為之接合法,但不能使用於光無法透射之構件中,適用構件受到限制,不易實用化。In addition, in order to shorten the aforementioned hardening time, if an adhesive with excellent curability at room temperature is used, the construction time required for the aforementioned lamination step cannot be ensured, and the hardening has already been carried out before lamination, so when laminating There may be cases where sufficient joint strength cannot be expressed. In addition, as for the method of completing hardening at low temperature and in a short time, although a bonding method using light irradiation has been studied, it cannot be used in members that cannot transmit light, and the applicable members are limited, making it difficult to put it into practical use.

考量以上背景,目前正強烈需求一種嶄新的接合材料,可在短時間且低溫下完成施工,並且即使對光不會透射之材料仍可理想地予以接合。 [先前技術文獻] [專利文獻]Considering the above background, there is a strong demand for a new bonding material, which can be completed in a short time and at low temperature, and can be ideally bonded even to materials that do not transmit light. [Prior Art Literature] [Patent Document]

[專利文獻1]日本特開2010-181432號公報 [專利文獻2]日本特開2003-136677號公報[Patent Document 1] Japanese Unexamined Patent Publication No. 2010-181432 [Patent Document 2] Japanese Patent Laid-Open No. 2003-136677

[發明所欲解決之課題][Problem to be Solved by the Invention]

本發明所欲解決的課題係提供一種硬化性黏接劑組成物,即使在短時間且低溫仍可完成施工並進行接合,且即使對2個以上之活性能量射線無法透射而在構件表面具有撓曲、凹凸之被黏接體仍可理想地予以接合。且提供一種硬化性黏接劑組成物,在使用該硬化性黏接劑組成物來形成黏接劑層並製得具有該黏接劑層之黏接片時,即使在將該黏接片捲繞於輥等而予以保存的情況下,仍可防止黏接劑層從輥的端部被擠出,並提供使用此組成物之黏接片、含有此黏接片之疊層體及其製造方法。 [解決課題之手段]The problem to be solved by the present invention is to provide a hardening adhesive composition, which can complete the construction and join even in a short time and at low temperature, and has flexibility on the surface of the member even if it cannot transmit more than two active energy rays. Curved, concave-convex adherends can still be bonded ideally. Furthermore, there is provided a curable adhesive composition which, when an adhesive layer is formed using the curable adhesive composition and an adhesive sheet having the adhesive layer is produced, even when the adhesive sheet is wound The adhesive layer can still be prevented from being extruded from the end of the roll when it is stored on a roll, and an adhesive sheet using the composition, a laminate containing the adhesive sheet, and a manufacturing method thereof are provided . [Means to solve the problem]

本案發明人等發現藉由使用一種硬化性黏接劑組成物,其含有光硬化性樹脂(A)、熱塑性樹脂(B)及光聚合起始劑,且前述光硬化性樹脂(A)及前述熱塑性樹脂(B)具有聚合性不飽和雙鍵以外之聚合性官能基,可解決前述課題,乃至完成本發明。 [發明之效果]The inventors of the present case found that by using a curable adhesive composition, which contains a photocurable resin (A), a thermoplastic resin (B) and a photopolymerization initiator, and the aforementioned photocurable resin (A) and the aforementioned The thermoplastic resin (B) has a polymerizable functional group other than a polymerizable unsaturated double bond, so that the aforementioned problems can be solved, leading to the completion of the present invention. [Effect of Invention]

本發明之硬化性黏接劑組成物即使在照射活性能量射線後也不會進行快速激烈的硬化反應,並具有接合所需要的柔軟性,故能在施予外部刺激後將黏接劑組成物與構件彼此進行疊層。 本發明之硬化性黏接劑組成物即使在例如光無法透射之構件仍可接合。 本發明之硬化性黏接劑組成物在硬化時,也可因應需要進行加熱,但由於活性能量射線之照射所致硬化已開始進行,故在高溫實施硬化步驟並非必要,即使在低溫加熱仍可充分地使硬化進行,且能在短時間內將構件彼此牢固地接合。The curable adhesive composition of the present invention does not undergo a rapid and violent hardening reaction even after being irradiated with active energy rays, and has the flexibility required for bonding, so the adhesive composition can be released after an external stimulus is applied. Stacking with components. The curable adhesive composition of the present invention can be bonded even to members that cannot transmit light, for example. The hardening adhesive composition of the present invention can also be heated according to need when hardening, but since the hardening has already started due to the irradiation of active energy rays, it is not necessary to perform the hardening step at a high temperature, and it can be heated even at a low temperature. Hardening is sufficiently advanced, and members can be firmly joined to each other in a short time.

本發明之硬化性黏接劑組成物含有光硬化性樹脂(A)、熱塑性樹脂(B)及光聚合起始劑,且前述光硬化性樹脂(A)及前述熱塑性樹脂(B)具有聚合性不飽和雙鍵以外之聚合性官能基,故硬化後可形成緻密的交聯結構,並充分地接合被黏接體,因此可專門使用作為將圖像顯示裝置所使用之各種構件彼此牢固地予以接合之材料。 就本發明之硬化性黏接劑組成物而言,在使用該硬化性黏接劑組成物來形成黏接劑層並製得具有該黏接劑層之黏接片時,即使在將該黏接片捲繞於輥等並予以保存的情況下,仍可防止黏接劑層從輥的端部被擠出。The curable adhesive composition of the present invention contains a photocurable resin (A), a thermoplastic resin (B) and a photopolymerization initiator, and the photocurable resin (A) and the thermoplastic resin (B) are polymerizable Polymerizable functional group other than unsaturated double bonds, so it can form a dense crosslinked structure after hardening, and fully bond the adherend, so it can be specially used to firmly bond various components used in image display devices to each other Materials for joining. Regarding the curable adhesive composition of the present invention, when the adhesive layer is formed using the curable adhesive composition and an adhesive sheet having the adhesive layer is produced, even when the adhesive Even when the sheet is wound on a roll or the like and stored, the adhesive layer can be prevented from being extruded from the end of the roll.

本發明之硬化性黏接劑組成物,係使用於將2個以上之具有活性能量射線不會透射的面之被黏接體予以貼合之用途,並含有光硬化性樹脂(A)、熱塑性樹脂(B)及光聚合起始劑,且前述光硬化性樹脂(A)及前述熱塑性樹脂(B)具有聚合性不飽和雙鍵以外之聚合性官能基。The curable adhesive composition of the present invention is used for laminating two or more adherends having surfaces that do not transmit active energy rays, and contains photocurable resin (A), thermoplastic The resin (B) and the photopolymerization initiator, and the aforementioned photocurable resin (A) and the aforementioned thermoplastic resin (B) have a polymerizable functional group other than a polymerizable unsaturated double bond.

就本發明之硬化性黏接劑組成物而言,係在施予外部刺激並將前述硬化性黏接劑組成物之聚合性官能基活化後貼附到被黏接體,故可在前述硬化性黏接劑組成物之反應性提高的狀態下進行硬化。藉此,比起不使其活化的狀態,可在低溫且短時間進行硬化。The curable adhesive composition of the present invention adheres to the adherend after applying an external stimulus and activating the polymerizable functional group of the curable adhesive composition, so it can be Hardening is performed in a state where the reactivity of the adhesive composition is improved. Thereby, hardening can be performed at a low temperature and in a short time compared with the state without activation.

就前述外部刺激而言,有熱、光(活性能量射線)、水分(濕氣)等,但不限於此,宜使用熱、光,使用光更佳。利用光來活化的硬化性黏接劑組成物若在未照射光的狀態,則無論保存溫度如何,硬化都不會進行,保存安定性良好,且即使不加熱也能活化反應性部位,故能在低溫進行硬化。又,外部刺激可單獨使用一種,也可將多種合併使用。The aforementioned external stimuli include heat, light (active energy ray), water (moisture) and the like, but are not limited thereto. Heat and light are preferred, and light is more preferred. If the curable adhesive composition activated by light is not irradiated with light, it will not harden regardless of the storage temperature, the storage stability is good, and the reactive part can be activated even without heating, so it can Hardening takes place at low temperature. Also, one type of external stimulus may be used alone, or multiple types may be used in combination.

例如就前述外部刺激而言,除使用前述光之外更合併使用熱時,因為前述光所致反應已開始進行,故充其量熱乃為了促進硬化反應而使用,不需要在高溫加熱,即使於低溫下且短時間之反應仍可獲得良好的硬化反應。For example, in terms of the aforementioned external stimuli, when heat is used in addition to the aforementioned light, since the reaction caused by the aforementioned light has already started, the heat is at best used to promote the hardening reaction, and it is not necessary to heat at a high temperature, even at a low temperature. A good hardening reaction can still be obtained with a short and short reaction time.

本發明之硬化性黏接劑組成物所含的光硬化性樹脂(A)及熱塑性樹脂(B)具有聚合性不飽和雙鍵以外之聚合性官能基。藉此,能抑制在施予外部刺激後急速的硬化反應,並使硬化反應緩緩地進行,故在施予外部刺激後仍可具有接合所需的柔軟性。其結果,能在施予外部刺激後將黏接劑組成物與構件彼此疊層。The photocurable resin (A) and thermoplastic resin (B) contained in the curable adhesive composition of the present invention have polymerizable functional groups other than polymerizable unsaturated double bonds. This suppresses the rapid hardening reaction after the external stimulus is applied, and slows down the hardening reaction, so that the flexibility required for bonding can be maintained even after the external stimulus is applied. As a result, the adhesive composition and the member can be laminated upon application of an external stimulus.

若為前述硬化性黏接劑組成物,則例如在照射光後,硬化會緩緩地進行,故照射光後仍具有接合所需要的柔軟性,即使在光無法透射之被黏接體仍可進行接合。In the case of the aforementioned curable adhesive composition, for example, after light irradiation, hardening proceeds slowly, so after light irradiation, it still has the flexibility required for bonding, and it can be used even in adherends that cannot transmit light. to join.

就前述硬化性黏接劑組成物而言,考量硬化前的操作性優良,且厚度調整容易的情況,宜使用事先成形為片狀者。As for the aforementioned curable adhesive composition, it is preferable to use a preformed sheet-like composition in consideration of excellent workability before hardening and easy adjustment of thickness.

就前述片狀接合材而言,宜使用厚度落在50~2000μm之範圍者,使用落在100~1500μm之範圍者更佳,使用落在200~1000μm之範圍者的話,硬化前的操作性優良,且例如對於被黏接體表面有凹凸、撓曲等高低差者仍可進行隨附,故較理想。As for the aforementioned sheet-like bonding material, it is preferable to use a thickness in the range of 50-2000 μm, more preferably in the range of 100-1500 μm, and to use a thickness in the range of 200-1000 μm, which has excellent workability before hardening , and for example, it is ideal for those with unevenness, deflection, etc. on the surface of the adherend, which can still be attached.

就前述硬化性黏接劑組成物而言,使用其於40℃的損耗正切(tanδ40 )以頻率1Hz測定時未達1.5者的話,在獲得如下之硬化性黏接劑組成物方面較理想:硬化前之操作性優良,例如即使將具有使用硬化性黏接劑組成物形成的黏接劑層之黏接片捲繞於輥等並將其予以保存時,仍可防止黏接劑層從輥的端部被擠出,且隨附於構件之撓曲、表面之高低差部之隨附性獲得改善;落在0.01以上且1.0以下之範圍更佳;使用落在0.1以上且0.8以下之範圍者的話,在如下硬化性黏接劑組成物方面更理想:硬化前之操作性更優良,例如即使將具有使用硬化性黏接劑組成物形成的黏接劑層之黏接片捲繞於輥等並將其予以保存時,仍可更進一步防止黏接劑層從輥的端部被擠出。As for the aforementioned curable adhesive composition, if its loss tangent (tanδ 40 ) at 40°C is less than 1.5 when measured at a frequency of 1 Hz, it is ideal to obtain the following curable adhesive composition: Excellent workability before hardening. For example, even when an adhesive sheet having an adhesive layer formed using a curable adhesive composition is wound on a roll and stored, the adhesive layer can still be prevented from falling from the roll. The end part of is extruded, and the accompanying property of the deflection of the member and the height difference of the surface is improved; it is better to fall in the range of 0.01 or more and 1.0 or less; use the range of 0.1 or more and 0.8 or less In the latter case, it is more preferable in terms of a curable adhesive composition that has better operability before curing, for example, even if an adhesive sheet having an adhesive layer formed using a curable adhesive composition is wound on a roll When waiting and storing it, it is still possible to further prevent the adhesive layer from being extruded from the end of the roll.

就前述硬化性黏接劑組成物而言,使用其於60℃的損耗正切(tanδ60 )以頻率1Hz測定時為1.5以上者的話,在獲得如下之硬化性黏接劑組成物方面較理想:硬化前之操作性優良,例如即使將具有使用硬化性黏接劑組成物形成的黏接劑層之黏接片捲繞於輥等並將其予以保存時,仍可防止黏接劑層從輥的端部被擠出,且隨附於構件之撓曲、表面之高低差部之隨附性獲得改善,使用2.0以上者更佳,使用5.0以上者再更佳,使用10.0以上者的話,在獲得隨附於構件之撓曲、表面之高低差部之隨附性更進一步獲得改善之硬化性黏接劑組成物方面更理想。Regarding the aforementioned curable adhesive composition, if the loss tangent (tanδ 60 ) at 60°C is measured at a frequency of 1 Hz and is 1.5 or higher, it is more ideal to obtain the following curable adhesive composition: Excellent workability before hardening. For example, even when an adhesive sheet having an adhesive layer formed using a curable adhesive composition is wound on a roll and stored, the adhesive layer can still be prevented from falling from the roll. The ends are extruded, and the compliance with the deflection of the member and the height difference of the surface is improved. It is better to use 2.0 or more, and it is even better to use 5.0 or more. If you use 10.0 or more, in It is more desirable to obtain a curable adhesive composition that further improves the compliance with the deflection of the member and the surface level difference.

另外,上述於40℃的損耗正切(tanδ40 )及於60℃的損耗正切(tanδ60 )係使用動態黏彈性試驗機(Rheometrics公司製,商品名:ARES 2KSTD),將試驗片挾持於係該試驗機的測定部之平行圓盤之間,測定於溫度40℃或60℃、及頻率1Hz的儲藏彈性模量(G’)與損失彈性模量(G”),損耗正切(tanδ)係將前述損失彈性模量(G”)除以前述儲藏彈性模量(G’)而得的值(G”/G’)。另外,就上述測定所使用的試驗片而言,係使用將前述使用硬化性黏接劑組成物形成的黏接劑層裁切成由厚度1mm且直徑8mm之大小構成的圓形狀者。In addition, the above-mentioned loss tangent (tanδ 40 ) at 40°C and loss tangent (tanδ 60 ) at 60°C were obtained by using a dynamic viscoelasticity testing machine (manufactured by Rheometrics, trade name: ARES 2KSTD), and the test piece was clamped in the system. The storage elastic modulus (G') and loss elastic modulus (G") are measured at a temperature of 40°C or 60°C and a frequency of 1Hz between the parallel disks of the measuring part of the testing machine. The loss tangent (tanδ) is expressed as The value (G"/G') obtained by dividing the aforementioned loss elastic modulus (G") by the aforementioned storage elastic modulus (G'). In addition, for the test piece used for the above measurement, the above-mentioned The adhesive layer formed of the curable adhesive composition was cut into a circular shape having a thickness of 1 mm and a diameter of 8 mm.

另外,前述硬化性黏接劑組成物之於40℃的損耗正切(tanδ40 )及於60℃的損耗正切(tanδ60 )可藉由適當選擇前述光硬化性樹脂(A)、前述熱塑性樹脂(B)、因應需要之其他成分等的組成或其數目平均分子量等,而設定在前述預定的範圍內。In addition, the loss tangent (tanδ 40 ) at 40°C and the loss tangent (tanδ 60 ) at 60°C of the aforementioned curable adhesive composition can be determined by appropriately selecting the aforementioned photocurable resin (A), the aforementioned thermoplastic resin ( B) According to the composition or number average molecular weight of other components, etc. as required, it is set within the aforementioned predetermined range.

又,就前述硬化性黏接劑組成物而言,宜使用於30℃至120℃之範圍內具有熔點者,為於35℃至90℃之範圍內具有熔點者更佳,為於40℃至60℃之範圍內具有熔點者,在獲得如下之硬化性黏接劑組成物方面較理想:硬化前之操作性優良,例如即使將具有使用硬化性黏接劑組成物形成的黏接劑層之黏接片捲繞於輥等並將其予以保存時,仍可防止黏接劑層從輥的端部被擠出,且隨附於構件之撓曲、表面之高低差部之隨附性獲得改善。Also, as for the aforementioned hardening adhesive composition, it is preferable to use one having a melting point in the range of 30°C to 120°C, more preferably one having a melting point in the range of 35°C to 90°C, and one having a melting point in the range of 40°C to 90°C. Those having a melting point within the range of 60°C are ideal for obtaining a curable adhesive composition that has excellent workability before hardening, for example, even if an adhesive layer formed using a curable adhesive composition is used. When the adhesive sheet is wound on a roll or the like and stored, the adhesive layer can still be prevented from being extruded from the end of the roll, and the attachment to the deflection of the member and the level difference of the surface can be obtained. improve.

另外,前述熔點係指使用差示掃描熱量測定法(DSC法),以昇溫速度10℃/分鐘之昇溫條件從20℃昇溫至150℃,保持1分鐘後,以10℃/分鐘之降溫條件暫時冷卻至-10℃,保持10分鐘後,再度以10℃/分鐘之昇溫條件進行測定時所觀察到的顯示最大放熱峰部(放熱峰頂)之溫度。In addition, the above-mentioned melting point refers to the use of differential scanning calorimetry (DSC method), the temperature is raised from 20°C to 150°C at a heating rate of 10°C/min, and after holding for 1 minute, it is temporarily heated at a temperature of 10°C/min. After cooling to -10°C and keeping it for 10 minutes, the temperature of the maximum exothermic peak (exothermic peak top) observed when the temperature is raised again at 10°C/min is measured.

本發明之硬化性黏接劑組成物含有光硬化性樹脂(A),且前述光硬化性樹脂(A)具有聚合性不飽和雙鍵以外之聚合性官能基。The curable adhesive composition of the present invention contains a photocurable resin (A), and the photocurable resin (A) has a polymerizable functional group other than a polymerizable unsaturated double bond.

就前述光硬化性樹脂(A)而言,宜使用光陽離子聚合性化合物及/或光陰離子聚合性化合物。藉由使用前述光陽離子聚合性化合物及/或光陰離子聚合性化合物,可在硬化時不受氧的妨礙,且於照射後反應仍可繼續進行,並且由於照射光後會和構件進行疊層,即使對光不會透射之構件仍可進行疊層。尤其是使用陽離子聚合性化合物的話,照射光後之反應性優良,容易獲得硬化後之高接合性,故較理想。前述光聚合性化合物可單獨使用,也可合併使用。It is preferable to use a photocationically polymerizable compound and/or a photoanionically polymerizable compound for the said photocurable resin (A). By using the aforementioned photocationically polymerizable compound and/or photoanionically polymerizable compound, it is not hindered by oxygen during curing, and the reaction can still continue after irradiation, and since it will be laminated with the member after irradiation with light, Even components that do not transmit light can still be laminated. In particular, the use of a cationically polymerizable compound is preferable since it is excellent in reactivity after irradiation with light, and it is easy to obtain high adhesiveness after curing. The aforementioned photopolymerizable compounds may be used alone or in combination.

就前述光陽離子聚合性化合物而言,若為1分子中具有1個以上之光陽離子聚合性官能基者,則無特別限制。就光陽離子聚合性化合物而言,宜為1分子中具有1個以上之環氧基、氧雜環丁烷基、羥基、乙烯基醚基、環硫醚基、伸乙亞胺基、㗁唑啉基等光陽離子聚合性官能基者。其中,就獲得高硬化性與硬化後之接合性方面,前述光陽離子聚合性化合物為具有環氧基、氧雜環丁烷基者更佳。The aforementioned photocationically polymerizable compound is not particularly limited as long as it has one or more photocationically polymerizable functional groups in one molecule. For photocationically polymerizable compounds, it is preferable to have one or more epoxy groups, oxetanyl groups, hydroxyl groups, vinyl ether groups, episulfide groups, ethyleneimine groups, and oxazole groups in one molecule. Photocationically polymerizable functional groups such as linyl groups. Among them, in terms of obtaining high curability and bondability after curing, it is more preferable that the aforementioned photocationically polymerizable compound has an epoxy group or an oxetanyl group.

就前述具有環氧基之光陽離子聚合性化合物而言,可使用1分子中具有1個以上環氧基之化合物。具體而言,可使用:雙酚A型環氧樹脂、雙酚F型環氧樹脂、聯苯型環氧樹脂、四甲基聯苯型環氧樹脂、多羥基萘型環氧樹脂、異氰酸酯改性環氧樹脂、10-(2,5-二羥基苯基)-9,10-二氫-9-氧雜-10-磷雜菲-10-氧化物改性環氧樹脂、苯酚酚醛清漆型環氧樹脂、甲酚酚醛清漆型環氧樹脂、己烷二醇型環氧樹脂、三苯甲烷型環氧樹脂、四苯乙烷型環氧樹脂、雙環戊二烯-苯酚加成反應型環氧樹脂、苯酚芳烷基型環氧樹脂、萘酚酚醛清漆型環氧樹脂、萘酚芳烷基型環氧樹脂、萘酚-苯酚共縮聚酚醛清漆型環氧樹脂、萘酚-甲酚共縮聚酚醛清漆型環氧樹脂、芳香族烴甲醛樹脂改性酚醛樹脂型環氧樹脂、聯苯改性酚醛清漆型環氧樹脂、三羥甲基丙烷型環氧樹脂、脂環族環氧樹脂、具有環氧基之丙烯酸系樹脂、具有環氧基之聚胺甲酸酯樹脂、具有環氧基之聚酯樹脂、具有可撓性之環氧樹脂等。The compound which has one or more epoxy groups in 1 molecule can be used for the said photocationically polymerizable compound which has an epoxy group. Specifically, bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenyl type epoxy resin, tetramethylbiphenyl type epoxy resin, polyhydroxynaphthalene type epoxy resin, isocyanate modified Reactive epoxy resin, 10-(2,5-dihydroxyphenyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide modified epoxy resin, phenol novolak type Epoxy resin, cresol novolak type epoxy resin, hexanediol type epoxy resin, triphenylmethane type epoxy resin, tetraphenylethane type epoxy resin, dicyclopentadiene-phenol addition reaction type cyclopentadiene Oxygen resin, phenol aralkyl type epoxy resin, naphthol novolak type epoxy resin, naphthol aralkyl type epoxy resin, naphthol-phenol co-condensation novolak type epoxy resin, naphthol-cresol co-condensation Polycondensation novolak type epoxy resin, aromatic hydrocarbon formaldehyde resin modified phenolic resin type epoxy resin, biphenyl modified novolac type epoxy resin, trimethylolpropane type epoxy resin, alicyclic epoxy resin, Acrylic resin with epoxy group, polyurethane resin with epoxy group, polyester resin with epoxy group, flexible epoxy resin, etc.

其中,就前述環氧樹脂而言,宜使用脂環族環氧樹脂或多官能脂肪族型環氧樹脂,使用脂環族環氧樹脂的話,由於前述光陽離子聚合性優良,而可獲得硬化性優良的接合材,故較理想。Among them, as for the above-mentioned epoxy resin, it is preferable to use an alicyclic epoxy resin or a multifunctional aliphatic epoxy resin. If an alicyclic epoxy resin is used, since the above-mentioned photocationic polymerizability is excellent, it is possible to obtain curability. Excellent bonding material, so ideal.

此外,也可在它們之中摻合其他樹脂成分等、或加成其他樹脂成分等來提高可撓性、或用來改善黏接力、彎曲力,就如此的改性物而言,可使用CTBN(末端含有羧基之丁二烯-丙烯腈橡膠)改性環氧樹脂;使丙烯酸系橡膠、NBR、SBR、丁基橡膠或異戊二烯橡膠等各種橡膠分散於樹脂而得的環氧樹脂;以如上所述之液狀橡膠進行改性而得的環氧樹脂;添加丙烯酸系樹脂、胺甲酸酯系樹脂、脲樹脂、聚酯樹脂、苯乙烯樹脂等各種樹脂而成的環氧樹脂;螯合改性環氧樹脂;多元醇改性環氧樹脂等。In addition, other resin components can also be mixed with them, or other resin components can be added to improve flexibility, or to improve adhesion and bending strength. For such modified products, CTBN can be used (butadiene-acrylonitrile rubber with carboxyl group at the end) modified epoxy resin; epoxy resin obtained by dispersing various rubbers such as acrylic rubber, NBR, SBR, butyl rubber or isoprene rubber in the resin; Epoxy resin modified by liquid rubber as mentioned above; epoxy resin added with various resins such as acrylic resin, urethane resin, urea resin, polyester resin, and styrene resin; Chelating modified epoxy resin; polyol modified epoxy resin, etc.

就前述具有氧雜環丁烷基之光陽離子聚合性化合物而言,可列舉:1,4-雙((3-乙基-3-氧雜環丁烷基甲氧基)甲基)苯、1,4-雙((3-甲基-3-氧雜環丁烷基甲氧基)甲基)苯、3-甲基-3-環氧丙基氧雜環丁烷、3-乙基-3-環氧丙基氧雜環丁烷、3-甲基-3-羥甲基氧雜環丁烷、3-乙基-3-羥甲基氧雜環丁烷、二(1-乙基(3-氧雜環丁烷基)甲基)醚等氧雜環丁烷化合物。Examples of the aforementioned photocationically polymerizable compound having an oxetanyl group include: 1,4-bis((3-ethyl-3-oxetanylmethoxy)methyl)benzene, 1,4-bis((3-methyl-3-oxetanylmethoxy)methyl)benzene, 3-methyl-3-epoxypropyloxetane, 3-ethyl -3-epoxypropyl oxetane, 3-methyl-3-hydroxymethyl oxetane, 3-ethyl-3-hydroxymethyl oxetane, two (1-ethyl Oxetane compounds such as (3-oxetanyl)methyl) ether.

前述光硬化性樹脂(A)宜在相對於硬化性黏接劑組成物之總量為10質量%~50質量%之範圍內使用,在20質量%~40質量%之範圍內使用的話,在可獲得如下之黏接劑組成物方面更理想:硬化後之接合性不會降低,且例如即使將由硬化性黏接劑組成物構成的黏接片捲繞於輥等並將其予以保存時,仍可更進一步防止黏接劑層從輥的端部被擠出,且隨附於構件之撓曲、表面之高低差部之隨附性更進一步獲得改善。The aforementioned photocurable resin (A) is preferably used in the range of 10% by mass to 50% by mass relative to the total amount of the curable adhesive composition, and if used in the range of 20% by mass to 40% by mass, the It is more desirable to obtain an adhesive composition that does not lower the bondability after curing and, for example, even when an adhesive sheet composed of a curable adhesive composition is wound on a roll or the like and stored, It is still possible to further prevent the adhesive layer from being extruded from the end of the roller, and the compliance with the deflection of the member and the unevenness of the surface is further improved.

又,本發明之硬化性黏接劑組成物含有熱塑性樹脂(B)。 前述熱塑性樹脂(B)具有聚合性不飽和雙鍵以外之聚合性官能基。藉由使用前述具有聚合性不飽和雙鍵以外之聚合性官能基之熱塑性樹脂(B),能和前述聚合性化合物(A)相互反應,且能抑制施予外部刺激後之急速的硬化反應,並使硬化反應緩緩地進行,故在施予外部刺激後仍可具有接合所需要的柔軟性。其結果,能在施予外部刺激後將黏接劑組成物與構件彼此疊層。Moreover, the curable adhesive composition of this invention contains a thermoplastic resin (B). The aforementioned thermoplastic resin (B) has a polymerizable functional group other than a polymerizable unsaturated double bond. By using the thermoplastic resin (B) having a polymerizable functional group other than the polymerizable unsaturated double bond, it can interact with the aforementioned polymerizable compound (A), and can suppress the rapid hardening reaction after external stimulus is applied, And the hardening reaction proceeds slowly, so it can still have the flexibility required for bonding after external stimulation is applied. As a result, the adhesive composition and the member can be laminated upon application of an external stimulus.

就前述熱塑性樹脂(B)所具有的聚合性官能基而言,宜至少具有選自於由異氰酸酯基、羥基、氧雜環丁烷基及環氧基構成之群組中之1種以上。藉由使用前述至少具有選自於由異氰酸酯基、羥基、氧雜環丁烷基及環氧基構成之群組中之1種以上之熱塑性樹脂(B),能和前述聚合性化合物(A)相互反應,且能在施予外部刺激後抑制急速的硬化反應,並使硬化反應緩緩地進行,故在施予外部刺激後仍可具有接合所需要的柔軟性。其結果,能在施予外部刺激後將黏接劑組成物與構件彼此疊層。The polymerizable functional group contained in the thermoplastic resin (B) preferably has at least one or more selected from the group consisting of an isocyanate group, a hydroxyl group, an oxetanyl group, and an epoxy group. By using the aforementioned thermoplastic resin (B) having at least one or more selected from the group consisting of isocyanate group, hydroxyl group, oxetanyl group, and epoxy group, it is possible to combine with the aforementioned polymerizable compound (A) They react with each other, and can suppress the rapid hardening reaction after the external stimulus is applied, and make the hardening reaction proceed slowly, so it can still have the flexibility required for bonding after the external stimulus is applied. As a result, the adhesive composition and the member can be laminated upon application of an external stimulus.

就前述熱塑性樹脂(B)而言,使用其於40℃的損耗正切(tanδ40 )以頻率1Hz測定時未達1.5者的話,在獲得如下之硬化性黏接劑組成物方面較理想:硬化前之操作性優良,例如即使將具有使用含有前述熱塑性樹脂(B)之硬化性黏接劑組成物形成的黏接劑層之黏接片捲繞於輥等並將其予以保存時,仍可防止黏接劑層從輥的端部被擠出,且隨附於構件之撓曲、表面之高低差部之隨附性獲得改善;落在0.01以上至1.0以下之範圍更佳;使用落在0.1以上至0.8以下之範圍者的話,在如下方面更理想:硬化前之操作性優良,例如即使將具有使用含有前述熱塑性樹脂(B)之硬化性黏接劑組成物形成的黏接劑層之黏接片捲繞於輥等並將其予以保存時,仍可更進一步防止黏接劑層從輥的端部被擠出。As for the aforementioned thermoplastic resin (B), if its loss tangent (tanδ 40 ) at 40°C is less than 1.5 when measured at a frequency of 1 Hz, it is ideal for obtaining the following curable adhesive composition: before hardening The workability is excellent, for example, even when the adhesive sheet having the adhesive layer formed by using the curable adhesive composition containing the aforementioned thermoplastic resin (B) is wound on a roll or the like and stored, the The adhesive layer is extruded from the end of the roller, and the attachment to the deflection of the member and the height difference of the surface is improved; it is better to fall in the range of 0.01 or more to 1.0 or less; use 0.1 If the range is more than 0.8, it is more preferable in the following aspects: the workability before curing is excellent, for example, even if the adhesive layer is formed using the curable adhesive composition containing the aforementioned thermoplastic resin (B). When the tab is wound on a roll or the like and stored, the adhesive layer can be further prevented from being extruded from the end of the roll.

就前述熱塑性樹脂(B)而言,使用其於60℃的損耗正切(tanδ60 )以頻率1Hz測定時為1.5以上者的話,在獲得如下之硬化性黏接劑組成物方面較理想:硬化前之操作性優良,例如即使將具有使用含有前述熱塑性樹脂(B)之硬化性黏接劑組成物形成的黏接劑層之黏接片捲繞於輥等並將其予以保存時,仍可防止黏接劑層從輥的端部被擠出,且隨附於構件之撓曲、表面之高低差部之隨附性獲得改善,使用5.0以上者更佳,使用10.0以上者的話,在獲得隨附於構件之撓曲、表面之高低差部之隨附性更進一步獲得改善之硬化性黏接劑組成物方面更理想。As for the aforementioned thermoplastic resin (B), if the loss tangent (tanδ 60 ) at 60°C is measured at a frequency of 1 Hz and is 1.5 or higher, it is preferable to obtain a curable adhesive composition as follows: The workability is excellent, for example, even when the adhesive sheet having the adhesive layer formed by using the curable adhesive composition containing the aforementioned thermoplastic resin (B) is wound on a roll or the like and stored, the The adhesive layer is extruded from the end of the roller, and the compliance with the deflection of the member and the unevenness of the surface is improved. It is better to use 5.0 or more. It is more ideal in terms of a hardening adhesive composition that can further improve the adherence to the deflection of the member and the unevenness of the surface.

另外,上述於40℃的損耗正切(tanδ40 )及於60℃的損耗正切(tanδ60 )係利用動態黏彈性試驗機(Rheometrics公司製,商品名:ARES 2KSTD),將試驗片挾持於係該試驗機的測定部之平行圓盤之間,測定於溫度40℃或60℃、及頻率1Hz之儲藏彈性模量(G’)與損失彈性模量(G”),損耗正切(tanδ)係將前述損失彈性模量(G”)除以前述儲藏彈性模量(G’)而得的值(G”/G’)。另外,就上述測定所使用的試驗片而言,係使用將前述使用硬化性黏接劑組成物形成的黏接劑層裁切成由厚度1mm且直徑8mm之大小構成的圓形狀者。In addition, the above-mentioned loss tangent (tanδ 40 ) at 40°C and loss tangent (tanδ 60 ) at 60°C were obtained by using a dynamic viscoelasticity testing machine (manufactured by Rheometrics Co., Ltd., trade name: ARES 2KSTD), and the test piece was clamped in the system. The storage elastic modulus (G') and loss elastic modulus (G") are measured at a temperature of 40°C or 60°C and a frequency of 1Hz between the parallel disks of the measuring part of the testing machine. The loss tangent (tanδ) is expressed as The value (G"/G') obtained by dividing the aforementioned loss elastic modulus (G") by the aforementioned storage elastic modulus (G'). In addition, for the test piece used for the above measurement, the above-mentioned The adhesive layer formed of the curable adhesive composition was cut into a circular shape having a thickness of 1 mm and a diameter of 8 mm.

另外,前述熱塑性樹脂(B)之於40℃的損耗正切(tanδ40 )及於60℃的損耗正切(tanδ60 ),例如使用胺甲酸酯系樹脂時,可藉由適當選擇構成胺甲酸酯系樹脂之多元醇與多異氰酸酯等之組成或其數目平均分子量等,而設定在前述預定的範圍內。In addition, the loss tangent (tanδ 40 ) at 40°C and the loss tangent (tanδ 60 ) at 60°C of the above-mentioned thermoplastic resin (B), for example, when using a urethane-based resin, can be properly selected to form urethane The composition of the polyol and polyisocyanate of the ester resin or the number average molecular weight thereof is set within the aforementioned predetermined range.

又,就前述熱塑性樹脂(B)而言,宜使用於30℃~120℃之範圍內具有熔點者,為於35℃~100℃之範圍內具有熔點者更佳,為於40℃~80℃之範圍內具有熔點者,在獲得如下之硬化性黏接劑組成物方面較理想:硬化前之操作性優良,例如即使將具有使用含有前述熱塑性樹脂(B)之硬化性黏接劑組成物形成的黏接劑層之黏接片捲繞於輥等並將其予以保存時,仍可防止黏接劑層從輥的端部被擠出,且隨附於構件之撓曲、表面之高低差部之隨附性獲得改善。Also, for the aforementioned thermoplastic resin (B), it is preferable to use one having a melting point in the range of 30°C to 120°C, more preferably one having a melting point in the range of 35°C to 100°C, and one having a melting point in the range of 40°C to 80°C. Those having a melting point within the above range are ideal for obtaining a curable adhesive composition that is excellent in workability before hardening, for example, even if a curable adhesive composition containing the aforementioned thermoplastic resin (B) is formed When the adhesive sheet of the adhesive layer is wound on a roll or the like and stored, the adhesive layer can still be prevented from being extruded from the end of the roll, and it is attached to the deflection of the component and the level difference of the surface The attachment of parts has been improved.

另外,前述熔點係指使用差示掃描熱量測定法(DSC法),以昇溫速度10℃/分鐘之昇溫條件從20℃昇溫至150℃,保持1分鐘後,以10℃/分鐘之降溫條件暫時冷卻至-10℃,保持10分鐘後,再度以10℃/分鐘之昇溫條件進行測定時所觀察到的顯示最大放熱峰部(放熱峰頂)之溫度。In addition, the above-mentioned melting point refers to the use of differential scanning calorimetry (DSC method), the temperature is raised from 20°C to 150°C at a heating rate of 10°C/min, and after holding for 1 minute, it is temporarily heated at a temperature of 10°C/min. After cooling to -10°C and keeping it for 10 minutes, the temperature of the maximum exothermic peak (exothermic peak top) observed when the temperature is raised again at 10°C/min is measured.

又,就前述熱塑性樹脂(B)而言,在可獲得如下之黏接劑組成物方面,宜使用重量平均分子量落在2000~2000000之範圍之黏接性樹脂:硬化前之操作性優良,且例如即使將具有使用前述硬化性黏接劑組成物形成的黏接劑層之黏接片捲繞於輥等並將其予以保存時,仍可更進一步防止黏接劑層從輥的端部被擠出,且隨附於構件之撓曲、表面之高低差部之隨附性更進一步得到改善。更理想的重量平均分子量之範圍為5000~1000000,再更理想的重量平均分子量之範圍為5000~800000。重量平均分子量過小的話,硬化前之硬化性黏接劑組成物的凝聚力不足,隨時間經過會發生硬化性黏接劑組成物滲出等導致操作性降低。又,重量平均分子量過大的話,有時會有和前述光硬化性樹脂(A)之相容性降低的情況。In addition, as the aforementioned thermoplastic resin (B), it is preferable to use an adhesive resin having a weight-average molecular weight in the range of 2,000 to 2,000,000 in order to obtain an adhesive composition that has excellent workability before hardening, and For example, even when an adhesive sheet having an adhesive layer formed using the curable adhesive composition described above is wound up on a roll or the like and stored, the adhesive layer can be further prevented from being drawn from the end of the roll. Extrusion, and the compliance with the deflection of the member and the unevenness of the surface are further improved. A more ideal range of weight average molecular weight is 5,000-1,000,000, and an even more ideal range of weight average molecular weight is 5,000-800,000. If the weight average molecular weight is too small, the cohesive force of the curable adhesive composition before curing is insufficient, and the curable adhesive composition oozes out over time, resulting in a decrease in workability. Moreover, when a weight average molecular weight is too large, compatibility with the said photocurable resin (A) may fall.

就前述熱塑性樹脂(B)而言,可列舉例如:聚酯樹脂、胺甲酸酯系樹脂、丙烯酸系樹脂、聚乙烯醇縮醛樹脂等。這些黏接性樹脂可為均聚物,也可為共聚物。又,這些黏接性樹脂可單獨使用,也可將2種以上合併使用。Examples of the thermoplastic resin (B) include polyester resins, urethane resins, acrylic resins, and polyvinyl acetal resins. These adhesive resins may be homopolymers or copolymers. In addition, these adhesive resins may be used alone or in combination of two or more.

就前述熱塑性樹脂(B)而言,使用胺甲酸酯系樹脂、丙烯酸系樹脂的話,在可獲得如下之黏接劑組成物方面較理想:硬化前之操作性優良,且例如即使將具有使用硬化性黏接劑組成物形成的黏接劑層之黏接片捲繞於輥等並將其予以保存時,仍可更進一步防止黏接劑層從輥的端部被擠出,且隨附於構件之撓曲、表面之高低差部之隨附性更進一步得到改善,使用胺甲酸酯系樹脂(B’)的話更理想。For the aforementioned thermoplastic resin (B), it is preferable to use a urethane-based resin or an acrylic resin in order to obtain an adhesive composition that is excellent in workability before hardening and, for example, even if it is used When the adhesive sheet of the adhesive layer formed by the curable adhesive composition is wound on a roll and stored, the adhesive layer can still be further prevented from being extruded from the end of the roll, and the accompanying It is more preferable to use a urethane-based resin (B') to further improve the conformability to the flexure of the member and the uneven portion of the surface.

前述胺甲酸酯系樹脂(B’)宜具有聚合性不飽和雙鍵以外之聚合性官能基。 藉由使用前述具有聚合性不飽和雙鍵以外之聚合性官能基之胺甲酸酯系樹脂(B’),能抑制對前述黏接劑組成物施予外部刺激時之急速的反應,故能在施予外部刺激後將構件彼此接合。The aforementioned urethane resin (B') preferably has a polymerizable functional group other than a polymerizable unsaturated double bond. By using the urethane-based resin (B') having a polymerizable functional group other than a polymerizable unsaturated double bond, it is possible to suppress a rapid response to external stimuli to the aforementioned adhesive composition, so it is possible to The members are joined to each other after an external stimulus is applied.

就前述外部刺激而言,宜使用光。使聚合反應進行並形成硬化物時,藉由使用前述具有聚合性不飽和雙鍵以外之聚合性官能基之胺甲酸酯系樹脂(B’),不僅可利用光的照射進行聚合,亦可利用暗反應進行聚合,故例如能將光無法透射之構件彼此接合。As for the aforementioned external stimulus, light is preferably used. When the polymerization reaction is advanced to form a cured product, by using the above-mentioned urethane resin (B') having a polymerizable functional group other than the polymerizable unsaturated double bond, not only polymerization can be performed by irradiation with light, but also Polymerization is carried out by means of a dark reaction, so that, for example, members that cannot transmit light can be joined to each other.

就前述外部刺激而言,除了使用前述光之外,也可因應需要合併使用熱。此時,由於因前述光所致反應已開始進行,故充其量熱乃為了促進硬化反應而使用,不需要在高溫加熱,即使於低溫下且短時間之反應仍可獲得良好的硬化反應。As for the aforementioned external stimulus, in addition to the aforementioned light, heat may also be used in combination if necessary. At this time, since the aforementioned light-induced reaction has already started, the heat is used to promote the hardening reaction at best. It is not necessary to heat at a high temperature, and a good hardening reaction can be obtained even at a low temperature and for a short time.

就前述聚合性不飽和雙鍵以外之聚合性官能基而言,宜至少具有選自於由異氰酸酯基、羥基、氧雜環丁烷基及環氧基構成之群組中之1種以上。 就具有前述異氰酸酯基之胺甲酸酯系樹脂(B’)而言,例如可使用藉由使多元醇(b’1)與多異氰酸酯(b’2)進行反應而得到的具有異氰酸酯基之聚胺甲酸酯(B’1)。The polymerizable functional group other than the aforementioned polymerizable unsaturated double bond preferably has at least one or more selected from the group consisting of an isocyanate group, a hydroxyl group, an oxetanyl group, and an epoxy group. As the urethane resin (B') having the aforementioned isocyanate group, for example, a polyisocyanate group-containing polyol (b'1) obtained by reacting a polyisocyanate (b'2) can be used. Carbamate (B'1).

就具有前述羥基之胺甲酸酯系樹脂(B’)而言,例如可使用藉由使多元醇(b’1)與多異氰酸酯(b’2)進行反應而得到的具有羥基之聚胺甲酸酯(B’2)。As the urethane-based resin (B') having the aforementioned hydroxyl group, for example, polyurethane having a hydroxyl group obtained by reacting a polyol (b'1) with a polyisocyanate (b'2) can be used. Ester (B'2).

就具有前述氧雜環丁烷基或環氧基之胺甲酸酯系樹脂(B’)而言,例如可使用藉由使具有前述異氰酸酯基之聚胺甲酸酯(B’1)與具有能和前述異氰酸酯基反應之官能基(b”1)且具有氧雜環丁烷基或環氧基且具有至少1個以上之不飽和雙鍵以外之聚合性官能基(b”2)之單體(B”)進行反應而得到的聚胺甲酸酯(B’3)。 就能和前述異氰酸酯基反應之官能基(b”1)而言,可使用例如:羥基、胺基、羧基、巰基等,宜使用:羥基、胺基。As for the urethane resin (B') having the aforementioned oxetanyl group or epoxy group, for example, a polyurethane (B'1) having the aforementioned isocyanate group can be used A functional group (b"1) that can react with the aforementioned isocyanate group and has an oxetanyl group or an epoxy group and has at least one polymerizable functional group (b"2) other than an unsaturated double bond. Polyurethane (B'3) obtained by reacting body (B"). As the functional group (b"1) capable of reacting with the aforementioned isocyanate group, for example: hydroxyl group, amino group, carboxyl group, mercapto group, etc. can be used, preferably: hydroxyl group, amino group.

就前述不飽和雙鍵以外之聚合性官能基(b”2)而言,係指所謂具有自由基聚合性之官能基以外者,例如係指具有陽離子聚合性之官能基及具有陰離子聚合性之官能基。 又,就前述不飽和雙鍵以外之聚合性官能基(b”2)而言,可使用例如:環氧基、氧雜環丁烷基、環硫乙烷基等,宜使用氧雜環丁烷基。The above-mentioned polymerizable functional group (b"2) other than the unsaturated double bond refers to those other than the so-called functional groups having radical polymerizability, such as functional groups having cationic polymerizability and anionic polymerizable functional groups. functional group. In addition, as for the polymerizable functional group (b"2) other than the above-mentioned unsaturated double bond, for example: epoxy group, oxetanyl group, epithiol group, etc. can be used, and oxetane group is preferably used. alkyl.

就前述單體(B”)而言,若為具有能和前述異氰酸酯基反應之官能基(b”1)及氧雜環丁烷基或環氧基且具有前述不飽和雙鍵以外之聚合性官能基(b”2)者,則無特別限制,可列舉例如:3-乙基-3-(4-羥基丁基)氧甲基-氧雜環丁烷、3-羥甲基-3-乙基氧雜環丁烷、2-羥甲基氧雜環丁烷、3-羥基氧雜環丁烷等。Regarding the aforementioned monomer (B"), if it has a functional group (b"1) capable of reacting with the aforementioned isocyanate group and an oxetanyl group or an epoxy group, and has polymerizability other than the aforementioned unsaturated double bond The functional group (b"2) is not particularly limited, and examples include: 3-ethyl-3-(4-hydroxybutyl)oxymethyl-oxetane, 3-hydroxymethyl-3- Ethyl oxetane, 2-hydroxymethyl oxetane, 3-hydroxy oxetane, etc.

就前述單體(B”)而言,相對於前述胺甲酸酯系樹脂(B’)100質量份,宜在5質量份~20質量份之範圍內使用,在5質量份~15質量份之範圍內使用更佳。The above-mentioned monomer (B") is preferably used within the range of 5 parts by mass to 20 parts by mass, and 5 parts by mass to 15 parts by mass relative to 100 parts by mass of the above-mentioned urethane resin (B'). It is better to use within the range.

就前述單體(B”)更具體而言,相對於前述胺甲酸酯系樹脂(B’)所具有的異氰酸酯基之莫耳數,宜使用可供給超過50莫耳%且100莫耳%以下之能和前述異氰酸酯基反應之官能基的量,使用可供給60莫耳%~100莫耳%之能和前述異氰酸酯基反應之官能基的量更佳,使用可供給80莫耳%~100莫耳%之能和前述異氰酸酯基反應之官能基的量再更佳。藉此,可獲得適當的柔軟性、快速硬化性、塗佈到基材後之保形性、機械性強度、耐久性(尤其是耐水解性)、黏合到基材之黏合性等優良的前述熱塑性樹脂(B)。More specifically, the aforementioned monomer (B") is preferably used to supply more than 50 mol% and 100 mol% of the isocyanate group moles of the aforementioned urethane resin (B'). The amount of the following functional groups that can react with the aforementioned isocyanate groups is better to use the amount of functional groups that can supply 60 mol% to 100 mol% of the energy to react with the aforementioned isocyanate groups, and use 80 mol% to 100 mol% The amount of the functional group that can react with the above-mentioned isocyanate group is even better. Thereby, appropriate flexibility, rapid hardening, shape retention, mechanical strength, and durability after being applied to the substrate can be obtained (especially hydrolysis resistance), the above-mentioned thermoplastic resin (B) excellent in adhesiveness to a base material, etc.

使前述胺甲酸酯系樹脂(B’)與前述單體(B”)反應時,可因應需要使用胺甲酸酯化觸媒。前述胺甲酸酯化觸媒可在前述胺甲酸酯化反應之任意階段適當地添加。前述胺甲酸酯化反應宜實施到異氰酸酯基含量(%)成為實質上的定值為止。When reacting the aforementioned urethane-based resin (B') with the aforementioned monomer (B"), a urethane-forming catalyst can be used as needed. The aforementioned urethane-forming catalyst can be added to the aforementioned urethane Add appropriately at any stage of the urethanization reaction. The above-mentioned urethanization reaction is preferably carried out until the isocyanate group content (%) becomes a substantially constant value.

就前述胺甲酸酯化觸媒而言,可使用例如:三乙胺、三乙二胺、N-甲基

Figure 108109010-A0304-12-01
啉等含氮化合物;乙酸鉀、硬脂酸鋅、辛酸錫(II)等有機金屬鹽;二月桂酸二丁基錫等有機金屬化合物等。As for the aforementioned urethanization catalyst, for example, triethylamine, triethylenediamine, N-methyl
Figure 108109010-A0304-12-01
Nitrogen-containing compounds such as morphine; organometallic salts such as potassium acetate, zinc stearate, and tin(II) octoate; organometallic compounds such as dibutyltin dilaurate, etc.

又,就前述胺甲酸酯系樹脂(B’)之製造所能使用的前述多元醇(b’1)而言,可使用選自於由聚碳酸酯多元醇、聚酯多元醇、聚醚多元醇構成之群組中之1種以上等。其中,就前述多元醇(b’1)而言,宜單獨使用聚碳酸酯多元醇、聚酯多元醇,或將2種以上組合使用,組合使用聚碳酸酯多元醇及聚酯多元醇的話,由於可獲得如下之硬化性黏接劑組成物故較理想:硬化前之操作性優良,且例如即使將含有前述胺甲酸酯系樹脂(B’)之硬化性黏接劑組成物的黏接片捲繞於輥等並將其予以保存時,仍可更進一步防止黏接劑層從輥的端部被擠出,且隨附於構件之撓曲、表面之高低差部之隨附性更進一步得到改善。In addition, as the aforementioned polyol (b'1) that can be used in the production of the aforementioned urethane resin (B'), it is possible to use polyols selected from polycarbonate polyols, polyester polyols, and polyether polyols. One or more types of the group consisting of polyols, etc. Among them, for the aforementioned polyol (b'1), it is preferable to use polycarbonate polyol and polyester polyol alone, or to use two or more of them in combination. When polycarbonate polyol and polyester polyol are used in combination, It is preferable to obtain a curable adhesive composition that is excellent in workability before curing and, for example, can be an adhesive sheet containing the curable adhesive composition of the above-mentioned urethane resin (B'). When it is wound on a roll and stored, the adhesive layer can still be further prevented from being extruded from the end of the roll, and the attachment to the deflection of the member and the level difference of the surface can be further improved. Improved.

就前述聚碳酸酯多元醇而言,可使用例如使碳酸酯及/或光氣與後述低分子多元醇進行反應而得者。 就前述碳酸酯而言,可使用例如:碳酸甲酯、碳酸二甲酯、碳酸乙酯、碳酸二乙酯、環碳酸酯、碳酸二苯酯等。As the above-mentioned polycarbonate polyol, for example, one obtained by reacting carbonate and/or phosgene with a low-molecular-weight polyol described later can be used. As the aforementioned carbonate, for example, methyl carbonate, dimethyl carbonate, ethyl carbonate, diethyl carbonate, cyclocarbonate, diphenyl carbonate and the like can be used.

又,就前述能和碳酸酯、光氣反應之低分子多元醇而言,可使用例如:乙二醇、二乙二醇、三乙二醇、四乙二醇、1,2-丙烷二醇、1,3-丙烷二醇、二丙二醇、三丙二醇、1,2-丁烷二醇、1,3-丁烷二醇、1,4-丁烷二醇、2,3-丁烷二醇、1,5-戊烷二醇、1,5-己烷二醇、1,6-己烷二醇、2,5-己烷二醇、1,7-庚烷二醇、1,8-辛烷二醇、1,9-壬烷二醇、1,10-癸烷二醇、1,11-十一烷二醇、1,12-十二烷二醇、2-甲基-1,3-丙烷二醇、新戊二醇、2-丁基-2-乙基-1,3-丙烷二醇、3-甲基-1,5-戊烷二醇、2-乙基-1,3-己烷二醇、2-甲基-1,8-辛烷二醇、1,4-環己烷二甲醇、對苯二酚、間苯二酚、雙酚A、雙酚F、4,4’-聯苯酚等。Also, as for the aforementioned low-molecular-weight polyols capable of reacting with carbonate and phosgene, for example, ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, and 1,2-propanediol can be used. , 1,3-propanediol, dipropylene glycol, tripropylene glycol, 1,2-butanediol, 1,3-butanediol, 1,4-butanediol, 2,3-butanediol , 1,5-pentanediol, 1,5-hexanediol, 1,6-hexanediol, 2,5-hexanediol, 1,7-heptanediol, 1,8- Octanediol, 1,9-nonanediol, 1,10-decanediol, 1,11-undecanediol, 1,12-dodecanediol, 2-methyl-1, 3-propanediol, neopentyl glycol, 2-butyl-2-ethyl-1,3-propanediol, 3-methyl-1,5-pentanediol, 2-ethyl-1, 3-hexanediol, 2-methyl-1,8-octanediol, 1,4-cyclohexanedimethanol, hydroquinone, resorcinol, bisphenol A, bisphenol F, 4 , 4'-biphenol and so on.

就前述聚碳酸酯多元醇而言,宜使用脂肪族聚碳酸酯多元醇或脂環族聚碳酸酯多元醇。As the aforementioned polycarbonate polyol, aliphatic polycarbonate polyol or alicyclic polycarbonate polyol is preferably used.

就脂肪族聚碳酸酯多元醇而言,在賦予含有前述胺甲酸酯系樹脂(B’)之硬化性黏接劑組成物例如於常溫下能進行貼附的等級之黏著性方面,宜使用使碳酸二烷基酯與選自於由1,4-丁烷二醇、1,5-戊烷二醇、3-甲基-1,5-戊烷二醇及1,6-己烷二醇構成之群組中之1種以上之多元醇進行反應而得者。For the aliphatic polycarbonate polyol, it is preferable to use it in imparting adhesiveness to the curable adhesive composition containing the above-mentioned urethane resin (B'), for example, at a level that can be attached at room temperature. Dialkyl carbonate is selected from 1,4-butanediol, 1,5-pentanediol, 3-methyl-1,5-pentanediol and 1,6-hexanediol It is obtained by reacting one or more polyhydric alcohols in the group consisting of alcohols.

就脂環族聚碳酸酯多元醇而言,在賦予含有前述胺甲酸酯系樹脂(B’)之硬化性黏接劑組成物黏接片例如於常溫下能進行貼附的等級之黏著性,且賦予優良的初始凝聚力方面,宜使用例如使碳酸二烷基酯與包含選自於由環己烷二甲醇及其衍生物構成之群組中之1種以上之多元醇進行反應而得者。In the alicyclic polycarbonate polyol, the adhesiveness of the adhesive sheet of the curable adhesive composition containing the above-mentioned urethane-based resin (B') can be attached at room temperature, for example. , and in terms of imparting excellent initial cohesion, it is preferable to use, for example, one obtained by reacting dialkyl carbonate with one or more polyhydric alcohols selected from the group consisting of cyclohexanedimethanol and its derivatives .

就前述聚碳酸酯多元醇而言,在獲得如下之黏接片方面,宜使用具有500~5000之範圍之數目平均分子量者,使用具有800~3000之範圍之數目平均分子量者更佳:形成具備前述預定範圍內之損耗正切(tanδ40 及tanδ60 )之胺甲酸酯系樹脂,硬化前之操作性優良,且例如即使將含有前述胺甲酸酯系樹脂(B’)之硬化性黏接劑組成物的黏接片捲繞於輥等並將其予以保存時,仍可更進一步防止黏接劑層從輥的端部被擠出,且隨附於構件之撓曲、表面之高低差部之隨附性更進一步得到改善。Regarding the aforementioned polycarbonate polyols, it is preferable to use those having a number average molecular weight in the range of 500 to 5,000, more preferably those having a number average molecular weight in the range of 800 to 3,000, in order to obtain the following adhesive sheet: Urethane resins with a loss tangent (tanδ 40 and tanδ 60 ) within the aforementioned predetermined range are excellent in workability before curing, and even if curable adhesives containing the aforementioned urethane resin (B') are bonded When the adhesive sheet of the adhesive composition is wound on a roll and stored, it can further prevent the adhesive layer from being extruded from the end of the roll, and it will be attached to the deflection of the component and the level difference of the surface The attachment of parts has been further improved.

前述聚碳酸酯多元醇相對於前述多元醇(b’1)之總量宜在20質量%~80質量%之範圍內使用,在30質量%~70質量%之範圍內使用更佳,在40質量%~50質量%之範圍內使用的話,在獲得如下之黏接片方面較理想:維持於光照常溫下能進行貼附的等級之黏著性,且即使將具有使用了含有前述胺甲酸酯系樹脂(B’)之硬化性黏接劑組成物之黏接劑層之黏接片捲繞於輥等並將其予以保存時,仍可更進一步防止黏接劑層從輥的端部被擠出,且隨附於構件之撓曲、表面之高低差部之隨附性更進一步得到改善。The aforementioned polycarbonate polyol should be used in the range of 20% by mass to 80% by mass relative to the total amount of the aforementioned polyol (b'1), more preferably in the range of 30% by mass to 70% by mass, and at 40% by mass If it is used in the range of mass % to 50 mass %, it is ideal to obtain an adhesive sheet that maintains the adhesiveness of the level that can be attached under light and normal temperature, and even if it will use the above-mentioned urethane When the adhesive sheet of the adhesive layer of the curable adhesive composition based on resin (B') is wound up on a roll or the like and stored, the adhesive layer can be further prevented from being drawn from the end of the roll. Extrusion, and the compliance with the deflection of the member and the unevenness of the surface are further improved.

就前述多元醇(b’1)所能使用的前述聚酯多元醇而言,可使用例如:使低分子量之多元醇與多元羧酸進行酯化反應而得者、將ε-己內酯等環狀酯化合物進行開環聚合反應而得之聚酯、它們的共聚合聚酯等。As the polyester polyol that can be used for the polyol (b'1), for example, those obtained by esterifying a low-molecular-weight polyol with a polycarboxylic acid, ε-caprolactone, etc. Polyesters obtained by ring-opening polymerization of cyclic ester compounds, their copolymerized polyesters, etc.

就前述低分子量之多元醇而言,可使用例如:分子量大致約為50~300之乙二醇、丙二醇、1,4-丁烷二醇、1,6-己烷二醇、二乙二醇、新戊二醇、1,3-丁烷二醇等脂肪族伸烷基二醇;或環己烷二甲醇等。For the aforementioned low molecular weight polyols, for example, ethylene glycol, propylene glycol, 1,4-butanediol, 1,6-hexanediol, diethylene glycol with a molecular weight of approximately 50-300 can be used , neopentyl glycol, 1,3-butanediol and other aliphatic alkylene glycols; or cyclohexanedimethanol, etc.

又,就前述聚酯多元醇之製造所能使用的前述多元羧酸而言,可使用例如:琥珀酸、己二酸、癸二酸、十二烷二羧酸等脂肪族二羧酸;或對苯二甲酸、間苯二甲酸、鄰苯二甲酸、萘二羧酸等芳香族二羧酸;及它們的酐或酯化物等。Also, as the aforementioned polycarboxylic acid that can be used in the manufacture of the aforementioned polyester polyol, for example, aliphatic dicarboxylic acids such as succinic acid, adipic acid, sebacic acid, and dodecanedicarboxylic acid can be used; or Aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, phthalic acid, and naphthalene dicarboxylic acid; and their anhydrides or esters, etc.

就前述聚酯多元醇而言,在獲得如下之黏接片方面,宜使用脂肪族聚酯多元醇,使用直鏈脂肪族聚酯多元醇更佳:形成具備前述預定範圍內之損耗正切(tanδ40 及tanδ60 )之胺甲酸酯系樹脂,硬化前之操作性優良,且例如即使將具有使用含有前述胺甲酸酯系樹脂(B’)之硬化性黏接劑組成物形成的黏接劑層之黏接片捲繞於輥等並將其予以保存時,仍可更進一步防止黏接劑層從輥的端部被擠出,且隨附於構件之撓曲、表面之高低差部之隨附性更進一步得到改善。前述直鏈脂肪族聚酯多元醇係指側鏈不具有烷基之聚酯多元醇。As far as the aforementioned polyester polyols are concerned, it is preferable to use aliphatic polyester polyols, and it is more preferable to use straight-chain aliphatic polyester polyols in order to obtain the following adhesive sheet: to form a loss tangent (tanδ) within the aforementioned predetermined range. 40 and tanδ 60 ) urethane-based resins have excellent workability before hardening, and for example, even with adhesives formed using a curable adhesive composition containing the above-mentioned urethane-based resin (B') When the adhesive sheet of the agent layer is wound on a roll and stored, it can still further prevent the adhesive layer from being extruded from the end of the roll, and it is attached to the deflection of the component and the level difference of the surface The accompanying property is further improved. The aforementioned linear aliphatic polyester polyol refers to a polyester polyol having no alkyl group in its side chain.

就前述聚酯多元醇而言,可列舉使前述脂肪族伸烷基二醇與脂肪族二羧酸進行反應而得者,宜使用將1,6-己烷二醇與己二酸進行酯化反應而得之脂肪族聚酯多元醇。The polyester polyols mentioned above include those obtained by reacting the aforementioned aliphatic alkylene glycols with aliphatic dicarboxylic acids, preferably by esterifying 1,6-hexanediol with adipic acid. Aliphatic polyester polyol obtained by reaction.

就前述聚酯多元醇而言,在獲得如下之黏接片方面,宜使用具有1000~5000之範圍之數目平均分子量者:形成具備前述預定範圍內之損耗正切(tanδ40 及tanδ60 )之胺甲酸酯系樹脂,硬化前之操作性優良,且例如即使將具有使用含有前述胺甲酸酯系樹脂(B’)之硬化性黏接劑組成物形成的黏接劑層之黏接片捲繞於輥等並將其予以保存時,仍可更進一步防止黏接劑層從輥的端部被擠出,且隨附於構件之撓曲、表面之高低差部之隨附性更進一步得到改善。As for the aforementioned polyester polyol, it is preferable to use one having a number average molecular weight in the range of 1000 to 5000 in order to obtain the following adhesive sheet: form an amine having a loss tangent (tanδ 40 and tanδ 60 ) within the aforementioned predetermined range The formate-based resin has excellent workability before hardening, and for example, even if an adhesive sheet having an adhesive layer formed using a curable adhesive composition containing the above-mentioned urethane-based resin (B') is rolled When it is wound on a roll or the like and stored, the adhesive layer can still be further prevented from being extruded from the end of the roll, and the compliance with the deflection of the member and the level difference of the surface can be further improved. improve.

尤其是就前述聚酯多元醇而言,使用使1,2-乙烷二醇或1,4-丁烷二醇等脂肪族二醇與己二酸進行反應而得之聚酯多元醇時,宜使用具有1100~2900之範圍之數目平均分子量者;使用使1,6-己烷二醇與己二酸進行反應而得之聚酯多元醇時,宜使用具有1100~5000之範圍之數目平均分子量者;使用使1,6-己烷二醇與癸二酸進行反應而得之聚酯多元醇時,宜使用具有1000~5000之範圍之數目平均分子量者。In particular, when a polyester polyol obtained by reacting an aliphatic diol such as 1,2-ethanediol or 1,4-butanediol with adipic acid is used as the aforementioned polyester polyol, The number average molecular weight in the range of 1100~2900 should be used; when using polyester polyol obtained by reacting 1,6-hexanediol with adipic acid, the number average molecular weight in the range of 1100~5000 should be used. Molecular weight; when using polyester polyol obtained by reacting 1,6-hexanediol and sebacic acid, it is preferable to use one having a number average molecular weight in the range of 1,000 to 5,000.

前述聚酯多元醇相對於前述多元醇(b’1)之總量,宜在10質量%~50質量%之範圍內使用,在20質量%~40質量%之範圍內使用的話,在獲得如下之黏接片方面較理想:維持於常溫下能進行貼附的等級之黏著性,且即使將具有使用含有前述胺甲酸酯系樹脂(B’)之硬化性黏接劑組成物形成的黏接劑層之黏接片捲繞於輥等並將其予以保存時,仍可更進一步防止黏接劑層從輥的端部被擠出,且隨附於構件之撓曲、表面之高低差部之隨附性更進一步得到改善。The aforementioned polyester polyol is preferably used in the range of 10% by mass to 50% by mass relative to the total amount of the aforementioned polyol (b'1), and if it is used in the range of 20% by mass to 40% by mass, the following The adhesive sheet is more ideal: it maintains the level of adhesiveness that can be attached at room temperature, and even if it will have the adhesive formed by using the curable adhesive composition containing the aforementioned urethane resin (B'). When the adhesive sheet of the adhesive layer is wound on a roll and stored, it can still further prevent the adhesive layer from being extruded from the end of the roll, and it will be attached to the deflection of the component and the level difference of the surface. The attachment of parts has been further improved.

就前述多元醇(b’1)而言,宜組合使用前述聚碳酸酯多元醇與前述聚酯多元醇。As the aforementioned polyol (b'1), it is preferable to use the aforementioned polycarbonate polyol and the aforementioned polyester polyol in combination.

前述聚碳酸酯多元醇及前述聚酯多元醇相對於前述多元醇(b’1)100質量份,宜使用合計含有20質量份以上者,使用含有50質量份以上者的話,在獲得如下之黏接片方面較理想:維持於常溫下能進行貼附的等級之黏著性,且即使將具有使用含有前述胺甲酸酯系樹脂(B’)之硬化性黏接劑組成物形成的黏接劑層之黏接片捲繞於輥等並將其予以保存時,仍可更進一步防止黏接劑層從輥的端部被擠出,且隨附於構件之撓曲、表面之高低差部之隨附性更進一步得到改善。The aforementioned polycarbonate polyol and the aforementioned polyester polyol are preferably used to contain a total of 20 parts by mass or more with respect to 100 parts by mass of the aforementioned polyol (b'1). When using 50 parts by mass or more, the following viscosity is obtained Ideal for tabs: maintaining adhesiveness at a level that can be attached at room temperature, and even with an adhesive formed using a curable adhesive composition containing the aforementioned urethane resin (B') When the adhesive sheet of the double layer is wound on a roll and stored, it can further prevent the adhesive layer from being extruded from the end of the roll, and it is attached to the deflection of the component and the height difference of the surface. Attachment is further improved.

組合使用前述聚碳酸酯多元醇與前述聚酯多元醇時,[聚碳酸酯多元醇/聚酯多元醇](質量比)宜落在0.4~7.0之範圍內,落在1.0~2.0之範圍內的話,在獲得如下之黏接片方面更理想:形成具備前述預定範圍內之損耗正切(tanδ40 及tanδ60 )之胺甲酸酯系樹脂,結果可維持於常溫下能進行貼附的等級之黏著性,且例如即使將具有使用含有前述胺甲酸酯系樹脂(B’)之硬化性黏接劑組成物形成的黏接劑層之黏接片捲繞於輥等並將其予以保存時,仍可更進一步防止黏接劑層從輥的端部被擠出,且隨附於構件之撓曲、表面之高低差部之隨附性更進一步得到改善。When using the above-mentioned polycarbonate polyol and the above-mentioned polyester polyol in combination, [polycarbonate polyol/polyester polyol] (mass ratio) should fall within the range of 0.4~7.0, fall within the range of 1.0~2.0 If this is the case, it is more ideal to obtain an adhesive sheet that has a loss tangent (tanδ 40 and tanδ 60 ) within the aforementioned predetermined range of the urethane-based resin, and as a result can be maintained at a level that can be attached at room temperature. Adhesiveness, and for example, even when an adhesive sheet having an adhesive layer formed using a curable adhesive composition containing the aforementioned urethane resin (B') is wound on a roll or the like and stored , can still further prevent the adhesive layer from being extruded from the end of the roller, and the compliance with the deflection of the member and the height difference of the surface is further improved.

又,就前述多元醇(b’1)而言,也可使用聚醚多元醇。就前述聚醚多元醇而言,可使用例如將1種或2種以上之具有2個以上之活性氫原子之化合物作為起始劑,並使環氧烷進行加成聚合而得者。In addition, polyether polyols can also be used as the aforementioned polyol (b'1). As the aforementioned polyether polyol, for example, one obtained by addition-polymerizing alkylene oxide using one or more compounds having two or more active hydrogen atoms as an initiator can be used.

就前述起始劑而言,可使用例如:乙二醇、二乙二醇、三乙二醇、丙二醇、三亞甲基二醇、1,3-丁烷二醇、1,4-丁烷二醇、1,6-己烷二醇、雙酚A、甘油、三羥甲基乙烷、三羥甲基丙烷等。As the aforementioned initiator, for example, ethylene glycol, diethylene glycol, triethylene glycol, propylene glycol, trimethylene glycol, 1,3-butanediol, 1,4-butanediol, Alcohol, 1,6-hexanediol, bisphenol A, glycerin, trimethylolethane, trimethylolpropane, etc.

就前述環氧烷而言,可使用例如:環氧乙烷、環氧丙烷、環氧丁烷、苯基環氧乙烷、環氧氯丙烷、四氫呋喃等。 就前述聚醚多元醇而言,宜使用脂肪族聚醚多元醇、具有脂環族結構之聚醚多元醇。As the aforementioned alkylene oxide, for example, ethylene oxide, propylene oxide, butylene oxide, phenyloxirane, epichlorohydrin, tetrahydrofuran and the like can be used. As the aforementioned polyether polyols, aliphatic polyether polyols and polyether polyols having an alicyclic structure are preferably used.

就前述聚醚多元醇而言,尤其可使用將四氫呋喃進行開環聚合而得的聚四亞甲基二醇、使四氫呋喃與經烷基取代之四氫呋喃進行反應而得的聚四亞甲基二醇衍生物、使新戊二醇與四氫呋喃進行共聚合而得的聚四亞甲基二醇衍生物等。其中,就前述聚醚多元醇而言,在維持含有前述硬化性黏接劑組成物之黏接片於常溫下能進行貼附的等級之貼附性,且改善優良的柔軟性、耐久性(尤其是耐水解性)等方面,宜使用聚四亞甲基二醇(PTMG)、聚四亞甲基二醇衍生物(PTXG)。 又,就前述多元醇(b’1)而言,除了可使用前述者之外,還可使用其他多元醇。就前述其他多元醇而言,可列舉例如丙烯酸系多元醇等。As the aforementioned polyether polyol, polytetramethylene glycol obtained by ring-opening polymerization of tetrahydrofuran and polytetramethylene glycol obtained by reacting tetrahydrofuran with alkyl-substituted tetrahydrofuran can be used in particular. derivatives, polytetramethylene glycol derivatives obtained by copolymerizing neopentyl glycol and tetrahydrofuran, and the like. Among them, the above-mentioned polyether polyol maintains the adhesion of the adhesive sheet containing the above-mentioned curable adhesive composition at room temperature, and improves excellent flexibility and durability ( In particular, hydrolysis resistance) and the like, polytetramethylene glycol (PTMG) and polytetramethylene glycol derivatives (PTXG) are preferably used. Also, as the aforementioned polyol (b'1), other polyols may be used in addition to the aforementioned ones. As said other polyol, acrylic polyol etc. are mentioned, for example.

就前述多元醇(b’1)而言,宜使用具有500~5000之範圍之數目平均分子量者,使用具有1000~3000之範圍之數目平均分子量者的話,在獲得保形性、塗佈作業性、初始凝聚力等優良的硬化性黏接劑組成物方面較理想。另外,前述數目平均分子量係利用下述條件進行測定而得的值。For the aforementioned polyol (b'1), it is preferable to use one having a number average molecular weight in the range of 500 to 5,000, and to use a polyol having a number average molecular weight in the range of 1,000 to 3,000 is more effective in obtaining shape retention and coating workability. , initial cohesion and other excellent hardening adhesive composition is ideal. In addition, the said number average molecular weight is the value measured by the following conditions.

[數目平均分子量之測定方法] 本發明所記載之數目平均分子量之測定係經聚苯乙烯換算之利用凝膠滲透層析法(GPC),並利用下述條件進行測定而得的值。[Determination method of number average molecular weight] The measurement of the number average molecular weight described in the present invention is a value obtained by measuring the polystyrene-equivalent gel permeation chromatography (GPC) under the following conditions.

樹脂樣本溶液:0.4質量%四氫呋喃(THF)溶液 測定裝置型號:HLC-8220GPC(東曹股份有限公司製) 管柱:TSKgel(東曹股份有限公司製) 沖提液:四氫呋喃(THF)Resin sample solution: 0.4% by mass tetrahydrofuran (THF) solution Measuring device model: HLC-8220GPC (manufactured by Tosoh Co., Ltd.) String: TSKgel (manufactured by Tosoh Co., Ltd.) Eluent: Tetrahydrofuran (THF)

就前述胺甲酸酯系樹脂(B’)之製造所能使用的多異氰酸酯(b’2)而言,可使用脂環族多異氰酸酯、脂肪族多異氰酸酯、芳香族多異氰酸酯等,宜使用脂環族多異氰酸酯。As the polyisocyanate (b'2) that can be used in the production of the above-mentioned urethane resin (B'), alicyclic polyisocyanate, aliphatic polyisocyanate, aromatic polyisocyanate, etc. can be used, and aliphatic polyisocyanate is preferably used. Cyclic polyisocyanate.

就前述脂環族多異氰酸酯而言,可單獨使用例如:異佛爾酮二異氰酸酯、1,3-雙(異氰氧基甲基)環己烷、4,4’-二環己基甲烷二異氰酸酯、2,4-及/或2,6-甲基環己烷二異氰酸酯、伸環己基二異氰酸酯、甲基伸環己基二異氰酸酯、雙(2-異氰氧基乙基)-4-伸環己基-1,2-二羧酸酯及2,5-及/或2,6-降莰烷二異氰酸酯、二聚酸二異氰酸酯、雙環庚烷三異氰酸酯等,或將2種以上組合使用。As the aforementioned alicyclic polyisocyanate, for example, isophorone diisocyanate, 1,3-bis(isocyanoxymethyl)cyclohexane, 4,4'-dicyclohexylmethane diisocyanate can be used alone , 2,4- and/or 2,6-methylcyclohexane diisocyanate, cyclohexylene diisocyanate, methyl cyclohexylene diisocyanate, bis(2-isocyanoxyethyl)-4-cyclohexane Hexyl-1,2-dicarboxylate, 2,5- and/or 2,6-norbornane diisocyanate, dimer acid diisocyanate, biscycloheptane triisocyanate, etc., or a combination of two or more thereof are used.

就前述脂環族多異氰酸酯而言,於前述之中,在獲得具有和前述多元醇(b’1)之良好的反應性,且耐熱性、光線透射性等優良的黏接片方面,宜使用4,4’-二環己基甲烷二異氰酸酯(HMDI)、異佛爾酮二異氰酸酯(IPDI)、1,3-雙(異氰氧基甲基)環己烷(BICH)。Of the aforementioned alicyclic polyisocyanates, among the aforementioned, it is preferable to use 4,4'-dicyclohexylmethane diisocyanate (HMDI), isophorone diisocyanate (IPDI), 1,3-bis(isocyanoxymethyl)cyclohexane (BICH).

就使前述多元醇(b’1)與前述多異氰酸酯(b’2)進行反應並製造具有異氰酸酯基之胺甲酸酯系樹脂(B’)之方法而言,可列舉例如藉由將已進料於反應容器之前述多元醇(b’1)於常壓或減壓條件下進行加熱來去除水分後,再一次性或分次供給前述多異氰酸酯(b’2)並使其進行反應之方法。As the method of making the aforementioned polyol (b'1) react with the aforementioned polyisocyanate (b'2) to produce the urethane resin (B') having an isocyanate group, for example, by making A method in which the aforementioned polyol (b'1) fed into the reaction vessel is heated under normal pressure or reduced pressure to remove moisture, and then the aforementioned polyisocyanate (b'2) is supplied in one batch or in batches and allowed to react .

前述多元醇(b’1)與前述多異氰酸酯(b’2)之反應宜在前述多異氰酸酯(b’2)所具有的異氰酸酯基與前述多元醇(b’1)所具有的羥基之當量比(以下稱[NCO/OH當量比])為1.1~20.0之範圍內實施,在1.1~13.0之範圍內實施更佳,在1.1~5.0之範圍內實施再更佳,在1.5~3.0之範圍內實施特佳。The reaction between the polyol (b'1) and the polyisocyanate (b'2) is preferably at an equivalent ratio of the isocyanate group contained in the polyisocyanate (b'2) to the hydroxyl group contained in the polyol (b'1). (hereinafter referred to as [NCO/OH equivalent ratio]) is implemented within the range of 1.1~20.0, better within the range of 1.1~13.0, even better within the range of 1.1~5.0, and within the range of 1.5~3.0 Excellent implementation.

前述多元醇(b’1)與前述多異氰酸酯(b’2)之反應條件(溫度、時間等)若考量安全、品質、成本等各種條件並適當地設定即可,並無特別限制,例如反應溫度宜落在70~120℃之範圍內,反應時間宜落在30分鐘~5小時之範圍內。The reaction conditions (temperature, time, etc.) of the aforementioned polyol (b'1) and the aforementioned polyisocyanate (b'2) are not particularly limited as long as they are appropriately set in consideration of various conditions such as safety, quality, and cost. The temperature should fall within the range of 70~120°C, and the reaction time should fall within the range of 30 minutes~5 hours.

使前述多元醇(b’1)與前述多異氰酸酯(b’2)進行反應時,可因應需要使用例如三級胺觸媒、有機金屬系觸媒等作為觸媒。 又,前述反應可在無溶劑之環境下實施,也可在有機溶劑存在下實施。When the aforementioned polyol (b'1) is reacted with the aforementioned polyisocyanate (b'2), for example, a tertiary amine catalyst, an organometallic catalyst, or the like can be used as a catalyst if necessary. In addition, the aforementioned reaction may be carried out in a solvent-free environment, or may be carried out in the presence of an organic solvent.

就前述有機溶劑而言,可單獨使用例如:乙酸甲酯、乙酸乙酯、乙酸丙酯、乙酸丁酯等酯系溶劑;丙酮、甲乙酮、甲基丁基酮、環己酮等酮系溶劑;甲基賽璐蘇乙酸酯、丁基賽璐蘇乙酸酯等醚酯系溶劑;甲苯、二甲苯等芳香族烴系溶劑;二甲基甲醯胺、二甲基乙醯胺等醯胺系溶劑等,或將2種以上組合使用。前述有機溶劑也可在前述胺甲酸酯系樹脂(B’)之製造途中或製造前述胺甲酸酯系樹脂(B’)之後,利用減壓加熱、常壓乾燥等適當的方法去除。For the aforementioned organic solvents, for example, ester solvents such as methyl acetate, ethyl acetate, propyl acetate, and butyl acetate can be used alone; ketone solvents such as acetone, methyl ethyl ketone, methyl butyl ketone, and cyclohexanone; Ether ester solvents such as methyl celluloid acetate and butyl celluloid acetate; aromatic hydrocarbon solvents such as toluene and xylene; amides such as dimethylformamide and dimethylacetamide A solvent or the like may be used in combination of two or more. The organic solvent may be removed by an appropriate method such as heating under reduced pressure or normal pressure drying during or after the production of the urethane resin (B').

就本發明之硬化性黏接劑組成物而言,為了促進施予外部刺激後之反應性,並獲得硬化後之高接合性,而使用含有光聚合起始劑者。 又,就前述聚合起始劑而言,例如有光聚合起始劑與熱聚合起始劑,但藉由使用反應會因光而進行之光聚合起始劑,可獲得低溫下之反應及良好的硬化反應。藉此,可獲得高接合性而不會造成所疊層之構件的損傷、或由於構件間產生應變使得構件變形、或於接合材與構件間產生裂紋。 就前述光而言,可使用紫外線、可見光等適當的光,宜使用300nm以上且420nm以下之波長的光。The curable adhesive composition of the present invention contains a photopolymerization initiator in order to promote reactivity to external stimuli and obtain high adhesiveness after curing. In addition, the aforementioned polymerization initiators include, for example, photopolymerization initiators and thermal polymerization initiators, but by using a photopolymerization initiator whose reaction is carried out by light, it is possible to obtain a low-temperature reaction and good hardening reaction. Thereby, high bondability can be obtained without causing damage to the laminated members, deformation of the members due to strain generated between the members, or generation of cracks between the bonding material and the members. Appropriate light such as ultraviolet light or visible light can be used for the aforementioned light, and light having a wavelength of 300 nm to 420 nm is preferably used.

就前述光聚合起始劑而言,若為利用光而活化者即可,可列舉例如:光自由基聚合起始劑、光陽離子聚合起始劑、光陰離子聚合起始劑,宜使用光陽離子聚合起始劑、光陰離子聚合起始劑,使用光陽離子聚合起始劑的話,由於可適當地調整暗反應所為之聚合,故較理想。As far as the photopolymerization initiator is concerned, it is sufficient if it is activated by light, for example: photoradical polymerization initiator, photocation polymerization initiator, photoanion polymerization initiator, preferably using photocation As a polymerization initiator and a photoanionic polymerization initiator, it is preferable to use a photocationic polymerization initiator because the polymerization by dark reaction can be properly adjusted.

就上述光陽離子聚合起始劑而言,只要是利用所使用的波長之光能誘發陽離子聚合性官能基的開環反應,則無特別限制,但宜使用利用300~370nm之波長的光會誘發陽離子聚合性官能基的開環反應,且在超過370nm之波長區域無活性的化合物,就如此的化合物而言,可列舉例如:芳香族重氮鹽、芳香族錪鹽、芳香族鋶鹽等鎓鹽類。As far as the above-mentioned photocationic polymerization initiator is concerned, as long as the ring-opening reaction of the cationic polymerizable functional group is induced by the light energy of the wavelength used, it is not particularly limited, but it is preferable to use the light of the wavelength of 300~370nm to induce The ring-opening reaction of the cationic polymerizable functional group, and the compound is inactive in the wavelength region exceeding 370nm. Examples of such compounds include: onium salts such as aromatic diazonium salts, aromatic iodonium salts, and aromatic permeate salts. salt.

就如此的鎓鹽類之具體例而言,可列舉例如:OPTOMA SP-150、OPTOMA SP-170、OPTOMA SP-171(均為ADEKA公司製);UVE-1014(General Electronics公司製);OMNICAT250、OMNICAT270(均為IGM Resin公司製);IRGACURE290(BASF公司製);SAN-AID SI-60L、SAN-AID SI-80L、SAN-AID SI-100L(均為三新化學工業公司製);CPI-100P、CPI-101A、CPI-200K(均為San-Apro公司製)等。Specific examples of such onium salts include, for example: OPTOMA SP-150, OPTOMA SP-170, OPTOMA SP-171 (all manufactured by ADEKA); UVE-1014 (manufactured by General Electronics); OMNICAT250, OMNICAT270 (all made by IGM Resin); IRGACURE290 (made by BASF); SAN-AID SI-60L, SAN-AID SI-80L, SAN-AID SI-100L (all made by Sanshin Chemical Industry); CPI- 100P, CPI-101A, CPI-200K (all manufactured by San-Apro), etc.

另外,前述光陽離子聚合起始劑可單獨使用,也可將2種以上合併使用。此外,也可使用有效活性波長不同的多種光陽離子聚合起始劑,使其進行2階段硬化。 前述光陽離子聚合起始劑也可因應需要合併使用蒽系、9-氧硫代

Figure 108109010-A0304-12-02
Figure 108109010-A0304-12-03
系等增感劑。Moreover, the said photocationic polymerization initiator may be used individually, and may use it in combination of 2 or more types. Moreover, it is also possible to perform two-stage hardening using several photocationic polymerization initiators which differ in effective active wavelength. The aforementioned photocationic polymerization initiators can also be used in combination with anthracene series, 9-oxothio
Figure 108109010-A0304-12-02
Figure 108109010-A0304-12-03
Department of sensitizers.

就前述光陽離子聚合起始劑之摻合比例而言,相對於黏接劑組成物100質量份,宜在0.001質量份~30質量份之範圍內使用,在0.01~20質量份之範圍內使用更佳,在0.1質量份~10質量份之範圍內使用再更佳。前述光陽離子聚合起始劑之摻合比例過少的話,展現高接合性所需要的硬化會變得不足,過多的話,硬化性獲得改善,但照射光後之硬化進行快,將光無法透射之構件彼此接合會變得困難。In terms of the blending ratio of the aforementioned photocationic polymerization initiator, relative to 100 parts by mass of the adhesive composition, it is preferable to use it in the range of 0.001 to 30 parts by mass, and to use it in the range of 0.01 to 20 parts by mass. More preferably, it is even better to use within the range of 0.1 parts by mass to 10 parts by mass. If the blending ratio of the above-mentioned photocationic polymerization initiator is too small, the hardening required to exhibit high bonding properties will become insufficient, and if too large, the hardening properties will be improved, but the hardening after irradiation with light proceeds quickly, and the member that cannot transmit light Engaging with each other can become difficult.

就本發明之硬化性黏接劑組成物而言,可使用除了含有前述光硬化性樹脂(A)、前述熱塑性樹脂(B)、前述光聚合起始劑之外,還因應需要含有其他成分者。The curable adhesive composition of the present invention may contain other components as needed in addition to the aforementioned photocurable resin (A), aforementioned thermoplastic resin (B), and aforementioned photopolymerization initiator. .

就本發明之硬化性黏接劑組成物而言,例如為了獲得如下之黏接片,可使用重量平均分子量為2000~2000000之範圍之黏著性樹脂:即使使用具有使用硬化性黏接劑組成物形成的黏接劑層之黏接片時、將其捲繞於輥等並將其予以保存時,仍可更進一步防止黏接劑層從輥的端部被擠出,且於常溫下之貼附性優良。理想的重量平均分子量之範圍為5000~1000000,更理想的重量平均分子量之範圍為5000~800000。For the curable adhesive composition of the present invention, for example, in order to obtain the following adhesive sheet, an adhesive resin having a weight average molecular weight of 2,000 to 2,000,000 can be used: even if a curable adhesive composition is used When the adhesive sheet of the formed adhesive layer is wound up on a roll and stored, the adhesive layer can be further prevented from being extruded from the end of the roll, and it can be pasted at room temperature. Excellent adhesion. The ideal weight average molecular weight is in the range of 5,000 to 1,000,000, and the more ideal weight average molecular weight is in the range of 5,000 to 800,000.

就前述黏著性樹脂而言,可列舉例如:聚酯、聚胺甲酸酯、聚(甲基)丙烯酸酯、聚乙烯醇縮醛等。這些黏著性樹脂可為均聚物,也可為共聚物。又,這些黏著性樹脂可單獨使用,也可將2種以上合併使用。Examples of the aforementioned adhesive resin include polyester, polyurethane, poly(meth)acrylate, polyvinyl acetal, and the like. These adhesive resins may be homopolymers or copolymers. In addition, these adhesive resins may be used alone or in combination of two or more.

就前述黏著性樹脂而言,於常溫下具有黏著性的話,將具有使用前述硬化性黏接劑組成物形成的黏接劑層之黏接片疊層到被黏接體時的貼附性會獲得改善,故較理想。為了賦予前述黏著性樹脂之黏著性,前述黏接性樹脂之玻璃轉移溫度宜落在-30~20℃之範圍內,落在-25~10℃之範圍內更佳。藉由上述範圍內之玻璃轉移溫度,可賦予前述硬化性接合材組成物黏著性,同時賦予高彈性模量,並能改善前述接合材之接合強度。If the above-mentioned adhesive resin has adhesiveness at normal temperature, the adhesiveness when laminating an adhesive sheet having an adhesive layer formed using the above-mentioned curable adhesive composition on an adherend will decrease. To be improved, it is more ideal. In order to impart adhesiveness to the aforementioned adhesive resin, the glass transition temperature of the aforementioned adhesive resin should preferably fall within the range of -30~20°C, more preferably within the range of -25~10°C. With the glass transition temperature within the above range, it is possible to impart adhesiveness and high modulus of elasticity to the aforementioned curable joining material composition, and to improve the joint strength of the aforementioned joining material.

另外,前述黏接性樹脂之玻璃轉移溫度例如可使用動態黏彈性試驗機(Rheometrics公司製,商品名:ARES 2KSTD),將試驗片挾持於係該試驗機的測定部之平行圓盤之間,測定頻率1.0Hz的儲藏彈性模量(G’)與損失彈性模量(G”),並算出使損耗正切(tanδ)成為最大值之溫度,該損耗正切(tanδ)可利用將前述損失彈性模量(G”)除以前述儲藏彈性模量(G’)而得的值(G”/G’)算出。In addition, the glass transition temperature of the aforementioned adhesive resin can be obtained, for example, by using a dynamic viscoelasticity tester (manufactured by Rheometrics Co., Ltd., trade name: ARES 2KSTD). Measure the storage elastic modulus (G') and loss elastic modulus (G") at a frequency of 1.0Hz, and calculate the temperature at which the loss tangent (tanδ) becomes the maximum value. The amount (G") was calculated by dividing the value (G"/G') obtained by the said storage elastic modulus (G').

前述黏著性樹脂也可經交聯,故也可導入能和交聯劑、前述硬化性黏接劑組成物所含的官能基反應之官能基。就上述官能基而言,可列舉例如:羥基、羧基、環氧基、胺基等,宜在不妨礙前述硬化性黏接劑組成物聚合之範圍內適當地選擇。The aforementioned adhesive resin may also be cross-linked, so functional groups capable of reacting with the functional groups contained in the cross-linking agent and the aforementioned curable adhesive composition may also be introduced. Examples of the above-mentioned functional groups include hydroxyl groups, carboxyl groups, epoxy groups, amino groups, etc., and should be appropriately selected within the range that does not interfere with the polymerization of the aforementioned curable adhesive composition.

前述黏著性樹脂相對於前述硬化性黏接劑組成物100質量份,宜在0.1質量份~100質量份之範圍內使用,在1~50質量份之範圍內使用更佳,在5質量份~30質量份之範圍內使用再更佳。藉由將前述黏著性樹脂設定在上述範圍內之摻合比例,可獲得如下黏接片:硬化後之接合性不會降低,且即使將黏接片捲繞於輥等並將其予以保存時,仍可更進一步防止黏接劑層從輥的端部被擠出,且於常溫下之貼附性優良。The above-mentioned adhesive resin is preferably used in the range of 0.1 to 100 parts by mass, more preferably in the range of 1 to 50 parts by mass, and in the range of 5 to 5 parts by mass relative to 100 parts by mass of the aforementioned hardening adhesive composition. It is even better to use within the range of 30 parts by mass. By setting the blending ratio of the above-mentioned adhesive resin within the above-mentioned range, an adhesive sheet can be obtained that does not decrease in adhesiveness after hardening, and even when the adhesive sheet is wound up on a roll or the like and stored , can still further prevent the adhesive layer from being extruded from the end of the roller, and has excellent adhesion at room temperature.

就前述硬化性黏接劑組成物而言,可因應需要使用含有其他添加劑者。 就前述添加劑而言,可使用:氫氧化鋁、氧化鋁、氮化鋁、氫氧化鎂、氧化鎂、雲母、滑石、氮化硼、玻璃薄片等填料;矽烷偶聯劑、磷酸系添加劑、丙烯酸酯系添加劑、賦黏劑等。尤其是使用和玻璃之反應性高的矽烷偶聯劑的話,可獲得對於由玻璃等構成的構件之黏接性優良的黏接片,故較理想,使用能和上述硬化性黏接劑組成物反應之光硬化型矽烷偶聯劑更佳。The aforementioned curable adhesive composition may contain other additives as needed. As for the aforementioned additives, fillers such as aluminum hydroxide, aluminum oxide, aluminum nitride, magnesium hydroxide, magnesium oxide, mica, talc, boron nitride, and glass flakes can be used; silane coupling agents, phosphoric acid additives, acrylic acid Ester additives, tackifiers, etc. In particular, if a silane coupling agent with high reactivity with glass is used, an adhesive sheet with excellent adhesion to members composed of glass and the like can be obtained, so it is ideal to use a composition that can be combined with the above-mentioned hardening adhesive Reaction light hardening silane coupling agent is better.

又,就添加劑而言,除了使用前述者之外,在不損及本發明之效果之範圍內,還可使用含有如下添加劑者,例如:軟化劑、安定劑、黏接促進劑、整平劑、消泡劑、塑化劑、賦黏樹脂、纖維類、抗氧化劑、抗水解劑、增黏劑、顏料等著色劑、填充劑等。Also, in terms of additives, in addition to the aforementioned ones, within the scope of not impairing the effects of the present invention, those containing the following additives can also be used, for example: softeners, stabilizers, adhesion promoters, leveling agents , defoaming agent, plasticizer, tackifying resin, fiber, antioxidant, antihydrolysis agent, tackifier, pigment and other colorants, fillers, etc.

就前述硬化性黏接劑組成物而言,宜如前述藉由預先成形成片狀等任意的形狀而製成黏接片來使用,可為在片狀基材之雙面具有前述黏接劑層者,也可為不具前述片狀基材,而是利用前述黏接劑層構成的,即所謂無基材之黏接片。就前述黏接片而言,可使用利用單一種黏接劑層構成者,也可使用將相同或不同的2種以上之黏接劑層疊層而成者。As for the aforementioned curable adhesive composition, it is suitable to be used as an adhesive sheet by forming it into an arbitrary shape such as a sheet in advance, as mentioned above, and it may have the aforementioned adhesive on both sides of the sheet-like substrate. Layers may also be formed without the above-mentioned sheet-shaped substrate, but by using the above-mentioned adhesive layer, that is, the so-called substrate-free adhesive sheet. The above-mentioned adhesive sheet may be formed using a single adhesive layer, or may be formed by laminating two or more types of the same or different adhesive layers.

就前述黏接片之製造方法而言,例如可藉由將前述黏接劑組成物塗佈於基材之雙面,並因應需要進行乾燥來形成黏接劑層而製造。 製造將由相同或不同的組成構成的2種以上之黏接劑層疊層而成者作為前述黏接片時,例如可藉由將黏接劑組成物1塗佈於片狀基材之雙面,並因應需要進行乾燥來形成黏接劑層1,再將另一黏接劑組成物2塗佈於前述黏接劑層1之表面,並因應需要進行乾燥來形成黏接劑層2而製造。As for the manufacturing method of the above-mentioned adhesive sheet, for example, it can be manufactured by coating the above-mentioned adhesive composition on both sides of the base material, and drying as necessary to form an adhesive layer. When producing a laminate of two or more adhesive layers of the same or different composition as the aforementioned adhesive sheet, for example, by applying the adhesive composition 1 to both sides of a sheet-like substrate, The adhesive layer 1 is formed by drying as needed, and then another adhesive composition 2 is applied on the surface of the adhesive layer 1 and dried as needed to form the adhesive layer 2 .

就前述黏接片而言,例如可藉由將前述黏接劑組成物1塗佈於脫模片之表面,並因應需要進行乾燥來形成黏接劑層1,再將另一黏接劑組成物2塗佈於前述黏接劑層1之表面,並因應需要進行乾燥來形成黏接劑層2而製造。 就前述黏接片而言,在改善成形成前述片狀等時的作業效率方面,前述組成物宜使用除了含有聚合性化合物、聚合起始劑之外,還含有溶劑者。 就前述溶劑而言,可使用例如:乙酸甲酯、乙酸乙酯、乙酸丙酯、乙酸丁酯等酯系溶劑;丙酮、甲乙酮、甲基異丁基酮、二異丁基酮、環己酮等酮系溶劑;甲苯、二甲苯等芳香族烴系溶劑等。For the aforementioned adhesive sheet, for example, the adhesive layer 1 can be formed by applying the aforementioned adhesive composition 1 on the surface of the release sheet and drying as needed, and then another adhesive composition The object 2 is coated on the surface of the aforementioned adhesive layer 1 and dried as needed to form the adhesive layer 2 . As for the adhesive sheet, it is preferable to use a composition containing a solvent in addition to a polymerizable compound and a polymerization initiator in order to improve work efficiency when forming into the sheet shape. For the aforementioned solvents, for example, ester-based solvents such as methyl acetate, ethyl acetate, propyl acetate, and butyl acetate; acetone, methyl ethyl ketone, methyl isobutyl ketone, diisobutyl ketone, and cyclohexanone can be used. Ketone solvents such as ketones; aromatic hydrocarbon solvents such as toluene and xylene, etc.

本發明之黏接片可藉由將前述聚合性化合物與前述聚合起始劑、溶劑等任意成分予以混合而製造。將前述成分予以混合並製造接合材(X)時,可因應需要使用溶解器(dissolver)、蝶刀式混合機、BDM雙軸混合機、行星式混合機等,宜使用溶解器、蝶刀式混合機,使用前述導電性填料時,在改善它們的分散性方面,宜使用行星式混合機。The adhesive sheet of the present invention can be produced by mixing the aforementioned polymerizable compound with optional components such as the aforementioned polymerization initiator and solvent. When mixing the above-mentioned components to produce the joint material (X), you can use a dissolver (dissolver), a butterfly knife mixer, a BDM double-shaft mixer, a planetary mixer, etc. according to the need. For the mixer, when using the aforementioned conductive fillers, it is better to use a planetary mixer in order to improve their dispersibility.

另外,前述聚合起始劑宜在使前述黏接片硬化前或將前述黏接片成形成片狀等之前使用。 又,前述黏接片例如可藉由在製成含有前述聚合性化合物與前述聚合起始劑、溶劑等任意成分之組成物後,塗覆於例如剝離襯裡之表面並使其乾燥等而製造。 前述乾燥宜在40℃~120℃之溫度實施,在約50℃~90℃之溫度實施的話,在抑制使片狀接合材之硬化反應進行方面更理想。又,由於可抑制溶劑等之急速揮發所導致的片表面之起泡,故較理想。In addition, the above-mentioned polymerization initiator is preferably used before curing the above-mentioned adhesive sheet or before forming the above-mentioned adhesive sheet into a sheet shape or the like. Also, the adhesive sheet can be produced, for example, by making a composition containing the polymerizable compound and optional components such as the polymerization initiator and solvent, and then coating the surface of, for example, a release liner and drying it. The aforementioned drying is preferably carried out at a temperature of 40°C to 120°C, and it is more desirable to carry out at a temperature of about 50°C to 90°C in order to suppress the progress of the hardening reaction of the sheet-like bonding material. In addition, it is preferable because it can suppress blistering on the surface of the sheet due to rapid volatilization of solvents and the like.

前述黏接片直到使用之前,也可利用前述剝離襯裡予以挾持。 就前述剝離襯裡而言,可使用例如:牛皮紙、玻璃紙、優質紙等紙;聚乙烯、聚丙烯(OPP、CPP)、聚對苯二甲酸乙二酯等樹脂薄膜;將前述紙與樹脂薄膜疊層而成的層合紙、在利用黏土、聚乙烯醇等對前述紙施以填平處理而成者之單面或雙面施加聚矽氧系樹脂等之剝離處理而成者等。The above-mentioned adhesive sheet can also be pinched by the above-mentioned release liner until it is used. For the aforementioned release liner, for example, paper such as kraft paper, cellophane, and high-quality paper; resin films such as polyethylene, polypropylene (OPP, CPP), and polyethylene terephthalate; Laminated paper made of layers, one or both sides of the above-mentioned paper that is filled with clay, polyvinyl alcohol, etc., and released with silicone-based resin, etc., etc.

保存前述黏接片時的溫度宜為-10℃以上,為5℃以上更佳,為23℃以上的話,可減少因結露所導致之前述黏接片的吸水,並抑制前述黏接片之硬化性的降低,故更理想。The temperature when storing the aforementioned adhesive sheet is preferably -10°C or higher, more preferably 5°C or higher, and if it is higher than 23°C, it can reduce the water absorption of the aforementioned adhesive sheet caused by condensation and inhibit the hardening of the aforementioned adhesive sheet Sexual reduction, so more ideal.

就使前述黏接片硬化並將前述構件等進行黏接時所使用的光而言,宜使用紫外線。前述紫外線在有效率地實施利用紫外線所致之硬化反應方面,可在氮氣等鈍性氣體環境下進行照射,也可在空氣環境下進行照射。又,也可因應需要合併使用熱作為能量源,並於照射光後進行加熱。Ultraviolet light is preferably used as the light used for curing the adhesive sheet and bonding the members and the like. The aforementioned ultraviolet rays may be irradiated under an inert gas environment such as nitrogen gas or may be irradiated under an air environment in order to efficiently carry out the hardening reaction by ultraviolet rays. Also, if necessary, heat may be used in combination as an energy source, and heating may be performed after irradiation with light.

使用紫外線作為光時,可列舉:低壓水銀燈、高壓水銀燈、超高壓水銀燈、金屬鹵化物燈、無電極燈(FUSION LAMP)、化學燈、黑光燈、水銀-氙氣燈、短弧燈、氦-鎘雷射、氬雷射、太陽光、LED等。又,能閃光性地照射光之氙氣閃光燈由於可將對前述基材之熱的影響控制在最小限度,故較理想。When ultraviolet rays are used as light, examples include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high pressure mercury lamps, metal halide lamps, electrodeless lamps (FUSION LAMPs), chemical lamps, black light lamps, mercury-xenon lamps, short-arc lamps, and helium-cadmium lamps. Laser, argon laser, sunlight, LED, etc. Also, a xenon flash lamp capable of flashing light is preferable because it can minimize the influence of heat on the substrate.

就上述光的照射裝置而言,除了可使用前述者之外,還可使用殺菌燈、碳弧、氙氣燈、金屬鹵化物燈、掃描型、簾型電子束加速器等。As the above-mentioned light irradiation device, in addition to the above-mentioned ones, germicidal lamps, carbon arcs, xenon lamps, metal halide lamps, scanning type, curtain type electron beam accelerators, etc. can also be used.

前述黏接片可藉由貼附於被黏接體而製成疊層體。 使用有本發明之黏接片的疊層體之製造方法,係介隔黏接片將2個以上之具有活性能量射線不會透射的面之被黏接體予以疊層之疊層體之製造方法,其按順序包含:利用感壓黏接將黏接片之黏接劑層與第1被黏接體予以貼合之步驟[1];在步驟[1]之前或之後對前述黏接片之黏接劑層的另一側之表面照射活性能量射線,而使黏接劑層之硬化率提昇0.01~30%之步驟[2];將前述黏接片壓潰之步驟[3];及在前述黏接片被壓潰的狀態下,使前述黏接劑層之硬化率從前述步驟[2]之硬化率進一步硬化20%以上之步驟[4]。The said adhesive sheet can be made into a laminated body by sticking to a to-be-adhered body. The method for producing a laminate using the adhesive sheet of the present invention is the manufacture of a laminate in which two or more adherends having surfaces that do not transmit active energy rays are laminated via an adhesive sheet The method, which includes in order: the step [1] of bonding the adhesive layer of the adhesive sheet to the first adherend by using pressure-sensitive bonding; applying the aforementioned adhesive sheet before or after step [1] The step of irradiating the surface of the other side of the adhesive layer with active energy rays to increase the hardening rate of the adhesive layer by 0.01~30% [2]; the step of crushing the aforementioned adhesive sheet [3]; and Step [4] of further hardening the hardening rate of the aforementioned adhesive layer by 20% or more from the hardening rate of the aforementioned step [2] in the state where the aforementioned adhesive sheet is crushed.

前述具有活性能量射線不會透射的面之被黏接體係指波長200nm~780nm之光的透射率為30%以下之被黏接體,可列舉例如:鋁或不銹鋼、銅等金屬;玻璃環氧樹脂基板或經著色之薄膜基材等。The above-mentioned adhered system having a surface that does not transmit active energy rays refers to an adhered body whose transmittance of light with a wavelength of 200nm to 780nm is less than 30%. Examples include: aluminum, stainless steel, copper and other metals; glass epoxy Resin substrate or colored film substrate, etc.

前述步驟[1]中,並未對黏接片之黏接劑層與第1被黏接體進行加熱,而是利用感壓黏接進行貼合。本步驟[1]中不需要加熱等操作,在作業環境下的溫度即可適當地實施,故可輕易地將黏接片暫時固定到第1被黏接體,也可輕易地實施重新貼合。In the aforementioned step [1], the adhesive layer of the adhesive sheet and the first adherend are not heated, but bonded by pressure-sensitive bonding. This step [1] does not require heating and other operations, and can be carried out appropriately at the temperature of the working environment, so it is easy to temporarily fix the adhesive sheet to the first adherend, and it is also easy to carry out re-bonding .

前述步驟[1]之感壓黏接所使用的壓力宜為0.1~3000KPa之壓力,為0.5~1000KPa更佳,為1.0~500KPa的話,可不損傷第1被黏接體並獲得用以得到高接合強度所必須要的黏合性,故更理想。The pressure used in the pressure-sensitive bonding in the aforementioned step [1] should be 0.1~3000KPa, more preferably 0.5~1000KPa, and if it is 1.0~500KPa, it will not damage the first adherend and obtain high bonding strength. The adhesiveness necessary for strength is more ideal.

前述步驟[2]中,係在步驟[1]之前或之後對前述黏接片之黏接劑層的另一側之表面照射活性能量射線,而使黏接劑層之硬化率提昇0.01~30%。本步驟[2]中,即使在照射活性能量射線後仍具有貼合所必須要的黏著性,故即使在照射活性能量射線後,仍可將被黏接體彼此疊層。In the aforementioned step [2], the surface of the other side of the adhesive layer of the aforementioned adhesive sheet is irradiated with active energy rays before or after step [1], so that the hardening rate of the adhesive layer is increased by 0.01~30 %. In this step [2], since the adhesiveness necessary for bonding is obtained even after the active energy ray irradiation, the adherends can be laminated even after the active energy ray irradiation.

就前述活性能量射線之照射強度而言,宜為0.1~1000mW/cm2 ,為0.5~800mW/cm2 更佳,為0.1~400mW/cm2 再更佳。藉由設定為前述預定強度,可減少照射活性能量射線時所產生的熱,故能適當地調整照射活性能量射線後的硬化率。The irradiation intensity of the aforementioned active energy rays is preferably 0.1-1000 mW/cm 2 , more preferably 0.5-800 mW/cm 2 , and even more preferably 0.1-400 mW/cm 2 . By setting to the above-mentioned predetermined intensity, the heat generated at the time of irradiating active energy rays can be reduced, so the curing rate after irradiating active energy rays can be appropriately adjusted.

就前述活性能量射線之照射時間而言,宜為1~60秒,為5~50秒更佳,為10~40秒再更佳。藉由設定為前述預定時間,可減少照射活性能量射線時所產生的熱,故能適當地調整照射活性能量射線後的硬化率。As for the irradiation time of the aforementioned active energy rays, it is preferably 1 to 60 seconds, more preferably 5 to 50 seconds, and even more preferably 10 to 40 seconds. By setting to the aforementioned predetermined time, the heat generated when irradiating active energy rays can be reduced, so that the curing rate after irradiating active energy rays can be appropriately adjusted.

就前述活性能量射線之照射時間而言,可一次性進行照射,也可分次進行照射。分次進行照射時,例如也可將1分鐘的照射分成2次,而照射30秒2次。藉由予以分次,可減少照射活性能量射線時所產生的熱,故能適當地調整照射活性能量射線後的硬化率。Regarding the irradiation time of the aforementioned active energy rays, irradiation may be performed at one time or may be performed in divided steps. When the irradiation is performed in divided steps, for example, one minute of irradiation may be divided into two times, and the irradiation may be performed twice in 30 seconds. By grading, the heat generated when irradiating active energy rays can be reduced, so the curing rate after irradiating active energy rays can be appropriately adjusted.

前述步驟[2]中,使照射前述活性能量射線後之前述黏接片的硬化率提昇0.01~30%。另外,使硬化率提昇1%意指:步驟[1]的硬化率為1%時,提昇成為2%的情況(以下皆同)。藉由設定為前述硬化率,即使在照射活性能量射線後,黏接片仍具有貼合所必須要的黏著性,故即使照射活性能量射線後,仍可將被黏接體彼此疊層。又,藉由設定為前述硬化率,即使在照射活性能量射線後,黏接片仍具有隨附於高低差所必須要的柔軟性,故例如在被黏接體之至少一者為具有撓曲及/或凹凸之類的被黏接體之疊層步驟中,仍可使黏接片隨附到前述撓曲及/或凹凸。前述步驟[2]中,宜使硬化率提昇0.1~20%,使硬化率提昇0.2~10%更佳。In the aforementioned step [2], the hardening rate of the aforementioned adhesive sheet after irradiating the aforementioned active energy rays is increased by 0.01-30%. In addition, increasing the hardening rate by 1% means that when the hardening rate in the step [1] is 1%, the increase is 2% (the same applies hereinafter). By setting the above-mentioned curing rate, the adhesive sheet has the adhesiveness necessary for bonding even after the active energy ray irradiation, so even after the active energy ray irradiation, the adherends can be laminated. In addition, by setting the aforementioned curing rate, the adhesive sheet still has the flexibility required to cope with the difference in height even after the active energy ray is irradiated, so that at least one of the adherends has a deflection In the step of laminating adherends such as unevenness and/or unevenness, the adhesive sheet can still be attached to the aforementioned flexure and/or unevenness. In the aforementioned step [2], it is preferable to increase the hardening rate by 0.1-20%, and it is more preferable to increase the hardening rate by 0.2-10%.

另外,前述硬化率係以凝膠分率表示,凝膠分率係指將本發明之黏接片的黏接劑層浸漬到已調整至23℃之甲苯中24小時,並根據未溶解於前述溶劑中而殘存之黏接片的黏接劑層之乾燥後的質量、以及下式進行計算而得的值。In addition, the above-mentioned hardening rate is expressed by gel fraction, and the gel fraction refers to the adhesive layer of the adhesive sheet of the present invention immersed in toluene adjusted to 23°C for 24 hours, and according to the undissolved in the above-mentioned The mass of the adhesive layer of the adhesive sheet remaining in the solvent after drying and the value calculated by the following formula.

凝膠分率(質量%)=[(未溶解於甲苯而殘存之黏接片的黏接劑層之質量)/(浸漬於甲苯前之黏接片的黏接劑層之質量)]×100Gel fraction (mass %)=[(mass of adhesive layer of adhesive sheet not dissolved in toluene)/(mass of adhesive layer of adhesive sheet before immersion in toluene)]×100

前述步驟[2]中,藉由照射活性能量射線而使前述黏接片之硬化反應開始。就其他使硬化反應開始的方法而言,還有加熱、吸濕(吸水)等,但藉由使用活性能量射線,即使對存有因加熱而劣化之顧慮的構件仍可適用,又,不需要對疊層步驟中的黏接片進行吸濕管理。In the aforementioned step [2], the hardening reaction of the aforementioned adhesive sheet is started by irradiating active energy rays. Other methods for initiating the hardening reaction include heating, moisture absorption (water absorption), etc., but by using active energy rays, it can be applied even to components that may deteriorate due to heating, and it is not necessary to Manage moisture absorption of the adhesive sheet in the lamination step.

就前述活性能量射線而言,宜使用紫外線。前述紫外線在有效率地實施利用紫外線所致之硬化反應方面,可在氮氣等鈍性氣體環境下進行照射,也可在空氣環境下進行照射。又,也可因應需要合併使用熱作為能量源,並於照射活性能量射線後進行加熱。As the aforementioned active energy rays, ultraviolet rays are preferably used. The aforementioned ultraviolet rays may be irradiated under an inert gas environment such as nitrogen gas or may be irradiated under an air environment in order to efficiently carry out the hardening reaction by ultraviolet rays. Also, if necessary, heat may be used in combination as an energy source, and heating may be performed after irradiating active energy rays.

使用紫外線作為活性能量射線時,可列舉:低壓水銀燈、高壓水銀燈、超高壓水銀燈、金屬鹵化物燈、無電極燈(FUSION LAMP)、化學燈、黑光燈、水銀-氙氣燈、短弧燈、氦-鎘雷射、氬雷射、太陽光、LED等。又,能閃光性地照射活性能量射線之氙氣閃光燈由於可將對前述基材之熱的影響控制在最小限度,故較理想。When ultraviolet rays are used as active energy rays, examples include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high pressure mercury lamps, metal halide lamps, electrodeless lamps (FUSION LAMP), chemical lamps, black light lamps, mercury-xenon lamps, short-arc lamps, helium - Cadmium laser, argon laser, sunlight, LED, etc. Also, a xenon flash lamp capable of flashing irradiating active energy rays is preferable because it can minimize the influence of heat on the substrate.

就上述活性能量射線之照射裝置而言,除了使用前述者之外,還可使用殺菌燈、碳弧、氙氣燈、金屬鹵化物燈、掃描型、簾型電子束加速器等。As the irradiation device of the above-mentioned active energy rays, in addition to the above-mentioned ones, germicidal lamps, carbon arcs, xenon lamps, metal halide lamps, scanning type, curtain type electron beam accelerators, etc. can also be used.

就前述活性能量射線之照射方法而言,可列舉對前述黏接片直接照射之方法、或介隔預先疊層於前述黏接片之基材等而照射活性能量射線之方法。此時,前述基材等必須為透明,就前述基材而言,可列舉例如後述之剝離襯裡等。As the method of irradiating the aforementioned active energy rays, a method of directly irradiating the aforementioned adhesive sheet, or a method of irradiating active energy rays through a substrate laminated on the aforementioned adhesive sheet in advance can be mentioned. In this case, the aforementioned base material and the like must be transparent, and examples of the aforementioned base material include release liners described later.

前述步驟[3]中,藉由將前述黏接片壓潰可提高黏合到被黏接體之黏合性,例如即使為表面具有撓曲、凹凸之類的被黏接體,仍可使前述黏接片隨附於該撓曲、凹凸,並使其適當地黏合。In the aforementioned step [3], the adhesion to the adherend can be improved by crushing the aforementioned adhesive sheet. The tabs accompany this flex, bump, and allow it to bond properly.

將第2被黏接體接合於由黏接劑層與第1被黏接體構成的疊層物之黏接劑層表面,該接合係於30~100℃之溫度下,歷時10秒~10分鐘施加1~500KPa之壓力,而使前述黏接片之厚度比原本厚度薄10%以上之狀態下進行。The second adherend is bonded to the surface of the adhesive layer of the laminate consisting of the adhesive layer and the first adherend, and the bonding is at a temperature of 30 to 100°C for 10 seconds to 10 seconds. Apply a pressure of 1~500KPa every minute, so that the thickness of the aforementioned adhesive sheet is more than 10% thinner than the original thickness.

又,前述步驟[3]中,藉由適當地調整後述溫度與壓力與時間,例如可使黏接片之厚度比原本厚度薄10%以上,藉此,例如在被黏接體之至少一者為具有撓曲及/或凹凸之類的被黏接體之疊層步驟中,可使黏接片充分地隨附到前述撓曲及/或凹凸。又,為了在使前述黏接片之厚度比原本厚度薄10%以上之狀態下,使其和被黏接體黏合,必須將前述步驟[2]中的照射活性能量射線後之硬化率設定在前述預定範圍內。Also, in the aforementioned step [3], by properly adjusting the temperature, pressure, and time described later, for example, the thickness of the adhesive sheet can be made thinner by more than 10% than the original thickness, whereby, for example, at least one of the adherends In the step of laminating an adherend having warpage and/or unevenness, the adhesive sheet can be sufficiently attached to the warp and/or unevenness. In addition, in order to bond the adhesive sheet to the adherend with the thickness of the adhesive sheet being 10% or more thinner than the original thickness, it is necessary to set the curing rate after the active energy ray irradiation in the aforementioned step [2] to within the aforementioned predetermined range.

前述步驟[3]中,壓潰前述黏接片之溫度係為了使前述黏接片與被黏接體黏合,且使厚度改變所必須,在接合方面,溫度可適當地調整,但宜為30~100℃,為40℃~90℃更佳,為50~80℃再更佳。藉由設定在前述預定範圍,可在前述步驟[1]、[2]中維持片形狀,且不須抑制因加熱導致之液晶顯示裝置之構件的損傷,可適當地改變厚度,且可獲得用以得到高接合強度所必須要的黏合性,故更理想。In the aforementioned step [3], the temperature for crushing the aforementioned adhesive sheet is necessary to make the aforementioned adhesive sheet adhere to the adherend and change the thickness. In terms of bonding, the temperature can be adjusted appropriately, but it is preferably 30 ~100°C, more preferably 40°C~90°C, more preferably 50~80°C. By setting within the aforementioned predetermined range, the shape of the sheet can be maintained in the aforementioned steps [1], [2], and it is not necessary to suppress damage to members of the liquid crystal display device due to heating, the thickness can be appropriately changed, and the use can be obtained. In order to obtain the adhesiveness necessary for high joint strength, it is more ideal.

前述步驟[3]中,壓潰前述黏接片之壓力係為了使前述黏接片與被黏接體黏合,且使厚度改變所必須,在接合方面,壓力可適當地調整,但宜為0.1~3000KPa之壓力,為0.5~1000KPa更佳,為1.0~500KPa的話,不會因加壓導致損傷液晶顯示裝置之構件,可適當地改變厚度,且可獲得用以得到高接合強度所必須要的黏合性,故更理想。In the aforementioned step [3], the pressure of crushing the aforementioned adhesive sheet is necessary to make the aforementioned adhesive sheet adhere to the adherend and change the thickness. In terms of bonding, the pressure can be adjusted appropriately, but it is preferably 0.1 The pressure of ~3000KPa is more preferably 0.5~1000KPa. If it is 1.0~500KPa, the components of the liquid crystal display device will not be damaged due to the pressure, and the thickness can be changed appropriately, and the necessary strength for obtaining high joint strength can be obtained. Adhesive, so more ideal.

前述步驟[3]中,壓潰前述黏接片之時間係為了使前述黏接片與被黏接體黏合,且使厚度改變所必須,在接合方面,時間可適當地調整,但宜為10秒~20分鐘,為30秒~15分鐘更佳,為1~10分鐘的話,不會損傷被黏接體,且可適當地改變厚度,且可獲得用以得到高接合強度所必須要的黏合性,故更理想。In the aforementioned step [3], the time for crushing the aforementioned adhesive sheet is necessary to make the aforementioned adhesive sheet adhere to the adherend and change the thickness. In terms of bonding, the time can be adjusted appropriately, but it is preferably 10 Seconds to 20 minutes, preferably 30 seconds to 15 minutes, 1 to 10 minutes, the adherend will not be damaged, and the thickness can be changed appropriately, and the necessary adhesion for obtaining high joint strength can be obtained Sex, so it is more ideal.

前述步驟[3]宜在前述步驟[2]結束後60分鐘以內實施。在5~45分鐘以內更佳,在10~30分鐘以內實施再更佳。藉由設定在前述預定範圍,可確保從前述步驟[2]移至步驟[3]的準備時間,且可在前述步驟[3]中賦予壓潰前述黏接片所必須要的柔軟性。The aforementioned step [3] should be implemented within 60 minutes after the aforementioned step [2]. It is better within 5 to 45 minutes, and it is even better to implement within 10 to 30 minutes. By setting within the aforementioned predetermined range, the preparation time for moving from the aforementioned step [2] to the aforementioned step [3] can be ensured, and the flexibility necessary for crushing the aforementioned adhesive sheet can be imparted in the aforementioned step [3].

前述步驟[4]中,藉由在20~100℃之溫度下熟成30分鐘~7天,而使前述黏接劑層之硬化率從前述步驟[2]之硬化率進一步提昇20%以上。本發明之製造方法中,藉由照射活性能量射線而黏接片之硬化反應即會開始,故即使在常溫下硬化仍會進行,但可因應需要進行加熱,將硬化時間縮短。In the aforementioned step [4], by aging at a temperature of 20-100° C. for 30 minutes to 7 days, the hardening rate of the aforementioned adhesive layer is further increased by more than 20% from the hardening rate of the aforementioned step [2]. In the production method of the present invention, the hardening reaction of the adhesive sheet will start by irradiating active energy rays, so hardening will still proceed even at normal temperature, but the hardening time can be shortened by heating as needed.

就於前述步驟[4]使黏接片硬化而形成的硬化物而言,宜使其硬化率提昇30%以上。藉由設定為前述硬化率,能獲得可將構件彼此牢固地接合之黏接劑層。就前述黏接片之硬化率而言,設定為40%以上更佳,使其提昇50%以上再更佳,使其提昇60%以上最佳。For the hardened product formed by hardening the adhesive sheet in the aforementioned step [4], it is preferable to increase the hardening rate by more than 30%. By setting to the said hardening rate, the adhesive bond layer which can join members firmly can be obtained. As far as the hardening rate of the above-mentioned adhesive sheet is concerned, it is better to set it at 40% or more, and it is even better to increase it to 50% or more, and it is best to increase it to 60% or more.

另外,前述硬化率係以凝膠分率表示,凝膠分率係指將本發明之黏接片的黏接劑層浸漬到已調整至23℃之甲苯中24小時,並根據未溶解於前述溶劑中而殘存之黏接片的黏接劑層之乾燥後的質量、以及下式進行計算而得的值。In addition, the above-mentioned hardening rate is expressed by gel fraction, and the gel fraction refers to the adhesive layer of the adhesive sheet of the present invention immersed in toluene adjusted to 23°C for 24 hours, and according to the undissolved in the above-mentioned The mass of the adhesive layer of the adhesive sheet remaining in the solvent after drying and the value calculated by the following formula.

凝膠分率(質量%)=[(未溶解於甲苯而殘存之黏接片的黏接劑層之質量)/(浸漬於甲苯前之黏接片的黏接劑層之質量)]×100Gel fraction (mass %)=[(mass of adhesive layer of adhesive sheet not dissolved in toluene)/(mass of adhesive layer of adhesive sheet before immersion in toluene)]×100

就前述步驟[4]之硬化溫度而言,宜為30~100℃,為40℃~90℃更佳,為50~80℃再更佳。藉由設定在前述預定範圍,不須抑制因加熱導致之液晶顯示裝置之構件的損傷,可適當地改變厚度,且可獲得用以得到高接合強度所必須要的黏合性,故更理想。As for the curing temperature in the aforementioned step [4], it is preferably 30-100°C, more preferably 40-90°C, and even more preferably 50-80°C. By setting it within the aforementioned predetermined range, it is more desirable that the thickness can be appropriately changed without suppressing damage to members of the liquid crystal display device due to heating, and that the adhesiveness necessary for obtaining high bonding strength can be obtained.

就前述步驟[4]之硬化時間而言,宜熟成10分鐘~7天,熟成15分鐘~1天更佳,熟成20分鐘~3小時再更佳,熟成1~2小時的話,可抑制於高溫之加熱所導致之液晶顯示裝置之構件的損傷,且可抑制因每個構件之熱膨脹差而在冷卻時所產生之構件間的應變所導致之被黏接體的變形,及在黏接片與被黏接體間產生之裂紋所導致之剝離。As far as the hardening time of the aforementioned step [4] is concerned, it should be matured for 10 minutes to 7 days, more preferably for 15 minutes to 1 day, and even more preferably for 20 minutes to 3 hours. If matured for 1 to 2 hours, it can be restrained at high temperature The damage of the components of the liquid crystal display device caused by the heating, and the deformation of the adherend caused by the strain between the components generated during cooling due to the thermal expansion difference of each component can be suppressed, and the bonding between the adhesive sheet and the Peeling caused by cracks between bonded bodies.

前述步驟[4]宜在前述步驟[2]結束後60分鐘以內實施。在5~45分鐘以內更佳,在10~30分鐘以內實施再更佳。藉由設定在前述預定範圍,可確保從前述步驟[2]移至步驟[4]的準備時間,且可在前述步驟[4]中賦予為了使前述黏接片與被黏接體黏合所必須要的黏著性與柔軟性。The aforementioned step [4] should be implemented within 60 minutes after the aforementioned step [2]. It is better within 5 to 45 minutes, and it is even better to implement within 10 to 30 minutes. By setting within the aforementioned predetermined range, the preparation time for moving from the aforementioned step [2] to the aforementioned step [4] can be ensured, and the necessary time for bonding the aforementioned adhesive sheet to the adherend can be given in the aforementioned step [4]. Adhesiveness and softness required.

就前述製造方法所使用的黏接片之黏接劑層而言,硬化前之黏接劑層之於23℃的損耗正切(tanδ23 )宜未達1.5。Regarding the adhesive layer of the adhesive sheet used in the aforementioned manufacturing method, the loss tangent (tanδ 23 ) of the adhesive layer before hardening at 23°C is preferably less than 1.5.

另外,前述於23℃的損耗正切(tanδ23 )係使用動態黏彈性試驗機(Rheometrics公司製,商品名:ARES 2KSTD),將試驗片挾持於係該試驗機的測定部之平行圓盤之間,測定於溫度0~150℃、及頻率1Hz的儲藏彈性模量(G’)與損失彈性模量(G”),損耗正切(tanδ)係將前述損失彈性模量(G”)除以前述儲藏彈性模量(G’)而得的值(G”/G’)。另外,就上述測定所使用的試驗片而言,係使用將前述黏接劑層裁切成由厚度1mm且直徑8mm之大小構成的圓形狀者。In addition, the aforementioned loss tangent (tanδ 23 ) at 23°C was obtained using a dynamic viscoelasticity testing machine (manufactured by Rheometrics, trade name: ARES 2KSTD), and the test piece was sandwiched between parallel discs in the measuring section of the testing machine. , Measure the storage elastic modulus (G') and loss elastic modulus (G") at a temperature of 0~150°C and a frequency of 1 Hz, and the loss tangent (tanδ) is divided by the aforementioned loss elastic modulus (G") The value (G"/G') obtained by storing the elastic modulus (G'). In addition, for the test piece used in the above measurement, the above-mentioned adhesive layer was cut into a piece with a thickness of 1 mm and a diameter of 8 mm. The size of the circular shape.

就前述黏接片之黏接劑層而言,於頻率1Hz測定硬化前之黏接劑層之於23℃的損耗正切(tanδ23 )時,宜設定為未達1.5,設定為0.01以上至1.0以下之範圍更佳,設定為0.1以上至0.8以下之範圍的話,在獲得如下之製造方法方面更為理想:於前述步驟[1]及步驟[2]中將黏接片之厚度維持一定,並改善貼合黏接片時的操作性。For the adhesive layer of the above-mentioned adhesive sheet, when measuring the loss tangent (tanδ 23 ) of the adhesive layer before hardening at 23°C at a frequency of 1 Hz, it should be set to less than 1.5, and set to 0.01 or more to 1.0 The following range is more preferable, and if it is set in the range of 0.1 to 0.8, it is more ideal to obtain the following manufacturing method: in the aforementioned step [1] and step [2], the thickness of the adhesive sheet is maintained constant, and Improved operability when attaching adhesive sheets.

另外,前述黏接片在硬化前之黏接劑層之於23℃的損耗正切(tanδ23 ),除了可利用前述製造時之條件之外,還可利用適當地選擇後述之前述光硬化性樹脂(A)、前述熱塑性樹脂(B)、因應需要之其他成分等之組成或其數目平均分子量等,而設定在前述預定範圍內。In addition, the loss tangent (tanδ 23 ) of the adhesive layer at 23°C before hardening of the above-mentioned adhesive sheet can be used in addition to the above-mentioned conditions at the time of production, and can also be used by appropriately selecting the above-mentioned photocurable resin described later. (A), the above-mentioned thermoplastic resin (B), the composition or the number average molecular weight of other components according to need, etc., are set within the above-mentioned predetermined range.

就前述黏接片的黏接劑層而言,宜使用於步驟[3]之實施溫度以下具有熔點者。於前述範圍具有熔點者可適當地實施前述黏接片之厚度之薄化,且可獲得隨附於構件之撓曲、表面之高低差部之隨附性得到改善之製造方法。As for the adhesive layer of the aforementioned adhesive sheet, it is preferable to use one having a melting point below the implementation temperature of step [3]. Those having a melting point within the aforementioned range can appropriately reduce the thickness of the aforementioned adhesive sheet, and can obtain a manufacturing method in which compliance with deflection of the member and the compliance of the surface level difference is improved.

另外,前述熔點係指使用差示掃描熱量測定法(DSC法),以昇溫速度10℃/分鐘之昇溫條件從20℃昇溫至150℃,保持1分鐘後,以10℃/分鐘之降溫條件暫時冷卻至-10℃,保持10分鐘後,再度以10℃/分鐘之昇溫條件進行測定時所觀察到的顯示最大放熱峰部(放熱峰頂)之溫度。In addition, the above-mentioned melting point refers to the use of differential scanning calorimetry (DSC method), the temperature is raised from 20°C to 150°C at a heating rate of 10°C/min, and after holding for 1 minute, it is temporarily heated at a temperature of 10°C/min. After cooling to -10°C and keeping it for 10 minutes, the temperature of the maximum exothermic peak (exothermic peak top) observed when the temperature is raised again at 10°C/min is measured.

就前述黏接片之黏接劑層而言,硬化後之黏接劑層於40℃的儲藏彈性模量(E’40)以頻率1.0Hz進行測定時宜為1.0×104 Pa以上,且於60℃的儲藏彈性模量(E’60)以頻率1.0Hz進行測定時宜為1.0×104 Pa以上。藉由設定為前述儲藏彈性模量,能獲得可將構件彼此牢固地接合之黏接劑層。As for the adhesive layer of the aforementioned adhesive sheet, the storage elastic modulus (E'40) of the cured adhesive layer at 40°C is preferably 1.0×10 4 Pa or more when measured at a frequency of 1.0 Hz, and The storage elastic modulus (E'60) at 60°C is preferably 1.0×10 4 Pa or more when measured at a frequency of 1.0 Hz. By setting the storage elastic modulus as described above, an adhesive layer capable of firmly joining members can be obtained.

另外,前述黏接片經硬化形成的硬化物(硬化後之黏接劑層)的動態黏彈性係使用動態黏彈性測定裝置(Rheometrics公司製,商品名:RSA-II)測得的值。另外,前述測定係使用如下者:製作前述黏接片經硬化形成的厚度100μm之硬化物(硬化後之黏接劑層),並將其使用啞鈴形裁切機衝壓成JIS K 7127之試驗片模型5的形狀。In addition, the dynamic viscoelasticity of the cured product formed by hardening the adhesive sheet (cured adhesive layer) is a value measured using a dynamic viscoelasticity measuring device (manufactured by Rheometrics, trade name: RSA-II). In addition, the above-mentioned measurement uses the following: prepare the hardened product (adhesive layer after hardening) with a thickness of 100 μm formed by hardening the above-mentioned adhesive sheet, and punch it into a test piece according to JIS K 7127 using a dumbbell-shaped cutting machine. The shape of model 5.

就前述製造方法所使用的黏接片之黏接劑層而言,宜使用厚度為50~2000μm之範圍者,使用100~1500μm者更佳,使用200~1000μm者的話,在獲得如下之製造方法方面較理想:於前述步驟[1]及步驟[2]中將黏接片之厚度維持一定,並改善貼合黏接片時的操作性,且於前述步驟[3]中,可適當地實施前述黏接片之厚度之薄化,且隨附於構件之撓曲、表面之高低差部之隨附性獲得改善。As for the adhesive layer of the adhesive sheet used in the aforementioned manufacturing method, it is preferable to use a thickness in the range of 50-2000 μm, more preferably 100-1500 μm, and 200-1000 μm. After obtaining the following manufacturing method The aspect is more ideal: in the aforementioned step [1] and step [2], the thickness of the adhesive sheet can be maintained at a certain level, and the operability when pasting the adhesive sheet can be improved, and in the aforementioned step [3], it can be properly implemented The thickness of the aforementioned adhesive sheet is thinned, and the compliance with the deflection of the member and the unevenness of the surface is improved.

利用上述疊層體之製造方法,即使在短時間且低溫仍可完成施工並進行接合,且即使對2個以上之活性能量射線不會透射而在構件表面具有撓曲、凹凸之被黏接體仍可理想地予以接合。Utilizing the above-mentioned manufacturing method of laminates, construction and bonding can be completed even in a short time and at low temperature, and even if two or more active energy rays are not transmitted, the adherend has bending and unevenness on the surface of the member It can still be joined ideally.

本發明之疊層體在硬化前較柔軟,故對存在有撓曲、凹凸之構件的隨附性優良,且在硬化後可將構件充分地進行接合,故可專門使用於圖像顯示裝置所使用的各種構件彼此之接合材。The laminated body of the present invention is soft before hardening, so it is excellent in adhering to members with deflection and unevenness, and can fully bond the members after hardening, so it can be used exclusively for image display devices. The joint material used for various components.

就前述圖像顯示裝置而言,可列舉例如:個人電腦、行動電話、智慧型手機、平板電腦等行動終端(PDA)、遊戲機、電視(TV)、汽車導航、觸控面板、手寫板等使用了搭載有LCD、PDP或EL、有機EL、微型LED、量子點(QD)等之圖像顯示面板之平面型圖像顯示裝置的構成構件。就構成構件而言,可列舉例如:圖像顯示面板、電路基板、背蓋、邊框(bezel)、框架(frame)、底盤等。本發明之黏接片可在硬化後將構件彼此牢固地接合,故也可使用於構成產業用途、廣告用途所使用的大型圖像顯示裝置之構件彼此的接合。 [實施例]Examples of the aforementioned image display device include mobile terminals (PDA) such as personal computers, mobile phones, smart phones, and tablet computers, game consoles, televisions (TV), car navigation, touch panels, tablet computers, etc. A component of a flat-panel image display device using an image display panel equipped with LCD, PDP, EL, organic EL, micro LED, quantum dot (QD), etc. The constituent members include, for example, an image display panel, a circuit board, a back cover, a bezel, a frame, and a chassis. The adhesive sheet of the present invention can firmly join members after hardening, so it can also be used for joining members constituting large-scale image display devices used in industrial applications and advertising applications. [Example]

以下利用實施例及比較例更具體地說明本發明。 <胺甲酸酯系樹脂(B’-1)之製備> 藉由於反應容器中,將使1,5-戊烷二醇、1,6-己烷二醇及碳酸二烷基酯反應而得之數目平均分子量2000之脂肪族聚碳酸酯多元醇50質量份、與使1,6-己烷二醇及己二酸反應而得之數目平均分子量4500之聚酯多元醇30質量份進行混合,並於減壓條件下加熱至100℃來進行脫水,以使含水率成為0.05質量%。Hereinafter, the present invention will be more specifically described using examples and comparative examples. <Preparation of urethane resin (B'-1)> 50 parts by mass of aliphatic polycarbonate polyol with a number average molecular weight of 2000 obtained by reacting 1,5-pentanediol, 1,6-hexanediol and dialkyl carbonate in a reaction vessel , mixed with 30 parts by mass of polyester polyol with a number average molecular weight of 4500 obtained by reacting 1,6-hexanediol and adipic acid, and heated to 100°C under reduced pressure for dehydration, so that The water content was 0.05% by mass.

然後,藉由將前述脂肪族聚碳酸酯多元醇及前述聚酯多元醇之混合物冷卻至70℃者、與二環己基甲烷-4,4’-二異氰酸酯14.5質量份進行混合後,昇溫至100℃並使其反應3小時,獲得胺甲酸酯系樹脂(B’-1)。另外,前述胺甲酸酯系樹脂(B’-1)具有異氰酸酯基作為聚合性官能基。Then, after cooling the mixture of the above-mentioned aliphatic polycarbonate polyol and the above-mentioned polyester polyol to 70°C, and mixing it with 14.5 parts by mass of dicyclohexylmethane-4,4'-diisocyanate, the temperature was raised to 100 °C and reacted for 3 hours to obtain a urethane-based resin (B'-1). In addition, the aforementioned urethane resin (B'-1) has an isocyanate group as a polymerizable functional group.

<胺甲酸酯系樹脂(B’-2)之製備> 藉由於反應容器中,將使1,5-戊烷二醇、1,6-己烷二醇及碳酸二烷基酯反應而得之數目平均分子量2000之脂肪族聚碳酸酯多元醇40質量份、與使1,6-己烷二醇及己二酸反應而得之數目平均分子量4500之聚酯多元醇40質量份進行混合,並於減壓條件下加熱至100℃來進行脫水,以使含水率成為0.05質量%。<Preparation of urethane resin (B'-2)> 40 parts by mass of aliphatic polycarbonate polyol with a number average molecular weight of 2000 obtained by reacting 1,5-pentanediol, 1,6-hexanediol and dialkyl carbonate in a reaction vessel , mixed with 40 parts by mass of polyester polyol with a number average molecular weight of 4500 obtained by reacting 1,6-hexanediol and adipic acid, and heated to 100°C under reduced pressure for dehydration, so that The water content was 0.05% by mass.

然後,藉由將前述脂肪族聚碳酸酯多元醇及前述聚酯多元醇之混合物冷卻至70℃者、與二環己基甲烷-4,4’-二異氰酸酯13.7質量份進行混合後,昇溫至100℃並使其反應3小時,獲得胺甲酸酯系樹脂(B’-2)。另外,前述胺甲酸酯系樹脂(B’-2)具有異氰酸酯基作為聚合性官能基。Then, after cooling the mixture of the above-mentioned aliphatic polycarbonate polyol and the above-mentioned polyester polyol to 70°C, and mixing it with 13.7 parts by mass of dicyclohexylmethane-4,4'-diisocyanate, the temperature was raised to 100 °C and reacted for 3 hours to obtain a urethane-based resin (B'-2). In addition, the aforementioned urethane resin (B'-2) has an isocyanate group as a polymerizable functional group.

<胺甲酸酯系樹脂(B’-3)之製備> 藉由於反應容器中,將使1,5-戊烷二醇、1,6-己烷二醇及碳酸二烷基酯反應而得之數目平均分子量2000之脂肪族聚碳酸酯多元醇60質量份、與使1,6-己烷二醇及己二酸反應而得之數目平均分子量4500之聚酯多元醇20質量份進行混合,並於減壓條件下加熱至100℃來進行脫水,以使含水率成為0.05質量%。<Preparation of urethane resin (B'-3)> 60 parts by mass of aliphatic polycarbonate polyol with a number average molecular weight of 2000 obtained by reacting 1,5-pentanediol, 1,6-hexanediol and dialkyl carbonate in a reaction vessel , mixed with 20 parts by mass of polyester polyol with a number average molecular weight of 4500 obtained by reacting 1,6-hexanediol and adipic acid, and heated to 100°C under reduced pressure for dehydration, so that The water content was 0.05% by mass.

然後,藉由將前述脂肪族聚碳酸酯多元醇及前述聚酯多元醇之混合物冷卻至70℃者、與二環己基甲烷-4,4’-二異氰酸酯16.3質量份進行混合後,昇溫至100℃並使其反應3小時,獲得胺甲酸酯系樹脂(B’-3)。另外,前述胺甲酸酯系樹脂(B’-3)具有異氰酸酯基作為聚合性官能基。Then, after cooling the mixture of the above-mentioned aliphatic polycarbonate polyol and the above-mentioned polyester polyol to 70°C, and mixing it with 16.3 parts by mass of dicyclohexylmethane-4,4'-diisocyanate, the temperature was raised to 100 °C and reacted for 3 hours to obtain a urethane-based resin (B'-3). In addition, the aforementioned urethane resin (B'-3) has an isocyanate group as a polymerizable functional group.

<胺甲酸酯系樹脂(B’-4)之製備> 藉由於反應容器中,將使1,5-戊烷二醇、1,6-己烷二醇及碳酸二烷基酯反應而得之數目平均分子量2000之脂肪族聚碳酸酯多元醇60質量份、與使1,6-己烷二醇及己二酸反應而得之數目平均分子量4500之聚酯多元醇20質量份進行混合,並於減壓條件下加熱至100℃來進行脫水,以使含水率成為0.05質量%。<Preparation of urethane resin (B'-4)> 60 parts by mass of aliphatic polycarbonate polyol with a number average molecular weight of 2000 obtained by reacting 1,5-pentanediol, 1,6-hexanediol and dialkyl carbonate in a reaction vessel , mixed with 20 parts by mass of polyester polyol with a number average molecular weight of 4500 obtained by reacting 1,6-hexanediol and adipic acid, and heated to 100°C under reduced pressure for dehydration, so that The water content was 0.05% by mass.

然後,藉由將前述脂肪族聚碳酸酯多元醇及前述聚酯多元醇之混合物冷卻至70℃者、與二環己基甲烷-4,4’-二異氰酸酯15.3質量份進行混合後,昇溫至100℃並使其反應3小時,獲得胺甲酸酯系樹脂(B’-4)。另外,前述胺甲酸酯系樹脂(B’-4)具有異氰酸酯基作為聚合性官能基。Then, after cooling the mixture of the above-mentioned aliphatic polycarbonate polyol and the above-mentioned polyester polyol to 70°C, and mixing it with 15.3 parts by mass of dicyclohexylmethane-4,4'-diisocyanate, the temperature was raised to 100 °C and reacted for 3 hours to obtain a urethane-based resin (B'-4). In addition, the aforementioned urethane resin (B'-4) has an isocyanate group as a polymerizable functional group.

<胺甲酸酯系樹脂(B’-5)之製備> 藉由於反應容器中,將使1,5-戊烷二醇、1,6-己烷二醇及碳酸二烷基酯反應而得之數目平均分子量2000之脂肪族聚碳酸酯多元醇60質量份、與使1,6-己烷二醇及己二酸反應而得之數目平均分子量4500之聚酯多元醇20質量份進行混合,並於減壓條件下加熱至100℃來進行脫水,以使含水率成為0.05質量%。<Preparation of urethane resin (B'-5)> 60 parts by mass of aliphatic polycarbonate polyol with a number average molecular weight of 2000 obtained by reacting 1,5-pentanediol, 1,6-hexanediol and dialkyl carbonate in a reaction vessel , mixed with 20 parts by mass of polyester polyol with a number average molecular weight of 4500 obtained by reacting 1,6-hexanediol and adipic acid, and heated to 100°C under reduced pressure for dehydration, so that The water content was 0.05% by mass.

然後,藉由將前述脂肪族聚碳酸酯多元醇及前述聚酯多元醇之混合物冷卻至70℃者、與二環己基甲烷-4,4’-二異氰酸酯4.5質量份進行混合後,昇溫至100℃並使其反應3小時至羥基含量成為定值,獲得胺甲酸酯系樹脂(B’-5)。另外,前述胺甲酸酯系樹脂(B’-5)具有羥基作為聚合性官能基。Then, after cooling the mixture of the above-mentioned aliphatic polycarbonate polyol and the above-mentioned polyester polyol to 70°C, and mixing it with 4.5 parts by mass of dicyclohexylmethane-4,4'-diisocyanate, the temperature was raised to 100 °C and allowed to react for 3 hours until the hydroxyl content became a constant value to obtain a urethane resin (B'-5). In addition, the aforementioned urethane resin (B'-5) has a hydroxyl group as a polymerizable functional group.

<胺甲酸酯系樹脂(C’-1)之製備> 藉由於反應容器中,將使1,5-戊烷二醇、1,6-己烷二醇及碳酸二烷基酯反應而得之數目平均分子量2000之脂肪族聚碳酸酯多元醇60質量份、與使1,4-丁烷二醇及己二酸反應而得之數目平均分子量1000之聚酯多元醇20質量份進行混合,並於減壓條件下加熱至100℃來進行脫水,以使含水率成為0.05質量%。<Preparation of urethane resin (C'-1)> 60 parts by mass of aliphatic polycarbonate polyol with a number average molecular weight of 2000 obtained by reacting 1,5-pentanediol, 1,6-hexanediol and dialkyl carbonate in a reaction vessel , mixed with 20 parts by mass of polyester polyol with a number average molecular weight of 1000 obtained by reacting 1,4-butanediol and adipic acid, and heated to 100°C under reduced pressure for dehydration, so that The water content was 0.05% by mass.

然後,藉由將前述脂肪族聚碳酸酯多元醇及前述聚酯多元醇之混合物冷卻至70℃者、與二環己基甲烷-4,4’-二異氰酸酯20質量份進行混合後,昇溫至100℃並使其反應3小時,獲得具有異氰酸酯基之胺甲酸酯系預聚物。Then, after cooling the mixture of the aforementioned aliphatic polycarbonate polyol and the aforementioned polyester polyol to 70° C., mixing it with 20 parts by mass of dicyclohexylmethane-4,4′-diisocyanate, the temperature was raised to 100 °C and allowed to react for 3 hours to obtain a urethane-based prepolymer having an isocyanate group.

藉由將使前述胺甲酸酯系預聚物100質量份於100℃加熱熔融而成者、與丙烯酸-2-羥基乙酯11.4質量份與辛酸錫(II)0.01質量份進行混合,並於100℃使其反應至NCO%成為定值,獲得胺甲酸酯系樹脂(C’-1)。另外,胺甲酸酯系樹脂(C’-1)具有聚合性不飽和雙鍵作為聚合性官能基。100 parts by mass of the aforementioned urethane-based prepolymer was heated and melted at 100° C., 11.4 parts by mass of 2-hydroxyethyl acrylate and 0.01 part by mass of tin (II) octoate were mixed, and the It was made to react at 100 degreeC until NCO% became a constant value, and the urethane resin (C'-1) was obtained. In addition, the urethane resin (C'-1) has a polymerizable unsaturated double bond as a polymerizable functional group.

利用前述方法獲得之具有聚合性不飽和雙鍵之胺甲酸酯系樹脂(C’-1)之異氰酸酯基含量(NCO%)為0質量%。The isocyanate group content (NCO%) of the urethane resin (C'-1) having a polymerizable unsaturated double bond obtained by the aforementioned method was 0% by mass.

<胺甲酸酯系樹脂(C’-2)之製備> 藉由於反應容器中,將使1,5-戊烷二醇、1,6-己烷二醇及碳酸二烷基酯反應而得之數目平均分子量2000之脂肪族聚碳酸酯多元醇40質量份、與使1,6-己烷二醇及己二酸反應而得之數目平均分子量4500之聚酯多元醇40質量份進行混合,並於減壓條件下加熱至100℃來進行脫水,以使含水率成為0.05質量%。<Preparation of urethane resin (C'-2)> 40 parts by mass of aliphatic polycarbonate polyol with a number average molecular weight of 2000 obtained by reacting 1,5-pentanediol, 1,6-hexanediol and dialkyl carbonate in a reaction vessel , mixed with 40 parts by mass of polyester polyol with a number average molecular weight of 4500 obtained by reacting 1,6-hexanediol and adipic acid, and heated to 100°C under reduced pressure for dehydration, so that The water content was 0.05% by mass.

然後,藉由將前述脂肪族聚碳酸酯多元醇及前述聚酯多元醇之混合物冷卻至70℃者、與二環己基甲烷-4,4’-二異氰酸酯13.7質量份進行混合後,昇溫至100℃並使其反應3小時,獲得具有異氰酸酯基之胺甲酸酯系預聚物。Then, after cooling the mixture of the above-mentioned aliphatic polycarbonate polyol and the above-mentioned polyester polyol to 70°C, and mixing it with 13.7 parts by mass of dicyclohexylmethane-4,4'-diisocyanate, the temperature was raised to 100 °C and allowed to react for 3 hours to obtain a urethane-based prepolymer having an isocyanate group.

藉由將使前述胺甲酸酯系預聚物100質量份於100℃加熱熔融而成者、與丙烯酸-2-羥基乙酯1.6質量份與辛酸錫(II)0.01質量份進行混合,並於100℃使其反應至NCO%成為定值,獲得胺甲酸酯系樹脂(C’-2)。另外,胺甲酸酯系樹脂(C’-2)具有聚合性不飽和雙鍵作為聚合性官能基。100 parts by mass of the aforementioned urethane-based prepolymer was heated and melted at 100° C., 1.6 parts by mass of 2-hydroxyethyl acrylate and 0.01 part by mass of tin (II) octoate were mixed, and the It was made to react at 100 degreeC until NCO% became a constant value, and the urethane resin (C'-2) was obtained. In addition, the urethane resin (C'-2) has a polymerizable unsaturated double bond as a polymerizable functional group.

利用前述方法獲得之具有聚合性不飽和雙鍵之胺甲酸酯系樹脂(C’-2)之異氰酸酯基含量(NCO%)為0質量%。The isocyanate group content (NCO%) of the urethane resin (C'-2) having a polymerizable unsaturated double bond obtained by the aforementioned method was 0% by mass.

(實施例1) 藉由將前述胺甲酸酯系樹脂(B’-1)100質量份、CEL-2021P(DAICEL公司製,脂環族環氧樹脂)43質量份、CPI-100P(San-Apro公司製,鋶鹽系,固體成分濃度50%)11.4質量份進行混合攪拌,並添加甲乙酮將非揮發成分調整成75質量%,獲得黏接劑組成物(a-1)。 然後,使用棒狀金屬器具將前述黏接劑組成物(a-1)塗覆於脫模襯裡(厚度50μm之聚對苯二甲酸乙二酯薄膜之單面經聚矽氧化合物施以剝離處理者)之表面,使乾燥後之厚度成為100μm。(Example 1) By adding 100 parts by mass of the aforementioned urethane resin (B'-1), 43 parts by mass of CEL-2021P (manufactured by DAICEL, cycloaliphatic epoxy resin), 43 parts by mass of CPI-100P (manufactured by San-Apro, Co. Salt system, solid content concentration 50%) 11.4 mass parts were mixed and stirred, and methyl ethyl ketone was added to adjust the non-volatile content to 75 mass % to obtain an adhesive composition (a-1). Then, the aforementioned adhesive composition (a-1) was coated on a release liner (one side of a polyethylene terephthalate film with a thickness of 50 μm was treated with a polysiloxane compound) using a rod-shaped metal utensil. ) surface so that the thickness after drying becomes 100 μm.

然後,將前述塗覆物投入85℃之乾燥機乾燥5分鐘,並於乾燥後之塗覆物的單面貼合脫模襯裡(厚度38μm之聚對苯二甲酸乙二酯薄膜之單面經聚矽氧化合物施以剝離處理者),獲得厚度100μm之黏接片(X-1)。Then, put the aforementioned coating into a dryer at 85°C to dry for 5 minutes, and attach a release liner (one side of a polyethylene terephthalate film with a thickness of 38 μm) to one side of the dried coating. Silicone compound was subjected to peeling treatment), and an adhesive sheet (X-1) with a thickness of 100 μm was obtained.

(實施例2) 使用前述胺甲酸酯系樹脂(B’-2)替換前述胺甲酸酯系樹脂(B’-1),除此之外,以和實施例1同樣的方法獲得厚度100μm之黏接片(X-2)。(Example 2) Except that the aforementioned urethane resin (B'-2) was used instead of the aforementioned urethane resin (B'-1), an adhesive sheet with a thickness of 100 μm was obtained in the same manner as in Example 1 ( X-2).

(實施例3) 使用前述胺甲酸酯系樹脂(B’-3)替換前述胺甲酸酯系樹脂(B’-1),除此之外,以和實施例1同樣的方法獲得厚度100μm之黏接片(X-3)。(Example 3) In addition to using the aforementioned urethane resin (B'-3) instead of the aforementioned urethane resin (B'-1), an adhesive sheet with a thickness of 100 μm was obtained in the same manner as in Example 1 ( X-3).

(實施例4) 使用前述胺甲酸酯系樹脂(B’-4)替換前述胺甲酸酯系樹脂(B’-1),除此之外,以和實施例1同樣的方法獲得厚度100μm之黏接片(X-4)。(Example 4) Except that the aforementioned urethane resin (B'-4) was used instead of the aforementioned urethane resin (B'-1), an adhesive sheet with a thickness of 100 μm was obtained in the same manner as in Example 1 ( X-4).

(實施例5) 使用前述胺甲酸酯系樹脂(B’-5)替換前述胺甲酸酯系樹脂(B’-1),並將CPI-100P的使用量從11.4質量份變更為5.7質量份,除此之外,以和實施例1同樣的方法獲得厚度100μm之黏接片(X-5)。(Example 5) In addition to using the aforementioned urethane resin (B'-5) instead of the aforementioned urethane resin (B'-1), and changing the amount of CPI-100P used from 11.4 parts by mass to 5.7 parts by mass In addition, an adhesive sheet (X-5) having a thickness of 100 μm was obtained in the same manner as in Example 1.

(比較例1) 使用前述胺甲酸酯系樹脂(C’-1)替換前述胺甲酸酯系樹脂(B’-1),除此之外,以和實施例1同樣的方法獲得厚度100μm之黏接片(X’-1)。(comparative example 1) Except that the aforementioned urethane resin (C'-1) was used instead of the aforementioned urethane resin (B'-1), an adhesive sheet with a thickness of 100 μm was obtained in the same manner as in Example 1 ( X'-1).

(比較例2) 使用前述胺甲酸酯系樹脂(C’-2)替換前述胺甲酸酯系樹脂(B’-1),除此之外,以和實施例1同樣的方法獲得厚度100μm之黏接片(X’-2)。(comparative example 2) Except that the aforementioned urethane resin (C'-2) was used instead of the aforementioned urethane resin (B'-1), an adhesive sheet with a thickness of 100 μm was obtained in the same manner as in Example 1 ( X'-2).

(比較例3) 使用DICY-7(三菱化學股份有限公司製,二氰二胺)3質量份、與2MAOK-PW(四國化成工業股份有限公司製,2,4-二胺基-6-[2’-甲基咪唑基-(1’)]-乙基-s-三

Figure 108109010-A0304-12-04
異三聚氰酸加成物)1.0質量份替換CPI-100P11.4質量份,除此之外,以和實施例1同樣的方法獲得厚度100μm之黏接片(X’-3)。 另外,前述黏接片(X’-3)具有熱聚合性起始劑,且能藉由加熱來進行硬化反應。(Comparative Example 3) 3 parts by mass of DICY-7 (manufactured by Mitsubishi Chemical Co., Ltd., dicyandiamide) and 2MAOK-PW (manufactured by Shikoku Chemical Industry Co., Ltd., 2,4-diamino-6- [2'-Methylimidazolyl-(1')]-ethyl-s-tri
Figure 108109010-A0304-12-04
An adhesive sheet (X'-3) with a thickness of 100 μm was obtained in the same manner as in Example 1 except that 1.0 parts by mass of isocyanuric acid adduct) was substituted for 11.4 parts by mass of CPI-100P. Moreover, the said adhesive sheet (X'-3) has a thermopolymerizable initiator, and can perform hardening reaction by heating.

[照射活性能量射線前之黏接劑層之損耗正切(tanδ)之測定方法] 將疊層於實施例及比較例所得到的黏接片之雙面之剝離襯裡予以剝離,並疊層黏接劑層使厚度達1mm後,裁切成由直徑8mm之大小構成的圓形狀者作為試驗片。使用動態黏彈性試驗機(Rheometrics公司製,商品名:ARES 2KSTD),將試驗片挾持於係該試驗機的測定部之平行圓盤之間,於溫度40℃及60℃,測定頻率1Hz的儲藏彈性模量(G’)與損失彈性模量(G”),損耗正切(tanδ)係將前述損失彈性模量(G”)除以前述儲藏彈性模量(G’)而得的值(G”/G’)。[Measuring method of loss tangent (tanδ) of adhesive layer before irradiation with active energy rays] Peel off the release liner laminated on both sides of the adhesive sheet obtained in Examples and Comparative Examples, and laminate the adhesive layer to a thickness of 1 mm, then cut it into a circular shape with a diameter of 8 mm as a test piece. Using a dynamic viscoelasticity testing machine (manufactured by Rheometrics, trade name: ARES 2KSTD), the test piece is clamped between the parallel disks of the measuring part of the testing machine, and the storage at a temperature of 40 ° C and 60 ° C and a frequency of 1 Hz is measured. The elastic modulus (G') and the loss elastic modulus (G"), the loss tangent (tanδ) is the value obtained by dividing the aforementioned loss elastic modulus (G") by the aforementioned storage elastic modulus (G') (G "/G').

[耐壓性之評價方法(評價對黏接片施力時,黏接劑層所含的成分是否被擠出之方法)] 將實施例及比較例得到的黏接片裁切成5cm×5cm,並將疊層於雙面之剝離襯裡剝離後,疊層黏接劑層使厚度達0.5mm。其後,將疊層成厚度達0.5mm之黏接片,於23℃之溫度環境下以0.05MPa之壓力加壓壓接於已裁切成7cm×7cm之厚度50μm之剝離襯裡的中央部10秒鐘使其貼合。[Evaluation method of pressure resistance (method of evaluating whether the components contained in the adhesive layer are squeezed out when a force is applied to the adhesive sheet)] The adhesive sheets obtained in Examples and Comparative Examples were cut into 5 cm x 5 cm, and after peeling off the release liner laminated on both sides, the adhesive layer was laminated to a thickness of 0.5 mm. Afterwards, the laminated adhesive sheet with a thickness of 0.5mm was pressed and bonded to the central part 10 of the release liner cut into 7cm×7cm with a thickness of 50μm at a temperature of 23°C with a pressure of 0.05MPa. Seconds make it fit.

從前述經貼合而得者之上部,以每單位面積施加0.1MPa之壓力的狀態,於-20℃、5℃、40℃之溫度環境下放置24小時。 然後,利用下述基準評價放置後之黏接片的厚度相對於放置前之黏接片的厚度(0.5mm)變化的比例(放置後之黏接片的厚度/放置前之黏接片的厚度)。From the upper part of the above-mentioned pasted product, a pressure of 0.1 MPa per unit area is applied, and the temperature environment of -20°C, 5°C, and 40°C is left for 24 hours. Then, the ratio of the thickness of the adhesive sheet after placement to the thickness of the adhesive sheet before placement (0.5 mm) was evaluated using the following criteria (thickness of the adhesive sheet after placement/thickness of the adhesive sheet before placement ).

◎:放置後之黏接片的厚度相對於放置前之黏接片的厚度之比例為100%以上且未達101%(無變化)。 ○:放置後之黏接片的厚度相對於放置前之黏接片的厚度之比例為97%以上且未達100%。 △:放置後之黏接片的厚度相對於放置前之黏接片的厚度之比例為93%以上且未達97%。 ×:放置後之黏接片的厚度相對於放置前之黏接片的厚度之比例未達93%。◎: The ratio of the thickness of the adhesive sheet after leaving to the thickness of the adhesive sheet before leaving was 100% or more and less than 101% (no change). ○: The ratio of the thickness of the adhesive sheet after leaving to the thickness of the adhesive sheet before leaving is 97% or more and less than 100%. △: The ratio of the thickness of the adhesive sheet after leaving to the thickness of the adhesive sheet before leaving is 93% or more and less than 97%. ×: The ratio of the thickness of the adhesive sheet after placement to the thickness of the adhesive sheet before placement is less than 93%.

[照射活性能量射線後之柔軟性的評價方法(評價將照射活性能量射線後之黏接片對於被黏接體表面的撓曲、凹凸施力時的高低差隨附性之方法)] 將實施例及比較例得到的黏接片裁切成5cm×5cm,並將疊層於雙面之剝離襯裡剝離後,疊層黏接劑層使厚度達0.5mm。其後,將疊層成厚度達0.5mm之黏接片,於23℃之溫度環境下以0.05MPa之壓力加壓壓接於已裁切成7cm×7cm之厚度50μm之剝離襯裡的中央部10秒鐘使其貼合。[Evaluation method of softness after active energy ray irradiation (method for evaluating the flexibility of the adhesive sheet after irradiating active energy ray to the surface of the adherend, and the height difference when the force is applied to the surface of the adherend)] The adhesive sheets obtained in Examples and Comparative Examples were cut into 5 cm x 5 cm, and after peeling off the release liner laminated on both sides, the adhesive layer was laminated to a thickness of 0.5 mm. Afterwards, the laminated adhesive sheet with a thickness of 0.5mm was pressed and bonded to the central part 10 of the release liner cut into 7cm×7cm with a thickness of 50μm at a temperature of 23°C with a pressure of 0.05MPa. Seconds make it fit.

將前述貼附物放置於23℃之溫度環境下60分鐘後,使用無電極燈(FUSION LAMP H-BULB)照射強度100mW/cm2 之紫外線10秒鐘。After placing the aforementioned stickers in a temperature environment of 23°C for 60 minutes, use an electrodeless lamp (FUSION LAMP H-BULB) to irradiate ultraviolet light with an intensity of 100mW/cm 2 for 10 seconds.

將前述紫外線照射後之貼附物放置於23℃之溫度環境下10分鐘後,使用已加熱至70℃之熱壓製裝置,於以0.5MPa進行加壓的狀態壓製成形10秒鐘。 利用下述基準評價熱壓製後之黏接片的厚度相對於前述熱壓製前之黏接片的厚度(0.5mm)變化的比例(熱壓製後之黏接片的厚度/熱壓製前之黏接片的厚度)。After placing the above ultraviolet irradiated sticker in a temperature environment of 23° C. for 10 minutes, use a hot pressing device heated to 70° C., and press it at 0.5 MPa for 10 seconds. The ratio of the thickness of the adhesive sheet after hot pressing to the thickness of the adhesive sheet before hot pressing (0.5 mm) was evaluated using the following criteria (thickness of the adhesive sheet after hot pressing/adhesion before hot pressing slice thickness).

◎:熱壓製後之黏接片的厚度相對於熱壓製前之黏接片的厚度之比例未達50%。 ○:熱壓製後之黏接片的厚度相對於熱壓製前之黏接片的厚度之比例為50%以上且未達80%。 △:熱壓製後之黏接片的厚度相對於熱壓製前之黏接片的厚度之比例為80%以上且未達90%。 ×:熱壓製後之黏接片的厚度相對於熱壓製前之黏接片的厚度之比例為90%以上且未達100%(無變化)。◎: The ratio of the thickness of the adhesive sheet after hot pressing to the thickness of the adhesive sheet before hot pressing is less than 50%. ○: The ratio of the thickness of the adhesive sheet after hot pressing to the thickness of the adhesive sheet before hot pressing is 50% or more and less than 80%. △: The ratio of the thickness of the adhesive sheet after hot pressing to the thickness of the adhesive sheet before hot pressing is 80% or more and less than 90%. ×: The ratio of the thickness of the adhesive sheet after hot pressing to the thickness of the adhesive sheet before hot pressing is 90% or more and less than 100% (no change).

[對於光不會透射之構件之接合性的評價方法(剪切黏接力之評價方法)] 令將實施例及比較例得到的黏接片裁切成寬度10mm×長度10mm之大小者作為試驗樣本。將前述試驗樣本之其中一剝離襯裡去除,並於23℃之溫度環境下以0.05MPa之壓力加壓壓接於表面係平滑之寬度15mm×長度150mm×厚度0.05mm之鋁板10秒鐘使其貼合。[Evaluation method for adhesiveness of members that do not transmit light (evaluation method for shear adhesion)] What cut the adhesive sheet obtained in the Example and the comparative example into the size of 10 mm in width x 10 mm in length was used as a test sample. Remove one of the release liners of the aforementioned test samples, and press and bond it to an aluminum plate with a smooth surface of 15mm in width x 150mm in length x 0.05mm in thickness at a temperature of 23°C with a pressure of 0.05MPa for 10 seconds to make it stick combine.

將前述貼附物放置於23℃之溫度環境下60分鐘後,使用無電極燈(FUSION LAMP H-BULB)照射強度100mW/cm2 之紫外線10秒鐘。此時,實施前述紫外線照射而未去除剝離襯裡。After placing the aforementioned stickers in a temperature environment of 23°C for 60 minutes, use an electrodeless lamp (FUSION LAMP H-BULB) to irradiate ultraviolet light with an intensity of 100mW/cm 2 for 10 seconds. At this time, the aforementioned ultraviolet irradiation was performed without removing the release liner.

將前述紫外線照射後之貼附物放置於23℃之溫度環境下10分鐘後,去除剝離襯裡,使用已加熱至80℃之熱壓製裝置並於以0.5MPa進行加壓之狀態,加壓壓接於表面係平滑之寬度15mm×長度150mm×厚度1.0mm之環氧樹脂玻璃板(新神戶電機公司製/KEL-GEF)10分鐘。 以將前述加壓壓接後之疊層體於80℃條件下加熱放置1小時,並於23℃環境下放置30分鐘以上經冷卻而成者作為評價樣本。Place the above-mentioned sticker after ultraviolet irradiation in a temperature environment of 23°C for 10 minutes, remove the release liner, and use a hot pressing device that has been heated to 80°C to pressurize at 0.5MPa. The surface is smoothed on an epoxy resin glass plate (manufactured by Shin-Kobe Electric Co., Ltd./KEL-GEF) with a width of 15 mm x a length of 150 mm x a thickness of 1.0 mm for 10 minutes. The above-mentioned laminated body after pressure bonding was heated and placed at 80°C for 1 hour, and then placed at 23°C for more than 30 minutes and then cooled as an evaluation sample.

另外,本評價所使用的鋁板及環氧樹脂玻璃板係光不會透射之材料。In addition, the aluminum plate and epoxy glass plate used in this evaluation are materials that do not transmit light.

前述評價樣本中,分別夾持前述被黏接體(I)及前述被黏接體(II)之端部,使用拉伸試驗機沿180度方向以拉伸速度10mm/分鐘進行拉伸試驗,藉此求得前述試驗樣本之剪切黏接力(MPa)。In the aforementioned evaluation sample, the ends of the aforementioned adherend (I) and the aforementioned adherend (II) were respectively clamped, and a tensile test was performed at a tensile speed of 10 mm/min in a direction of 180 degrees using a tensile testing machine. From this, the shear adhesion (MPa) of the aforementioned test sample was obtained.

[低溫硬化性之評價方法(硬化前之凝膠分率之評價方法)] 將實施例及比較例得到的黏接片裁切成40mm×50mm之大小。然後,令僅將貼附於前述黏接片之厚度38μm的剝離襯裡予以去除而得者作為試驗樣本。[Evaluation method of low temperature curability (evaluation method of gel fraction before hardening)] The adhesive sheets obtained in Examples and Comparative Examples were cut into a size of 40 mm×50 mm. Then, what removed only the 38-micrometer-thick release liner attached to the said adhesive sheet was used as a test sample.

測定前述試驗樣本之質量後,浸漬於已調整為23℃之甲苯24小時。於前述浸漬後取出試驗樣本,測定使其於105℃之乾燥機內乾燥1小時而得者之質量。基於前述質量與如下之算式算出硬化前之黏接劑層之凝膠分率。After measuring the mass of the aforementioned test sample, it was immersed in toluene adjusted to 23°C for 24 hours. After the aforementioned immersion, the test sample was taken out, and the mass obtained by drying it in a dryer at 105° C. for 1 hour was measured. Calculate the gel fraction of the adhesive layer before hardening based on the aforementioned mass and the following formula.

硬化前之黏接劑層之凝膠分率(質量%)=[(未溶解於甲苯而殘存之黏接片的黏接劑層之質量)/(前述甲苯浸漬前之黏接片的黏接劑層之質量)]×100Gel fraction (mass %) of the adhesive layer before hardening = [(mass of the adhesive layer of the adhesive sheet that is not dissolved in toluene)/(adhesion of the aforementioned adhesive sheet before toluene immersion The mass of agent layer)]×100

前述浸漬前之黏接片的黏接劑層之質量係指由前述試驗樣本之質量扣除其製造所使用的剝離襯裡之質量而得的值。又,前述殘存的黏接劑層之質量係指由前述殘存物之乾燥後之質量扣除前述剝離襯裡之質量而得的值。The mass of the adhesive layer of the aforementioned adhesive sheet before dipping refers to the value obtained by subtracting the mass of the release liner used for its manufacture from the mass of the aforementioned test sample. Moreover, the mass of the said remaining adhesive layer means the value which subtracted the mass of the said release liner from the mass of the said residue after drying.

[低溫硬化性之評價方法(硬化後之凝膠分率之評價方法)] 將實施例及比較例得到的黏接片裁切成40mm×50mm之大小。然後,使用無電極燈(FUSION LAMP H-BULB)照射強度100mW/cm2 之紫外線10秒鐘。此時,係對厚度50μm之剝離襯裡側照射紫外線。令將前述紫外線照射後之貼附物於80℃條件下加熱放置1小時,於23℃環境下放置30分鐘以上予以冷卻後,僅將貼附於前述黏接片之厚度38μm的剝離襯裡予以去除而得者作為試驗樣本。[Evaluation method of low-temperature curability (evaluation method of gel fraction after curing)] The adhesive sheets obtained in Examples and Comparative Examples were cut into a size of 40 mm×50 mm. Then, ultraviolet rays with an intensity of 100 mW/cm 2 were irradiated for 10 seconds using an electrodeless lamp (FUSION LAMP H-BULB). At this time, ultraviolet rays were irradiated to the side of the release liner having a thickness of 50 μm. Let the above-mentioned sticker after ultraviolet irradiation be heated at 80°C for 1 hour, and then let it cool at 23°C for more than 30 minutes, and then remove only the peel-off liner with a thickness of 38 μm attached to the above-mentioned adhesive sheet. The winners were used as test samples.

測定前述試驗樣本之質量後,浸漬於已調整為23℃之甲苯24小時。於前述浸漬後取出試驗樣本,並使其於105℃之乾燥機內乾燥1小時,測定其質量。基於前述質量與如下之算式算出硬化後之黏接劑層之凝膠分率。After measuring the mass of the aforementioned test sample, it was immersed in toluene adjusted to 23°C for 24 hours. After the aforementioned immersion, the test sample was taken out, dried in a dryer at 105°C for 1 hour, and its mass was measured. Calculate the gel fraction of the hardened adhesive layer based on the aforementioned mass and the following formula.

硬化後之黏接劑層之凝膠分率(質量%)=[(未溶解於甲苯而殘存之黏接片的黏接劑層之質量)/(前述甲苯浸漬前之黏接片的黏接劑層之質量)]×100Gel fraction (mass %) of the hardened adhesive layer=[(mass of the adhesive layer of the adhesive sheet that is not dissolved in toluene)/(adhesion of the aforementioned adhesive sheet before toluene immersion The mass of agent layer)]×100

前述浸漬前之黏接片的黏接劑層之質量係指由前述試驗樣本之質量扣除其製造所使用的剝離襯裡之質量而得的值。又,前述殘存的黏接劑層之質量係指由前述殘存物之乾燥後之質量扣除前述剝離襯裡之質量而得的值。The mass of the adhesive layer of the aforementioned adhesive sheet before dipping refers to the value obtained by subtracting the mass of the release liner used for its manufacture from the mass of the aforementioned test sample. Moreover, the mass of the said remaining adhesive layer means the value which subtracted the mass of the said release liner from the mass of the said residue after drying.

[表1]

Figure 108109010-A0304-0001
[Table 1]
Figure 108109010-A0304-0001

[表2]

Figure 108109010-A0304-0002
[Table 2]
Figure 108109010-A0304-0002

(實施例6) 製作對寬度15mm×長度70mm×厚度0.3mm之表面平滑的鋁板進行脫脂處理,於鋁板頂面的端部,間隔12mm平行排列並黏接2支間隔件而成的設有間隔件之鋁,並使用其作為被黏接體(I)。另外,前述間隔件係由PET薄膜與黏接片構成,以PET薄膜與黏接片之總厚度成為80μm的方式製得。又,令寬度15mm×長度70mm×厚度1.0mm之環氧樹脂玻璃板(新神戶電機公司製/KEL-GEF)作為被黏接體(II)。另外,前述被黏接體(I)及前述被黏接體(II)係光不會透射之材料。(Example 6) Make the aluminum plate with a smooth surface of width 15mm×length 70mm×thickness 0.3mm, degrease the aluminum plate with a spacer, arrange it in parallel at an interval of 12mm at the end of the top surface of the aluminum plate, and glue two spacers. Aluminum with spacers, and Use it as the adherend (I). In addition, the said spacer was comprised from the PET film and the adhesive sheet, and it manufactured so that the total thickness of the PET film and the adhesive sheet might become 80 micrometers. Also, a glass epoxy plate (manufactured by Shin-Kobe Electric Co., Ltd./KEL-GEF) with a width of 15 mm×length 70 mm×thickness 1.0 mm was used as an adherend (II). In addition, the aforementioned adherend (I) and the aforementioned adherend (II) are materials that do not transmit light.

步驟[1-1]:令將前述黏接片(X-1)裁切成寬度10mm×長度10mm之大小者作為試驗樣本。去除前述試驗樣本之厚度38μm的剝離襯裡,以位於前述被黏接體(I)2支間隔件之間的方式,於23℃之溫度環境下,利用0.05MPa之壓力加壓壓接10秒鐘使其貼合。Step [1-1]: Cut the aforementioned adhesive sheet (X-1) into a size of 10 mm in width and 10 mm in length as a test sample. Remove the release liner with a thickness of 38 μm from the aforementioned test sample, and place it between the two spacers of the aforementioned adherend (I), pressurize and crimp with a pressure of 0.05 MPa for 10 seconds at a temperature of 23°C to make it fit.

步驟[2-1]:然後將前述貼附物於23℃之溫度環境下放置30分鐘。其後,對前述試驗樣本之另一側之面的表層,使用無電極燈(FUSION LAMP H-BULB)照射約100mW/cm2 強度之紫外線10秒鐘。Step [2-1]: Then place the above-mentioned stickers in a temperature environment of 23°C for 30 minutes. Thereafter, the surface layer on the other side of the aforementioned test sample was irradiated with ultraviolet light at an intensity of about 100 mW/cm 2 for 10 seconds using an electrodeless lamp (FUSION LAMP H-BULB).

步驟[3-1]:將前述紫外線照射後之貼附物於23℃之溫度環境下放置20分鐘後,去除前述試驗樣本之另一側之面的剝離襯裡,使用已加熱至80℃之熱壓製裝置於以0.2MPa進行加壓之狀態下壓製成形10分鐘。Step [3-1]: After placing the above-mentioned sticker after ultraviolet irradiation at a temperature of 23°C for 20 minutes, remove the peel-off liner on the other side of the test sample, and use heat heated to 80°C The pressing device pressurizes for 10 minutes under the state of pressurizing at 0.2 MPa.

步驟[4-1]:將前述加壓壓接後之疊層體於80℃條件下加熱放置1小時,並於23℃環境下放置30分鐘並冷卻,藉此獲得評價樣本(Y-1)。Step [4-1]: Heat the above-mentioned laminated body at 80°C for 1 hour, then let it stand at 23°C for 30 minutes and cool it down to obtain an evaluation sample (Y-1) .

前述黏接片(X-1)在照射紫外線前之凝膠分率為0.5%。The gel fraction of the aforementioned adhesive sheet (X-1) was 0.5% before being irradiated with ultraviolet rays.

另外,就凝膠分率之測定方法而言,係將黏接片裁切成40mm×50mm之大小後,僅去除單面之剝離襯裡來作為試驗片。測定前述試驗片之質量後,浸漬於已調整為23℃之甲苯24小時。 於前述浸漬後取出試驗片,測定使其於105℃之乾燥機內乾燥1小時而得者之質量。基於前述質量與如下之算式算出照射活性能量射線前之黏接劑層之凝膠分率。In addition, in terms of the measurement method of the gel fraction, the adhesive sheet is cut into a size of 40 mm x 50 mm, and only the release liner on one side is removed as a test piece. After measuring the mass of the test piece, it was immersed in toluene adjusted to 23° C. for 24 hours. After the aforementioned immersion, the test piece was taken out, and the mass obtained by drying it in a dryer at 105° C. for 1 hour was measured. The gel fraction of the adhesive layer before irradiating active energy rays was calculated based on the aforementioned mass and the following formula.

照射活性能量射線前之黏接劑層之凝膠分率(質量%)=[(未溶解於甲苯而殘存之黏接片的黏接劑層之質量)/(前述甲苯浸漬前之黏接片的黏接劑層之質量)]×100Gel fraction (mass %) of the adhesive layer before irradiating active energy rays = [(mass of the adhesive layer of the adhesive sheet that is not dissolved in toluene)/(the aforementioned adhesive sheet before toluene immersion The mass of the adhesive layer)]×100

前述浸漬前之黏接片的黏接劑層之質量係指由前述試驗片之質量扣除其製造所使用的剝離襯裡之質量而得的值。又,前述殘存的黏接劑層之質量係指由前述殘存物之乾燥後之質量扣除前述剝離襯裡之質量而得的值。The mass of the adhesive layer of the adhesive sheet before immersion refers to the value obtained by subtracting the mass of the release liner used for its manufacture from the mass of the aforementioned test piece. Moreover, the mass of the said remaining adhesive layer means the value which subtracted the mass of the said release liner from the mass of the said residue after drying.

於前述步驟[2-1]中,照射紫外線後之前述黏接片(X-1)之凝膠分率為8.5%。In the aforementioned step [2-1], the gel fraction of the aforementioned adhesive sheet (X-1) after irradiating ultraviolet rays was 8.5%.

於前述步驟[4-1]中,於前述23℃環境下放置30分鐘並冷卻後之前述黏接片(X-1)之凝膠分率為71.5%。In the aforementioned step [4-1], the gel fraction of the aforementioned adhesive sheet (X-1) after being placed in the aforementioned 23°C environment for 30 minutes and cooled was 71.5%.

以目視確認前述評價樣本(Y-1)之結果並未觀察到前述被黏接體(I)及被黏接體(II)有撓曲、凹陷的發生、及變色等變化。As a result of visually confirming the above-mentioned evaluation sample (Y-1), no changes such as bending, occurrence of dents, and discoloration of the above-mentioned adherends (I) and adherends (II) were observed.

(實施例7) 使用前述黏接片(X-2)替換前述黏接片(X-1),除此之外,以和實施例6同樣的方法實施步驟[1-2]、步驟[2-2]、步驟[3-2]、步驟[4-2],並獲得評價樣本(Y-2)。(Example 7) Use the aforementioned adhesive sheet (X-2) to replace the aforementioned adhesive sheet (X-1), except that, implement step [1-2], step [2-2], step [3-2], step [4-2], and obtain an evaluation sample (Y-2).

前述黏接片(X-2)在照射紫外線前之凝膠分率為0.2%。The gel fraction of the aforementioned adhesive sheet (X-2) was 0.2% before being irradiated with ultraviolet rays.

於前述步驟[2-2]中,照射紫外線後之前述黏接片(X-2)之凝膠分率為6.1%。In the aforementioned step [2-2], the gel fraction of the aforementioned adhesive sheet (X-2) after being irradiated with ultraviolet rays was 6.1%.

前述步驟[4-2]中,於前述23℃環境下放置30分鐘並冷卻後之前述黏接片(X-2)之凝膠分率為68.9%。In the aforementioned step [4-2], the gel fraction of the aforementioned adhesive sheet (X-2) after being placed in the aforementioned 23°C environment for 30 minutes and cooled was 68.9%.

以目視確認前述評價樣本(Y-2)之結果並未觀察到前述被黏接體(I)及被黏接體(II)有撓曲、凹陷的發生、及變色等變化。As a result of visually confirming the above-mentioned evaluation sample (Y-2), changes such as bending, occurrence of dents, and discoloration of the above-mentioned adherends (I) and adherends (II) were not observed.

(比較例4) 於前述步驟[2-1]中,照射約100mW/cm2 強度之紫外線1分鐘,除此之外,以和實施例6同樣的方法實施步驟[1-1’]、步驟[2-1’]、步驟[3-1’]、步驟[4-1’],並獲得評價樣本(Y’-1)。(Comparative Example 4) In the aforementioned step [2-1], irradiate ultraviolet rays with an intensity of about 100mW/cm 2 for 1 minute, except that, implement step [1-1'], step [2-1'], step [3-1'], step [4-1'], and obtain the evaluation sample (Y'-1).

於前述步驟[2-1’]中,照射紫外線後之前述黏接片(X-1)之凝膠分率為46.1%。In the aforementioned step [2-1'], the gel fraction of the aforementioned adhesive sheet (X-1) after ultraviolet irradiation was 46.1%.

於前述步驟[4-1’]中,於前述23℃環境下放置30分鐘並冷卻後之前述黏接片(X-1)之凝膠分率為77.8%。In the aforementioned step [4-1'], the gel fraction of the aforementioned adhesive sheet (X-1) after being placed in the aforementioned 23°C environment for 30 minutes and cooled was 77.8%.

以目視確認前述評價樣本(Y’-1)之結果觀察到前述被黏接體(I)中有部分撓曲、凹陷的發生。As a result of visually confirming the aforementioned evaluation sample (Y'-1), it was observed that partial deflection and dents occurred in the aforementioned adherend (I).

(比較例5) 於前述步驟[2-1]中,照射約90mW/cm2 強度之紫外線1秒鐘,除此之外,以和實施例6同樣的方法實施步驟[1-2’]、步驟[2-2’]、步驟[3-2’]、步驟[4-2’],並獲得評價樣本(Y’-2)。(Comparative Example 5) In the aforementioned step [2-1], irradiate ultraviolet rays with an intensity of about 90 mW/cm 2 for 1 second, except that, in the same manner as in Example 6, step [1-2'], Step [2-2'], step [3-2'], step [4-2'], and obtain an evaluation sample (Y'-2).

於前述步驟[2-2’]中,照射紫外線後之前述黏接片(X-1)之凝膠分率為0.3%。In the aforementioned step [2-2'], the gel fraction of the aforementioned adhesive sheet (X-1) after irradiating ultraviolet rays was 0.3%.

於前述步驟[4-2’]中,於前述23℃環境下放置30分鐘並冷卻後之前述黏接片(X-1)之凝膠分率為10.8%。In the aforementioned step [4-2'], the gel fraction of the aforementioned adhesive sheet (X-1) after being placed in the aforementioned 23°C environment for 30 minutes and cooled was 10.8%.

以目視確認前述評價樣本(Y’-2)之結果並未觀察到前述被黏接體(I)及被黏接體(II)有撓曲、凹陷的發生、及變色等變化。As a result of visually confirming the aforementioned evaluation sample (Y'-2), no changes such as flexure, occurrence of dents, and discoloration of the aforementioned adherend (I) and adherend (II) were observed.

(比較例6) 於前述步驟[2-1]中,照射約90mW/cm2 強度之紫外線1秒鐘,並於前述步驟[4-1]中,將前述加壓壓接後之疊層體的加熱放置從80℃變更為180℃,除此之外,以和實施例6同樣的方法實施步驟[1-3’]、步驟[2-3’]、步驟[3-3’]、步驟[4-3’],並獲得評價樣本(Y’-3)。(Comparative Example 6) In the aforementioned step [2-1], irradiate ultraviolet rays with an intensity of about 90 mW/cm 2 for 1 second, and in the aforementioned step [4-1], press-bond the aforementioned laminated body In addition to changing the heating and placing from 80°C to 180°C, steps [1-3'], steps [2-3'], steps [3-3'], steps [4-3'], and obtain the evaluation sample (Y'-3).

於前述步驟[2-3’]中,照射紫外線後之前述黏接片(X-1)之凝膠分率為0.3%。In the aforementioned step [2-3'], the gel fraction of the aforementioned adhesive sheet (X-1) after irradiating ultraviolet rays was 0.3%.

於前述步驟[4-3’]中,於前述23℃環境下放置30分鐘並冷卻後之前述黏接片(X-1)之凝膠分率為84.1%。In the aforementioned step [4-3'], the gel fraction of the aforementioned adhesive sheet (X-1) after being placed in the aforementioned 23°C environment for 30 minutes and cooled was 84.1%.

以目視確認前述評價樣本(Y’-2)之結果,前述被黏接體(II)劣化,且變色成黃色。As a result of visually confirming the aforementioned evaluation sample (Y'-2), the aforementioned adherend (II) deteriorated and discolored to yellow.

又,針對前述實施例及比較例得到的評價樣本實施如下之評價。Moreover, the following evaluation was implemented about the evaluation sample obtained by the said Example and the comparative example.

[厚度變化(柔軟性)之評價] 藉由測定前述實施例及比較例得到的評價樣本之總厚度,並自其扣除被黏接體(I)、被黏接體(II)之厚度,算出前述疊層後之黏接片的厚度,利用下述基準進行評價。[Evaluation of thickness change (softness)] By measuring the total thickness of the evaluation samples obtained in the aforementioned examples and comparative examples, and subtracting the thickness of the adherend (I) and the adherend (II) from it, the thickness of the aforementioned laminated adhesive sheet is calculated , and evaluated using the following criteria.

◎:前述疊層後之黏接片的厚度為80μm。 〇:前述疊層後之黏接片的厚度厚於80μm且為90μm以下。 △:前述疊層後之黏接片的厚度厚於90μm且為95μm以下。 ×:前述疊層後之黏接片的厚度厚於95μm且為100μm以下(無變化)。◎: The thickness of the adhesive sheet after the aforementioned lamination is 80 μm. 〇: The thickness of the adhesive sheet after the above-mentioned lamination is thicker than 80 μm and 90 μm or less. △: The thickness of the adhesive sheet after the above-mentioned lamination is thicker than 90 μm and 95 μm or less. ×: The thickness of the adhesive sheet after the above-mentioned lamination is thicker than 95 μm and 100 μm or less (no change).

[剪切黏接力(接合性)之評價] 藉由分別夾持前述實施例及比較例得到的評價樣本之被黏接體(I)及前述被黏接體(II)之端部,於23℃之溫度環境下,使用拉伸試驗機沿180度方向以拉伸速度10mm/分鐘進行拉伸試驗,求得前述評價樣本之剪切黏接力。[Evaluation of Shear Adhesion (Jointability)] By clamping the end of the adherend (I) and the aforementioned adherend (II) of the evaluation samples obtained in the above-mentioned examples and comparative examples, in a temperature environment of 23°C, use a tensile tester along the The tensile test was carried out at a tensile speed of 10mm/min in the direction of 180 degrees to obtain the shear adhesion of the aforementioned evaluation samples.

[表3]

Figure 108109010-A0304-0003
[table 3]
Figure 108109010-A0304-0003

Claims (18)

一種硬化性黏接劑組成物,係使用於將2個以上之具有活性能量射線不會透射的面之被黏接體予以接合之用途;其含有光硬化性樹脂(A)、熱塑性樹脂(B)及光聚合起始劑,且該光硬化性樹脂(A)至少具有選自於由環氧基、氧雜環丁烷基、羥基、乙烯基醚基、環硫醚基、伸乙亞胺基、
Figure 108109010-A0305-02-0064-1
唑啉基構成之群組中之1種以上之聚合性不飽和雙鍵以外之聚合性官能基,該熱塑性樹脂(B)至少具有選自於由異氰酸酯基、羥基及氧雜環丁烷基構成之群組中之1種以上之聚合性不飽和雙鍵以外之聚合性官能基,該光硬化性樹脂(A),係在相對於硬化性黏接劑組成物之總量為10質量%~50質量%之範圍內使用,其於40℃的損耗正切(tanδ40)未達1.5,且於60℃的損耗正切(tanδ60)為1.5以上。
A curable adhesive composition used for bonding two or more adherends with surfaces that do not transmit active energy rays; it contains a photocurable resin (A), a thermoplastic resin (B ) and a photopolymerization initiator, and the photocurable resin (A) has at least base,
Figure 108109010-A0305-02-0064-1
Polymerizable functional groups other than one or more polymerizable unsaturated double bonds in the group consisting of oxazoline groups, the thermoplastic resin (B) has at least one group consisting of isocyanate groups, hydroxyl groups and oxetanyl groups One or more polymerizable functional groups other than polymerizable unsaturated double bonds in the group, the photocurable resin (A) is 10% by mass to the total amount of the curable adhesive composition. When used within a range of 50% by mass, the loss tangent (tanδ 40 ) at 40°C is less than 1.5, and the loss tangent (tanδ 60 ) at 60°C is 1.5 or more.
如申請專利範圍第1項之硬化性黏接劑組成物,其中,該熱塑性樹脂(B)為胺甲酸酯系樹脂(B’)。 Such as the curable adhesive composition of claim 1, wherein the thermoplastic resin (B) is a urethane resin (B'). 如申請專利範圍第2項之硬化性黏接劑組成物,其中,該胺甲酸酯系樹脂(B’)包括使包含選自於由聚碳酸酯多元醇、聚酯多元醇及聚醚多元醇構成之群組中之1種以上之多元醇(b’1)與多異氰酸酯(b’2)反應而得的聚胺甲酸酯樹脂(BA’)。 Such as the curable adhesive composition of item 2 of the scope of the patent application, wherein the urethane resin (B') includes polycarbonate polyol, polyester polyol and polyether polyol Polyurethane resin (BA') obtained by reacting one or more polyols (b'1) and polyisocyanate (b'2) in the group consisting of alcohols. 如申請專利範圍第3項之硬化性黏接劑組成物,其中,該多元醇(b’1)包含聚碳酸酯多元醇及聚酯多元醇。 Such as the curable adhesive composition of claim 3, wherein the polyol (b'1) includes polycarbonate polyol and polyester polyol. 如申請專利範圍第4項之硬化性黏接劑組成物,其中,該聚碳酸酯多元醇之數目平均分子量為500~5000,該聚酯多元醇之數目平均分子量為1000~5000。 For example, the curable adhesive composition of claim 4, wherein the polycarbonate polyol has a number-average molecular weight of 500-5000, and the polyester polyol has a number-average molecular weight of 1000-5000. 如申請專利範圍第1至5項中任一項之硬化性黏接劑組成物,其中,該光聚合起始劑為光陽離子性聚合起始劑。 The curable adhesive composition according to any one of items 1 to 5 of the patent claims, wherein the photopolymerization initiator is a photocationic polymerization initiator. 如申請專利範圍第1至5項中任一項之硬化性黏接劑組成物,其熔點落在30℃~120℃之範圍內。 For example, the curable adhesive composition of any one of items 1 to 5 of the scope of the patent application has a melting point within the range of 30°C to 120°C. 一種黏接片,具有使用如申請專利範圍第1至7項中任一項之硬化性黏接劑組成物而形成的黏接劑層。 An adhesive sheet has an adhesive layer formed by using the curable adhesive composition according to any one of items 1 to 7 in the scope of the patent application. 一種疊層體,係將如申請專利範圍第8項之黏接片貼附於被黏接體而得。 A laminate obtained by attaching the adhesive sheet as described in item 8 of the patent application to the adherend. 如申請專利範圍第9項之疊層體,係使用於圖像顯示裝置。 For example, the laminated body of item 9 in the scope of the patent application is used in image display devices. 一種疊層體之製造方法,係介隔如申請專利範圍第8項之黏接片而將2個以上之具有活性能量射線不會透射的面之被黏接體予以疊層;其按順序包含: 利用感壓黏接將黏接片之黏接劑層與第1被黏接體予以貼合之步驟[1];在步驟[1]之前或之後對該黏接片之黏接劑層的另一側之表面照射活性能量射線,而使黏接劑層之硬化率提昇0.01~30%之步驟[2];將該黏接片壓潰之步驟[3];及在該黏接片被壓潰的狀態下,使該黏接劑層之硬化率從該步驟[2]之硬化率進一步硬化20%以上之步驟[4]。 A method for manufacturing a laminate, comprising laminating two or more adherends with surfaces that do not transmit active energy rays through an adhesive sheet such as item 8 of the scope of the patent application; it includes sequentially : Step [1] of bonding the adhesive layer of the adhesive sheet to the first adherend by pressure-sensitive bonding; another step of bonding the adhesive layer of the adhesive sheet before or after step [1] The step of irradiating the surface of one side with active energy rays to increase the hardening rate of the adhesive layer by 0.01~30% [2]; the step of crushing the adhesive sheet [3]; and pressing the adhesive sheet In the collapsed state, the step [4] of further hardening the curing rate of the adhesive layer by 20% or more from the curing rate of the step [2]. 如申請專利範圍第11項之疊層體之製造方法,其中,該步驟[1]中,予以貼合之壓力為0.1~3000KPa。 For example, the method for manufacturing a laminated body as claimed in claim 11 of the patent application, wherein, in the step [1], the pressure for bonding is 0.1~3000KPa. 如申請專利範圍第11或12項之疊層體之製造方法,其中,該步驟[2]中,活性能量射線強度為0.1~1000mW/cm2,且照射該活性能量射線0.1~60秒。 Such as the manufacturing method of the laminated body of claim 11 or 12, wherein, in the step [2], the active energy ray intensity is 0.1~1000mW/cm 2 , and the active energy ray is irradiated for 0.1~60 seconds. 如申請專利範圍第11或12項之疊層體之製造方法,其中,該步驟[3]中,係於30~100℃之溫度下,施加1~600KPa之壓力來將該黏接片壓潰。 Such as the manufacturing method of the laminated body of claim 11 or 12 of the patent scope, wherein, in the step [3], the adhesive sheet is crushed by applying a pressure of 1-600KPa at a temperature of 30-100°C . 如申請專利範圍第11或12項之疊層體之製造方法,其中,該步驟[4]中,係藉由在20~100℃之溫度下將該黏接片熟成10分鐘~7天而使其硬化。 Such as the manufacturing method of the laminated body of claim 11 or 12 of the patent scope, wherein, in the step [4], the adhesive sheet is matured at a temperature of 20-100°C for 10 minutes to 7 days. It hardens. 如申請專利範圍第11或12項之疊層體之製造方法,其中,該步驟[3]係在該步驟[2]結束後60分鐘以內實施。 The manufacturing method of the laminated body as claimed in claim 11 or 12, wherein the step [3] is implemented within 60 minutes after the end of the step [2]. 如申請專利範圍第11或12項之疊層體之製造方法,其中,該步驟[4]係在該步驟[2]結束後60分鐘以內實施。 The manufacturing method of the laminated body as claimed in claim 11 or 12 of the patent application, wherein the step [4] is implemented within 60 minutes after the end of the step [2]. 一種圖像顯示裝置,係使用如申請專利範圍第11至17項中任一項之製造方法製造而得。 An image display device is manufactured by using any one of the manufacturing methods in the 11th to 17th items of the patent application.
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