TWI787014B - Circuit board manufacturing system and circuit board manufacturing method - Google Patents

Circuit board manufacturing system and circuit board manufacturing method Download PDF

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TWI787014B
TWI787014B TW110148693A TW110148693A TWI787014B TW I787014 B TWI787014 B TW I787014B TW 110148693 A TW110148693 A TW 110148693A TW 110148693 A TW110148693 A TW 110148693A TW I787014 B TWI787014 B TW I787014B
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circuit board
information
processing
circuit
processing device
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TW202326502A (en
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林積泰
黃裕仁
林聖凱
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和碩聯合科技股份有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30—Computing systems specially adapted for manufacturing

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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

A circuit board manufacturing system and a circuit board manufacturing method are provided. Obtain bill of material information and circuit board design information based on work order information. Perform component positioning correction on the circuit board according to the bill of material information and the circuit board design information to generate corrected circuit board design information. Panelization information is generated according to the corrected circuit board design information and panelization parameter information. Process optimization information is generated according to the corrected circuit board design information, the panelization information and processing rule information. The processing optimization information is output to a circuit board processing device to control the circuit board processing device to execute a circuit board processing operation according to the processing optimization information.

Description

電路板加工系統及電路板加工方法Circuit board processing system and circuit board processing method

本發明是有關於一種加工裝置，且特別是有關於一種電路板加工系統及電路板加工方法。 The invention relates to a processing device, and in particular to a circuit board processing system and a circuit board processing method.

隨著知識的普及、資訊的快速傳播，業界彼此之間的競爭成為科技進步的最大動力。舉凡產業成本、產能多寡以及人力資源的運用等，都被業者用以作為彼此之間競爭的指標。因此，如何減少產業成本、增加產量並且有效的運用人力資源等問題，便成為業界在研發創新產品時需要積極研究的課題。 With the popularization of knowledge and the rapid dissemination of information, competition among industries has become the biggest driving force for technological progress. For example, industrial costs, production capacity, and the use of human resources are all used by industry players as indicators of competition among themselves. Therefore, how to reduce industrial costs, increase production, and effectively use human resources has become a topic that the industry needs to actively study when developing innovative products.

一般來說，目前的電子零件可透過表面黏著技術(Surface Mount Technology，SMT)而黏貼在電路板的表面上。然而，利用SMT製程技術來加工電路板的相關作業大多仍仰賴人工的方式來進行。這種以人工方式來進行生產的方式不但相當耗費工時，且易出現產品品質不穩定的情形。 Generally speaking, the current electronic components can be pasted on the surface of the circuit board through surface mount technology (Surface Mount Technology, SMT). However, most of the operations related to processing circuit boards using SMT process technology still rely on manual methods. This manual production method is not only time-consuming, but also prone to unstable product quality.

本發明提供一種電路板加工系統及電路板加工方法，可有效提高生產效率，並提高產品品質。 The invention provides a circuit board processing system and a circuit board processing method, which can effectively improve production efficiency and product quality.

本發明的電路板加工方法包括下列步驟。接收工單資訊。依據工單資訊取得物料清單資訊以及電路板設計資訊。依據物料清單資訊以及電路板設計資訊執行電路板的元件定位校正，以產生經校正電路板設計資訊。依據經校正電路板設計資訊以及拼板(panelization)參數資訊產生拼板資訊。依據經校正電路板設計資訊、拼板資訊以及加工規則資訊產生加工製程優化資訊。將加工製程優化資訊輸出至電路板加工裝置，以控制電路板加工裝置依據加工製程優化資訊執行電路板加工操作。 The circuit board processing method of the present invention includes the following steps. Receive work order information. Obtain BOM information and circuit board design information based on work order information. Perform component positioning calibration of the circuit board according to the BOM information and the circuit board design information to generate corrected circuit board design information. Panelization information is generated according to the corrected circuit board design information and panelization parameter information. Process optimization information is generated according to the corrected circuit board design information, panel information and processing rule information. The processing process optimization information is output to the circuit board processing device, so as to control the circuit board processing device to execute the circuit board processing operation according to the processing process optimization information.

在本發明的一實施例中，上述的電路板設計資訊包括電路板上的各個元件的位置資訊以及電路板的電路佈線資訊。 In an embodiment of the present invention, the above-mentioned circuit board design information includes position information of each component on the circuit board and circuit wiring information of the circuit board.

在本發明的一實施例中，上述執行電路板的元件定位校正的步驟包括校正電路板上各晶片的特定腳位的定位。 In an embodiment of the present invention, the above-mentioned step of correcting the positioning of components on the circuit board includes correcting the positioning of specific pins of each chip on the circuit board.

在本發明的一實施例中，上述的拼板參數資訊包括拼板模式、電路板加工裝置進行加工的載板的尺寸，載板中各子板的形狀與尺寸，載板中相鄰兩子板間的距離、載板的夾持邊寬度以及載板的定位孔位置至少之其一。 In an embodiment of the present invention, the above-mentioned imposition parameter information includes the imposition mode, the size of the carrier board processed by the circuit board processing device, the shape and size of each sub-board in the carrier board, and the At least one of the distance between the boards, the width of the clamping side of the carrier board and the position of the positioning hole of the carrier board.

在本發明的一實施例中，上述的加工規則資訊包括依據電路板上的各元件的大小決定元件安裝順序的規則、依據電路板上的各電路模組的安裝所需時間決定電路模組安裝順序的規則以及電路板加工裝置的預設加工規則至少之其一。 In an embodiment of the present invention, the above-mentioned processing rule information includes the rules for determining the order of component installation according to the size of each component on the circuit board, and the determination of the installation of the circuit modules according to the time required for the installation of each circuit module on the circuit board. At least one of the sequence rule and the preset processing rule of the circuit board processing device.

本發明還提供一種電路板加工系統包括電路板加工裝置以及處理器。處理器接收工單資訊，依據工單資訊取得物料清單資訊以及電路板設計資訊，依據物料清單資訊以及電路板設計資訊執行電路板的元件定位校正，以產生經校正電路板設計資訊，依據經校正電路板設計資訊以及拼板參數資訊產生拼板資訊，依據經校正電路板設計資訊、拼板資訊以及加工規則資訊產生加工製程優化資訊，並將加工製程優化資訊輸出至電路板加工裝置。電路板加工裝置依據加工製程優化資訊執行電路板加工操作。 The invention also provides a circuit board processing system including a circuit board processing device and a processor. The processor receives work order information, obtains bill of material information and circuit board design information according to the work order information, performs component positioning correction of the circuit board according to the bill of material information and circuit board design information, and generates corrected circuit board design information, according to the corrected circuit board design information Circuit board design information and panel parameter information generate panel information, and process optimization information is generated according to the corrected circuit board design information, panel information, and processing rule information, and the process optimization information is output to the circuit board processing device. The circuit board processing device executes the circuit board processing operation according to the optimization information of the processing process.

在本發明的一實施例中，上述的電路板設計資訊包括電路板上的各個元件的位置資訊以及電路板的電路佈線資訊。 In an embodiment of the present invention, the above-mentioned circuit board design information includes position information of each component on the circuit board and circuit wiring information of the circuit board.

在本發明的一實施例中，上述的電路板的元件定位校正包括電路板上各晶片的特定腳位的定位校正。 In an embodiment of the present invention, the component positioning correction of the above-mentioned circuit board includes positioning correction of specific pins of each chip on the circuit board.

在本發明的一實施例中，上述的拼板參數資訊包括拼板模式、電路板加工裝置進行加工的載板的尺寸，載板中各子板的形狀與尺寸，載板中相鄰兩子板間的距離、載板的夾持邊寬度以及載板的定位孔位置至少之其一。 In an embodiment of the present invention, the above-mentioned imposition parameter information includes the imposition mode, the size of the carrier board processed by the circuit board processing device, the shape and size of each sub-board in the carrier board, and the At least one of the distance between the boards, the width of the clamping side of the carrier board and the position of the positioning hole of the carrier board.

在本發明的一實施例中，上述的加工規則資訊包括依據電路板上的各元件的大小決定元件安裝順序的規則、依據電路板上的各電路模組的安裝所需時間決定電路模組安裝順序的規則以及電路板加工裝置的預設加工規則至少之其一。 In an embodiment of the present invention, the above-mentioned processing rule information includes the rules for determining the order of component installation according to the size of each component on the circuit board, and the determination of the installation of the circuit modules according to the time required for the installation of each circuit module on the circuit board. At least one of the sequence rule and the preset processing rule of the circuit board processing device.

基于上述，本發明的實施例可依據基於經校正電路板設計資訊、拼板資訊以及加工規則資訊產生的加工製程優化資訊來 進行電路板加工，而可對應不同工廠或不同產品自動地進行電路板加工的優化，避免習知技術以人工作業所可能造成的錯誤，有效提高生產效率以及產品良率，將產能最大化。 Based on the above, the embodiments of the present invention can be based on the process optimization information generated based on the corrected circuit board design information, panel information and processing rule information. Carry out circuit board processing, and can automatically optimize circuit board processing corresponding to different factories or different products, avoiding errors that may be caused by manual operations in conventional technologies, effectively improving production efficiency and product yield, and maximizing production capacity.

102:處理器 102: Processor

104:電路板加工裝置 104: Circuit board processing device

S202~S212:電路板加工方法的步驟 S202~S212: steps of circuit board processing method

圖1是依照本發明的實施例的一種電路板加工系統的示意圖。 FIG. 1 is a schematic diagram of a circuit board processing system according to an embodiment of the present invention.

圖2是依照本發明的實施例的一種電路板加工方法的流程圖。 Fig. 2 is a flowchart of a circuit board processing method according to an embodiment of the present invention.

圖1是依照本發明的實施例的一種電路板加工系統的示意圖，請參照圖1。電路板加工系統可包括處理器102以及電路板加工裝置104，電路板加工裝置104可例如為表面黏著技術(SMT)機台，然不以此為限。處理器102可自，例如網路伺服器(未繪示)接收工單資訊，並自動地依據工單資訊自資料庫(未繪示)取得工單資訊所對應的產品的物料清單資訊以及電路板設計資訊(例如電路板的元件佈局圖，其可包括例如電路板上的各個元件的位置資訊以及電路板的電路佈線資訊)。其中工單資訊可例如為副檔名為JOB的資料檔案，其可包括電路板的拼板參數資訊，然不以此為限。在部分實施例中，工單資訊也可例如為其他類型的檔案，而 不以JOB檔為限。此外，電路板的拼板參數資訊也可儲存於資料庫中，處理器102可依據工單資訊指示的產品資訊以及工廠資訊在資料庫中獲取對應的拼板參數資訊，又或者，拼板參數資訊也可依據使用者的輸入設定。 FIG. 1 is a schematic diagram of a circuit board processing system according to an embodiment of the present invention, please refer to FIG. 1 . The circuit board processing system may include a processor 102 and a circuit board processing device 104. The circuit board processing device 104 may be, for example, a surface mount technology (SMT) machine, but is not limited thereto. The processor 102 can receive work order information from, for example, a network server (not shown), and automatically obtain the BOM information and circuit of the product corresponding to the work order information from a database (not shown) according to the work order information Board design information (such as component layout diagram of the circuit board, which may include, for example, position information of each component on the circuit board and circuit wiring information of the circuit board). The work order information may be, for example, a data file with the extension name JOB, which may include information on the assembly parameters of the circuit board, but is not limited thereto. In some embodiments, the work order information can also be other types of files, and Not limited to JOB files. In addition, the jigsaw parameter information of the circuit board can also be stored in the database, and the processor 102 can obtain the corresponding jigsaw parameter information in the database according to the product information and factory information indicated by the work order information, or the jigsaw parameter Information can also be set based on user input.

處理器102可依據物料清單資訊以及電路板設計資訊執行電路板的元件定位校正，以產生完成元件位置與極性校正的經校正電路板設計資訊。舉例來說，處理器102可檢查電路板上各元件(例如晶片，然不以此為限)的特定腳位，以確定各元件的擺放方式正確，例如可通過校正元件的第一腳位的位置來校正元件的位置與極性，以確定元件的位置與極性正確，然不以此為限。處理器102並依據經校正電路板設計資訊以及拼板參數資訊產生拼板資訊，其中拼板參數資訊可例如包括拼板模式、電路板加工裝置104欲進行加工的載板的尺寸，載板中各子板的形狀與尺寸，載板中相鄰兩子板間的距離、載板的夾持邊寬度以及載板的定位孔位置至少之其一，然不以此為限。拼板資訊可包括依據拼板參數資訊的拼板原則進行拼板後的拼板結果。拼板模式可例如為正反面交替的陰陽板(different side mirror board)的拼板模式或相同面的陰陽板(Same side mirror board)的拼板模式，然不以此為限。 The processor 102 can perform component positioning correction on the circuit board according to the BOM information and the circuit board design information, so as to generate corrected circuit board design information that completes component position and polarity correction. For example, the processor 102 can check the specific pin position of each component (such as a chip, but not limited to this) on the circuit board to determine that the placement of each component is correct, for example, by correcting the first pin position of the component Correct the position and polarity of the component to ensure that the position and polarity of the component are correct, but not limited to this. The processor 102 generates imposition information according to the corrected circuit board design information and the imposition parameter information, wherein the imposition parameter information may include, for example, the imposition mode, the size of the substrate to be processed by the circuit board processing device 104, and the The shape and size of each sub-board, the distance between two adjacent sub-boards in the carrier board, the width of the clamping side of the carrier board, and the position of the positioning hole of the carrier board are at least one, but not limited thereto. The panelization information may include panelization results after panelization is performed according to panelization principles of panelization parameter information. The jigsaw pattern can be, for example, a jigsaw pattern of a different side mirror board with alternating front and back sides or a jigsaw pattern of a same side mirror board (Same side mirror board), but it is not limited thereto.

處理器102可依據經校正電路板設計資訊、拼板資訊以及加工規則資訊產生加工製程優化資訊，並將加工製程優化資訊輸出至電路板加工裝置104，以使電路板加工裝置104依據加工製 程優化資訊執行電路板加工操作。其中加工製程優化資訊可包括經優化過後的電路板加工的相關設定參數，加工製程優化資訊可例如為副檔名為JOB的資料檔案，然不以此為限。加工規則資訊可儲存於資料庫中，處理器102可依據工廠資訊在資料庫中獲取對應的加工規則資訊。加工規則資訊則可例如包括依據電路板上的各元件的大小決定元件安裝順序的規則、依據電路板上的各電路模組的安裝所需時間決定電路模組安裝順序的規則以及電路板加工裝置104的預設加工規則至少之其一。舉例來說，可依序由尺寸小的元件安裝至尺寸大的元件，此外對於特定的元件也可指定其安裝順序，也就是說可依據實際需求客製化電路板加工的規則。 The processor 102 can generate processing process optimization information according to the corrected circuit board design information, panel information, and processing rule information, and output the processing process optimization information to the circuit board processing device 104, so that the circuit board processing device 104 can process according to the processing system. Process optimization information to perform circuit board processing operations. The processing process optimization information may include relevant setting parameters of the optimized circuit board processing, and the processing process optimization information may be, for example, a data file with the extension name JOB, but it is not limited thereto. The processing rule information can be stored in a database, and the processor 102 can obtain corresponding processing rule information from the database according to factory information. The processing rule information may include, for example, the rules for determining the installation order of components based on the size of each component on the circuit board, the rules for determining the installation order of circuit modules based on the time required for the installation of each circuit module on the circuit board, and the circuit board processing device. 104 is at least one of the preset processing rules. For example, it is possible to install from small-sized components to large-sized components sequentially. In addition, the installation order of specific components can also be specified, that is to say, the rules of circuit board processing can be customized according to actual needs.

由於各工廠的環境條件不同，電路板加工裝置104的生產線配置、設備型號等皆有可能有所差異，因此各工廠的電路板加工裝置104在對相同設計的電路板進行加工時的步驟或原則也可能有所不同。例如，元件安裝順序、電路模組的安裝順序、安裝所需工時以及特定元件的安裝優先程度等，皆可能隨著各工廠的電路板加工裝置104的生產線配置不同而有所變化，此外產品不同也可能影響電路板加工時的步驟或原則。通過處理器102依據基於經校正電路板設計資訊、拼板資訊以及加工規則資訊產生的加工製程優化資訊來進行電路板加工，可對應不同工廠或不同產品自動地進行電路板加工的優化，避免習知技術以人工作業所可能造成的出錯，而可有效提高生產效率以及產品良率，將產能 最大化。 Due to the different environmental conditions of each factory, the production line configuration and equipment model of the circuit board processing device 104 may be different. Therefore, the steps or principles when the circuit board processing device 104 of each factory processes circuit boards of the same design It may also be different. For example, the order in which components are installed, the order in which circuit modules are installed, the man-hours required for installation, and the priority level of installation of specific components may vary with the configuration of the production line of the circuit board processing device 104 in each factory. In addition, the product The difference may also affect the steps or principles of circuit board processing. The processor 102 performs circuit board processing according to the processing process optimization information generated based on the corrected circuit board design information, panel information, and processing rule information, and can automatically optimize circuit board processing corresponding to different factories or different products, avoiding habit Known technology can effectively improve production efficiency and product yield by using the errors that may be caused by manual operations, and increase production capacity maximize.

在部分實施例中，處理器102還可比較不同的工單資訊所對應的物料清單資訊以及電路板設計資訊至少其中之一，並依據比較結果調整電路板加工裝置104進行電路板加工的排程，例如可使設計相似的電路板的加工排程相互對照，如此可減低備料以及產線配置調整的負擔，進一步提高生產效率。 In some embodiments, the processor 102 can also compare at least one of the BOM information and the circuit board design information corresponding to different work order information, and adjust the circuit board processing schedule of the circuit board processing device 104 according to the comparison result. , for example, the processing schedules of similarly designed circuit boards can be compared with each other, which can reduce the burden of material preparation and production line configuration adjustment, and further improve production efficiency.

圖2是依照本發明的實施例的一種電路板加工方法的流程圖。由上述實施例可知，電路板加工裝置的電路板加工方法可包括下列步驟。首先，接收工單資訊(步驟S202)，工單資訊可例如由工廠端的工程師上傳至網路伺服器後，再自網路伺服器上抓取，工單資訊可例如包括拼板參數資訊。接著，依據工單資訊取得對應的物料清單資訊以及電路板設計資訊(步驟S204)，例如可依據所指示的產品資訊與工廠資訊自資料庫取得對應的物料清單資訊以及電路板設計資訊以及加工規則資訊。然後，依據物料清單資訊以及電路板設計資訊執行電路板的元件定位校正，以產生經校正電路板設計資訊(步驟S206)，其中電路板設計資訊可包括電路板上的各個元件的位置資訊以及電路板的電路佈線資訊，校正電路板的元件定位校正的方式可例如為通過校正電路板上各晶片的特定腳位的定位，以校正各晶片的位置與極性。 Fig. 2 is a flowchart of a circuit board processing method according to an embodiment of the present invention. It can be known from the above embodiments that the circuit board processing method of the circuit board processing device may include the following steps. Firstly, work order information is received (step S202 ). The work order information can be uploaded to the web server by, for example, the engineer at the factory, and then retrieved from the web server. The work order information can, for example, include panel parameter information. Then, obtain the corresponding BOM information and circuit board design information according to the work order information (step S204), for example, obtain the corresponding BOM information, circuit board design information and processing rules from the database according to the indicated product information and factory information Information. Then, according to the BOM information and the circuit board design information, the component positioning correction of the circuit board is performed to generate the corrected circuit board design information (step S206), wherein the circuit board design information may include the position information of each component on the circuit board and the circuit The circuit wiring information of the board, and the method of correcting the component positioning of the circuit board can be, for example, correcting the position and polarity of each chip by correcting the positioning of specific pins of each chip on the circuit board.

之後，依據經校正電路板設計資訊以及拼板參數資訊產生拼板資訊(步驟S208)，其中拼板參數資訊可例如包括拼板模式、電路板加工裝置進行加工的載板的尺寸，載板中各子板的形 狀與尺寸，載板中相鄰兩子板間的距離、載板的夾持邊寬度以及載板的定位孔位置至少之其一，然不以此為限。然後，依據經校正電路板設計資訊、拼板資訊以及加工規則資訊產生加工製程優化資訊(步驟S210)，其中加工規則資訊可包括依據電路板上的各元件的大小決定元件安裝順序的規則、依據電路板上的各電路模組的安裝所需時間決定電路模組安裝順序的規則以及電路板加工裝置的預設加工規則至少之其一，然不以此為限。最後，將加工製程優化資訊輸出至電路板加工裝置，以控制電路板加工裝置依據加工製程優化資訊執行電路板加工操作(步驟S212)。 Afterwards, according to the corrected circuit board design information and the imposition parameter information, the imposition information is generated (step S208), wherein the imposition parameter information may for example include the imposition mode, the size of the carrier board processed by the circuit board processing device, the carrier board The shape of each daughter board The shape and size, the distance between two adjacent sub-boards in the carrier board, the width of the clamping side of the carrier board, and the position of the positioning hole of the carrier board are at least one of them, but it is not limited to this. Then, generate processing process optimization information according to the corrected circuit board design information, panel information, and processing rule information (step S210), wherein the processing rule information may include rules for determining the installation order of components based on the size of each component on the circuit board, according to The time required for the installation of each circuit module on the circuit board determines at least one of the rules for the installation order of the circuit modules and the preset processing rules of the circuit board processing device, but not limited thereto. Finally, the process optimization information is output to the circuit board processing device, so as to control the circuit board processing device to perform circuit board processing operations according to the process optimization information (step S212 ).

在部分實施例中，電路板加工方法還可包括比較不同的工單資訊所對應的物料清單資訊以及電路板設計資訊至少其中之一，並依據比較結果調整電路板加工裝置進行電路板加工的排程，例如可使設計相似的電路板的加工排程相鄰，如此可減低備料以及產線配置調整的負擔，進一步提高生產效率。 In some embodiments, the circuit board processing method may further include comparing at least one of the bill of material information and the circuit board design information corresponding to different work order information, and adjusting the arrangement of the circuit board processing device for circuit board processing according to the comparison result. For example, the processing scheduling of similarly designed circuit boards can be made adjacent to each other, which can reduce the burden of material preparation and production line configuration adjustment, and further improve production efficiency.

綜上所述，本發明的實施例可依據基於經校正電路板設計資訊、拼板資訊以及加工規則資訊產生的加工製程優化資訊來進行電路板加工，而可對應不同工廠或不同產品自動地進行電路板加工的優化，避免習知技術以人工作業所可能造成的錯誤，有效提高生產效率以及產品良率，將產能最大化。 To sum up, the embodiments of the present invention can perform circuit board processing based on the processing process optimization information generated based on the corrected circuit board design information, panel information, and processing rule information, and can automatically process corresponding to different factories or different products. The optimization of circuit board processing avoids errors that may be caused by manual operations in conventional technologies, effectively improves production efficiency and product yield, and maximizes production capacity.

S202~S212:電路板加工方法的步驟 S202~S212: steps of circuit board processing method

Claims (10)

一種電路板加工方法，包括：接收一工單資訊；依據該工單資訊取得一物料清單資訊、一電路板設計資訊以及一拼板參數資訊；依據該物料清單資訊以及該電路板設計資訊執行該電路板的元件定位校正，以產生一經校正電路板設計資訊；依據該經校正電路板設計資訊以及該拼板參數資訊產生一拼板資訊；依據該經校正電路板設計資訊、該拼板資訊以及一加工規則資訊產生一加工製程優化資訊；以及將該加工製程優化資訊輸出至一電路板加工裝置，以控制該電路板加工裝置依據該加工製程優化資訊執行電路板加工操作。 A circuit board processing method, comprising: receiving a work order information; obtaining a bill of materials information, a circuit board design information and a jigsaw parameter information according to the work order information; executing the process according to the material list information and the circuit board design information Correcting the component positioning of the circuit board to generate a corrected circuit board design information; generating a panel information according to the corrected circuit board design information and the panel parameter information; according to the corrected circuit board design information, the panel information and A processing rule information generates a processing process optimization information; and outputs the processing process optimization information to a circuit board processing device, so as to control the circuit board processing device to execute circuit board processing operations according to the processing process optimization information. 如請求項1所述的電路板加工方法，其中該電路板設計資訊包括該電路板上的各個元件的位置資訊以及該電路板的電路佈線資訊。 The circuit board processing method as described in Claim 1, wherein the circuit board design information includes position information of each component on the circuit board and circuit wiring information of the circuit board. 如請求項1所述的電路板加工方法，其中執行該電路板的元件定位校正的步驟包括校正該電路板上各晶片的一特定腳位的定位。 The circuit board processing method as claimed in claim 1, wherein the step of correcting the positioning of components on the circuit board includes correcting the positioning of a specific pin of each chip on the circuit board. 如請求項1所述的電路板加工方法，其中該拼板參數資訊包括拼板模式、該電路板加工裝置進行加工的載板的尺寸，該載板中各子板的形狀與尺寸，該載板中相鄰兩子板間的距離、 該載板的夾持邊寬度以及該載板的定位孔位置至少之其一。 The circuit board processing method as described in claim 1, wherein the jigsaw parameter information includes the jigsaw mode, the size of the carrier board processed by the circuit board processing device, the shape and size of each sub-board in the carrier board, the carrier board The distance between two adjacent sub-boards in the board, At least one of the width of the clamping side of the carrier board and the position of the positioning hole of the carrier board. 如請求項1所述的電路板加工方法，其中該加工規則資訊包括依據該電路板上的各元件的大小決定元件安裝順序的規則、依據該電路板上的各電路模組的安裝所需時間決定電路模組安裝順序的規則以及該電路板加工裝置的預設加工規則至少之其一。 The circuit board processing method as described in claim 1, wherein the processing rule information includes the rules for determining the order of component installation based on the size of each component on the circuit board, and the time required for the installation of each circuit module on the circuit board At least one of the rules for determining the installation order of the circuit modules and the preset processing rules of the circuit board processing device. 一種電路板加工系統，包括：一電路板加工裝置；以及一處理器，接收一工單資訊，依據該工單資訊取得一物料清單資訊、一電路板設計資訊以及一拼板參數資訊，依據該物料清單資訊以及該電路板設計資訊執行該電路板的元件定位校正，以產生一經校正電路板設計資訊，依據該經校正電路板設計資訊以及該拼板參數資訊產生一拼板資訊，依據該經校正電路板設計資訊、該拼板資訊以及一加工規則資訊產生一加工製程優化資訊，將該加工製程優化資訊輸出至該電路板加工裝置，該電路板加工裝置依據該加工製程優化資訊執行電路板加工操作。 A circuit board processing system, comprising: a circuit board processing device; and a processor, receiving a work order information, obtaining a bill of materials information, a circuit board design information and a panel parameter information according to the work order information, according to the work order information The bill of material information and the circuit board design information execute the component positioning correction of the circuit board to generate a corrected circuit board design information, and generate a panel information according to the corrected circuit board design information and the panel parameter information, according to the experience Calibrate the circuit board design information, the panel information and a processing rule information to generate a processing process optimization information, output the processing process optimization information to the circuit board processing device, and the circuit board processing device executes the circuit board according to the processing process optimization information processing operations. 如請求項6所述的電路板加工系統，其中該電路板設計資訊包括該電路板上的各個元件的位置資訊以及該電路板的電路佈線資訊。 The circuit board processing system as described in claim 6, wherein the circuit board design information includes position information of each component on the circuit board and circuit wiring information of the circuit board. 如請求項6所述的電路板加工系統，其中該電路板的元件定位校正包括，該電路板上各晶片的一特定腳位的定位校正。 The circuit board processing system as claimed in claim 6, wherein the component positioning correction of the circuit board includes positioning correction of a specific pin position of each chip on the circuit board. 如請求項6所述的電路板加工系統，其中該拼板參數 資訊包括拼板模式、該電路板加工裝置進行加工的載板的尺寸，該載板中各子板的形狀與尺寸，該載板中相鄰兩子板間的距離、該載板的夾持邊寬度以及該載板的定位孔位置至少之其一。 The circuit board processing system as described in claim item 6, wherein the jigsaw parameters The information includes the jigsaw mode, the size of the carrier board processed by the circuit board processing device, the shape and size of each sub-board in the carrier board, the distance between two adjacent sub-boards in the carrier board, and the clamping position of the carrier board. At least one of side width and positioning hole position of the carrier board. 如請求項6所述的電路板加工系統，其中該加工規則資訊包括依據該電路板上的各元件的大小決定元件安裝順序的規則、依據該電路板上的各電路模組的安裝所需時間決定電路模組安裝順序的規則以及該電路板加工裝置的預設加工規則至少之其一。The circuit board processing system as described in claim 6, wherein the processing rule information includes the rules for determining the order of component installation according to the size of each component on the circuit board, and the time required for the installation of each circuit module on the circuit board At least one of the rules for determining the installation order of the circuit modules and the preset processing rules of the circuit board processing device.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201227375A (en) * 2010-12-23 2012-07-01 Advantech Co Ltd Design guidance system and method for circuit board layout rule
TW202018851A (en) * 2018-10-23 2020-05-16 以色列商奧寶科技有限公司 Adaptive routing for correcting die placement errors
TW202109340A (en) * 2019-07-12 2021-03-01 美商矽睿科技股份有限公司 Methods, systems and computer-readable non-transitory storage medias for printed circuit board design based on automatic corrections

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201227375A (en) * 2010-12-23 2012-07-01 Advantech Co Ltd Design guidance system and method for circuit board layout rule
TW202018851A (en) * 2018-10-23 2020-05-16 以色列商奧寶科技有限公司 Adaptive routing for correcting die placement errors
TW202109340A (en) * 2019-07-12 2021-03-01 美商矽睿科技股份有限公司 Methods, systems and computer-readable non-transitory storage medias for printed circuit board design based on automatic corrections

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