TWI786544B - Support jig, support jig set, and cleaning method for tank - Google Patents
Support jig, support jig set, and cleaning method for tank Download PDFInfo
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Abstract
Description
本發明係有關一種治具(jig),尤指一種可用於清洗桶槽之支撐治具及清洗方法。 The present invention relates to a jig, in particular to a support jig and cleaning method that can be used to clean a tank.
一般半導體製程中,常需使用大量化學藥液,故化學藥液之純度極為重要,以避免雜質殘留於半導體裝置上。 In the general semiconductor manufacturing process, a large amount of chemical liquid is often used, so the purity of the chemical liquid is extremely important to avoid impurities remaining on the semiconductor device.
從以往以來,化學藥液係於化學廠房內生產後,注入於桶槽中再運送至半導體廠,或注入設置於半導體廠內的桶槽中,以在半導體廠中進行半導體製程之相關作業。因此,於將化學藥液注入桶槽之前,需先清洗該桶槽,以確保該桶槽之內部不會殘留雜質。藉此,令化學藥液不會混入雜質,以保持化學藥液之純度。 In the past, the chemical solution was produced in the chemical factory, injected into the tank and then transported to the semiconductor factory, or injected into the tank installed in the semiconductor factory, so as to carry out the related operations of the semiconductor process in the semiconductor factory. Therefore, before injecting the chemical liquid into the tank, the tank needs to be cleaned to ensure that no impurities remain inside the tank. In this way, the chemical liquid will not be mixed with impurities to maintain the purity of the chemical liquid.
然而,習知清洗桶槽之方式,如圖1A所示,係先立好桶槽物件9’,使其保持直立狀,再以噴霧方式(如圖1A所示之霧狀噴液8’)進行該桶槽物件9’內部之清洗。惟此桶槽清洗方式不僅無法均勻洗淨該桶槽物件9’內部,且噴霧之力道極弱而難以清除該桶槽物件9’內壁面上之污垢。因此,於將化學藥液注入該桶槽物件9’後,會有該桶槽物件9’之內部所殘留之雜質混入化學藥液中之情形,此時會導致化學藥液之純度變差。 However, the conventional way of cleaning the tank, as shown in Figure 1A, is to set up the tank object 9' first, keep it upright, and then use the spray method (the mist spray liquid 8' as shown in Figure 1A) Carry out cleaning of the inside of the tank object 9'. But this tank cleaning method can not evenly clean the tank object 9 ' inside, and the power of the spray is extremely weak and difficult to remove the dirt on the tank object 9 ' inner wall surface. Therefore, after the chemical liquid is injected into the tank object 9', the impurities remaining in the tank object 9' may be mixed into the chemical liquid, which will cause the purity of the chemical liquid to deteriorate.
另一方面,在業界中亦有採用將桶槽物件9’浸漬於清洗液以清洗該桶槽物件9’之方式。例如,如圖1B所示,係於站立好之桶槽物件9’內注入清洗液8”至幾乎最大容量(超過九成滿),待長時間浸漬以溶解而去除該桶槽物件9’內之雜質後,再移除該清洗液8”。
On the other hand, in the industry, there is also a method of immersing the tank object 9' in a cleaning solution to clean the tank object 9'. For example, as shown in Figure 1B, the
然而,習知之浸漬清洗液之方式中,需將清洗液8”裝填至幾乎最大容量之狀態,因而需耗費大量清洗液8”之使用量,且需長時間浸漬,故大幅增加清洗作業之費用成本及增長清洗時間,因而使清洗作業之經濟效益下降。
However, in the conventional method of immersing the cleaning solution, it is necessary to fill the
再者,習知之浸漬清洗液之方式中,基於安全考量,清洗液8”不會注入至該桶槽物件9’內部之頂端空間為止,因而無法洗淨該桶槽物件9’內部之頂端空間。因此,於將化學藥液注入該桶槽物件9’之後,殘留於該桶槽物件9’內部之頂端空間之雜質會混入化學藥液中,導致化學藥液之純度變差,進而影響該半導體之製造之良率。
Furthermore, in the known method of immersing the cleaning solution, based on safety considerations, the
因此,如何克服上述習知技術的種種問題,實已成目前亟欲解決的課題。 Therefore, how to overcome the various problems of the above-mentioned conventional technologies has become an urgent problem to be solved at present.
鑑於上述習知技術之種種缺失,本發明係提供一種支撐治具,係用以支撐一筒狀之桶槽物件,該支撐治具係包括:彎曲狀主體,係具有相對之第一端與第二端,以令該第一端與該第二端之間形成一間隔;以及連接件,係以可調整該間隔之寬度的方式連接該彎曲狀主體之第一端與第二端而配置於該間隔上,其中,該彎曲狀主體係沿著該桶槽物件之周方向緊密接觸於該桶槽物件之外 周面之至少一部分,該彎曲狀主體與該連接件係形成一環狀結構,藉此,供該桶槽物件橫置於該環狀結構中。 In view of the various deficiencies of the above-mentioned prior art, the present invention provides a support jig for supporting a cylindrical tank object. The support jig includes: a curved main body having a first end opposite to a second end two ends, so that a space is formed between the first end and the second end; On the interval, wherein, the curved main system is in close contact with the outside of the tub object along the circumferential direction of the tub object At least a part of the peripheral surface, the curved main body and the connecting piece form a ring structure, whereby the bucket object is placed horizontally in the ring structure.
前述之支撐治具中,該彎曲狀主體係包含複數個相連接之支撐部。例如,該複數個支撐部係以可拆裝方式相連接。 In the aforementioned supporting jig, the curved main system includes a plurality of connected supporting parts. For example, the plurality of supporting parts are connected in a detachable manner.
於支撐治具中,該支撐部可為桿體或片體。另外,該支撐部可呈弧形。 In the supporting jig, the supporting part can be a rod or a sheet. In addition, the support portion may be arc-shaped.
前述之支撐治具中,該連接件可呈馬蹄形。 In the aforementioned support jig, the connecting piece may be in the shape of a horseshoe.
前述之支撐治具中,該連接件可藉由螺紋構件連接該彎曲狀主體之第一端與第二端。 In the aforementioned support fixture, the connector can be connected to the first end and the second end of the curved main body by a threaded member.
前述之支撐治具中,可更包括用以置放該彎曲狀主體之基座。例如,該基座可與該彎曲狀主體之外周面朝周方向可滑動地接觸,以便在將該桶槽物件橫置於該環狀結構中時,容許該桶槽物件進行旋轉。 The aforementioned support fixture may further include a base for placing the curved main body. For example, the base may be in slidable contact with the outer peripheral surface of the curved body in a circumferential direction, so as to allow the tub object to rotate when the tub object is placed horizontally in the ring structure.
本發明更提供一種支撐治具組,係包括複數個前述之支撐治具,該等複數個支撐治具係用以分別設置在該桶槽物件之軸方向上的不同位置。 The present invention further provides a set of supporting jigs, which includes a plurality of the above-mentioned supporting jigs, and the plurality of supporting jigs are respectively arranged at different positions in the axial direction of the bucket object.
本發明亦提供一種清洗方法,係包括:提供支撐治具之步驟,該支撐治具係包括:彎曲狀主體,係具有相對之第一端與第二端,以令該第一端與該第二端之間形成一間隔;以及連接件,係以可調整該間隔之寬度的方式連接該彎曲狀主體之第一端與第二端而配置於該間隔上,其中,該支撐治具係構成為,使該彎曲狀主體沿著桶槽物件之周方向緊密接觸於該桶槽物件之外周面之至少一部分,並由該彎曲狀主體與該連接件形成環狀結構,藉此,將該桶槽物件橫置於該環狀結構中;將該支撐治具設置於一筒狀之桶槽物件上,使該支撐治具之該環狀結構沿著該桶槽物件之周方向緊密接觸於該桶槽物件之外周面之至少一部 分,而將該桶槽物件橫置於該環狀結構中;將清洗液注入該桶槽物件中之步驟;以及令設置有該支撐治具並注入有該清洗液的該桶槽物件繞著該環狀結構之軸線進行旋轉,藉此,使該清洗液清洗該桶槽物件之內部之步驟。 The present invention also provides a cleaning method, which includes: the step of providing a supporting jig, and the supporting jig includes: a curved main body with a first end and a second end opposite to each other, so that the first end and the second end A space is formed between the two ends; and a connecting piece is configured to connect the first end and the second end of the curved main body to the space in such a way that the width of the space can be adjusted, wherein the support jig constitutes In order to make the curved main body closely contact at least a part of the outer peripheral surface of the tub object along the circumferential direction of the tub object, and form a ring structure by the curved main body and the connecting piece, whereby the barrel The tank object is placed horizontally in the ring structure; the supporting jig is set on a cylindrical tank object, so that the ring structure of the support jig is in close contact with the tank object along the circumferential direction. At least a part of the outer peripheral surface of the barrel object divide, and place the tank object horizontally in the annular structure; inject the cleaning liquid into the tank object; and make the tank object provided with the supporting jig and injected with the cleaning liquid go around The axis of the annular structure is rotated, whereby the cleaning liquid is used to clean the interior of the tank object.
前述之清洗方法中,在該清洗步驟中,該桶槽物件可進行往復轉動。例如,可將該連接件作為旋轉止擋處,以令該桶槽物件以該旋轉止擋為基準而進行往復轉動。 In the aforementioned cleaning method, in the cleaning step, the tub object can be reciprocated. For example, the connecting piece can be used as a rotation stop, so that the tub object can reciprocate based on the rotation stop.
前述之清洗方法中,可包括將設置於該桶槽物件的該支撐治具的該彎曲狀主體置放於基座上之步驟,其中,該基座係與該彎曲狀主體之外周面朝周方向可滑動地接觸,以容許該桶槽物件進行旋轉。 In the aforementioned cleaning method, it may include the step of placing the curved main body of the supporting jig set on the tank object on a base, wherein the base is facing the outer peripheral surface of the curved main body Orientation slidably contacts to allow the tub object to rotate.
前述之清洗方法中,能夠以人力作動該桶槽物件,使該桶槽物件相對該基座旋轉。另外,亦可由該基座提供旋轉該桶槽物件之作用力。 In the aforementioned cleaning method, the tub object can be actuated by manpower to make the tub object rotate relative to the base. In addition, the force for rotating the tub object can also be provided by the base.
由上可知,本發明之清洗方法中,主要藉由橫置該桶槽物件及旋轉該桶槽物件之配合,使該清洗液可翻攪去除該桶槽物件內部之雜質。因此,相較於習知噴霧清洗方式,本發明之清洗方法之可均勻洗淨該桶槽物件內部之所有區域。此外,該桶槽物件之旋轉力道極強,因此桶槽內之該清洗液會被劇烈地翻攪,而能輕易清除該桶槽物件內壁面上之污垢。如此,於該桶槽物件注入半導體製程所需之化學藥液後,該桶槽物件內之化學藥液中因無雜質混入而純度極佳,進而能確保該半導體製程之良率。 It can be seen from the above that in the cleaning method of the present invention, the cleaning liquid can be stirred to remove the impurities inside the tank object mainly through the coordination of horizontally placing the tank object and rotating the tank object. Therefore, compared with the conventional spray cleaning method, the cleaning method of the present invention can uniformly clean all areas inside the tank object. In addition, the rotating force of the tank object is extremely strong, so the cleaning liquid in the tank will be violently stirred, and the dirt on the inner wall surface of the tank object can be easily removed. In this way, after the tank object is injected with the chemical liquid required for the semiconductor process, the chemical liquid in the tank object has excellent purity because no impurities are mixed in, thereby ensuring the yield rate of the semiconductor process.
再者,本發明之清洗方法藉由橫置該桶槽物件及旋轉該桶槽物件之配合,使該桶槽物件只需注入最大容量之一半之清洗液,即可進行清洗作業,因而能大幅減少該清洗液之使用量,且無需進行長時間浸漬之步驟,故相較於習 知之浸漬清洗方式,本發明之清洗方法能大幅降低清洗作業之費用成本及縮短清洗時間,因而能提高清洗作業之經濟效益。 Furthermore, the cleaning method of the present invention cooperates with placing the tank object horizontally and rotating the tank object, so that the tank object only needs to inject half of the cleaning liquid of the maximum capacity to carry out the cleaning operation, thus greatly Reduce the amount of cleaning solution used, and do not need to perform a long-term soaking step, so compared with the conventional Known as the immersion cleaning method, the cleaning method of the present invention can greatly reduce the cost of cleaning operations and shorten the cleaning time, thereby improving the economic benefits of cleaning operations.
又,本發明之清洗方法藉由橫置該桶槽物件及旋轉該桶槽物件之配合,使該桶槽物件只需注入最大容量之一半之清洗液,即可進行清洗作業,因而不僅能達成清洗作業之安全性,且能洗淨該桶槽物件內部之所有區域。因此,相較於習知之浸漬清洗方式,本發明之清洗方法於進行清洗作業後,該桶槽物件內部之所有區域不會殘留雜質,於該桶槽物件注入半導體製程所需之化學藥液後,該桶槽物件內之化學藥液中因無雜質混入而純度極佳,進而能確保該半導體製程之良率。 In addition, the cleaning method of the present invention cooperates with placing the tank object horizontally and rotating the tank object, so that the tank object only needs to inject half of the cleaning liquid of the maximum capacity to carry out the cleaning operation, so it can not only achieve The safety of the cleaning operation, and it can clean all the areas inside the tank. Therefore, compared with the conventional immersion cleaning method, the cleaning method of the present invention does not leave impurities in all areas inside the tank object after the cleaning operation, and after the tank object is injected with the chemical liquid required for the semiconductor process , the chemical solution in the tank object has excellent purity because no impurities are mixed in, thereby ensuring the yield rate of the semiconductor manufacturing process.
另外,本發明之支撐治具係設計成環狀結構,而使注入有清洗液之桶槽物件之外周面所承受之應力有效地被分散,故該支撐治具能穩固地支撐該裝載有清洗液之桶槽物件,使該桶槽物件不會變形。 In addition, the supporting jig of the present invention is designed as a ring structure, so that the stress on the outer peripheral surface of the tank object injected with cleaning liquid is effectively dispersed, so the supporting jig can firmly support the cleaning liquid loaded with it. Liquid bucket object, so that the bucket object will not be deformed.
1:支撐治具 1: support jig
1a:環狀結構 1a: ring structure
2:支撐治具組 2: Support fixture group
8,8”:清洗液 8,8": cleaning fluid
8’:霧狀噴液 8': mist spray
9:桶槽物件 9: Barrel object
9’:桶槽物件 9': bucket object
10:彎曲狀主體 10: curved body
10a:第一端 10a: first end
10b:第二端 10b: second end
11:連接件 11:Connector
12:固定件 12:Fixer
20:基座 20: base
20a:座體 20a: seat body
20b:作用構件 20b: Action component
20c:調整件 20c: Adjustment parts
21,21’:螺紋構件 21,21': threaded member
22:支架 22: Bracket
90:槽體 90: tank body
91:腳座 91: foot seat
92:輸送埠 92: Delivery port
100,100’:板座 100,100': board seat
100a,100b,110b:穿孔 100a, 100b, 110b: perforation
101:第一支撐部 101: The first support part
102:第二支撐部 102: the second support part
103:第三支撐部 103: The third supporting part
110a,110a’:開口 110a, 110a': opening
111:架體 111: frame body
112,113:腳座 112,113: feet
200:滾輪 200: Roller
201:支撐架 201: support frame
202:階梯結構 202: Ladder structure
202a,202b,202c:台階 202a, 202b, 202c: steps
920:輸送管 920: delivery pipe
α:中心角度 α: Center angle
β:對稱角度 β: Symmetry angle
A:軌道區 A: Track area
B:固定區 B: fixed area
C1:外周面 C1: Perimeter
C2:內周面 C2: inner peripheral surface
d:間距 d: spacing
F:旋轉方向 F: direction of rotation
G:間隔 G: Interval
H:高度 H: height
L:軸線 L: axis
O:圓心 O: center of circle
R:直徑 R: Diameter
S:外周面 S: Peripheral surface
t:寬度 t: width
W:周方向 W: week direction
X,Y,Z:箭頭方向 X, Y, Z: Arrow direction
圖1A係為顯示習知清洗桶槽之方式之示意圖。 FIG. 1A is a schematic diagram showing a conventional method for cleaning a tub.
圖1B係為顯示習知清洗桶槽之另一方式之示意圖。 Fig. 1B is a schematic diagram showing another way of cleaning the tank in the prior art.
圖2係為本發明之支撐治具之立體分解示意圖。 Fig. 2 is a three-dimensional exploded schematic view of the supporting jig of the present invention.
圖3係為本發明之支撐治具之平面示意圖。 Fig. 3 is a schematic plan view of the supporting jig of the present invention.
圖4係為圖3之局部放大示意圖。 FIG. 4 is a partially enlarged schematic diagram of FIG. 3 .
圖5係為本發明之支撐治具之連接件之平面示意圖。 Fig. 5 is a schematic plan view of the connector of the supporting jig of the present invention.
圖6係為顯示本發明之支撐治具組承載桶槽物件之立體示意圖。 Fig. 6 is a schematic perspective view showing that the supporting jig set of the present invention carries the tank object.
圖7係為顯示本發明之支撐治具組承載桶槽物件之左視示意圖。 Fig. 7 is a schematic diagram showing the left side view of the supporting jig set carrying the tank object of the present invention.
圖8係為圖7之局部放大示意圖。 FIG. 8 is a partially enlarged schematic diagram of FIG. 7 .
圖9係為顯示本發明之支撐治具組承載桶槽物件之前視示意圖。 Fig. 9 is a schematic diagram showing the front view of the supporting jig set of the present invention for carrying bucket objects.
圖10係為顯示本發明之桶槽物件的內部之示意圖。 Fig. 10 is a schematic view showing the interior of the tub object of the present invention.
以下藉由具體實施例說明本發明之實施方式。 The implementation of the present invention will be described below by means of specific examples.
須知,本說明書所附圖式所繪示之結構、比例、大小等,均僅用以配合說明書所揭示之內容,以供該發明所屬技術領域中具有通常知識者之瞭解與閱讀,並非用以限定本發明可實施之限定條件。因此,其不具技術上之實質意義,任何結構之修飾、比例關係之改變或大小之調整,在不影響本發明所能產生之功效及所能達成之目的下,均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時,本說明書中所引用之如「上」、「第一」、「第二」、「第三」等用語,亦僅為便於敘述之明瞭,而非用以限定本發明可實施之範圍,其相對關係之改變或調整,在無實質變更技術內容下,當亦視為本發明可實施之範疇。 It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for the understanding and reading of those with ordinary knowledge in the technical field of the invention, and are not used to Limiting conditions on which the present invention can be implemented. Therefore, it has no technical substantive meaning, and any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of the present invention without affecting the effect and purpose of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "above", "first", "second" and "third" quoted in this specification are only for the convenience of description and are not used to limit the scope of the present invention. The change or adjustment of the relative relationship shall also be regarded as the applicable scope of the present invention if there is no substantial change in the technical content.
圖2至圖5係為顯示本發明之支撐治具的圖面。如圖2所示,所述之支撐治具1係包括:一彎曲狀主體10以及一連接件11。
2 to 5 are diagrams showing the supporting jig of the present invention. As shown in FIG. 2 , the
於本實施例中,該支撐治具1係用以支撐一筒狀之桶槽物件9(如圖6所示)。例如,該桶槽物件9係為化學藥品儲存用桶槽,如圖10所示,其具有一外觀大致呈圓筒狀之槽體90與一用以支撐該槽體90之腳座91。該桶槽物件9之
規格係採用槽體90的直徑R為3400mm及總高度H為5346mm之金屬容器結構,且其總重量約5噸。在此應注意者為,桶槽物件9之種類繁多,並不限於上述之規格。
In this embodiment, the
所述之彎曲狀主體10係具有相對之第一端10a與第二端10b,以令該第一端10a與該第二端10b之間形成一間隔G。
The curved
於本實施例中,該彎曲狀主體10係包含第一支撐部101、第二支撐部102與第三支撐部103,且該等支撐部係相連接。例如,該第一支撐部101、第二支撐部102與第三支撐部103係以可拆裝方式相連接。
In this embodiment, the
於其中一可拆裝方式中,如圖2所示,該第一支撐部101、第二支撐部102與第三支撐部103之端側係配置有至少一個具有複數個穿孔100a之板座100,令相鄰之兩支撐部之板座100的位置相互對齊疊合,再以螺絲(省略其圖式)穿過互相疊合之板座100之該穿孔100a,並以螺帽(省略其圖式)固定該螺絲之端側,從而藉由該螺絲與該螺帽來連接並固定相疊合的板座100彼此,以固定鄰接之兩支撐部。較佳者為,該穿孔100a為螺孔。具體而言,該第一支撐部101之相對兩端係分別以螺接方式連接於該第二支撐部102與該第三支撐部103。
In one of the detachable ways, as shown in Figure 2, at least one
再者,該彎曲狀主體10係沿著該桶槽物件9之周方向W(如圖6所示)緊密接觸於該桶槽物件9之外周面S(如圖6所示)之至少一部分。例如,如圖2所示,該彎曲狀主體10係於其外周面C1沿其周方向定義有一條位於中間段之軌道區A及兩條分別位於該軌道區A兩旁之固定區B,因此,該軌道區A可用以供外力旋轉該彎曲狀主體10,且該固定區B可用以強化固定該桶槽物件9。
Furthermore, the
另外,該彎曲狀主體10之內周面C2係為如黑色橡膠之軟質橡膠墊面,以利於緊密接觸該桶槽物件9之外周面S。
In addition, the inner peripheral surface C2 of the curved
所述之連接件11係以可調整該間隔G之寬度t(參照圖3)的方式連接該彎曲狀主體10之第一端10a與第二端10b而配置於該間隔G上。其中,該彎曲狀主體10與該連接件11係形成一環狀結構1a(參照圖3),而該桶槽物件9係以橫置方式配置於該環狀結構1a中。
The connecting
於本實施例中,該連接件11係於正面觀看時呈馬蹄形,如圖5所示,其定義有一架體111及形成於該架體111相對兩側之腳座112,113。例如,該架體111係為鰭片狀或肋骨狀,該鰭片或肋骨上係形成有至少一開口110a,且該兩腳座112,113亦可依需求形成有至少一開口110a’,並於該兩腳座112,113之側面上形成有複數個如螺孔之穿孔110b。
In this embodiment, the connecting
再者,如圖2所示,該連接件11係藉由複數個螺紋構件21(參照圖6)而連接該彎曲狀主體10之第一端10a與第二端10b。例如,該彎曲狀主體10之第一端10a與第二端10b係分別配置有一個具有複數個如螺孔之穿孔100b之板座100’,以令兩腳座112,113之側面分別對齊並疊合於該第一端10a之板座100’與第二端10b之板座100’,再以該螺紋構件21對應接合該些穿孔100b,110b,藉此使該螺紋構件21連接且固定該些腳座112,113與該些板座100’而固定該連接件11與該彎曲狀主體10。具體而言,該連接件11之兩腳座112,113分別以螺接方式連接於該第二支撐部102與該第三支撐部103。
Furthermore, as shown in FIG. 2 , the
例如,如圖3所示,該環狀結構1a係形成為大致圓形環體,而該第一支撐部101係形成為呈170度角(如圖3所示之基於該環狀結構1a之圓心O所得之中心角度α)之弧形區段。此外,該第二支撐部102與第三支撐部103係依據該連接件11之構造、強度而呈現因應角度需求之弧形區段,故該連接件11可依據其材質特性或該螺紋構件21之旋鎖鬆緊度調整該間隔G之寬度t。因此,該連接件
11、該第二支撐部102與第三支撐部103係形成190度角之弧形區段,例如,該第二支撐部102與第三支撐部103各為弧度相同之弧形區段(如圖3所示之基於該環狀結構1a之圓心O所得之80度的對稱角度β)。
For example, as shown in FIG. 3, the annular structure 1a is formed as a substantially circular ring, and the first supporting
較佳地,可於該連接件11的腳座112,113與該第二支撐部102及/或該第三支撐部103之間配置一托架(省略其圖式),使該些腳座112,113與該第二支撐部102及/或該第三支撐部103隔開間隔(如圖4所示之間距d),以調整該間隔G之寬度t,亦即增大該寬度t(例如該間距d加上該連接件11之兩腳座112,113之側面之間的距離)。應可理解者為,該螺紋構件21會連接並固定該些腳座112,113、托架與該些板座100’。
Preferably, a bracket (figure omitted) can be disposed between the
另外,藉由該開口110a,110a’之構成,亦有利於該連接件11之應力分散,以避免發生應力集中而使該連接件11碎裂之問題。因此,於調整該該間隔G之寬度t之過程中,可保護該連接件11之結構免無損壞。
In addition, the configuration of the
於另一實施例中,請一併參考圖6至圖9,該支撐治具1更包括至少一個用以置放該彎曲狀主體10之基座20。例如,該基座20係與該彎曲狀主體10之外周面C1朝周方向可滑動地接觸,以便在將該桶槽物件9橫置於該彎曲狀主體10中時,容許該桶槽物件9進行旋轉。具體而言,該基座20係可滑動地接觸該彎曲狀主體10之軌道區A,如圖7所示,以供外力旋轉該彎曲狀主體10。
In another embodiment, please refer to FIG. 6 to FIG. 9 , the
所述之基座20係包含有一座體20a及複數個設於該座體20a上之作用構件20b,如圖6所示。例如,單一作用構件20b係藉由一支撐架201將兩滾輪200並排配置於該座體20a上,如圖9所示。其中,該支撐架201係固定於該座體20a上,且該兩滾輪200之旋轉軸係連接於該支撐架201,以令該兩滾輪200接觸該彎曲狀主體10之軌道區A(參照圖7)。
The
再者,該些作用構件20b係對稱地配置於該第一支撐部101之外周面C1之軌道區A上,如圖9所示,以使該些滾輪200能穩定轉動該彎曲狀主體10。較佳地,如圖7所示,該座體20a可藉由複數個調整件20c固定該些支撐架201,其中,該調整件20c係具有階梯結構202,如圖8所示,以令該支撐架201卡固於其中一台階202a,202b,202c上,藉此可依需求改變該支撐架201之高低位置,以調整該些滾輪200於該第一支撐部101之外周面C1之軌道區A上之位置。如此地,使該些作用構件20b能依該彎曲狀主體10之弧度大小調整至適當位置處。
Furthermore, the
於另一實施例中,如圖6至圖9所示,可將複數個(如三個)支撐治具1組合成一支撐治具組2。此外,該些支撐治具1係分別設置在該桶槽物件9之軸線L之方向上的不同位置。例如,該些支撐治具1係沿該桶槽物件9之軸線L之方向隔著間隔而排列。應可理解者為,該些支撐治具1亦能以呈現長筒狀支撐治具組之方式緊靠地排列,或者,可依需求而製作單一長筒狀之支撐治具,以取代該長筒狀支撐治具組。
In another embodiment, as shown in FIGS. 6 to 9 , a plurality of (for example, three) supporting
所述之支撐治具組2係包含有複數個支架22,以連接相鄰之支撐治具1。例如,該支架22之相對兩端側係具有複數個固定孔(未標註元件符號),且該支撐治具1係於其彎曲狀主體10之外周面C1之固定區B上配置有複數個具有固定孔(未標註元件符號)之固定件12(參照圖2),以令該支架22之相對兩端側分別對齊並疊合於相鄰之支撐治具1之固定件12,再以螺紋構件21’對應接合該些固定孔,藉此使該螺紋構件21’連接並固定該些固定件12與該些支架22而固定相鄰之支撐治具1。具體而言,該些支架22係分別以螺接方式連接相鄰之第一支撐部101、相鄰之第二支撐部102及/或相鄰之第三支撐部103。
The supporting jig set 2 includes a plurality of
再者,該固定件12之佈設位置可依需求調整,以調整該支撐治具組2之結構強度。例如,基於圖3所示之該環狀結構1a,該固定件12可對稱或均勻地配置於該彎曲狀主體10之外周面C1之固定區B上。例如,可配置於圖3所示之相對該圓心O之90度角之四個位置處。其中,該第一支撐部101係於兩處上配置有該些固定件12,且該第二支撐部102與該第三支撐部103係分別僅於一處上配置有該些固定件12。較佳地,如圖9所示,該桶槽物件9之四個腳座91係分別對應該些固定件12之位置。
Furthermore, the arrangement position of the fixing
應可理解者為,有關該支撐治具1之種類可依需求選擇,例如彎曲狀主體10可變更成一個、兩個或四個以上弧形區段、或改變該連接件11之形態等,而不限於上述者。
It should be understood that the type of the supporting
於使用該支撐治具1時,係將桶槽物件9以橫置方式配置於該環狀結構1a中並使其緊密接合於該彎曲狀主體10之內周面C2,再藉由外力推動該彎曲狀主體10,藉此使該支撐治具1在接觸於該些滾輪200之狀態下進行轉動,如圖6所示。藉此,該支撐治具1可適用於該桶槽物件9之清洗作業。
When using the supporting
因此,請一併參考圖2至圖10,本發明更提供一種清洗方法,供該桶槽物件9之清洗作業採用。該清洗作業所採用之清洗方法之具體步驟如下所述。
Therefore, please refer to FIG. 2 to FIG. 10 together. The present invention further provides a cleaning method for the cleaning operation of the
於本實施例中,基於該支撐治具1之使用方式,係將該基座20之置放表面定義為基準面(例如地面等之環境表面),並將該桶槽物件9之橫置方向定義為前後方向(亦即桶槽物件9之軸線L的方向。例如圖6所示之箭頭方向X),且將該基準面之另一坐標軸定義為左右方向(例如圖6所示之箭頭方向Y),並
將該桶槽物件9於橫置前之直立方向定義為上下方向(垂直於該基準面之方向。例如圖6所示之箭頭方向Z)。
In this embodiment, based on the usage of the
首先,將該第一支撐部101配置於該基座20上,再將該桶槽物件9傾倒以橫置於該第一支撐部101上。接著,將該第二支撐部102與該第三支撐部103連接並固定於該第一支撐部101,再以該連接件11連接並固定該第二支撐部102與該第三支撐部103,以形成該環狀結構1a。藉此,如圖6所示,使該環狀結構1a沿著該桶槽物件9之周方向W緊密接觸於該桶槽物件9之外周面S之至少一部分,而構成該桶槽支撐治具1。並且,將該桶槽物件9橫置固定於該桶槽支撐治具組2中。
Firstly, the first supporting
接著,如圖10所示,將清洗液8由該桶槽物件9之輸送埠92注入該槽體90中。其中,該清洗液8不會注入至該桶槽物件9之槽體90的最大容量,而只會注入達最大容量的大致一半狀態。例如,該輸送埠92係連接於一伸入該槽體90內之輸送管920,以將該清洗液8注入至該槽體90內。
Next, as shown in FIG. 10 , the
於本實施例中,該清洗液8係含有31%之過氧化氫(Hydrogen peroxide),其密度為1.11g/cm3。該清洗液8至多係呈槽體90的最大容量的一半狀態(其重量約為20噸),因此於該支撐治具1接觸該些滾輪200並進行轉動時,該槽體90中之清洗液8能被翻攪。
In this embodiment, the
另外,就其它順序而言,亦可在傾倒桶槽物件9之前,先將該清洗液8裝入該槽體90中,再將該桶槽物件9傾倒以橫置於該第一支撐部101上。
In addition, as far as other procedures are concerned, the
之後,藉由如人力或電動等方式之外力推動該彎曲狀主體10。藉此,設置有該支撐治具1(或該支撐治具組2)並且注入有該清洗液8的該桶槽物
件9會以該桶槽物件9之軸線L之方向作為轉軸進行旋轉,而翻攪該槽體90內之清洗液8。如此,藉由被翻攪之該清洗液8來清洗該槽體90之內部。
Afterwards, the curved
於本實施例中,由於該連接件11無法滑越過該基座20之滾輪200,故該桶槽物件9之旋轉係以該連接件11為起始點朝左方向(逆時針方向)或右方向(順時針方向)擺動,如圖9所示之旋轉方向F,而無法旋轉一圈。例如,該桶槽物件9之旋轉角度可為基於該轉軸向左擺動約130度角或向右擺動約130度角,或者是由左下方至右下方或由右下方至左下方大幅擺動260度角。因此,在該清洗過程中,該桶槽物件9可進行往復轉動,亦即逆時針方向與順時針方向之來回擺動。應可理解者為,該桶槽物件9之旋轉角度係配合該連接件11與該基座20之大小而決定,故調整該連接件11與該基座20之大小,即可改變該桶槽物件9之旋轉角度。
In this embodiment, since the connecting
待完成清洗作業後,藉由該輸送管920將清洗液8由該桶槽物件9之輸送埠92抽離該槽體90,以將該清洗液8輸送至該桶槽物件9外之預定處,如廢液收集處(省略其圖式)。
After the cleaning operation is completed, the
因此,本發明之清洗方法中,主要藉由橫置該桶槽物件9及旋轉該桶槽物件9之配合,以令該清洗液8可翻攪去除該桶槽物件9內部之雜質。因此,相較於習知之噴霧清洗方式,本發明之清洗方法之桶槽物件9之旋轉角度能有效均勻洗淨該桶槽物件9之槽體90內部之所有區域。此外,該桶槽物件9之旋轉力道強,使桶槽內部的該清洗液8被激烈攪拌,藉此能輕易清除該桶槽物件9之槽體90內壁面上之污垢。如此,於該桶槽物件9之槽體90注入半導體製程所需之化學藥液後,不會有各種雜質混入該桶槽物件9之槽體90內之化學藥液中,因此純度高,而能確保該半導體製程之良率。
Therefore, in the cleaning method of the present invention, the cleaning
再者,相較於習知之浸漬清洗方式,本發明之清洗方法藉由橫置該桶槽物件9及旋轉該桶槽物件9之配合,使該桶槽物件9之槽體90只需注入最大容量之一半之清洗液8,即可進行清洗作業,因而能大幅減少該清洗液8之使用量,且無需進行長時間浸漬之步驟。因此,本發明之清洗方法能大幅降低清洗作業之費用成本及縮短清洗時間,因而能提高清洗作業之經濟效益。
Furthermore, compared with the conventional immersion cleaning method, the cleaning method of the present invention only needs to inject the
又,相較於習知之浸漬清洗方式,本發明之清洗方法藉由橫置該桶槽物件9及旋轉該桶槽物件9之配合,使該桶槽物件9之槽體90只需注入最大容量之一半之清洗液8,即可進行清洗作業,因而不僅能符合清洗作業之安全性,且能洗淨該桶槽物件9之槽體90內部之所有區域。因此,於採用本發明之清洗方法進行清洗作業後,該桶槽物件9之槽體90內部之所有區域不會殘留雜質,於該桶槽物件9之槽體90注入半導體製程所需之化學藥液後,不會有各種雜質混入該桶槽物件9之槽體90內之化學藥液中,因此純度高,而能在該半導體製程中確保高良率。
Also, compared to the conventional immersion cleaning method, the cleaning method of the present invention only needs to inject the maximum capacity into the
另外,基於本發明之清洗方法之需求,本發明之支撐治具1(或該支撐治具組2)主要藉由環狀結構1a之構成,來強化該桶槽物件9於橫置及旋轉時之抗變形性(亦即該支撐治具1或該支撐治具組2所提供之強度輔助功能),使注入有清洗液8之桶槽物件9之外周面S所承受之應力(例如旋轉離心力)能有效分散,而不會發生應力集中之問題。因此,該支撐治具1(或該支撐治具組2)能穩固地支撐該注入有清洗液8之桶槽物件9(總重約25噸),使該桶槽物件9(不論是注入有清洗液8或未注入有清洗液8)不會變形。
In addition, based on the requirements of the cleaning method of the present invention, the supporting jig 1 (or the supporting jig group 2) of the present invention is mainly composed of an annular structure 1a to strengthen the
再者,本發明之支撐治具1(或該支撐治具組2)係藉由基座20之構成,而分散該桶槽物件9於旋轉時之外周面S所承受之應力。尤其是採用以四個
滾輪200支承該桶槽物件9之重量之構成,因此更能有效分散位於該注入有清洗液8之桶槽物件9之滾輪200側之外周面S所承受之應力。因此,該支撐治具1(或該支撐治具組2)能穩固地支撐該注入有清洗液8之桶槽物件9,使該桶槽物件9不會變形。
Moreover, the supporting jig 1 (or the supporting jig set 2 ) of the present invention is formed by the base 20 to disperse the stress on the outer peripheral surface S of the
如上述,本發明之支撐治具及清洗方法係藉由環狀結構支撐治具支承橫置之桶槽物件及旋轉該桶槽物件等構成,實現可發揮高清洗功效之清洗作業,且能藉由縮短清洗時間,而縮短例如該半導體製程之啟動時間(生產線之準備時間),故有利於半導體製程之技術發展。 As mentioned above, the support jig and cleaning method of the present invention are formed by supporting the horizontal tank object and rotating the tank object by the ring structure support jig, so as to realize the cleaning operation with high cleaning effect, and can use By shortening the cleaning time, for example, the start-up time of the semiconductor manufacturing process (production line preparation time) is shortened, so it is beneficial to the technological development of the semiconductor manufacturing process.
再者,於本發明之橫置旋轉洗淨過程中,因清洗液至多僅注入至該桶槽物件之最大容量之一半即可,故不僅可減少清洗液之費用,且該清洗作業所排出之清洗液(亦即廢液)也會減少,而可大幅降低處理廢液之費用。 Furthermore, in the horizontal rotation cleaning process of the present invention, because the cleaning liquid is only injected into half of the maximum capacity of the tank object at most, it is not only possible to reduce the cost of the cleaning liquid, but also the discharge of the cleaning operation Cleaning liquid (that is, waste liquid) will also be reduced, which can greatly reduce the cost of waste liquid treatment.
上述實施例僅用以例示性說明本發明之原理及其功效。本發明所屬技術領域中具有通常知識者可在不違背本發明之主旨之範圍內,對上述實施例進行各種修改或變更。因此本發明係不受限於所記載的實施例,而應依循申請專利範圍所定義之技術思維做最廣範圍的解釋。 The above-mentioned embodiments are only used to illustrate the principles and effects of the present invention. Those skilled in the technical field of the present invention can make various modifications or changes to the above-mentioned embodiments within the scope of not departing from the gist of the present invention. Therefore, the present invention is not limited to the described embodiments, but should be interpreted in the widest range according to the technical thinking defined in the scope of the patent application.
1:支撐治具 1: support jig
1a:環狀結構 1a: ring structure
2:支撐治具組 2: Support fixture group
9:桶槽物件 9: Barrel object
20:基座 20: base
20a:座體 20a: seat body
20b:作用構件 20b: Action component
20c:調整件 20c: Adjustment parts
21,21’:螺紋構件 21,21': threaded member
22:支架 22: Bracket
92:輸送埠 92: Delivery port
L:軸線 L: axis
S:外周面 S: Peripheral surface
W:周方向 W: week direction
X,Y,Z:箭頭方向 X, Y, Z: Arrow direction
Claims (10)
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US5791357A (en) * | 1996-06-06 | 1998-08-11 | Shin-Etsu Handotai Co., Ltd. | Support jig for thin circular objects |
US6638770B1 (en) * | 2000-02-09 | 2003-10-28 | Affymetrix, Inc. | Cleaning deposit devices that generate microarrays |
CN206588079U (en) * | 2017-03-13 | 2017-10-27 | 咸宁职业技术学院 | A kind of electric automatization high-efficiency washing device |
CN209680687U (en) * | 2018-12-04 | 2019-11-26 | 中山大学孙逸仙纪念医院 | Tracheal tube cleaning machine |
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US5791357A (en) * | 1996-06-06 | 1998-08-11 | Shin-Etsu Handotai Co., Ltd. | Support jig for thin circular objects |
US6638770B1 (en) * | 2000-02-09 | 2003-10-28 | Affymetrix, Inc. | Cleaning deposit devices that generate microarrays |
CN206588079U (en) * | 2017-03-13 | 2017-10-27 | 咸宁职业技术学院 | A kind of electric automatization high-efficiency washing device |
CN209680687U (en) * | 2018-12-04 | 2019-11-26 | 中山大学孙逸仙纪念医院 | Tracheal tube cleaning machine |
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