TWI786426B - High frequency characteristic inspection apparatus and high frequency characteristic inspection method - Google Patents

Abstract

The object of the present invention is to automatically connect inspection probes to a substrate and appropriately inspect high-frequency characteristics. The high-frequency characteristics inspection device of the present invention inspects the high-frequency characteristics of a substrate, and includes: a movable inspection jig having a plurality of inspection probes for inspecting the substrate from the main surface side of the substrate; an imaging unit , which photographs the main surface side of the above-mentioned substrate; a substrate holder, which holds the above-mentioned substrate and can move at least parallel to the main surface of the above-mentioned substrate; and a control unit, based on the image captured by the above-mentioned imaging unit, at least The substrate holder moves to make the inspection probes contact the substrate; the control unit moves the substrate holder parallel to the main surface of the substrate, and after positioning the substrate relative to the inspection jig, The inspection jig moves relative to the substrate holder in a vertical direction to the main surface, and the inspection probes are brought into contact with the substrate.

Description

High-frequency characteristic inspection device and high-frequency characteristic inspection method

The invention relates to a high-frequency characteristic inspection device and a high-frequency characteristic inspection method.

In the previous inspection equipment for inspecting the substrate, there were those that inspected the continuity and insulation of the circuit pattern, but did not measure the high-frequency characteristics of the substrate. Also, as a technique for measuring high-frequency characteristics of a substrate, a technique of simply performing inspection using a non-contact electromagnetic induction probe member is known (for example, refer to Patent Document 1). [Prior technical literature] [Patent literature]

[Patent Document 1] Japanese Patent Laid-Open No. 11-44724

[Problem to be solved by the invention]

However, in the above-mentioned prior art, the non-contact electromagnetic induction probe member is used for simple inspection, and it is difficult to automatically connect the inspection probe to the substrate to be inspected and inspect the high-frequency characteristics.

The present invention was made to solve the above-mentioned problems, and an object of the present invention is to provide a high-frequency characteristic inspection device and a high-frequency characteristic inspection method capable of automatically connecting inspection probes to a substrate and appropriately inspecting high-frequency characteristics. [Technical means to solve problems]

In order to solve the above-mentioned problems, an aspect of the present invention is a high-frequency characteristic inspection device, which inspects the high-frequency characteristics of the substrate, and includes: a movable inspection jig, which has a A plurality of inspection probes for inspecting the above-mentioned substrate; an imaging unit for imaging the main surface side of the above-mentioned substrate; a substrate holder for holding the above-mentioned substrate and capable of moving at least parallel to the main surface of the above-mentioned substrate; and a control unit for Based on the image captured by the imaging unit, at least the substrate holder is moved to bring the inspection probe into contact with the substrate; the control unit moves the substrate holder parallel to the main surface of the substrate to perform the above After the substrate is positioned relative to the inspection jig, the inspection jig and the substrate holder are moved in a direction perpendicular to the main surface relative to each other, so that the inspection probes are brought into contact with the substrate.

Also, an aspect of the present invention is a method for inspecting high-frequency characteristics, which is a method for inspecting high-frequency characteristics of a high-frequency characteristic inspection device for inspecting high-frequency characteristics of a substrate. The high-frequency characteristic inspection device includes: a movable inspection device A tool having a plurality of inspection probes for inspecting the above-mentioned substrate from the main surface side of the above-mentioned substrate; an imaging unit for taking pictures of the main surface side of the above-mentioned substrate; The principal surface of the substrate moves in parallel; and a control unit moves at least the substrate holder based on the image captured by the imaging unit so that the inspection probes contact the substrate; and the control unit moves the substrate holder Move in parallel with respect to the main surface of the above-mentioned substrate, after positioning the above-mentioned substrate relative to the above-mentioned inspection jig, move the above-mentioned inspection jig and the above-mentioned substrate holder relative to the vertical direction of the above-mentioned main surface, so that the above-mentioned inspection The probes contact the aforementioned substrate. [Effect of Invention]

According to the present invention, it is possible to automatically connect inspection probes to a substrate and appropriately inspect high-frequency characteristics.

Hereinafter, a high-frequency characteristic inspection device and a high-frequency characteristic inspection method according to an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a diagram showing a configuration example of a high-frequency characteristic inspection device 1 according to this embodiment. In addition, FIG. 2 is a functional block diagram showing an example of the high-frequency characteristic inspection device of this embodiment.

As shown in FIGS. 1 and 2 , the high-frequency characteristic inspection device 1 includes an upper surface inspection jig 21 , a lower surface inspection jig 22 , an upper surface camera 31 , a lower surface camera 32 , a substrate holder 40 , and an upper surface inspection jig. A drive unit 41 , a lower surface inspection jig drive unit 42 , a substrate holder drive unit 43 , and a control PC (Control Personal Computer) 50 . The high-frequency characteristic inspection device 1 is an inspection device for inspecting the high-frequency characteristics of the substrate PB. Also, a network analyzer 2 as an analysis device for inspecting the high-frequency characteristics of the substrate PB is connected to the high-frequency characteristic inspection device 1.

The substrate PB is a printed circuit board to be inspected, and a circuit pattern is formed inside. In addition, a plurality of substrates PB are formed on the substrate sheet ST. On the surface of each substrate PB included in the substrate sheet ST, substrate patterns such as electrodes contacting (connected to) an inspection jig when inspecting high-frequency characteristics, and alignment marks serving as positioning marks for a single substrate PB are formed.

Furthermore, in this embodiment, let the directions parallel to the main surface of the substrate PB be, for example, the X-axis direction, the Y-axis direction, and the θ direction, and let the directions (vertical directions) perpendicular to the main surface of the substrate PB be The Z-axis direction will be described. In addition, in the following description, the direction parallel to the main surface of the board|substrate PB may be called a parallel direction. Here, the θ direction is an angular direction on a plane parallel to the principal surface of the substrate PB, and represents a rotation angle with the Z-axis direction as a rotation axis. Also, in this embodiment, the principal surface on the upper side of the substrate PB is defined as the principal surface F1 (an example of the first principal surface), and the principal surface on the lower side of the substrate PB is defined as the principal surface F2 (the second principal surface). An example) will be described.

The substrate holder 40 is configured to hold the substrate PB (substrate sheet ST) and to be movable parallel to at least the main surface of the substrate PB. The substrate holder 40 is movable in the X-axis direction, the Y-axis direction, and the θ direction by a substrate holder driving unit 43 described below.

The upper surface inspection jig 21 is an inspection jig for inspecting the substrate PB from the upper main surface F1 side of the substrate PB, has a plurality of inspection probes 11, and is arranged on the main surface F1 side of the substrate PB. Moreover, the upper surface inspection jig 21 is connected to the network analyzer 2 via the inspection cable CB1. The upper surface inspection jig 21 is configured to be movable only in the vertical direction to the main surface (for example, the main surface F1 ) of the substrate PB within a range where a change in the posture of the inspection cable CB1 does not affect the inspection of high-frequency characteristics. For example, the upper surface inspection jig 21 can be moved in the Z-axis direction by an upper surface inspection jig drive unit 41 described below.

The lower surface inspection jig 22 is an inspection jig for inspecting the substrate PB from the main surface F2 side of the lower side of the substrate PB, has a plurality of inspection probes 12, and is arranged on the main surface F2 side of the substrate PB. Moreover, the lower surface inspection jig 22 is connected to the network analyzer 2 via the inspection cable CB2. The lower surface inspection jig 22 is configured to be movable only parallel to the main surface (for example, the main surface F2 ) of the substrate PB within a range in which a change in the posture of the inspection cable CB2 does not affect the inspection of high-frequency characteristics. For example, the lower surface inspection jig 22 can be moved in the X-axis direction, the Y-axis direction, and the θ direction by the lower-surface inspection jig driving unit 42 described below.

Furthermore, in this embodiment, the inspection probes 11 included in the upper surface inspection jig 21 and the inspection probes 12 included in the lower surface inspection jig 22 represent arbitrary inspection probes included in the high-frequency characteristic inspection device 1. In the case of a needle, or in a case where no special distinction is required, the inspection probe 10 will be described. In addition, the upper surface inspection jig 21 and the lower surface inspection jig 22 will be described as the inspection jig 20 when they represent any inspection jigs included in the high-frequency characteristic inspection device 1 or when no special distinction is required.

The upper surface camera 31 (an example of an imaging unit) is arranged on the main surface F1 side of the substrate PB, and images the main surface F1 side (upper surface side) of the substrate PB. The upper surface camera 31 is equipped with an imaging element such as a CCD (Charge Coupled Device, Charge Coupled Device) sensor, etc., photographs the substrate pattern on the main surface F1 side of the substrate PB, and outputs the photographed substrate pattern (image data) to Control PC50.

The bottom surface camera 32 (an example of an imaging unit) is arranged on the main surface F2 side of the substrate PB, and images the main surface F2 side (lower surface side) of the substrate PB. The bottom surface camera 32 includes, for example, an imaging element such as a CCD sensor, images the substrate pattern on the main surface F2 side of the substrate PB, and outputs the imaged substrate pattern (image data) to the control PC 50 .

In addition, in the present embodiment, the upper surface camera 31 (an example of the first imaging unit) and the lower surface camera 32 (an example of the second imaging unit) represent arbitrary cameras included in the high-frequency characteristic inspection device 1, Or when there is no need to distinguish them, the camera 30 will be described.

The inspection cable CB1 (an example of the first inspection cable) is, for example, a coaxial cable, connected between the network analyzer 2 and the upper surface inspection jig 21, and between the network analyzer 2 and the inspection probe 11 Transmission of inspection signals for inspection of high-frequency characteristics. That is, a plurality of inspection probes 11 are connected to the network analyzer 2 through the inspection cable CB1, and the inspection cable CB1 is a coaxial cable.

The inspection cable CB2 (an example of the second inspection cable) is, for example, a coaxial cable, connected between the network analyzer 2 and the lower surface inspection jig 22, and between the network analyzer 2 and the inspection probe 12 Transmission of inspection signals for inspection of high-frequency characteristics. That is, the plurality of inspection probes 12 are connected to the network analyzer 2 through the inspection cable CB2, and the inspection cable CB2 is a coaxial cable.

The upper surface inspection jig driving unit 41 is a driving mechanism for moving the upper surface inspection jig 21 . The upper surface inspection jig driving unit 41 moves the upper surface inspection jig 21 in the vertical direction to the main surface (for example, the main surface F1 ) of the substrate PB. The upper surface inspection jig drive unit 41 moves the upper surface inspection jig 21 in the Z-axis direction under the control of the control PC 50 described below.

The lower surface inspection jig driving unit 42 is a driving mechanism for moving the lower surface inspection jig 22 . The lower surface inspection jig driving unit 42 moves the lower surface inspection jig 22 in a direction parallel to the main surface (for example, the main surface F2 ) of the substrate PB. The lower surface inspection jig driving unit 42 moves the lower surface inspection jig 22 in the X-axis direction, the Y-axis direction, and the θ direction under the control of the control PC 50 described later.

The substrate holder driving unit 43 is a driving mechanism for moving the substrate holder 40 . The substrate holder drive unit 43 moves in a direction parallel to the main surface of the substrate PB (for example, the main surface F1 ), and moves in a direction perpendicular to the main surface of the substrate PB. The substrate holder driving unit 43 moves the substrate holder 40 in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ direction under the control of the control PC 50 described below.

The control PC 50 is a control unit that controls the high-frequency characteristic inspection device 1 . The control PC 50 moves at least the substrate holder 40 based on the image captured by the camera 30 so that the inspection probe 10 contacts the substrate PB. For example, the control PC 50 moves the substrate holder 40 parallel to the main surface of the substrate PB to position the substrate PB relative to the inspection jig 20 , and then moves the inspection jig 20 and the substrate holder 40 relative to the main surface. The inspection probe 10 is moved in the vertical direction to the surface so that the inspection probe 10 comes into contact with the substrate PB.

Specifically, the control PC 50 moves the substrate holder 40 in parallel based on the substrate pattern captured by the upper surface camera 31 and the lower surface camera 32 to position the substrate PB with respect to the inspection jig 20 . That is, the control PC 50 controls the substrate holder driving unit 43 to move the substrate holder 40 in any one of the X-axis direction, the Y-axis direction, and the θ direction, or in a direction combining them, thereby The positioning of the board|substrate PB with respect to the upper surface inspection jig 21 is performed. Furthermore, the control PC 50 controls the lower surface inspection jig driving unit 42 to make the lower surface inspection jig 22 parallel (such as any one of the X-axis direction, the Y-axis direction, and the θ direction) based on the substrate pattern captured by the lower-surface camera 32. direction or a combination thereof) to finely adjust the positioning of the substrate PB relative to the lower surface inspection jig 22 .

After positioning the substrate PB relative to the inspection jig 20, the control PC 50 moves the upper surface inspection jig 21 and the lower surface inspection jig 22 in the vertical direction relative to the substrate holder 40, thereby making the plurality of inspection probes The needle 10 contacts the substrate PB. The control PC 50 controls the substrate holder driving unit 43 to move, for example, the substrate holder 40 in the vertical direction (Z-axis direction) so that the plurality of inspection probes 10 of the lower surface inspection jig 22 contact the substrate PB. Furthermore, the control PC 50 controls the upper surface inspection jig drive unit 41, for example, moves the upper surface inspection jig 21 in the vertical direction (Z-axis direction), so that the plurality of inspection probes 10 of the upper surface inspection jig 21 contact the substrate. PB.

In this way, the control PC 50 moves the upper surface inspection jig 21 and the lower surface inspection jig 22 in the vertical direction relative to the substrate holder 40 to perform positioning of the substrate PB and contact of the inspection probes 10 . Here, details of the moving directions of the upper surface inspection jig 21 , the lower surface inspection jig 22 , and the substrate holder 40 in this embodiment will be described with reference to FIG. 3 .

FIG. 3 is a diagram illustrating an example of movement of the inspection jig 20 and the substrate holder 40 according to the present embodiment. As shown in FIG. 3 , the upper surface inspection jig 21 is driven by the upper surface inspection jig drive unit 41 , and can be used only within the range where the posture change of the inspection cable CB1 will not affect the inspection of high frequency characteristics. Move in the Z-axis direction. Furthermore, the upper surface inspection jig 21 has a configuration that cannot move in the X-axis direction, the Y-axis direction, and the θ direction. Here, the amount of movement in the vertical direction (Z-axis direction) of the upper surface inspection jig 21 is, for example, 50 mm (millimeters) or less. The movement in the vertical direction (Z-axis direction) of the upper surface inspection jig 21 is used for contacting the inspection probe 11 of the upper surface inspection jig 21 with the substrate PB.

In addition, the lower surface inspection jig 22 can be rotated in the X-axis direction and the Y-axis direction within the range where the posture change of the inspection cable CB2 does not affect the inspection of high-frequency characteristics by the drive of the lower surface inspection jig drive unit 42 . direction, and theta direction in any direction or a combination of these directions to move. Furthermore, the lower surface inspection jig 22 is configured so that it cannot move in the Z-axis direction. Here, the movement amount of the lower surface inspection jig 22 in the parallel direction (X-axis direction and Y-axis direction) is smaller than the movement amount of the substrate holder 40, for example, 5 mm or less, on the surface parallel to the main surface of the substrate PB. The amount of movement in the angular direction (theta direction) is, for example, 3° (degrees) or less. The movement of the lower surface inspection jig 22 in parallel directions (X-axis direction, Y-axis direction, and θ direction) is used for positioning the lower surface inspection jig 22 relative to the substrate PB.

Further, the substrate holder 40 can move in parallel directions (X-axis direction, Y-axis direction, and θ direction) and a vertical direction (Z-axis direction) by the driving of the substrate holder driving unit 43 . The movement of the substrate holder 40 in the parallel direction (X-axis direction, Y-axis direction, and θ direction) is used for the positioning of the substrate PB relative to the upper surface inspection jig 21 and the lower surface inspection jig 22, and the substrate sheet ST The movement of the substrate PB on the inspection object. Also, the movement in the vertical direction (Z-axis direction) of the substrate holder 40 is used for the contact between the inspection probe 12 of the lower surface inspection jig 22 and the substrate PB.

In this way, the control PC 50 uses the upper surface inspection jig 21 , the lower surface inspection jig 22 , and the substrate holder 40 that can move in a specific direction, and performs the adjustment of the substrate PB relative to the upper surface inspection jig 21 and the lower surface inspection jig 22 . Positioning and contact of the inspection probes 12 of the upper surface inspection jig 21 and the lower surface inspection jig 22 with the substrate PB. The control PC 50 moves the substrate holder 40 downward when the inspection probes 10 of the upper surface inspection jig 21 and the lower surface inspection jig 22 are in contact with the substrate PB, so that the inspection probes of the lower surface inspection jig 22 are moved downward. The needles 12 are brought into contact with the substrate PB, and the upper surface inspection jig 21 is moved downward, so that the inspection probes 11 of the upper surface inspection jig 21 are brought into contact with the substrate PB.

After the control PC 50 brings the inspection probes 10 of the upper surface inspection jig 21 and the lower surface inspection jig 22 into contact with the substrate PB, it executes the high-frequency characteristic inspection of the substrate PB using the network analyzer 2 .

Next, the operation of the high-frequency characteristic inspection device 1 of this embodiment will be described with reference to the drawings. FIG. 4 is a flow chart showing an example of the operation of the high-frequency characteristic inspection device 1 of this embodiment. In this figure, the operation|movement which performs the high-frequency characteristic inspection of the board|substrate PB from both surface sides of the board|substrate PB by the control PC50 of the high-frequency characteristic inspection apparatus 1 is shown.

As shown in FIG. 4 , the control PC 50 of the high-frequency characteristic inspection apparatus 1 first moves the substrate holder 40 to the inspection start position (step S101 ). The control PC 50 controls the substrate holder driving unit 43 so that the upper surface inspection jig 21 and the lower surface inspection jig 22 come to the inspection start position among the plurality of substrates PB of the substrate sheet ST held by the substrate holder 40 The way of the substrate PB moves. Furthermore, setting information such as the size of the substrate sheet ST, the size of the substrate PB, and the number of substrates PB in the substrate sheet ST is stored in a memory unit (not shown) provided in the control PC 50 .

Next, the control PC 50 starts to photograph the upper surface of the substrate PB with the upper surface camera 31 and starts to photograph the lower surface of the substrate PB with the lower surface camera 32 (step S102 ). The control PC50 starts the imaging operation of the upper surface camera 31, and regularly acquires the image of the board|substrate pattern of the upper surface side (principal surface F1 side) of the board|substrate PB which was imaged. Moreover, control PC50 starts the imaging operation of the bottom surface camera 32, and acquires the image|photographed image of the board|substrate pattern of the bottom surface side (main surface F2 side) of the board|substrate PB regularly. Here, the substrate pattern includes, for example, an alignment mark or a wiring pattern.

Next, the control PC 50 moves the substrate holder 40 in the X-axis direction, the Y-axis direction, and the θ direction based on the images captured by the upper surface camera 31 and the lower surface camera 32, thereby determining the inspection position of the upper surface inspection jig 21 (step S103). The control PC 50 controls the substrate holder driving unit 43 based on the images of the substrate pattern captured by the upper surface camera 31 and the lower surface camera 32 to determine the inspection position of the upper surface inspection jig 21 .

Next, the control PC 50 makes the lower surface inspection jig 22 in the X-axis direction, Y-axis direction, and Move in the θ direction to determine the inspection position of the lower surface inspection jig 22 (step S104). The control PC 50 controls the lower surface inspection jig driver 42 based on the image of the substrate pattern captured by the lower surface camera 32 and the information on the inspection position of the upper surface inspection jig 21 determined in the above step S103, and determines the lower surface inspection jig 21. Tool 22 inspection position. Here, the control PC 50 moves the inspection position of the lower surface inspection jig 22 within a range in which the change in the posture of the inspection cable CB2 does not affect the inspection of high-frequency characteristics.

Next, the control PC 50 moves the substrate holder 40 in the Z-axis direction so that the inspection probes 12 of the lower surface inspection jig 22 contact the substrate PB (step S105 ). The control PC 50 controls the substrate holder drive unit 43 to move the substrate holder 40 downward in the Z-axis direction so that the inspection probes 12 of the lower surface inspection jig 22 contact the substrate PB.

Next, the PC 50 is controlled to move the upper surface inspection jig 21 in the Z-axis direction, so that the inspection probes 11 of the upper surface inspection jig 21 contact the substrate PB (step S106 ). The control PC 50 controls the upper surface inspection jig drive unit 41 to move the upper surface inspection jig 21 downward in the Z-axis direction so that the inspection probes 11 of the upper surface inspection jig 21 contact the substrate PB.

Next, the control PC 50 checks the high-frequency characteristics of the substrate PB through the network analyzer 2 (step S107). The network analyzer 2 measures, for example, the frequency characteristics of the passing power and reflected power of the path of the high-frequency circuit of the substrate PB as the high-frequency characteristics of the substrate PB, and judges whether it is acceptable or not.

Next, the control PC 50 moves the upper surface inspection jig 21 and the substrate holder 40 in the Z-axis direction, thereby releasing the contact of the inspection probe 10 (step S108 ). The control PC 50 controls the upper surface inspection jig driving part 41 to move the upper surface inspection jig 21 upward in the Z-axis direction, thereby releasing the contact (electrical connection) of the inspection probe 11 of the upper surface inspection jig 21 . In addition, the control PC 50 controls the substrate holder driving unit 43 to move the substrate holder 40 upward in the Z-axis direction, thereby releasing the contact (electrical connection) of the inspection probe 12 of the lower surface inspection jig 22 .

Next, the control PC50 judges whether the next inspection position exists (step S109). The control PC 50 determines whether there is a next inspection position in the current board PB based on the setting information (for example, information on a plurality of inspection positions in the substrate PB) and the current inspection position stored in the memory unit (not shown). When the next inspection position exists (step S109: YES), control PC50 advances a process to step S103, and repeats the process of step S103 to step S109. Moreover, control PC50 advances a process to step S110, when the next inspection position does not exist (step S109: negative (NO)).

In step S110 , the control PC 50 determines whether there is a substrate PB to be inspected next. The control PC 50 confirms the current inspection position based on the setting information (such as the size of the substrate sheet ST, the size of the substrate PB, and the number of the substrate PB in the substrate sheet ST) and the current inspection position stored in the memory section not shown above. Whether or not the substrate PB to be inspected next exists among the plurality of substrates PB included in the substrate sheet ST. When the control PC50 exists the board|substrate PB to be inspected next (step S110: Yes), it advances a process to step S111. Moreover, when the control PC50 does not exist the board|substrate PB to be inspected next (step S110: No), it finishes a process.

In step S111, the control PC50 moves the board|substrate holder 40 to the position of the board|substrate PB to be inspected next. The control PC50 controls the board|substrate holder drive part 43 so that it may move to the position of the board|substrate PB of the next inspection target among the several board|substrates PB which board|substrate sheet ST has. After the processing of step S111, the control PC 50 advances the processing to step S102, and repeats the processing from step S102 to step S110 for the next substrate PB to be inspected after moving.

Next, referring to FIG. 5 , a variation example of the operation of the high-frequency characteristic inspection device 1 of the present embodiment in the case where the high-frequency characteristics are inspected only on the upper surface side of the substrate PB will be described. FIG. 5 is a flow chart showing another example of the operation of the high-frequency characteristic inspection device 1 of this embodiment. In this figure, the operation|movement which performs the high-frequency characteristic inspection of the board|substrate PB from the upper surface side (principal surface F1 side) of the board|substrate PB by the control PC50 of the high-frequency characteristic inspection apparatus 1 is shown.

In FIG. 5, since the processing of step S201 is the same as the processing of step S101 shown in FIG. 4, the description thereof is omitted here.

In step S202 , the control PC 50 starts to photograph the upper surface of the substrate PB through the upper surface camera 31 . Control PC50 starts the imaging operation of the upper surface camera 31, and acquires the image of the board|substrate pattern of the upper surface side (principal surface F1 side) of the board|substrate PB which was imaged regularly.

Next, the control PC 50 moves the substrate holder 40 in the X-axis direction, the Y-axis direction, and the θ direction based on the image captured by the upper surface camera 31 to determine the inspection position of the upper surface inspection jig 21 (step S203 ). The control PC 50 determines the inspection position of the upper surface inspection jig 21 by controlling the substrate holder drive unit 43 based on the image of the substrate pattern captured by the upper surface camera 31 .

Next, the PC 50 is controlled to move the upper surface inspection jig 21 in the Z-axis direction, so that the inspection probes 11 of the upper surface inspection jig 21 contact the substrate PB (step S204 ). The control PC 50 controls the upper surface inspection jig drive unit 41 to move the upper surface inspection jig 21 downward in the Z-axis direction so that the inspection probes 11 of the upper surface inspection jig 21 contact the substrate PB.

Next, the control PC 50 checks the high-frequency characteristics of the substrate PB through the network analyzer 2 (step S205).

Next, the control PC 50 moves the upper surface inspection jig 21 in the Z-axis direction, thereby releasing the contact of the inspection probe 10 (step S206 ). The control PC 50 controls the upper surface inspection jig driving part 41 to move the upper surface inspection jig 21 upward in the Z-axis direction, thereby releasing the contact (electrical connection) of the inspection probe 11 of the upper surface inspection jig 21 .

Next, since the processing from step S207 to step S209 is the same as the processing from step S109 to step S111 shown in FIG. 4 above, description thereof will be omitted here. Furthermore, in step S207, when the next inspection position exists (step S207: YES), control PC50 advances a process to step S203, and repeats the process of step S203 to step S207. Moreover, in step S208, when the board|substrate PB to be inspected next exists among the some board|substrate PB which board|substrate sheet ST has (step S208: Yes), control PC50 advances a process to step S209. Also, after the processing of step S209, the control PC 50 advances the processing to step S202, and repeats the processing from step S202 to step S208 for the next substrate PB to be inspected after the movement.

As described above, the high-frequency characteristic inspection device 1 of this embodiment is a high-frequency characteristic inspection device for inspecting the high-frequency characteristics of the substrate PB, and includes an inspection jig 20, a camera 30 (imaging unit), a substrate holder 40, And control PC50 (control part). The inspection jig 20 has a plurality of inspection probes 10 for inspecting the substrate PB from the main surface side of the substrate PB, and can be used in the range where the change in the posture of the inspection cables (CB1, CB2) does not affect the inspection of high-frequency characteristics move within. The camera 30 images the main surface side (for example, the main surface F1 side) of the board|substrate PB. The substrate holder 40 holds the substrate PB and is movable parallel to at least the main surface of the substrate PB (for example, in the X-axis direction, the Y-axis direction, or the θ direction). The control PC 50 moves at least the substrate holder 40 based on the image captured by the camera 30 to bring the inspection probe 10 into contact with the substrate PB. The PC 50 is controlled to move the substrate holder 40 parallel to the main surface of the substrate PB, and after the substrate PB is positioned relative to the inspection jig 20, the inspection jig 20 and the substrate holder 40 are relatively aligned in the vertical direction of the main surface. (For example, the Z-axis direction) moves, and the inspection probe 10 contacts the board|substrate PB.

Thereby, the high-frequency characteristic inspection apparatus 1 of the present embodiment moves the substrate holder 40 parallel to the principal surface to position the substrate PB, moves the inspection jig 20 in the vertical direction to bring the inspection probe 10 into contact with the substrate PB, Therefore, it is possible to reduce posture changes of the inspection cables ( CB1 , CB2 ) when inspecting high-frequency characteristics. Therefore, the high-frequency characteristic inspection device 1 of this embodiment can automatically connect the inspection probe 10 to the substrate PB without affecting the posture change of the inspection cables (CB1, CB2), and can appropriately inspect the high-frequency characteristics. .

Furthermore, in the inspection of high-frequency characteristics, if the measurement environment changes, such as a change in the posture of the inspection cable, the measurement results of high-frequency characteristics may change. Therefore, in the inspection of high-frequency characteristics, it is desirable to minimize changes in the measurement environment such as changes in the posture of the inspection cables (CB1, CB2). The high-frequency characteristic inspection device 1 of this embodiment can reduce the posture change of the inspection cables (CB1, CB2), so that the reproducibility of the measurement results of the high-frequency characteristics can be ensured, and the high-frequency characteristics can be appropriately inspected.

Also, in this embodiment, the inspection jig 20 includes a first inspection jig (upper surface inspection jig 21 ) arranged on the first main surface side (the main surface F1 side) of the substrate PB, and an The second inspection jig (lower surface inspection jig 22 ) on the second main surface side (main surface F2 side) opposite to the main surface side (main surface F1 side). The camera 30 includes a first imaging unit (upper surface camera 31) for imaging the substrate pattern on the first main surface side (main surface F1 side), and a second imaging unit (top surface camera 31) for imaging the substrate pattern on the main surface F2 side (second main surface side). part (lower surface camera 32). The control PC 50 moves the substrate holder 40 parallel to the main surface based on the substrate pattern captured by the first imaging unit (upper surface camera 31) and the second imaging unit (lower surface camera 32), and performs relative inspection of the substrate PB. With 20 positioning. The PC 50 is controlled to move the first inspection jig (upper surface inspection jig 21 ) and the second inspection jig (lower surface inspection jig 22 ) relative to the substrate holder 40 in the vertical direction, so that the plurality of inspection probes 10 contact substrate PB. Here, the first main surface is the main surface F1 on the upper side of the substrate PB, and the second main surface is the main surface F2 on the lower side of the substrate PB.

Thus, the high-frequency characteristic inspection device 1 of the present embodiment can appropriately inspect the high-frequency characteristics from both the first main surface side (main surface F1 side) and the second main surface side (main surface F2 side), and High-frequency characteristics can be appropriately inspected for various substrates PB having different circuit patterns.

In addition, in the present embodiment, the lower surface inspection jig 22 is movable parallel to the main surface F2 (for example, in the X-axis direction, the Y-axis direction, and the θ direction). The control PC 50 moves the lower surface inspection jig 22 parallel to the main surface F2 (for example, along the X-axis direction, the Y-axis direction, and the θ direction) based on the substrate pattern captured by the lower-surface camera 32, thereby performing the lower-surface inspection jig 22 Positioning relative to the substrate PB. The control PC 50 moves the substrate holder 40 in the vertical direction (for example, the Z-axis direction), so that the plurality of inspection probes 10 of the lower surface inspection jig 22 contact the substrate PB. The control PC 50 moves the upper surface inspection jig 21 in the vertical direction (for example, the Z-axis direction), so that the plurality of inspection probes 10 of the upper surface inspection jig 21 contacts the substrate PB.

Thus, the high-frequency characteristic inspection device 1 of the present embodiment can improve the bottom surface inspection process by moving the bottom surface inspection jig 22 parallel to the main surface F2 (for example, along the X-axis direction, the Y-axis direction, and the θ direction). The accuracy of the positioning of the tool 22 relative to the substrate PB. In addition, the high-frequency characteristic inspection device 1 of the present embodiment can also move the upper surface inspection jig 21 in parallel to the main surface in addition to the vertical direction of the main surface, and make the lower surface inspection jig 22 The inspection is performed in a fixed state, but in this case, the movement direction of the upper surface inspection jig 21 increases, so the posture change of the inspection cable CB1 also increases. Therefore, as in this embodiment, the lower surface inspection jig 22 is used instead of the upper surface inspection jig 21 to share the movement in the direction parallel to the main surface, so that even when there are inspection jigs 20 on the upper and lower surfaces, it can be properly inspected. Minimize the posture change of the inspection cables (CB1, CB2).

In addition, in this embodiment, the movement amount in the vertical direction of the upper surface inspection jig 21 is 50 mm or less. Also, the amount of movement in the parallel direction of the lower surface inspection jig 22 is 5 mm or less, and the amount of movement in the angular direction on the surface parallel to the main surface of the substrate PB is 3° or less. Thereby, the high-frequency characteristic inspection device 1 of this embodiment can appropriately reduce the posture change of the inspection cables (CB1, CB2) even when there are inspection jigs 20 on the upper and lower surfaces.

Also, in this embodiment, a plurality of inspection probes 10 are connected to the network analyzer 2 for inspecting the high-frequency characteristics of the substrate PB through inspection cables (CB1, CB2), and the inspection cables (CB1, CB2) are coaxial cables. Thereby, the high-frequency characteristics inspection device 1 of this embodiment can further appropriately inspect the high-frequency characteristics by utilizing the shielding effect of the coaxial cable.

Also, the high-frequency characteristic inspection method of this embodiment is a high-frequency characteristic inspection method of the high-frequency characteristic inspection device 1 for inspecting the high-frequency characteristics of the substrate PB, and the PC 50 is controlled so that the substrate holder 40 is parallel to the main surface of the substrate PB. After moving to position the substrate PB relative to the inspection jig 20 , the inspection jig 20 and the substrate holder 40 are moved relative to the substrate holder 40 in the vertical direction of the main surface, and the inspection probe 10 is brought into contact with the substrate PB. Thereby, the high-frequency characteristic inspection method of this embodiment can exert the same effect as the above-mentioned high-frequency characteristic inspection device 1, and can automatically connect the inspection probe 10 to the substrate PB, and appropriately inspect the high-frequency characteristics.

In addition, this invention is not limited to the said embodiment, It can change in the range which does not deviate from the summary of this invention.

For example, in the above-mentioned embodiment, an example of using the network analyzer 2 as an example of the analysis device for checking the high-frequency characteristics of the substrate PB has been described, but it is not limited to this, as long as it is an analysis device for checking the high-frequency characteristics , it can also be other devices. Also, in the above-mentioned embodiment, an example of connecting the external network analyzer 2 to the high-frequency characteristic inspection device 1 has been described, but the high-frequency characteristic inspection device 1 may also have the function of the network analyzer 2.

In addition, in the above-mentioned embodiment, an example was described in which the first main surface is the main surface F1 on the upper side of the substrate PB, and the second main surface is the main surface F2 on the lower side of the substrate PB, but the present invention is not limited thereto. For example, the second main surface may be the main surface F1 on the upper side of the substrate PB, and the first main surface may be the main surface F2 on the lower side of the substrate PB.

In this case, the upper surface inspection jig 21 can move parallel to the main surface F1 (for example, along the X-axis direction, the Y-axis direction, and the θ direction), and the control PC 50 can make the upper surface The surface inspection jig 21 moves parallel to the main surface F1 (for example, along the X-axis direction, the Y-axis direction, and the θ direction), thereby positioning the upper surface inspection jig 21 relative to the substrate PB. In addition, the control PC 50 can also move the substrate holder 40 in the vertical direction (for example, the Z-axis direction), so that the plurality of inspection probes 10 of the upper surface inspection jig 21 contact the substrate PB, and the lower surface inspection jig 22 The plurality of inspection probes 10 of the lower surface inspection jig 22 are brought into contact with the substrate PB by moving in the vertical direction (for example, the Z-axis direction).

Moreover, in the said embodiment, although the example which provided control PC50 as an example of a control part was demonstrated, it is not limited to this, For example, a built-in type control unit, a control panel, etc. may be sufficient. In addition, the high-frequency characteristic inspection device 1 may not include the control PC 50 but may be provided externally.

In addition, in the above-mentioned embodiment, the example in which the high-frequency characteristic inspection device 1 is provided with both the upper surface inspection jig 21 and the upper surface camera 31, and the lower surface inspection jig 22 and the lower surface camera 32 has been described. It is not limited to this, and any one may be provided.

In addition, in the above-mentioned embodiment, the example in which the substrate holder 40 holds the sheet-shaped substrate sheet ST having a plurality of substrates PB has been described, but it is not limited to this, and a single substrate PB may be held. In addition, the substrate holder 40 may hold the substrate sheet ST in a roll state.

In addition, each structure included in the high-frequency characteristic inspection apparatus 1 mentioned above has a computer system inside. In addition, the program for realizing the functions of the components of the above-mentioned high-frequency characteristic inspection device 1 may be recorded in a computer-readable recording medium, so that the computer system can read and execute the program recorded in the recording medium, Thereby, the processing in each structure included in the above-mentioned high-frequency characteristic inspection device 1 is performed. Here, "causing the computer system to read and execute the program recorded in the recording medium" includes installing the program in the computer system. The "computer system" mentioned here includes OS (Operating System, operating system) and hardware such as peripheral devices. In addition, a "computer system" may also include multiple computer devices connected via a network including the Internet, WAN (Wide Area Network, wide area network), LAN (Local Area Network, local area network), dedicated lines, etc. . Also, the so-called "computer-readable recording medium" refers to floppy disks, optical disks, ROM (Read Only Memory, read-only memory), CD-ROM (Compact Disc-Read Only Memory, CD-ROM), etc. Memory devices such as portable media and hard drives built into computer systems. In this way, the program-memorized recording medium may also be a non-transitory recording medium such as CD-ROM.

Moreover, in order to distribute this program, the recording medium which can be accessed from a distribution server and which is installed internally or externally is also included in the recording medium. In addition, the configuration of dividing the program into a plurality of components and downloading them at different points in time and combining them with the components of the high-frequency characteristic inspection device 1, or the delivery server for transmitting each divided program may also be different. . Furthermore, the so-called "computer-readable recording medium" also includes those that retain the program for a certain period of time, such as the server in the case of sending the program through the network, or the volatile memory (RAM) inside the computer system that becomes the client. . In addition, the above-mentioned program may also be used to realize part of the above-mentioned functions. Furthermore, it may be a so-called difference file (difference program) which can realize the above-mentioned function by combining with a program already recorded in the computer system.

In addition, a part or all of the above-mentioned functions may also be implemented in the form of an integrated circuit such as LSI (Large Scale Integration, large scale integrated circuit). Each of the above-mentioned functions may be processed individually, or a part or all of them may be integrated and processed. In addition, the method of forming an integrated circuit is not limited to LSI, and it can also be realized by a dedicated circuit or a general-purpose processor. Also, when an integrated circuit technology that replaces LSI appears due to progress in semiconductor technology, an integrated circuit produced by this technology can also be used.

1: High-frequency characteristic inspection device 2: Network analyzer 10, 11, 12: Inspection probe 20: Inspection jig 21: Upper surface inspection jig 22: Lower surface inspection jig 30: Camera 31: Upper surface camera 32 : Lower surface camera 40: Substrate holder 41: Upper surface inspection jig driving unit 42: Lower surface inspection jig driving unit 43: Substrate holder driving unit 50: Control PCC B1, CB2: Inspection cable F1: Main surface F2: Main surface PB: Substrate ST: Substrate sheet

FIG. 1 is a diagram showing a configuration example of a high-frequency characteristic inspection device according to this embodiment. Fig. 2 is a functional block diagram showing an example of the high-frequency characteristic inspection device of this embodiment. Fig. 3 is a diagram for explaining an example of the moving operation of the inspection jig and the substrate holder of the present embodiment. Fig. 4 is a flowchart showing an example of the operation of the high-frequency characteristic inspection device of this embodiment. Fig. 5 is a flow chart showing another example of the operation of the high-frequency characteristic inspection device of this embodiment.

1: High-frequency characteristic inspection device

2: Network Analyzer

10,11,12: Check the probes

20: Check the jig

21: Upper surface inspection fixture

22: Bottom surface inspection fixture

30: camera

31: Upper surface camera

32: Lower surface camera

40: Substrate holder

50:Control PC

CB1, CB2: Check the cables

F1: main surface

F2: main surface

PB: Substrate

ST: substrate sheet

Claims (8)

A high-frequency characteristic inspection device, which inspects the high-frequency characteristics of a substrate, and includes: a movable inspection jig having a plurality of inspection probes for inspecting the above-mentioned substrate from the main surface side of the above-mentioned substrate; an imaging unit , which photographs the main surface side of the above-mentioned substrate; a substrate holder, which holds the above-mentioned substrate and can move at least parallel to the main surface of the above-mentioned substrate; and a control unit, based on the image captured by the above-mentioned imaging unit, at least The substrate holder moves so that the inspection probes contact the substrate; and the inspection jig includes a first inspection jig disposed on the first main surface side of the substrate, and a first inspection jig disposed on the first main surface side of the above-mentioned substrate. The second inspection fixture on the second main surface side on the opposite side; the imaging unit includes a first imaging unit that captures the substrate pattern on the first main surface side, and a second imaging unit that captures the substrate pattern on the second main surface side. An imaging unit; the second inspection jig can move in parallel; the control unit captures the substrate pattern on the first main surface side through the first imaging unit, and captures the second imaging unit through the second imaging unit. The substrate pattern on the main surface side: based on the substrate pattern captured by the first imaging unit and the second imaging unit, the substrate holder is moved in parallel to position the substrate relative to the inspection jig ; based on the substrate pattern on the second main surface side captured by the second imaging unit, the second inspection jig is moved in parallel to position the second inspection jig relative to the substrate; Move the substrate holder in the vertical direction of the main surface, and make the plurality of inspection probes of the second inspection jig contact the second main surface of the substrate; move the first inspection jig in the vertical direction , and make the plurality of inspection probes of the first inspection jig contact the first main surface of the substrate; inspect the high-frequency characteristics of the substrate from both sides of the substrate. The high-frequency characteristics inspection device according to claim 1, wherein the plurality of inspection jigs are connected to an analysis device for inspecting the high-frequency characteristics of the above-mentioned substrate through inspection cables, and the control unit makes the second inspection jig and the above-mentioned The first inspection jig moves within a range in which the above-mentioned posture change of the inspection cable does not affect the inspection. The high-frequency characteristics inspection device according to claim 1 or 2, wherein the movement amount of the first inspection jig in the vertical direction is 50 mm or less. The high-frequency characteristics inspection device according to claim 1 or 2, wherein the amount of movement of the second inspection jig in the parallel direction is 5 mm or less, and the amount of movement in the angular direction on the surface parallel to the main surface of the substrate is 3 ° (degrees) below. The high-frequency characteristics inspection device according to claim 3, wherein the amount of movement of the second inspection jig in the parallel direction is 5 mm or less, and the amount of movement in the angular direction of the surface parallel to the main surface of the substrate is 3° ( degree) or less. The high-frequency characteristic inspection device as claimed in claim 2, wherein the inspection cable is a coaxial cable. A high-frequency characteristic inspection method, which is a high-frequency characteristic inspection method of a high-frequency characteristic inspection device for inspecting the high-frequency characteristics of a substrate. The high-frequency characteristic inspection device includes: a movable inspection jig, which has a A plurality of inspection probes for inspecting the main surface side of the substrate; an imaging unit that images the main surface side of the substrate; a substrate holder that holds the substrate and can move at least parallel to the main surface of the substrate; and a control unit that moves at least the substrate holder based on the image captured by the imaging unit so that the inspection probes come into contact with the substrate; and the inspection jig includes a The first inspection jig, and the second inspection jig arranged on the second main surface side opposite to the first main surface side; the imaging unit includes a first imaging unit that captures the substrate pattern on the first main surface side part, and the second imaging part for photographing the substrate pattern on the second main surface side; the second inspection jig can move in parallel; and the control part takes pictures of the first main surface side by the first imaging part and the substrate pattern on the second main surface side is photographed by the second imaging unit; based on the substrate pattern photographed by the first imaging unit and the second imaging unit, the substrate holder is placed in the parallel move the substrate relative to the inspection jig; move the second inspection jig in parallel based on the substrate pattern on the second main surface side captured by the second imaging unit, and Carry out the positioning of the above-mentioned second inspection jig relative to the above-mentioned substrate; The substrate holder is moved in the vertical direction of the main surface, and the plurality of inspection probes of the second inspection jig are brought into contact with the substrate; the first inspection jig is moved in the vertical direction, and the first inspection jig is moved in the vertical direction. 1. The plurality of inspection probes of the inspection jig are in contact with the substrate; the inspection of the high-frequency characteristics of the substrate is performed from both sides of the substrate. The high-frequency characteristics inspection method of claim 7, wherein the plurality of inspection jigs are connected to an analysis device for inspecting the high-frequency characteristics of the above-mentioned substrate through inspection cables, and the control unit makes the second inspection jig and the above-mentioned The first inspection jig moves within a range in which the above-mentioned posture change of the inspection cable does not affect the inspection.

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