TWI782543B - Radio-frequency identification (rfid) device thereof - Google Patents

Radio-frequency identification (rfid) device thereof Download PDF

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TWI782543B
TWI782543B TW110118928A TW110118928A TWI782543B TW I782543 B TWI782543 B TW I782543B TW 110118928 A TW110118928 A TW 110118928A TW 110118928 A TW110118928 A TW 110118928A TW I782543 B TWI782543 B TW I782543B
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frequency identification
radio frequency
circuit board
induction coil
protection body
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TW110118928A
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TW202201280A (en
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林連豐
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辰晧電子股份有限公司
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Abstract

The present invention disclosed a radio-frequency identification (RFID) device. The RFID device comprises a protective casing and a RFID circuit unit situated inside the protective casing. The RFID circuit unit comprises a substrate, a microchip disposed on the substrate, and an antenna. A front surface of the substrate faces a top surface of the protective casing; a back surface of the substrate faces a bottom surface of the protective casing. The antenna comprises a first side surface and a second side surface opposing each other, the first side surface faces the top surface of the protective casing, and the second side surface faces the front surface of the substrate. When the protective casing is inserted into an opening of a metal object and having its top surface facing the opening, the sensitivity of the electronic signal can be increased from having the first side surface of the antenna facing the top surface of the protective casing.

Description

射頻識別裝置radio frequency identification device

本發明與射頻識別裝置有關,尤指一種適合安裝於金屬物品的射頻識別裝置。The invention relates to a radio frequency identification device, in particular to a radio frequency identification device suitable for being installed on metal objects.

在將射頻識別標籤(RFID Tag)設置於金屬物品上時所面對的課題之一,是如何降低金屬干擾,或是說如何提昇該射頻識別標籤的電磁信號感應或收發能力。針對這個課題,發明人先前已提出一種可適用於金屬物品的射頻識別裝置,諸如台灣I685287專利及台灣公開第202009796號專利,然而,關於其中的感應線圈對於電磁信號的感應能力或收發能力的提昇,一直是發明人所汲汲追求者。One of the issues faced when placing a radio frequency identification tag (RFID Tag) on a metal object is how to reduce metal interference, or how to improve the electromagnetic signal induction or transceiving capability of the radio frequency identification tag. In response to this subject, the inventor has previously proposed a radio frequency identification device applicable to metal objects, such as Taiwan I685287 patent and Taiwan Publication No. 202009796 patent. , has always been the inventor's pursuit.

本發明提供一種射頻識別裝置,其包括一保護體及位於該保護體內的一射頻識別電路單元。該射頻識別電路單元包括一電路板、及設於該電路板上的一射頻識別晶片與一感應線圈(可視為一天線)。該電路板具有一正面、一背面及相對的一第一側邊與一第二側邊。該電路板的該正面對該保護體的該頂面,該電路板的該背面面對該保護體的該底面,電路板的該第一側邊及第二側邊分別曝露於該保護體的該柱面。該保護體的該柱面還包含一斷裂面,該斷裂面位於該電路板的該第二側邊的上方且鄰近該第二側邊。The invention provides a radio frequency identification device, which includes a protective body and a radio frequency identification circuit unit located in the protective body. The radio frequency identification circuit unit includes a circuit board, and a radio frequency identification chip and an induction coil (which can be regarded as an antenna) arranged on the circuit board. The circuit board has a front side, a back side and a first side and a second side opposite to each other. The front side of the circuit board faces the top surface of the protection body, the back side of the circuit board faces the bottom surface of the protection body, and the first side and the second side of the circuit board are respectively exposed to the protection body the cylinder. The cylindrical surface of the protective body further includes a fracture surface, the fracture surface is located above the second side of the circuit board and adjacent to the second side.

在一實施例中,該感應線圈位於該電路板的該正面,該感應線圈具有相對的一第一側面與一第二側面,且該第一側面面對該保護體的該頂面,該第二側面面對該電路板的該正面。In one embodiment, the induction coil is located on the front side of the circuit board, the induction coil has a first side and a second side opposite to each other, and the first side faces the top surface of the protective body, and the first side faces the top surface of the protection body. The two sides face the front side of the circuit board.

較佳地,該第一側面與該保護體的該頂面之間的間距是小於或等1mm,優選是小於或等0.5mm。Preferably, the distance between the first side and the top surface of the protective body is less than or equal to 1 mm, preferably less than or equal to 0.5 mm.

在一實施例中,本發明之射頻識別裝置的上述保護體包括包覆該射頻識別晶片的一內保護體及包覆該內保護體、該電路板與該感應線圈的一外保護體,且該內保護體的材料為絕緣保護膠,該外保護體的材料為塑膠材料或橡膠材料。In one embodiment, the protection body of the radio frequency identification device of the present invention includes an inner protection body covering the radio frequency identification chip and an outer protection body covering the inner protection body, the circuit board and the induction coil, and The material of the inner protection body is insulating protective glue, and the material of the outer protection body is plastic material or rubber material.

在一實施例中,本發明之射頻識別裝置的上述射頻識別電路單元包括固定於該電路板的該正面的一鐵心,該鐵心包括一中間連接柱及分別連接於該中間連接柱兩端的兩側塊,該感應線圈位於該兩側塊之間且環繞該中間連接柱,且該感應線圈的兩端分別連接到該兩側塊上的焊錫,該鐵心藉由該些焊錫焊接至該電路板的該正面。In one embodiment, the radio frequency identification circuit unit of the radio frequency identification device of the present invention includes an iron core fixed on the front side of the circuit board, the iron core includes an intermediate connecting column and two sides respectively connected to the two ends of the intermediate connecting column block, the induction coil is located between the two side blocks and surrounds the middle connecting column, and the two ends of the induction coil are respectively connected to the solder on the two side blocks, and the iron core is welded to the circuit board by the solder The front.

在一實施例中,本發明之射頻識別裝置的上述感應線圈具有相對的一第三側面及一第四側面,該第三側面鄰接該第一側面,該第二側面鄰接該第三側面且位於該第一側面的對面,該第四側面鄰接該第二側面且位於該第三側面的對面,該第三側面及該第四側面分別面對該保護體的該柱面,其中,該第一側面較該第三側面寬廣。In one embodiment, the induction coil of the radio frequency identification device of the present invention has a third side and a fourth side opposite to each other, the third side is adjacent to the first side, and the second side is adjacent to the third side and is located at Opposite to the first side, the fourth side is adjacent to the second side and opposite to the third side, the third side and the fourth side are respectively facing the cylindrical surface of the protective body, wherein the first The side is wider than the third side.

圖1及圖2顯示本發明之射頻識別裝置的一個較佳實施例,其包括一保護體3及位於保護體3內的一射頻識別電路單元2。保護體3具有一底面30、一頂面31、及位於底面30與頂面31之間的一柱面32。在此實施例中,保護體3的底面30的直徑小於保護體3的頂面31的直徑,且保護體3靠近底面30的部分向下漸縮地形成一圓錐段。FIG. 1 and FIG. 2 show a preferred embodiment of the radio frequency identification device of the present invention, which includes a protective body 3 and a radio frequency identification circuit unit 2 inside the protective body 3 . The protective body 3 has a bottom surface 30 , a top surface 31 , and a cylindrical surface 32 located between the bottom surface 30 and the top surface 31 . In this embodiment, the diameter of the bottom surface 30 of the protection body 3 is smaller than the diameter of the top surface 31 of the protection body 3 , and the portion of the protection body 3 close to the bottom surface 30 tapers downward to form a conical section.

如圖3至圖5所示,射頻識別電路單元2包括一電路板12及一感應線圈21。電路板12具有一正面121、一背面122、及相對的一第一側邊123與一第二側邊124。As shown in FIGS. 3 to 5 , the radio frequency identification circuit unit 2 includes a circuit board 12 and an induction coil 21 . The circuit board 12 has a front side 121 , a back side 122 , and a first side 123 and a second side 124 opposite to each other.

感應線圈21(可視為天線)設於電路板12的正面121,且感應線圈21具有相對的一第一側面211與一第二側面212,及相對的一第三側面213與一第四側面214。第三側面213鄰接第一側面211。第二側面212鄰接第三側面213且位於第一側面211的對面。第四側面214鄰接第二側面212且位於第三側面213的對面。其中,感應線圈21的第一側面211與電路板12的正面121面向同一方向,第三側面213與電路板12的第一側邊123面向同一方向,第二側面212面對電路板12的正面121,第四側面214與電路板12的第二側邊124朝向同一方向。在此實施例中,第一側面211的長寬相等於第二側面212,第三側面213的長寬相等於第四側面214,第三側面213與第一側面211的長度相同,第三側面213的寬度小於第一側面211,換言之,感應線圈21的第一側面211比第三側面213寬廣,也比第四側面214寬廣。The induction coil 21 (which can be regarded as an antenna) is disposed on the front surface 121 of the circuit board 12, and the induction coil 21 has a first side 211 and a second side 212 opposite to each other, and a third side 213 and a fourth side 214 opposite to each other. . The third side 213 is adjacent to the first side 211 . The second side 212 is adjacent to the third side 213 and opposite to the first side 211 . The fourth side 214 is adjacent to the second side 212 and opposite to the third side 213 . Wherein, the first side 211 of the induction coil 21 faces the same direction as the front side 121 of the circuit board 12, the third side 213 faces the same direction as the first side 123 of the circuit board 12, and the second side 212 faces the front side of the circuit board 12 121 , the fourth side 214 faces the same direction as the second side 124 of the circuit board 12 . In this embodiment, the length and width of the first side 211 are equal to the second side 212, the length and width of the third side 213 are equal to the fourth side 214, the third side 213 has the same length as the first side 211, and the third side The width of 213 is smaller than that of the first side 211 , in other words, the first side 211 of the induction coil 21 is wider than the third side 213 and wider than the fourth side 214 .

在此實施例中,如圖3所示,射頻識別電路單元2包括設於電路板12的背面122的一射頻識別晶片22。此外,射頻識別電路單元2可再包括一鐵心23,且如圖2所示,鐵心23設於電路板12的正面121,感應線圈21環繞鐵心23。其中,射頻識別晶片22係為中、高頻段的射頻識別晶片,可選用NXP公司的I-Code-SLI、NTag213、NTag215、NTag216、Mifare等高頻射頻識別晶片、或意法半導體公司(ST)的ST25TV512、ST25TV02K、ST25TV16k等高頻射頻識別晶片、或 Temic公司的 T5777、T5778等低頻射頻識別晶片,EM公司的EM4102 、EM4200、EM4069 等低頻射頻識別晶片,在此實施例中是選擇13.56MHz頻段的高頻射頻識別晶片。In this embodiment, as shown in FIG. 3 , the RFID circuit unit 2 includes an RFID chip 22 disposed on the back surface 122 of the circuit board 12 . In addition, the radio frequency identification circuit unit 2 may further include an iron core 23 , and as shown in FIG. 2 , the iron core 23 is disposed on the front surface 121 of the circuit board 12 , and the induction coil 21 surrounds the iron core 23 . Among them, the radio frequency identification chip 22 is a radio frequency identification chip in the middle and high frequency bands, and high frequency radio frequency identification chips such as NXP's I-Code-SLI, NTag213, NTag215, NTag216, Mifare, or STMicroelectronics (ST) can be selected. ST25TV512, ST25TV02K, ST25TV16k and other high-frequency radio frequency identification chips, or Temic company's T5777, T5778 and other low-frequency radio frequency identification chips, EM company's EM4102, EM4200, EM4069 and other low-frequency radio frequency identification chips, in this embodiment, select the 13.56MHz frequency band high frequency radio frequency identification chips.

在此實施例中,如圖6所示,保護體3還包括包覆射頻識別晶片22的一內保護體300及包覆內保護體300的一外保護體302。內保護體300的材料為絕緣保護膠。外保護體302為非導電性材料,較佳可由塑膠材料或橡膠材料製成,例如以耐熱約攝氏200度的塑膠材料射出成形。在此實施例中,外保護體302的材料可選擇ABS、PP、PE、PPN、添加玻璃纖維的聚酰胺(例如PA6 GF30)......等塑膠材料。In this embodiment, as shown in FIG. 6 , the protection body 3 further includes an inner protection body 300 covering the RFID chip 22 and an outer protection body 302 covering the inner protection body 300 . The material of the inner protective body 300 is insulating protective glue. The outer protective body 302 is made of non-conductive material, preferably made of plastic material or rubber material, such as injection molding of plastic material with a heat resistance of about 200 degrees Celsius. In this embodiment, the material of the outer protective body 302 can be selected from plastic materials such as ABS, PP, PE, PPN, polyamide with glass fiber added (such as PA6 GF30), etc.

再如圖6所示,電路板12的正面121面對保護體3的頂面31,電路板12的背面122面對保護體3的底面30,電路板12的第一側邊123面對保護體3的柱面32,感應線圈21的第一側面211面對保護體3的頂面31,感應線圈21的第二側面212面對電路板12的正面121,感應線圈21的第三側面213及第四側面214分別面對保護體3的柱面32。由於射頻識別電路單元2可水平置放或傾斜置放於保護體3內,故所述的「面對」不限於圖中所示的情況,尚包括「傾斜地面對」。As shown in Figure 6 again, the front side 121 of the circuit board 12 faces the top surface 31 of the protection body 3, the back side 122 of the circuit board 12 faces the bottom surface 30 of the protection body 3, and the first side 123 of the circuit board 12 faces the protection body. The cylindrical surface 32 of the body 3, the first side 211 of the induction coil 21 faces the top surface 31 of the protection body 3, the second side 212 of the induction coil 21 faces the front 121 of the circuit board 12, and the third side 213 of the induction coil 21 and the fourth side 214 respectively face the cylindrical surface 32 of the protective body 3 . Since the RFID circuit unit 2 can be placed horizontally or obliquely in the protective body 3, the "facing" is not limited to the situation shown in the figure, and also includes "facing obliquely".

如圖7及圖8所示,本發明之射頻識別裝置於實際運用時,是被塞入一物品5的一凹洞51內,該物品可具有金屬性表面、也可以是一金屬體,但不以此為限,例如,也可以是木製或塑膠製物品。如此,感應線圈21的第一側面211係面對凹洞51的洞口510,或是說感應線圈21的第一側面211是面對該物品5的外面,使得一射頻識別感應主機6易於感應讀取射頻識別晶片22。在此實施例中,感應線圈21的第一側面211最寬廣且朝向外面,這將提升感應線圈21對電磁波信號的感應能力(或收發能力)。在物品5具有金屬表面或物品5為金屬體的情形下,感應線圈21的感應能力的提昇即相當於金屬干擾減少,可確保射頻識別感應主機6對射頻識別晶片22的正常讀取,降低讀取不到或讀取錯誤的情形。As shown in Figures 7 and 8, the radio frequency identification device of the present invention is inserted into a cavity 51 of an article 5 during actual use. The article may have a metallic surface or be a metal body, but Not limited thereto, for example, wooden or plastic items may also be used. In this way, the first side 211 of the induction coil 21 is facing the opening 510 of the recess 51, or the first side 211 of the induction coil 21 is facing the outside of the article 5, so that an RFID induction host 6 is easy to read by induction. Take the radio frequency identification chip 22. In this embodiment, the first side 211 of the induction coil 21 is the widest and faces outward, which will improve the induction ability (or the ability to send and receive) of the induction coil 21 to electromagnetic wave signals. In the case that the article 5 has a metal surface or the article 5 is a metal body, the improvement of the induction ability of the induction coil 21 is equivalent to the reduction of metal interference, which can ensure the normal reading of the radio frequency identification chip 22 by the radio frequency identification sensing host 6 and reduce the reading rate. Can not get or read the wrong situation.

如圖9所示,一基板1的兩相對邊各凸出多個本發明所述的射頻識別電路單元2。每一個射頻識別電路單元2的電路板12都是基板1的一部分,基板1是以印刷電路板製程來製作的。在圖中的每一塊電路板12都焊接上所述的射頻識別晶片22與鐵心23(已纏繞上感應線圈21)之後,即獲得圖9中所示的基板1。接著,進行一封裝作業,亦即:於射頻識別晶片22上覆蓋絕緣保護膠以形成上述內保護體300,然後,以塑膠射出方式使每一個射頻識別電路單元2分別被塑膠材料包覆住以形成上述的外保護體302,如此,基板1上的每一個射頻識別電路單元2就分別被上述的保護體3所包覆,且如圖10所示,每一個保護體3的柱面32都連接到基板1。然後,將每一個保護體3的電路板12從基板1上斷開,就會獲得多個如圖1及6所示的射頻識別裝置,且每一個射頻識別裝置的電路板12的第二側邊124都會曝露於保護體3的外保護體302的柱面32。As shown in FIG. 9 , a plurality of radio frequency identification circuit units 2 of the present invention protrude from two opposite sides of a substrate 1 . The circuit board 12 of each radio frequency identification circuit unit 2 is a part of the substrate 1, and the substrate 1 is manufactured by a printed circuit board process. After each circuit board 12 in the figure is soldered with the radio frequency identification chip 22 and the iron core 23 (the induction coil 21 has been wound), the substrate 1 shown in FIG. 9 is obtained. Next, perform a packaging operation, that is: cover the insulating protective glue on the RFID chip 22 to form the above-mentioned inner protection body 300, and then make each RFID circuit unit 2 be covered by plastic material by plastic injection. The above-mentioned outer protection body 302 is formed, so that each radio frequency identification circuit unit 2 on the substrate 1 is respectively covered by the above-mentioned protection body 3, and as shown in FIG. 10 , the cylindrical surface 32 of each protection body 3 is Connect to substrate 1. Then, the circuit board 12 of each protective body 3 is disconnected from the substrate 1 to obtain a plurality of radio frequency identification devices as shown in Figures 1 and 6, and the second side of the circuit board 12 of each radio frequency identification device The edges 124 are all exposed to the cylindrical surface 32 of the outer protective body 302 of the protective body 3 .

在此實施例中,鐵心23係為一工字型鐵心,且如圖11所示,鐵心23包括一中間連接柱231及分別連接於中間連接柱231兩端的兩側塊232,感應線圈21位於兩側塊232之間且環繞中間連接柱231,感應線圈21的兩端分別連接到兩側塊232上的焊錫233。鐵心23藉由該些焊錫233焊接至電路板12的正面121上的兩焊墊(圖中未示),以使鐵心23固定於電路板12的正面121,及使感應線圈21電性連接至射頻識別晶片22。In this embodiment, the iron core 23 is an I-shaped iron core, and as shown in FIG. Between the two side blocks 232 and around the middle connecting column 231 , two ends of the induction coil 21 are respectively connected to the solder 233 on the two side blocks 232 . The iron core 23 is welded to two pads (not shown) on the front surface 121 of the circuit board 12 by these solders 233, so that the iron core 23 is fixed on the front surface 121 of the circuit board 12, and the induction coil 21 is electrically connected to the RFID chip 22 .

圖12至圖14顯示本發明之射頻識別裝置的另一較佳實施例,其大致相同於上述實施例中,不同之處在於除了電路板12的第二側邊124曝露於保護體3的柱面32之外,電路板12的第一側邊123也曝露於保護體3的柱面32,這主要是因為該另一較佳實施例所使用的基板1a不同於上述實施例所導致的結果。更詳而言之,如圖15及圖16所示,基板1a是以印刷電路板製程來製作的,每一個射頻識別電路單元2的電路板12都是基板1的一部分。其中,基板1a包括一中間板111a、分別位於中間板111a兩相邊的兩側板112a、多根連接中間板111a與其中一側板112a的第一連接桿113a、及多根連接中間板111a與另一側板112a的第二連接桿114a,每一第一連接桿113a各具有一較寬部分作為電路板12,每一第二連接桿114a亦各具有一較寬部分作為電路板12。每一電路板12的正面及背面分別設置一個上述鐵心23及一個上述射頻識別晶片22,每一鐵心23均纏繞一個上述感應線圈21。如此,每一個電路板12及位於其上的感應線圈21、射頻識別晶片22與鐵心23就構成一個射頻識別電路單元2。接著,於每一射頻識別晶片22上覆蓋絕緣保護膠以形成上述內保護體300,然後,以塑膠射出方式使每一個射頻識別電路單元2分別被塑膠材料包覆住以形成上述的外保護體302,如此,基板1a上的每一個射頻識別電路單元2就分別被上述的保護體3所包覆,且如圖17所示,每一個保護體3的柱面32都連接到基板1a。然後,將每一個電路板12從基板1a上斷開,就會獲得多個如圖12至圖14所示的射頻識別裝置,且每一個射頻識別裝置的電路板12的第一側邊123與第二側邊124都會曝露於保護體3的柱面32。12 to 14 show another preferred embodiment of the radio frequency identification device of the present invention, which is substantially the same as the above-mentioned embodiment, except that the second side 124 of the circuit board 12 is exposed to the post of the protective body 3 In addition to the surface 32, the first side 123 of the circuit board 12 is also exposed to the cylindrical surface 32 of the protective body 3, which is mainly because the substrate 1a used in this another preferred embodiment is different from the result of the above-mentioned embodiment. . More specifically, as shown in FIG. 15 and FIG. 16 , the substrate 1 a is manufactured by a printed circuit board process, and the circuit board 12 of each RFID circuit unit 2 is a part of the substrate 1 . Wherein, the base plate 1a includes a middle board 111a, two side boards 112a respectively located on the two phase sides of the middle board 111a, a plurality of first connecting rods 113a connecting the middle board 111a and one side board 112a, and a plurality of connecting rods 113a connecting the middle board 111a and the other side boards. Each of the first connecting rods 113a of the second connecting rods 114a of the side plate 112a has a wider portion serving as the circuit board 12 , and each of the second connecting rods 114a also has a wider portion serving as the circuit board 12 . The front and back of each circuit board 12 are respectively provided with a core 23 and a radio frequency identification chip 22 , and each core 23 is wound with an induction coil 21 . In this way, each circuit board 12 and the induction coil 21 , the RFID chip 22 and the core 23 on the circuit board 12 constitute a radio frequency identification circuit unit 2 . Next, each radio frequency identification chip 22 is covered with insulating protective glue to form the above-mentioned inner protection body 300, and then, each radio frequency identification circuit unit 2 is respectively covered by plastic material by plastic injection to form the above-mentioned outer protection body 302. In this way, each radio frequency identification circuit unit 2 on the substrate 1a is respectively covered by the above-mentioned protection body 3, and as shown in FIG. 17 , the cylinder surface 32 of each protection body 3 is connected to the substrate 1a. Then, each circuit board 12 is disconnected from the substrate 1a to obtain a plurality of radio frequency identification devices as shown in FIGS. The second sides 124 are all exposed to the cylindrical surface 32 of the protective body 3 .

在該另一實施例中,在射出成形每一個外保護體302的同時,還以該塑膠材料一併成形一骨架303,以使每一個外保護體302都連接到骨架303。每一個電路板12從基板1a上斷開時,每一個外保護體302也一併從骨架303斷開,使得每一個保護體3上留下一個斷裂面304,斷裂面304 位於電路板12的第二側邊214的上方且鄰近第二側邊214。In this another embodiment, when each outer protective body 302 is injection-molded, a frame 303 is also molded from the plastic material, so that each outer protective body 302 is connected to the frame 303 . When each circuit board 12 is disconnected from the substrate 1a, each outer protective body 302 is also disconnected from the skeleton 303, so that a fracture surface 304 is left on each protective body 3, and the fracture surface 304 is located on the side of the circuit board 12. Above and adjacent to the second side 214 .

基板1a的上述配置,可確保電路板12在上述射出成形過程中不會發生歪斜,茲說明如后:已配置上述射頻識別電路單元2的基板1a被放入一塑膠射出模具(圖中未示)之後,中間板111a及兩側板112a會被該塑膠射出模具合模後的上模塊與下模塊夾住,故基板1a此時被平穩地保持在一水平狀態。在熔融的塑膠材料被注入該塑膠射出模具之後,該熔融的塑膠材料會從基板1a的透孔305進入,並沿著該塑膠射出模具的內部流道流入每一個模窩內,每一個模窩是用來對應形成每一個外保護體302的外形。完成前述塑膠射出程序之後,就能從該塑膠射出模具取出已連接多個保護體3的基板1a,一如圖17所示,其中,每一骨架303的形狀是由該塑膠射出模具的內部流道造成的,且每一骨架303各連接四個保護體3,但不以此為限。The above-mentioned configuration of the substrate 1a can ensure that the circuit board 12 will not be skewed during the above-mentioned injection molding process, and it will be explained as follows: the substrate 1a configured with the above-mentioned radio frequency identification circuit unit 2 is put into a plastic injection mold (not shown in the figure) ), the middle plate 111a and the side plates 112a will be clamped by the upper module and the lower module after the plastic injection mold is closed, so the base plate 1a is stably kept in a horizontal state at this time. After the molten plastic material is injected into the plastic injection mold, the molten plastic material will enter from the through hole 305 of the substrate 1a, and flow into each mold cavity along the internal flow channel of the plastic injection mold, and each mold cavity It is used to form the shape of each outer protective body 302 correspondingly. After the aforementioned plastic injection procedure is completed, the substrate 1a connected with multiple protective bodies 3 can be taken out from the plastic injection mold, as shown in Figure 17, wherein the shape of each skeleton 303 is determined by the internal flow of the plastic injection mold Road, and each frame 303 is connected to four protective bodies 3, but not limited thereto.

此外,為了讓感應線圈21具有較佳的電磁波感應能力(或信號收發能力),感應線圈21的第一側面211(亦即頂面)與保護體3的頂面31之間的間距G是小於或等1mm,較佳是小於或等於0.5mm。In addition, in order to allow the induction coil 21 to have better electromagnetic wave induction capability (or signal transceiving capability), the distance G between the first side 211 (that is, the top surface) of the induction coil 21 and the top surface 31 of the protection body 3 is less than Or equal to 1mm, preferably less than or equal to 0.5mm.

1:基板 12:電路板 121:正面 122:背面 123:第一側邊 124:第二側邊 2:射頻識別電路單元 21:感應線圈 22:射頻識別晶片 23:鐵心 211:第一側面 212:第二側面 213:第三側面 214:第四側面 231:中間連接柱 232:側塊 233:焊錫 3:保護體 30:底面 300:內保護體 302:外保護體 303:骨架 304:斷裂面 305:透孔 31:頂面 32:柱面 5:物品 51:凹洞 510:洞口 6:射頻識別感應主機 1a:基板 111a:中間板 112a:側板 113a:第一連接桿 114a:第二連接桿1: Substrate 12: Circuit board 121: front 122: back 123: First side 124: second side 2: RFID circuit unit 21: induction coil 22: RFID chip 23: iron core 211: first side 212: second side 213: The third side 214: The fourth side 231: Intermediate connecting column 232: side block 233: Solder 3: Protector 30: bottom surface 300: inner protective body 302: Outer protective body 303: skeleton 304: fracture surface 305: through hole 31: top surface 32: Cylinder 5: Items 51: pit 510: hole 6: RFID sensing host 1a: Substrate 111a: middle plate 112a: side panel 113a: the first connecting rod 114a: the second connecting rod

圖1顯示本發明射頻識別裝置的一個較佳實施例的立體圖。 圖2顯示本發明該較佳實施例的俯視圖。 圖3顯示本發明該較佳實施例的射頻識別電路單元的立體圖。 圖4顯示本發明該射頻識別電路單元的後視圖。 圖5顯示本發明該射頻識別電路單元的另一立體圖 圖6顯示本發明該較佳實施例的A-A斷面圖。 圖7及圖8顯示本發明該較佳實施例使用於一金屬製物品的情形。 圖9及圖10顯示本發明用於製作該較佳實施例的一基板及其在一封裝作業前、後所呈現的狀態。 圖11顯示本發明該較佳實施例的鐵心與感應線圈的仰視圖。 圖12顯示本發明射頻識別裝置的另一較佳實施例的立體圖。 圖13顯示本發明該另一較佳實施例的俯視圖。 圖14顯示本發明該另一較佳實施例的B-B斷面圖。 圖15至圖17用於說明該另一較佳實施例的製造過程。Fig. 1 shows a perspective view of a preferred embodiment of the radio frequency identification device of the present invention. Figure 2 shows a top view of the preferred embodiment of the present invention. FIG. 3 shows a perspective view of the radio frequency identification circuit unit of the preferred embodiment of the present invention. FIG. 4 shows the rear view of the radio frequency identification circuit unit of the present invention. Fig. 5 shows another perspective view of the radio frequency identification circuit unit of the present invention Fig. 6 shows the A-A sectional view of the preferred embodiment of the present invention. FIG. 7 and FIG. 8 show the application of the preferred embodiment of the present invention to a metal object. 9 and 10 show a substrate used to fabricate the preferred embodiment of the present invention and its state before and after a packaging operation. Fig. 11 shows a bottom view of the iron core and the induction coil of the preferred embodiment of the present invention. FIG. 12 shows a perspective view of another preferred embodiment of the radio frequency identification device of the present invention. Fig. 13 shows a top view of another preferred embodiment of the present invention. Fig. 14 shows a B-B sectional view of another preferred embodiment of the present invention. 15 to 17 are used to illustrate the manufacturing process of this other preferred embodiment.

12:電路板12: Circuit board

121:正面121: front

123:第一側邊123: First side

124:第二側邊124: second side

2:射頻識別電路單元2: RFID circuit unit

3:保護體3: Protector

30:底面30: bottom surface

31:頂面31: top surface

Claims (10)

一種射頻識別裝置,包括:一保護體,具有一頂面、一底面、及位於該頂面與該底面之間的一柱面;及一射頻識別電路單元,位於該保護體內且包括一電路板、及設於該電路板上的一射頻識別晶片與一天線,該電路板具有一正面、一背面及相對的一第一側邊與一第二側邊,該電路板的該正面面對該保護體的該頂面,該電路板的該背面面對該保護體的該底面,該電路板的該第一側邊及第二側邊分別曝露於該保護體的該柱面;其中,該天線係為一感應線圈,該感應線圈位於該電路板的該正面,該感應線圈具有相對的一第一側面與一第二側面,且該第一側面面對該保護體的該頂面,該第二側面面對該電路板的該正面;該保護體的該柱面還包含一斷裂面,該斷裂面位於該電路板的該第二側邊的上方且鄰近該第二側邊。 A radio frequency identification device, comprising: a protection body having a top surface, a bottom surface, and a cylinder between the top surface and the bottom surface; and a radio frequency identification circuit unit located in the protection body and including a circuit board , and a radio frequency identification chip and an antenna arranged on the circuit board, the circuit board has a front side, a back side and an opposite first side and a second side, the front side of the circuit board faces the The top surface of the protection body, the back surface of the circuit board faces the bottom surface of the protection body, the first side and the second side of the circuit board are respectively exposed to the cylindrical surface of the protection body; wherein, the The antenna is an induction coil, the induction coil is located on the front side of the circuit board, the induction coil has a first side and a second side opposite to each other, and the first side faces the top surface of the protective body, the The second side faces the front side of the circuit board; the cylindrical surface of the protective body further includes a fracture surface, the fracture surface is located above the second side of the circuit board and adjacent to the second side. 如請求項1所述的射頻識別裝置,其中該感應線圈還具有相對的一第三側面及一第四側面,該第三側面鄰接該第一側面,該第二側面鄰接該第三側面且位於該第一側面的對面,該第四側面鄰接該第二側面且位於該第三側面的對面,該第三側面及該第四側面分別面對該保護體的該柱面,其中,該第一側面較該第三側面寬廣。 The radio frequency identification device as claimed in claim 1, wherein the induction coil also has a third side and a fourth side opposite to each other, the third side is adjacent to the first side, and the second side is adjacent to the third side and is located at Opposite to the first side, the fourth side is adjacent to the second side and opposite to the third side, the third side and the fourth side are respectively facing the cylindrical surface of the protective body, wherein the first The side is wider than the third side. 如請求項1所述的射頻識別裝置,其中該感應線圈的該第一側面與該保護體的該頂面之間的間距是小於或等1mm。 The radio frequency identification device as claimed in claim 1, wherein the distance between the first side surface of the induction coil and the top surface of the protection body is less than or equal to 1mm. 如請求項1所述的射頻識別裝置,其中該感應線圈的該第一側面與該保護體的該頂面之間的間距是小於或等0.5mm。 The radio frequency identification device as claimed in claim 1, wherein the distance between the first side surface of the induction coil and the top surface of the protection body is less than or equal to 0.5mm. 如請求項1所述的射頻識別裝置,其中該保護體包括包覆該射頻識別晶片的一內保護體及包覆該內保護體、該電路板與該天線的一外保護體,且該內保護體的材料為絕緣保護膠,該外保護體的材料為塑膠材料或橡膠材料。 The radio frequency identification device as claimed in claim 1, wherein the protection body includes an inner protection body covering the radio frequency identification chip and an outer protection body covering the inner protection body, the circuit board and the antenna, and the inner protection body The material of the protective body is insulating protective glue, and the material of the outer protective body is plastic material or rubber material. 如請求項1至5任一項所述的射頻識別裝置,其中該射頻識別電路單元包括固定於該電路板的該正面的一鐵心,該鐵心包括一中間連接柱及分別連接於該中間連接柱兩端的兩側塊,該感應線圈位於該兩側塊之間且環繞該中間連接柱,且該感應線圈的兩端分別連接到該兩側塊上的焊錫,該鐵心藉由該些焊錫焊接至該電路板的該正面。 The radio frequency identification device as described in any one of claims 1 to 5, wherein the radio frequency identification circuit unit includes an iron core fixed on the front side of the circuit board, the iron core includes an intermediate connecting column and is respectively connected to the intermediate connecting column Two side blocks at both ends, the induction coil is located between the two side blocks and surrounds the middle connecting column, and the two ends of the induction coil are respectively connected to the solder on the two side blocks, and the iron core is welded to the the front side of the circuit board. 如請求項1至5所述的射頻識別裝置,其中該射頻識別電路單元包括固定於該電路板的該正面的一鐵心,該感應線圈環繞該鐵心。 The radio frequency identification device as claimed in claims 1 to 5, wherein the radio frequency identification circuit unit includes an iron core fixed on the front surface of the circuit board, and the induction coil surrounds the iron core. 如請求項1所述的射頻識別裝置,其中該保護體的該底面的直徑小於該保護體的該頂面的直徑,且該保護體 靠近該底面的部分向下漸縮地形成一圓錐段,該射頻識別電路單元全部位於該圓錐段的上方。 The radio frequency identification device as claimed in claim 1, wherein the diameter of the bottom surface of the protection body is smaller than the diameter of the top surface of the protection body, and the protection body The portion close to the bottom surface tapers downward to form a conical section, and the radio frequency identification circuit unit is all located above the conical section. 一種射頻識別裝置,包括:一保護體,具有一底面、一頂面、及位於該底面與該頂面之間的一柱面,當該保護體被塞入一物品的一凹洞內時,該保護體的該頂面係被曝露於該凹洞的一洞口,且該保護體的該底面與該柱面均被埋入於該凹洞內;一鐵心,位於該保護體內,且該鐵心面對該頂面之面的面積,大於該鐵心面對該柱面之面的面積;及一天線,位於該保護體內,且環繞該鐵心。 A radio frequency identification device, comprising: a protective body having a bottom surface, a top surface, and a cylindrical surface between the bottom surface and the top surface, when the protective body is inserted into a cavity of an article, The top surface of the protective body is exposed at an opening of the concave cavity, and the bottom surface and the cylindrical surface of the protective body are buried in the concave cavity; an iron core is located in the protective body, and the iron core The area of the surface facing the top surface is larger than the area of the surface of the iron core facing the cylindrical surface; and an antenna is located in the protection body and surrounds the iron core. 如請求項9所述的射頻識別裝置,其中該天線係為一感應線圈,該感應線圈具有面對該保護體的該頂面的一第一側面、相對於該第一側面的一第二側面、面對該保護體的該柱面的一第三側面、及相對於該第三側面的一第四側面,該第一側面的面積大於該第三側面的面積。 The radio frequency identification device as claimed in item 9, wherein the antenna is an induction coil, the induction coil has a first side facing the top surface of the protective body, and a second side opposite to the first side , a third side facing the cylindrical surface of the protective body, and a fourth side opposite to the third side, the area of the first side is larger than the area of the third side.
TW110118928A 2020-06-18 2020-06-18 Radio-frequency identification (rfid) device thereof TWI782543B (en)

Priority Applications (1)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6897827B2 (en) * 2000-07-17 2005-05-24 Hanex Co., Ltd. Installation structure for RFID tag, method for installing RFID tag, and communication using such RFID tag
TWM385757U (en) * 2009-12-25 2010-08-01 Claridy Solutions Inc Device containing radio frequency identification and anti-counterfeit functions
TW202009796A (en) * 2018-08-21 2020-03-01 辰晧電子股份有限公司 Radio frequency identification electronic device and method thereof, and article using the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6897827B2 (en) * 2000-07-17 2005-05-24 Hanex Co., Ltd. Installation structure for RFID tag, method for installing RFID tag, and communication using such RFID tag
TWM385757U (en) * 2009-12-25 2010-08-01 Claridy Solutions Inc Device containing radio frequency identification and anti-counterfeit functions
TW202009796A (en) * 2018-08-21 2020-03-01 辰晧電子股份有限公司 Radio frequency identification electronic device and method thereof, and article using the same

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