CN114897122A - Manufacturing method of high-temperature-resistant electronic tag - Google Patents
Manufacturing method of high-temperature-resistant electronic tag Download PDFInfo
- Publication number
- CN114897122A CN114897122A CN202210596795.1A CN202210596795A CN114897122A CN 114897122 A CN114897122 A CN 114897122A CN 202210596795 A CN202210596795 A CN 202210596795A CN 114897122 A CN114897122 A CN 114897122A
- Authority
- CN
- China
- Prior art keywords
- groove
- sealant layer
- sealant
- antenna
- electronic tag
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/0773—Physical layout of the record carrier the record carrier comprising means to protect itself against external heat sources
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2113/00—Details relating to the application field
- G06F2113/18—Chip packaging
Abstract
The invention relates to the technical field of electronic tags, and discloses a manufacturing method of a high-temperature-resistant electronic tag.A first sealing adhesive layer, a second sealing adhesive layer and a third sealing adhesive layer with sequentially reduced melting points are arranged above a radio frequency chip of the manufactured electronic tag, and the lowest melting point of the sealing adhesive layer is not lower than 230 ℃.
Description
Technical Field
The invention relates to the technical field of electronic tags, in particular to a manufacturing method of a high-temperature-resistant electronic tag.
Background
At present, electronic tags are widely applied to various fields such as product anti-counterfeiting, product production line management, warehouse management, asset management, electric power, railways, traffic, logistics, medical treatment and the like, and traceability of products is realized by acquiring data of the electronic tags.
Most of common electronic tags are formed by arranging an antenna and welding a radio frequency identification chip on the surface of a substrate board, and if the radio frequency identification chip is packaged by a patch, a patch bonding pad is arranged on the surface of the substrate board; and then, packaging the substrate board by using glue, so that the finally manufactured electronic tag has certain high temperature resistance. When the electronic tag with the structure is continuously located in a high-temperature environment, such as logistics storage, industrial production line heavy asset management, production link, product life cycle tracking and other scenes of severe environments existing in heavy industries of automobiles, high-speed rails, shipbuilding, aircraft manufacturing and the like, as the temperature reaches more than 200 ℃, glue for packaging is easily changed into liquid, a bonding pad welded with the radio frequency identification chip on the substrate board can be melted, and in addition, the radio frequency identification chip is only welded on the surface of the substrate board, and positioning or limiting measures are lacked, finally, the liquidity of the liquid glue can drive the radio frequency identification chip to be far away from the initial welding position, and further the performance of the electronic tag is influenced.
Disclosure of Invention
In view of the defects of the background art, the invention provides a method for manufacturing a high-temperature-resistant electronic tag, and aims to solve the technical problem that the high-temperature-resistant performance of the existing electronic tag is poor, and when the existing electronic tag is continuously applied to a high-temperature environment of more than 200 ℃, a radio frequency chip of the electronic tag is easy to deviate from an initial welding position, so that the performance of the electronic tag is influenced.
In order to solve the technical problems, the invention provides the following technical scheme: the manufacturing method of the high-temperature-resistant electronic tag comprises the following steps:
s1: providing a base material plate, wherein the top of the base material plate is inwards provided with a groove;
s2: printing a first antenna on a top surface of the substrate board in a partial region on a left side of the groove, a left side wall of the groove, and a left region on a bottom surface of the groove; printing a second antenna on the bottom surface of the substrate board, a partial region of the right side surface of the substrate board, a partial region on the top surface of the substrate board on the right side of the groove, the right side wall of the groove, and the right region on the bottom surface of the groove; the first antenna and the second antenna on the bottom surface of the groove form a feed port;
s3: welding a radio frequency chip and the feed port through a welding process so as to electrically connect the first antenna and the second antenna with the radio frequency chip;
s4: filling a first sealant into the groove, and then curing the first sealant to form a first sealant layer, wherein the first sealant layer covers the radio frequency chip, the first antenna on the bottom surface of the groove and the second antenna on the bottom surface of the groove, and the first sealant layer is higher than the radio frequency chip.
As a further technical scheme, the method also comprises the following steps:
s5: providing a bottom cover, wherein a first groove is formed in the top surface of the bottom cover inwards, and a second groove is formed in the bottom surface of the first groove inwards;
s6: firstly, placing the substrate board on which the first sealing glue layer is manufactured into a second groove, then filling a second sealing glue into the second groove, and finally curing the second sealing glue to form a second sealing glue layer;
s7: filling a third sealant into the first groove, and then curing the third sealant to form a third sealant layer;
s8: and providing a top cover, and hermetically connecting the top cover and the bottom cover.
Furthermore, the melting point of the first sealant layer is greater than that of the second sealant layer, and the melting point of the second sealant layer is greater than that of the third sealant layer.
Further, the melting point of the third sealant layer is greater than 230 degrees.
Further, the bottom cap is hermetically coupled with the top cap by ultrasonic waves or an integrated injection molding process in step S8.
Further, the top surface of the first sealant layer manufactured in step S4 is flush with the entrance surface of the groove, or the top of the first sealant layer manufactured in step S4 is lower than the entrance surface of the groove;
the top surface of the second sealing adhesive layer is flush with the inlet surface of the second groove, and the top surface of the third sealing adhesive layer is flush with the inlet surface of the first groove.
When the top surface of the first sealant layer manufactured in step S4 is lower than the entrance surface of the groove, the second sealant is further filled into the upper region of the first sealant layer in the groove in step S6.
Compared with the prior art, the invention has the beneficial effects that:
1. the first sealing adhesive layer, the second sealing adhesive layer and the third sealing adhesive layer with the melting points sequentially reduced are arranged above the radio frequency chip of the electronic tag manufactured by the invention, and the melting point of the lowest sealing adhesive layer is not lower than 230 ℃, so that when the electronic tag manufactured by the invention is continuously applied to a high-temperature environment of 230 ℃ or above, even if the third sealing adhesive layer and the second sealing adhesive layer are melted and flow, the first sealing adhesive layer is not melted, the damage and impact of heat conduction and high temperature on the radio frequency chip are avoided, and the radio frequency chip can be prevented from falling off due to the fact that the first sealing adhesive layer is still solid, and the problem that the performance of the tag is invalid or seriously weakened due to high temperature is avoided;
2. even if the first sealing adhesive layer melts under the condition of extreme high temperature, the flowing first sealing adhesive layer causes the radio frequency chip to start to displace, but the radio frequency chip is still connected with the feed port at the bottom of the groove, namely electrically connected with the first antenna and the second antenna, so that the radio frequency performance of the electronic tag is ensured to be normal;
3. the bottom cover and the top cover of the electronic tag manufactured by the method are hermetically connected, so that the electronic tag can be waterproof and dustproof;
4. the substrate board of the electronic tag manufactured by the method is covered and protected by the second sealing adhesive layer and the third sealing adhesive layer, and the electronic tag is good in shock resistance.
Drawings
FIG. 1 is a flow chart of the present invention;
FIG. 2 is a schematic structural view of a substrate sheet of the present invention;
FIG. 3 is a schematic diagram of the structure of the first antenna and the second antenna of the present invention;
FIG. 4 is a schematic diagram of the connection between the first antenna, the second antenna and the RF chip according to the present invention;
FIG. 5 is a schematic view of the bottom cover of the present invention;
FIG. 6 is a schematic view of the substrate plate of the present invention being placed in the third recess of the bottom cover;
FIG. 7 is a schematic structural view of the bottom cover and the top cover after being hermetically connected in the embodiment;
FIG. 8 is a schematic view of a first arrangement of a first sealant layer, a second sealant layer, and a third sealant layer in an embodiment;
FIG. 9 is a schematic view of a second arrangement of the first, second, and third sealant layers in an embodiment;
FIG. 10 is a simulation diagram of the RFID tag of the present invention placed on a metal carrier S11;
FIG. 11 is a schematic diagram of a standing-wave ratio simulation of the RFID tag of the present invention placed on a metal carrier;
FIG. 12 is a schematic diagram showing the simulation of the impedance of the RFID tag of the present invention placed on a metal carrier;
FIG. 13 is a simulation diagram of the RFID tag of the present invention placed on a non-metal carrier in S11;
fig. 14 is a schematic diagram of VSWR simulation of the RFID tag of the present invention placed on a non-metal carrier.
Detailed Description
The present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams each illustrating the basic structure of the present invention only in a schematic manner, and thus show only the constitution related to the present invention.
As shown in fig. 1, the method for manufacturing the high-temperature resistant electronic tag includes the following steps:
s1: providing a substrate plate 1, wherein the top of the substrate plate 1 is inwards provided with a groove 2;
the structure of the substrate plate 1 is schematically shown in fig. 2, the top of the substrate plate in fig. 2 is provided with a groove 2 inwards, the length, width and height of the groove 2 are respectively 2.5mm, 2.5mm and 1.0mm, wherein the substrate plate 1 is made of a ceramic plate. In one embodiment, the substrate board 1 may also be made of other materials according to the requirement of manufacturing the electronic tag or the requirement of manufacturing the circuit board, for example, the substrate board 1 is made of teflon and rogers FR4 board. In one embodiment, the top surface of the substrate board 1 may be provided with a plurality of recesses 2 formed therein for receiving different IC chips.
S2: printing a first antenna 3 on a partial region on the left side of the groove 2 on the top surface of the substrate board 1, a left side wall of the groove 2, and a left region on the bottom surface of the groove 2; printing a second antenna 3 on the bottom surface of the substrate board 1, a partial region of the right side surface of the substrate board 1, a partial region on the top surface of the substrate board 1 on the right side of the groove 2, the right side wall of the groove 2, and the right region on the bottom surface of the groove 2; the first antenna 3 and the second antenna 4 on the bottom surface of the groove 2 form a feed port;
specifically, as shown in fig. 3 and 4, the first antenna 3 includes a first horizontal portion 30, a first vertical portion 31, and a second horizontal portion 32, the first horizontal portion 30 is printed on a partial area on the top surface of the substrate board 1 on the left side of the recess 2, and the width of the first horizontal portion 30 is the same as the width of the substrate board 1; the first vertical portion 31 is printed on the left side wall of the groove 2, and the first vertical portion 31 spreads over the entire left side wall of the groove 2; the second horizontal part 32 is printed on the bottom surface of the groove 2 on a partial area on the left side of the radio frequency chip 5, and the width of the second horizontal part 32 is smaller than that of the groove 2;
the second antenna 4 includes a third horizontal portion 40, a second vertical portion 41, a fourth horizontal portion 42, a third vertical portion 43, and a fifth horizontal portion 44, the third horizontal portion 40 is printed on the bottom surface of the substrate board 1 and spreads over the entire bottom surface of the substrate board 1, the second vertical portion 41 is printed on a partial region of the right side surface of the substrate board 1, the fourth horizontal portion 42 is printed on a partial region on the top surface of the substrate board 1 on the right side of the groove 2, the third vertical portion 43 is printed on the right side wall of the groove 2 and spreads over the entire right side wall of the groove 2, the fifth horizontal portion 44 is printed on a partial region on the bottom surface of the groove 2 on the right side of the rf chip 5, and the width of the fifth horizontal portion 44 is smaller than the width of the groove 2.
S3: welding the radio frequency chip 5 with the feed port by a welding process so as to electrically connect the first antenna 3 and the second antenna 4 with the radio frequency chip 5;
s4: first sealant is filled in the groove 2, then the first sealant is cured to form a first sealant layer 100, the first sealant layer 100 covers the radio frequency chip 5, the first antenna 3 on the bottom surface of the groove 2 and the second antenna 4 on the bottom surface of the groove 2, and the first sealant layer 100 is higher than the radio frequency chip 5.
During actual manufacturing, the first sealant layer 100 may be formed in the entire groove 2, and at this time, the top surface of the first sealant layer 100 is flush with the inlet surface of the groove 2; or forming the first sealant layer 100 in the recess 2 in a part of the space above the rf chip 5, where the top surface of the first sealant layer 100 is lower than the inlet surface of the recess 2;
in practical use, since the length, width and height of the main stream rf chip 5 are 2.0mm, 2.0mm and 0.5mm, respectively, the electronic tag manufactured in steps S1 to S4 of the present invention is manufactured by welding the rf chip 5 inside the groove 2, and when the electronic tag manufactured by the method of the present invention is located in a high temperature environment, even if the first sealant layer 100 melts, the groove 2 limits the position of the rf chip 5, which can still ensure that the rf chip 5 is connected to the feed port, thereby ensuring that the electronic tag can normally operate.
Furthermore, in order to enhance the shock resistance of the electronic tag manufactured by the method, reduce the production cost and improve the finished product quantity, the method also comprises the following steps:
s5: providing a bottom cover 6, wherein a first groove 60 is formed inwards on the top surface of the bottom cover 6, and a second groove 61 is formed inwards on the bottom surface of the first groove 60;
wherein the structure diagram of the bottom cover 6 is shown in fig. 5, and in addition, the structure diagram in fig. 6 further includes the top cover 7 used in step S8;
s6: firstly, placing the substrate plate 1 on which the first sealing adhesive layer 100 is manufactured into the second groove 61, then filling a second sealing adhesive into the second groove 61, and finally curing the second sealing adhesive to form a second sealing adhesive layer;
specifically, after the first sealant layer 100 is formed in the entire space in the groove 2, the step S6 forms the second sealant layer 101 only in the second groove 61; when the first sealant layer 100 is formed in the space above the rf chip 5 in the groove 2, step S6 further fills the second sealant into the groove 2 in the area where the first sealant layer 100 is not formed, and then manufactures the second sealant layer in the area where the first sealant layer 100 is not formed in the groove 2; the top surface of the second sealant layer 101 is flush with the inlet surface of the second groove 61;
s7: filling a third sealant into the first groove 60, and then curing the third sealant to form a third sealant layer 102;
in particular, the top surface of the third layer of sealant 102 is flush with the inlet face of the first groove 60;
fig. 8 and 9 show two schematic structural diagrams of the first sealant layer 100, the second sealant layer 101 and the third sealant layer 102 of the electronic tag manufactured according to the present invention; in fig. 8, the first sealant layer 100 is formed in the whole of the recess 2, in fig. 9, the first sealant layer 100 is formed in the recess 2 in a partial region above the rf chip 5, and the second sealant layer 101 is formed in the second recess 61 and in the recess 2 in a space where the first sealant layer 100 is not formed;
in this embodiment, the melting point of the first sealant layer 100 is greater than the melting point of the second sealant layer 101, and the melting point of the second sealant layer 101 is greater than the melting point of the third sealant layer 102. The melting point of the third sealant layer 102 is not less than 230 ℃. In actual use, the first sealant layer 100, the second sealant layer 101, and the third sealant layer 102 can all adopt epoxy resins with different melting points;
in actual manufacturing, the higher the melting point of the sealing glue layer is, the higher the corresponding price cost is, the higher the curing temperature required by the sealing glue is, the longer the curing time is, and the higher the curing temperature is and the longer the curing time is, the influence on the shape structure of the bottom modification can be influenced, so that the bottom cover is easily bulged and the like; by manufacturing the first sealing adhesive layer 100, the second sealing adhesive layer 101 and the third sealing adhesive layer 102 with sequentially reduced melting points, the invention can reduce the production cost for manufacturing the electronic tag, and on the other hand, the melting point of the sealing glue is reduced, the curing temperature and time are both reduced, and the influence of the curing of the sealing glue on the bottom cover 6 can be reduced; in addition, the base material plate 1 is placed in the second groove 61, and then the second sealing glue layer 101 and the third sealing glue layer 102 are used for curing and protecting the base material plate, so that the shock resistance of the electronic tag manufactured by the method can be improved;
s8: providing a top cover 7, and hermetically connecting the top cover 6 with the bottom cover 7;
specifically, the bottom cover 6 is hermetically connected to the top cover 7 by ultrasonic waves or an integral injection molding process in step S8.
In summary, the electronic tag manufactured by the invention adopts the first sealant layer 100, the second sealant layer 101 and the third sealant layer 102 with different melting points to cure and protect the radio frequency chip 5, and the melting point of the lowest sealant layer is not lower than 230 degrees, when the electronic tag manufactured by the invention is continuously applied in a high-temperature environment of 230 degrees and above, even if the third sealant layer 102 and the second sealant layer 101 are melted and flow, the first sealant layer 100 is not melted, thereby avoiding the damage and impact of heat conduction and high temperature to the radio frequency chip 5, and because the first sealant layer 100 is still solid, the radio frequency chip 5 can be prevented from falling off, and the problem that the performance of the tag is invalid or seriously weakened due to high temperature is avoided;
secondly, by limiting the position of the radio frequency chip 5 by the groove 2, even if the first sealing adhesive layer 100 melts under the condition of extreme high temperature, the flowing first sealing adhesive layer 100 causes the radio frequency chip 5 to start to displace, but the radio frequency chip 5 is still connected with the bottom of the groove 2, namely a feed area, under the limitation of the groove 2, so that the radio frequency performance of the electronic tag is ensured to be normal;
in addition, the bottom cover 6 is hermetically connected with the top cover 7, so that the electronic tag can be waterproof and dustproof;
finally, the substrate board 1 is covered and protected by the first sealing adhesive layer 100, the second sealing adhesive layer 101 and the third sealing adhesive layer 102, and the electronic tag manufactured by the method is good in shock resistance.
In this embodiment, the model of the rf chip 5 is ali-HIGGS 8, the typical value of the equivalent input parallel capacitance is 0.85Pf, the typical value of the equivalent input parallel resistance is 2500.00ohm, and the input impedance is calculated as: 16-j202 ohm @920Mhz, the impedance values are input by combining the structures of the first antenna 3 and the second antenna 4, the RFID electronic tag is placed in the engineering plastic box body, the box body is placed on a 150x150 mm metal plate, the schematic diagrams are shown in fig. 9, fig. 10 and fig. 11 through simulation, the schematic diagrams can be obtained from fig. 9, fig. 10 and fig. 11, the S11 value of the RFID electronic tag reaches-35 db when the RFID electronic tag is around 920Mhz, the standing wave ratio is less than 1.1, the impedance matching reaches 16.07+ j212.7ohm (no further optimization is performed under the condition that mass production is not affected), in addition, the gain value is about 3.7e +000, conjugate matching is realized, the radio frequency chip 5 can be started at the farthest distance of 10M through professional data exchange equipment in actual production and testing, the remote identification and the remote data acquisition and interaction effects of the internet of things are achieved. Meanwhile, the RFID electronic tag is subjected to drop test, and drops at any angle from a position 1.5 meters away from the cement ground, so that the appearance and the radio frequency performance of the RFID electronic tag are not changed, and the anti-seismic and anti-drop effects are realized.
Further, the 150X150 metal plate is removed, so that the RFID electronic tag is subjected to a simulation test in the air (a non-metal environment carrier), and a simulation schematic diagram thereof is shown in fig. 12 and fig. 13, which can be obtained from fig. 12 and fig. 13, after the metal plate carrier is removed, the frequency of the RFID electronic tag still reaches a sensitivity value below-30 db within about 906Mhz (the middle american frequency range 902-.
According to the simulation test result, the RFID electronic tag can realize the excellent characteristics of reading and data interaction regardless of being applied to a metal carrier or a nonmetal carrier, gets rid of the limitation of the carriers such as metal, nonmetal and the like on the radio frequency characteristics of the carriers, and realizes the characteristic of multi-adaptability.
In light of the foregoing, it is to be understood that various changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.
Claims (7)
1. The manufacturing method of the high-temperature-resistant electronic tag is characterized by comprising the following steps of:
s1: providing a base material plate, wherein the top of the base material plate is inwards provided with a groove;
s2: printing a first antenna on a top surface of the substrate board in a partial region on a left side of the groove, a left side wall of the groove, and a left region on a bottom surface of the groove; printing a second antenna on the bottom surface of the substrate board, a partial region of the right side surface of the substrate board, a partial region on the top surface of the substrate board on the right side of the groove, the right side wall of the groove, and the right region on the bottom surface of the groove; the first antenna and the second antenna on the bottom surface of the groove form a feed port;
s3: welding a radio frequency chip and the feed port through a welding process so as to electrically connect the first antenna and the second antenna with the radio frequency chip;
s4: filling a first sealant into the groove, and then curing the first sealant to form a first sealant layer, wherein the first sealant layer covers the radio frequency chip, the first antenna on the bottom surface of the groove and the second antenna on the bottom surface of the groove, and the first sealant layer is higher than the radio frequency chip.
2. The method for manufacturing the high-temperature-resistant electronic tag according to claim 1, further comprising the following steps:
s5: providing a bottom cover, wherein a first groove is formed in the top surface of the bottom cover inwards, and a second groove is formed in the bottom surface of the first groove inwards;
s6: firstly, placing the substrate board on which the first sealing glue layer is manufactured into a second groove, then filling a second sealing glue into the second groove, and finally curing the second sealing glue to form a second sealing glue layer;
s7: filling a third sealant into the first groove, and then curing the third sealant to form a third sealant layer;
s8: and providing a top cover, and hermetically connecting the top cover and the bottom cover.
3. The method for manufacturing a high temperature resistant electronic tag according to claim 2, wherein the melting point of the first sealant layer is greater than the melting point of the second sealant layer, and the melting point of the second sealant layer is greater than the melting point of the third sealant layer.
4. The method for manufacturing a high temperature resistant electronic tag according to claim 2, wherein the melting point of the third sealant layer is greater than 230 ℃.
5. The method of claim 2, wherein the bottom cover and the top cover are hermetically connected by ultrasonic waves or an integral injection molding process in step S8.
6. The method of claim 2, wherein the top surface of the first sealant layer manufactured in step S4 is flush with the entrance surface of the groove, or the top surface of the first sealant layer manufactured in step S4 is lower than the entrance surface of the groove;
the top surface of the second sealing adhesive layer is flush with the inlet surface of the second groove, and the top surface of the third sealing adhesive layer is flush with the inlet surface of the first groove.
7. The method as claimed in claim 6, wherein when the top surface of the first sealant layer manufactured in step S4 is lower than the entrance surface of the groove, the second sealant is further filled into the groove in step S6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210596795.1A CN114897122A (en) | 2022-05-30 | 2022-05-30 | Manufacturing method of high-temperature-resistant electronic tag |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210596795.1A CN114897122A (en) | 2022-05-30 | 2022-05-30 | Manufacturing method of high-temperature-resistant electronic tag |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114897122A true CN114897122A (en) | 2022-08-12 |
Family
ID=82725220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210596795.1A Pending CN114897122A (en) | 2022-05-30 | 2022-05-30 | Manufacturing method of high-temperature-resistant electronic tag |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114897122A (en) |
-
2022
- 2022-05-30 CN CN202210596795.1A patent/CN114897122A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8248240B2 (en) | RFID tag and manufacturing method thereof | |
| US9092712B2 (en) | Embedded high frequency RFID | |
| CN102709260B (en) | Semiconductor packaging structure | |
| CN208141425U (en) | Component built-in device and RFID tag | |
| US8546927B2 (en) | RFIC chip mounting structure | |
| CN107535046A (en) | Radio-frequency module | |
| CN106203607A (en) | A kind of tire implanted electronic tag and packaging technology | |
| US20110169115A1 (en) | Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products | |
| US20090014527A1 (en) | Ask-026 | |
| CN103094463A (en) | Package structure and method for manufacturing the same | |
| KR20140053116A (en) | Hybrid contact/contactless integrated circuit card, the strength of the electronic module of which is reinforced | |
| KR101007415B1 (en) | Method of producing electronic apparatus | |
| CN106447014A (en) | High-temperature-resistant tag and application thereof | |
| CN102629337A (en) | Micro intelligent label | |
| CN114897122A (en) | Manufacturing method of high-temperature-resistant electronic tag | |
| JP6367661B2 (en) | IC module | |
| CN103020696A (en) | Electronic tag manufacturing method | |
| CN102663486A (en) | Miniature intelligent label | |
| CN206301366U (en) | A kind of high temperature resistant labels | |
| CN105956652B (en) | Smart card and manufacturing method thereof | |
| CN213934947U (en) | Miniature electronic label | |
| CN102244989B (en) | Printed circuit board (PCB) with built-in antenna with radio frequency identification tag and manufacturing method thereof | |
| CN102376012B (en) | A kind of double-interface smart card | |
| US20110226860A1 (en) | Printed circuit board with antenna for rfid chip and method for manufacturing the same | |
| CN105956653B (en) | Smart card and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |