TW202201280A - Radio-frequency identification (rfid) device thereof - Google Patents

Abstract

The present invention disclosed a radio-frequency identification (RFID) device. The RFID device comprises a protective casing and a RFID circuit unit situated inside the protective casing. The RFID circuit unit comprises a substrate, a microchip disposed on the substrate, and an antenna. A front surface of the substrate faces a top surface of the protective casing; a back surface of the substrate faces a bottom surface of the protective casing. The antenna comprises a first side surface and a second side surface opposing each other, the first side surface faces the top surface of the protective casing, and the second side surface faces the front surface of the substrate. When the protective casing is inserted into an opening of a metal object and having its top surface facing the opening, the sensitivity of the electronic signal can be increased from having the first side surface of the antenna facing the top surface of the protective casing.

Description

radio frequency identification device

The present invention relates to a radio frequency identification device, in particular to a radio frequency identification device suitable for being installed on metal objects.

One of the challenges faced when installing an RFID tag on a metal object is how to reduce metal interference, or how to improve the electromagnetic signal sensing or transceiving capability of the RFID tag. In response to this subject, the inventor has previously proposed a radio frequency identification device suitable for metal objects, such as Taiwan I685287 Patent and Taiwan Publication No. 202009796 Patent, however, regarding the improvement of the induction coil's inductive ability or the ability to send and receive electromagnetic signals , has always been the pursuer of the inventor.

The invention provides a radio frequency identification device, which includes a protection body and a radio frequency identification circuit unit located in the protection body. The RFID circuit unit includes a circuit board, a RFID chip and an induction coil (can be regarded as an antenna) on the circuit board. The circuit board has a front side, a back side, and a first side and a second side opposite to each other. The front surface of the circuit board faces the top surface of the protector, the back surface of the circuit board faces the bottom surface of the protector, and the first side and the second side of the circuit board are respectively exposed to the protective body. the cylinder. The cylindrical surface of the protection body further includes a fracture surface, and the fracture surface is located above the second side edge of the circuit board and is adjacent to the second side edge.

In one embodiment, the induction coil is located on the front surface of the circuit board, the induction coil has a first side surface and a second side surface opposite to each other, and the first side surface faces the top surface of the protective body, and the first side surface faces the top surface of the protection body. The two sides face the front side of the circuit board.

Preferably, the distance between the first side surface and the top surface of the protective body is less than or equal to 1 mm, preferably less than or equal to 0.5 mm.

In one embodiment, the protection body of the RFID device of the present invention includes an inner protection body covering the RFID chip and an outer protection body covering the inner protection body, the circuit board and the induction coil, and The material of the inner protective body is insulating protective glue, and the material of the outer protective body is plastic material or rubber material.

In one embodiment, the above-mentioned RFID circuit unit of the RFID device of the present invention includes an iron core fixed on the front surface of the circuit board, the iron core includes a middle connecting column and two sides respectively connected to both ends of the middle connecting column. block, the induction coil is located between the two side blocks and surrounds the middle connecting column, and the two ends of the induction coil are respectively connected to the solder on the two side blocks, and the iron core is welded to the circuit board by the solder. the front.

In one embodiment, the induction coil of the RFID device of the present invention has a third side surface and a fourth side surface opposite to each other, the third side surface is adjacent to the first side surface, and the second side surface is adjacent to the third side surface and located at the opposite side. Opposite to the first side surface, the fourth side surface is adjacent to the second side surface and located opposite to the third side surface, the third side surface and the fourth side surface respectively face the cylindrical surface of the protector, wherein the first side surface is The side surface is wider than the third side surface.

FIG. 1 and FIG. 2 show a preferred embodiment of the RFID device of the present invention, which includes a protective body 3 and a RFID circuit unit 2 located in the protective body 3 . The protection body 3 has a bottom surface 30 , a top surface 31 , and a cylindrical surface 32 located between the bottom surface 30 and the top surface 31 . In this embodiment, the diameter of the bottom surface 30 of the protective body 3 is smaller than the diameter of the top surface 31 of the protective body 3 , and the portion of the protective body 3 close to the bottom surface 30 tapers downward to form a conical section.

As shown in FIG. 3 to FIG. 5 , the RFID circuit unit 2 includes a circuit board 12 and an induction coil 21 . The circuit board 12 has a front side 121 , a back side 122 , and a first side 123 and a second side 124 opposite to each other.

The induction coil 21 (can be regarded as an antenna) is disposed on the front surface 121 of the circuit board 12 , and the induction coil 21 has a first side 211 and a second side 212 opposite, and a third side 213 and a fourth side 214 opposite. . The third side surface 213 is adjacent to the first side surface 211 . The second side surface 212 is adjacent to the third side surface 213 and is located opposite to the first side surface 211 . The fourth side surface 214 is adjacent to the second side surface 212 and is located opposite to the third side surface 213 . The first side 211 of the induction coil 21 faces the same direction as the front side 121 of the circuit board 12 , the third side 213 faces the same direction as the first side 123 of the circuit board 12 , and the second side 212 faces the front side of the circuit board 12 121, the fourth side 214 and the second side 124 of the circuit board 12 face the same direction. In this embodiment, the length and width of the first side 211 are equal to the length and width of the second side 212, the length and width of the third side 213 are equal to the fourth side 214, the length of the third side 213 and the first side 211 are the same, and the third side 213 has the same length as the first side 211. The width of 213 is smaller than that of the first side surface 211 , in other words, the first side surface 211 of the induction coil 21 is wider than the third side surface 213 and also wider than the fourth side surface 214 .

In this embodiment, as shown in FIG. 3 , the RFID circuit unit 2 includes a RFID chip 22 disposed on the back surface 122 of the circuit board 12 . In addition, the RFID circuit unit 2 may further include an iron core 23 , and as shown in FIG. 2 , the iron core 23 is disposed on the front surface 121 of the circuit board 12 , and the induction coil 21 surrounds the iron core 23 . Among them, the RFID chip 22 is a mid- and high-frequency RFID chip, which can be selected from NXP's I-Code-SLI, NTag213, NTag215, NTag216, Mifare and other high-frequency RFID chips, or STMicroelectronics (ST) ST25TV512, ST25TV02K, ST25TV16k and other high-frequency RFID chips, or Temic's T5777, T5778 and other low-frequency RFID chips, EM's EM4102, EM4200, EM4069 and other low-frequency RFID chips, in this embodiment, the 13.56MHz frequency band is selected HF RFID chip.

In this embodiment, as shown in FIG. 6 , the protection body 3 further includes an inner protection body 300 covering the RFID chip 22 and an outer protection body 302 covering the inner protection body 300 . The material of the inner protective body 300 is insulating protective glue. The outer protective body 302 is a non-conductive material, preferably made of plastic material or rubber material, for example, injection molding of plastic material with a heat resistance of about 200 degrees Celsius. In this embodiment, the material of the outer protective body 302 can be selected from plastic materials such as ABS, PP, PE, PPN, polyamide (eg, PA6 GF30) with glass fiber added.

As shown in FIG. 6 , the front surface 121 of the circuit board 12 faces the top surface 31 of the protective body 3 , the back surface 122 of the circuit board 12 faces the bottom surface 30 of the protective body 3 , and the first side 123 of the circuit board 12 faces the protective body 3 . The cylindrical surface 32 of the body 3, the first side 211 of the induction coil 21 faces the top surface 31 of the protection body 3, the second side 212 of the induction coil 21 faces the front surface 121 of the circuit board 12, and the third side 213 of the induction coil 21 and the fourth side surface 214 respectively face the cylindrical surface 32 of the protection body 3 . Since the RFID circuit unit 2 can be placed in the protective body 3 horizontally or obliquely, the "facing" is not limited to the situation shown in the figure, but also includes "facing on an inclined plane".

As shown in FIG. 7 and FIG. 8 , the RFID device of the present invention is inserted into a cavity 51 of an object 5 during practical use. The object may have a metallic surface or a metal body, but Not limited to this, for example, it can also be a wooden or plastic item. In this way, the first side 211 of the induction coil 21 faces the opening 510 of the cavity 51, or the first side 211 of the induction coil 21 faces the outside of the article 5, so that a RFID induction host 6 is easy to read by induction Take the RFID chip 22. In this embodiment, the first side surface 211 of the induction coil 21 is the widest and faces outward, which will improve the induction capability (or transceiving capability) of the induction coil 21 to electromagnetic wave signals. In the case where the article 5 has a metal surface or the article 5 is a metal body, the improvement of the inductive capability of the induction coil 21 is equivalent to the reduction of metal interference, which can ensure the normal reading of the RFID chip 22 by the RFID induction host 6, and reduce the read Can not get or read the wrong situation.

As shown in FIG. 9 , two opposite sides of a substrate 1 protrude a plurality of RFID circuit units 2 according to the present invention. The circuit board 12 of each RFID circuit unit 2 is a part of the substrate 1 , and the substrate 1 is manufactured by a printed circuit board process. After each circuit board 12 in the figure is soldered with the RFID chip 22 and the iron core 23 (the induction coil 21 has been wound around), the substrate 1 shown in FIG. 9 is obtained. Next, a packaging operation is performed, that is: covering the RFID chip 22 with insulating protective glue to form the inner protection body 300 , and then, each RFID circuit unit 2 is covered with plastic material by plastic injection. The above-mentioned outer protective body 302 is formed. In this way, each RFID circuit unit 2 on the substrate 1 is respectively covered by the above-mentioned protective body 3, and as shown in FIG. 10, the cylindrical surface 32 of each protective body 3 is Connect to substrate 1. Then, the circuit board 12 of each protective body 3 is disconnected from the substrate 1 to obtain a plurality of RFID devices as shown in FIGS. 1 and 6 , and the second side of the circuit board 12 of each RFID device is obtained. Both edges 124 are exposed to the cylindrical surface 32 of the outer protective body 302 of the protective body 3 .

In this embodiment, the iron core 23 is an I-shaped iron core, and as shown in FIG. 11 , the iron core 23 includes a middle connecting column 231 and two side blocks 232 respectively connected to both ends of the middle connecting column 231 . The induction coil 21 is located at Between the two side blocks 232 and surrounding the middle connecting column 231 , the two ends of the induction coil 21 are respectively connected to the solder 233 on the two side blocks 232 . The iron core 23 is soldered to two pads (not shown) on the front surface 121 of the circuit board 12 by the solders 233, so that the iron core 23 is fixed on the front surface 121 of the circuit board 12, and the induction coil 21 is electrically connected to the front surface 121 of the circuit board 12. RFID chip 22 .

12 to 14 show another preferred embodiment of the RFID device of the present invention, which is substantially the same as the above-mentioned embodiment, except that the second side 124 of the circuit board 12 is exposed to the posts of the protective body 3 In addition to the surface 32, the first side 123 of the circuit board 12 is also exposed to the cylindrical surface 32 of the protective body 3, which is mainly because the substrate 1a used in this other preferred embodiment is different from the above-mentioned embodiment. . More specifically, as shown in FIG. 15 and FIG. 16 , the substrate 1 a is fabricated by a printed circuit board process, and the circuit board 12 of each RFID circuit unit 2 is a part of the substrate 1 . The base plate 1a includes a middle plate 111a, two side plates 112a located on opposite sides of the middle plate 111a, a plurality of first connecting rods 113a connecting the middle plate 111a and one of the side plates 112a, and a plurality of first connecting rods 113a connecting the middle plate 111a and the other side plates 111a. For the second connecting rods 114a of the side plate 112a, each first connecting rod 113a has a wider portion serving as the circuit board 12, and each second connecting rod 114a also has a wider portion serving as the circuit board 12. The iron core 23 and the RFID chip 22 are respectively disposed on the front side and the back side of each circuit board 12 , and the induction coil 21 is wound around each iron core 23 . In this way, each circuit board 12 and the induction coil 21 , the RFID chip 22 and the iron core 23 located thereon constitute a RFID circuit unit 2 . Next, cover each RFID chip 22 with insulating protective glue to form the above-mentioned inner protective body 300 , and then, by plastic injection, each RFID circuit unit 2 is respectively covered with plastic material to form the above-mentioned outer protective body 302, in this way, each RFID circuit unit 2 on the substrate 1a is respectively covered by the above-mentioned protective body 3, and as shown in FIG. 17, the cylindrical surface 32 of each protective body 3 is connected to the substrate 1a. Then, by disconnecting each circuit board 12 from the substrate 1a, a plurality of RFID devices as shown in FIG. 12 to FIG. 14 are obtained, and the first side 123 of the circuit board 12 of each RFID device is connected to the The second side edges 124 are all exposed to the cylindrical surface 32 of the protection body 3 .

In this other embodiment, when each outer protection body 302 is injection-molded, a frame 303 is also formed with the plastic material, so that each outer protection body 302 is connected to the frame 303 . When each circuit board 12 is disconnected from the substrate 1a, each outer protection body 302 is also disconnected from the skeleton 303, so that each protection body 3 leaves a fracture surface 304, and the fracture surface 304 is located on the side of the circuit board 12. Above the second side edge 214 and adjacent to the second side edge 214 .

The above-mentioned configuration of the substrate 1a can ensure that the circuit board 12 will not be skewed during the above-mentioned injection molding process. It will be explained as follows: the substrate 1a on which the above-mentioned RFID circuit unit 2 has been arranged is placed into a plastic injection mold (not shown in the figure). ), the middle plate 111a and the side plates 112a will be clamped by the upper and lower modules after the plastic injection mold is closed, so the substrate 1a is stably maintained in a horizontal state at this time. After the molten plastic material is injected into the plastic injection mold, the molten plastic material will enter from the through hole 305 of the substrate 1a, and flow into each mold cavity along the internal flow channel of the plastic injection mold. It is used to form the shape of each outer protection body 302 correspondingly. After completing the aforementioned plastic injection process, the substrate 1a connected with the plurality of protective bodies 3 can be taken out from the plastic injection mold, as shown in FIG. 17 , wherein the shape of each frame 303 is determined by the internal flow of the plastic injection mold. and each frame 303 is connected to four protection bodies 3, but not limited thereto.

In addition, in order for the induction coil 21 to have better electromagnetic wave induction capability (or signal transmission and reception capability), the distance G between the first side surface 211 (ie the top surface) of the induction coil 21 and the top surface 31 of the protective body 3 is less than or equal to 1mm, preferably less than or equal to 0.5mm.

1: Substrate 12: circuit board 121: front 122: Back 123: First side 124: Second side 2: RFID circuit unit 21: Induction coil 22: RFID chip 23: Iron Heart 211: The first side 212: Second side 213: Third side 214: Fourth side 231: Intermediate connecting column 232: Side Block 233: Solder 3: Protector 30: Bottom surface 300: Inner Protector 302: Outer Protector 303: Skeleton 304: Fracture Surface 305: Through hole 31: Top surface 32: Cylinder 5: Items 51: Hole 510: hole 6: RFID induction host 1a: Substrate 111a: Intermediate plate 112a: Side panels 113a: The first connecting rod 114a: Second connecting rod

FIG. 1 shows a perspective view of a preferred embodiment of the radio frequency identification device of the present invention. Figure 2 shows a top view of the preferred embodiment of the present invention. FIG. 3 shows a perspective view of the RFID circuit unit of the preferred embodiment of the present invention. FIG. 4 shows a rear view of the RFID circuit unit of the present invention. FIG. 5 shows another perspective view of the RFID circuit unit of the present invention Figure 6 shows the A-A sectional view of the preferred embodiment of the present invention. FIG. 7 and FIG. 8 show the case where the preferred embodiment of the present invention is applied to a metal article. FIG. 9 and FIG. 10 show a substrate used for fabricating the preferred embodiment of the present invention and its state before and after a packaging operation. FIG. 11 shows a bottom view of the iron core and the induction coil of the preferred embodiment of the present invention. FIG. 12 shows a perspective view of another preferred embodiment of the radio frequency identification device of the present invention. Figure 13 shows a top view of the other preferred embodiment of the present invention. FIG. 14 shows a B-B sectional view of the other preferred embodiment of the present invention. 15 to 17 are used to illustrate the manufacturing process of the other preferred embodiment.

12: circuit board

121: front

123: First side

124: Second side

2: RFID circuit unit

3: Protector

30: Bottom surface

31: Top surface

Claims (8)

A radio frequency identification device, comprising: a protective body having a top surface, a bottom surface, and a cylindrical surface between the top surface and the bottom surface; and A RFID circuit unit, located in the protective body and including a circuit board, a RFID chip and an antenna mounted on the circuit board, the circuit board has a front side, a back side and an opposite first side and a second side, the front side of the circuit board faces the top surface of the protector, the back side of the circuit board faces the bottom surface of the protector, the first side and the second side of the circuit board The sides are respectively exposed to the cylindrical surface of the protective body; Wherein, the cylindrical surface of the protective body further includes a fracture surface, and the fracture surface is located above the second side edge of the circuit board and is adjacent to the second side edge. The RFID device of claim 1, wherein the antenna is an induction coil, the induction coil is located on the front surface of the circuit board, the induction coil has a first side and a second side opposite, and the first side is One side faces the top surface of the protector, and the second side faces the front surface of the circuit board. The radio frequency identification device according to claim 2, wherein the distance between the first side surface of the induction coil and the top surface of the protective body is less than or equal to 1 mm. The RFID device of claim 2, wherein the distance between the first side surface of the induction coil and the top surface of the protective body is less than or equal to 0.5mm. The radio frequency identification device as claimed in claim 1, wherein the protection body comprises an inner protection body covering the RFID chip and an outer protection body covering the inner protection body, the circuit board and the antenna, and the inner protection body The material of the protective body is insulating protective glue, and the material of the outer protective body is plastic material or rubber material. The radio frequency identification device according to any one of claims 2 to 4, wherein the radio frequency identification circuit unit includes an iron core fixed on the front surface of the circuit board, the iron core includes an intermediate connecting column and is respectively connected to the intermediate connecting column Two side blocks at both ends, the induction coil is located between the two side blocks and surrounds the middle connecting column, and both ends of the induction coil are respectively connected to the solder on the two side blocks, and the iron core is welded to the iron core by the solder. the front side of the circuit board. The RFID device as claimed in claim 6, wherein the induction coil has a third side and a fourth side opposite to each other, the third side is adjacent to the first side, and the second side is adjacent to the third side and located at the Opposite to the first side surface, the fourth side surface is adjacent to the second side surface and is located opposite to the third side surface, the third side surface and the fourth side surface respectively face the cylindrical surface of the protector, wherein the first side surface wider than the third side. The radio frequency identification device as claimed in claim 1, wherein the diameter of the bottom surface of the protective body is smaller than the diameter of the top surface of the protective body, and a portion of the protective body close to the bottom surface tapers downward to form a conical segment, The RFID circuit units are all located above the conical section.

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