KR100831403B1 - Method for manufacturing contactless card - Google Patents

Abstract

According to the present invention, an insertion groove forming step of forming an insertion groove in the portion where the chip of the substrate is to be inserted; A chip insertion step of inserting and fixing a chip in the insertion groove of the substrate; An antenna forming step of forming an antenna pattern and a connection pattern connecting both terminals of the chip with the antenna pattern by printing conductive ink on the upper surface of the substrate; And a cover sheet forming step of stacking cover sheets on upper and lower surfaces of the substrate on which the antenna pattern is formed, respectively. According to the disclosed contactless card manufacturing method, as a noncontact card is manufactured using a single-chip unpacked state, damage or destruction of the chip may be reduced, and manufacturing cost and maintenance cost may be reduced.

Contactless Card, RFID, Antenna, Chip, Conductive Ink

Description

Method for manufacturing contactless card

1 is a flowchart of a contactless card manufacturing method according to an embodiment of the present invention;

2a and 2b are a cross-sectional view and a perspective view of the manufacturing step of FIG.

3 is a flowchart of a method of manufacturing a contactless card according to another embodiment of the present invention;

4a and 4b are a cross-sectional view and a perspective view of the manufacturing step of FIG.

5 is a schematic perspective view of a contactless card according to the present invention.

<Explanation of symbols for the main parts of the drawings>

110 ... substrate 111 ... insertion groove

120 Chip 121 Terminal

131 Antenna pattern 132,232 Connection pattern

140 ... Cover Sheet 150 ... Adhesive

160 ... protective layer 270 ... contact

The present invention relates to a method for manufacturing a contactless card, and more particularly, to a method for manufacturing an RFID card, that is, a non-contact card, capable of radio frequency identification (RFID).

In general, the contactless card refers to a card reader and a wireless communication system installed separately from the outside, that is, a traffic card, a library card to communicate in a non-contact manner, and an antenna for wireless communication and an IC chip connected to the antenna are embedded therein. Therefore, wireless authentication of the processing target is possible.

Conventionally, a packaging chip in which a small unitary chip is separately packed is used as a chip embedded in the contactless card, and the contactless card is separately purchased, imported, or manufactured by itself, and then connected to an antenna and bonding. It can be prepared as.

Here, the packaging chip has the advantage of adding convenience to the connection process between the antennas by packing the small piece of chip, while the manufacturing cost is increased as well as the packing process according to the packing of the piece of chip As the thickness of the chip increases, the packaging chip may be damaged or destroyed during the lamination process to which the outer cover sheet is attached or during use of the finished card.

Frequent damage of the packaging chip has a problem that can increase the manufacturing cost of the contactless card and increase the maintenance cost of the manufactured card.

In addition, when damage occurs to a packing portion of the packaging chip during bonding with the antenna, the undamaged single-chip inside the packaging chip may not be recycled.

The present invention was created to solve the above-described problems, and as a result of manufacturing a non-contact card using a single chip in an unpacked state, as well as a problem of damage or destruction of an internal chip, as well as a reduction in manufacturing cost and maintenance cost. It is an object of the present invention to provide a method for manufacturing a contactless card.

Other objects and advantages of the invention will be described below and will be appreciated by the embodiments of the invention. Furthermore, the objects and advantages of the present invention can be realized by means and combinations indicated in the claims.

Non-contact card manufacturing method according to an embodiment of the present invention for achieving the above object, the insertion groove forming step of forming an insertion groove in the portion where the chip of the substrate is to be inserted; A chip insertion step of inserting and fixing a chip into an insertion groove of the substrate; An antenna forming step of printing a conductive ink on the upper surface of the substrate to form an antenna pattern and a connection pattern connecting the antenna pattern and both terminals of the chip; And a cover sheet forming step of stacking cover sheets on upper and lower surfaces of the substrate on which the antenna pattern is formed.

In addition, the chip insertion step, a method of fixing the chip by applying an adhesive to the insertion groove may be applied.

In addition, the insertion groove may be formed to a depth corresponding to the thickness of the chip.

In addition, after the antenna forming step, a protective layer forming step of forming a protective layer by applying a non-conductive ink on the upper surface of the chip including the connection pattern may be further included.

On the other hand, a non-contact card manufacturing method according to another embodiment of the present invention for achieving the above object, the antenna forming step of forming an antenna pattern and a connection pattern connected to the antenna pattern by printing a conductive ink on the upper surface of the substrate; An insertion groove forming step of forming an insertion groove at a substantially center portion of the connection pattern of the substrate to separate the connection pattern into a pair of connection patterns; A chip insertion step of inserting and fixing a chip into an insertion groove of the substrate; A contact portion connecting step of connecting a contact portion between both terminals of the inserted chip and the pair of connection patterns by printing with conductive ink; And a cover sheet forming step of stacking cover sheets on upper and lower surfaces of the substrate to which the contact parts are connected.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms or words used in the specification and claims should not be construed as having a conventional or dictionary meaning, and the inventors should properly explain the concept of terms in order to best explain their own invention. It should be interpreted as meanings and concepts corresponding to the technical idea of the present invention based on the principle of definition.

Therefore, the embodiments described in the specification and the drawings shown in the drawings are only the most preferred embodiment of the present invention and do not represent all of the technical idea of the present invention, various modifications that can be replaced at the time of the present application It should be understood that there may be equivalents and variations.

1 is a flow chart of a contactless card manufacturing method according to an embodiment of the present invention, Figures 2a and 2b is a sectional view and a perspective view of the manufacturing step of Figure 1, Figure 3 is a contactless card manufacturing method according to another embodiment of the present invention 4A and 4B are cross-sectional and perspective views of the manufacturing step of FIG. 3, and FIG. 5 is a schematic perspective view of a contactless card according to the present invention.

The present invention relates to a non-contact card manufacturing method using a single piece of chip (hereinafter, chip) in an unpacked state.

Hereinafter, a method of manufacturing a contactless card according to an embodiment of the present invention will be described with reference to FIGS. 1 to 2B.

First, the insertion groove 111 is formed in a portion where the chip 120 of the substrate 110 is inserted (S100).

Here, the insertion groove 111 has a depth corresponding to the thickness of the chip 120 so that the chip 120 is stably protected while the thickness change of the substrate 110 according to the insertion of the chip 120 is minimized. It is preferable to form.

After the insertion groove forming step (S100), the chip 120 is inserted and fixed into the insertion groove 111 of the substrate 110 (S110).

In the chip insertion step (S110), the chip 120 may be stably fixed by applying an adhesive 150 to the insertion groove 111 so as to prevent external detachment of the inserted chip 120. .

Next, after the chip insertion step (S110), the conductive pattern is printed on the upper surface of the substrate 110 to form the antenna pattern 131, the antenna pattern 131, and both terminals 121 of the chip 120. As the connection pattern 132 for connecting is formed, an antenna is formed on the upper surface of the substrate 110 (S120).

The antenna forming step (S120) includes a process of forming an antenna pattern 131 for wireless communication with an external card reader and a connection pattern 132 for interconnecting the chip 120 and the antenna pattern 131.

That is, according to the antenna forming step (S120), as the antenna pattern 131 and the connection pattern 132 are formed by printing conductive ink on the substrate 110, antenna formation and between the antenna and the chip 120 are performed. The connection process can be done at one time.

On the other hand, the antenna forming method through the printing of the conductive ink as in the present invention can simplify the manufacturing process and reduce the manufacturing cost compared to the conventional copper foil etching method.

After the antenna forming step (S120), the cover sheet 140 is formed on each of the upper and lower surfaces of the substrate 110 on which the antenna pattern 131 is formed (S140).

The cover sheet 140 is made of a hard sheet so that not only the chip 120 inserted into the substrate 110 but also the upper and lower surfaces of the substrate 110 on which the antenna pattern 131 is formed are stably protected from the outside. Preferably, as shown in FIG. 5, the cover sheet 140 may be formed with various printed matters to beautify the appearance or to indicate the purpose of the card to be manufactured.

On the other hand, after the antenna forming step (S120), the protective layer forming step of forming a protective layer 160 by applying a non-conductive non-conductive ink on the upper surface of the chip 120 including the connection pattern 132 ( S130 may further include.

Here, the protective layer 160 is preferably formed by applying a non-conductive ink to prevent a short circuit between the terminals 121 of the chip 120.

According to the protective layer 160, the chip 120 and the antenna as applied to the portion of the connection pattern 132 for connecting between the chip 120 and the antenna pattern 131 and the upper surface of the chip 120 In addition to strengthening the fixing force of the connection between the pattern 131, it is possible to reduce the problem of cracking, damage or breakage of the connection by the external impact.

Hereinafter, a method of manufacturing a contactless card according to another embodiment of the present invention will be described with reference to FIGS. 3 to 4B.

First, an antenna is formed on the top surface of the substrate 110 by printing conductive ink on the top surface of the substrate 110 to form the antenna pattern 131 and the connection pattern 232 connected to the antenna pattern 131 (S200). . Here, the connection pattern 232 is a portion to be connected between the antenna pattern 131 and the chip 120 later.

After the antenna forming step (S200), the insertion groove 111 is formed in a substantially central portion of the connection pattern 232 of the substrate 110 to separate the connection pattern 232 into a pair of connection patterns 232. (S210).

The pair of both connection patterns 232 are connected to both terminals 121 of the chip 120 to be inserted into the insertion groove 111 later, so that the connection between the antenna pattern 131 and the chip 120 is performed. This is possible.

Here, the insertion groove 111 has a depth corresponding to the thickness of the chip 120 so that the chip 120 is stably protected while the thickness change of the substrate 110 according to the insertion of the chip 120 is minimized. It is preferable to form.

After the insertion groove forming step (S210), the chip is inserted into and fixed inside the insertion groove 111 of the substrate 110 (S220).

In the chip insertion step (S220), the chip 120 can be stably fixed by applying the adhesive 150 to the insertion groove 111 to prevent the external separation of the inserted chip 120.

Next, after the chip insertion step (S220), the contact portion 270 is formed by printing the contact portion between the both terminals 121 of the inserted chip 120 and the pair of connection patterns 232 with conductive ink. Form (S230).

Of course, the conductive ink used in the contact portion connecting step (S230) is the same material as the conductive ink used in the antenna forming step (S200) to facilitate the connection of the contact portion without changing the formed antenna characteristics. Is preferably applied.

After the contact portion connecting step (S230), the cover sheet 140 is laminated on the upper and lower surfaces of the substrate 110 to which the contact portion is connected (S250).

The cover sheet 140, as in an embodiment of the present invention, as well as the chip 120 inserted into the substrate 110, the upper and lower surfaces of the substrate 110 on which the antenna pattern 131 is formed is stable from the outside. It is desirable to be made of a hard sheet so as to be protected.

In addition, as shown in FIG. 5, the cover sheet 140 may be formed with various printed matters to express the purpose of the card to be beautiful or manufactured.

On the other hand, after the contact portion connecting step (S230), the protective layer forming step of forming a protective layer 160 by applying a non-conductive ink on the upper surface of the chip 120 including the conductive ink portion connecting the contact portion (S240) ) May be further included.

According to the protective layer 160, the chip 120 and the antenna pattern 131 are applied to the contact connector 270 connecting the chip 120 and the antenna pattern 131 and the upper surface of the chip 120. 131) as well as to strengthen the fixing force between the connection portion can reduce the problem of cracking, damage or breakage of the connection portion due to external impact.

According to the method of manufacturing a contactless card of the present invention as described above, the chip 120 is primarily protected by the protective layer 160, and as the cover sheet 140 is formed on the protective layer 160 Secondary protection of the chip 120 is possible.

Therefore, the chip 120 and the antenna pattern 131 are firmly connected to each other and at the same time the damage problem of the chip 120 from external shock can be reduced, thereby not only stably protecting the chip 120 Maintenance costs can be reduced.

In addition, according to the method of manufacturing a contactless card of the present invention, the chip thickness does not increase as the single chip in an unpacked state is not used, compared to a manufacturing process using a packaging chip in a conventional packed state. Problems such as damage or destruction can be reduced, and the manufacturing cost can be reduced because only a single chip is manufactured without the need for the chip in the packaged state.

In addition, according to the present invention, as the occurrence of damage or destruction of the chip is reduced, the manufacturing cost of the contactless card and the maintenance cost of the manufactured card are reduced.

In addition, when a contact failure occurs between the antenna pattern 131 and both terminals 121 of the chip 120 during the manufacturing process of the non-contact card, a method of reconnecting a connection part without having to discard the chip 120. There is an advantage that the chip 120 can be recycled by.

As described above, although the present invention has been described by way of limited embodiments and drawings, the present invention is not limited thereto and is described by the person of ordinary skill in the art to which the present invention pertains. Various modifications and variations are possible without departing from the scope of the appended claims.

According to the method of manufacturing a contactless card of the present invention, the chip thickness does not increase as a noncontact card is manufactured using a single chip in an unpacked state, and thus an internal chip is compared with a manufacturing process using a packaging chip in a conventionally packed state. The damage or destruction problem of the card can be reduced and thus the maintenance cost of the manufactured card can be reduced.

In addition, according to the present invention can be manufactured only by purchasing a single chip without the need of the chip in the packaged state, the manufacturing cost can be reduced.

Further, according to the present invention, by forming a protective layer inside the card, the connection between the chip and the antenna pattern is firmly connected and at the same time stable chip protection from external impact can reduce the chip damage problem.

Claims (8)

An insertion groove forming step of forming an insertion groove having a depth corresponding to the thickness of the chip in a portion of the substrate into which the single chip in an unpacked state is to be inserted; A chip insertion step of inserting and fixing a chip into an insertion groove of the substrate; An antenna forming step of printing a conductive ink on the upper surface of the substrate to form an antenna pattern and a pair of connection patterns connecting the antenna pattern and both terminals of the chip; A protective layer forming step of forming a protective layer by applying a non-conductive ink to an upper surface of the chip including the connection pattern; And And a cover sheet forming step of stacking cover sheets on upper and lower surfaces of the substrate on which the protective layer is formed. The method of claim 1, wherein the chip insertion step, Method of manufacturing a contactless card, characterized in that for fixing the chip by applying an adhesive to the insertion groove. delete delete An antenna forming step of printing a conductive ink on an upper surface of the substrate to form an antenna pattern and a connection pattern connecting both ends of the antenna pattern; Insertion grooves to be inserted into the unpacked unit chip is to be formed in the center of the connection pattern, but to form an insertion groove having a depth corresponding to the thickness of the chip, to separate the connection pattern into a pair of connection patterns Forming a groove; A chip insertion step of inserting and fixing a chip into an insertion groove of the substrate; A contact part connecting step of forming a contact connection part by printing a contact part between both terminals of the inserted chip and the pair of connection patterns with conductive ink; A protective layer forming step of forming a protective layer by applying a non-conductive ink to the upper surface of the chip including the conductive ink connecting the contact portion; And And a cover sheet forming step of stacking cover sheets on upper and lower surfaces of the substrate on which the protective layer is formed. The method of claim 5, wherein the chip insertion step, Method of manufacturing a contactless card, characterized in that for fixing the chip by applying an adhesive to the insertion groove. delete delete

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