TWI781618B - 3d printing neural probe and manufacturing method thereof - Google Patents

Abstract

A 3D printing neural probe and manufacturing method thereof is provided. The manufacturing method is applied to a 3D printer. The manufacturing method includes: setting up a polymer base layer; printing a conductive layer on the polymer base layer, the conductive layer includes multiple wires, each wire includes a first node; printing a polymer film layer on the polymer base layer and the conductor layer, the polymer film layer has a first orifice at the location corresponding to the first node on each wire of the conductive layer, and the width of the first orifice along a first direction is smaller than the width of the first node along the first direction.

Description

3D printed neural probe and manufacturing method thereof

This case is about a neural probe and its manufacturing method.

A neural probe is an electrode applied to neural signal recording or neural electrical stimulation, which is widely used in neuroscience research, neurological disease treatment, brain region positioning and brain-computer interface and other fields. To choose a good neural probe, at least several factors must be considered: first, the signal-to-noise ratio (Signal-to-Noise Ratio, SNR) of the electrode must be high enough to provide good signal quality; The toughness of the front part of the probe used for implantation must be moderate, so as to provide enough toughness to pass through the brain tissue without causing excessive damage to the brain tissue; the third point is to provide as many recording channels as possible to allow a large number of nerves to be processed simultaneously. signal recording; the fourth point is to provide good biocompatibility to avoid tissue inflammation or cell death in the case of long-term recording; the fifth point is to customize to cope with the differences in the anatomical appearance of different individuals or different brain regions, so that The recording channel of the electrode can be implanted in the best recording position; sixth point, lower production cost.

Traditional neural probes can be divided into array microelectrodes, semiconductor process electrodes, and 3D printing process electrodes over time. The main material of the array microelectrode is metal. The advantage of the array microelectrode is that the manufacturing process is simple, but it is limited by low SNR and easy bending And the deterioration of its metal material. The main material of the semiconductor process electrode is silicon. The semiconductor process electrode allows more recording channels to be set per unit area, and the input impedance of the recording channel can be effectively improved by adjusting the process parameters to increase the SNR. The semiconductor process can also be used to achieve mass production. Reduce costs, but the problem is that the semiconductor material is too hard to break or damage tissues, and its biocompatibility is poor. Another problem with semiconductor process electrodes is that only a large number of electrodes with the same appearance and the same distribution of recording channels can be produced. However, the same electrode is suitable for a specific individual or brain region, and may be troublesome to use in other individuals or brain regions. For example, the human cerebral cortex is about 2~6mm, while the height of the thalamus is about 20mm; therefore, when the neural electrodes suitable for the cerebral cortex are applied to the thalamus nerve recording, it is necessary to move the depth position many times, which is very troublesome and Easily damage brain tissue. Therefore, 3D printing technology has been applied to the manufacture of nerve electrodes. Finally, in order to overcome the defects of low biocompatibility and poor toughness of metal or semiconductor materials, polymer materials have recently been developed to replace the aforementioned electrode materials. Polymer process electrodes provide good biocompatibility and toughness, and are widely used in various electrodes including 3D printing process electrodes.

The conventional 3D printed neural probes are made by laminating gel-like polymers. FIG. 1 is a schematic diagram of a conventional neural probe, please refer to FIG. 1 . The conventional neural probe 11 includes a PI substrate 112 (polyimide substrate) and a conductive circuit layer 111 . The bottom end of the conventional neural probe 11 is the recording channel, and the top is the interface connected to the adapter 12. All the recording channels correspond to one interface, and the conventional neural probe 11 in FIG. 1 has 7 recording channels in total. and their individual corresponding interfaces. FIG. 2 is a schematic diagram of the use situation of the known nerve probe; FIG. 3 is a schematic diagram of the connection between the known nerve probe and the adapter 12, please refer to FIG. 2 and FIG. 3 together. Implant the conventional neural probe 11 into the recording point R of the subject to measure the electrical signal of the brain nerve. Telegrams know God The recording channel at the bottom of the probe 11 is transmitted to the joint at the top, and then transmitted to the adapter 12 . It is known that the joint surface of the nerve probe 11 must be completely exposed, and then be pressed together with the joint surface of the adapter 12 to achieve electrical connection. In order to reduce the impedance between the two, the junction of the conventional nerve probe 11 must be large enough. However, this leads to the problem that the adapter 12 is too large, which affects its applicability. The root cause of the aforementioned problems is that it is difficult to electrically connect the electrodes of the 3D printing process to the adapter 12 by welding. The bonding relationship between the PI substrate 112 and the conductive circuit layer 111 of the conventional neural probe manufactured by the traditional 3D printing method is not stable, especially when the PI substrate 112 made of polymer material and the conductive circuit layer 111 made of metal are used. In this case, a firm bond cannot be formed between the two. Therefore, when the conventional neural probe 11 is soldered, the PI substrate 112 and the conductive circuit layer 111 are often peeled off.

In view of this, this case proposes a method for manufacturing 3D printed neural probes. The manufacturing method of the 3D printed neural probe is suitable for a 3D printer, and the manufacturing method includes the following steps: setting a polymer base layer; coating a conductor layer on the polymer base layer, and the conductor layer includes A plurality of lines, each of which includes a bonding area; and a polymer film layer coated on the polymer base layer and the conductor layer, the polymer film layer corresponding to the bonding area of each of the lines of the conductor layer There is a first hole, the width of the first hole along a first direction is smaller than the width of the wiring area along the first direction.

According to some embodiments, each of the lines further includes a measuring point, and the polymer film layer has a second hole corresponding to the measuring point of each of the lines, and the width of the second hole along a second direction is smaller than the amount The width of the measuring point along the second direction.

According to some embodiments, the width of the first hole along the first direction is less than 3/4 of the width of the wire bonding area along the first direction.

According to some embodiments, the width of the first hole along any direction is smaller than the width of the wiring region along the any direction.

According to some embodiments, a midpoint of a section line of the first hole along the first direction corresponds to a midpoint of a section line of the wire bonding area along the first direction.

According to some embodiments, the method of coating the conductor layer or the polymer film layer is to vaporize the material and then spray it on the surface of the workpiece.

The case also proposes a neural probe. The neural probe includes: a polymer base layer; a conductor layer arranged on the polymer base layer, the conductor layer includes a plurality of circuits, each of which includes a bonding area; and a polymer film layer, Arranged on the polymer base layer and the conductor layer, the polymer film layer has a first hole corresponding to the wiring area of each of the lines of the conductor layer, and the width of the first hole along a first direction is less than The width of the wire bonding area along the first direction.

According to some embodiments, the neural probe further includes a signal adapter, and the signal adapter includes a plurality of channels, each of which is electrically connected to each of the bonding areas.

11: Learning Neural Probes

111: Conductive circuit layer

112: PI substrate

12: Adapter

13: Wire

14: welding head

2: Neural Probe

21: Polymer base layer

22: Conductor layer

221: line

2211: Playing area

2212: Measurement point

23: polymer film layer

231: The first hole

232: The second hole

A1: First direction

A2: Second direction

M: Midpoint of intercept line

R: record point

S01~S03: Steps

D1, D2, D3, D4, D5, D6: Width

[Fig. 1] is a schematic diagram of a known neural probe; [Fig. 2] is a schematic diagram of the use situation of a known neural probe; [Fig. 3] is a schematic diagram of a known neural probe connected to an adapter; [Fig. 4] ] is the flow of the manufacturing method of the 3D printed neural probe according to some embodiments of this case [Fig. 5] is a schematic diagram of a nerve probe according to some embodiments of this case; [Fig. 6] is a schematic diagram of a polymer base layer according to some embodiments of this case; [Fig. 7A] is a conductor according to a first embodiment of this case [Fig. 7B] is a schematic diagram of the polymer film layer according to the first embodiment of this case; [Fig. 8] is a schematic diagram of wiring the nerve probe according to some embodiments of this case; [Fig. 9A] is a schematic diagram of this case according to some embodiments. The schematic diagram of the conductor layer of the second embodiment; [Fig. 9B] is the schematic diagram of the polymer film layer according to the second embodiment of this case; [Fig. 9C] is the schematic diagram of the polymer film layer according to the third embodiment of this case; [Fig. 10A] is the schematic diagram of the conductor layer according to the fourth embodiment of this case; [Fig. 10B] is the schematic diagram of the polymer film layer according to the fourth embodiment of this case; [Fig. 11A] is the realization of the nerve probe according to some embodiments of this case Take pictures; [Fig. 11B] is a partially enlarged view of the wiring area in Fig. 11A; [Fig. 12] is a real shot of the neural probe that has completed wiring according to some embodiments of this case.

Figure 4 is a flow chart of the manufacturing method of the 3D printed neural probe according to some embodiments of this case; Figure 5 is a schematic diagram of the neural probe according to some embodiments of this case, please refer to Figure 4 and Figure 5 together. 3D printing The manufacturing method of the neural probe 2 is suitable for 3D printers. The manufacturing method is not limited to a single machine that can provide multiple printing materials or a plurality of machines that can provide one or more printing materials. For example, the polymer base layer 21 is first printed on a polymer 3D printer, and then the polymer base layer 21 is placed on a metal 3D printer to print conductors on the polymer base layer 21 Layer 22. The 3D printing machine can be but not limited to extrusion type, gold It belongs to line 221 type, particle type, powder inkjet type, lamination type or photopolymerization type. The 3D printing material can be but not limited to polymer, metal, semiconductor or ceramic. The neural probe 2 may be, but not limited to, an electrode applied to the brain, spinal nerves or peripheral nerves to measure neural electrical signals.

Please refer to FIG. 4 and FIG. 5 together. The manufacturing method of the 3D printed neural probe 2 sets the polymer base layer 21 (step S01 ). The method of setting the polymer base layer 21 may be to print the polymer base layer 21 by a 3D printer, or to manufacture the polymer base layer 21 by other processes and then set the polymer base layer 21 on 3D printing. machine to continue the subsequent process. The material of the polymer base layer 21 can be but not limited to polyimide, polyethylene, polypropylene, polyvinyl chloride, polytetrafluoroethylene, polyacrylic acid ester, polymethacrylic acid, ethylene terephthalate Glycol ester, polycarbonate, parylene, polydimethylsiloxane, polyimide, or a combination of one or more of the aforementioned materials. According to some embodiments, the manufacturing method of the 3D printed neural probe 2 can form the polymer base layer 21 into the shape of the neural probe 2 . According to some embodiments, after the polymer base layer 21 is formed in the manufacturing method of the 3D printed neural probe 2 , it is then cut into the shape of the neural probe 2 . The shape of the nerve probe 2 can be, but not limited to, triangular or wedge-shaped, which includes a tip, so as to facilitate insertion into tissues.

The manufacturing method of the 3D printed nerve probe 2 coats the conductor layer 22 on the polymer base layer 21 (step S02 ). The conductive layer 22 includes a plurality of circuits 221 , and each circuit 221 includes a bonding area 2211 . According to some embodiments, the coating method may be extrusion coating the conductive material on the polymer base layer 21 after being heated. According to some embodiments, the coating method may be spraying the conductive material on the polymer base layer 21 after vaporization. In this way, the spraying method improves the uniformity of material distribution on the surface, and can form a thin film layer. In addition, the viscosity of the material The consistency does not affect the process of the spraying method, thereby avoiding the situation where the material is too viscous to be extruded or the material is too thin to flow on the surface.

According to some embodiments, the material of the conductor layer 22 is a conductive polymer, such as but not limited to π-electron conjugated conductive polymers, for example, polyaniline, polypyrrole, polythiophene, rubrene, condensed tetraphenyl , condensed pentaphenyl, perylene diimide, tetracyanoquinodimethane, polyacetylene, polyphenylene vinylene, derivatives of the aforementioned materials, or a combination of one or more of the aforementioned materials, etc. According to some embodiments, the material of the conductive layer 22 is metal or colloid doped with metal, such as but not limited to conductive silver colloid. According to some embodiments, the material of the conductive layer 22 may be but not limited to carbon black, carbon nanotubes and the like.

The wiring area 2211 is a contact point for the nerve probe 2 to output electrical signals. Each circuit 221 may include one or more wire bonding areas 2211 . According to some embodiments, the bonding area 2211 is an endpoint of the end of the wire 221 . According to some embodiments, the bonding area 2211 is a node in the middle of the lines 221 . The shape of the wire bonding area 2211 can be circular, triangular, square, polygonal or irregular. According to some embodiments, the width of the bonding area 2211 is greater than that of the wiring 221 to provide a larger junction area than the wiring 221 itself. According to some embodiments, each line 221 includes a measurement point 2212 . The measurement point 2212 is an interface for the nerve probe 2 to measure electrical signals. Each line 221 may include one or more measurement points 2212 . According to some embodiments, the measurement point 2212 is an endpoint at the end of the line 221 . According to some embodiments, the measurement point 2212 is a node in the middle of the line 221 . The shape of the measurement point 2212 can be circular, triangular, square, polygonal or irregular. According to some embodiments, the width of the measurement point 2212 is larger than that of the line 221 to provide a larger junction area than the line 221 itself.

The manufacturing method of the 3D printed nerve probe 2 coats the polymer film layer 23 on the polymer base layer 21 and the conductor layer 22 (step S03 ). The material of the polymer film layer 23 can be but not limited to polyimide, polyethylene, polypropylene, polyvinyl chloride, polytetrafluoroethylene, polyacrylic acid ester, polymethacrylic acid, ethylene terephthalate Glycol ester, polycarbonate, parylene, polydimethylsiloxane, polyimide, or a combination of one or more of the aforementioned materials. According to some embodiments, the polymer film layer 23 is made of the same material as the polymer base layer 21 to provide a stronger bond between the two. According to some embodiments, the coating method can be extrusion coating the polymer material on the polymer base layer 21 and the conductor layer 22 after being heated. According to some embodiments, the coating method may be spraying the vaporized polymer material on the polymer base layer 21 and the conductor layer 22 . In this way, the polymer film layer 23 is more evenly attached around the wire bonding area 2211 , providing uniform force and preventing the wire bonding area 2211 from detaching from the polymer base layer 21 , which will be described in detail later.

The polymer film layer 23 has a first hole 231 corresponding to the wire bonding area 2211 of each circuit 221 of the conductor layer 22 , and the width of the first hole 231 along the first direction A1 is smaller than the width of the wire bonding area 2211 along the first direction A1. According to some embodiments, the correspondence may mean that the wire bonding area 2211 completely or partially overlaps with the range of the first hole 231 , so that the wire bonding area 2211 can be observed within the first hole 231 . According to some embodiments, the correspondence may mean that the wire bonding area 2211 substantially overlaps with the geometric center of the first hole 231 . According to some embodiments, the first direction A1 may refer to a sectional direction passing through the wire bonding area 2211 or the range of the first hole 231 . According to some embodiments, the first direction A1 may refer to a sectional direction passing through the geometric center of the wire bonding area 2211 or the first hole 231 . The first direction A1 may refer to a single direction or multiple directions. Fig. 6 is a schematic diagram of the polymer base layer according to some embodiments of this case; Fig. 7A is a schematic diagram of a conductor layer according to the first embodiment of this case; Fig. 7B is a high score according to the first embodiment of this case Schematic diagram of sub-film layers. The first embodiment in FIG. 7A is produced by coating the conductor layer 22 on the polymer base layer 21 in FIG. 6 . The conductor layer 22 in FIG. 7A includes three lines 221 , and each line 221 includes a bonding area 2211 . Wherein, the wire bonding area 2211 is circular and has a diameter width D1. The polymer film layer 23 in FIG. 7B covers the polymer base layer 21 and the conductor layer 22 . Wherein, the polymer film layer 23 includes three first holes 231 corresponding to the three bonding regions 2211 in FIG. 7A , and the first holes 231 are circular and have a diameter width D2. In the first embodiment shown in FIG. 7A and FIG. 7B, the center of the wire bonding area 2211 corresponds to the center of the first hole 231, and the first direction A1 can be all sections passing through the center of the circle (the angle of the first direction A1 can be 0 degrees to 360 degrees). The diameter width D2 is smaller than the diameter width D1 , so only a part of the wire bonding area 2211 can be observed from the appearance of the first hole 231 , and the rest of the wire bonding area 2211 is covered by the polymer film layer 23 .

According to some embodiments, in order to transmit the signal measured by the neural probe 2 to the signal recording system, the neural probe 2 must be connected with the adapter 12 to match the transmission interface of the signal recording system. The signal adapter 12 includes a plurality of channels, and each channel is electrically connected to the wiring area 2211 of each circuit 221 of the nerve probe 2 . A common practice is to electrically connect the neural probe 2 and the adapter 12 by wire bonding. FIG. 8 is a schematic diagram of wiring a nerve probe according to some embodiments of the present application, please refer to FIG. 8 . For the conventional nerve probe 11 in FIG. 1 or for the nerve probe 2 whose wiring region 2211 is not covered by the polymer film layer 23, the 3D printed polymer base layer 21 (or PI substrate 112) and the conductor layer 22 (or the conductive circuit layer 111) is different in material and lacks good bonding, so the up and down movement of the welding head 14 during the wire bonding process will cause the conductive layer 22 (or the conductive circuit layer 111) to be pulled and bonded to the polymer base layer 21 (or PI The substrate 112) is separated. Therefore, according to some embodiments, the manufacturing method of the 3D printed neural probe 2 is to coat the polymer film layer 23 At this time, part of the wiring area 2211 is covered with the polymer film layer 23 . Since the surface material of the polymer film layer 23 and the polymer base layer 21 are close to each other and the bonding relationship is good, and a part of the wire bonding area 2211 is sandwiched between the two, it is avoided when the welding head 14 wires the wire bonding area 2211. The problem that the wire bonding area 2211 is separated from the polymer base layer 21 is solved.

According to some embodiments, the wire bonding area 2211 may also be polygonal. FIG. 9A is a schematic diagram of the conductor layer according to the second embodiment of the present application, please refer to FIG. 9A . In the second embodiment of the present invention, the wire bonding area 2211 is quadrangular and has a width D1. In addition, the circuit 221 of the conductor layer 22 also includes a measurement point 2212, the measurement point 2212 is circular and has a diameter width D3 along the second direction A2. FIG. 9B is a schematic diagram of the polymer film layer according to the second embodiment of this case, please refer to FIG. 9B. The manufacturing method of 3D printed neural probe 2 is to coat the polymer film layer 23 on the polymer base layer 21 and the conductor layer 22, and the polymer film layer 23 includes a quadrangular first hole 231 corresponding to the wiring area 2211, which The hole width is D2. In the second embodiment, the first direction A1 is the horizontal direction, and the width D2 of the first hole 231 in the horizontal direction is smaller than the width D1 of the wire bonding area 2211 in the horizontal direction. In this way, the left and right sides of the wire bonding area 2211 share the width D1 minus the width D2 and are pressed under the polymer film layer 23 . In the second embodiment, the second hole 232 is also circular and has a diameter width D3 along the second direction A2. In this way, when the center of the second hole 232 is the same as that of the measurement point 2212 , the polymer film layer 23 does not cover the measurement point 2212 .

FIG. 9C is a schematic diagram of the polymer film layer according to the third embodiment of the present case, please refer to FIG. 9C. In the third embodiment, the second hole 232 is also circular and has a diameter width D4 along the second direction A2. Wherein, the width D4 is smaller than the width D3. In this way, when the center of the second hole 232 is the same as that of the measurement point 2212, the polymer film layer 23 covers the periphery of the measurement point 2212 scope. According to some embodiments, the input impedance of the nerve probe 2 is adjusted by adjusting the width of the second hole 232 , so as to change the measurement signal quality of the nerve probe 2 and the spatial range allowed for measurement.

FIG. 10A is a schematic diagram of the conductor layer according to the fourth embodiment of the present application, please refer to FIG. 10A . In the fourth embodiment of the present invention, the wire bonding area 2211 is quadrangular and has a width D1 along the first horizontal direction A1 and a width D5 along the first vertical direction A1. FIG. 10B is a schematic diagram of the polymer film layer according to the fourth embodiment of the present case, please refer to FIG. 10B . The manufacturing method of 3D printed neural probe 2 is to coat the polymer film layer 23 on the polymer base layer 21 and the conductor layer 22, and the polymer film layer 23 includes a quadrangular first hole 231 corresponding to the wiring area 2211, which The hole has a width D1 along the first horizontal direction A1 and a width D6 along the first vertical direction A1. In the fourth embodiment, not all the widths of the first holes 231 in the first direction A1 are smaller than the width of the wiring area 2211 , for example, in the horizontal first direction A1 . In this way, when the geometric center of the first hole 231 is the same as that of the wire bonding area 2211, the range of the width D5 minus the width D6 on the upper and lower sides of the wire bonding area 2211 is covered under the polymer film layer 23, and the left and right sides are not. Covered by a polymer film layer 23 . In the fourth embodiment, the upper and lower parts of the wire bonding area 2211 are sandwiched between the polymer film layer 23 and the polymer base layer 21 , so as to avoid the problem that the wire bonding area 2211 is detached from the polymer base layer 21 during the wire bonding process. According to some embodiments, choosing to cover the left and right sides between the polymer film layer 23 and the polymer base layer 21 while the upper and lower sides are not covered by the polymer film layer 23 can also achieve the aforementioned effects. According to some embodiments, the midpoint M of the sectional line of the first hole 231 along the first direction A1 corresponds to the midpoint M of the sectional line of the wire bonding area 2211 along the first direction A1 . The sectional line may refer to the sectional line passing through the first hole 231 or the bonding area 2211, and the midpoint M of the sectional line may refer to the sectional line and the first hole 231 or the bonding area The midpoint of the two intersection points of the boundary of 2211. In this way, according to some embodiments, when the midpoint M of the section line of the first hole 231 along the first direction A1 is the same as the midpoint M of the section line of the wire bonding area 2211 along the first direction A1 and the first hole 231 is along the first direction A1 If the width of one direction A1 is smaller than the width of the wire bonding area 2211 along the first direction A1, then the area covered by the polymer film layer 23 on both sides of the wire bonding area 2211 along the first direction A1 is the same, so as to achieve an average stress.

FIG. 11A is a real shot of the neural probe according to some embodiments of the present application, please refer to FIG. 11A . In this embodiment, the conductor layer 22 of the nerve probe 2 has a total of nine lines 221 (the white lines in FIG. 11A ), each of which includes a wiring area 2211 (the dots on the white lines in FIG. 11A ). FIG. 11B is a partially enlarged view of the wire bonding area in FIG. 11A , please refer to FIG. 11B . The wire bonding area 2211 is the light-colored area in FIG. 11B , and the polymer film layer 23 is the dark-colored area in FIG. 11B . As shown in FIG. 11B , part of the wire bonding area 2211 is covered under the polymer film layer 23 . According to some embodiments, the width of the first hole 231 along the first direction A1 is less than 3/4 of the width of the wire bonding area 2211 along the first direction A1. For example, the diameter width of the wire bonding area 2211 in FIG. 11B is about 200 μm, and the diameter width of the first hole 231 is about 150 μm, so the diameter width of the first hole 231 is about three quarters of the diameter width of the wire bonding area 2211 .

To sum up, the manufacturing method of the 3D printed neural probe 2 uses the polymer film layer 23 to cover part of the wire bonding area 2211 , thereby solving the problem that wire bonding cannot be performed due to the difficulty of heterogeneous bonding in the 3D printing process. Fig. 12 is a real photo of the neural probe with wire bonding according to some embodiments of this case, please refer to Fig. 12 . The neural probe 2 and the adapter 12 are electrically connected by wires 13 by wire bonding, so that the volume of the adapter 12 can be reduced, avoiding the problem of limited application due to the excessively large adapter 12 as shown in FIG. 3 . For example, the smaller volume allows application in smaller experimental subjects or provides lighter medical equipment.

Although the technical content of the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Any modification and modification made by those skilled in the art without departing from the spirit of the present invention should be covered by the present invention. Therefore, the scope of protection of the present invention should be defined by the scope of the appended patent application.

2: Neural Probe

21: Polymer base layer

22: Conductor layer

221: line

2211: Playing area

2212: Measurement point

23: polymer film layer

231: The first hole

Claims (12)

A method of manufacturing a 3D printed neural probe, suitable for a 3D printer, the manufacturing method includes the following steps: setting a polymer base layer; Coating a conductive layer on the polymer base layer, the conductive layer includes a plurality of circuits, each of which includes a bonding area; and A polymer film layer is coated on the polymer base layer and the conductor layer, and the polymer film layer has a first hole corresponding to the wiring area of each of the lines of the conductor layer, and the first hole is along a first hole. The width in one direction is smaller than the width of the wire bonding area along the first direction. The manufacturing method as described in claim 1, wherein each of the lines further includes a measuring point, and the polymer film layer has a second hole corresponding to the measuring point of each of the lines, and the second hole is along a first The width of the two directions is smaller than the width of the measuring point along the second direction. The manufacturing method according to claim 1, wherein the width of the first hole along the first direction is less than three-quarters of the width of the wiring region along the first direction. The manufacturing method according to claim 1, wherein the width of the first hole along any first direction is smaller than the width of the wire bonding area along any first direction. The manufacturing method according to claim 1, wherein the midpoint of a section line of the first hole along the first direction corresponds to the midpoint of a section line of the wire bonding area along the first direction. The manufacturing method according to claim 1, wherein the method of coating the conductor layer or the polymer film layer is spraying the material on the surface of the workpiece after vaporization. A neural probe comprising: a polymer base layer; a conductive layer arranged on the polymer base layer, the conductive layer includes a plurality of lines, each of which includes a bonding area; and A polymer thin film layer is arranged on the polymer base layer and the conductor layer, the polymer thin film layer has a first hole corresponding to the wiring area of each of the lines of the conductor layer, and the first hole is along a The width in the first direction is smaller than the width of the wire bonding area along the first direction. The nerve probe as described in claim item 7, wherein each of the lines further includes a measuring point, and the polymer film layer has a second hole corresponding to the measuring point of each of the lines, and the second hole is along a The width in the second direction is smaller than the width of the measuring point along the second direction. The nerve probe according to claim 7, wherein the width of the first hole along the first direction is less than three quarters of the width of the wiring region along the first direction. The nerve probe according to claim 7, wherein the width of the first hole along any first direction is smaller than the width of the wiring region along any first direction. The nerve probe according to claim 7, wherein the midpoint of a section line of the first hole along the first direction corresponds to the midpoint of a section line of the wire bonding area along the first direction. The nerve probe as described in claim 7 further includes a signal adapter, and the signal adapter includes a plurality of channels, and each of the channels is electrically connected to each of the wiring areas.

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