TWI781465B - Resin molding apparatus and resin molded product manufacturing method - Google Patents
Resin molding apparatus and resin molded product manufacturing method Download PDFInfo
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- TWI781465B TWI781465B TW109136356A TW109136356A TWI781465B TW I781465 B TWI781465 B TW I781465B TW 109136356 A TW109136356 A TW 109136356A TW 109136356 A TW109136356 A TW 109136356A TW I781465 B TWI781465 B TW I781465B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
- B29C45/021—Plunger drives; Pressure equalizing means for a plurality of transfer plungers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/03—Injection moulding apparatus
- B29C45/04—Injection moulding apparatus using movable moulds or mould halves
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1742—Mounting of moulds; Mould supports
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/53—Means for plasticising or homogenising the moulding material or forcing it into the mould using injection ram or piston
- B29C45/531—Drive means therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/58—Details
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/64—Mould opening, closing or clamping devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/70—Means for plasticising or homogenising the moulding material or forcing it into the mould, combined with mould opening, closing or clamping devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C2037/90—Measuring, controlling or regulating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/84—Safety devices
- B29C2045/848—Safety devices detecting or preventing overload of an injection plunger
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/766—Measuring, controlling or regulating the setting or resetting of moulding conditions, e.g. before starting a cycle
Abstract
Description
本公開是有關於一種樹脂成形裝置以及樹脂成形品的製造方法。The present disclosure relates to a resin molding device and a method for manufacturing a resin molded product.
例如,日本專利特開平11-260844號公報(專利文獻1)中記載有下述半導體樹脂密封裝置,即:將施加於柱塞(plunge)的力區分為注入阻力與滑動阻力並進行監視(monitor),藉此區分未填充、空洞不良是由樹脂特性異常還是裝置異常所導致,確實地自動控制裝置。For example, Japanese Patent Laid-Open No. 11-260844 (Patent Document 1) describes a semiconductor resin sealing device in which the force applied to a plunger is divided into injection resistance and sliding resistance and monitored (monitor ), to distinguish whether non-filling and void defects are caused by abnormal resin properties or abnormal equipment, and automatically control the equipment reliably.
專利文獻1所記載的半導體樹脂密封裝置將成形中的注入阻力、與通過裝置驅動控制部使柱塞上升時由柱塞的下部的測力感測器(load cell)所得的閾值(滑動閾值)進行比較,判定是否產生了樹脂異常。In the semiconductor resin sealing device described in
有時將半導體樹脂密封裝置的柱塞沿一個方向排列而構成柱塞列,將柱塞列的列數設為單個或多個來製造樹脂成形品。但是,在柱塞列的列數為單個及多個的任一情況下均使用相同閾值時,有時無法對柱塞施加適當的傳遞輸出。In some cases, the plungers of the semiconductor resin sealing device are arranged in one direction to form a plunger row, and the number of the plunger row is single or plural to manufacture a resin molded product. However, when the same threshold is used regardless of whether the number of plunger rows is single or plural, appropriate transfer output may not be applied to the plunger.
根據此處公開的實施方式,可提供一種樹脂成形裝置,包括:成形模;柱塞列,構成為能夠將樹脂移送至成形模;檢測器,構成為能夠檢測與柱塞列的傳遞輸出有關的檢測值;以及控制部,構成為能夠控制傳遞輸出,且樹脂成形裝置構成為,能夠將柱塞列的列數適用於單個或多個的任一種,控制部構成為,能夠切換對檢測器所檢測的檢測值進行校正的校正值,以根據柱塞列的列數來生成傳遞輸出。According to the embodiments disclosed herein, there is provided a resin molding apparatus including: a molding die; a plunger row configured to be able to transfer the resin to the molding die; a detector configured to detect a signal related to the output of the plunger row. detection value; and the control unit is configured to be able to control the transfer output, and the resin molding device is configured to be able to apply the number of plunger rows to either single or multiple, and the control unit is configured to be able to switch the number of columns for the detector. The detected detection value is corrected to a correction value to generate a transfer output according to the column number of the plunger column.
根據此處公開的實施方式,提供一種樹脂成形品的製造方法,用於使用所述樹脂成形裝置來製造樹脂成形品,且包括下述步驟:在成形模設置成形對象物;將成形模鎖模;對成形對象物進行樹脂成形;以及將成形模開模。According to the embodiment disclosed here, there is provided a method for manufacturing a resin molded product using the resin molding apparatus, comprising the steps of: setting an object to be molded in a molding mold; clamping the molding mold ; performing resin molding on the object to be formed; and opening the forming die.
根據此處公開的實施方式,可提供一種樹脂成形裝置及樹脂成形品的製造方法,可更準確地把握傳遞輸出。According to the embodiments disclosed herein, it is possible to provide a resin molding device and a method of manufacturing a resin molded product, which can more accurately grasp the transfer output.
本發明的所述及其他目的、特徵、方面及優點將根據與圖式關聯而理解的與本發明有關的下述詳細說明來表明。These and other objects, features, aspects, and advantages of the present invention will be apparent from the following detailed description related to the present invention to be understood in conjunction with the accompanying drawings.
以下,對實施方式進行說明。此外,用於說明實施方式的圖式中,相同的參照符號表示相同部分或相應部分。Embodiments will be described below. In addition, in the drawings for describing the embodiments, the same reference numerals denote the same or corresponding parts.
圖1中表示實施方式的樹脂成形品的製造裝置的示意性平面圖。如圖1所示,實施方式1的樹脂成形品的製造裝置包括模塑模塊(moulding module)A、載入模塊(in-loader module)B及載出模塊(out-loader module)C。FIG. 1 shows a schematic plan view of a manufacturing apparatus of a resin molded article according to an embodiment. As shown in FIG. 1 , the manufacturing apparatus of a resin molded product according to
模塑模塊A包括鑄模機構部1000,此鑄模機構部1000構成為可對例如搭載於導線架(lead frame)的半導體芯片等成形對象物進行樹脂成形。載入模塊B包括載入器2000,此載入器2000構成為可對模塑模塊A供給成形對象物及樹脂。載出模塊C包括載出器3000,此載出器3000構成為可從模塑模塊A中取出樹脂成形品。載入器2000及載出器3000構成為可沿圖1的箭頭所示的方向移動。The mold module A includes a
模塑模塊A與載入模塊B通過例如螺杆或銷等連結機構而相互可裝卸地連結。而且,模塑模塊A與載出模塊C也通過例如螺杆或銷等連結機構而相互可裝卸地連結。The molding module A and the loading module B are detachably connected to each other by a connecting mechanism such as a screw or a pin. Furthermore, the molding module A and the load-out module C are also detachably connected to each other by a connecting mechanism such as a screw or a pin, for example.
圖1所示的實施方式的樹脂成形品的製造裝置包括兩個模塑模塊A,但模塑模塊A的個數可根據生產量而增減調整。實施方式的樹脂成形品的製造裝置例如可包括一個模塑模塊A,也可包括增設至四個的模塑模塊A。即,實施方式的樹脂成形品的製造裝置可設為能增減模塑模塊A的個數的結構。The manufacturing apparatus of a resin molded product according to the embodiment shown in FIG. 1 includes two molding modules A, but the number of molding modules A can be increased or decreased according to the production volume. The manufacturing apparatus of the resin molded article of embodiment may include, for example, one molding module A, and may include up to four molding modules A. That is, the manufacturing apparatus of the resin molded article of embodiment can be set as the structure which can increase and decrease the number of objects of the molding module A.
而且,圖1所示的實施方式的樹脂成形品的製造裝置中,模塑模塊A、載入模塊B及載出模塊C是按圖1所示的順序配置,但例如也可由模塑模塊A、載入模塊B及載出模塊C成一體的一個母機與僅包括模塑模塊A的一個或多個子機來構成樹脂成形品的製造裝置。此外,也可將一個模塑模塊A理解為實施方式的樹脂成形品的製造裝置。Moreover, in the manufacturing apparatus of the resin molded article of embodiment shown in FIG. One master machine, in which the loading module B and the unloading module C are integrated, and one or more sub-machines including only the molding module A constitute a manufacturing device for resin molded products. In addition, one molding module A can also be understood as the manufacturing apparatus of the resin molded article of embodiment.
圖2中表示實施方式的樹脂成形裝置的示意性立體圖。圖2所示的實施方式的樹脂成形裝置配置於圖1所示的實施方式的樹脂成形品的製造裝置的鑄模機構部1000。FIG. 2 shows a schematic perspective view of a resin molding apparatus according to an embodiment. The resin molding apparatus of the embodiment shown in FIG. 2 is arranged in the
如圖2所示,實施方式的樹脂成形裝置包括第一平臺200、第二平臺400、可動平臺300及連杆(tie bar)500。第二平臺400與第一平臺200遠離地相向。As shown in FIG. 2 , the resin molding apparatus of the embodiment includes a
可動平臺300位於第一平臺200與第二平臺400之間,構成為可在第一平臺200與第二平臺400之間沿著連杆500相對於第一平臺200而移動。The
連杆500為在第一平臺200與第二平臺400之間延伸的棒狀構件。連杆500的一端固定於第一平臺200,連杆500的另一端固定於第二平臺400。The
圖2所示的實施方式的樹脂成形裝置包括:安裝於第一平臺200的第一模具固持器30、安裝於可動平臺300的第二模具固持器安裝塊50、安裝於第二模具固持器安裝塊50的第二模具固持器40、第二模具固持器安裝塊50內的傳遞驅動機構60、以及可動平臺300與第二平臺400之間的鎖模機構600。此處,第二模具固持器40經由第二模具固持器安裝塊50而安裝於可動平臺300。The resin molding device of the embodiment shown in FIG. 2 includes: the
圖3中表示實施方式的樹脂成形裝置的示意性局部截面圖。如圖3所示,實施方式的樹脂成形裝置包括:作為保持於第一模具固持器30的成形模的第一模具10、以及作為保持於第二模具固持器40的成形模的第二模具20。FIG. 3 shows a schematic partial cross-sectional view of a resin molding device according to an embodiment. As shown in FIG. 3 , the resin molding apparatus of the embodiment includes: a
鎖模機構600構成為,通過使可動平臺300相對於第一平臺200移動,按壓第一模具10和第二模具20,從而可將第一模具10與第二模具20鎖模。The
第一模具固持器30包括第一板31及第一輔助塊32。第一板31構成為可安裝於第一平臺200,從第一平臺200側起依次包括隔熱板及加熱板。第一輔助塊32構成為可將第一模具10固定於第一板31下。The
第二模具固持器40包括第二輔助塊41及第二板42。第二板42構成為可安裝於第二模具固持器安裝塊50,從第二模具固持器安裝塊50側起依序包括隔熱板及加熱板。第二輔助塊41構成為可將第二模具20固定於第二板42上。The
第一模具10包括第一凹部11、滯料部12及第一模具板13。第一凹部11可包括與成形對象物的樹脂成形後的形狀相應的形狀。滯料部12被用作向成形對象物移送樹脂前的、樹脂的蓄積部。第一模具板13構成為可固定於第一模具固持器30的第一板31。The
第二模具20包括第二凹部21、料筒(pot)22及第二模具板23。第二凹部21可包括與成形對象物的樹脂成形後的形狀相應的形狀。料筒22被用作用於成形對象物的樹脂成形的、樹脂的設置部。第二模具板23構成為可固定於第二模具固持器40的第二板42。The
圖4中表示用於實施方式的樹脂成形裝置的、傳遞驅動機構的一例的示意性側面圖。如圖4所示,實施方式的傳遞驅動機構60包括第一傳遞驅動軸63a以及第一傳遞驅動軸63a上的第一檢測器66a,所述第一檢測器66a為測力感測器等。而且,實施方式的傳遞驅動機構60包括第三傳遞驅動軸63c以及第三傳遞驅動軸63c上的第三檢測器66c,所述第三檢測器66c例如為測力感測器等。FIG. 4 shows a schematic side view of an example of a transmission drive mechanism used in the resin molding apparatus of the embodiment. As shown in FIG. 4 , the
而且,實施方式的傳遞驅動機構60包括第一檢測器66a上及第三檢測器66c上的柱塞單元支撐板62、以及柱塞單元支撐板62上的柱塞單元61。Furthermore, the
柱塞單元61包括用於對成形模注入樹脂的柱塞64、以及柱塞單元本體65。柱塞64為沿Z軸方向直線狀地延伸的棒狀構件。圖4所示的示例中,柱塞64的前端740位於柱塞單元本體65的外部,並且柱塞64的另一前端(未圖示)位於柱塞單元本體65的內部。The
圖5中表示實施方式的傳遞驅動機構60的示意性平面圖。圖5為對圖4所示的傳遞驅動機構60從柱塞64的前端740觀察時的示意性俯視。FIG. 5 shows a schematic plan view of the
如圖5中俯視所示,柱塞64沿X軸方向排列而構成單列柱塞列641。如圖5中俯視所示,單列柱塞列641是通過各柱塞64的前端740位於任意的直線741上從而構成。As shown in plan view in FIG. 5 , the
如圖5中俯視所示,柱塞列641位於兩個區域R1與區域R2中的一個區域R1,所述兩個區域R1與區域R2是由將柱塞單元本體65的Y軸方向的寬度二等分的、沿X軸方向延伸的中心線C-C分隔而成。而且,穿過構成柱塞列641的柱塞64各自的前端740且沿X軸方向延伸的直線741位於區域R1。As shown in a top view in FIG. 5 , the
此外,單個柱塞列641或直線741亦可位於由柱塞單元本體65的中心線C-C所分隔的兩個區域R1及區域R2中的另一區域R2。此外,單列柱塞列641或直線741位於區域R1或區域R2的任一者的結構是由於多品種少量生產等各種原因而有需求。In addition, a
如圖5中俯視所示,傳遞驅動機構60包括第一傳遞驅動軸63a、第二傳遞驅動軸63b及第三傳遞驅動軸63c。如圖5中俯視所示,第一傳遞驅動軸63a、第三傳遞驅動軸63c及第二傳遞驅動軸63b依次位於X軸方向。As shown in plan view in FIG. 5 , the
如圖5中俯視所示,實施方式的傳遞驅動機構60中,第三傳遞驅動軸63c的中心631c位於穿過第一傳遞驅動軸63a的中心631a和第二傳遞驅動軸63b的中心631b的直線632上以外的部位。As shown in plan view in FIG. 5, in the
而且,如圖5中俯視所示,傳遞驅動機構60包括第一傳遞驅動軸63a與柱塞單元支撐板62之間的第一檢測器66a、第二傳遞驅動軸63b與柱塞單元支撐板62之間的第二檢測器66b、以及第三傳遞驅動軸63c與柱塞單元支撐板62之間的第三檢測器66c。And, as shown in plan view in FIG. The
傳遞驅動機構60構成為,通過包括例如滾珠螺杆等的第一傳遞驅動軸63a、第二傳遞驅動軸63b及第三傳遞驅動軸63c,使柱塞單元本體65升降,即,可使柱塞列641升降。The
傳遞驅動機構60的柱塞列641構成為,通過柱塞列641上升,從而可將配置於柱塞列641的上方的樹脂移送至成形模。為了使柱塞列641上升而傳遞驅動機構60施加的力為柱塞列641的傳遞輸出。第一檢測器66a、第二檢測器66b及第三檢測器66c構成為可檢測與柱塞列641的傳遞輸出有關的檢測值。The
圖6中表示用於實施方式的樹脂成形裝置的、傳遞驅動機構60的另一例的示意性側面圖。圖6所示的傳遞驅動機構60的特徵在於包括多列柱塞列。這樣,實施方式的樹脂成形裝置構成為,可將包括單列柱塞列的傳遞驅動機構60、與包括多列柱塞列的傳遞驅動機構60更換而使用。即,實施方式的樹脂成形裝置構成為,可適用於柱塞列的列數為單個或多個的任一情況。FIG. 6 shows a schematic side view of another example of the
圖6所示的實施方式的傳遞驅動機構60的柱塞單元61包括用於對成形模注入樹脂的柱塞64a、柱塞64b。柱塞64a、柱塞64b也為沿Z軸方向直線狀地延伸的棒狀構件。圖6所示的示例中,柱塞64a的前端740a位於柱塞單元本體65的外部,並且柱塞64a的另一前端(未圖示)位於柱塞單元本體65的內部。而且,柱塞64b的前端740b位於柱塞單元本體65的外部,並且柱塞64b的另一前端(未圖示)位於柱塞單元本體65的內部。The
圖7中表示實施方式的傳遞驅動機構60的示意性平面圖。圖7為對圖6所示的傳遞驅動機構60從柱塞64a、柱塞64b的前端740a、前端740b觀察時的示意性俯視。FIG. 7 shows a schematic plan view of a
如圖7中俯視所示,傳遞驅動機構60包括多列柱塞列643。多列柱塞列643是通過單列柱塞列641與單列柱塞列642沿Y軸方向相互空開間隔排列從而構成。單列柱塞列641包括多個柱塞64a,單列柱塞列642包括多個柱塞64b。單列柱塞列641及單列柱塞列642分別沿X軸方向延伸。As shown in plan view in FIG. 7 , the
如圖7中俯視所示,單列柱塞列641位於由柱塞單元本體65的中心線C-C所分隔的兩個區域R1及區域R2中的一個區域R1,單列柱塞列642位於另一區域R2。而且,穿過構成單列柱塞列641的多個柱塞64a各自的前端740a且沿X軸方向延伸的直線741a位於區域R1,穿過構成單列柱塞列642的多個柱塞64b各自的前端740b且沿X軸方向延伸的直線741b位於區域R2。As shown in the top view in FIG. 7 , the single-
多列柱塞列643的結構當然不限定於圖7中俯視所示的結構,多列柱塞列643例如也可由3列以上的單列柱塞列沿Y軸方向相互空開間隔排列而構成。The structure of the
以下,參照圖8~圖18,對作為使用實施方式的樹脂成形裝置來製造樹脂成形品的方法的一例的、實施方式的樹脂成形品的製造方法進行說明。圖8中表示實施方式的樹脂成形品的製造方法的流程圖。如圖8所示,實施方式的樹脂成形品的製造方法包括:決定校正值的步驟(S10)、設置成形對象物的步驟(S20)、鎖模的步驟(S30)、進行樹脂成形的步驟(S40)、以及開模的步驟(S50)。以下,對各步驟加以更詳細說明。Hereinafter, a method of manufacturing a resin molded product according to an embodiment as an example of a method of manufacturing a resin molded product using the resin molding apparatus according to the embodiment will be described with reference to FIGS. 8 to 18 . FIG. 8 shows a flowchart of a method of manufacturing a resin molded article according to the embodiment. As shown in FIG. 8 , the method of manufacturing a resin molded product according to the embodiment includes: a step of determining a correction value (S10), a step of setting a molding object (S20), a step of clamping a mold (S30), and a step of performing resin molding ( S40), and the step of mold opening (S50). Hereinafter, each step will be described in more detail.
如圖8所示,實施方式的樹脂成形品的製造方法是從決定校正值的步驟(S10)開始。決定校正值的步驟(S10)例如可如以下那樣進行。首先,將圖4或圖6所示的傳遞驅動機構60的柱塞單元61更換為圖9的示意性局部截面圖所示的檢定夾具900。檢定夾具900包括虛擬柱塞單元本體65c、以及虛擬柱塞單元本體65c上的虛擬柱塞64c。而且,從圖3所示的實施方式的樹脂成形裝置中去掉第二模具20。As shown in FIG. 8 , the manufacturing method of the resin molded article of the embodiment starts from the step of determining the correction value ( S10 ). The step of determining the correction value ( S10 ) can be performed, for example, as follows. First, the
接下來,在圖3所示的實施方式的樹脂成形裝置中,代替傳遞驅動機構60而設置圖9所示的檢定夾具900。接著,如圖9所示,在第二板42上設置經外部校正的測力感測器等基準檢測器800。然後,通過例如滾珠螺杆等而使第一傳遞驅動軸63a、第二傳遞驅動軸63b及第三傳遞驅動軸63c驅動,使檢定夾具900上升。藉此,檢定夾具900的虛擬柱塞64c對基準檢測器800施加力,基準檢測器800檢測施加於虛擬柱塞64c的力的測定值。而且,同時也通過第一檢測器66a、第二檢測器66b及第三檢測器66c來檢測力的測定值。此外,基準檢測器800內置有放大器,從基準檢測器800輸出的測定值成為經放大器放大的值。Next, in the resin molding apparatus of the embodiment shown in FIG. 3 , a
此處,基準檢測器800經外部校正,因而由基準檢測器800所檢測的力的測定值為較基於第一檢測器66a、第二檢測器66b及第三檢測器66c所檢測的檢測值的力的測定值更準確的值。這樣,以由基準檢測器800所檢測的力的測定值為基準,來對基於由第一檢測器66a、第二檢測器66b及第三檢測器66c所得的檢測值的、力的測定值進行校正。實施方式的樹脂成形裝置中,通過使用所述校正值,從而可檢測柱塞列的傳遞輸出的更準確的值。作為所述校正值,決定與柱塞列的列數各自對應的值。Here, the
此外,在使用例如圖5所示的單列柱塞列641的情況下,在圖5的俯視中,基準檢測器800進行下述步驟,即:將沿X軸方向延伸的直線741設置於以柱塞單元本體65所切取的線段的中點751,決定校正值。而且,在使用圖7所示的多列柱塞列643的情況下,在圖7的俯視中,基準檢測器800進行下述步驟,即:將沿X軸方向延伸的中心線C-C設置於以柱塞單元本體65所切取的線段的中點752,決定校正值。In addition, in the case of using, for example, the single-
圖10中表示實施方式的樹脂成形裝置的主要部分的框圖。如圖10所示,實施方式的樹脂成形裝置包括例如觸控螢幕等輸入輸出部67、連接於輸入輸出部67的控制部68、連接於控制部68的傳遞驅動機構60、連接於控制部68的擴大器(amplifier)等放大器69、以及連接於放大器69的檢測器66(第一檢測器66a、第二檢測器66b及第三檢測器66c)。FIG. 10 shows a block diagram of main parts of the resin molding apparatus according to the embodiment. As shown in FIG. 10 , the resin molding apparatus of the embodiment includes an input and
決定校正值的步驟中,實施方式的樹脂成形裝置例如像以下那樣運行。首先,從輸入輸出部67向控制部68以進行決定校正值的步驟的方式輸出指令。藉此,控制部68以對傳遞驅動軸(第一傳遞驅動軸63a、第二傳遞驅動軸63b及第三傳遞驅動軸63c)進行驅動的方式輸出指令。傳遞驅動軸接收來自控制部68的指示,使檢定夾具900上升。In the step of determining the correction value, the resin molding apparatus of the embodiment operates as follows, for example. First, a command is output from the input/
檢測器66(第一檢測器66a、第二檢測器66b及第三檢測器66c)在由基準檢測器800測定施加於虛擬柱塞64c的力的同時,進行檢測。接著,第一檢測器66a、第二檢測器66b及第三檢測器66c的檢測值在由放大器69放大後,輸出至控制部68。The detectors 66 (the
然後,以從基準檢測器800輸出的力的值作為基準,利用從第一檢測器66a、第二檢測器66b及第三檢測器66c經由放大器輸出的值來決定校正值。所述校正值的決定可由控制部68進行。控制部68包括記憶部。控制部68的記憶部記憶與柱塞列為單列的情況、及柱塞列為多列(兩列以上)的情況的柱塞列的列數對應的各校正值。控制部68除了包含記憶部以外,例如也可包含可編程邏輯控制器(Programmable Logic Controller,PLC)或人機接口(Human Machine Interface,HMI)等。Then, the correction value is determined using the values output from the
接下來,如圖8所示,在決定校正值的步驟(S10)後,進行設置成形對象物的步驟(S20)。設置成形對象物的步驟(S20)例如可如以下那樣進行。首先,如圖11的示意性局部截面圖所示,在第一模具10與第二模具20之間設置成形對象物1。在圖11所示的示例中,成形對象物1設置於第二模具20的凹部21。作為成形對象物1,例如可使用搭載於導線架的半導體芯片等。Next, as shown in FIG. 8 , after the step of determining the correction value ( S10 ), the step of setting the object to be formed ( S20 ) is performed. The step ( S20 ) of setting the object to be formed can be performed as follows, for example. First, as shown in the schematic partial cross-sectional view of FIG. 11 , the
圖12中表示實施方式所用的第二模具20的一例的示意性平面圖。如圖12所示,第二模具20的第二凹部21僅設於也作為柱塞64移動的通路的料筒22的單側。而且,圖12所示的示例中,第二凹部21的形狀成為矩形,料筒22的形狀成為圓形,但不限定於這些形狀。FIG. 12 shows a schematic plan view of an example of the
接下來,進行鎖模的步驟(S30)。鎖模的步驟(S30)例如可如以下那樣進行。首先,可通過以下方式進行,即:鎖模機構600使可動平臺300上升,使第二模具20相對於經固定的第一模具10而移動,如圖13的示意性局部截面圖所示,按壓第一模具10和第二模具20。此外,第一模具10與第二模具20的鎖模也可通過使第一模具10相對於經固定的第二模具20而移動從而進行,也可通過使第一模具10及第二模具20兩者移動從而進行。Next, the step of mode locking ( S30 ) is performed. The step of mold locking ( S30 ) can be performed as follows, for example. First, it can be carried out in the following manner: the
接下來,進行樹脂成形的步驟(S40)。樹脂成形的步驟(S40)例如可如以下那樣進行。首先,圖4所示的傳遞驅動機構60經由柱塞單元支撐板62使柱塞單元61上升。藉此,柱塞64上升,如圖14的示意性局部截面圖所示,將供給於料筒22內的樹脂擠出至料筒22的外部。Next, a resin molding step ( S40 ) is performed. The resin molding step ( S40 ) can be performed, for example, as follows. First, the
接下來,被擠出至料筒22的外部的樹脂熔融並蓄積在滯料部12。接著,將熔融後的樹脂移送至包含第一模具10的凹部11和第二模具20的凹部21的模腔90內。然後,通過樹脂固化從而將成形對象物1密封等,藉此進行成形對象物1的樹脂成形。Next, the resin extruded to the outside of the
圖15及圖16中,表示對通過實施方式的樹脂成形裝置中的柱塞64移動而進行的、樹脂70向模腔90內的移送進行圖解的示意性放大局部截面圖。如圖15所示,在設置成形對象物的步驟(S20)後且鎖模的步驟(S30)前,在料筒22內設置固態的樹脂70a,柱塞64位於固態的樹脂70a的下側。15 and 16 are schematic enlarged partial cross-sectional views illustrating transfer of the
在隨後的對成形對象物1進行樹脂成形的步驟(S40)中,如圖16所示,柱塞64向第一模具10的滯料部12擠出料筒22內的固態的樹脂70a,固態的樹脂70a因第一模具10的未圖示的加熱板而熔融,熔融的樹脂70蓄積在滯料部12的內部。然後,熔融的樹脂70因柱塞64移動所產生的壓力而通過樹脂通路14,被移送至模腔90內的成形對象物1上。然後,熔融的樹脂70固化,成形對象物1的樹脂成形完成。In the subsequent step (S40) of resin molding the object to be molded 1, as shown in FIG. The
此外,上文中,對實施方式的樹脂成形裝置使用具有圖5所示的包含多個柱塞64的單列柱塞列641的傳遞驅動機構60的情況的、實施方式的樹脂成形品的製造方法進行了說明,但實施方式的樹脂成形裝置也可使用例如圖17的示意性平面圖所示那樣的第二模具20,並且代替為例如圖6及圖7所示那樣的具有多列柱塞列的傳遞驅動機構60,來製造樹脂成形品。In addition, in the above, the method of manufacturing the resin molded article of the embodiment is carried out in the case where the resin molding apparatus of the embodiment uses the
控制部68構成為可控制柱塞列的傳遞輸出。圖18中,表示實施方式的樹脂成形裝置的控制部68控制柱塞列的傳遞輸出的動作的一例的流程圖。控制部68首先從輸入輸出部67獲取運行條件。此處,運行條件中,包含柱塞列的列數及與所述柱塞列的列數對應地設定的傳遞輸出值(傳遞輸出的設定值)。The
接下來,控制部68基於運行條件對放大器69輸出指令值(校正值)。控制部68基於柱塞列的列數,輸出控制部68的記憶部所記憶的校正值。即,控制部68在使用柱塞列的列數為單個的傳遞驅動機構60的情況下,輸出柱塞列的列數為單個時的校正值。在將柱塞列的列數為單個的傳遞驅動機構60更換為柱塞列的列數為多個的傳遞驅動機構60的情況下,控制部68切換為與所述柱塞列的列數相應的校正值並輸出至放大器69。Next, the
接著,控制部68基於運行條件對傳遞驅動機構60輸出指令值(傳遞輸出的設定值)。控制部68根據柱塞列的列數,輸出控制部68的記憶部記憶的傳遞輸出的設定值。例如在柱塞列的列數為單個的情況下,控制部68輸出柱塞列的列數為單個時的、傳遞輸出的設定值。而且,例如在柱塞列的列數為多個的情況下,控制部68輸出與所述柱塞列的列數對應的、傳遞輸出的設定值。Next, the
接下來,控制部68確認傳遞驅動機構60的柱塞列的傳遞輸出是否達到傳遞輸出的設定值。控制部68通過放大器69來獲取基於檢測器66(第一檢測器66a、第二檢測器66b及第三檢測器66c)所進行的檢測的、柱塞列的傳遞輸出值。此處,來自放大器69的傳遞輸出值為基於校正值對基於檢測器66所進行的檢測的、柱塞列的傳遞輸出值加以校正而得的值。另外,控制部68基於這些值的比較來判斷所獲取的傳遞輸出值是否到達傳遞輸出的設定值。此外,也可利用控制部68或檢測器66(第一檢測器66a、第二檢測器66b及第三檢測器66c)來進行生成傳遞輸出時的校正。進而,也可在控制部68與放大器69之間設置校正部,利用所述校正部來進行生成傳遞輸出時的校正。Next, the
控制部68在判斷為柱塞列的傳遞輸出的校正後的值達到傳遞輸出的設定值的情況下,不對傳遞驅動機構60輸出旨在變更柱塞列的傳遞輸出的指令。即,控制部68將傳遞輸出值維持於一定值,以使柱塞列的上升運行停止。When the
另一方面,控制部68在判斷為傳遞輸出的校正後的值未達到傳遞輸出的設定值的情況下,對傳遞驅動機構60輸出用於使柱塞列的傳遞輸出上升的指令。控制部68對傳遞驅動機構60輸出用於使柱塞列的傳遞輸出上升的指令,直到判斷為柱塞列的傳遞輸出值達到傳遞輸出的設定值為止。On the other hand, when it is determined that the corrected value of the transmission output has not reached the set value of the transmission output, the
表1的左欄中,表示代替傳遞驅動機構60而對圖9所示的檢定夾具900實際施加,並由基準檢測器所檢測的柱塞列的傳遞輸出值。進而,表1的中欄中,表示由使用圖4及圖5所示的具有單列柱塞列641的傳遞驅動機構60的、實施方式的樹脂成形裝置實際施加,並基於檢測器66(第一檢測器66a、第二檢測器66b及第三檢測器66c)的柱塞列的傳遞輸出值。表1的右欄中表示這些輸出值的差。In the left column of Table 1, the transmission output value of the plunger row detected by the reference detector is shown by actually applied to the
表2及表3的左欄中,表示代替傳遞驅動機構60而對圖9所示的檢定夾具900實際施加,並由基準檢測器所檢測的柱塞列的傳遞輸出值。進而,表2及表3的中欄中,表示由使用圖6及圖7所示的具有兩列柱塞列643的傳遞驅動機構60的、實施方式的樹脂成形裝置實際施加,並基於檢測器66(第一檢測器66a、第二檢測器66b及第三檢測器66c)的柱塞列的傳遞輸出值。表2及表3的右欄中表示這些輸出值的差。In the left column of Table 2 and Table 3, the transmission output value of the plunger row detected by the reference detector which is actually applied to the
表1~表3的「基準檢測器的輸出值[kN]」的欄的數值表示由基準檢測器800實際施加的柱塞列的傳遞輸出值,「檢測器的輸出值[kN]」的欄的數值表示基於由實施方式的樹脂成形裝置的檢測器66(第一檢測器66a、第二檢測器66b及第三檢測器66c)實際檢測的檢測值的、柱塞列的傳遞輸出值。而且,表1~表3的「差[kN]」的欄的數值表示「檢測器的輸出值[kN]」的欄的數值與「基準檢測器的輸出值[kN]」的欄的數值的差。表1~表3的「差[kN]」的欄的數值小的情況下,表示能更準確地把握實際的柱塞列的傳遞輸出的值。The values in the columns of "Output value of the reference detector [kN]" in Tables 1 to 3 indicate the transfer output value of the plunger row actually applied by the
此外,表1及表2的「檢測器的輸出值[kN]」表示柱塞列的列數為單個的情況下的、經校正值校正後的值,相對於此,表3的「檢測器的輸出值[kN]」的欄的數值表示柱塞列的列數為兩列的情況下的、基於校正值所運算的輸出值。In addition, the "detector output value [kN]" in Table 1 and Table 2 indicates the value corrected by the correction value in the case where the number of plunger rows is single, while the "detector output value [kN]" in Table 3 The numerical value in the column of output value [kN]" indicates the output value calculated based on the correction value when the number of plunger rows is two.
[表1]
[表2]
[表3]
如由表2的「差[kN]」的欄的數值、及表3的「差[kN]」的欄的數值的比較所表明,確認到在使用具有兩列柱塞列的傳遞驅動機構的情況下,相較於基於與單列柱塞列相應的校正值來進行運算,基於與兩列柱塞列相應的校正值來進行運算的情況下,能更準確地把握實際的柱塞列的傳遞輸出的值。As shown by the comparison of the numerical values in the column of "difference [kN]" in Table 2 and the numerical value in the column of "difference [kN]" in Table 3, it was confirmed that in the case of using a transmission drive mechanism having two rows of plunger rows, In this case, the transmission of the actual plunger row can be grasped more accurately when the calculation is performed based on the correction value corresponding to the two-row plunger row than when the calculation is performed based on the correction value corresponding to the single-row plunger row. output value.
這樣,實施方式的樹脂成形裝置中,控制部構成為可根據柱塞列的列數來切換對檢測器所檢測的傳遞輸出值進行校正的校正值,因而可更準確地控制柱塞列的傳遞輸出。In this way, in the resin molding apparatus of the embodiment, the control unit is configured to switch the correction value for correcting the transfer output value detected by the detector according to the number of plunger rows, so that the transfer of the plunger row can be controlled more accurately. output.
如以上那樣,對實施方式進行了說明,但將所述實施方式的各結構適當組合也是從最初開始預定。As mentioned above, although embodiment was demonstrated, appropriate combination of each structure of the said embodiment is also planned from the beginning.
對本發明的實施方式進行了說明,但應認為本次公開的實施方式在所有方面為例示而非限制性。本發明的範圍是由發明申請專利範圍表示,意指包含與發明申請專利範圍均等的含意及範圍內的所有變更。Although the embodiment of the present invention has been described, it should be understood that the embodiment disclosed this time is illustrative and not restrictive in any respect. The scope of the present invention is indicated by the scope of claims for invention, and it is intended that all modifications within the meaning and scope equivalent to the claims for invention are included.
1:成形對象物 10:第一模具 11:第一凹部 12:滯料部 13:第一模具板 14:樹脂通路 20:第二模具 21:第二凹部 22:料筒 23:第二模具板 30:第一模具固持器 31:第一板 32:第一輔助塊 40:第二模具固持器 41:第二輔助塊 42:第二板 50:第二模具固持器安裝塊 60:傳遞驅動機構 61:柱塞單元 62:柱塞單元支撐板 63a:第一傳遞驅動軸 63b:第二傳遞驅動軸 63c:第三傳遞驅動軸 64、64a、64b:柱塞 64c:虛擬柱塞 65:柱塞單元本體 65c:虛擬柱塞單元本體 66:檢測器 66a:第一檢測器 66b:第二檢測器 66c:第三檢測器 67:輸入輸出部 68:控制部 69:放大器 70、70a:樹脂 90:模腔 200:第一平臺 300:可動平臺 400:第二平臺 500:連杆 600:鎖模機構 631a、631b、631c:中心 632、741、741a、741b:直線 641、642、643:柱塞列 740、740a、740b:前端 751、752:中點 800:基準檢測器 900:檢定夾具 1000:鑄模機構部 2000:載入器 3000:載出器 A:模塑模塊 B:載入模塊 C:載出模塊 R1、R2:區域 S10~S50:步驟 C-C:中心線1: Forming object 10: The first mold 11: The first recess 12: Stuck material department 13: The first mold plate 14: Resin access 20: Second mold 21: Second recess 22: Barrel 23: Second mold plate 30: First Die Holder 31: First Board 32: The first auxiliary block 40: Second mold holder 41: Second auxiliary block 42: second board 50:Second mold holder mounting block 60: Transfer drive mechanism 61:Plunger unit 62:Plunger unit support plate 63a: First transmission drive shaft 63b: Second transmission drive shaft 63c: The third transmission drive shaft 64, 64a, 64b: plunger 64c: Virtual plunger 65: Plunger unit body 65c: Virtual plunger unit body 66: detector 66a: first detector 66b: Second detector 66c: The third detector 67: Input and output section 68: Control Department 69: Amplifier 70, 70a: resin 90: mold cavity 200: the first platform 300: movable platform 400: second platform 500: connecting rod 600: clamping mechanism 631a, 631b, 631c: center 632, 741, 741a, 741b: straight line 641, 642, 643: plunger row 740, 740a, 740b: front end 751, 752: Midpoint 800: Benchmark detector 900: Verification fixture 1000: Molding Mechanism Department 2000: Loader 3000: loader A: Molded module B: load module C: load out module R1, R2: area S10~S50: Steps C-C: Centerline
圖1為實施方式的樹脂成形品的製造裝置的示意性平面圖。 圖2為實施方式的樹脂成形裝置的示意性立體圖。 圖3為實施方式的樹脂成形裝置的示意性局部截面圖。 圖4為用於實施方式的樹脂成形裝置的、傳遞驅動機構的一例的示意性側面圖。 圖5為圖4所示的傳遞驅動機構的示意性平面圖。 圖6為用於實施方式的樹脂成形裝置的、傳遞驅動機構的另一例的示意性側面圖。 圖7為圖6所示的傳遞驅動機構的示意性平面圖。 圖8為實施方式的樹脂成形品的製造方法的流程圖。 圖9為對決定校正值的步驟的一例進行圖解的示意性局部截面圖。 圖10為實施方式的樹脂成形裝置的主要部分的框圖。 圖11為對設置成形對象物的步驟的一例進行圖解的示意性局部截面圖。 圖12為用於實施方式的樹脂成形裝置的、第二模具的一例的示意性平面圖。 圖13為對設置成形對象物的步驟的一例進行圖解的示意性局部截面圖。 圖14為對實施方式的樹脂成形品的製造方法的鎖模步驟進行圖解的示意性局部截面圖。 圖15為對通過柱塞移動而進行的樹脂向模腔內的移送進行圖解的示意性放大局部截面圖。 圖16為對通過柱塞移動而進行的樹脂向模腔內的移送進行圖解的示意性放大局部截面圖。 圖17為用於實施方式的樹脂成形裝置的、第二模具的另一例的示意性平面圖。 圖18為實施方式的樹脂成形裝置的控制部對柱塞列的傳遞輸出進行控制的動作的一例的流程圖。FIG. 1 is a schematic plan view of a manufacturing apparatus of a resin molded article according to an embodiment. Fig. 2 is a schematic perspective view of a resin molding device according to an embodiment. Fig. 3 is a schematic partial cross-sectional view of a resin molding device according to an embodiment. 4 is a schematic side view of an example of a transmission drive mechanism used in the resin molding apparatus of the embodiment. FIG. 5 is a schematic plan view of the transmission drive mechanism shown in FIG. 4 . 6 is a schematic side view of another example of a transmission drive mechanism used in the resin molding apparatus of the embodiment. FIG. 7 is a schematic plan view of the transmission drive mechanism shown in FIG. 6 . FIG. 8 is a flowchart of a method of manufacturing a resin molded article according to an embodiment. FIG. 9 is a schematic partial cross-sectional view illustrating an example of a procedure for determining a correction value. Fig. 10 is a block diagram of a main part of the resin molding apparatus according to the embodiment. Fig. 11 is a schematic partial cross-sectional view illustrating an example of a step of setting an object to be formed. Fig. 12 is a schematic plan view of an example of a second die used in the resin molding apparatus of the embodiment. Fig. 13 is a schematic partial cross-sectional view illustrating an example of a step of setting an object to be formed. 14 is a schematic partial cross-sectional view illustrating a mold clamping step of the method of manufacturing a resin molded article according to the embodiment. Fig. 15 is a schematic enlarged partial cross-sectional view illustrating the transfer of the resin into the cavity by the movement of the plunger. Fig. 16 is a schematic enlarged partial sectional view illustrating the transfer of resin into the cavity by the movement of the plunger. Fig. 17 is a schematic plan view of another example of the second mold used in the resin molding apparatus of the embodiment. 18 is a flowchart of an example of the operation of the control unit of the resin molding apparatus according to the embodiment to control the transmission output of the plunger row.
60:傳遞驅動機構60: Transfer drive mechanism
66:檢測器66: detector
67:輸入輸出部67: Input and output section
68:控制部68: Control Department
69:放大器69: Amplifier
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201501217A (en) * | 2013-06-20 | 2015-01-01 | Towa Corp | Compressed resin sealing method and compressed resin sealing apparatus for electronic component |
CN107107408A (en) * | 2014-12-04 | 2017-08-29 | 加注有限责任公司 | Injection molding apparatus and the method for manufacturing part |
TW201808576A (en) * | 2016-05-26 | 2018-03-16 | 山田尖端科技股份有限公司 | Resin molding die and resin molding method |
TW201838043A (en) * | 2017-02-08 | 2018-10-16 | 日商信越工程股份有限公司 | Resin sealing device and resin sealing method |
TW201936358A (en) * | 2017-08-21 | 2019-09-16 | 日商Towa股份有限公司 | Resin molding apparatus and method for manufacturing resin molded product |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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NL193526C (en) * | 1991-02-26 | 2000-01-04 | Boschman Tech Bv | Device for encapsulating electronic parts with a plastic. |
JPH11260844A (en) | 1998-03-12 | 1999-09-24 | Toshiba Corp | Semiconductor resin encapsulating equipment |
JP2000343576A (en) | 1999-06-09 | 2000-12-12 | Mitsubishi Electric Corp | Injection molding machine, semiconductor sealing device and production of semiconductor device |
JP2002018889A (en) | 2000-07-07 | 2002-01-22 | Shibaura Mechatronics Corp | Controlling method for semiconductor molding apparatus |
JP2003347329A (en) | 2002-05-29 | 2003-12-05 | Sainekkusu:Kk | Semiconductor resin sealing device |
JP5039443B2 (en) | 2007-06-18 | 2012-10-03 | アピックヤマダ株式会社 | Transfer molding apparatus and semiconductor device manufacturing method |
JP5151553B2 (en) | 2008-02-29 | 2013-02-27 | 日本電気株式会社 | Resin injection apparatus, resin injection method, resin injection program, and recording medium |
JP5608523B2 (en) | 2010-11-26 | 2014-10-15 | アピックヤマダ株式会社 | Resin sealing device |
JP2013026360A (en) * | 2011-07-20 | 2013-02-04 | Apic Yamada Corp | Resin sealing device |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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TW201808576A (en) * | 2016-05-26 | 2018-03-16 | 山田尖端科技股份有限公司 | Resin molding die and resin molding method |
TW201838043A (en) * | 2017-02-08 | 2018-10-16 | 日商信越工程股份有限公司 | Resin sealing device and resin sealing method |
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