TWI774987B - Inspection method and inspection device - Google Patents

Inspection method and inspection device Download PDF

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TWI774987B
TWI774987B TW108132387A TW108132387A TWI774987B TW I774987 B TWI774987 B TW I774987B TW 108132387 A TW108132387 A TW 108132387A TW 108132387 A TW108132387 A TW 108132387A TW I774987 B TWI774987 B TW I774987B
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temperature
crumbs
polymer
crumb
moisture
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TW202033957A (en
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河津祐介
難波諒
野瀨誠
藤岡俊文
物部浩之
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日商Ube彈性體股份有限公司
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    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/44Resins; Plastics; Rubber; Leather
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00Investigating or analyzing materials by the use of thermal means
    • G01N25/56Investigating or analyzing materials by the use of thermal means by investigating moisture content
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

本發明提供一種能於脫水/乾燥步驟後且成型前檢測出過量水分之檢查技術。本發明之屑粒狀之聚合物之檢查方法的特徵在於:連續地供給聚合並脫水乾燥後之屑粒狀之聚合物,檢測上述屑粒狀之聚合物內之包含過量水分之屑粒。The present invention provides an inspection technique capable of detecting excess moisture after the dehydration/drying step and before molding. The crumb polymer inspection method of the present invention is characterized by continuously supplying the crumb polymer after polymerization, dehydration and drying, and detecting crumbs containing excessive moisture in the crumb polymer.

Description

檢查方法及檢查裝置Inspection method and inspection device

本發明係一種檢查所供給移送之屑粒狀之聚合物中有無水分之技術。The present invention is a technique for checking the presence or absence of moisture in the supplied and transferred polymer in the form of crumbs.

作為屑粒狀之聚合物之製程之一例,簡單地對丁二烯橡膠等合成橡膠之製程進行說明。As an example of the manufacturing process of the crumb polymer, the manufacturing process of synthetic rubber such as butadiene rubber will be briefly described.

製備作為原料之丁二烯溶液,並添加觸媒,使其等聚合,而形成聚合物溶液(聚合步驟)。對所獲得之聚合物溶液進行蒸汽處理,回收屑漿狀之聚合物(脫溶劑步驟)。藉由擠出機將含有水分之聚合物脫水,並藉由熱風等進行乾燥,而使其成為乾燥屑粒狀(脫水/乾燥步驟)。壓縮屑粒狀之聚合物使其成型(成型步驟)。再者,一般而言,將合成橡膠之製造過程中產生之粒徑為3〜10 mm左右之顆粒稱為屑粒。A butadiene solution as a raw material is prepared, a catalyst is added, and it is polymerized to form a polymer solution (polymerization step). The obtained polymer solution is subjected to steam treatment to recover the polymer in the form of a scrap (desolvation step). The polymer containing water is dehydrated by an extruder, and is dried by hot air or the like to be in the form of dry crumbs (dehydration/drying step). The polymer in the form of crumbs is compressed and molded (molding step). Furthermore, generally speaking, particles with a particle size of about 3 to 10 mm generated during the production of synthetic rubber are called crumbs.

本申請案之發明係關於成型步驟者。對成型步驟更詳細地進行說明。The invention of the present application relates to the molding step. The molding step will be described in more detail.

利用加壓成型機(通常稱為壓型機,以下稱為壓型機),將屑粒狀或粉末狀之半製品加壓成型為具有直六面體形狀之加壓成型品(通常稱為成型件,以下稱為成型件)。Using a press molding machine (usually referred to as a press machine, hereinafter referred to as a press machine), the semi-finished product in the form of crumbs or powder is press-molded into a press-molded product with a straight hexahedron shape (usually called a press-molded product). moldings, hereinafter referred to as moldings).

此時,自動計量屑粒狀之聚合物,並將其調整至規定重量範圍內。將其成型為規定重量範圍內之成型件,並核查重量,藉由聚乙烯膜、聚苯乙烯膜等薄膜包裝袋被覆橡膠成型件,將複數個橡膠成型件收納至集裝箱等收納用容器,然後向使用者出貨。At this time, the polymer in the form of crumbs is automatically measured and adjusted within the specified weight range. It is molded into a molded product within a specified weight range, and the weight is checked, the rubber molded product is covered with a film packaging bag such as polyethylene film, polystyrene film, etc. Ship to users.

再者,於使用者方,對成型件進行溶融或溶解、硫化、加工。Furthermore, on the user side, the molded article is melted or dissolved, vulcanized, and processed.

如上所述,於合成橡膠之製程中,未必使用水分,因此於脫水/乾燥步驟中會將水分去除。然而,實際上會殘存於脫水/乾燥步驟中未被徹底去除之水分。於包含過量水分之成型件中,存在產生外觀上之缺陷,或於使用者方發生故障之風險。As mentioned above, in the process of synthetic rubber, moisture is not necessarily used, so it is removed during the dehydration/drying step. However, water that is not completely removed in the dehydration/drying step actually remains. In moldings containing excess moisture, there is a risk of creating cosmetic defects or malfunctioning on the part of the user.

針對於此,在先前之一般成型步驟中,會於成型件成型後且搬出前,由監察員實施外觀目視檢查,藉此檢測包含過量水分之成型件。然而,對於成型件內部之過量水分,監察員無法檢測。又,監察員之負擔亦較大。In view of this, in the previous general molding step, after the molding and before unloading, the inspector conducts a visual inspection of the appearance, thereby detecting the molding containing excessive moisture. However, the inspector was unable to detect excess moisture inside the molded part. In addition, the burden of the inspector is also greater.

於專利文獻1中,提出了如下技術:使用具有平滑面之紅外線透射透明板,一面擠壓橡膠,一面經由透明板對試樣橡膠照射紅外線,藉此能以較短時間且高精度地測定試樣橡膠之水分含有率。 先前技術文獻 專利文獻In Patent Document 1, a technique is proposed in which a sample rubber can be irradiated with infrared rays through a transparent plate using an infrared-transmitting transparent plate having a smooth surface while pressing the rubber, whereby the test sample can be measured with high accuracy in a short period of time. The moisture content of the sample rubber. prior art literature Patent Literature

專利文獻1:日本專利特開2004-020192號公報Patent Document 1: Japanese Patent Laid-Open No. 2004-020192

[發明所欲解決之問題][Problems to be Solved by Invention]

根據專利文獻1之技術,藉由測定試樣橡膠之水分含有率,並確認其為特定值以下,能推測出成為製品之成型件中亦不含過量水分。According to the technique of Patent Document 1, by measuring the moisture content of the sample rubber and confirming that it is equal to or less than a specific value, it can be estimated that there is no excess moisture in the molded article to be a product.

然而,本申請案之發明人經過對過量水分殘存機制進行研究後認為,是否會殘存過量水分之規律性較低,難以預測,不易根據試樣橡膠之水分含有率為特定值以下,而斷定成為製品之成型件中亦不含過量水分。However, the inventor of the present application, after researching the mechanism of excess water retention, believes that the regularity of whether excess water will remain is low and difficult to predict. The molded part of the product also does not contain excess moisture.

本發明係鑒於上述問題點而完成,其目的在於:提供一種能於脫水/乾燥步驟後且成型前檢測出過量水分之檢查技術。 [解決問題之技術手段]The present invention has been made in view of the above problems, and an object of the present invention is to provide an inspection technique capable of detecting excess moisture after the dehydration/drying step and before molding. [Technical means to solve problems]

解決上述問題之本發明係一種檢查方法,係連續地供給聚合並脫水乾燥後之屑粒狀之聚合物,檢測上述屑粒狀之聚合物內之包含過量水分之屑粒。The present invention to solve the above-mentioned problems is an inspection method for continuously supplying a crumb-like polymer after polymerization, dehydration and drying, and detecting crumbs containing excessive moisture in the crumb-like polymer.

藉由檢測成型件成型前之屑粒中包含過量水分之屑粒,能檢測出先前不能偵測到之成型件內部包含之過量水分。By detecting crumbs containing excess moisture in crumbs prior to molding of the molded part, excess moisture contained within the previously undetectable molded part can be detected.

於上述發明中,較佳為如下設定:測定上述屑粒狀之聚合物之溫度,基於溫度差,檢測包含過量水分之屑粒。In the above-mentioned invention, it is preferable to measure the temperature of the above-mentioned crumb-like polymer, and to detect crumbs containing excessive moisture based on the temperature difference.

於上述發明中,較佳為如下設定:對連續地供給之屑粒狀之聚合物,測定各測點之溫度,求出複數個測點之平均溫度,檢測與溫度低於平均溫度之測點對應之屑粒。In the above invention, it is preferable to set as follows: the temperature of each measurement point is measured for the continuously supplied crumb polymer, the average temperature of a plurality of measurement points is obtained, and the measurement point whose temperature is lower than the average temperature is detected. Corresponding crumbs.

於上述發明中,較佳為如下設定:檢測與相對於上述平均溫度之溫度差為9.5℃以上之測點對應之屑粒。In the said invention, it is preferable to set so that the chip|tip corresponding to the measurement point whose temperature difference with respect to the said average temperature is 9.5 degreeC or more is detected.

藉此,能檢測出過量水分氣化之影響、或溫度難以上升之影響所導致之低溫部。This makes it possible to detect a low temperature portion due to the effect of vaporization of excess moisture or the effect of hard temperature rise.

於上述發明中,較佳為如下設定:供給上述脫水乾燥後之屑粒狀之聚合物時的聚合物之平均溫度為40〜70℃。In the above invention, it is preferable to set the average temperature of the polymer at the time of supplying the polymer in the form of crumbs after dehydration and drying to 40 to 70°C.

藉此,過量水分所導致之上述影響容易凸顯。In this way, the above-mentioned effects caused by excessive moisture are easily highlighted.

於上述發明中,較佳為如下設定:上述包含過量水分之屑粒為塊狀。In the above-mentioned invention, it is preferable to set as follows: the above-mentioned crumbs containing excessive moisture are in the form of lumps.

包含過量水分之屑粒容易結塊。又,若為塊狀,則易於檢測出氣化或溫度難以上升之影響。Crumbs that contain excess moisture tend to agglomerate. Moreover, if it is a block shape, it becomes easy to detect the influence of vaporization and temperature rise.

於上述發明中,較佳為如下設定:包含過量水分之屑粒之含水率為1質量%以上。In the above-mentioned invention, it is preferable to set the moisture content of the crumbs containing excess moisture to 1 mass % or more.

解決上述問題之本發明係一種檢查裝置,其具備:供給機構,其連續地供給聚合並脫水乾燥後之屑粒狀之聚合物;溫度測定機構,其測定自上述供給機構供給之屑粒狀之聚合物之溫度;及判斷機構,其使用上述溫度測定機構算出與平均溫度之溫度差,並基於溫度差檢測包含過量水分之屑粒。The present invention to solve the above-mentioned problems is an inspection apparatus comprising: a supply mechanism for continuously supplying the polymer in the form of crumbs after polymerization, dehydration and drying; the temperature of the polymer; and a judging mechanism that calculates a temperature difference from the average temperature using the above-mentioned temperature measuring mechanism, and detects chips containing excess moisture based on the temperature difference.

於上述發明中,較佳為如下設定:上述過量水分檢查機構為溫度記錄相機。 [發明之效果]In the above-mentioned invention, it is preferable to set as follows: the above-mentioned excessive moisture inspection means is a temperature recording camera. [Effect of invention]

本發明能於脫水/乾燥步驟後且成型前檢測出過量水分。The present invention can detect excess moisture after the dehydration/drying step and before molding.

〜系統構成〜~System Components~

圖1係本發明之一實施形態之系統構成圖。FIG. 1 is a system configuration diagram of an embodiment of the present invention.

系統具備連續供給機構、過量水分檢查機構、成型件等值重量計測機構、成型件成型機構、搬出機構、控制機構,而執行一系列動作。The system is equipped with a continuous supply mechanism, an excess moisture inspection mechanism, a molded part equivalent weight measurement mechanism, a molded part molding mechanism, a carry-out mechanism, and a control mechanism, and executes a series of actions.

連續供給機構例如為振動送料機1。振動送料機1將聚合後經過脫水/乾燥步驟8之屑粒狀之聚合物2連續地供給至系統。The continuous feeding mechanism is, for example, the vibrating feeder 1 . The vibrating feeder 1 continuously feeds the polymer 2 in the form of crumbs after the dehydration/drying step 8 to the system.

過量水分檢查機構例如為溫度記錄相機3。溫度記錄相機3設置於振動送料機1上,藉由偵測乾燥不充分之屑粒所導致之溫度未上升,而檢測過量水分(詳見下文)。The excess moisture inspection means is, for example, the temperature recording camera 3 . The temperature recording camera 3 is arranged on the vibrating feeder 1, and detects excess moisture by detecting the temperature not rising due to insufficiently dried crumbs (see below for details).

成型件等值重量計測機構例如為具有料斗之計量裝置6。料斗設置於連續供給機構與成型件成型機構之間。料斗具有上料斗與下料斗。藉由控制上料斗與下料斗之動作,並利用計量裝置6計量料斗內儲存之屑粒狀之聚合物之重量,而計測相當於成型件之屑粒狀之聚合物之重量。The equivalent weight measuring mechanism of the molded part is, for example, a measuring device 6 having a hopper. The hopper is arranged between the continuous supply mechanism and the molding device forming mechanism. The hopper has an upper hopper and a lower hopper. By controlling the action of the upper hopper and the lower hopper, and using the weighing device 6 to measure the weight of the crumb polymer stored in the hopper, the weight of the crumb polymer equivalent to the molding is measured.

成型件成型機構例如為加壓成型機(壓型機)7。供給藉由成型件等值重量計測機構所計量出之量之屑粒狀之聚合物,並對其施以加壓成型,而使其成為成型件。The molded article molding mechanism is, for example, a press molding machine (pressing machine) 7 . A crumb-like polymer in an amount measured by a molded product equivalent weight measuring mechanism is supplied, and pressure-molded is applied to form a molded product.

搬出機構例如為輸送機14。於輸送機14之中途設置有重量計測裝置15。The unloading mechanism is, for example, the conveyor 14 . A weight measuring device 15 is installed in the middle of the conveyor 14 .

控制裝置30自過量水分檢查機構3輸入過量水分檢查資訊,自重量計測裝置15輸入成型件重量資訊,而執行區分控制。即,將未檢測出過量水分、重量處於正規範圍內之成型件作為正規品12搬往下一步驟(包裝步驟)9,將檢測出過量水分、或/及重量處於正規範圍外之成型件作為不合規品13剔除,並送往另一步驟10(再處理)。The control device 30 inputs the excess moisture inspection information from the excess moisture inspection mechanism 3, and inputs the molded part weight information from the weight measuring device 15, and executes the division control. That is, a molded product whose excess moisture is not detected and whose weight is within the normal range is transferred to the next step (packaging step) 9 as a regular product 12, and a molded product whose excess moisture is detected or/and whose weight is outside the regular range is regarded as a regular product 12. Non-compliant products 13 are rejected and sent to another step 10 (reprocessing).

過量水分並非實質瑕疵,藉由將包含過量水分之屑粒狀之聚合物再處理,可作為材料加以再利用。Excessive moisture is not a substantial defect, and can be reused as a material by reprocessing the crumbed polymer containing excess moisture.

〜本申請案之基本概念〜 本申請案之發明係著眼於過量水分所導致之溫度差者。圖2係作為本發明基本概念之根據之驗證試驗結果。圖2之縱軸為屑粒之含水率(質量%),橫軸為由[(WP表面溫度)-(屑粒平均溫度)]求出之數值。此處,所謂WP表面溫度,係指屑粒中被猜想為包含過量水分之部分之測定溫度,所謂屑粒平均溫度,係指複數個測點之平均溫度。~Basic concept of this application~ The invention of the present application focuses on the temperature difference caused by excess moisture. Figure 2 shows the results of a verification test as a basis for the basic concept of the present invention. The vertical axis of FIG. 2 is the moisture content (mass %) of the chips, and the horizontal axis is the value obtained by [(WP surface temperature)−(chip average temperature)]. Here, the so-called WP surface temperature refers to the measured temperature of a portion of the chips that is presumed to contain excessive moisture, and the so-called chip average temperature refers to the average temperature of a plurality of measuring points.

聚合後經過脫水/乾燥步驟再被連續地供給至成型步驟之屑粒狀之聚合物之平均溫度為40〜70℃。更詳細而言,於在冬季進行之驗證試驗中,屑粒狀之聚合物之平均溫度為48.8℃,而於在夏季進行之驗證試驗中,屑粒狀之聚合物之平均溫度為60.7℃。The average temperature of the polymer in the form of crumbs after the dehydration/drying step and then continuously fed to the molding step after polymerization is 40 to 70°C. In more detail, in the verification test conducted in winter, the average temperature of the crumb polymer was 48.8°C, and in the verification test conducted in summer, the average temperature of the crumb polymer was 60.7°C.

再者,驗證試驗場所之冬季平均外部氣溫為6℃左右,夏季平均外部氣溫為26℃左右。脫水/乾燥步驟後之屑粒狀之聚合物之平均溫度會受到外部氣溫之影響。In addition, the average outside temperature of the verification test site was about 6°C in winter, and the average outside temperature in summer was about 26°C. The average temperature of the crumb polymer after the dehydration/drying step is affected by the outside air temperature.

無論是夏季還是冬季,屑粒狀之聚合物之溫度均以平均值為中心於-20℃〜+15℃之範圍內存在差異。調查此時之屑粒狀之聚合物之含水率。Regardless of whether it is summer or winter, the temperature of the crumb polymer varies from -20°C to +15°C with the average value as the center. The moisture content of the crumb polymer at this time was investigated.

由圖2之結果可知以下情況。在WP表面溫度處於屑粒平均溫度附近或高於屑粒平均溫度之屑粒中,含水率極低。另一方面,在WP表面溫度低於平均溫度之屑粒中,含水率較高。尤其,於WP表面溫度與屑粒平均溫度之溫度差為9.5℃以上之情形時,屑粒之含水率非常高。From the results in Fig. 2, the following can be seen. The moisture content is extremely low in crumbs where the WP surface temperature is near or higher than the average crumb temperature. On the other hand, in the crumbs whose WP surface temperature is lower than the average temperature, the moisture content is higher. In particular, when the temperature difference between the WP surface temperature and the average temperature of the chips is 9.5°C or more, the moisture content of the chips is very high.

又,包含過量水分之屑粒可見到容易結塊之傾向。將該塊中包含過量水分之部分定義為WET POINT(WP)。推測認為,脫水/乾燥步驟後之屑粒具有相對較高之溫度,而於包含過量水分之屑粒中,水分氣化時會奪取屑粒之熱量,或與過量水分增加相應地,溫度變得難以上升。In addition, the crumbs containing excessive moisture tend to be easily agglomerated. The portion of the block containing excess moisture is defined as WET POINT (WP). It is presumed that the crumbs after the dehydration/drying step have a relatively high temperature, and in crumbs containing excess moisture, the heat of the crumbs is captured when the moisture vaporizes, or the temperature becomes corresponding to the increase of the excess moisture. Difficult to ascend.

無論是夏季還是冬季,均可見同樣之傾向。於試驗之一例中,在冬季,屑粒表面溫度為48.8℃,WP為35.4℃(屑粒表面溫度與WP之溫度差為13.4℃),在夏季,屑粒表面溫度為60.7℃,WP為47.4℃(屑粒表面溫度與WP之溫度差為13.3℃)。The same tendency can be seen in both summer and winter. In one example of the test, in winter, the surface temperature of the crumb is 48.8 °C, and the WP is 35.4 °C (the temperature difference between the surface temperature of the crumb and the WP is 13.4 °C), and in summer, the surface temperature of the crumb is 60.7 °C, and the WP is 47.4 °C. °C (the temperature difference between the chip surface temperature and the WP is 13.3 °C).

由該結果可判斷出,測定屑粒狀之聚合物之溫度,能檢測出包含過量水分之屑粒,尤其,藉由著眼於溫度差,能不依存於外部氣溫,而確實地檢測出WET POINT。尤其,能檢測出包含1質量%以上過量水分之屑粒之WET POINT。From this result, it can be judged that by measuring the temperature of the crumb-like polymer, crumbs containing excessive moisture can be detected, and in particular, by focusing on the temperature difference, WET POINT can be reliably detected regardless of the outside air temperature. . In particular, it is possible to detect WET POINT of chips containing 1 mass % or more of excess moisture.

〜包含過量水分之屑粒(WET POINT)之檢測〜 WET POINT係基於溫度差而檢測。更具體而言,求出屑粒之複數個測點之平均溫度,將溫度低於平均溫度之測點部分設定為WET POINT,藉此能檢測出WET POINT。~Detection of crumbs containing excess moisture (WET POINT)~ WET POINT is detected based on the temperature difference. More specifically, the average temperature of a plurality of measurement points of the chips is obtained, and the portion of the measurement point whose temperature is lower than the average temperature is set as the WET POINT, whereby the WET POINT can be detected.

藉由將與上述平均溫度之差為9.5℃以上之測點部分設定為WET POINT,能更高精度地檢測出WET POINT。WET POINT can be detected with higher accuracy by setting the measurement point portion where the difference from the above average temperature is 9.5° C. or more as WET POINT.

屑粒之平均溫度例如可藉由以下方法而求出。The average temperature of the chips can be obtained, for example, by the following method.

圖3係溫度測定之一例。溫度測定機構為溫度記錄相機。能實現30幀/秒之攝像。溫度記錄相機3例如可使用CHINO公司製造之CPA-L25B。FIG. 3 shows an example of temperature measurement. The temperature measuring mechanism is a temperature recording camera. Able to achieve 30 frames / second camera. As the temperature recording camera 3, for example, CPA-L25B manufactured by CHINO Corporation can be used.

利用溫度記錄相機拍攝屑粒並形成圖像,測定各圖像中與特定範圍(例如,600 mm×500 mm)對應之圖像範圍(圖示虛線)內之像素單位之溫度。由各像素之測定溫度能求出屑粒之平均溫度。The crumbs are photographed and imaged using a thermographic camera, and the temperature in each image is measured in units of pixels within the image range (dashed line shown) corresponding to a specific range (eg, 600 mm x 500 mm). The average temperature of the chips can be obtained from the measured temperature of each pixel.

求取平均溫度時,測點較佳為100〜100,000,更佳為1,000〜100,000,特佳為10,000〜100,000。能高精度地檢測出WET POINT。When obtaining the average temperature, the measurement points are preferably 100 to 100,000, more preferably 1,000 to 100,000, and particularly preferably 10,000 to 100,000. WET POINT can be detected with high accuracy.

進而,抽出溫度較平均溫度低特定值以下(例如9.5℃)之像素,藉此檢測WET POINT。Further, pixels whose temperature is lower than the average temperature by a predetermined value or less (eg, 9.5° C.) are extracted to detect WET POINT.

〜過量水分產生機制推定〜 前提條件為,藉由經過脫水/乾燥步驟,不會產生含有過量水分之屑粒。儘管如此,實際上依然會產生含有過量水分之屑粒。關於其機制進行了探討。~Estimated mechanism of excess moisture production~ The prerequisite is that, by going through the dehydration/drying step, no crumbs with excess moisture are produced. Nonetheless, crumbs containing excess moisture are actually produced. Its mechanism is discussed.

於脫水/乾燥步驟中,水分會被排出至外部。此時,小片牢牢黏附於排出部內壁面。小片吸收被排出至外部之水分之一部分。In the dehydration/drying step, moisture is discharged to the outside. At this time, the small pieces are firmly adhered to the inner wall surface of the discharge portion. The small pieces absorb a part of the moisture discharged to the outside.

存在含有水分之小片基於某種契機剝離,而混入向下一步驟(成型步驟)供給之屑粒中之風險。There is a risk that the small pieces containing moisture are peeled off at some point and mixed into the crumbs supplied to the next step (molding step).

因此,要預測含有過量水分之屑粒之產生非常困難。Therefore, it is very difficult to predict the generation of crumbs containing excess moisture.

〜關於屑粒塊〜 作為屑粒之特徵,屑粒具有黏著性,屑粒彼此容易黏結,推測認為其易於形成屑粒塊。據推測,包含過量水分之屑粒塊混入,由此導致WET POINT產生。~About the crumb block~ As a feature of the crumbs, the crumbs have adhesiveness, and the crumbs are easily bonded to each other, and it is presumed that the crumbs are likely to be formed. Presumably, crumbs containing excess moisture were mixed in, thereby causing WET POINT to be generated.

另一方面,若過量水分彙聚而存在,則氣化之影響等容易凸顯,從而易於檢測出低溫部(參照圖3)。On the other hand, if the excess water is concentrated and exists, the influence of vaporization and the like are likely to be prominent, and the low-temperature portion can be easily detected (see FIG. 3 ).

因此,本申請案適於WET POINT之檢測,但並不限定於屑粒塊,亦可應用於屑粒。Therefore, the present application is suitable for the detection of WET POINT, but it is not limited to crumb blocks, and can also be applied to crumbs.

再者,一般屑粒之粒徑為3〜10 mm。於本申請案中,將粒徑達20 mm以上者稱為屑粒塊。Furthermore, the particle size of the general crumbs is 3 to 10 mm. In this application, those with a particle size of 20 mm or more are referred to as crumbs.

〜效果〜 綜上所述,能於脫水/乾燥步驟後且成型件成型前檢測出過量水分。其結果,亦能檢測出成型件內部之過量水分。~Effect~ In summary, excess moisture can be detected after the dehydration/drying step and before the molding is formed. As a result, excess moisture inside the molded part can also be detected.

再者,由於能在成型件成型前檢測出過量水分,因此例如亦存在如下可能性:於向壓型機落下之軌道上,將包含過量水分之屑粒狀之聚合物剔除。Furthermore, since excess moisture can be detected before the molding is formed, there is also a possibility, for example, that the crumb-like polymer containing excess moisture is removed on the track that falls toward the press.

然而,屑粒狀之聚合物具有黏著性,顆粒彼此容易黏結,結果,粒度變得不均一而難以預測行為。於在向壓型機落下之軌道上,將包含過量水分之屑粒狀之聚合物剔除之情形時,需要複雜之機構。另一方面,只要於成型件成型後,將包含過量水分之成型件去除,便能容易且確實地將其去除。However, crumb polymers are cohesive and the particles tend to stick to each other. As a result, the particle size becomes non-uniform and unpredictable behavior. In the case of rejecting the crumb polymer containing excess moisture on the track falling toward the press, a complicated mechanism is required. On the other hand, as long as the molded part containing excess moisture is removed after the molded part is formed, it can be easily and surely removed.

根據上文所述,無需溫度記錄相機與簡單控制以外之構成或步驟。無需對現有之製程追加新構成或新步驟,便能輕易且確實地檢測出過量水分。亦不會對製品之品質造成影響。According to the above, no configuration or steps other than a temperature recording camera and simple control are required. Excessive moisture can be easily and reliably detected without adding new components or steps to the existing process. It will not affect the quality of the products.

又,藉由著眼於溫度差,能不依存於外部氣溫,而確實地進行檢測。In addition, by focusing on the temperature difference, it is possible to reliably perform detection without depending on the outside air temperature.

〜對象之屑粒狀之聚合物〜 形成成型件之對象之屑粒狀之聚合物為可硫化之橡膠,例如可列舉天然橡膠(NR)、異戊二烯橡膠(IR)、苯乙烯丁二烯橡膠(SBR)、丁二烯橡膠(BR)、氯丁二烯橡膠(CR)、丁基橡膠(IIR)、腈系橡膠(NBR)、乙丙橡膠(EPM、EPDM)、氯磺化聚乙烯橡膠(CSM)、丙烯酸系橡膠(ACM)、胺基甲酸酯系橡膠(U)、矽酮系橡膠(VMQ、PVMQ、FVMQ)、氟系橡膠(FKM)、多硫化橡膠(T)等。尤其,就本發明而言,最佳為對丁二烯橡膠(BR)之應用。於驗證試驗中,使用丁二烯橡膠。~The object's crumb polymer~ The crumb polymer that forms the object of the molding is a vulcanizable rubber, for example, natural rubber (NR), isoprene rubber (IR), styrene butadiene rubber (SBR), butadiene rubber. (BR), chloroprene rubber (CR), butyl rubber (IIR), nitrile rubber (NBR), ethylene propylene rubber (EPM, EPDM), chlorosulfonated polyethylene rubber (CSM), acrylic rubber ( ACM), urethane rubber (U), silicone rubber (VMQ, PVMQ, FVMQ), fluorine rubber (FKM), polyvulcanized rubber (T), etc. In particular, application to butadiene rubber (BR) is preferred for the present invention. In the verification test, butadiene rubber was used.

〜總結〜 經過脫水/乾燥步驟再被連續地供給至成型步驟之屑粒狀之聚合物之平均溫度為40〜70℃。例如,於在冬季進行之驗證試驗中,平均溫度為48.8℃,而於在夏季進行之驗證試驗中,平均溫度為60.7℃。調查此時之屑粒狀之聚合物之含水率。在溫度處於平均值附近或高於平均之屑粒中,含水率極低。另一方面,在溫度低於平均之屑粒中,尤其在與平均溫度之溫度差為9.5℃以上之情形時,含水率顯著較高。作為一例,對包含過量水分之屑粒,測定塊之溫度,冬季為35.4℃(溫度差為13.4℃),夏季為47.4℃(溫度差為13.3℃)。由該結果可知,藉由測定屑粒狀之聚合物之溫度,並著眼於溫度差,能不依存於外部氣溫,而確實地檢測出包含過量水分之屑粒。~Summarize~ The average temperature of the polymer in the form of crumbs after the dehydration/drying step and then continuously fed to the molding step is 40 to 70°C. For example, in the verification test conducted in winter, the average temperature was 48.8°C, and in the verification test conducted in summer, the average temperature was 60.7°C. The moisture content of the crumb polymer at this time was investigated. In crumbs with temperatures around or above average, the moisture content is extremely low. On the other hand, in the crumbs whose temperature is lower than average, especially when the temperature difference from an average temperature is 9.5 degreeC or more, the moisture content is remarkably high. As an example, when the temperature of the block was measured for the chips containing excessive moisture, it was 35.4°C (a temperature difference of 13.4°C) in winter and 47.4°C (a temperature difference of 13.3°C) in summer. From this result, by measuring the temperature of the crumb-like polymer and focusing on the temperature difference, it is possible to reliably detect crumbs containing excessive moisture regardless of the outside air temperature.

1:振動送料機 2:橡膠屑粒 3:溫度記錄相機 6:附料斗之計量裝置 7:壓型機(加壓成型機) 8:脫水/乾燥步驟 9:包裝步驟 10:再處理步驟 11:異常偵測信號 12:正規品(製品) 13:不合規品 14:輸送機 15:重量計測裝置 30:控制裝置1: Vibrating feeder 2: Rubber crumbs 3: Temperature recording camera 6: Metering device with hopper 7: Pressing machine (pressure forming machine) 8: Dehydration/Drying Step 9: Packaging step 10: Reprocessing steps 11: Abnormal detection signal 12: Regular product (product) 13: Non-compliant products 14: Conveyor 15: Weight measuring device 30: Control device

圖1係本發明之一實施形態之系統構成圖。 圖2係作為本發明基本概念之根據之驗證試驗結果。 圖3係本發明之一實施形態之檢測例。FIG. 1 is a system configuration diagram of an embodiment of the present invention. Figure 2 shows the results of a verification test as a basis for the basic concept of the present invention. Fig. 3 is a detection example of an embodiment of the present invention.

2:橡膠屑粒 2: Rubber crumbs

3:溫度記錄相機 3: Temperature recording camera

6:附料斗之計量裝置 6: Metering device with hopper

7:壓型機(加壓成型機) 7: Pressing machine (pressure forming machine)

8:脫水/乾燥步驟 8: Dehydration/Drying Step

9:包裝步驟 9: Packaging step

10:再處理步驟 10: Reprocessing steps

11:異常偵測信號 11: Abnormal detection signal

12:正規品(製品) 12: Regular product (product)

13:不合規品 13: Non-compliant products

14:輸送機 14: Conveyor

15:重量計測裝置 15: Weight measuring device

30:控制裝置 30: Control device

Claims (7)

一種檢查方法,其特徵在於:連續地供給聚合並脫水乾燥後之屑粒狀之聚合物,測定上述屑粒狀之聚合物之溫度,基於溫度差,檢測上述屑粒狀之聚合物內之包含過量水分之屑粒;其中對連續地供給之屑粒狀之聚合物,測定各測點之溫度,求出複數個測點之平均溫度,檢測與比平均溫度低9.5℃以上之溫度之測點對應之屑粒。 An inspection method comprising: continuously supplying polymerized, dewatered and dried crumb-like polymer, measuring the temperature of the crumb-like polymer, and detecting the content of the crumb-like polymer based on the temperature difference Excessive moisture crumbs; among which, for the continuously supplied crumb-like polymer, the temperature of each measuring point is measured, the average temperature of a plurality of measuring points is obtained, and the measuring point whose temperature is more than 9.5°C lower than the average temperature is detected. Corresponding crumbs. 如請求項1之檢查方法,其中供給上述脫水乾燥後之屑粒狀之聚合物時的聚合物之平均溫度為40~70℃。 The inspection method of claim 1, wherein the average temperature of the polymer when the dewatered and dried crumb-like polymer is supplied is 40 to 70°C. 如請求項1或2之檢查方法,其中上述包含過量水分之屑粒為塊狀。 The inspection method of claim 1 or 2, wherein the above-mentioned crumbs containing excess moisture are in the form of lumps. 如請求項1或2之檢查方法,其中包含過量水分之屑粒之含水率為1質量%以上。 The inspection method according to claim 1 or 2, wherein the moisture content of the crumbs containing excess moisture is 1% by mass or more. 如請求項3之檢查方法,其中包含過量水分之屑粒之含水率為1質量%以上。 According to the inspection method of claim 3, the moisture content of the chips containing excessive moisture is 1 mass % or more. 一種檢查裝置,其特徵在於具備:供給機構,其連續地供給聚合並脫水乾燥後之屑粒狀之聚合物; 溫度測定機構,其測定自上述供給機構供給之屑粒狀之聚合物之各測點之溫度;及判斷機構,其使用上述溫度測定機構算出與平均溫度之溫度差,並將與比平均溫度低9.5℃以上之溫度之測點對應之屑粒作為包含過量水分之屑粒進行檢測。 An inspection device characterized by comprising: a supply mechanism for continuously supplying the polymer in the form of crumbs after polymerization, dehydration and drying; A temperature measuring means for measuring the temperature of each measuring point of the crumb polymer supplied from the above-mentioned supply means; and a judging means for calculating the temperature difference from the average temperature using the above-mentioned temperature measuring means, and comparing the temperature with the temperature lower than the average temperature The crumbs corresponding to the measurement points with a temperature above 9.5°C are detected as crumbs containing excessive moisture. 如請求項6之檢查裝置,其中上述溫度測定機構為溫度記錄相機。 The inspection device according to claim 6, wherein the temperature measuring means is a temperature recording camera.
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