TWI768333B - Heat dissipation module and electronic device - Google Patents

Abstract

A heat dissipation module disposed in an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes a tube having a heating zone and a cooling zone, a magnetic generator disposed outside the tube and corresponding to a position next to the heating zone, a working fluid filled in the tube, and a plurality magnetic particles disposed in the working fluid. The heat source generates and transfers heat to the heating zone. When the heating zone is above the cooling zone along a gravity direction, the magnetic particles pass through the heating zone and absorbs heat therein, such that magnetic loss of the magnetic particles occurs due to temperature increasing, and the magnetic particles move to the cooling zone by gravity. The magnetic particles dissipates heat in the cooling zone and magnetic restoration occurs due to temperature decreasing, and the magnetic particles move to the heating zone by magnetic attraction of the magnetic generator. The magnetic particles moving in the tube makes a cycle.

Description

Cooling Modules and Electronic Devices

The present invention relates to a heat dissipation module and an electronic device.

In recent years, with the development of the technology industry, electronic devices such as notebook computers, personal digital assistants, and smart phones have frequently appeared in daily life. Some electronic components mounted in these electronic devices usually generate heat energy during operation. If the accumulated heat energy cannot be removed smoothly, the operation performance of the electronic device will be affected. Therefore, a heat dissipation module or a heat dissipation element, such as a heat dissipation fan, a heat dissipation sticker or a heat dissipation pipe, is usually arranged inside the electronic device to help dissipate the heat generated by the electronic element to the outside of the electronic device.

In the above heat dissipation module, the heat dissipation fan can effectively dissipate heat energy to the outside, but it consumes a lot of electricity, weighs more and requires a large space, which is not conducive to application in electronic devices that pursue a thin and light design, and is easy to generate Noise affects the additional communication functions of electronic devices. In addition, in order for the cooling fan to dissipate heat by convection, the casing of the electronic device needs to be provided with an opening, which also reduces the mechanical strength of the electronic device.

On the other hand, the heat dissipation material can absorb the heat energy of electronic components to reduce the surface temperature, and its cost and required space are low, so it can be widely used in electronic devices, but it is difficult for the heat energy to be further dissipated to the outside through other components , its cooling effect is limited. Furthermore, the heat pipe can transfer the heat energy of the electronic element to another board, but it lacks the convection effect, so the heat dissipation effect is limited.

In view of this, the existing heat pipe can be further matched with the evaporator and the condenser to form a loop, and the phase change heat transfer medium that can be converted between two phases (such as liquid and gas) by absorbing or releasing heat energy can be used in the heat pipe. Internal circulation flows to absorb thermal energy in the evaporator and release it in the condenser, thereby transferring the thermal energy from the electronic components to the outside. However, the heat transfer medium only flows in the loop by its own phase change, and its flow effect is poor, and thus its heat dissipation effect is limited.

The present invention provides a heat dissipation module and an electronic device, which form a circulation for heat dissipation by changing the magnetic properties of magnetic particles with heat absorption and heat dissipation.

The heat dissipation module of the present invention is arranged on an electronic device. Electronic devices have heat sources. The heat dissipation module includes a pipeline, a magnetic generator, a working fluid and a plurality of magnetic particles. The pipeline has a heating zone and a cooling zone. The heat source is in thermal contact with the heating zone to transfer heat to the heating zone. The magnetic generator is arranged outside the pipeline and corresponding to the heating zone. The working fluid is filled in the pipeline. The magnetic particles are movably arranged in the working fluid. When the heating zone is located above the cooling zone along the direction of gravity, the magnetic particles passing through the heating zone lose their magnetic properties due to heat absorption and increase in temperature, and move to the cooling zone by gravity. The magnetic particles in the cooling zone recover magnetically due to heat dissipation and temperature reduction, and are magnetically attracted back to the heating zone by the magnetic generator. The travel of magnetic particles in the pipeline forms a cycle.

The electronic device of the present invention includes a body, a pipeline, a magnetic generator, a working fluid and a plurality of magnetic particles. The body is equipped with a heat source. The pipeline is arranged in the body. The pipeline has a heating zone and a cooling zone. The heat source is in thermal contact with the heating zone to transfer heat to the heating zone. The magnetic generator is arranged outside the pipeline and corresponding to the heating zone. The working fluid is filled in the pipeline. The magnetic particles are movably arranged in the working fluid. When the heating zone is located above the cooling zone along the direction of gravity, the magnetic particles passing through the heating zone lose their magnetic properties due to heat absorption and increase in temperature, and move to the cooling zone by gravity. The magnetic particles in the cooling zone are magnetically recovered due to heat dissipation and temperature reduction, and are magnetically attracted back to the heating zone by the magnetic generator. The travel of magnetic particles in the pipeline forms a cycle.

Based on the above, the heat dissipation module and the electronic device using the same are respectively equipped with a working fluid and a plurality of magnetic particles in the pipeline. In addition to making the magnetic particles move in the pipeline by the working fluid, it is also The magnetic properties of the magnetic particles will change with temperature, and the corresponding components are set to make the magnetic particles circulate in the pipeline.

When the heating zone is located above the cooling zone along the direction of gravity, the magnetic particles lose their magnetic properties due to heat absorption, so that they are not attracted by the magnetic generator and cannot resist gravity and move to the cooling zone. After recovery, it can be magnetically attracted back to the heating zone by the magnetic generator, thereby making the magnetic particles circulate in the pipeline to achieve the effect of heat dissipation. In this way, the working fluid and the magnetic particles can respectively provide required heat dissipation effects according to different states.

In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows.

FIG. 1 is a schematic diagram of a heat dissipation module according to an embodiment of the present invention. Figure 2 shows the hysteresis curves of magnetic particles at different temperatures. Please refer to FIG. 1 and FIG. 2 at the same time. In this embodiment, the heat dissipation module 100 is suitable for an electronic device. The electronic device has a heat source 11 , such as a processor chip or a display chip of the electronic device. The heat dissipation module 100 includes The pipeline 110, the magnetic generator 120, the working fluid 140 and the plurality of magnetic particles 130, wherein the pipeline 110 has a heating area 112 and a cooling area 113, and the heat source 11 is in thermal contact with the heating area 112, so that the heat generated by the heat source 11 is transferred to heating zone 112 . The magnetic generator 120 includes an electromagnet, a permanent magnet or a combination thereof, and is disposed outside the pipeline 110 and corresponding to the heating zone 112 . The working fluid 140 is filled in the pipeline 110 , and the magnetic particles 130 , such as magnetic powder in the form of micro-particles or magnetic powder in the form of nano-particles, are movably arranged in the working fluid 140 . Here, the pipeline 110 and the working fluid 140 therein are virtualized, so as to facilitate the identification of the magnetic particles 130 in the working fluid 140 . Furthermore, the pipeline 110 is a loop pipeline, and the magnetic particles 130 use the working fluid 140 as a medium to smoothly move in the pipeline 110 . The heating zone 112 and the cooling zone 113 belong to opposite sides of the circuit pipeline. The position of the magnetic generator 120 corresponding to the heat source 11 is not limited herein. Anything that can magnetically attract the magnetic particles 130 in the cooling zone 113 back to the heating zone 112 is applicable to this embodiment.

As shown in FIG. 2 , the magnetic particles 130 are made of neodymium-iron-boron magnets (NdFeB), for example, and its hysteresis curve in the second quadrant is shown here, wherein the magnetic field intensity H (the horizontal axis in the figure) and the magnetic induction intensity B are shown here. The relationship between (the vertical axis in the figure) is non-linear, but its changing trend with temperature is obvious, that is, when the temperature increases, the hysteresis force of the magnetic particles 130 will decrease, and vice versa, it will also The hysteresis force will increase due to the decrease in temperature.

In this way, as shown in FIG. 1 , when the heating zone 112 is located above the cooling zone 113 along the gravitational direction G, the magnetic particles 130 passing through the heating zone 112 will lose their magnetic properties due to heat absorption and temperature increase, as shown in the figure. Sections of the magnetic particles 130 are marked by hatching. Then, the magnetically depleted magnetic particles 130 will reduce the magnetic attraction with the magnetic generator 120 , and thus cannot resist the gravity at this time, so they move to the cooling zone 113 from top to bottom by gravity. That is to say, when the magnetic particles 130 are magnetically lost, the magnetic attraction force of the magnetic generator 120 to the magnetic particles 130 will be smaller than the gravitational potential energy of the magnetic particles 130 . Therefore, the magnetic particles 130 in the heating zone 112 to reduce the hysteresis force will slide down to the cooling zone 113 under the influence of gravity.

Next, the magnetic particles 130 in the cooling zone 113 recover magnetically due to heat dissipation and temperature reduction, that is, the magnetic loss of the magnetic particles 130 in this embodiment is reversible. In this way, the hysteresis force of the magnetic particles 130 will be gradually recovered due to the gradual heat dissipation, and then smoothly attracted by the magnetic generator 120 and moved back to the heating zone 112 again. Accordingly, the magnetic particles 130 will constitute a circulating flow path (flow path) F1 in the pipeline 110 .

FIG. 3 is a schematic diagram of the heat dissipation module in another state. Compared with FIG. 1 , FIG. 3 shows a use state in which FIG. 1 is turned upside down. Referring to FIG. 3 , in this embodiment, the heat dissipation module 100 is, for example, a two-phase flow heat dissipation module. In the state of FIG. 3 , the cooling area 113 is located above the heating area 112 along the gravity direction G, so the working fluid 140 The heating area 112 absorbs heat to change from liquid to gas and moves to the cooling area 113 , and the working fluid 140 changes from gas to liquid in the cooling area 113 due to heat dissipation and flows back to the heating area 112 . In this way, the working fluid 140 will constitute another circulating flow path F2 in the pipeline 110 . It can be clearly seen from FIG. 3 that, in this state, since the gravitational potential energy of the magnetic particles 130 is greater than the molecular potential energy of the working fluid 140 due to heat absorption, the magnetic particles 130 remain in the heating zone 112 and do not follow the operation. Fluid 140 moves.

It can be clearly seen from FIG. 1 and FIG. 3 that the heat dissipation module 100 of this embodiment can form different traveling flow paths F1 and F2 by the working fluid 140 and the magnetic particles 130 , so as to correspond to the different positions of the heat source 11 . Or different heat dissipation requirements of electronic devices in different operating positions. In other words, the heat dissipation module 100 of this embodiment provides a composite heat dissipation means, and switches the heat dissipation mode according to the gravity state.

It should also be noted that the heat dissipation module 100 is not limited to that shown in FIG. 1 and FIG. For example, even if the electronic device is in an inclined state, that is, the heat dissipation module 100 of FIG. 1 is placed at an inclination, the heating area 112 and the cooling area 113 are located on opposite sides of the pipeline 110, so they are along the direction of gravity G. There are still high and low differences. If the heating area 112 is set higher than the cooling area 113, it can still reach as shown in FIG. 1, and the magnetic particles 130 after endothermic are moved to the cooling area 113 by gravity to dissipate heat.

In addition, in this embodiment, the magnetic particles 130 respectively have an outer coating layer (not shown) and have an outline and a surface roughness that can avoid mutual aggregation, that is, as shown in FIG. 1 and FIG. The outer contour of the line facilitates its movement in the working fluid 140 . This can effectively prevent the magnetic particles 130 from agglomerating with each other to cause agglomeration and the like.

FIG. 4 is a schematic diagram of an electronic device and its internal heat dissipation module. Please refer to FIG. 4 , the electronic device 10 is, for example, a tablet computer, which is provided with a heat source 11 and a heat dissipation module, and the heat generated by the heat source 11 is transmitted to the heat dissipation module through the heat pipe 12 , and the heat dissipation module is connected with the electronic device. The body structure of the electronic device 10 is in contact with each other and covers most of the area of the electronic device 10 , so that the pipeline 210 can be regarded as a cooling area away from the heat source 11 .

Here, the heat dissipation module is composed of similar components as in the previous embodiment, so the same parts will not be described in detail in this embodiment. Different from the previous embodiment, the pipeline 210 of this embodiment includes a heating area 212, a cooling area 213 and a magnetic generating area 211. As mentioned above, the magnetic generator includes an electromagnet, a permanent magnet or a combination thereof, in order to allow cooling The magnetic particles in the area 213 can be smoothly attracted to the heating area 212, so it is expected that different types of magnetic generators are correspondingly arranged in different segments S1, S2 of the magnetic generating area 211, and the segments S1, S2, S2 can generate different magnetic forces to form a magnetic gradient.

For example, the heat source 11 of the present embodiment is also the control unit of the electronic device 10 , which is electrically connected to the electromagnets corresponding to the segments S1 and S2 (ie, the magnetic generator 120 of the previous embodiment). Therefore, The magnitude of the provided magnetic force and the generation frequency of the magnetic force can be adjusted at the segments S1 and S2 as required, so as to smoothly guide the magnetic particles back to the heating area 212 .

In addition, if the control unit corresponds to the embodiment shown in FIG. 3 , when the cooling area 113 is higher than the heating area 112 along the gravity direction G, that is, when the working fluid 140 is used as the heat dissipation means, the control unit can The magnetic generator 120 is stopped or hibernated accordingly. Otherwise, the control unit activates the magnetic generator 120 . In other words, the control unit can control the magnetic generator 120 correspondingly according to the state of the heating area 112 and the cooling area 113 of the pipeline 110 in the gravitational field in the heat dissipation module 100 .

To sum up, in the above-mentioned embodiments of the present invention, the heat dissipation module and the electronic device using the same are respectively provided with working fluid and a plurality of magnetic particles in the pipeline, except that the magnetic particles are dissipated by the working fluid. In addition to the movement in the pipeline, at the same time, because the magnetic properties of the magnetic particles will change with temperature, they are arranged with corresponding components to allow the magnetic particles to form a circulation in the pipeline.

When the heating zone is located above the cooling zone along the direction of gravity, the magnetic particles lose their magnetic properties due to heat absorption, so that they are not attracted by the magnetic generator and cannot resist gravity and move to the cooling zone. After recovery, it can be magnetically attracted back to the heating zone by the magnetic generator, thereby making the magnetic particles circulate in the pipeline to achieve the effect of heat dissipation. On the contrary, when the cooling zone is located above the heating zone along the direction of gravity, the working fluid and another circulation formed by it are used as the current heat dissipation means. In this way, the working fluid and the magnetic particles can respectively provide required heat dissipation effects according to different states.

Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be determined by the scope of the appended patent application.

10: Electronics 11: Heat source 12: Heat pipe 100: cooling module 110, 210: pipeline 112, 212: Heating zone 113, 213: Cooling area 120: Magnetic Generator 130: Magnetic particles 140: Working fluid 211: Magnetic generating area B: Magnetic induction intensity F1, F2: traveling flow path G: direction of gravity H: Magnetic Field Strength S1, S2: Segmentation

FIG. 1 is a schematic diagram of a heat dissipation module according to an embodiment of the present invention. Figure 2 shows the hysteresis curves of magnetic particles at different temperatures. FIG. 3 is a schematic diagram of the heat dissipation module in another state. FIG. 4 is a schematic diagram of an electronic device and its internal heat dissipation module.

11: Heat source

100: cooling module

110: Pipeline

112: Heating zone

113: Cooling zone

120: Magnetic Generator

130: Magnetic particles

140: Working fluid

F1: Traveling flow path

G: direction of gravity

Claims (17)

A heat dissipation module is arranged on an electronic device, the electronic device has a heat source, and the heat dissipation module includes: a pipeline with a heating area and a cooling area, the heat source is in thermal contact with the heating area, so that the heat generated by the heat source is transferred to the heating area; a magnetic generator, disposed outside the pipeline and corresponding to the heating zone; a working fluid, filled in the pipeline; and A plurality of magnetic particles are movably arranged in the working fluid, wherein when the heating zone is located above the cooling zone along the direction of gravity, the magnetic particles passing through the heating zone become magnetic due to heat absorption and temperature increase. loss, and move to the cooling zone by gravity, the magnetic particles in the cooling zone recover magnetically due to heat dissipation and temperature reduction, and are magnetically attracted back to the heating zone by the magnetic generator, so that the magnetic particles The travel of the body in the pipeline constitutes a cycle. The heat dissipation module of claim 1, wherein the pipeline is a circuit pipeline, and the heating area and the cooling area belong to opposite sides of the circuit pipeline. The heat dissipation module of claim 1, wherein when the magnetic particles are magnetically lost, the magnetic attraction force of the magnetic generator to the magnetic particles is smaller than the gravitational potential energy of the magnetic particles. The heat dissipation module according to claim 1, which is a two-phase flow heat dissipation module. The heat dissipation module of claim 1, wherein when the cooling zone is located above the heating zone along the gravitational direction, the working fluid absorbs heat in the heating zone and changes from a liquid state to a gaseous state and moves to the cooling zone, And the working fluid dissipates heat in the cooling zone, changes from gaseous state to liquid state and flows to the heating zone, so that the working fluid travels in the pipeline to form another cycle. The heat dissipation module according to claim 1, wherein the magnetic particles respectively have outer coating layers and have outlines and surface roughnesses that can prevent each other from aggregating. The heat dissipation module of claim 1, wherein the magnetic generator comprises an electromagnet, a permanent magnet or a combination thereof. An electronic device, comprising: a body with a heat source configured therein; a pipeline disposed in the body, the pipeline has a heating area and a cooling area, the heat source is in thermal contact with the heating area, so that the heat generated by the heat source is transmitted to the heating area; a magnetic generator, disposed outside the pipeline and corresponding to the heating zone; a working fluid, filled in the pipeline; and A plurality of magnetic particles are movably arranged in the working fluid, wherein when the heating zone is located above the cooling zone along the direction of gravity, the magnetic particles passing through the heating zone become magnetic due to heat absorption and temperature increase. loss, and move to the cooling zone by gravity, the magnetic particles in the cooling zone recover magnetically due to heat dissipation and temperature reduction, and are magnetically attracted back to the heating zone by the magnetic generator, so that the magnetic particles The travel of the body in the pipeline forms a cycle. The electronic device of claim 8, wherein the pipeline is a circuit pipeline, and the heating area and the cooling area belong to opposite sides of the circuit pipeline. The electronic device of claim 8, wherein when the magnetic particles are magnetically lost, the magnetic attraction force of the magnetic generator to the magnetic particles is smaller than the gravitational potential energy of the magnetic particles. The electronic device of claim 8, wherein the heat dissipation module is a two-phase flow heat dissipation module. The electronic device of claim 8, wherein when the cooling zone is located above the heating zone along the gravitational direction, the working fluid absorbs heat in the heating zone and changes from a liquid state to a gaseous state and moves to the cooling zone, and The working fluid dissipates heat in the cooling zone and changes from a gaseous state to a liquid state and flows to the heating zone, so that the traveling of the working fluid in the pipeline forms another cycle. The electronic device as claimed in claim 8, wherein the magnetic particles are respectively provided with an outer coating layer and have outlines and surface roughness that can avoid mutual aggregation. The electronic device of claim 8, wherein the magnetic generator comprises an electromagnet, a permanent magnet, or a combination thereof. The electronic device of claim 8, wherein the magnetic particles are re-magnetized by the magnetic generator when they move from the cooling zone to the magnetic zone. The electronic device of claim 8, wherein the magnetic generator is an electromagnet, the electronic device further comprising: A control unit is electrically connected to the electromagnet to control the magnetic field generated by the magnetic generator to the pipeline. The electronic device of claim 16, wherein the control unit is the heat source.

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