TWI766289B - Method, system and apparatus for uniformed surface measurement - Google Patents

Abstract

This invention discloses a system and a method for uniformed surface measurement, in which a sensor is disposed to measure a carrier member of a polishing machine, and by controlling the pivoting of a sensor carrier carrying the sensor and the rotation of a rotating platform in the polishing machine to adjust a measurement trajectory of the sensor on the surface of the carrier member to achieve uniformed surface measurement of the carrier member and timely construction of the surface topography, and to achieve timely monitoring of the polishing state of the carrier member, thereby reducing the cost of replacing the carrier member in the polishing process. This invention also discloses a sensor apparatus for uniformed surface measurement.

Description

Method, system and sensor device for surface homogenization measurement

The present invention relates to surface measurement technology, in particular to a method, system and sensor device for measuring the surface uniformity of a carrier used in a polishing process.

In the fabrication of integrated circuits (ICs), it is often necessary to use a polishing process (eg, chemical mechanical polishing (CMP)) to polish or planarize the wafer or substrate to reduce the amount The increase in the number of stacked layers makes it difficult to focus exposure in subsequent wafer or substrate processes.

In conventional polishing machines used for polishing process, the wafer or substrate to be polished is mainly placed on a carrier and provided with a carrier (for example, a polishing pad or a lapping disc with or without abrasive, Polishing of wafers or substrates by polishing slurry applied to the carrier . It can be seen that the carrier is one of the important factors affecting the polishing efficiency of the wafer or the substrate.

However, in the above-mentioned polishing machine, the carrier will be worn out with the polishing process, so it is a consumable that needs to be replaced regularly. Due to the large area and the characteristics of non-removable after installation, it is difficult to effectively monitor the changes of the carrier during the process. Therefore, most technicians rely on the rule of thumb to evaluate the performance of the carrier. The surface status is used as the basis for replacement. Therefore, there is often a problem of wasted cost or poor polishing quality caused by replacing the carrier too early or too late.

Therefore, there is a need for a surface uniformity measurement method, system and sensor device for a carrier of a polishing machine, so as to solve the above-mentioned deficiencies in the prior art.

The present invention discloses a system for surface homogenization measurement, comprising: a polishing machine, a sensor carrier and a sensor, wherein the polishing machine comprises: a carrier for carrying a wafer, and a On the rotary platform on which the carrier is installed, the rotary platform is used to drive the carrier to rotate with the center of the rotary platform as the axis; the sensor carrier includes a shaft column arranged outside the rotary platform and a The shaft is pivoted and extends to the arm above the carrier, and is configured to pivot the arm above the rotating platform with the shaft as an axis; and the sensor is attached to the sensor The free end of the arm of the carrier is used to extract the surface information of the carrier.

In the above-mentioned system, it further includes: a control module, which is telecommunicationly connected with the rotating platform, the sensor carrier and the sensor, and is configured to: receive the carrier extracted by the sensor. surface information; controlling the sensor to extract the measurement track of the surface information of the carrier; and constructing the surface topography of the carrier according to the surface information, wherein the telecommunication connection includes wired or wireless signal transmission .

In the above-mentioned system, the method for the control module to control the sensor to extract the measurement track of the surface information of the carrier includes the following steps: controlling the rotating platform to rotate the rotating platform at a fixed direction and a fixed rotational speed to the rotating platform. The center of the circle is the axis to rotate; the pivoting range of the sensor carrier is controlled to be between the edge of the rotating platform and the center of the circle; and the pivoting speed of the sensor carrier is controlled so that the sensor is in The ray from the edge of the rotating platform to the center of the circle exhibits constant velocity motion.

In the above system, the measurement trajectories are spirals with equal spacing.

In the above-mentioned system, an output device telecommunicationly connected with the control module is further included, and is used to visualize the surface topography of the carrier.

In the above system, the control module is used for judging the service life of the carrier according to the surface information of the carrier, and when the carrier reaches the service life, the control module generates an alarm message to Output the alarm message to the output device.

In the above system, the surface information is height information of the surface of the carrier.

The present invention further provides a method for surface homogenization measurement, comprising: arranging a bearing member on a rotating platform of a polishing machine; making the rotating platform drive the bearing member to rotate around the center of the rotating platform as an axis; The sensor is placed at the free end of the arm of the sensor carrier, so that the sensor is suspended above the carrier; the arm of the sensor carrier is made of the shaft of the sensor carrier The shaft is pivoted on the rotating platform, and the shaft column is set outside the rotating platform; the sensor is made to pick up the surface information of the carrier; the sensor is adjusted to pick up the measurement of the surface information of the carrier and constructing the surface topography of the carrier according to the surface information.

In the above-mentioned method, the step of adjusting the measurement track of the sensor to extract the surface information of the carrier includes the following sub-steps: controlling the rotating platform in a fixed direction and a fixed rotational speed with the center of the rotating platform as the center of the circle. axis to rotate; control the pivoting range of the sensor carrier to be between the edge of the rotating platform and the center of the circle; and control the pivoting speed of the sensor carrier to make the sensor rotate during the rotation The ray from the edge of the platform to the center of the circle exhibits constant velocity motion.

In the above method, the measurement trajectories are spirals with equal intervals.

In the above method, the method further includes visualizing the surface topography of the carrier to an output device.

In the above method, the method further includes: judging the service life of the carrier according to the surface information of the carrier, and when the carrier reaches the service life, generating an alarm message to output the alarm message to an output device.

In the above method, the surface information is height information of the surface of the carrier.

The present invention further provides a sensor device for surface homogenization measurement, comprising: a sensor carrier, which includes a shaft column disposed outside a rotating platform and pivotally connected to the shaft column and extending to a bearing member an upper arm part, and the arm part is pivoted above the rotating platform with the shaft column as an axis; and a sensor is arranged on the free end of the arm part of the sensor carrier and used for extracting Surface information of the carrier.

As can be seen from the above, the system, method and sensor device for surface homogenization measurement of the present invention are provided with a sensor to measure the carrier in the polishing machine, and control the sensing of the carrier sensor by controlling the sensor. The pivoting of the tester carrier and the rotation of the rotating platform in the polishing machine adjust the measurement trajectory of the sensor on the surface of the carrier, so as to achieve uniform measurement of the carrier surface and real-time construction of the surface topography, and achieve accurate Real-time monitoring of the polishing status of the carrier, thereby improving the efficiency of the polishing process.

10: Sensor Vehicle

11: Sensor

20: Rotating Platform

21: Carrier

22: Dresser

23: Carrier

30: Control Module

40: Output device

S100~S600: Steps

FIG. 1 is a structural diagram of a system for surface measurement according to an embodiment of the present invention;

FIG. 2 is a top view of a system for surface measurement according to an embodiment of the present invention;

FIG. 3 is a diagram showing the relationship of components of a system for surface measurement according to an embodiment of the present invention;

FIG. 4 is a schematic view of the implementation of the method and system for surface measurement according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of an implementation of the method and system for surface measurement according to an embodiment of the present invention; and

FIG. 6 is a flow chart of steps of a method for surface measurement according to an embodiment of the present invention.

The following specific embodiments are used to illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to cooperate with the contents disclosed in the specification for the understanding and reading of those who are familiar with the art, and are not intended to limit the implementation of the present invention. Therefore, it has no technical significance. Any modification of the structure, change of the proportional relationship or adjustment of the size should still fall within the scope of the present invention without affecting the effect and the purpose that the present invention can achieve. The technical content disclosed by the invention can be covered within the scope.

Referring to FIG. 1, the system of the present invention can be applied to a polishing machine (eg, a CMP polishing machine) for polishing wafers and/or substrates. The polishing machine mainly includes a polishing pad or disc with or without abrasives, a polishing pad with or without grooves, a polishing disc or a platen provided with a carrier 21 , or the like), a rotating platform 20, a carrier 23 (eg, a head) that holds a wafer or substrate on a carrier 21 for polishing, and conditioning of the carrier 21 during the polishing process ), a conditioner 22 that cleans and regenerates roughness (eg, a diamond disk).

In addition to the above, the system of the present invention is further provided with an off-site sensor device, which has a sensor carrier 10 and a sensor 11, and the sensor carrier 10 can use its shaft column O _d (It is located outside the rotating platform 20) swings (ie, pivots) above the carrier 21, and the sensor 11 is suspended on the sensor carrier 10 on the arm pivotally connected to the shaft column O _d The free end of the part to perform surface measurements on the carrier 21 by the pivoting of the sensor carrier 10 . It should be noted that the sensor carrier 10 shown in the embodiments of the present invention is in the form of a robotic arm, but those skilled in the art will understand that the sensor carrier 10 can be set to other sensors that can be mounted as needed. The state of the device 11.

Please refer to FIG. 2 , which is a schematic view of the implementation of the sensor 11 of the present invention performing sweeping action on the carrier 21 mounted on the rotary platform 20 when the carrier 21 on the rotary platform 20 is viewed from a top view. Here, the remaining components of the polishing machine are omitted for convenience of illustration. From this, it can be observed that the sensor carrier 10 can pivot back and forth at the sweep angle θ above the carrier 21 mounted on the rotating platform 20 with its shaft column O _d as the axis. Therefore, the sensor carrier 10 is suspended on the sensor carrier 10 . The sensor 11 at the free end of the arm can move back and forth in the radial direction of the rotating platform 20 relative to the center O, and at the same time, the rotating platform 20 uses the center O as the rotation axis to drive the rotation of the carrier 21 to achieve a complete surface of the carrier 21 Measure. It should be noted that, in the embodiment of the present invention, the carrier 21 is set to have a similar size to the surface area of the rotating platform 20 and is placed coaxially with the center O. However, the carrier 21 can also be set to be as required. The dimension smaller than the surface area of the rotating platform 20 and being placed on a different axis from the center O is not limited to the above-mentioned aspect.

In the embodiment of the present invention, the pivoting of the sensor carrier 10 , the rotation of the rotating platform 20 and the surface measurement of the sensor 11 can be adjusted by the control module 30 , as shown in FIG. 3 . Specifically, the control module 30 is installed in the system in the form of software, hardware or firmware, and can be connected to the sensing device, the sensor carrier 10 , the sensor 11 , and the rotating platform 20 in a wired or wireless manner. A telecommunication connection (for example, setting the above components to communicate with each other through wired or wireless signal transmission), and is configured to set the pivoting of the sensor carrier 10 or the rotational speed of the rotating platform 20 according to the requirements of surface measurement, Receive the surface information of the carrier 21 measured by the sensor 11 and start/stop (ON/OFF) the surface measurement procedure.

In one embodiment, the control module 30 controls the measurement position of the sensor 11 relative to the center O in the radial direction of the rotating platform 20 by adjusting the sweeping angle θ of the sensor carrier 10 . For example, when the position to be measured on the carrier 21 is far from the center O of the rotating platform 20, the control module 30 can adjust the sensing The sweeping angle θ of the carrier 10 is set to a small value, so that the sensor 11 can be close to the center O to extract its surface information; conversely, when the position on the carrier 21 to be measured is close to the center O of the rotating platform 20 , the control module 30 can adjust the sweeping angle θ of the sensor carrier 10 to a larger value, so that the sensor 11 is close to the center O and extracts its surface information.

In another embodiment, the control module 30 controls the measurement section of the sensor 11 on the carrier 21 by adjusting the rotation of the rotating platform 20 . For example, the control module 30 can control the rotating platform 20 to rotate clockwise or counterclockwise at a fixed or non-fixed speed, so that the sensor 11 will not repeat the surface measurement in the same section of the carrier 21 Instead, the surface measurement is performed around the center O of the rotating platform 20 in a circular manner.

In yet another embodiment, the control module 30 is a computer device or similar hardware device loaded with imaging applications (eg, color conjugate focus imaging), and the sensor 11 is a probe for imaging (eg, application Non-contact sensors of optical, electromagnetic or inductive sensing types) are configured to extract height information of the surface of the carrier 21 (ie, the thickness information of the carrier 21). Therefore, through the imaging application of the control module 30 , the height information extracted by the sensor 11 can be used by the control module 30 to construct the surface topography of the carrier 21 (eg, the surface three-dimensional structure of the carrier 21 ) in real time. Further, due to the characteristic of dynamic imaging with time function when the control module 30 constructs the surface topography of the carrier 21 in real time, the control module 30 can enable the control module 30 to follow the pivot of the sensor carrier 10 between the sensor 11 and the sensor carrier 10 . The surface topography changes of the carrier 21 are dynamically updated during the surface measurement by the rotation of the rotating platform 20 , so that the effect of online real-time monitoring of the polishing state of the surface of the carrier 21 is easily achieved.

In another embodiment, the control module 30 may also perform ON/OFF of the surface measurement according to the operation state of the polishing machine. For example, when the technician replaces the carrier 21, the control module 30 stops the operation of the sensor 11, the sensor carrier 10 and the rotating platform 20 to avoid errors. measurement results. In additional embodiments, the control module 30 may also perform ON/OFF of the surface measurement according to the process requirements of the polishing machine. For example, technicians can set a fixed time for surface monitoring in the process, so when the surface measurement is turned off, the control module 30 stops the operation of the sensor 11 and the sensor carrier 10 to save the overall process time .

The control module 30 of the present invention can also be further connected to the output device 40 by telecommunication, wherein the output device 40 is, for example, a flat panel display or a computer screen, but not limited thereto. The output device 40 is used to visualize the surface topography of the carrier 21 constructed by the control module 30 during the surface measurement of the sensor 11 , so that the technician can observe the carrier 21 during the operation of the polishing machine. The surface topography changes to determine whether the carrier 21 needs to be replaced.

In alternative embodiments, the output device 40 may also be the medium used by the control module 30 to alert the technicians operating the polishing machine. For example, when constructing the surface topography of the carrier 21 , the control module 30 can determine whether the carrier 21 has reached the service life according to the surface information (for example, predefining the service life judgment standard of the carrier 21 ), and A warning message is displayed on the output device 40 while outputting the surface topography of the carrier 21 to remind the technician to replace the carrier 21 .

In the embodiment of the present invention, in order to achieve the complete surface measurement of the carrier 21, the control module 30 preferably controls the rotating platform 20 to revolve around the center O in the same direction (eg, clockwise or counterclockwise). Continuously rotate, and control the sweeping angle θ of the sensor carrier 10 to be a value that enables the sensor carrier 10 to pivot from the center O of the rotating platform 20 to the edge of the rotating platform 20, so that the sensor 11 is rotating Each cycle of the rotation of the platform 20 and the pivoting of the sensor carrier 10 can measure every position on the carrier 21 on which the rotating platform 20 is carried.

In the above-mentioned manner, the measurement track of the sensor 11 on the rotating platform 20 will be in the shape of a spiral, as shown in FIG. 4 . In the aspect of the standardized measurement trajectory shown in FIG. 4 , the rotating platform 20 drives the carrier 21 to rotate with the center O as the axis at the speed ω _p , and the sensor carrier 10 drives the speed ω _d The sensor 11 pivots back and forth toward the center O in the radial direction of the rotating platform 20 , and at the same time, the measurement position of the sensor 11 corresponding to the rotating platform 20 is represented by _Op . So far, the trajectory function of the _normalized measurement trajectory of the position Op of the sensor 11 can be represented by the following Equation 1 and Equation 2:

在上述方程式1及方程式2中，X _(t)及Y _(t)係代表感測器11位置O _p 對於時間函數的值；α係代表量測承載件21的起始角度；β係代表量測感測器載具10之樞轉之起始角度；D係代表旋轉平台20之圓心O至感測器11位置O _p 的距離；L係代表感測器載具10之長度(即，感測器11至感測器載具10之軸柱O _d 的距離)；ω係代表量測軌跡相對於旋轉平台20圓心的轉速；而d _x 及d _y 係代表感測器載具10之軸柱O _d 至旋轉平台20圓心O的距離。

In the above equations 1 and 2, X _{( t )} and Y _{( t ) represent} the value of the position Op of the sensor 11 as a function of time; α represents the starting angle of the measurement carrier 21; β represents the quantity D represents the distance from the center O of the rotating platform 20 to the position _Op of the sensor 11; L represents the length of the sensor carrier 10 (ie, the sensor The distance from the sensor 11 to the shaft column O _d of the sensor carrier 10 ); ω represents the rotational speed of the measurement track relative to the center of the rotating platform 20 ; and d _x and dy represent the _axis of the sensor carrier 10 The distance from the column O _d to the center O of the rotating platform 20 .

By adjusting the velocities ω _p and ω _d of the rotating platform 20 and the sensor carrier 10 by the control module 30 , the results of the above equations 1 and 2 will also be different, so that the measurement trajectory shown in FIG. 4 is relatively Adjust to spirals of different density. However, it should be noted that the uneven density of the spirals may cause the sensor 11 to fail when measuring the surface of the carrier 21 (for example, when the distance between the spirals of the measurement track is too far apart, the The area within the distance may not be measured by the sensor 11 ), and the real surface state on the carrier 21 cannot be reconstructed correctly. Therefore, the control module 30 of the present invention can further adjust the trajectory function of the measurement trajectory of the sensor 11 , so that each time the platform 20 or the sensor carrier 10 is rotated to complete a rotation or pivoting cycle All can measure the complete state of the surface of the carrier 21 .

上以等速率運動，並且此射線

將同時以等角速度繞圓心O旋轉，遂使 感測器11之量測軌跡呈現間距相等之螺旋線，故此類螺旋線亦可稱之為等速螺線。 In order to achieve the above-mentioned complete measurement of the carrier 21 , the embodiment of the present invention further includes adjusting the measurement track of the sensor 11 on the rotating platform 20 to be an Archimedes spiral ( Archimedean Spiral) form. As shown in FIG. 5, the definition of the Archimedes spiral is: when the position Op of the operation sensor 11 on the rotating platform 20 _moves in a radial direction relative to the center O of the circle, the distance between the sensor 11 and the center O rays

moving at constant velocity, and the ray

It will rotate around the center O at the same angular velocity at the same time, so that the measurement track of the sensor 11 presents a spiral with equal spacing, so this kind of spiral can also be called a constant velocity spiral.

For example, the measurement trajectory of the sensor 11 on the surface of the carrier 21 can be expressed by a polar coordinate equation: r=a+bθ. At this time, when the measurement trajectory is adjusted to a constant velocity spiral, the spiral The spacing will always be equal to 2πb. In this embodiment, the speeds ω _p and ω _d of the rotating platform 20 and the sensor carrier 10 can be adjusted as described below, so that the measurement trajectory of the sensor 11 is close to the above-mentioned constant velocity spiral.

上的速度分量 為：ω _d * L * cos(β+ω _d t)。接著，基於方程式3定義調整後感測器載具10的樞轉速度ω _m 為： First, assuming that the unadjusted pivot speed of the sensor carrier 10 is ω _d , the ray of the sensor 11 connected to the center O of the circle on the rotating platform 20 can be deduced first

The velocity component on is: ω _d * L * cos( β + ω _d t ). Next, the pivot speed ω _m of the sensor carrier 10 after adjustment is defined based on Equation 3 as:

ω _m = ω _d * sec( β + ω _d t ) (Equation 3) makes the velocity component of the sensor 11 on the ray OP connected to the center O on the rotating platform 20 according to the following Equation 4:

ω _m * L * cos( β + ω _d × t ) = ω _d L * sec( β + ω _d t )* cos( β + ω _d t ) = ω _d × L (Equation 4). Finally, by controlling the rotational speed ω _p of the rotating platform 20 at a constant value, the trajectory function of the measured trajectory of the sensor 11 on the rotating platform 20 (for example, the aforementioned Equation 1 and Equation 2) can be controlled to be close to the same The form of the speed spiral.

Through the above adjustment, the measurement trajectory of the sensor 11 on the rotating platform 20 is close to the constant velocity spiral, because the distance between the spirals is equal, each time the sensor carrier 10 and the rotating platform 20 pivot and After completing one cycle of rotation, the sensor 11 can obtain the surface information (eg, height information) of the carrier 21 uniformly, without being affected by the relative speed of the sensor 11 and the carrier 21 when moving, so that the control mode can be controlled. The surface morphology of the carrier 21 constructed by the group 30 can be closer to the current real state, which is helpful for more effective analysis of the surface polishing state of the carrier 21 .

Referring now to FIG. 6, a flow chart of the steps for carrying out the method for surface measurement of the present invention is shown. It should be noted that, for the convenience of discussion, the same elements as those in the aforementioned Figures 1 to 5 will be denoted by the same reference numerals.

As previously described, the control module 30 may perform ON/OFF of the surface measurement depending on the operation state of the polishing machine. Therefore, in step S100, the control module 30 first confirms that the carrier 21 has been set on the rotating platform 20 of the polishing machine, so as to ensure that no abnormality or system idling occurs when the surface measurement of the carrier 21 starts. .

Following step S200 , after confirming that the carrier 21 has been installed on the rotating platform 20 , the control module 30 can start the surface measurement of the bearing 21 , including starting the pivoting of the sensor carrier 10 and the rotation of the rotating platform 20 . And the sensor 11 captures the surface information of the carrier 21 .

In step S300 , in order to enable the sensor 11 to obtain the surface information (eg, height information) of the carrier 21 uniformly, the control module 30 further controls the pivoting speed of the sensor carrier 10 and the rotating platform 20 The rotational speed of the carrier 21 is driven, so that the measuring trajectory of the sensor 11 on the surface of the rotating platform 20 is close to a constant velocity spiral (as shown in Figs. 4 and 5).

In step S400, during the pivoting of the sensor 11 along with the sensor carrier 10 and the rotation of the rotating platform 20, the surface information of the carrier 21 extracted by the sensor 11 is constructed by the control module 30 as a carrier Surface topography of piece 21.

Next, in step S500 , the surface topography of the carrier 21 constructed by the control module 30 is visually presented by the output device 40 to assist the technicians operating the polishing machine to analyze the polishing state of the surface of the carrier 21 .

Finally, in step S600 , a technician operating the polishing machine can observe the change in the surface topography of the carrier 21 displayed by the output device 40 to determine whether the carrier 21 needs to be replaced (ie, the carrier 21 has reached the limit of its service life). In an alternative embodiment, the control module 30 can also predefine the criteria for judging the service life of the carrier 21 , and notify a technician (eg, display an alarm message on the output device 40 ) to replace the carrier 21 when the carrier 21 needs to be replaced. At this time, without replacing the carrier 21, the control module 30 will cyclically execute steps S300 to S500 to continuously control the movements of the sensor carrier 10 and the rotating platform 20, and the surface measurement of the sensor 11 And the reconstruction of the surface topography of the carrier 21 to dynamically update the surface topography changes of the carrier 21 to the technicians. On the contrary, when it is determined that the carrier 21 needs to be replaced, the control module 30 will stop the operation of the sensor carrier 10 , the rotating platform 20 and the sensor 11 , so that the technician can replace the carrier 21 .

To sum up, the system, method and sensor device for surface homogenization measurement of the present invention are provided with a sensor to measure the carrier in the polishing machine, and by controlling the sensor on the carrier. The pivoting of the sensor carrier and the rotation of the rotating platform in the polishing machine can adjust the measurement trajectory of the sensor on the surface of the carrier, so as to achieve uniform measurement of the surface of the carrier and real-time construction of the surface topography, and achieve Real-time monitoring of the polishing status of the carrier, thereby improving the efficiency of the polishing process.

S100~S600: Steps

Claims (20)

A system for surface homogenization measurement, comprising: a polishing machine, including: a carrier for carrying wafers; and a rotating platform for installing the carrier and for driving the carrier Rotate with the center of the rotating platform as the axis; the sensor carrier includes a shaft column arranged outside the rotating platform and an arm pivotally connected with the shaft column and extending above the carrier, and is configured to The arm is pivoted above the rotating platform by using the shaft column as an axis; a sensor is arranged on the free end of the arm of the sensor carrier, and is used to extract the surface information of the carrier; and a control module, which is telecommunicationly connected with the rotating platform, the sensor carrier and the sensor, and is configured to control the sensor to extract the measurement track of the surface information of the carrier, wherein the The control module controls the pivoting speed of the sensor carrier, so that the sensor moves at a constant speed on the ray from the edge of the rotating platform to the center of the circle. The system of claim 1, wherein the control module is further configured to: receive the surface information of the carrier extracted by the sensor; and construct the surface topography of the carrier based on the surface information. The system of claim 1, wherein the control module further controls the rotating platform to rotate in a fixed direction and a fixed rotational speed with the center of the rotating platform as an axis, and controls the pivoting range of the sensor carrier It is between the edge of the rotating platform and the center of the circle. The system of claim 1, wherein the measurement trajectories are equally spaced spirals. The system of claim 2, further comprising an output device telecommunicationly connected to the control module for visually presenting the surface topography of the carrier. The system of claim 2, wherein the control module is used for judging the service life of the carrier according to the surface information of the carrier. The system of claim 6, wherein when the carrier reaches the service life, the control module generates an alarm message to output the alarm message to the output device. The system of claim 1, wherein the surface information is height information of the surface of the carrier. A method for surface homogenization measurement, comprising the following steps: arranging a carrier on a rotating platform of a polishing machine; making the rotating platform drive the bearing to rotate around the center of the rotating platform; arranging a sensor on the free end of the arm of the sensor carrier, so that the sensor is suspended above the carrier; the arm of the sensor carrier is pivoted on the shaft of the sensor carrier The rotating platform pivots on the rotating platform, wherein the shaft column is set outside the rotating platform; the sensor is made to extract the surface information of the carrier; the measurement track of the sensor to extract the surface information of the carrier is adjusted , to control the pivoting speed of the sensor carrier, so that the sensor moves at a constant speed on the ray from the edge of the rotating platform to the center of the circle; and construct the surface shape of the carrier according to the surface information appearance. The method as claimed in claim 9, wherein the step of adjusting the measurement trajectory of the sensor to extract the surface information of the carrier further comprises the following sub-steps: controlling the rotating platform in a fixed direction and a fixed rotation speed at the The center of the rotating platform is rotated as an axis; and the pivoting range of the sensor carrier is controlled to be between the edge of the rotating platform and the center of the circle. The method of claim 9, wherein the measurement trajectories are equally spaced spirals. The method of claim 9, further comprising visually presenting the surface topography of the carrier to an output device. The method of claim 9, further comprising the following steps: judging the service life of the carrier according to the surface information of the carrier. The method of claim 13, further comprising the steps of: when the carrier reaches the service life, generating an alarm message to output the alarm message to an output device. The method of claim 9, wherein the surface information is height information of the surface of the carrier. A sensor device for surface homogenization measurement, comprising: a sensor carrier, comprising a shaft post arranged outside a rotating platform and an arm pivotally connected with the shaft post and extending above a carrier , and is configured to make the arm pivot above the rotating platform with the shaft as an axis; a sensor is set at the free end of the arm of the sensor carrier, and is used to extract the carrier the surface information of the item; and A control module is telecommunicationly connected with the sensor carrier and the sensor, and is configured to control the measurement trajectory of the surface information of the carrier extracted by the sensor, wherein the control module is The pivoting speed of the sensor carrier is controlled, so that the sensor moves at a constant speed on the ray from the edge of the rotating platform to the center of the circle. The sensor device of claim 16, wherein the surface information is height information of the surface of the carrier. The sensor device of claim 16, wherein the control module is multiplexed to: receive the surface information of the carrier extracted by the sensor; and construct the surface topography of the carrier according to the surface information . The sensor device of claim 16, wherein the measurement trajectories are equally spaced spirals. The sensor device as claimed in claim 18, further comprising an output device telecommunicationly connected to the control module for visually presenting the surface topography of the carrier.

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