TWI765587B - Intelligent imaging and measurement system and method - Google Patents
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本發明係為一種智慧取像與量測的系統與方法,特別是一種即時輸出拍攝物實際尺寸的技術。 The present invention relates to a system and method for intelligent image capturing and measurement, especially a technology for outputting the actual size of a photographed object in real time.
目前具有量測實際尺寸的取像系統,需架設在一個固定已知高度的位置,並在取像視野內放置一對照物(通常具有特定單位刻度的尺規)。取像系統再同時拍攝物件的物與對照物,由此來比對物件的實際尺寸。 At present, the imaging system for measuring the actual size needs to be erected at a position with a fixed and known height, and a control object (usually a ruler with a specific unit scale) is placed in the imaging field of view. The imaging system simultaneously shoots the object and the control object to compare the actual size of the object.
而上述方法必需仰賴人工透過影像中的對照物藉以推算物件的實際尺寸,較適合用於處理少量的影像上。若用於產線上,因待檢測的的數量大,上述方法將不符合效益,並且上述方法之取像系統也必須定期執行校正,方能維持影像的精準度,更添增許多產線上的成本。 The above-mentioned method must rely on artificially to estimate the actual size of the object through the control object in the image, which is more suitable for processing a small number of images. If it is used on a production line, the above method will not be effective due to the large number of objects to be inspected, and the imaging system of the above method must also be calibrated regularly in order to maintain the accuracy of the image and increase the cost of many production lines. .
根據現有技術的缺漏,所屬技術領域需一種不需固定高度、不需對照物以及可即時計算影像中物件的實際尺寸之取像系統。因此如何達到符合上述條件的取像系統,即成為所領技術領域有待克服的問題。 According to the deficiencies in the prior art, there is a need in the technical field for an imaging system that does not require a fixed height, does not require a contrast, and can instantly calculate the actual size of an object in an image. Therefore, how to achieve an imaging system that meets the above conditions becomes a problem to be overcome in the technical field.
為解決上述問題,本發明之實施例發展出一種智慧取像與量測系統,上述系統整合取像、測距以及計算的功能,並可在任意取像距離下計算影像中物件的實際尺寸。上述系統除了可以計算二維的尺寸資訊(X,Y)外,上述系統透過內建的測距單元,對於不規則形狀的物件,可進一步取得高度資訊,以產生該物件的三維的尺寸資訊(X,Y,Z)。而本發明之智慧取像與量測系統中,具備標準尺寸資訊的資料庫,上述標準尺寸資訊具有多個取像距離資訊以及解析度資訊所對應之畫素矩陣以及實際尺寸資訊。因此透過本發明擷取之物件影像,可即時計算物件在影像中的實際尺寸。計算方式係利用迴歸分析法透過上述系統內資料庫的標準尺寸資訊,將取像距離資訊以及解析度資訊所對應畫素矩陣的實際尺寸,推算物件長、寬、高之實際的尺寸,從而達到即時計算影像中物件實際尺寸的功效。 To solve the above problem, an embodiment of the present invention develops an intelligent image capturing and measuring system, which integrates the functions of image capturing, ranging and calculation, and can calculate the actual size of the object in the image at any image capturing distance. In addition to calculating the two-dimensional size information (X, Y), the above-mentioned system can further obtain height information for irregularly shaped objects through the built-in ranging unit to generate the three-dimensional size information of the object ( X, Y, Z). In the smart imaging and measurement system of the present invention, there is a database of standard size information, and the standard size information includes a plurality of pixel matrices and actual size information corresponding to imaging distance information and resolution information. Therefore, through the object image captured by the present invention, the actual size of the object in the image can be calculated in real time. The calculation method is to use the regression analysis method to calculate the actual size of the object's length, width and height through the standard size information of the above-mentioned database in the system. The ability to instantly calculate the actual size of objects in an image.
具體而言,本發明之實施例提供一種智慧取像與量測系統。上述智慧取像與量測系統包括至少一個測距取像裝置、影像處理裝置以及顯示裝置。上述測距取像裝置包括至少一個取像單元以及至少一個測距單元。上述取像單元擷取物件的影像後,產生至少一個原始影像檔,並取得上述原始影像檔之解析度資訊。上述測距單元測量上述取像單元與物件之取像距離,以產生取像距離資訊。上述影像處理裝置包括資料庫與計算模組。上述影像處理裝置訊號連接上述測距取像裝置,並計算上述原始影像檔中物件之實際尺寸。上述資料庫係用以儲存多個標準尺寸資訊,每一上述標準尺寸資訊分別包括單位面積之解析度、取像距離、對應之畫素矩陣以及對應的實際尺寸。上述計算模組訊號連接上述資料庫,根據上述原始影像檔之上述解析度資訊以及上述取像距離資訊,比對上述資料庫中之上述標準尺寸資訊,並計算產生具有實際尺寸資訊 之處理後影像檔。上述顯示裝置,係為顯示上述原始影像檔或上述處理後影像檔。 Specifically, embodiments of the present invention provide an intelligent imaging and measurement system. The above-mentioned intelligent imaging and measurement system includes at least one ranging imaging device, an image processing device and a display device. The above-mentioned ranging and imaging device includes at least one imaging unit and at least one ranging unit. After the image capturing unit captures the image of the object, at least one original image file is generated, and the resolution information of the original image file is obtained. The distance measuring unit measures the image capturing distance between the image capturing unit and the object to generate image capturing distance information. The above image processing device includes a database and a computing module. The signal of the above-mentioned image processing device is connected to the above-mentioned distance measuring and imaging device, and the actual size of the object in the above-mentioned original image file is calculated. The above-mentioned database is used for storing a plurality of standard size information, and each of the above-mentioned standard size information respectively includes the resolution per unit area, the image capturing distance, the corresponding pixel matrix and the corresponding actual size. The above-mentioned calculation module signal is connected to the above-mentioned database, and according to the above-mentioned resolution information and the above-mentioned acquisition distance information of the above-mentioned original image file, the above-mentioned standard size information in the above-mentioned database is compared, and the actual size information is calculated and generated. The processed image file. The above-mentioned display device is for displaying the above-mentioned original image file or the above-mentioned processed image file.
依據又一實施例,上述影像處理裝置還包括疊合模組。當上述物件具有設計圖,疊合模組將上述設計圖與上述處理後影像檔疊合,並同時顯示在上述顯示裝置。 According to yet another embodiment, the above-mentioned image processing apparatus further includes a stacking module. When the above-mentioned object has a design drawing, the superimposing module superimposes the above-mentioned design drawing and the above-mentioned processed image file, and simultaneously displays it on the above-mentioned display device.
依據又一實施例,上述影像處理裝置還包括量測模組,提供人工對上述處理後影像檔執行虛擬量測,並產生尺寸量測資料。 According to yet another embodiment, the image processing apparatus further includes a measurement module for manually performing virtual measurement on the processed image file and generating dimension measurement data.
依據又一實施例,其中上述測距單元包括雷射測距儀、可見光測距儀、紅外線測距儀或步進馬達。 According to yet another embodiment, the distance measuring unit includes a laser distance meter, a visible light distance meter, an infrared distance meter or a stepping motor.
依據又一實施例,其中上述物件例如可包括印刷電路板、半導體晶圓或其他電子產品。 According to yet another embodiment, the above-mentioned objects may include, for example, printed circuit boards, semiconductor wafers, or other electronic products.
依據又一實施例,其中上述計算模組之計算方式包括迴歸分析法。 According to yet another embodiment, the calculation method of the above-mentioned calculation module includes a regression analysis method.
本發明之實施例更提供一種智慧取像與量測方法,包括以下步驟。準備多個個標準尺寸資訊,其中每一標準尺寸資訊分別包括一單位面積之解析度、取像距離、對應之畫素矩陣以及對應的實際尺寸。擷取物件之影像,獲得原始影像檔以及擷取上述原始影像檔之解析度資訊以及取像距離資訊。透過上述多個標準尺寸資訊,計算上述原始影像檔之實際尺寸資訊,並附加至上述原始影像檔上,得到處理後影像檔。將上述物件之設計圖與上述處理後影像檔疊合後,並將所得之一疊合影像顯示於顯示裝置上。對上述疊合影像進行虛擬量測。 Embodiments of the present invention further provide an intelligent image acquisition and measurement method, which includes the following steps. A plurality of standard size information are prepared, wherein each standard size information respectively includes a resolution per unit area, an imaging distance, a corresponding pixel matrix and a corresponding actual size. Capture the image of the object, obtain the original image file, and capture the resolution information and the distance information of the original image file. The actual size information of the original image file is calculated through the plurality of standard size information, and added to the original image file to obtain a processed image file. After superimposing the above-mentioned design drawing of the object and the above-mentioned processed image file, a superimposed image obtained is displayed on the display device. A virtual measurement is performed on the above-mentioned superimposed image.
依據又一實施例,其中計算上述原始影像檔之一實際尺寸資訊的方法包括迴歸分析法。 According to yet another embodiment, the method for calculating the actual size information of one of the original image files includes a regression analysis method.
綜合上述實施例之技術特徵,因此可具體主張以下功效。 Combining the technical features of the above embodiments, the following effects can be specifically claimed.
(1)不需定期執行系統校正,且不需事先量測取像距離,可簡化設置取像系統的流程。 (1) There is no need to perform system calibration regularly, and there is no need to measure the image acquisition distance in advance, which can simplify the process of setting up the imaging system.
(2)本系統在取像後可即時計算影像中物件的實際尺寸,並可配合相容的虛擬量測模組以量測物件的特定位置,例如:使用者透過顯示裝置檢視處理後影像,並當點選至少兩個點(即座標)時,即時計算兩個點的實際距離。並可應用於虛擬量測產品的瑕疵位置,不像如過去需要人工實地量測。 (2) The system can immediately calculate the actual size of the object in the image after taking the image, and can cooperate with a compatible virtual measurement module to measure the specific position of the object. For example, the user can view the processed image through the display device, And when at least two points (ie coordinates) are clicked, the actual distance between the two points is calculated in real time. It can also be applied to virtual measurement of the defect position of the product, unlike the need for manual field measurement in the past.
(3)對於不規則形狀的物件,本系統之測距單元可透過完整掃描物件的上表面或取得物件上複數個取樣點的方式得到多個取像距離,以取得完整的物件的高度資訊。例如:在物件的上表面,進行10萬個點的取樣,分別獲得對應這些取樣點之取像距離資訊,以推定物件之面的高度資訊。因此,使用者在透過顯示裝置觀看影像時2D影像時,實則為俯視一個立體的物件。故當物件的上表面具有不一致的高度時,使用者點選處理後影像兩個點進行虛擬計算,實際上是計算兩個三維座標(X,Y,Z)間的距離,以得到物件的實際尺寸,而更接近真實量測的結果。 (3) For objects with irregular shapes, the ranging unit of the system can obtain multiple imaging distances by completely scanning the upper surface of the object or obtaining multiple sampling points on the object to obtain complete height information of the object. For example, 100,000 points are sampled on the upper surface of the object, and the distance information corresponding to these sampling points is obtained respectively, so as to estimate the height information of the surface of the object. Therefore, when the user views the 2D image through the display device, he is actually looking down on a three-dimensional object. Therefore, when the upper surface of the object has inconsistent heights, the user clicks two points in the processed image to perform virtual calculation, in fact, the distance between the two three-dimensional coordinates (X, Y, Z) is calculated to obtain the actual object. size, which is closer to the actual measurement result.
100:智慧取像與量測系統 100:Intelligent imaging and measurement system
120:測距取像裝置 120: Ranging and imaging device
122:取像單元 122: Acquisition unit
124:測距單元 124: Ranging unit
140:影像處理裝置 140: Image processing device
142:資料庫 142:Database
144:計算模組 144: Computing Module
146:疊合模組 146: Stacking module
148:量測模組 148: Measurement module
160:顯示裝置 160: Display device
200:物件 200:Object
220:原始影像檔 220: Original image file
240:處理後影像檔 240: processed image file
301-307:步驟 301-307: Steps
為讓本發明之上述和其他目的、特徵、優點與實施例能更明顯易懂,所附附圖之說明如下: In order to make the above and other objects, features, advantages and embodiments of the present invention more clearly understood, the accompanying drawings are described as follows:
圖1所繪為根據本發明之一實施例之一種智慧取像與量測系統之裝置示意圖。 FIG. 1 is a schematic diagram of a device of an intelligent imaging and measurement system according to an embodiment of the present invention.
圖2所繪為根據本發明之一實施例之一種智慧取像與量測系統之流程圖。 FIG. 2 is a flowchart of an intelligent imaging and measurement system according to an embodiment of the present invention.
圖3所繪為根據本發明之一實施例之一種智慧取像與量測系統之影像顯示示意圖。 FIG. 3 is a schematic diagram of an image display of an intelligent imaging and measurement system according to an embodiment of the present invention.
為更具體說明本發明之各實施例,以下輔以附圖進行說明。 In order to describe the various embodiments of the present invention more specifically, the following description is supplemented by the accompanying drawings.
請參閱圖1,圖1所繪為根據本發明之一實施例之一種智慧取像與量測系統之架構示意圖。在圖1中,依據一實施例,提供一種智慧取像與量測系統100。智慧取像與量測系統100包括至少一個測距取像裝置120、影像處理裝置140以及顯示裝置160。
Please refer to FIG. 1 . FIG. 1 is a schematic diagram illustrating the structure of an intelligent imaging and measurement system according to an embodiment of the present invention. In FIG. 1 , according to an embodiment, an intelligent imaging and
上述測距取像系統120包括至少一個取像單元122以及至少一個測距單元124。上述取像單元122係對物件200執行靜態或動態的影像擷取,並產生原始影像檔220。上述取像單元122在擷取物件200的影像前可調整影像擷取之解析度,並在擷取後,將解析度資訊附加存於上述原始影像檔220中。上述取像單元122可為具有靜態或動態影像擷取功能之相機、攝影機或掃描器。上述測距單元124可測量上述取像單元122與該物件200之間的取像距離,並將取像距離資訊存於上述原始影像檔220之中。根據本發明之另一實施例,上述測距單元124包括雷射測距儀、可見光測距儀、紅外線測距儀或步進馬達。
The above-mentioned ranging and
上述影像處理裝置140係將上述原始影像檔220之上述解析度資訊以及上述取像距離資訊經過計算,產生具有實際尺寸資訊之處理後影像檔240,並可依據需求進一步執行影像疊合或虛擬量測。上述影像處理裝置140係為具有運算功能之計算機或可攜式設備。上述影像處理裝置140包括資料庫142、計算模組144、疊合模組146以及量測模組148。
The above-mentioned
上述資料庫142係事先儲存多個標準尺寸資訊,每一個標準尺寸資訊都包括對應一單位面積之解析度、取像距離、對應之畫素矩陣,例如:於1m的取像距離與1920×1080的取像解析度之影像擷取的條件下,1mm2的單位面積所對應的畫素矩陣為2×2的矩陣,亦即1mm2的單位面積係使用顯示裝置之4個畫素來顯示。上述資料庫142係為具有儲存功能之硬碟,例如可為機械式硬碟、固態硬碟或外接式硬碟。 The above-mentioned database 142 stores a plurality of standard size information in advance, and each standard size information includes a resolution corresponding to a unit area, an imaging distance, and a corresponding pixel matrix. Under the condition of image capture with high resolution, the pixel matrix corresponding to a unit area of 1mm 2 is a 2×2 matrix, that is, a unit area of 1mm 2 is displayed using 4 pixels of the display device. The above-mentioned database 142 is a hard disk with a storage function, such as a mechanical hard disk, a solid-state hard disk or an external hard disk.
上述計算模組144係根據上述原始影像檔220之上述解析度資訊以及上述取像距離資訊,在上述資料庫142之上述多個標準尺寸資訊之中,尋找具有相同影像擷取條件的標準尺寸資訊,使用來計算物件200的實際尺寸。然後將物件200的實際尺寸資訊附加到原始影像檔220之後,成為處理後影像檔240。根據本發明之另一實施例,上述計算模組144之計算方式包括迴歸分析法。
The calculation module 144 searches for the standard size information with the same image capturing conditions among the plurality of standard size information in the database 142 according to the resolution information and the image capturing distance information of the original image file 220 , used to calculate the actual size of the
當上述物件200具有設計圖時,上述疊合模組146可將上述設計圖與上述處理後影像檔240疊合,並同時顯示在該顯示裝置160上,可供使用者比對上述物件200之設計圖與處理後影像240。
When the
上述量測模組148可讓人工對上述處理後影像檔240執行虛擬量測,產生尺寸量測資料。
The
根據本發明之另一實施例,當上述物件200高度起伏在容忍數值內,例如±0.1mm,可視為平整物體時,上述測距單元124可透過上述物件200事先設置的基準點取得對應至基準點的取像距離資訊,上述計算模組144再根據上述取像距離資訊,計算上述物件200在基準點外之其他區域的實際尺寸。而透過基準點取得上述取像距離資訊之用途,可應用於印刷電路板的製程中。例如:上述物件200為印刷電路板,可事先在製造上述印刷電路板上預設一基準點,作為取得上述取像距離資訊的位置。係因上述印刷電路板為高度大約一致的物體,即可經由基準點的單點測距所獲得的上述取像距離資訊,進而推算上述印刷電路板位於基準點外之其他區域之實際尺寸。上述基準點在印刷電路板上可為任意一個點,例如:在印刷電路板上事先標記的一個點或未上阻焊油墨的位置。
According to another embodiment of the present invention, when the height of the
根據本發明的實施方式,請同時參閱圖1和圖2以及圖3。圖2所繪為根據本發明之一實施例之一種智慧取像與量測之方法流程圖。 According to an embodiment of the present invention, please refer to FIG. 1 and FIG. 2 and FIG. 3 simultaneously. FIG. 2 is a flowchart of a method for intelligent imaging and measurement according to an embodiment of the present invention.
在圖2中,步驟301為開始。
In Figure 2,
在步驟302中,事先將用來比對計算之多個標準尺寸資訊存入影像處理裝置140的資料庫142之中。上述標準尺寸資訊以詳述如上,在此不再贅述之。
In
在步驟303中,測距取像裝置120擷取物件200的至少一個影像,並存成對應的原始影像檔220。上述原始影像檔220包含解析度資訊以及取像距離資訊,解析度資訊以及取像距離資訊來源如前文所述,在此不再贅述之。
In
在步驟304中,影像處理裝置140根據上述原始影像檔220之解析度資訊以及取像距離資訊,計算出上述原始影像檔220中物件200的實際尺寸
資訊,並產生處理後影像檔240。例如在1m的取像距離與1920*1080的取像解析度之影像擷取的條件下,1mm2的單位面積所對應的畫素矩陣為2×2的矩陣,上述物件200在原始影像檔220中長以及寬為200×200的矩陣所組成,即算出上述物件200實際面積為10000mm2。並將計算後的實際尺寸資訊附加至上述原始影像檔220,產生處理後影像檔240。
In
在步驟305中,根據上述顯示裝置160設定的解析度,將欲顯示的處理後影像檔240等比例放大或縮小顯示於上述顯示裝置160中。並可參考圖3影像顯示示意圖,圖3所繪為根據本發明之一實施例之一種智慧取像與量測系統之影像顯示的示意圖。當上述物件200為不規則形狀時,透過上述測距取像裝置120的測距功能,可記錄物件200之三維尺寸,並在上述顯示裝置160中的2D影像顯示上,進一步標示高度資訊。在圖3中,係以顏色深淺漸層的方式呈現物件200的上表面之高度資訊。但不限於上述的呈現方式,高度資訊也可以其他適合的方式來表現。上述測距取像裝置120之測距功能可為單點測距、掃描測距或多點測距。上述單點測距適合用於物件200為高度一致的型態;上述掃描測距或多點測距適合用於物件200具有不規則高度的上表面。
In
在步驟306中,透過顯示於上述顯示裝置160之處理後影像檔240,提供使用者執行虛擬量測。舉例來說,使用者透過上述顯示裝置160所顯示的處理後影像中,點選兩個點,即可計算出上述兩個點之間的實際距離。而實際上影像處理裝置140之量測裝置148將計算上述兩個點間在三維座標(X,Y,Z)上的距離,並非單純在二維座標(X,Y)上的距離。因此可以達到一個準確的虛擬量測結果。
In
在步驟307中,係為流程結束。
In
綜合上述,本發明之實施例一種智慧取像與量測系統,係可提供使用者不需實地量測物件200的尺寸,而是透過擷取上述物件200的影像後,再透過顯示裝置160執行虛擬測量,以有效節省人工量測的成本。再者,透過本發明系統計算影像中上述物件200長、寬、高的資訊後,可輕易的在顯示裝置160虛擬量測不規則形狀的物件200尺寸,有效克服人工量測時的困難。
In view of the above, an embodiment of the present invention is an intelligent image capturing and measuring system, which can provide the user without the need to measure the size of the
本發明在本文中僅以較佳實施例揭露,然任何熟習本技術領域者應能理解的是,上述實施例僅用於描述本發明,並非用以限定本發明所主張之專利權利範圍。舉凡與上述實施例均等或等效之變化或置換,皆應解讀為涵蓋於本發明之精神或範疇內。因此,本發明之保護範圍應以下述之申請專利範圍所界定者為準。 The present invention is only disclosed by preferred embodiments herein, however, any person skilled in the art should understand that the above-mentioned embodiments are only used to describe the present invention, and are not intended to limit the scope of the patent rights claimed by the present invention. All changes or substitutions that are equal or equivalent to the above-mentioned embodiments should be construed as being covered within the spirit or scope of the present invention. Therefore, the protection scope of the present invention should be defined by the following patent application scope.
100:智慧取像與量測系統 100:Intelligent imaging and measurement system
120:測距取像裝置 120: Ranging and imaging device
122:取像單元 122: Acquisition unit
124:測距單元 124: Ranging unit
140:影像處理裝置 140: Image processing device
142:資料庫 142:Database
144:計算模組 144: Computing Module
146:疊合模組 146: Stacking module
148:量測模組 148: Measurement module
160:顯示裝置 160: Display device
200:物件 200:Object
220:原始影像檔 220: Original image file
240:處理後影像檔 240: processed image file
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