TWI765454B - Tin wire feeding system - Google Patents
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Abstract
Description
本發明是有關於一種錫絲供應系統,特別是有關於一種可自動更換錫絲之錫絲供應系統。The present invention relates to a tin wire supply system, in particular to a tin wire supply system that can automatically replace the tin wire.
首先請參閱第1圖,其中第1圖表示一習知焊錫設備的示意圖。如第1圖所示,一般常見的焊錫設備主要包括有一錫絲捲11與一餵錫模組12。錫絲捲11主要係用以供應一錫絲W,且錫絲W可經由餵錫模組12上之馬達滾輪13引導後從出錫口14餵出錫絲,以利於進行後續的焊錫加工作業。First, please refer to FIG. 1 , wherein FIG. 1 shows a schematic diagram of a conventional soldering equipment. As shown in FIG. 1 , common soldering equipment mainly includes a
然而,當錫絲W耗盡時,機台往往必須立即停止並等待人員到場後,才能以人工的方式更換新的錫絲,惟若人員無法即時到場更換或補充錫絲時,則勢必會造成產線停擺而導致生產效率降低。However, when the tin wire W is exhausted, the machine must be stopped immediately and the new tin wire can be replaced manually only after the personnel arrives. It will cause the production line to stop and reduce the production efficiency.
有鑒於此,如何改善傳統以人工更換錫絲的習知問題點,並設計出一種可自動更換錫絲的錫絲供應系統始成為一重要之課題。In view of this, how to improve the conventional problem of replacing the tin wire manually and design a tin wire supply system that can automatically replace the tin wire has become an important issue.
有鑑於前述習知問題點,本發明之一實施例提供一種錫絲供應系統,包括一第一錫絲供應單元、一第二錫絲供應單元、一固定模組、一可動模組以及一熔接單元。前述第一錫絲供應單元可用以提供一第一錫絲至一餵錫模組,前述第二錫絲供應單元可用以提供一第二錫絲至前述餵錫模組。前述固定模組具有一本體以及設置於前述本體上之一導引機構,前述可動模組可相對於前述固定模組移動,並且具有一第一導引部以及一第二導引部,用以分別引導前述第一錫絲以及前述第二錫絲朝前述固定模組方向移動,其中當前述可動模組相對前述固定模組位於一第一位置時,前述第一錫絲依序經過前述第一導引部以及前述導引機構而到達前述餵錫模組。In view of the aforementioned conventional problems, an embodiment of the present invention provides a solder wire supply system, including a first solder wire supply unit, a second solder wire supply unit, a fixed module, a movable module, and a welding unit. The first tin wire supply unit can be used to provide a first tin wire to a tin feeding module, and the second tin wire supply unit can be used to provide a second tin wire to the tin feeding module. The fixed module has a main body and a guide mechanism disposed on the main body, the movable module can move relative to the fixed module, and has a first guide portion and a second guide portion for The first tin wire and the second tin wire are respectively guided to move toward the fixed module. When the movable module is located at a first position relative to the fixed module, the first tin wire passes through the first tin wire in sequence. The guide portion and the aforementioned guide mechanism reach the aforementioned tin feeding module.
特別地是,當前述可動模組相對前述固定模組由前述第一位置移動至一第二位置時,前述第一錫絲被前述可動模組與前述固定模組切斷成位在前述固定模組上之一主段部以及位在前述可動模組上之一殘留部,且前述熔接單元將前述第二錫絲與前述主段部彼此熔接。In particular, when the movable module moves from the first position to a second position relative to the fixed module, the first tin wire is cut by the movable module and the fixed module into position on the fixed module A main section on the set and a residual section located on the movable module, and the welding unit welds the second tin wire and the main section to each other.
於一實施例中,前述可動模組形成有一第一導槽以及一第二導槽,用以分別容納前述第一錫絲以及前述第二錫絲。In one embodiment, the movable module is formed with a first guide groove and a second guide groove for accommodating the first tin wire and the second tin wire respectively.
於一實施例中,前述固定模組之前述本體形成有一第三導槽,且當前述可動模組相對前述固定模組位於前述第一位置時,前述第一錫絲延伸經過前述第一、第三導槽而到達前述餵錫模組。In one embodiment, a third guide groove is formed on the body of the fixed module, and when the movable module is located at the first position relative to the fixed module, the first tin wire extends through the first and second tin wires. Three guide grooves to reach the aforementioned tin feeding module.
於一實施例中,前述第一導槽或前述第三導槽的至少其中一者形成有一尖銳結構,且當前述可動模組相對前述固定模組由前述第一位置移動至前述第二位置時,前述尖銳結構切斷前述第一錫絲。In one embodiment, at least one of the first guide groove or the third guide groove forms a sharp structure, and when the movable module moves relative to the fixed module from the first position to the second position , the aforementioned sharp structure cuts off the aforementioned first tin wire.
於一實施例中,前述固定模組之前述本體更形成有一第一容納部以及一第二容納部,當前述可動模組相對前述固定模組位於前述第一位置時,前述第二錫絲自前述第二導槽延伸到前述第二容納部內,且當前述可動模組相對前述固定模組由前述第一位置移動至前述第二位置時,前述第一錫絲之前述殘留部位於前述第一導槽內並對準前述第一容納部,且前述第二錫絲被截斷並與前述可動模組之一端面切齊。In one embodiment, the body of the fixed module is further formed with a first accommodating part and a second accommodating part, when the movable module is located at the first position relative to the fixed module, the second tin wire is The second guide groove extends into the second accommodating portion, and when the movable module moves relative to the fixed module from the first position to the second position, the residual portion of the first tin wire is located in the first position The guide groove is aligned with the first accommodating portion, and the second tin wire is cut off and cut to be flush with an end face of the movable module.
於一實施例中,前述第二導槽或前述第三導槽的其中至少一者形成有一尖銳結構,且當前述可動模組相對前述固定模組由前述第一位置移動至前述第二位置時,前述尖銳結構截斷前述第二錫絲。In one embodiment, at least one of the second guide groove or the third guide groove forms a sharp structure, and when the movable module moves relative to the fixed module from the first position to the second position , the aforementioned sharp structure cuts off the aforementioned second tin wire.
於一實施例中,前述錫絲供應系統更包括一感測器,用以感測前述第一錫絲之一末端,且當感測器感測到前述第一錫絲之前述末端時,前述可動模組相對前述固定模組由前述第一位置移動至前述第二位置。In one embodiment, the tin wire supply system further includes a sensor for sensing an end of the first tin wire, and when the sensor senses the end of the first tin wire, the The movable module moves from the first position to the second position relative to the fixed module.
於一實施例中,前述錫絲供應系統更包括一緩衝機構,其中前述第一錫絲依序經過前述導引機構以及前述緩衝機構而到達前述餵錫模組,且當前述可動模組相對前述固定模組由前述第一位置移動至前述第二位置時,前述緩衝機構由一第三位置相對前述固定模組移動至一第四位置,以使前述第一錫絲之前述主段部自前述緩衝機構上鬆脫。In one embodiment, the tin wire supply system further includes a buffer mechanism, wherein the first tin wire passes through the guide mechanism and the buffer mechanism in sequence to reach the tin feeding module, and when the movable module is opposite to the above When the fixing module moves from the first position to the second position, the buffer mechanism moves from a third position relative to the fixing module to a fourth position, so that the main section of the first tin wire is removed from the The buffer mechanism is loose.
於一實施例中,前述緩衝機構具有複數個導引件,用以引導前述第一錫絲朝前述餵錫模組方向移動,且當前述緩衝機構由前述第三位置相對前述固定模組移動至前述第四位置時,前述第一錫絲之前述主段部自前述些導引件上鬆脫。In one embodiment, the buffer mechanism has a plurality of guides for guiding the first tin wire to move toward the tin feeding module, and when the buffer mechanism moves from the third position relative to the fixing module to In the fourth position, the main section of the first tin wire is released from the guides.
於一實施例中,前述錫絲供應系統更包括一偏壓元件,當前述緩衝機構由前述第三位置相對前述固定模組移動至前述第四位置時,前述偏壓元件接觸前述導引機構,以透過前述導引機構夾持並固定前述第一錫絲之前述主段部於前述固定模組上之一既定位置。In one embodiment, the tin wire supply system further includes a biasing element, when the buffer mechanism moves from the third position relative to the fixing module to the fourth position, the biasing element contacts the guiding mechanism, The main section of the first tin wire is clamped and fixed to a predetermined position on the fixing module through the guiding mechanism.
以下說明本發明實施例之錫絲供應系統。可輕易了解本發明實施例提供許多合適的發明概念而可實施於廣泛的各種特定背景。所揭示的特定實施例僅僅用於說明以特定方法使用本發明,並非用以侷限本發明的範圍。The tin wire supply system according to the embodiment of the present invention will be described below. It will be readily appreciated that the present embodiments provide many suitable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments disclosed are merely illustrative of particular ways to use the invention, and are not intended to limit the scope of the invention.
除非另外定義,在此使用的全部用語(包括技術及科學用語)具有與此篇揭露所屬之一般技藝者所通常理解的相同涵義。能理解的是這些用語,例如在通常使用的字典中定義的用語,應被解讀成具有一與相關技術及本揭露的背景或上下文一致的意思,而不應以一理想化或過度正式的方式解讀,除非在此特別定義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is to be understood that these terms, such as those defined in commonly used dictionaries, should be interpreted to have a meaning consistent with the relevant art and the context or context of this disclosure, and not in an idealized or overly formal manner Interpretation, unless specifically defined herein.
有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之一較佳實施例的詳細說明中,將可清楚的呈現。以下各實施例中所提到的方向用語,例如:上、下、左、右、前或後等,僅是參考附加圖式的方向。因此,實施方式中所使用的方向用語是用來說明並非用來限制本發明。The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front or rear, etc., are only for referring to the directions of the attached drawings. Therefore, the directional terms used in the embodiments are used to describe and not to limit the present invention.
請參閱第2、3圖,其中第2圖表示本發明一實施例之錫絲供應系統的示意圖,第3圖表示當第2圖中之感測器S1偵測到第一錫絲W1即將用盡時的示意圖。如第2、3圖所示,本實施例之錫絲供應系統可供應錫絲至一餵錫模組F,從而進行一焊錫加工製程,其中前述錫絲供應系統主要包括一第一錫絲供應單元P1、一第二錫絲供應單元P2、兩個感測器S1、S2、一可動模組G、一固定模組E、一緩衝模組B以及一熔接單元H。Please refer to Figures 2 and 3, wherein Figure 2 is a schematic diagram of a tin wire supply system according to an embodiment of the present invention, and Figure 3 shows when the sensor S1 in Figure 2 detects that the first tin wire W1 is about to be used Schematic diagram of the end time. As shown in Figures 2 and 3, the tin wire supply system of this embodiment can supply tin wire to a tin feeding module F, so as to perform a solder processing process, wherein the above-mentioned tin wire supply system mainly includes a first tin wire supply Unit P1, a second tin wire supply unit P2, two sensors S1, S2, a movable module G, a fixed module E, a buffer module B and a welding unit H.
具體而言,前述第一錫絲供應單元P1可用以供應一第一錫絲W1,前述第二錫絲供應單元P2則可用以供應一第二錫絲W2,前述感測器S1、S2則可用以分別偵測第一、第二錫絲W1、W2是否即將用盡。應了解的是,本實施例之錫絲供應系統能夠選擇性地使用前述第一錫絲W1或第二錫絲W2,並使其依序通過前述可動模組G、固定模組E以及緩衝模組B而到達餵錫模組F,以利於進行後續的焊錫加工作業。舉例而言,前述感測器S1、S2可包含微動開關、光遮斷開關或近接開關。Specifically, the aforementioned first tin wire supply unit P1 can be used to supply a first tin wire W1, the aforementioned second tin wire supply unit P2 can be used to supply a second tin wire W2, and the aforementioned sensors S1 and S2 can be used To detect whether the first and second tin wires W1 and W2 are about to be used up respectively. It should be understood that the tin wire supply system of this embodiment can selectively use the first tin wire W1 or the second tin wire W2, and make it pass through the movable module G, the fixed module E and the buffer module in sequence. Group B arrives at the tin feeding module F to facilitate subsequent solder processing operations. For example, the aforementioned sensors S1 and S2 may include a micro switch, a photo-interrupting switch or a proximity switch.
前述可動模組G可相對於固定模組E移動,其中可動模組G主要包括一本體G0和設置於該本體G0上之一第一夾持部C1、一第二夾持部C2、一第一導引部G1以及一第二導引部G2。在本實施例中,前述第一夾持部C1和第一導引部G1可用以夾持並引導第一錫絲W1朝固定模組E方向前進,而前述第二夾持部C2和第二導引部G2則可用以夾持並引導第二錫絲W2朝固定模組E方向前進。The aforementioned movable module G can move relative to the fixed module E, wherein the movable module G mainly includes a main body G0 and a first clamping portion C1, a second clamping portion C2, a first clamping portion C1, a second clamping portion C2, and a first clamping portion C1 disposed on the main body G0. A guide portion G1 and a second guide portion G2. In this embodiment, the aforementioned first clamping portion C1 and the first guiding portion G1 can be used to clamp and guide the first tin wire W1 to advance toward the fixed module E, while the aforementioned second clamping portion C2 and the second The guide portion G2 can be used to clamp and guide the second tin wire W2 to move forward in the direction of the fixed module E.
前述固定模組E主要包括一本體E0以及設置於該本體E0上之一導引機構E1。如第2圖所示,在前述第一錫絲供應單元P1正常供應第一錫絲W1至餵錫模組F的情況下,可動模組G係相對於固定模組E位在一第一位置,此時第一錫絲W1會依序經過第一夾持部C1、第一導引部G1、固定模組E上之導引機構E1以及緩衝模組B而到達餵錫模組F。The aforementioned fixing module E mainly includes a main body E0 and a guiding mechanism E1 disposed on the main body E0. As shown in FIG. 2 , when the first tin wire supply unit P1 normally supplies the first tin wire W1 to the tin feeding module F, the movable module G is located at a first position relative to the fixed module E At this time, the first tin wire W1 will sequentially pass through the first clamping portion C1, the first guiding portion G1, the guiding mechanism E1 on the fixing module E, and the buffer module B to reach the tin feeding module F.
然而,如第3圖所示,當感測器S1因偵測到第一錫絲W1之末端而判斷第一錫絲W1即將用盡時,前述感測器S1會傳送一感測訊號至一處理單元(例如工業電腦),接著該處理單元會傳送一驅動訊號到驅動器D1,藉以將可動模組G從第2圖所示之第一位置相對於固定模組E朝左移動至一第二位置(如第3圖所示)。However, as shown in FIG. 3, when the sensor S1 detects the end of the first tin wire W1 and determines that the first tin wire W1 is about to be used up, the aforementioned sensor S1 will transmit a sensing signal to a A processing unit (such as an industrial computer), then the processing unit will send a driving signal to the driver D1, so as to move the movable module G from the first position shown in Figure 2 to the left relative to the fixed module E to a second location (as shown in Figure 3).
需特別說明的是,在可動模組G相對固定模組E由前述第一位置移動到第二位置的過程中,第一錫絲W1會被可動模組G與固定模組E截斷,且截斷後留在固定模組E上的第一錫絲W1(主段部)會與第二錫絲W2的末端對齊,接著則可透過熔接單元H自動地將第二錫絲W2與位在固定模組E上之第一錫絲W1(主段部)相互熔接;如此一來,便能夠不間斷地繼續使用第二錫絲供應單元P2所提供的第二錫絲W2以進行後續焊錫加工作業。It should be noted that, in the process of moving the movable module G relative to the fixed module E from the aforementioned first position to the second position, the first tin wire W1 will be cut off by the movable module G and the fixed module E, and cut off. The first tin wire W1 (main section) left on the fixing module E will be aligned with the end of the second tin wire W2, and then the second tin wire W2 can be automatically connected to the fixing die through the welding unit H. The first tin wires W1 (main sections) on the group E are welded to each other; in this way, the second tin wires W2 provided by the second tin wire supply unit P2 can be continuously used for subsequent solder processing operations.
另一方面,當感測器S1偵測到第一錫絲W1之末端而判斷第一錫絲W1即將用盡時,前述處理單元也會傳送一驅動訊號到另一驅動器D2,藉以將緩衝機構B從第2圖所示之一第三位置相對於固定模組E朝左移動到一第四位置(如第3圖所示)。此時,設置在緩衝機構B上之一偏壓元件L會接觸並壓迫固定模組E上的導引機構E1,以透過導引機構E1夾緊第一錫絲W1,從而能暫時地將第一錫絲W1固定於前述固定模組E上之一既定位置(第3圖),以方便前述熔接單元H進行錫絲的熔接作業。On the other hand, when the sensor S1 detects the end of the first tin wire W1 and determines that the first tin wire W1 is about to be used up, the aforementioned processing unit will also transmit a driving signal to another driver D2, so as to connect the buffer mechanism B moves from a third position shown in FIG. 2 to a fourth position (as shown in FIG. 3 ) to the left relative to the fixed module E. At this time, a biasing element L disposed on the buffer mechanism B will contact and press the guide mechanism E1 on the fixed module E, so as to clamp the first tin wire W1 through the guide mechanism E1, so that the first tin wire W1 can be temporarily removed. A tin wire W1 is fixed at a predetermined position on the fixing module E (FIG. 3), so as to facilitate the welding operation of the tin wire by the welding unit H.
舉例而言,前述熔接單元H可包含雷射熔接裝置、超音波熔接裝置、阻抗熔接裝置、電弧熔接裝置、加熱器或熱風槍,前述驅動器D1、D2則可包含氣壓缸、電動缸、線性馬達、齒輪或齒條等傳動機構。For example, the aforementioned welding unit H may include a laser welding device, an ultrasonic welding device, an impedance welding device, an arc welding device, a heater or a heat gun, and the aforementioned drivers D1 and D2 may include a pneumatic cylinder, an electric cylinder, and a linear motor. , gear or rack and other transmission mechanisms.
又,從第2圖可以清楚地看出,前述緩衝機構B包含有一本體B0以及設置於本體B0上的複數個導引件B1,此外在前述固定模組E上則設有複數個導引件R2,其中前述導引件R1、R2可用以引導第一錫絲W1朝餵錫模組F方向移動;然而,如第3圖所示,當緩衝機構B從第三位置移動至第四位置時,由於導引件R1朝導引件R2靠近,因此位在固定模組E上之第一錫絲W1(主段部)會從緩衝機構B的導引件R1上鬆脫,藉此可使餵錫模組F於一特定期間內仍然能夠有錫絲可以進行焊錫加工作業,且在此同時也能夠將剩餘的第一錫絲W1移除並更換新的錫絲而不需要停機,故可大幅提高生產效率。舉例而言,前述第一、第二導引部G1、G2、導引機構E1以及前述導引件R1、R2可包含滾輪、導桿、導管或導槽,並不以本實施例所揭露者為限。In addition, it can be clearly seen from FIG. 2 that the aforementioned buffer mechanism B includes a main body B0 and a plurality of guide members B1 arranged on the main body B0, and a plurality of guide members are provided on the aforementioned fixing module E. R2, wherein the aforementioned guide members R1, R2 can be used to guide the first tin wire W1 to move toward the tin feeding module F; however, as shown in Figure 3, when the buffer mechanism B moves from the third position to the fourth position , since the guide member R1 is close to the guide member R2, the first tin wire W1 (main segment) located on the fixed module E will be released from the guide member R1 of the buffer mechanism B, thereby making the The tin feeding module F can still have tin wires for solder processing within a certain period of time, and at the same time, the remaining first tin wires W1 can be removed and replaced with new tin wires without stopping, so it can be Significantly improve production efficiency. For example, the first and second guiding parts G1 and G2, the guiding mechanism E1 and the guiding elements R1 and R2 may include rollers, guiding rods, pipes or guiding grooves, which are not disclosed in this embodiment. limited.
接著請一併請參閱第4、5圖,其中第4圖表示第2圖中之錫絲供應系統的局部放大示意圖,第5圖表示當可動模組G相對固定模組E位在第一位置時,第一、第二錫絲W1、W2、可動模組G以及固定模組E之間的相對位置關係示意圖。Next, please refer to Figures 4 and 5 together. Figure 4 is a partially enlarged schematic view of the solder wire supply system in Figure 2. Figure 5 shows when the movable module G is in the first position relative to the fixed module E. , a schematic diagram of the relative positional relationship between the first and second tin wires W1, W2, the movable module G and the fixed module E.
如第4、5圖所示,當可動模組G相對固定模組E位在第一位置時,第一錫絲供應單元P1可正常供應第一錫絲W1至餵錫模組F。此外,從第5圖可以看出,在可動模組G的本體G0上形成有一第一導槽V1以及一第二導槽V2,在固定模組E之本體E0上則形成有一第三導槽V3、一第一容納部U1以及一第二容納部U2,其中可動模組G之本體G0與固定模組E之本體E0係以可相互滑動的方式彼此緊鄰設置。As shown in Figures 4 and 5, when the movable module G is in the first position relative to the fixed module E, the first tin wire supply unit P1 can supply the first tin wire W1 to the tin feeding module F normally. In addition, as can be seen from FIG. 5, a first guide groove V1 and a second guide groove V2 are formed on the body G0 of the movable module G, and a third guide groove is formed on the body E0 of the fixed module E V3, a first accommodating part U1 and a second accommodating part U2, wherein the main body G0 of the movable module G and the main body E0 of the fixed module E are arranged next to each other in a slidable manner.
應了解的是,當可動模組G相對固定模組E位在第一位置時,第一錫絲W1係被限位於前述第一導槽V1以及前述第三導槽V3內,藉此可避免第一錫絲W1在輸送過程中從可動模組G以及固定模組E上脫落。此外,作為備用的第二錫絲W2則是被限位於前述第二導槽V2以及前述第二容納部U2內。It should be understood that when the movable module G is located at the first position relative to the fixed module E, the first tin wire W1 is limited to the first guide groove V1 and the third guide groove V3, thereby avoiding The first tin wire W1 falls off from the movable module G and the fixed module E during the conveying process. In addition, the second tin wire W2 used as a backup is limited in the aforementioned second guide groove V2 and the aforementioned second accommodating portion U2.
請繼續參閱第5圖,前述第一錫絲W1可區分為位在第三導槽V3內之一主段部W11以及位在第一導槽V1內之一殘留部W12,第二錫絲W2則可區分為位在第二導槽V2內之一備用部W21以及位在第二容納部U2內之一延伸部W22;特別地是,前述第一、第二、第三導槽V1、V2、V3以及第一、第二容納部U1、U2的末端分別形成有一尖銳結構N,其可用以切割前述第一、第二錫絲W1、W2。Please continue to refer to FIG. 5, the first tin wire W1 can be divided into a main section W11 located in the third guide groove V3 and a residual part W12 located in the first guide groove V1, and the second tin wire W2 It can be divided into a spare part W21 located in the second guide groove V2 and an extension part W22 located in the second accommodating part U2; in particular, the aforementioned first, second and third guide grooves V1, V2 , V3 and the ends of the first and second accommodating parts U1 , U2 are respectively formed with a sharp structure N, which can be used to cut the aforementioned first and second tin wires W1 , W2 .
接著請一併請參閱第6、7圖,第6圖表示第3圖中之錫絲供應系統的局部放大示意圖,第7圖表示當可動模組G相對固定模組E由第一位置移動到第二位置時,第一、第二錫絲W1、W2、可動模組G以及固定模組E之間的相對位置關係示意圖。Next, please refer to Figures 6 and 7. Figure 6 shows a partial enlarged schematic view of the solder wire supply system in Figure 3. Figure 7 shows when the movable module G moves relative to the fixed module E from the first position to In the second position, a schematic diagram of the relative positional relationship between the first and second tin wires W1, W2, the movable module G and the fixed module E.
如第6、7圖所示,當如第3圖之感測器S1偵測到第一錫絲W1之末端而判斷第一錫絲W1即將用盡時,可動模組G會相對固定模組E由第一位置移動到第二位置,此時第一、第二錫絲W1、W2會受到前述尖銳結構N的切割作用而斷裂;也就是說,第一錫絲W1會隨著可動模組G相對於固定模組E移動而被切斷成為位在固定模組E上之主段部W11以及位在可動模組G上之殘留部W12;同理,第二錫絲W2也會隨著可動模組G相對於固定模組E移動而被切斷成為位在可動模組G上之備用部W21以及位在固定模組E上之延伸部W22(如第7圖所示),其中該第二錫絲W2之備用部W21會與可動模組G之端面切齊。As shown in Figs. 6 and 7, when the sensor S1 in Fig. 3 detects the end of the first tin wire W1 and determines that the first tin wire W1 is about to be used up, the movable module G will be opposite to the fixed module E moves from the first position to the second position. At this time, the first and second tin wires W1 and W2 will be broken by the cutting action of the aforementioned sharp structure N; that is to say, the first tin wire W1 will follow the movable module. G moves relative to the fixed module E and is cut into a main section W11 located on the fixed module E and a residual part W12 located on the movable module G; similarly, the second tin wire W2 will also follow the The movable module G moves relative to the fixed module E and is cut into a spare part W21 located on the movable module G and an extension part W22 located on the fixed module E (as shown in FIG. 7 ), wherein the The spare portion W21 of the second tin wire W2 is cut flush with the end face of the movable module G.
又,從第7圖中可以看出,當可動模組G相對固定模組E位於第二位置時,第一錫絲W1之主段部W11係緊鄰並恰好對準第二錫絲W2之備用部W21,故此時可利用熔接單元H將第一錫絲W1之主段部W11與第二錫絲W2之備用部W21彼此熔接,從而能夠使第二錫絲W2接續第一錫絲W1而不間斷地供應到餵錫模組F,以利於進行之後的焊錫加工作業。Also, as can be seen from Figure 7, when the movable module G is located at the second position relative to the fixed module E, the main section W11 of the first tin wire W1 is close to and just aligned with the spare portion of the second tin wire W2 Therefore, at this time, the main section W11 of the first tin wire W1 and the spare part W21 of the second tin wire W2 can be welded to each other by the welding unit H, so that the second tin wire W2 can be connected to the first tin wire W1 without It is intermittently supplied to the tin feeding module F to facilitate subsequent solder processing operations.
另一方面,從第7圖中也可以看出,當可動模組G相對固定模組E位於第二位置時,第一錫絲W1之殘留部W12係位在第一導槽V1內並對準第一容納部U1,藉此可方便將第一錫絲W1的殘留部W12移除後更換新的錫絲,同時可將新的錫絲安裝到第一導槽V1和第一容納部U1中,並使新錫絲的末端位於第一容納部U1內(如同第5圖中位於第二容納部U2內之延伸部W22);如此一來,新的錫絲即可作為備用之錫絲,且當前樹感測器S2偵測到第二錫絲W2之末端而判斷第二錫絲W2即將用盡時,則可將前述可動模組G相對固定模組E由第二位置移動回復到第一位置(如第2、4圖所示),並利用熔接單元H將新的錫絲與第二錫絲W2彼此熔接,從而能夠反覆而不間斷地供應錫絲到餵錫模組F,以利於進行焊錫加工作業。On the other hand, it can also be seen from FIG. 7 that when the movable module G is located at the second position relative to the fixed module E, the residual portion W12 of the first tin wire W1 is located in the first guide groove V1 and has a The first accommodating portion U1 is aligned, so that the residual portion W12 of the first tin wire W1 can be easily removed and then replaced with a new tin wire, and at the same time, the new tin wire can be installed in the first guide groove V1 and the first accommodating portion U1 , and make the end of the new tin wire located in the first accommodating part U1 (like the extension W22 in the second accommodating part U2 in Figure 5); in this way, the new tin wire can be used as a spare tin wire , and when the current tree sensor S2 detects the end of the second tin wire W2 and determines that the second tin wire W2 is about to be used up, the movable module G can be moved from the second position relative to the fixed module E to return to The first position (as shown in Figures 2 and 4), and the welding unit H is used to weld the new tin wire and the second tin wire W2 to each other, so that the tin wire can be supplied to the tin feeding module F repeatedly and uninterruptedly. In order to facilitate solder processing operations.
綜上所述,本發明提供一種錫絲供應系統,能夠在機台缺錫的情況下自動補充錫絲,並可藉由熔接單元自動地將新錫絲與舊錫絲彼此熔接。尤其,在補充新錫絲的過程中,焊錫加工流程仍然可以持續進行,從而可大幅節省人力成本並提高生產效率。To sum up, the present invention provides a tin wire supply system, which can automatically replenish tin wire when the machine is short of tin, and can automatically weld new tin wire and old tin wire to each other through the welding unit. In particular, during the process of replenishing new tin wire, the soldering process can still continue, which can greatly save labor costs and improve production efficiency.
雖然本發明的實施例及其優點已揭露如上,但應該瞭解的是,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作更動、替代與潤飾。此外,本發明之保護範圍並未侷限於說明書內所述特定實施例中的製程、機器、製造、物質組成、裝置、方法及步驟,任何所屬技術領域中具有通常知識者可從本發明揭示內容中理解現行或未來所發展出的製程、機器、製造、物質組成、裝置、方法及步驟,只要可以在此處所述實施例中實施大抵相同功能或獲得大抵相同結果皆可根據本發明使用。因此,本發明之保護範圍包括上述製程、機器、製造、物質組成、裝置、方法及步驟。另外,每一申請專利範圍構成個別的實施例,且本發明之保護範圍也包括各個申請專利範圍及實施例的組合。Although the embodiments of the present invention and their advantages have been disclosed above, it should be understood that those skilled in the art can make changes, substitutions and modifications without departing from the spirit and scope of the present invention. In addition, the protection scope of the present invention is not limited to the process, machine, manufacture, material composition, device, method and steps in the specific embodiments described in the specification, and any person with ordinary knowledge in the technical field can learn from the present disclosure. It is understood that processes, machines, manufactures, compositions of matter, devices, methods and steps developed in the present or in the future can be used in accordance with the present invention as long as they can perform substantially the same functions or achieve substantially the same results in the embodiments described herein. Therefore, the protection scope of the present invention includes the above-mentioned process, machine, manufacture, composition of matter, device, method and steps. In addition, each claimed scope constitutes a separate embodiment, and the protection scope of the present invention also includes the combination of each claimed scope and the embodiments.
雖然本發明已以較佳實施例揭露於上,然其並非用以限定本發明,任何熟習此項工藝者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Anyone skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, The protection scope of the present invention shall be determined by the scope of the appended patent application.
11:錫絲捲11: Tin Wire Roll
12:餵錫模組12: Tin feeding module
13:馬達滾輪13: Motor roller
14:出錫口14: Tin outlet
B:緩衝模組B: Buffer module
B0:本體B0: Ontology
C1:第一夾持部C1: The first clamping part
C2:第二夾持部C2: Second clamping part
D1:驅動器D1: Drive
D2:驅動器D2: Drive
E:固定模組E: Fixed module
E0:本體E0: Ontology
E1:導引機構E1: Guiding Mechanism
F:餵錫模組F: Feeding Tin Module
G:可動模組G: Movable module
G0:本體G0: body
G1:第一導引部G1: The first guide part
G2:第二導引部G2: Second guide part
H:熔接單元H: fusion unit
L:偏壓元件L: Bias element
N:尖銳結構N: sharp structure
P1:第一錫絲供應單元P1: The first tin wire supply unit
P2:第二錫絲供應單元P2: The second tin wire supply unit
R1:導引件R1: Guide
R2:導引件R2: Guide
S1:感測器S1: Sensor
S2:感測器S2: Sensor
U1:第一容納部U1: First accommodating part
U2:第二容納部U2: Second accommodating part
V1:第一導槽V1: The first guide groove
V2:第二導槽V2: Second guide groove
V3:第三導槽V3: The third guide groove
W:錫絲W: tin wire
W1:第一錫絲W1: The first tin wire
W11:主段部W11: Main Section
W12:殘留部W12: Residual part
W2:第二錫絲W2: Second tin wire
W21:備用部W21: Spare Department
W22:延伸部W22: Extension
第1圖表示一習知焊錫設備的示意圖。 第2圖表示本發明一實施例之錫絲供應系統的示意圖。 第3圖表示當第2圖中之感測器S1偵測到第一錫絲W1即將用盡時的示意圖。 第4圖表示第2圖中之錫絲供應系統的局部放大示意圖。 第5圖表示當可動模組G相對固定模組E位在第一位置時,第一、第二錫絲W1、W2、可動模組G以及固定模組E之間的相對位置關係示意圖。 第6圖表示第3圖中之錫絲供應系統的局部放大示意圖。 第7圖表示當可動模組G相對固定模組E由第一位置移動到第二位置時,第一、第二錫絲W1、W2、可動模組G以及固定模組E之間的相對位置關係示意圖。 FIG. 1 shows a schematic diagram of a conventional soldering apparatus. FIG. 2 is a schematic diagram of a tin wire supply system according to an embodiment of the present invention. FIG. 3 is a schematic diagram when the sensor S1 in FIG. 2 detects that the first tin wire W1 is about to be used up. FIG. 4 is a partially enlarged schematic view of the tin wire supply system in FIG. 2 . 5 is a schematic diagram showing the relative positional relationship between the first and second tin wires W1 and W2, the movable module G and the fixed module E when the movable module G is located at the first position relative to the fixed module E. FIG. 6 is a partially enlarged schematic view of the tin wire supply system in FIG. 3 . Figure 7 shows the relative positions of the first and second tin wires W1, W2, the movable module G and the fixed module E when the movable module G moves relative to the fixed module E from the first position to the second position Relationship diagram.
B:緩衝模組 B: Buffer module
B0:本體 B0: Ontology
C1:第一夾持部 C1: The first clamping part
C2:第二夾持部 C2: Second clamping part
D1:驅動器 D1: Drive
D2:驅動器 D2: Drive
E:固定模組 E: Fixed module
E0:本體 E0: Ontology
E1:導引機構 E1: Guiding Mechanism
F:餵錫模組 F: Feeding Tin Module
G:可動模組 G: Movable module
G0:本體 G0: body
G1:第一導引部 G1: The first guide part
G2:第二導引部 G2: Second guide part
H:熔接單元 H: fusion unit
L:偏壓元件 L: Bias element
P1:第一錫絲供應單元 P1: The first tin wire supply unit
P2:第二錫絲供應單元 P2: The second tin wire supply unit
R1:導引件 R1: Guide
R2:導引件 R2: Guide
S1:感測器 S1: Sensor
S2:感測器 S2: Sensor
W1:第一錫絲 W1: The first tin wire
W2:第二錫絲 W2: Second tin wire
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CN109689270A (en) * | 2016-07-08 | 2019-04-26 | 挪威钛公司 | Metal wire feed system and method |
CN106735751A (en) * | 2016-12-30 | 2017-05-31 | 青岛卓思三维智造技术有限公司 | The automatic complement wire system and method in two cabins |
CN109702285A (en) * | 2017-10-25 | 2019-05-03 | 宝山钢铁股份有限公司 | A kind of welding wire feeding device |
CN111515498A (en) * | 2019-02-05 | 2020-08-11 | 林肯环球股份有限公司 | Dual wire welding or additive manufacturing system |
CN111571069A (en) * | 2020-04-26 | 2020-08-25 | 湖北三环锻造有限公司 | Continuous wire feeding device and mechanical arm |
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