TWI764851B - Miniaturized semiconductor manufacturing system - Google Patents

Abstract

A miniaturized semiconductor manufacturing system is provided, including: a housing, including an inner space and an opening communicated with the inner space; a lifting mechanism, disposed in the inner space and including a holder configured to place a substrate, the holder being movable between a first position and a second position in a first direction relative to the opening; a processing chamber, disposed in the inner space and including a holding portion configured to place the substrate; and a transportation mechanism, disposed between the lifting mechanism and the processing chamber and being movable in a second direction; wherein an aspect ratio value of the housing is between 1 to 6.

Description

Miniaturized Semiconductor Process System

The present invention relates to a process system, in particular, to a miniaturized semiconductor process system.

Vacuum technology plays an important role in the semiconductor industry. Processes such as sputtering, lithography and etching all need to be carried out in a vacuum chamber, so as to reduce the influence of gas molecules on the processing of test pieces and effectively ensure production quality.

In the semiconductor manufacturing process, in order to manufacture semiconductor devices in batches, large-sized wafers are usually selected, and a robotic arm is used to transfer the wafers between multiple process chambers and storage spaces for continuous processing and manufacturing. However, in order to accommodate and transfer the aforementioned large-sized wafers, this type of vacuum system has the disadvantages of large volume and high construction cost, which is prone to waste of cost in small batch production or R&D testing stage, and the production time is long and the production efficiency is not good. .

Therefore, it is necessary to provide a novel and progressive miniaturized semiconductor process system to solve the above problems.

The main purpose of the present invention is to provide a miniaturized semiconductor process system with small size and low manufacturing cost.

In order to achieve the above object, the present invention provides a miniaturized semiconductor process system, comprising: a casing including an inner space and an opening communicating with the inner space; a lifting mechanism disposed in the inner space and including a a substrate carrier, the carrier can move relative to the opening along a first direction between a first position and a second position; a processing chamber is provided in the inner space and includes a substrate for placing the substrate a carrying part; and a conveying mechanism, which can be moved along a second direction between the lifting mechanism and the processing chamber, for taking and conveying the substrate between the stage and the carrying part; wherein, the An aspect ratio of the casing is between 1 and 6; when the stage is located at the first position, the stage is at least partially located in the opening and the substrate can be picked up and placed from outside; when the stage is located at the second position When in position, the pick-up mechanism corresponds to the carrier and can pick up and place the substrate from the carrier.

The following examples are only used to illustrate possible implementations of the present invention, but are not intended to limit the scope of protection of the present invention, and are described together first.

Please refer to FIGS. 1 to 12 , which show a preferred embodiment of the present invention. The miniaturized semiconductor process system 1 of the present invention includes: a casing 10 including an inner space 11 and an opening communicating with the inner space 11 12; an elevating mechanism 20, disposed in the inner space 11 and comprising a stage 21 for placing a substrate 2, the stage 21 can move in a first position relative to the opening 12 along a first direction D1 and a Between the second positions; a processing chamber 30 disposed in the inner space 11 and including a carrying portion 31 for placing the substrate 2; and a conveying mechanism 40 movably disposed along a second direction D2 in the Between the lifting mechanism 20 and the processing chamber 30, the substrate 2 is taken and transported between the stage 21 and the carrying portion 31; wherein, an aspect ratio of the casing 10 is between 1 and 6; when The stage 21 is located at the first position, the stage 21 is at least partially located in the opening 12 and can be used for taking and placing the substrate 2 from the outside, as shown in FIG. 3 ; when the stage 21 is at the second position, The picking mechanism 40 corresponds to the carrier 21 and can pick up and place the substrate 2 from the carrier 21 , as shown in FIG. 6 . Therefore, the miniaturized semiconductor process system 1 is small in size and low in manufacturing cost, and is suitable for small batch production in the stages of research and development and testing.

Preferably, the miniaturized semiconductor process system 1 further includes a cover 50 which can be opened and closed on the opening 12 and at least one actuating rod 60 connected to the cover 50 , and each of the actuating rods 60 includes a Connect the first end 61 of the cover 50 and a second end 62 opposite to the first end 61 and extending into the inner space 11; when the stage 21 moves toward the first position, the lifting mechanism 20 lifts Pushing the second end 62 causes the at least one actuating rod 60 to drive the cover 50 relatively away from the opening 12 , whereby the cover 50 can be automatically opened. In this embodiment, the at least one actuating rod 60 is slidably disposed through the housing 10 ; the lifting mechanism 20 further includes a moving platform 22 connected to the carrier 21 at intervals and a moving platform capable of driving the moving platform. The elevating drive unit 23 of 22 , the moving platform 22 is driven by the elevating drive unit 23 to drive the carrier 21 to move along the first direction D1 , and the moving platform 22 can push the at least one actuating rod 60 . The two ends 62 have smooth movement and good stability. Preferably, each of the actuating rods 60 further includes a radially protruding stop portion 63 and is sleeved with a first elastic piece 64 that springs against the housing 10 and the stop portion 63, thereby each The actuating rod 60 has a tendency to move away from the opening 12 ; when the stage 21 moves toward the second position, the at least one actuating rod 60 can drive the cover 50 to automatically close the opening 12 , so as to prevent foreign objects from entering the inner space 11 . In this embodiment, each of the blocking portions 63 is a nut, which has a simple structure and is easy to assemble; a sealing ring 51 is preferably provided between the cover 50 and the peripheral wall of the opening 12, and the sealing effect is good; 21 is provided with at least one guide groove 211 corresponding to the at least one actuating rod 60, and each of the actuating rods 60 is movably disposed in one of the guide grooves 211, so as to guide the movement of the stage 21; the relative position of the opening 12 An actuating rod 60 is provided on each of the two sides, and the actuation is stable and not easy to be displaced relative to each other. However, each of the actuating rods may not be provided with the first elastic member, and the cover can manually close the opening; the number and position of the at least one actuating rod can be changed according to structural requirements.

In detail, the lifting mechanism 20 further includes a plurality of connecting rods 24 connecting the moving platform 22 and the stage 21 and at least a second elastic member 25 set at least one of the connecting rods 24. Each of the second elastic members 25 It bounces between the moving platform 22 and the carrier 21 to provide a buffering effect. Referring to FIG. 3 and FIG. 4 , during operation, the moving platform 22 rises and drives the stage 21 to move toward the first position. When the stage 21 abuts against the housing 10 in the first direction D1, The moving platform 22 continuously rises to compress the at least one second elastic member 25 and pushes the second ends 62 of the actuating rods 60 to open the cover 50 to allow the substrate 2 to be taken and placed from outside; then, the The moving platform 22 descends to drive the stage 21 to move toward the second position. When the moving platform 22 descends and does not push the actuating rods 60 , the first elastic members 64 stretch and drive the two actuating rods 60 to make the two actuating rods 60 . The cover 50 closes the opening 12 , as shown in FIGS. 5 and 6 .

The pickup mechanism 40 includes a translation module 41 and a rotation module 42 disposed in the translation module 41. The rotation module 42 includes a rotation shaft 421 parallel to the first direction D1 and a rotation shaft 421 as a The shaft rotates and is used to pick up and place the pick-up arm 422 of the substrate 2 . Specifically, the translation module 41 includes a slide rail 411 disposed on the casing 10 parallel to the second direction D2 and a slide base 412 movably disposed on the slide rail 411 , and the rotation module 42 is provided with On the sliding seat 412, the sliding seat 412 can drive the rotating module 42 to move laterally, thereby shortening the conveying distance. The elevating mechanism 20 , the translation module 41 and the rotation module 42 can preferably act synchronously, which can effectively shorten the conveying time and reduce the space required for the fetching and conveying mechanism 40 , which is beneficial to the miniaturization of the miniaturized semiconductor process system 1 . change. Preferably, the pickup mechanism 40 further includes a lift module 43 disposed between the translation module 41 and the rotation module 42. The lift module 43 can drive the pick-up arm 422 along a parallel to the The direction of the first direction D1 moves. In this embodiment, the stage 21 includes a base 212 connected to the moving platform 22 and two supporting arms 213 protruding from the base 212 at intervals, and the two supporting arms 213 are used to support the substrate 2; One end of the feeding arm 422 is provided with a recess 423 for accommodating the substrate 2; when the stage 21 is located at the second position, the translation module 41 drives the reclaiming arm 422 to translate so that the locking recess 423 is located in the second position. Between the two supporting arms 213 , as shown in FIG. 6 , the lifting module 43 drives the reclaiming arm 422 to move up and down relative to the carrier 21 along the first direction D1 , so as to lift the substrate 2 upward or place it downward. The substrate 2 is shown in FIG. 7 .

Referring to FIG. 8 and FIG. 9 , after the reclaiming arm obtains the substrate 2 , the sliding seat 412 drives the reclaiming arm 422 to retreat from the carrier 21 , and the rotating shaft 421 drives the reclaiming arm 422 toward the processing chamber 30 . When one side rotates, when the latch 423 is adjacent to the processing chamber 30 , the sliding seat 412 drives the pick arm 422 to move toward the carrier 21 to allow the pick arm 422 to rotate until the latch 423 corresponds to The bearing portion 31 is shown in FIG. 10 . The processing chamber 30 further includes a chamber door 32 corresponding to the bearing portion 31 . When the chamber door 32 is opened, the transporting mechanism 40 can extend into the processing chamber 30 and pick up and place the processing chamber 30 from the bearing portion 31 . For the substrate 2, as shown in FIG. 11, after the substrate 2 is placed on the bearing portion 31, the sliding seat 412 drives the pick-up arm 422 to withdraw from the processing chamber 30, and the chamber door 32 is closed to allow the process to proceed. As shown in Figure 12. The processing chamber 30 can be sealed and decompressed to a vacuum state according to process requirements. The processing chamber 30 can include related process components such as a sputtering module, a thin film deposition module, or a thermal evaporation film group according to equipment functions. The size of the substrate 2 is preferably not greater than 2 inches, which can effectively reduce material loss and shorten the process time.

The miniaturized semiconductor process system 1 further includes an electronic control unit 70 and an operation display interface 80 electrically connected to the electronic control unit 70 . The operation display interface 80 is provided on the casing 10 for external operation. The unit 70 is electrically connected to the lifting mechanism 20 , the processing chamber 30 and the conveying mechanism 40 , whereby various parameters in the processing chamber 30 can be controlled by the operation display interface 80 , such as but not limited to the processing chamber The pressure, temperature, intensity of light source, opening and closing of the cavity door 32 in 30 can also control the movement of the lifting mechanism 20 and the conveying mechanism 40 .

A length L of the casing 10 is not greater than 1.6 meters, and a width W of the casing 10 is not greater than 0.5 meters, limiting the length and width of the miniaturized semiconductor process system 1 to effectively reduce the footprint. Further, the housing 10 includes a front side plate 13 and a rear side plate 14. The front side plate 13 extends toward the rear side plate 14 and has a recessed portion 131 that is closed in a circumferential direction. A side wall of the recessed portion 131 is provided with the opening 12. To avoid foreign objects colliding and entering the opening 12 ; preferably, the concave portion 131 extends obliquely relative to a side wall 132 of the opening 12 toward the side where the opening 12 is provided, so as to facilitate taking and placing the substrate 2 . Of course, the two adjacent side walls of the concave portion can also be vertically connected to each other. In this embodiment, the housing 10 further includes a set of frame 15, the front side plate 13 and the rear side plate 14 are covered on the set frame 15, the lifting mechanism 20, the transport mechanism 40, the processing chamber Both the chamber 30 and the electronic control unit 70 are assembled on the assembly frame 15, which has good stability and is convenient for manufacture and maintenance and replacement of components; the assembly frame 15 distinguishes the inner space 11 as a first area 111 and a first area 111. The second area 112, the lifting mechanism 20 and the conveying mechanism 40 are arranged in the first area 111, the processing chamber 30 is arranged in the second area 112; the electronic control unit 70 is arranged in the second area 112 and located in the second area 112 Above the processing chamber 30, the wiring distance can be shortened. With the above configuration, the internal space 11 can be effectively utilized to miniaturize the miniaturized semiconductor process system 1 .

1: Miniaturized semiconductor process system 2: Substrate 10: Shell 11: Internal space 111: District 1 112: Second District 12: Opening 13: Front side panel 131: Recess 132: Sidewall 14: Rear side panel 15: Assembly frame 20: Lifting mechanism 21: Carrier 211: Guide groove 212: Pedestal 213: Arm support 22: Mobile Platforms 23: Lifting drive unit 24: connecting rod 25: Second elastic piece 30: Processing Chamber 31: Bearing part 32: cavity door 40: Pickup and delivery agency 41: Pan module 411: Slide rail 412: Slider 42: Rotation module 421: Spindle 422: Reclaimer arm 423: Card concave 43: Lifting module 50: capping 51: sealing ring 60: Actuator lever 61: First End 62: Second End 63: Stopper 64: The first elastic piece 70: Electronic control unit 80: Operation display interface D1: first direction D2: Second direction L: length W: width

FIG. 1 is a perspective view of a preferred embodiment of the present invention. FIG. 2 is a side view of a preferred embodiment of the present invention. FIG. 3 is a partial enlarged view of a stage in a first position according to a preferred embodiment of the present invention. 4 is a partial side view of the stage in the first position according to a preferred embodiment of the present invention. FIG. 5 is a partial enlarged view of the carrier in a second position according to a preferred embodiment of the present invention. FIG. 6 and FIG. 7 are schematic diagrams illustrating the operation of a pick-up arm to pick up a substrate from the carrier according to a preferred embodiment of the present invention. 8 to 12 are schematic diagrams of operation of a preferred embodiment of the present invention.

1: Miniaturized semiconductor process system

10: Shell

13: Front side panel

131: Recess

50: capping

80: Operation display interface

L: length

W: width

Claims (10)

A miniaturized semiconductor process system, comprising: a casing, including an inner space and an opening communicating with the inner space; A lift mechanism, disposed in the inner space, includes a stage for placing a substrate, a moving platform connected to the stage at intervals, a lift driving unit capable of driving the moving platform, and a plurality of connecting the moving platform and the moving platform. A connecting rod of the carrier, and at least a second elastic piece set on at least one of the connecting rods, each of the second elastic pieces springs against the moving platform and the carrier, and the moving platform can drive the carrier can be moved relative to the opening between a first position and a second position along a first direction; a processing chamber disposed in the inner space and including a carrier for placing the substrate; and a transporting mechanism, which is movably arranged between the lifting mechanism and the processing chamber along a second direction, for transporting the substrate between the carrier and the carrier; Wherein, an aspect ratio of the casing is between 1 and 6; when the stage is located at the first position, the stage is at least partially located in the opening so that the substrate can be picked up and placed from outside; when the stage is located at the first position In the second position, the pickup mechanism corresponds to the carrier and can pick up and place the substrate from the carrier. The miniaturized semiconductor process system as claimed in claim 1, wherein the transport mechanism includes a translation module and a rotation module disposed in the translation module, and the rotation module includes a rotation shaft parallel to the first direction and a pick-up arm which rotates with the rotating shaft as an axis and is used for picking and placing the substrate. The miniaturized semiconductor process system of claim 2, wherein the translation module comprises a slide rail disposed on the casing parallel to the second direction and a slide base movably disposed on the slide rail, the The rotating module is arranged on the sliding seat. The miniaturized semiconductor manufacturing system according to claim 2, wherein the pick-up and delivery mechanism further comprises a lift module disposed between the translation module and the rotation module, and the lift module can drive the pick-up arm along the edge A direction parallel to the first direction moves. The miniaturized semiconductor process system as claimed in claim 1, further comprising an electronic control unit and an operation display interface electrically connected to the electronic control unit, wherein the operation display interface is provided on the casing for external operation, and the The electronic control unit is electrically connected to the lifting mechanism, the processing chamber and the transport mechanism. The miniaturized semiconductor process system as claimed in claim 1, wherein the housing comprises a front side plate and a rear side plate, the front side plate extends toward the rear side plate with a concave portion that is closed in a circumferential direction, and a side wall of the concave portion is provided with the opening. The miniaturized semiconductor process system of claim 1, wherein a length of one of the casings is not greater than 1.6 meters, and a width of one of the casings is not greater than 0.5 meters. The miniaturized semiconductor process system according to any one of claims 1 to 7, further comprising a cover that can be opened and closed on the opening and at least one actuating rod connected to the cover, wherein each of the actuating The rod includes a first end connected to the cover and a second end opposite to the first end and extending into the inner space; when the stage moves toward the first position, the lifting mechanism pushes the second end The end enables the at least one actuating rod to drive the cover relatively away from the opening. The miniaturized semiconductor process system as claimed in claim 8, wherein each of the actuating rods further comprises a radially protruding stopper and sleeved with a first elastic force that is resilient against the housing and the stopper. pieces. The miniaturized semiconductor process system of claim 4, wherein the translation module comprises a slide rail disposed on the casing parallel to the second direction and a slide seat movably disposed on the slide rail, the The rotating module is arranged on the sliding seat; the lifting mechanism, the translation module and the rotating module can be actuated synchronously; the processing chamber further includes a chamber door corresponding to the bearing portion; the miniaturized semiconductor process system further includes an electronic control unit and an operation display interface electrically connected to the electronic control unit, the operation display interface is provided on the casing for external operation, the electronic control unit is electrically connected to the lifting mechanism, the processing chamber and the A pick-up and delivery mechanism; the casing includes a front side plate and a rear side plate, the front side plate extends toward the rear side plate with a concave portion that is closed in a circumferential direction, and a side wall of the concave portion is provided with the opening; the concave portion is opposite to the opening. A side wall extends obliquely toward the side with the opening; a length of one of the casings is not greater than 1.6 meters, and a width of one of the casings is not greater than 0.5 meters; the miniaturized semiconductor process system further includes an openable and closable ground A cover covering the opening and at least one actuating rod connected to the cover, each of the actuating rods includes a first end connected to the cover and an opposite to the first end and extending into the inner space the second end; the at least one actuating rod is slidably penetrated through the casing; when the stage moves toward the first position, the moving platform pushes the second end so that the at least one actuating rod drives the The cover is relatively far away from the opening; each of the actuating rods further includes a radially protruding stop part and is sleeved with a first elastic piece that springs against the casing and the stop part; the stage is provided with There is at least one guide groove corresponding to the at least one actuating rod, and each of the actuating rods is movably arranged in one of the guide grooves; the casing further includes a set of connecting frames, and the front side plate and the rear side plate are covered on the an assembling frame; the assembling frame divides the inner space into a first area and a second area, the lifting mechanism and the conveying mechanism are arranged in the first area, and the processing chamber is arranged in the second area; and The electronic control unit is located in the second area and above the processing chamber.

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