TWI764499B - Biometric sensing apparatus - Google Patents

Biometric sensing apparatus

Info

Publication number
TWI764499B
TWI764499B TW110100965A TW110100965A TWI764499B TW I764499 B TWI764499 B TW I764499B TW 110100965 A TW110100965 A TW 110100965A TW 110100965 A TW110100965 A TW 110100965A TW I764499 B TWI764499 B TW I764499B
Authority
TW
Taiwan
Prior art keywords
light
holes
shielding layer
sensing element
light shielding
Prior art date
Application number
TW110100965A
Other languages
Chinese (zh)
Other versions
TW202207004A (en
Inventor
王碩宏
謝尚瑋
丘兆仟
Original Assignee
友達光電股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 友達光電股份有限公司 filed Critical 友達光電股份有限公司
Priority to CN202110761241.8A priority Critical patent/CN113822131B/en
Publication of TW202207004A publication Critical patent/TW202207004A/en
Application granted granted Critical
Publication of TWI764499B publication Critical patent/TWI764499B/en

Links

Images

Abstract

A biometric sensing apparatus including a light sensing device, a first medium layer, a first light-shielding layer, a second medium layer, and a second light-shielding layer is provided. The light sensing device is disposed on the substrate. The first medium layer is disposed on the substrate and the light sensing device. The first light-shielding layer is disposed on the first medium layer and has a first hole corresponding to the light sensing device. The first hole has a first aperture and a first center line perpendicular to the substrate. There is a first height between the surface of the first light-shielding layer away from the light sensing device and the light sensing device. The first hole has an offset distance. There is a maximum angle between the light passing through the first hole to the light sensing device and the first center line. The offset distance (S1), the first aperture (W1), the first height (D1) and the maximum angle (α) have the following relationship: 0 <S1 <[W1+(2*(D1*|tan(α)|)) ]; 0 <D1/W1 <15.

Description

生物特徵感測裝置Biometric Sensing Device

本發明是有關於一種感測裝置,且特別是有關於一種生物特徵感測裝置。The present invention relates to a sensing device, and more particularly, to a biometric sensing device.

在一般的指紋感測器(fingerprint sensor;FPS)中,常會藉由孔洞(pinhole;或稱:針孔)的設計以提升訊噪比(signal-to-noise ratio; SNR或S/N)及/或以演算法增強感測元件的影像訊號的處理能力。In general fingerprint sensor (fingerprint sensor; FPS), the design of pinhole (pinhole; also called: pinhole) is often used to improve the signal-to-noise ratio (SNR or S/N) and /or enhance the processing capability of the image signal of the sensing element with an algorithm.

本發明提供一種生物特徵感測裝置,其具有良好的光學及/或對應的辨識性能。The present invention provides a biometric sensing device with good optical and/or corresponding identification performance.

本發明的生物特徵感測裝置適於感測光線。生物特徵感測裝置包括至少一光感測元件、第一介質層、第一遮光層、第二介質層以及第二遮光層。光感測元件設置於基板上。第一介質層設置於基板及光感測元件上。第一遮光層設置於第一介質層上。第一遮光層包含多個第一孔洞。這些第一孔洞至少一者對應於光感測元件。這些第一孔洞至少一者具有垂直於基板之第一中心線。第一遮光層具有二相反的表面。二相反的表面其中一者較接近至少一光感測元件。較遠離光感測元件的第一遮光層之二相反的表面另一者與光感測元件之間具有第一高度。這些第一孔洞至少一者具有第一孔徑。第一高度對第一孔徑的比值大於0且小於15。第二介質層設置於第一遮光層上。第二遮光層設置於第二介質層上。第二遮光層包含多個第二孔洞。這些第二孔洞至少一者對應於這些第一孔洞至少一者。這些第二孔洞至少一者對應於光感測元件。第二遮光層具有二相反的表面。二相反的表面其中一者較接近至少一光感測元件。較遠離光感測元件的第二遮光層之二相反的表面另一者與光感測元件之間具有第二高度。這些第二孔洞至少一者具有第二孔徑。第二高度對第二孔徑的比值大於0且小於15。這些第一孔洞至少一者具有偏移距離。經由這些第一孔洞至少一者至光感測元件的光線與第一中心線之間具有最大夾角。偏移距離為S1,第一孔徑為W1,第一高度為D1,最大夾角為α,且偏移距離、第一孔徑、第一高度及最大夾角具有下列關係:0 < S1 < [W1+(2*(D1*|tan(α)|))]。The biometric sensing device of the present invention is suitable for sensing light. The biometric sensing device includes at least one light sensing element, a first medium layer, a first light shielding layer, a second medium layer and a second light shielding layer. The light sensing element is arranged on the substrate. The first dielectric layer is disposed on the substrate and the light sensing element. The first light shielding layer is disposed on the first dielectric layer. The first light shielding layer includes a plurality of first holes. At least one of the first holes corresponds to the light sensing element. At least one of the first holes has a first centerline perpendicular to the substrate. The first light shielding layer has two opposite surfaces. One of the two opposing surfaces is closer to the at least one light sensing element. A first height is provided between the other surface of the first light shielding layer farther from the light-sensing element and the other opposite surface of the first light-shielding layer and the light-sensing element. At least one of the first holes has a first aperture. The ratio of the first height to the first aperture is greater than 0 and less than 15. The second dielectric layer is disposed on the first light shielding layer. The second light shielding layer is disposed on the second dielectric layer. The second light shielding layer includes a plurality of second holes. At least one of the second holes corresponds to at least one of the first holes. At least one of the second holes corresponds to the light sensing element. The second light shielding layer has two opposite surfaces. One of the two opposing surfaces is closer to the at least one light sensing element. The other two opposite surfaces of the second light shielding layers farther from the light sensing element have a second height between the other surface and the light sensing element. At least one of the second holes has a second aperture. The ratio of the second height to the second aperture is greater than 0 and less than 15. At least one of the first holes has an offset distance. There is a maximum included angle between the light rays passing through at least one of the first holes to the light sensing element and the first center line. The offset distance is S1, the first aperture is W1, the first height is D1, the maximum angle is α, and the offset distance, the first aperture, the first height and the maximum angle have the following relationship: 0 < S1 < [W1+(2 *(D1*|tan(α)|))].

生物特徵感測裝置包括至少一光感測元件、第一介質層、第一遮光層、第二介質層以及第二遮光層。光感測元件設置於基板上。第一介質層設置於基板及光感測元件上。第一遮光層設置於第一介質層上。第一遮光層包含多個第一孔洞。這些第一孔洞至少一者對應於至少一光感測元件。這些第一孔洞至少一者具有一垂直於基板之第一中心線。第一遮光層具有二相反的表面及第一側邊。第一側邊連接二相反的表面。第一側邊連接二相反的表面其中一者形成第一結點。第一遮光層之二相反的表面其中一者較接近至少一光感測元件。較遠離光感測元件的第一遮光層之二相反的表面另一者與光感測元件之間具有一第一高度。這些第一孔洞至少一者具有第一孔徑。第一高度對第一孔徑的比值大於0且小於15。第二介質層設置於第一遮光層上。第二遮光層設置於第二介質層上。第二遮光層包含多個第二孔洞。這些第二孔洞至少一者對應於這些第一孔洞至少一者。第二遮光層具有二相反的表面及第二側邊。第二側邊連接二相反的表面。第二側邊連接二相反的表面其中一者形成一第二結點。第二遮光層之二相反的表面其中一者較接近光感測元件。較遠離光感測元件的第二遮光層之二相反的表面另一者與光感測元件之間具有第二高度。這些第二孔洞至少一者具有第二孔徑。第二高度對第二孔徑的比值大於0且小於15。這些第一孔洞至少一者具有偏移距離。第一結點與第二結點之連線與第一中心線之間具有最大夾角。偏移距離為S1,第一孔徑為W1,第一高度為D1,最大夾角為α,且偏移距離、第一孔徑、第一高度及最大夾角α具有下列關係:0<S1<[W1+(2*(D1*|tan(α)|))]。The biometric sensing device includes at least one light sensing element, a first medium layer, a first light shielding layer, a second medium layer and a second light shielding layer. The light sensing element is arranged on the substrate. The first dielectric layer is disposed on the substrate and the light sensing element. The first light shielding layer is disposed on the first dielectric layer. The first light shielding layer includes a plurality of first holes. At least one of the first holes corresponds to at least one light sensing element. At least one of the first holes has a first centerline perpendicular to the substrate. The first light shielding layer has two opposite surfaces and a first side. The first side connects the two opposing surfaces. The first side connects one of the two opposite surfaces to form a first node. One of the two opposite surfaces of the first light shielding layer is closer to the at least one light sensing element. There is a first height between the other two opposite surfaces of the first light shielding layers farther from the light sensing element and the light sensing element. At least one of the first holes has a first aperture. The ratio of the first height to the first aperture is greater than 0 and less than 15. The second dielectric layer is disposed on the first light shielding layer. The second light shielding layer is disposed on the second dielectric layer. The second light shielding layer includes a plurality of second holes. At least one of the second holes corresponds to at least one of the first holes. The second light shielding layer has two opposite surfaces and a second side. The second side connects the two opposing surfaces. The second side connects one of the two opposite surfaces to form a second node. One of the two opposite surfaces of the second light shielding layer is closer to the light sensing element. The other two opposite surfaces of the second light shielding layers farther from the light sensing element have a second height between the other surface and the light sensing element. At least one of the second holes has a second aperture. The ratio of the second height to the second aperture is greater than 0 and less than 15. At least one of the first holes has an offset distance. The connecting line between the first node and the second node has a maximum included angle with the first center line. The offset distance is S1, the first aperture is W1, the first height is D1, the maximum angle is α, and the offset distance, the first aperture, the first height and the maximum angle α have the following relationship: 0<S1<[W1+( 2*(D1*|tan(α)|))].

基於上述,在本發明的生物特徵感測裝置中,其遮光層的高度、遮光層的孔洞的孔徑、遮光層的孔洞的偏移距離以及對應的夾角之間至少具有上述的關係(以上述的關係式表示)。如此一來,可以使生物特徵感測裝置具有較佳的光學及/或對應的辨識性能。Based on the above, in the biometric sensing device of the present invention, the height of the light-shielding layer, the aperture of the hole in the light-shielding layer, the offset distance of the hole in the light-shielding layer, and the corresponding angle have at least the above relationship (with the above-mentioned relationship) relational representation). In this way, the biometric sensing device can have better optical and/or corresponding identification performance.

為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。如本領域技術人員將認識到的,可以以各種不同的方式修改所描述的實施例,而不脫離本發明的精神或範圍。In order to make the above-mentioned features and advantages of the present invention more obvious and easy to understand, the following embodiments are given and described in detail with the accompanying drawings as follows. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

在附圖中,為了清楚起見,放大了各元件等的厚度。在整個說明書中,相同的附圖標記表示相同的元件。應當理解,當諸如層、膜、區域或基板的元件被稱為在“另一元件上”、或“連接到另一元件”、“重疊於另一元件”時,其可以直接在另一元件上或與另一元件連接,或者中間元件可以也存在。相反,當元件被稱為“直接在另一元件上”或 “直接連接到”另一元件時,不存在中間元件。如本文所使用的,“連接”可以指物理及/或電連接。In the drawings, the thickness of each element and the like is exaggerated for clarity. The same reference numerals refer to the same elements throughout the specification. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on," "connected to," "overlying" another element, it can be directly on the other element on or connected to another element, or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. As used herein, "connected" may refer to a physical and/or electrical connection.

應當理解,儘管術語“第一”、“第二”、“第三”等在本文中可以用於描述各種元件、部件、區域、層及/或部分,但是這些元件、部件、區域、及/或部分不應受這些術語的限制。這些術語僅用於將一個元件、部件、區域、層或部分與另一個元件、部件、區域、層或部分區分開。因此,下面討論的“第三元件”、“部件”、“區域”、“層”、或“部分”可以被稱為第二元件、部件、區域、層或部分,且相對地“第二元件”、“部件”、“區域”、“層”、或“部分”可以被稱為第三元件、部件、區域、層或部分,而不脫離本文的教導。It will be understood that, although the terms “first,” “second,” “third,” etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, and/or or parts shall not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a "third element," "component," "region," "layer," or "section" discussed below could be termed a second element, component, region, layer, or section, and "second element" , "component," "region," "layer," or "section" could be termed a third element, component, region, layer, or section without departing from the teachings herein.

這裡使用的術語僅僅是為了描述特定實施例的目的,而不是限制性的。如本文所使用的,除非內容清楚地指示,否則單數形式“一”、“一個”和“該”旨在包括複數形式,包括“至少一個”。“或”表示“及/或”。如本文所使用的,術語“及/或”包括一個或多個相關所列項目的任何和所有組合。還應當理解,當在本說明書中使用時,術語“包括”及/或“包括”指定所述特徵、區域、整體、步驟、操作、元件的存在及/或部件,但不排除一個或多個其它特徵、區域整體、步驟、操作、元件、部件及/或其組合的存在或添加。The terminology used herein is for the purpose of describing particular embodiments only and is not limiting. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms including "at least one" unless the content clearly dictates otherwise. "Or" means "and/or". As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. It will also be understood that the terms "comprising" and/or "comprising" when used in this specification designate the stated feature, region, integer, step, operation, presence of an element and/or part, but do not exclude one or more The presence or addition of other features, entireties of regions, steps, operations, elements, components, and/or combinations thereof.

此外,諸如“下”和“上”的相對術語可在本文中用於描述一個元件與另一元件的關係,如圖所示。應當理解,相對術語旨在包括除了圖中所示的方位之外的裝置的不同方位。例如,如果一個附圖中的裝置翻轉,則被描述為在其他元件的“下”側的元件將被定向在其他元件的“上”側。因此,示例性術語“下”可以包括“下”和“上”的取向,取決於附圖的特定取向。類似地,如果一個附圖中的裝置翻轉,則被描述為在其它元件“下方”或“下方”的元件將被定向為在其它元件 “上方”。因此,示例性術語“下面”或“下面”可以包括上方和下方的取向。Furthermore, relative terms such as "lower" and "upper" may be used herein to describe one element's relationship to another element, as shown in the figures. It should be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one of the figures is turned over, elements described as being on the "lower" side of other elements would then be oriented on "upper" sides of the other elements. Thus, the exemplary term "lower" may include an orientation of "lower" and "upper", depending on the particular orientation of the drawings. Similarly, if the device in one of the figures is turned over, elements described as "below" or "beneath" other elements would then be oriented "above" the other elements. Thus, the exemplary terms "below" or "under" can encompass both an orientation of above and below.

本文使用的“基本上”或其他類似用語包括所述值和在本領域普通技術人員確定的特定值的可接受的偏差範圍內的平均值,考慮到所討論的測量和與測量相關的誤差的特定數量(即,測量系統的限制)。例如,“基本上”可以表示在所述值的一個或多個標準偏差內,或±30%、±20%、±10%、±5%內。As used herein, "substantially" or other similar terms include the stated value and the average value within an acceptable deviation of the particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and the error associated with the measurement. A specific quantity (that is, the limit of the measurement system). For example, "substantially" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%.

除非另有定義,本文使用的所有術語(包括技術和科學術語)具有與本發明所屬領域的普通技術人員通常理解的相同的含義。將進一步理解的是,諸如在通常使用的字典中定義的那些術語應當被解釋為具有與它們在相關技術和本發明的上下文中的含義一致的含義,並且將不被解釋為理想化的或過度正式的意義,除非本文中明確地這樣定義。Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be construed as having meanings consistent with their meanings in the context of the related art and the present invention, and are not to be construed as idealized or excessive Formal meaning, unless expressly defined as such herein.

本文參考作為理想化實施例的示意圖的截面圖來描述示例性實施例。因此,可以預期到作為例如製造技術及/或公差的結果的圖示的形狀變化。因此,本文所述的實施例不應被解釋為限於如本文所示的區域的特定形狀,而是包括例如由製造導致的形狀偏差。例如,示出或描述為平坦的區域通常可以具有粗糙及/或非線性特徵。此外,所示的銳角可以是圓的。因此,圖中所示的區域本質上是示意性的,並且它們的形狀不是旨在示出區域的精確形狀,並且不是旨在限制權利要求的範圍。Exemplary embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments. Thus, variations in the shapes of the illustrations as a result of, for example, manufacturing techniques and/or tolerances, are to be expected. Accordingly, the embodiments described herein should not be construed as limited to the particular shapes of regions as shown herein, but rather include deviations in shapes resulting from, for example, manufacturing. For example, regions illustrated or described as flat may typically have rough and/or nonlinear features. Additionally, the acute angles shown may be rounded. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the claims.

圖1至圖4是依照本發明的一實施例的一種生物特徵感測裝置的部分剖視示意圖。圖5是依照本發明的一實施例的一種生物特徵感測裝置的部分上視示意圖。圖2可以是對應於圖1中區域R1的放大圖。圖3可以是對應於圖1中區域R2的放大圖。圖4可以是生物特徵感測裝置100中的一遮光層的部分剖視示意圖。另外,為求清楚表示,於圖1至圖5中可能省略繪示了部分的膜層或構件。舉例而言,於圖5中僅是例性地繪示了基板190、第一孔洞117對應的上視位置、光感測元件170的外輪廓的概略對應上視位置、主動元件188的外輪廓的概略對應上視位置以及預設位917對應的上視位置。1 to 4 are schematic partial cross-sectional views of a biometric sensing device according to an embodiment of the present invention. FIG. 5 is a schematic partial top view of a biometric sensing device according to an embodiment of the present invention. FIG. 2 may be an enlarged view corresponding to the region R1 in FIG. 1 . FIG. 3 may be an enlarged view corresponding to the region R2 in FIG. 1 . FIG. 4 may be a partial cross-sectional schematic diagram of a light shielding layer in the biometric sensing device 100 . In addition, for the sake of clarity, some of the film layers or components may be omitted from the drawings in FIGS. 1 to 5 . For example, FIG. 5 only schematically illustrates the substrate 190 , the top-view position corresponding to the first hole 117 , the rough corresponding top-view position of the outer contour of the light sensing element 170 , and the outer contour of the active element 188 . The outline corresponds to the upward-looking position and the upward-looking position corresponding to the preset position 917 .

生物特徵感測裝置100包括基板190、至少一光感測元件170、第一介質層151、第一遮光層110、第二介質層152以及第二遮光層120。光感測元件170設置於基板190的基板表面190a上。第一介質層151設置於基板190的基板表面190a上以及光感測元件170上。第一遮光層110設置於第一介質層151上。第二介質層152設置於第一遮光層110上。第二遮光層120設置於第二介質層152上。The biometric sensing device 100 includes a substrate 190 , at least one light sensing element 170 , a first dielectric layer 151 , a first light shielding layer 110 , a second medium layer 152 and a second light shielding layer 120 . The light sensing element 170 is disposed on the substrate surface 190 a of the substrate 190 . The first dielectric layer 151 is disposed on the substrate surface 190 a of the substrate 190 and on the light sensing element 170 . The first light shielding layer 110 is disposed on the first dielectric layer 151 . The second dielectric layer 152 is disposed on the first light shielding layer 110 . The second light shielding layer 120 is disposed on the second dielectric layer 152 .

在本實施例中,生物特徵感測裝置100可以更包括第一保護層161或第二保護層162,但本發明不限於此。第一保護層161可以夾設於第一介質層151與第一遮光層110之間。第二保護層162可以夾設於第二介質層152與第二遮光層120之間。In this embodiment, the biometric sensing device 100 may further include a first protective layer 161 or a second protective layer 162, but the present invention is not limited thereto. The first protective layer 161 may be sandwiched between the first dielectric layer 151 and the first light shielding layer 110 . The second protective layer 162 may be sandwiched between the second dielectric layer 152 and the second light shielding layer 120 .

在本實施例中,至少藉由光感測元件170可以使生物特徵感測裝置100適於感測光線L。在一實施例中,生物特徵感測裝置100可以適於感測由生物特徵(如:指紋,但不限)所反射的光線,但本發明不限於此。In this embodiment, the biometric sensing device 100 can be adapted to sense light L by at least the light sensing element 170 . In one embodiment, the biometric sensing device 100 may be adapted to sense light reflected by biometrics (eg, fingerprints, but not limited to), but the invention is not limited thereto.

在圖1中,僅示例性地繪示一個光感測元件170,但本發明不限於此。在其他未繪示的實施例中,或是,生物特徵感測裝置100在圖1未繪示的區域中,可以具有其他相同或相似於光感測元件170的光感測元件。In FIG. 1 , only one light sensing element 170 is exemplarily shown, but the present invention is not limited thereto. In other not-shown embodiments, or, the biometric sensing device 100 may have other photo-sensing elements that are the same or similar to the photo-sensing element 170 in areas not shown in FIG. 1 .

在一實施例中,光感測元件170可以是由多個堆疊的膜層(如:對應的電極層及對應的感光層)所構成,但本發明不限於此。前述的感光層例如是富矽氧化物(Silicon-rich oxide;SRO)層,但本發明不限於此。在一可能的實施例中,光感測元件170可以包括模組化的光感測元件。In one embodiment, the light sensing element 170 may be composed of a plurality of stacked film layers (eg, corresponding electrode layers and corresponding photosensitive layers), but the invention is not limited thereto. The aforementioned photosensitive layer is, for example, a silicon-rich oxide (SRO) layer, but the present invention is not limited thereto. In a possible embodiment, the light sensing element 170 may comprise a modular light sensing element.

第一遮光層110具有多個第一孔洞117。這些第一孔洞117中的至少其中之一對應於光感測元件170。The first light shielding layer 110 has a plurality of first holes 117 . At least one of the first holes 117 corresponds to the light sensing element 170 .

對應於光感測元件170的第一孔洞117具有第一孔徑W1。對應於光感測元件170的第一孔洞117具有垂直於基板190的基板表面190a的第一中心線C1。The first hole 117 corresponding to the light sensing element 170 has a first aperture W1. The first hole 117 corresponding to the light sensing element 170 has a first center line C1 perpendicular to the substrate surface 190 a of the substrate 190 .

在本實施例中,第一遮光層110具有二相反的表面,前述二相反的表面其中一者較接近光感測元件170,而前述二相反的表面其中另一者較遠離光感測元件170。舉例而言,第一遮光層110具有彼此相反的第一上表面110a及第一下表面110b。相較於第一上表面110a,第一下表面110b較接近光感測元件170。相較於第一下表面110b,第一上表面110a較遠離光感測元件170。第一上表面110a與光感測元件170之間具有第一高度D1。第一高度D1與第一孔徑W1的比值大於0且小於15。也就是說,第一高度D1(後述的關係式中以D1表示)與第一孔徑W1(後述的關係式中以W1表示)具有以下關係式:0 < D1/W1 < 15。In this embodiment, the first light shielding layer 110 has two opposite surfaces, one of the two opposite surfaces is closer to the light sensing element 170 , and the other one of the two opposite surfaces is farther away from the light sensing element 170 . . For example, the first light shielding layer 110 has a first upper surface 110a and a first lower surface 110b opposite to each other. Compared with the first upper surface 110a , the first lower surface 110b is closer to the light sensing element 170 . Compared with the first lower surface 110b, the first upper surface 110a is farther away from the light sensing element 170. There is a first height D1 between the first upper surface 110a and the light sensing element 170 . The ratio of the first height D1 to the first aperture W1 is greater than 0 and less than 15. That is, the first height D1 (represented by D1 in the relational expression described later) and the first aperture W1 (represented by W1 in the relational expression described later) have the following relational expression: 0 < D1/W1 <15.

在本實施例中,第一遮光層110可以更具有連接第一上表面110a及第一下表面110b的第一側邊110c。第一上表面110a及第一下表面110b的至少其中之一與第一側邊110c可以形成第一結點P1。In this embodiment, the first light shielding layer 110 may further have a first side 110c connecting the first upper surface 110a and the first lower surface 110b. At least one of the first upper surface 110a and the first lower surface 110b and the first side edge 110c may form a first node P1.

在本實施例中,對於第一遮光層110而言,第一結點P1可以是對應於可入射的光L的最邊緣。也就是說,對於第一遮光層110而言,第一孔洞117的第一孔徑W1可以是以限光量較多者為主要的決定範圍。In this embodiment, for the first light shielding layer 110 , the first node P1 may be the most edge corresponding to the incident light L. That is to say, for the first light shielding layer 110 , the first aperture W1 of the first hole 117 may be mainly determined in a range with a larger amount of limited light.

在本實施例中,以剖面觀之,第一孔洞117在第一上表面110a上的孔徑可以基本上相同於第一孔洞117在第一下表面110b上的孔徑。也就是說,以剖面觀之,第一孔洞117的形態可以相同或相似於矩形。於此,第一孔洞117的第一孔徑W1可以是以第一上表面110a上的孔徑或第一下表面110b上的孔徑為主。但本發明並未排除後述的其他可能。In this embodiment, in a cross-sectional view, the diameter of the first hole 117 on the first upper surface 110a may be substantially the same as the diameter of the first hole 117 on the first lower surface 110b. That is, in a cross-sectional view, the shape of the first hole 117 may be the same or similar to a rectangle. Here, the first aperture W1 of the first hole 117 may be mainly the aperture on the first upper surface 110a or the aperture on the first lower surface 110b. However, the present invention does not exclude other possibilities described later.

在一未繪示的實施例中,以剖面觀之,第一孔洞117在第一上表面110a上的孔徑可以小於第一孔洞117在第一下表面110b上的孔徑。也就是說,以剖面觀之,第一孔洞117的形態可以相同或相似於正梯形。於此,第一孔洞117的第一孔徑W1基本上是以第一上表面110a上的孔徑為主。也就是說,第一上表面110a與第一側邊110c基本上可以形成第一結點P1。In a not-shown embodiment, in a cross-sectional view, the diameter of the first hole 117 on the first upper surface 110a may be smaller than the diameter of the first hole 117 on the first lower surface 110b. That is to say, in a cross-sectional view, the shape of the first hole 117 may be the same or similar to a regular trapezoid. Here, the first aperture W1 of the first hole 117 is basically the aperture on the first upper surface 110a. That is, the first upper surface 110a and the first side edge 110c can basically form the first node P1.

在一未繪示的實施例中,以剖面觀之,第一孔洞117在第一上表面110a上的孔徑可以大於第一孔洞117在第一下表面110b上的孔徑。也就是說,以剖面觀之,第一孔洞117的形態可以相同或相似於倒梯形。對應於光感測元件170的第一孔洞117具有偏移距離S1。偏移距離S1可以是第一孔洞117垂直投影於基板190的基板表面190a上的中心(如:對應於第一中心線C1)與第一孔洞117的預設位垂直投影於基板190的基板表面190a上的中心(如:對應於第二中心線C2)之間的距離。In a not-shown embodiment, in a cross-sectional view, the diameter of the first hole 117 on the first upper surface 110a may be larger than the diameter of the first hole 117 on the first lower surface 110b. That is to say, in a cross-sectional view, the shape of the first hole 117 may be the same or similar to an inverted trapezoid. The first hole 117 corresponding to the light sensing element 170 has an offset distance S1. The offset distance S1 may be the vertical projection of the center of the first hole 117 on the substrate surface 190 a of the substrate 190 (eg, corresponding to the first center line C1 ) and the vertical projection of the preset position of the first hole 117 on the substrate surface of the substrate 190 The distance between the centers on 190a (eg, corresponding to the second center line C2).

請參考圖1至圖3,舉例而言,於區域R1內的第一孔洞117可以具有偏移距離S1,而於區域R2內的第一孔洞117可以位於其預設位。也就是說,於區域R1內,偏移的第一孔洞117的第一中心線C1與對應於其的第二孔洞127的第二中心線C2不重疊。於區域R2內,位於預設位的第一孔洞117的第一中心線C1與對應於其的第二孔洞127的第二中心線C2基本上重疊。Referring to FIG. 1 to FIG. 3 , for example, the first holes 117 in the region R1 may have an offset distance S1 , and the first holes 117 in the region R2 may be located at their preset positions. That is, within the region R1, the first center line C1 of the offset first hole 117 does not overlap with the second center line C2 of the second hole 127 corresponding thereto. In the region R2, the first center line C1 of the first hole 117 at the preset position substantially overlaps with the second center line C2 of the second hole 127 corresponding thereto.

經由具有偏移距離S1的第一孔洞117至光感測元件170的光線與第一中心線C1之間具有最大夾角α。偏移距離S1(後述的關係式中以S1表示)、第一孔徑W1(後述的關係式中以W1表示)、第一高度D1(後述的關係式中以D1表示)及最大夾角(後述的關係式中以α表示)具有下列關係式:0< S1 < (W1+2*D1*|tan(α)|)。前述的關係式也可以表示為:0< S1 < (W1+2*D1*abs(tan(α))),其中abs為絕對值函式的一種表示方式。There is a maximum included angle α between the light rays passing through the first hole 117 with the offset distance S1 to the light sensing element 170 and the first center line C1 . Offset distance S1 (represented by S1 in the relational expression described later), first aperture W1 (represented by W1 in the relational expression described later), first height D1 (represented by D1 in the relational expression described later), and maximum included angle (represented by the relational expression described later) The relational expression is represented by α) has the following relational expression: 0<S1<(W1+2*D1*|tan(α)|). The aforementioned relational expression can also be expressed as: 0< S1 < (W1+2*D1*abs(tan(α))), where abs is a representation of the absolute value function.

在本實施例中,最大夾角α可以大於0°,且小於或等於60°,但本發明不限於此。In this embodiment, the maximum included angle α may be greater than 0° and less than or equal to 60°, but the present invention is not limited thereto.

在本實施例中,生物特徵感測裝置100可以更包括第三介質層153、第四介質層154以及第三遮光層130。第三介質層153及第四介質層154設置於第一遮光層110上。第三遮光層130設置於第三介質層153及第四介質層154上。In this embodiment, the biometric sensing device 100 may further include a third dielectric layer 153 , a fourth dielectric layer 154 and a third light shielding layer 130 . The third dielectric layer 153 and the fourth dielectric layer 154 are disposed on the first light shielding layer 110 . The third light shielding layer 130 is disposed on the third dielectric layer 153 and the fourth dielectric layer 154 .

在本實施例中,第二遮光層120可以夾設於二介質層152與第三介質層153之間;且/或,第二遮光層120可以夾設於二介質層152與第四介質層154之間,但本發明不限於此。In this embodiment, the second light shielding layer 120 can be sandwiched between the two dielectric layers 152 and the third dielectric layer 153; and/or, the second light shielding layer 120 can be sandwiched between the two dielectric layers 152 and the fourth dielectric layer 154, but the present invention is not limited to this.

第三遮光層130具有多個第三孔洞137。這些第三孔洞137中的至少其中之一對應於前述對應於光感測元件170的第一孔洞117。對應於前述對應於光感測元件170的第一孔洞117的第三孔洞137具有第三孔徑W3。The third light shielding layer 130 has a plurality of third holes 137 . At least one of the third holes 137 corresponds to the aforementioned first hole 117 corresponding to the light sensing element 170 . The third hole 137 corresponding to the aforementioned first hole 117 corresponding to the light sensing element 170 has a third aperture W3.

在本實施例中,第三遮光層130具有二相反的表面,前述二相反的表面其中一者較接近光感測元件170,而前述二相反的表面其中另一者較遠離光感測元件170。舉例而言,第三遮光層130具有彼此相反的第三上表面130a及第三下表面130b。相較於第三上表面130a,第三下表面130b較接近光感測元件170。相較於第三下表面130b,第三上表面130a較遠離光感測元件170。第三上表面130a與光感測元件170之間具有第三高度D3。第三高度D3與第三孔徑W3的比值大於0且小於15。也就是說,第三高度D3(後述的關係式中以D3表示)與第三孔徑W3(後述的關係式中以W3表示)具有以下關係:0 < D3/W3 < 15。In this embodiment, the third light shielding layer 130 has two opposite surfaces, one of the two opposite surfaces is closer to the light sensing element 170 , and the other one of the two opposite surfaces is farther away from the light sensing element 170 . For example, the third light shielding layer 130 has a third upper surface 130a and a third lower surface 130b opposite to each other. Compared with the third upper surface 130a, the third lower surface 130b is closer to the light sensing element 170. Compared with the third lower surface 130b, the third upper surface 130a is farther away from the light sensing element 170. There is a third height D3 between the third upper surface 130a and the light sensing element 170 . The ratio of the third height D3 to the third aperture W3 is greater than 0 and less than 15. That is, the third height D3 (represented by D3 in the relational expression described later) and the third aperture W3 (represented by W3 in the relational expression described later) have the following relationship: 0<D3/W3<15.

在本實施例中,第三遮光層130可以更具有連接第三上表面130a及第三下表面130b的第三側邊130c。第三上表面130a及第三下表面130b的至少其中之一與第三側邊130c可以形成第三結點P3。在本實施例中,對於第三遮光層130而言,第三結點P3可以是對應於可入射的光束的最邊緣。也就是說,對於第三遮光層130而言,第三孔洞137的第三孔徑W3可以是以限光量較多者為主要的決定範圍。In this embodiment, the third light shielding layer 130 may further have a third side edge 130c connecting the third upper surface 130a and the third lower surface 130b. At least one of the third upper surface 130a and the third lower surface 130b and the third side edge 130c may form a third node P3. In this embodiment, for the third light shielding layer 130, the third node P3 may be the edge corresponding to the incident light beam. That is to say, for the third light shielding layer 130 , the third aperture W3 of the third hole 137 may be mainly determined by the one with more light-limiting amount.

在本實施例中,以剖面觀之,第三孔洞137在第三上表面130a上的孔徑可以小於第三孔洞137在第三下表面130b上的孔徑。也就是說,以剖面觀之,第三孔洞137的形態可以相同或相似於正梯形。於此,第三孔洞137的第三孔徑W3基本上是以第三上表面130a上的孔徑為主。也就是說,第三上表面130a與第三側邊130c基本上可以形成第三結點P3。但本發明並未排除後述的其他可能。In this embodiment, in a cross-sectional view, the diameter of the third hole 137 on the third upper surface 130a may be smaller than the diameter of the third hole 137 on the third lower surface 130b. That is to say, in a cross-sectional view, the shape of the third hole 137 may be the same or similar to a regular trapezoid. Here, the third aperture W3 of the third hole 137 is basically the aperture on the third upper surface 130a. That is, the third upper surface 130a and the third side edge 130c can basically form the third node P3. However, the present invention does not exclude other possibilities described later.

在一未繪示的實施例中,以剖面觀之,第三孔洞137在第三上表面130a上的孔徑可以大於第三孔洞137在第三下表面130b上的孔徑。也就是說,以剖面觀之,第三孔洞137的形態可以相同或相似於倒梯形。於此,第三孔洞137的第三孔徑W3基本上是以第三下表面130b上的孔徑為主。In a not-shown embodiment, in a cross-sectional view, the diameter of the third hole 137 on the third upper surface 130a may be larger than the diameter of the third hole 137 on the third lower surface 130b. That is to say, in a cross-sectional view, the shape of the third hole 137 may be the same or similar to an inverted trapezoid. Here, the third aperture W3 of the third hole 137 is basically the aperture on the third lower surface 130b.

在一未繪示的實施例中,以剖面觀之,第三孔洞137在第三上表面130a上的孔徑可以基本上相同於第三孔洞137在第三下表面130b上的孔徑。也就是說,以剖面觀之,第三孔洞137的形態可以相同或相似於矩形。於此,第三孔洞137的第三孔徑W3可以是以第三上表面130a上的孔徑或第三下表面130b上的孔徑為主。In a not-shown embodiment, in a cross-sectional view, the diameter of the third hole 137 on the third upper surface 130a may be substantially the same as the diameter of the third hole 137 on the third lower surface 130b. That is, in a cross-sectional view, the shape of the third hole 137 may be the same or similar to a rectangle. Here, the third aperture W3 of the third hole 137 may be mainly the aperture on the third upper surface 130a or the aperture on the third lower surface 130b.

在本實施例中,第一遮光層110、第二遮光層120及第三遮光層130中的至少其中之一包括低反射層810及遮光導電層820。低反射層810的反射率基本上可以小於10%,或進一步地小於或等於5%。低反射層810可以包括金屬氧化物、或金屬氮氧化物、或上述材料之堆疊、或導電材質與上述之堆疊。前述的導電材質較佳包括銅(Cu)、鋁(Al)、鉬(Mo)、鈦(Ti)、銀(Ag)、鈮(Nb),會其他適宜的金屬元素、包含上述元素之合金或共金化合物(如:鉬鉭(MoTa)、鉬鈮(MoNb),或鉬鈦(MoTi))。其中,遮光導電層820可以為前述的導電材質之單層或堆疊之結構。前述的低反射層810可以包括前述之金屬氧化物或金屬氮氧化物(如:鉬氧化物(MoOx )、鉬鉭氧化物(MoTaOx )、鉬鈮氧化物(MoNbOx )、鉬氮氧化物(MoOx Ny )、鉬鉭氮氧化物(MoTaOx Ny )、鉬鈮氮氧化物(MoNbOx Ny ))或上述之組合或堆疊,但本發明不限於此。另外,前述的化學式中的x或y可以是一般化學式中用於表示數值的方式,且並未限定x或y為自然數或相同或固定的數值。另外,在前述合金或共金化合物中,並未限定各金屬元素的比例。In this embodiment, at least one of the first light shielding layer 110 , the second light shielding layer 120 and the third light shielding layer 130 includes a low reflection layer 810 and a light shielding conductive layer 820 . The reflectivity of the low reflection layer 810 may be substantially less than 10%, or further less than or equal to 5%. The low reflection layer 810 may include metal oxide, metal oxynitride, or a stack of the above materials, or a stack of conductive materials and the above. The aforementioned conductive materials preferably include copper (Cu), aluminum (Al), molybdenum (Mo), titanium (Ti), silver (Ag), niobium (Nb), other suitable metal elements, alloys containing the above-mentioned elements or Co-metal compounds (eg: molybdenum tantalum (MoTa), molybdenum niobium (MoNb), or molybdenum titanium (MoTi)). The light-shielding conductive layer 820 may be a single-layer or stacked structure of the aforementioned conductive materials. The aforementioned low reflection layer 810 may include the aforementioned metal oxides or metal oxynitrides (eg, molybdenum oxide (MoO x ), molybdenum tantalum oxide (MoTaO x ), molybdenum niobium oxide (MoNbO x ), molybdenum oxynitride (MoO x N y ), molybdenum tantalum oxynitride (MoTaO x N y ), molybdenum niobium oxynitride (MoNbO x N y )) or a combination or stack of the above, but the present invention is not limited thereto. In addition, x or y in the aforementioned chemical formulas may be the manners used to represent numerical values in general chemical formulas, and x or y is not limited to be a natural number or the same or fixed numerical value. In addition, in the aforementioned alloy or co-metal compound, the ratio of each metal element is not limited.

在本實施例中,生物特徵感測裝置100更包括多個透鏡187。這些透鏡187設置於基板190上。這些透鏡187中的至少其中之一對應於多個第三孔洞137中的至少其中之一。In this embodiment, the biometric sensing device 100 further includes a plurality of lenses 187 . These lenses 187 are provided on the substrate 190 . At least one of the lenses 187 corresponds to at least one of the plurality of third holes 137 .

在本實施例中,可以是一個透鏡187對應於一個第一孔洞117、一個第二孔洞127及/或一個第三孔洞137,但本發明不限於此。在一未繪示的實施例中,可以是一個透鏡(如:類似於透鏡187的透鏡)對應於多個第一孔洞117、多個第二孔洞127及/或多個第三孔洞137。In this embodiment, one lens 187 may correspond to one first hole 117 , one second hole 127 and/or one third hole 137 , but the invention is not limited thereto. In a not-shown embodiment, a lens (eg, a lens similar to the lens 187 ) may correspond to the plurality of first holes 117 , the plurality of second holes 127 and/or the plurality of third holes 137 .

在本實施例中,透鏡187的中心線(如:對應透鏡187最厚處的線)可以對應於一孔洞的中心線(如:一個第一孔洞117的中心線C1及/或一個第二孔洞127的中心線C2)。In this embodiment, the center line of the lens 187 (eg, the line corresponding to the thickest part of the lens 187 ) may correspond to the center line of a hole (eg, the center line C1 of a first hole 117 and/or a second hole) 127 centerline C2).

在本實施例中,相鄰之二個第三孔洞137的中心之間具有一間距S2,嵌於第三孔洞137且相鄰之二個透鏡187之間具有一間隔G,其中間距S2(後述的關係式中以S2表示)、間隔G(後述的關係式中以G表示)與第三孔徑W3(後述的關係式中以W3表示),具有下列關係式:(S2-W3)≦G。In this embodiment, there is a distance S2 between the centers of the two adjacent third holes 137, and there is a gap G between the two adjacent lenses 187 embedded in the third holes 137, wherein the distance S2 (described later) The relational expression of , represented by S2), the interval G (represented by G in the relational expression described later) and the third aperture W3 (represented by W3 in the relational expression described later), have the following relational expression: (S2-W3)≦G.

在本實施例中,可以是多個透鏡187對應於一個光感測元件170,但本發明不限於此。在一未繪示的實施例中,可以是一個透鏡(如:類似於透鏡187的透鏡)對應於一個光感測元件170。In this embodiment, a plurality of lenses 187 may correspond to one light sensing element 170, but the present invention is not limited thereto. In a not-shown embodiment, one lens (eg, a lens similar to the lens 187 ) may correspond to one light sensing element 170 .

在本實施例中,對應於第三孔洞137的透鏡設置於第三遮光層130的多個第二孔洞137中的至少其中之一上,且透鏡187的上表面187a與第三遮光層130的接近處與第三遮光層130的第三上表面130a之間具有接觸角θ。接觸角θ大於或等於30°且小於或等於75°。In this embodiment, the lens corresponding to the third hole 137 is disposed on at least one of the plurality of second holes 137 in the third light shielding layer 130 , and the upper surface 187 a of the lens 187 and the third light shielding layer 130 There is a contact angle θ between the proximity and the third upper surface 130 a of the third light shielding layer 130 . The contact angle θ is greater than or equal to 30° and less than or equal to 75°.

在本實施例中,生物特徵感測裝置100更包括紅外線濾除層(IR-cut layer)140。在一實施例中,紅外線濾除層140可以是單一的膜層也可是多個膜層的堆疊。紅外線濾除層140設置於光感測元件170及基板190上。In this embodiment, the biometric sensing device 100 further includes an IR-cut layer 140 . In one embodiment, the infrared filter layer 140 may be a single film layer or a stack of multiple film layers. The infrared filter layer 140 is disposed on the light sensing element 170 and the substrate 190 .

在本實施例中,生物特徵感測裝置100可以更包括第三保護層163或第四保護層163,但本發明不限於此。第三保護層163可以夾設於第三介質層153與紅外線濾除層140之間。第四保護層164可以夾設於第三遮光層130與第四介質層154之間。In this embodiment, the biometric sensing device 100 may further include a third protective layer 163 or a fourth protective layer 163, but the present invention is not limited thereto. The third protective layer 163 may be sandwiched between the third dielectric layer 153 and the infrared filter layer 140 . The fourth protective layer 164 may be sandwiched between the third light shielding layer 130 and the fourth dielectric layer 154 .

請參照圖5,在本實施例中,基板190上具有至少一單元SU。單元SU可以包括光感測元件170。當這些第一孔洞117至少一者從一預設位917移動或偏移至一另一位時,移動或偏移的第一孔洞117可以位於單元SU的邊緣。Referring to FIG. 5 , in this embodiment, the substrate 190 has at least one unit SU. The unit SU may include a light sensing element 170 . When at least one of the first holes 117 is moved or shifted from a preset position 917 to another position, the shifted or shifted first holes 117 may be located at the edge of the unit SU.

另外,在圖5(或;對應於圖1)中,第一孔洞117的移動方向或偏移方向僅是示例性地繪示,於本發明並不加以限制。In addition, in FIG. 5 (or; corresponding to FIG. 1 ), the moving direction or the offset direction of the first hole 117 is only shown by way of example, and is not limited to the present invention.

另外,本發明並不限定一單元SU中對應的光感測元件170數量及/或對應的透鏡187數量。在一實施例中,若一單元SU中具有多個光感測元件170,則前述的多個光感測元件170中的其中兩個可以串聯,或者是並聯。另外,光感測元件170的配置方式也可以依據感測需求而加以調整。舉例而言,光感測元件170可以區分為不同的區域。In addition, the present invention does not limit the corresponding number of light sensing elements 170 and/or the corresponding number of lenses 187 in a unit SU. In one embodiment, if a unit SU has multiple light sensing elements 170 , two of the aforementioned multiple light sensing elements 170 may be connected in series or in parallel. In addition, the configuration of the light sensing element 170 can also be adjusted according to the sensing requirements. For example, the light sensing element 170 can be divided into different regions.

在一實施例中,較遠離單元SU的邊緣的第一孔洞117的移動量或偏移量可能較小;或,可以不會移動或偏移。In one embodiment, the first hole 117 that is farther from the edge of the unit SU may have less movement or offset; or, may not move or offset.

在一實施例中,前述的單元SU可以稱為感測單元(sensor unit)。舉例而言,前述的單元SU可以包括對應的光感測元件170、對應於光感測元件170的孔洞(如:第一遮光層110中的至少一個第一孔洞117)及/或電性連接於光感測元件170的主動元件188。In one embodiment, the aforementioned unit SU may be referred to as a sensor unit. For example, the aforementioned unit SU may include a corresponding light sensing element 170 , a hole corresponding to the light sensing element 170 (eg, at least one first hole 117 in the first light shielding layer 110 ) and/or electrical connections The active element 188 of the light sensing element 170 .

在本實施例中,前述移動或偏移的第一孔洞117具有偏移距離S1。In this embodiment, the first hole 117 that is moved or shifted has an offset distance S1.

在一實施例中,當前述的第一孔洞117從一預設位917移動或偏移至另一位時,偏移距離S1可以是預設位917之中心線垂直投影於基板190上之處與移動或偏移的第一孔洞117的第一中心線C1垂直投影於基板190上之處之間的距離。In one embodiment, when the aforementioned first hole 117 moves or shifts from a preset position 917 to another position, the offset distance S1 may be the vertical projection of the center line of the preset position 917 on the substrate 190 The distance from where the first center line C1 of the moved or offset first hole 117 is perpendicularly projected on the substrate 190 .

在一實施例中,當前述的第一孔洞117從一預設位917移動或偏移至另一位時,偏移距離S1可以是移動或偏移的第一孔洞117的垂直於基板190的基板表面190a的第一中心線C1於基板表面190a上的投影與對應於前述的第一孔洞117的第二孔洞127的垂直於基板190的基板表面190a的第二中心線C2於基板表面190a上的投影之間的距離。也就是說,第一中心線C1與第二中心線C2可以不重合。In one embodiment, when the aforementioned first hole 117 moves or shifts from one preset position 917 to another, the shift distance S1 may be the distance of the first hole 117 that is moved or shifted perpendicular to the substrate 190 . The projection of the first centerline C1 of the substrate surface 190a on the substrate surface 190a and the second centerline C2 of the second hole 127 corresponding to the aforementioned first hole 117 perpendicular to the substrate surface 190a of the substrate 190 on the substrate surface 190a the distance between the projections. That is, the first center line C1 and the second center line C2 may not overlap.

綜上所述,在本發明的生物特徵感測裝置中,其遮光層的高度、遮光層的孔洞的孔徑、遮光層的孔洞的孔徑的偏移距離以及對應的夾角之間至少具有上述的關係(以上述的關係式表示)。如此一來,可以使生物特徵感測裝置具有良好的光學及/或對應的辨識性能。To sum up, in the biometric sensing device of the present invention, the height of the light-shielding layer, the aperture of the hole in the light-shielding layer, the offset distance of the aperture of the hole in the light-shielding layer, and the corresponding angle have at least the above relationship. (represented by the above relationship). In this way, the biometric sensing device can have good optical and/or corresponding identification performance.

100:生物特徵感測裝置 190:基板 190a:基板表面 170:光感測元件 151:第一介質層 110:第一遮光層 117:第一孔洞 C1:第一中心線 W1:第一孔徑 110a:第一上表面 110b:第一下表面 110c:第一側邊 152:第二介質層 120:第二遮光層 127:第二孔洞 C2:第二中心線 W2:第二孔徑 120a:第二上表面 120b:第二下表面 120c:第二側邊 130:第三遮光層 137:第三孔洞 W3:第三孔徑 130a:第三上表面 130b:第三下表面 140:紅外線濾除層 153:第三介質層 154:第四介質層 161:第一保護層 162:第二保護層 163:第三保護層 164:第四保護層 187:透鏡 188:主動元件 810:遮光導電層 820:低反射層 917:預設位 α:最大夾角 θ:接觸角 D1:第一高度 D2:第二高度 D3:第三高度 G:間隔 L:光線 P1:第一結點 P2:第二結點 P3:第二結點 R1、R2:區域 S1:偏移距離 S2:間距 SU:單元100: Biometric Sensing Device 190: Substrate 190a: Substrate Surface 170: Light sensing element 151: first dielectric layer 110: The first shading layer 117: The first hole C1: First centerline W1: first aperture 110a: first upper surface 110b: First lower surface 110c: First side 152: Second dielectric layer 120: Second shading layer 127: The second hole C2: Second centerline W2: Second aperture 120a: Second upper surface 120b: Second lower surface 120c: Second side 130: The third shading layer 137: The third hole W3: Third aperture 130a: Third upper surface 130b: Third lower surface 140: Infrared filter layer 153: The third dielectric layer 154: Fourth dielectric layer 161: The first protective layer 162: Second protective layer 163: The third protective layer 164: Fourth protective layer 187: Lens 188: Active Components 810: light-shielding conductive layer 820: low reflection layer 917: Preset α: Maximum included angle θ: contact angle D1: first height D2: The second height D3: The third height G: Interval L: light P1: the first node P2: The second node P3: The second node R1, R2: area S1: offset distance S2: Spacing SU: unit

圖1是依照本發明的一實施例的一種生物特徵感測裝置的部分剖視示意圖。 圖2是依照本發明的一實施例的一種生物特徵感測裝置的部分剖視示意圖。 圖3是依照本發明的一實施例的一種生物特徵感測裝置的部分剖視示意圖。 圖4是依照本發明的一實施例的一種生物特徵感測裝置的部分剖視示意圖。 圖5是依照本發明的一實施例的一種生物特徵感測裝置的部分上視示意圖。FIG. 1 is a partial cross-sectional schematic diagram of a biometric sensing device according to an embodiment of the present invention. FIG. 2 is a schematic partial cross-sectional view of a biometric sensing device according to an embodiment of the present invention. 3 is a partial cross-sectional schematic diagram of a biometric sensing device according to an embodiment of the present invention. 4 is a partial cross-sectional schematic diagram of a biometric sensing device according to an embodiment of the present invention. FIG. 5 is a schematic partial top view of a biometric sensing device according to an embodiment of the present invention.

100:生物特徵感測裝置100: Biometric Sensing Device

190:基板190: Substrate

190a:基板表面190a: Substrate Surface

170:光感測元件170: Light sensing element

151:第一介質層151: first dielectric layer

161:第一保護層161: The first protective layer

110:第一遮光層110: The first shading layer

110a:第一上表面110a: first upper surface

110b:第一下表面110b: First lower surface

117:第一孔洞117: The first hole

C1:第一中心線C1: First centerline

152:第二介質層152: Second dielectric layer

162:第二保護層162: Second protective layer

120:第二遮光層120: Second shading layer

120a:第二上表面120a: Second upper surface

120b:第二下表面120b: Second lower surface

127:第二孔洞127: The second hole

C2:第二中心線C2: Second centerline

153:第三介質層153: The third dielectric layer

163:第三保護層163: The third protective layer

140:紅外線濾除層140: Infrared filter layer

154:第四介質層154: Fourth dielectric layer

164:第四保護層164: Fourth protective layer

130:第三遮光層130: The third shading layer

130a:第三上表面130a: Third upper surface

130b:第三下表面130b: Third lower surface

137:第三孔洞137: The third hole

187:透鏡187: Lens

G:間隔G: Interval

R1、R2:區域R1, R2: area

S1:偏移距離S1: offset distance

S2:間距S2: Spacing

Claims (12)

一種生物特徵感測裝置,適於感測一光線,該生物特徵感測裝置包括:至少一光感測元件,設置於一基板上;一第一介質層,設置於該基板及該至少一光感測元件上;一第一遮光層,設置於該第一介質層上,該第一遮光層包含多個第一孔洞,其中該些第一孔洞至少一者對應於該至少一光感測元件,且該些第一孔洞至少一者具有一垂直於該基板之第一中心線,其中該第一遮光層具有二相反的表面,該二相反的表面其中一者較接近該至少一光感測元件,較遠離該至少一光感測元件的該第一遮光層之該二相反的表面另一者與該至少一光感測元件之間具有一第一高度,該些第一孔洞至少一者具有一第一孔徑,且該第一高度對該第一孔徑的比值大於0且小於15;一第二介質層,設置於該第一遮光層上;以及一第二遮光層,設置於該第二介質層上,該第二遮光層包含多個第二孔洞,其中該些第二孔洞至少一者對應於該些第一孔洞至少一者,其中該些第二孔洞至少一者對應於該至少一光感測元件,其中該第二遮光層具有二相反的表面,該二相反的表面 其中一者較接近該至少一光感測元件,較遠離該至少一光感測元件的該第二遮光層之該二相反的表面另一者與該至少一光感測元件之間具有一第二高度,該些第二孔洞至少一者具有一第二孔徑,且該第二高度對該第二孔徑的比值大於0且小於15;其中該些第一孔洞至少一者具有一偏移距離,經由該些第一孔洞至少一者至該至少一光感測元件的該光線與該第一中心線之間具有一最大夾角,該偏移距離為S1,該第一孔徑為W1,該第一高度為D1,該最大夾角為α,且該偏移距離、該第一孔徑、該第一高度及該最大夾角具有下列關係:0<S1<[W1+(2*(D1*|tan(α)|))]。 A biometric sensing device suitable for sensing a light, the biometric sensing device comprising: at least one light sensing element disposed on a substrate; a first dielectric layer disposed on the substrate and the at least one light on the sensing element; a first light shielding layer disposed on the first dielectric layer, the first light shielding layer including a plurality of first holes, wherein at least one of the first holes corresponds to the at least one light sensing element , and at least one of the first holes has a first center line perpendicular to the substrate, wherein the first light shielding layer has two opposite surfaces, one of the two opposite surfaces is closer to the at least one light sensor an element, the other one of the two opposite surfaces of the first light shielding layer farther from the at least one light sensing element and the at least one light sensing element has a first height, and at least one of the first holes has a first aperture, and the ratio of the first height to the first aperture is greater than 0 and less than 15; a second medium layer is arranged on the first light shielding layer; and a second light shielding layer is arranged on the first light shielding layer On the two dielectric layers, the second light shielding layer includes a plurality of second holes, wherein at least one of the second holes corresponds to at least one of the first holes, wherein at least one of the second holes corresponds to the at least one of the first holes A light sensing element, wherein the second light shielding layer has two opposite surfaces, the two opposite surfaces One of them is closer to the at least one light sensing element, and the other one of the two opposite surfaces of the second light shielding layer that is farther from the at least one light sensing element has a first space between the at least one light sensing element and the at least one light sensing element. Two heights, at least one of the second holes has a second hole diameter, and the ratio of the second height to the second hole diameter is greater than 0 and less than 15; wherein at least one of the first holes has an offset distance, There is a maximum angle between the light passing through at least one of the first holes to the at least one light sensing element and the first center line, the offset distance is S1, the first aperture is W1, the first The height is D1, the maximum angle is α, and the offset distance, the first aperture, the first height and the maximum angle have the following relationship: 0<S1<[W1+(2*(D1*|tan(α) |))]. 一種生物特徵感測裝置,包括:至少一光感測元件,設置於一基板上;一第一介質層,設置於該基板及該至少一光感測元件上;一第一遮光層,設置於該第一介質層上,該第一遮光層包含多個第一孔洞,其中該些第一孔洞至少一者對應於該至少一光感測元件,該些第一孔洞至少一者具有一垂直於該基板之第一中心線,該第一遮光層具有二相反的表面及一第一側邊,該第一側邊連接該二相反的表面,該第一側邊連接該二相反的表面其中一者形成一第一結點,其中該第一遮光層之該二相反的表面其中一者較接近該至少一光感測元件,較遠離該至少一光感測元件的該第一遮光層 之該二相反的表面另一者與該至少一光感測元件之間具有一第一高度,該些第一孔洞至少一者具有一第一孔徑,且該第一高度對該第一孔徑的比值大於0且小於15;一第二介質層,設置於該第一遮光層上;以及一第二遮光層,設置於該第二介質層上,該第二遮光層包含多個第二孔洞,其中該些第二孔洞至少一者對應於該些第一孔洞至少一者,且該第二遮光層具有二相反的表面及一第二側邊,該第二側邊連接該二相反的表面,該第二側邊連接該二相反的表面其中一者形成一第二結點,其中該第二遮光層之該二相反的表面其中一者較接近該至少一光感測元件,較遠離該至少一光感測元件的該第二遮光層之該二相反的表面另一者與該至少一光感測元件之間具有一第二高度,該些第二孔洞至少一者具有一第二孔徑,且該第二高度對該第二孔徑的比值大於0且小於15,其中該些第一孔洞至少一者具有一偏移距離,該第一結點與該第二結點之連線與該第一中心線之間具有一最大夾角,該偏移距離為S1,該第一孔徑為W1,該第一高度為D1,該最大夾角為α,且該偏移距離、該第一孔徑、該第一高度及該最大夾角α具有下列關係:0<S1<[W1+(2*(D1*|tan(α)|))]。 A biometric sensing device, comprising: at least one light sensing element disposed on a substrate; a first dielectric layer disposed on the substrate and the at least one light sensing element; a first light shielding layer disposed on On the first dielectric layer, the first light shielding layer includes a plurality of first holes, wherein at least one of the first holes corresponds to the at least one light sensing element, and at least one of the first holes has a perpendicular The first center line of the substrate, the first light shielding layer has two opposite surfaces and a first side, the first side is connected to the two opposite surfaces, the first side is connected to one of the two opposite surfaces one of the two opposite surfaces of the first light-shielding layer is closer to the at least one light-sensing element and farther away from the first light-shielding layer of the at least one light-sensing element There is a first height between the other one of the two opposite surfaces and the at least one light sensing element, at least one of the first holes has a first aperture, and the first height is the difference between the first aperture and the first aperture. The ratio is greater than 0 and less than 15; a second medium layer is disposed on the first light-shielding layer; and a second light-shielding layer is disposed on the second medium layer, and the second light-shielding layer includes a plurality of second holes, wherein at least one of the second holes corresponds to at least one of the first holes, and the second light shielding layer has two opposite surfaces and a second side, the second side is connected to the two opposite surfaces, The second side connects one of the two opposite surfaces to form a second node, wherein one of the two opposite surfaces of the second light shielding layer is closer to the at least one light sensing element and farther away from the at least one light sensing element There is a second height between the other one of the two opposite surfaces of the second light shielding layer of a light sensing element and the at least one light sensing element, and at least one of the second holes has a second aperture, And the ratio of the second height to the second aperture is greater than 0 and less than 15, wherein at least one of the first holes has an offset distance, and the connection line between the first node and the second node and the first There is a maximum included angle between a center line, the offset distance is S1, the first aperture is W1, the first height is D1, the maximum included angle is α, and the offset distance, the first aperture, the first aperture A height and the maximum included angle α have the following relationship: 0<S1<[W1+(2*(D1*|tan(α)|))]. 如請求項1或2所述的生物特徵感測裝置,其中該最大夾角α大於0°且小於或等於60°。 The biometric sensing device according to claim 1 or 2, wherein the maximum included angle α is greater than 0° and less than or equal to 60°. 如請求項1或2所述的生物特徵感測裝置,其中相鄰之二個該些第二孔洞的中心之間具有一間距,相鄰之二個該些第二孔洞之間具有一間隔,其中該間距為S2、該間隔為G、該第二孔徑為W2,且該間距、該間隔及該第二孔徑具有下列關係:(S2-W2)≦G。 The biometric sensing device according to claim 1 or 2, wherein there is a distance between the centers of two adjacent second holes, and a distance is formed between two adjacent second holes, The spacing is S2, the spacing is G, the second aperture is W2, and the spacing, the spacing and the second aperture have the following relationship: (S2-W2)≦G. 如請求項1或2所述的生物特徵感測裝置,更包括:多個透鏡,設置於該基板上,且該些透鏡至少一者對應於該些第二孔洞至少一者。 The biometric sensing device according to claim 1 or 2, further comprising: a plurality of lenses disposed on the substrate, and at least one of the lenses corresponds to at least one of the second holes. 如請求項5所述的生物特徵感測裝置,其中該些透鏡至少一者設置於該第二遮光層之該些第二孔洞至少一者上,且該些透鏡至少一者的上表面與較遠離該至少一光感測元件的該第二遮光層之該二相反的表面另一者夾設有一接觸角,且所述接觸角大於或等於30°且小於或等於75°。 The biometric sensing device according to claim 5, wherein at least one of the lenses is disposed on at least one of the second holes of the second light shielding layer, and the upper surface of the at least one of the lenses is different from the upper surface of the lens. The other one of the two opposite surfaces of the second light shielding layer away from the at least one light sensing element is sandwiched with a contact angle, and the contact angle is greater than or equal to 30° and less than or equal to 75°. 如請求項1或2所述的生物特徵感測裝置,更包括:一紅外線濾除層,設置於該至少一光感測元件及該基板上。 The biometric sensing device according to claim 1 or 2, further comprising: an infrared filter layer disposed on the at least one light sensing element and the substrate. 如請求項1或2所述的生物特徵感測裝置,更包括:一第三介質層,設置於該第一遮光層上;一第三遮光層,設置於該第三介質層上,且該第三遮光層夾設於該二介質層與該第三介質層之間,該第三遮光層包含多個第三孔洞, 其中該些第三孔洞至少一者對應於該些第一孔洞至少一者,該第三遮光層具有二相反之表面,該二相反的表面其中一者較接近該至少一光感測元件,較遠離該至少一光感測元件的該第三遮光層之該二相反的表面另一者與該至少一光感測元件之間具有一第三高度,該些第三孔洞至少一者具有一第三孔徑,且該第三高度對該第三孔徑的比值大於0且小於15。 The biometric sensing device according to claim 1 or 2, further comprising: a third medium layer disposed on the first light shielding layer; a third light shielding layer disposed on the third medium layer, and the The third light shielding layer is sandwiched between the two dielectric layers and the third medium layer, and the third light shielding layer includes a plurality of third holes, Wherein at least one of the third holes corresponds to at least one of the first holes, the third light shielding layer has two opposite surfaces, one of the two opposite surfaces is closer to the at least one light sensing element, There is a third height between the other of the two opposite surfaces of the third light shielding layer away from the at least one light sensing element and the at least one light sensing element, and at least one of the third holes has a first Three apertures, and the ratio of the third height to the third aperture is greater than 0 and less than 15. 如請求項8所述的生物特徵感測裝置,其中該第一遮光層、該第二遮光層及該第三遮光層中其中至少一者包括:一遮光導電層及一低反射層,且該低反射層包含導電材質之氧化物、導電材質之氮氧化物或前述之組合。 The biometric sensing device according to claim 8, wherein at least one of the first light shielding layer, the second light shielding layer and the third light shielding layer comprises: a light shielding conductive layer and a low reflection layer, and the The low-reflection layer includes oxide of conductive material, oxynitride of conductive material, or a combination thereof. 如請求項1或2所述的生物特徵感測裝置,其中該基板上具有至少一單元,當該些第一孔洞至少一者從一預設位移動至一另一位時,該些第一孔洞至少一者係位於該至少一單元的邊緣,且該單元包含該至少一光感測元件。 The biometric sensing device according to claim 1 or 2, wherein the substrate has at least one unit, and when at least one of the first holes moves from a preset position to another position, the first holes At least one of the holes is located at the edge of the at least one unit, and the unit includes the at least one light sensing element. 如請求項1或2所述的生物特徵感測裝置,其中該些第一孔洞至少一者具有該偏移距離,該偏移距離係為當該些第一孔洞至少一者從一預設位移動至一另一位時,其垂直投影於該基板上的該預設位之該第一中心線與該另一位之該第一中心線之間具有之距離。 The biometric sensing device of claim 1 or 2, wherein at least one of the first holes has the offset distance, and the offset distance is when at least one of the first holes is positioned from a preset When moving to another position, there is a distance between the first center line of the preset position projected vertically on the substrate and the first center line of the other position. 如請求項1或2所述的生物特徵感測裝置,其中該些第二孔洞至少一者具有一垂直於該基板之第二中心線,其中該些第一孔洞至少一者具有該偏移距離,該偏移距離係為當該些 第一孔洞至少一者偏移時,垂直投影於該基板上的該第一中心線與該些第二孔洞至少一者之一第二中心線之間之距離,且該第一中心線與該第二中心線不重合。 The biometric sensing device of claim 1 or 2, wherein at least one of the second holes has a second centerline perpendicular to the substrate, and at least one of the first holes has the offset distance , the offset distance is when these When at least one of the first holes is offset, the distance between the first centerline perpendicularly projected on the substrate and a second centerline of at least one of the second holes, and the first centerline and the The second centerlines do not coincide.
TW110100965A 2020-07-31 2021-01-11 Biometric sensing apparatus TWI764499B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110761241.8A CN113822131B (en) 2020-07-31 2021-07-06 Biological feature sensing device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202063059268P 2020-07-31 2020-07-31
US63/059,268 2020-07-31

Publications (2)

Publication Number Publication Date
TW202207004A TW202207004A (en) 2022-02-16
TWI764499B true TWI764499B (en) 2022-05-11

Family

ID=80680978

Family Applications (5)

Application Number Title Priority Date Filing Date
TW109143495A TWI748791B (en) 2020-07-31 2020-12-09 Photo sensor and manufacturing method thereof
TW109147226A TWI754512B (en) 2020-07-31 2020-12-31 Biometric identification device
TW110100965A TWI764499B (en) 2020-07-31 2021-01-11 Biometric sensing apparatus
TW110102293A TWI748851B (en) 2020-07-31 2021-01-21 Biometrics sensing device
TW110106985A TWI757107B (en) 2020-07-31 2021-02-26 Biometric identification device

Family Applications Before (2)

Application Number Title Priority Date Filing Date
TW109143495A TWI748791B (en) 2020-07-31 2020-12-09 Photo sensor and manufacturing method thereof
TW109147226A TWI754512B (en) 2020-07-31 2020-12-31 Biometric identification device

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW110102293A TWI748851B (en) 2020-07-31 2021-01-21 Biometrics sensing device
TW110106985A TWI757107B (en) 2020-07-31 2021-02-26 Biometric identification device

Country Status (1)

Country Link
TW (5) TWI748791B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI791397B (en) * 2022-04-07 2023-02-01 友達光電股份有限公司 Sensing device
TWI828390B (en) * 2022-10-26 2024-01-01 友達光電股份有限公司 Light sensor

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI652626B (en) * 2017-08-11 2019-03-01 財團法人工業技術研究院 Biometric device
US20200074138A1 (en) * 2018-08-31 2020-03-05 Boe Technology Group Co., Ltd. Display device, method for operating display device and electronic device
TWM598530U (en) * 2019-10-03 2020-07-11 神盾股份有限公司 Optical sensor and optical sensing system having the same
US20200234026A1 (en) * 2019-01-22 2020-07-23 Shenzhen GOODIX Technology Co., Ltd. Fingerprint identification apparatus and electronic device

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6794725B2 (en) * 1999-12-21 2004-09-21 Xerox Corporation Amorphous silicon sensor with micro-spring interconnects for achieving high uniformity in integrated light-emitting sources
US20030020078A1 (en) * 2001-07-25 2003-01-30 Motorola, Inc. Structure and method for fabricating semiconductor structures and devices with optical processing layers utilizing the formation of a compliant substrate for materials used to form the same
US8507840B2 (en) * 2010-12-21 2013-08-13 Zena Technologies, Inc. Vertically structured passive pixel arrays and methods for fabricating the same
EP2287639A3 (en) * 2009-08-17 2012-05-30 Sony Corporation Lens array imaging optics for a line sensor module
JP2014089432A (en) * 2012-03-01 2014-05-15 Sony Corp Solid-state imaging device, microlens forming method of solid-state imaging device and electronic apparatus
KR102150011B1 (en) * 2013-06-10 2020-09-01 삼성디스플레이 주식회사 Organic light emitting display device and method of manufacturing having the same
US9513411B2 (en) * 2014-07-31 2016-12-06 Visera Technologies Company Limited Double-lens structures and fabrication methods thereof
KR102440302B1 (en) * 2015-04-13 2022-09-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 Semiconductor device and method for manufacturing the same
TWI741988B (en) * 2015-07-31 2021-10-11 日商新力股份有限公司 Stacked lens structure, method of manufacturing the same, and electronic apparatus
WO2017024121A1 (en) * 2015-08-04 2017-02-09 Artilux Corporation Germanium-silicon light sensing apparatus
CN107004126A (en) * 2015-11-02 2017-08-01 深圳市汇顶科技股份有限公司 Multifunctional fingerprint sensor with anti-fingerprint spoof optical sensing
KR102630207B1 (en) * 2016-04-13 2024-01-26 택토텍 오와이 Multilayer structure with embedded multilayer electronics
US10332929B2 (en) * 2016-09-07 2019-06-25 Mei-Yen Lee Integrated sensing module and integrated sensing assembly using the same
TWI658410B (en) * 2016-09-07 2019-05-01 李美燕 Optical imaging system with variable light field for biometrics application
US10380395B2 (en) * 2016-09-30 2019-08-13 Synaptics Incorporated Optical sensor with angled reflectors
CN115037895A (en) * 2017-04-04 2022-09-09 奥特逻科公司 High-speed optical detection device
US10665627B2 (en) * 2017-11-15 2020-05-26 Taiwan Semiconductor Manufacturing Co., Ltd. Image sensor device and method for forming the image sensor device having a first lens and a second lens over the first lens
TWI765170B (en) * 2018-08-21 2022-05-21 神盾股份有限公司 Optical sensor, optical sensing system and method for manufacturing the same
CN110473887A (en) * 2018-08-21 2019-11-19 神盾股份有限公司 Optical sensor, optical sensor system and its manufacturing method
CN112117287A (en) * 2019-06-21 2020-12-22 三星电子株式会社 Image sensor with a plurality of pixels

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI652626B (en) * 2017-08-11 2019-03-01 財團法人工業技術研究院 Biometric device
US20200074138A1 (en) * 2018-08-31 2020-03-05 Boe Technology Group Co., Ltd. Display device, method for operating display device and electronic device
US20200234026A1 (en) * 2019-01-22 2020-07-23 Shenzhen GOODIX Technology Co., Ltd. Fingerprint identification apparatus and electronic device
TWM598530U (en) * 2019-10-03 2020-07-11 神盾股份有限公司 Optical sensor and optical sensing system having the same

Also Published As

Publication number Publication date
TW202207437A (en) 2022-02-16
TWI748851B (en) 2021-12-01
TW202207445A (en) 2022-02-16
TW202207441A (en) 2022-02-16
TW202207004A (en) 2022-02-16
TWI754512B (en) 2022-02-01
TWI748791B (en) 2021-12-01
TW202207005A (en) 2022-02-16
TWI757107B (en) 2022-03-01

Similar Documents

Publication Publication Date Title
TWI764499B (en) Biometric sensing apparatus
EP1598873B1 (en) CMOS image sensor and method of fabrication thereof
JP4545190B2 (en) Imaging device
JP5372102B2 (en) Photoelectric conversion device and imaging system
US10177186B2 (en) Pixel structure of image sensor and method of forming same
KR101315537B1 (en) Solid state imaging element
JP2017151419A (en) Metal mirror-based multispectral filter array
JP5968261B2 (en) Photoelectric conversion element, photoelectric conversion device using the same, and imaging system
CN109145682B (en) Optical fingerprint identification device and preparation method thereof
KR19980081131A (en) Solid-state imaging device having low hydrogen permeability membrane and method of manufacturing the same
KR20120092047A (en) Photoelectric conversion element, and photoelectric conversion apparatus and image sensing system
US11781905B2 (en) Optical sensing device and electronic apparatus having the same
JP3044734B2 (en) Solid-state imaging device
US10832028B2 (en) Optical fingerprint module
WO2021082937A1 (en) Under-screen optical fingerprint module, display screen assembly, and electronic device
CN113822131B (en) Biological feature sensing device
KR20210079183A (en) Filter for imaging device
JP4871499B2 (en) Solid-state imaging device and imaging system using the solid-state imaging device
US11888009B2 (en) Sensing apparatus having light-transmitting adhesive layer
TWI798878B (en) Optical sensing device
CN114255486A (en) Optical sensing device, preparation method thereof and display device
JP6039530B2 (en) Photoelectric conversion device and imaging system using the same
JPH09219505A (en) Solid state colored image pickup device
TW202209138A (en) Biometric sensing device and biometric sensing group
CN210626703U (en) Low-transmittance optical filter and optical fingerprint identification module comprising same