TWI763112B - Grinding and polishing simulation method, system and grinding and polishing process transferring method - Google Patents
Grinding and polishing simulation method, system and grinding and polishing process transferring method Download PDFInfo
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本發明是有關於一種模擬方法、系統及製程轉移方法,且特別是有關於一種研磨拋光模擬方法、系統及研磨拋光製程轉移方法。The present invention relates to a simulation method, system and process transfer method, and in particular to a grinding and polishing simulation method, system and grinding and polishing process transfer method.
隨著工業的發展,許多加工程序已經自動化,尤其在研磨拋光程序中,以往需透過大量人工來執行,現都以機器手臂或機器人代替人工。雖研磨拋光程序已逐漸自動化,但針對不同的產品、加工需求與不同硬體設備配置下,仍需要繁瑣冗長的人工來調整設備的各種參數,以確保加工品質。另一方面,在目前技術中也有無法跨產線轉移研磨拋光製程的缺點。With the development of the industry, many processing procedures have been automated, especially in the grinding and polishing procedures, which used to be performed by a large number of manual workers, but are now replaced by robotic arms or robots. Although the grinding and polishing procedures have been gradually automated, according to different products, processing requirements and different hardware equipment configurations, cumbersome and lengthy manual labor is still required to adjust various parameters of the equipment to ensure the processing quality. On the other hand, the current technology also has the disadvantage that the grinding and polishing process cannot be transferred across production lines.
因此,需要一種模擬系統及方法,模擬研磨拋光程序,以克服需要大量人力及時間調整設備的各種參數的缺點,並需要一種製程轉移方法,以克服無法跨產線轉移研磨拋光製程的問題。Therefore, there is a need for a simulation system and method for simulating a grinding and polishing process to overcome the shortcomings of requiring a lot of manpower and time to adjust various parameters of the equipment, and a process transfer method is needed to overcome the problem that the grinding and polishing process cannot be transferred across production lines.
本發明係有關於一種研磨拋光模擬方法、系統及研磨拋光製程轉移方法,其利用模擬研磨拋光作業的方式,減少人工調整設備參數的時間。並可依據不同產線之間的共通性及差異資訊,在不同的產線之間轉移研磨拋光製程。The present invention relates to a grinding and polishing simulation method, a system and a grinding and polishing process transfer method, which use the method of simulating grinding and polishing operations to reduce the time for manually adjusting equipment parameters. The grinding and polishing process can be transferred between different production lines according to the commonality and difference information between different production lines.
根據本發明之一實施例,提出一種研磨拋光模擬方法。取得一研磨拋光設備進行一工件的研磨或拋光作業之一感測資訊。依據此感測資訊識別出複數個模型參數。依據一加工路徑、複數個製程參數以及此些模型參數計算出至少一品質參數。According to an embodiment of the present invention, a grinding and polishing simulation method is provided. Sensing information of a grinding and polishing equipment for grinding or polishing a workpiece is obtained. A plurality of model parameters are identified according to the sensing information. At least one quality parameter is calculated according to a machining path, a plurality of process parameters and the model parameters.
根據本揭露之另一實施例,提出一種研磨拋光模擬系統。研磨拋光模擬系統包括一感測單元、一識別單元及一模擬單元。感測單元用以取得一研磨拋光設備進行一工件的研磨或拋光作業之一感測資訊。識別單元用以依據此感測資訊識別出複數個模型參數。模擬單元用以依據一加工路徑、複數個製程參數以及此些模型參數計算出至少一品質參數。According to another embodiment of the present disclosure, a grinding and polishing simulation system is provided. The grinding and polishing simulation system includes a sensing unit, an identification unit and a simulation unit. The sensing unit is used for obtaining sensing information of a grinding and polishing equipment for grinding or polishing a workpiece. The identification unit is used for identifying a plurality of model parameters according to the sensing information. The simulation unit is used for calculating at least one quality parameter according to a machining path, a plurality of process parameters and the model parameters.
根據本揭露之一實施例,提出一種研磨拋光製程轉移方法。建立一第一模擬環境,第一模擬環境對應一具有一第一研磨拋光設備及一第一機器人之一第一真實環境,且第一模擬環境包括一第一研磨拋光設備物理模型及一第一工件物理模型。取得第一研磨拋光設備及第一機器人進行一第一工件的研磨或拋光作業之一第一感測資訊。依據第一感測資訊識別出複數個第一模型參數。將一第一加工路徑、複數個第一製程參數及此些第一模型參數輸入至第一研磨拋光設備物理模型及第一工件物理模型計算出至少一第一品質參數。建立一第二模擬環境,第二模擬環境對應一具有一第二研磨拋光設備及一第二機器人之一第二真實環境,且第二模擬環境包括一第二研磨拋光設備物理模型及一第二工件物理模型。取得關聯第一研磨拋光設備及第一機器人之一第一校準資訊、取得關聯第二研磨拋光設備及第二機器人之一第二校準資訊,並根據第一校準資訊及第二校準資訊分別校準第一模擬環境及第二模擬環境。分析第一模擬環境及第二模擬環境得到一差異資訊。根據差異資訊,將至少一部分之第一加工路徑、此些第一製程參數及此些第一模型參數輸入至第二研磨拋光設備物理模型及第二工件物理模型,以模擬第二研磨拋光設備及第二機器人進行一第二工件的研磨或拋光作業,並計算出至少一第二品質參數。According to an embodiment of the present disclosure, a method for transferring a grinding and polishing process is provided. A first simulation environment is established, the first simulation environment corresponds to a first real environment with a first grinding and polishing equipment and a first robot, and the first simulation environment includes a physical model of the first grinding and polishing equipment and a first Artifact physical model. A first sensing information of the first grinding and polishing equipment and the first robot for grinding or polishing a first workpiece is obtained. A plurality of first model parameters are identified according to the first sensing information. At least one first quality parameter is calculated by inputting a first machining path, a plurality of first process parameters and the first model parameters into the first physical model of the grinding and polishing equipment and the first physical model of the workpiece. A second simulation environment is established, the second simulation environment corresponds to a second real environment with a second grinding and polishing equipment and a second robot, and the second simulation environment includes a physical model of the second grinding and polishing equipment and a second Artifact physical model. Obtain first calibration information associated with the first grinding and polishing equipment and the first robot, obtain second calibration information associated with the second grinding and polishing equipment and the second robot, and calibrate the first calibration information according to the first calibration information and the second calibration information respectively. A simulation environment and a second simulation environment. A difference information is obtained by analyzing the first simulation environment and the second simulation environment. According to the difference information, at least a part of the first processing path, the first process parameters and the first model parameters are input into the second grinding and polishing equipment physical model and the second workpiece physical model to simulate the second grinding and polishing equipment and The second robot performs a grinding or polishing operation on a second workpiece, and calculates at least one second quality parameter.
為了對本發明之上述及其他方面有更佳的瞭解,下文特舉實施例,並配合所附圖式詳細說明如下:In order to have a better understanding of the above-mentioned and other aspects of the present invention, the following specific examples are given and described in detail in conjunction with the accompanying drawings as follows:
請參照第1圖,其繪示研磨拋光模擬系統100、研磨拋光設備200、機器人300、以及工件400的示意圖。研磨拋光模擬系統100包括一感測單元110、一識別單元120、一模擬單元130、一加工路徑生成單元140及一輸入介面150。感測單元110例如是力量感測器量、位移感測器、表面粗糙度儀或視覺感測器,用以感測一研磨拋光設備200及一機器人300進行一工件400的研磨或拋光作業的各種感測資訊SI。識別單元120、模擬單元130及加工路徑生成單元140例如是一電路、一晶片或一電路板。輸入介面150例如是一觸控螢幕、或一鍵盤。Please refer to FIG. 1 , which shows a schematic diagram of a grinding and polishing simulation system 100 , a grinding and
請參照第1及2圖。第2圖繪示根據本發明一實施例之研磨拋光模擬方法的流程圖。在步驟S110,感測單元110取得研磨拋光設備200進行工件400的研磨或拋光作業之感測資訊SI。雖然在第1圖中,機器人300係抓取工件400接觸研磨拋光設備200以執行研磨或拋光作業。但在一實施例中,機器人300也可抓取研磨拋光設備200接觸工件400以執行研磨或拋光作業(未繪示)。本案所述之方法可適用於上述兩種配置方式,但是不限於此。在此步驟中,感測單元110僅需取得研磨拋光設備200及工件400的感測資訊SI即可,而不用獲得機器人300的感測資訊。感測資訊SI例如包括六軸力資訊、工件幾何變化量、表面粗糙度、或工件表面狀態。Please refer to Figures 1 and 2. FIG. 2 shows a flowchart of a grinding and polishing simulation method according to an embodiment of the present invention. In step S110 , the
在步驟S120,識別單元120依據感測資訊SI識別出複數個模型參數MP。請同時參照第3圖,其繪示根據本發明一實施例之步驟S110及S120的子步驟的流程圖。步驟S110及S120包括步驟S121至S127。In step S120, the identifying unit 120 identifies a plurality of model parameters MP according to the sensing information SI. Please also refer to FIG. 3 , which illustrates a flowchart of sub-steps of steps S110 and S120 according to an embodiment of the present invention. Steps S110 and S120 include steps S121 to S127.
步驟S121,識別單元120定義一範圍R。請參照第4圖,其繪示根據本發明一實施例之識別單元120定義之範圍R的示意圖。更進一步來說,識別單元120係基於工件400與研磨拋光設備200的接觸位置設定包含此接觸位置或在接觸位置附近之範圍R。範圍R可為一立方體、一球形或其他形狀。在識別單元120定義範圍R之後,機器人300引導工件400相對研磨拋光設備200移動於範圍R中之多個接觸點TP上,此處請留意,機器人300引導工件400相對研磨拋光設備200移動的情況可以是機器人300握持工件400在研磨拋光設備200上移動(即「工件在手(part in hand)」),或者是機器人300握持研磨拋光設備200在工件400上移動(即「工具在手(tool in hand)」)。In step S121, the identification unit 120 defines a range R. Please refer to FIG. 4 , which is a schematic diagram of the range R defined by the identification unit 120 according to an embodiment of the present invention. Furthermore, the identification unit 120 sets a range R including the contact position or the vicinity of the contact position based on the contact position between the
步驟S122,識別單元120自感測單元110接收機器人300引導工件400於範圍R中與研磨拋光設備200之多個接觸點TP之感測資訊SI。進一步來說,感測單元110取得各接觸點TP上之感測資訊SI,且識別單元120接收感測資訊SI。In step S122, the identification unit 120 receives from the
步驟S123,識別單元120依據模型參數的設定值計算對應之品質參數的預測值。識別單元120須先根據一模型參數預先任意設定的設定值計算對應之品質參數的預測值。模型參數的設定值例如為研磨拋光設備200及工件400之幾何參數的設定值、砂帶張力的設定值、變形校正參數的設定值、或磨耗校正參數的設定值。品質參數的預測值例如為正向/切線力分佈的預測值、材料移除率的預測值、表面粗糙度的預測值、或覆蓋率的預測值。由於品質參數的預測值與模型參數的設定值相關聯,因此可藉由模型參數的設定值計算對應之品質參數的預測值。In step S123, the identification unit 120 calculates the predicted value of the corresponding quality parameter according to the set value of the model parameter. The identification unit 120 must first calculate the predicted value of the corresponding quality parameter according to a preset value of a model parameter arbitrarily set. The set values of the model parameters are, for example, the set values of the geometric parameters of the grinding and
步驟S124,識別單元120計算品質參數的預測值與實際的感測資訊SI的誤差是否低於一門檻值。若是,則執行步驟S127;若否,則執行步驟S125。更進一步來說,識別單元120先分析實際的感測資訊SI所對應之品質參數,例如,識別單元120分析六軸力資訊所對應之正向/切線力分佈、分析工件幾何變化量所對應之材料移除率、分析工件表面狀態所對應之覆蓋率。接著,識別單元120計算品質參數的預測值與實際的感測資訊SI所對應之品質參數之間的誤差是否低於門檻值,例如,識別單元120計算品質參數的預測值與實際的感測資訊SI所對應之品質參數之間的均方根誤差(RMSE)、均方誤差(MSE)、平均絕對誤差(MAE)、平均絕對百分比誤差(MAPE)或對稱平均絕對百分比誤差(SMAPE)是否低於門檻值。其中門檻值可依據不同情況設定。In step S124, the identification unit 120 calculates whether the error between the predicted value of the quality parameter and the actual sensing information SI is lower than a threshold value. If yes, go to step S127; if not, go to step S125. More specifically, the identification unit 120 first analyzes the quality parameters corresponding to the actual sensing information SI. For example, the identification unit 120 analyzes the forward/tangential force distribution corresponding to the six-axis force information, and analyzes the workpiece geometric variation corresponding to the quality parameter. The material removal rate, the coverage rate corresponding to the analysis of the surface state of the workpiece. Next, the identifying unit 120 calculates whether the error between the predicted value of the quality parameter and the quality parameter corresponding to the actual sensing information SI is lower than the threshold value. For example, the identifying unit 120 calculates the predicted value of the quality parameter and the actual sensing information. Whether the root mean square error (RMSE), mean square error (MSE), mean absolute error (MAE), mean absolute percentage error (MAPE) or symmetric mean absolute percentage error (SMAPE) between the quality parameters corresponding to SI is lower than Threshold value. The threshold value can be set according to different situations.
若品質參數的預測值與實際的感測資訊SI的誤差低於門檻值,表示步驟S123中之模型參數的設定值是合適的。接著執行步驟S127,識別單元120定義此模型參數的設定值為最終採用的模型參數MP。然後執行步驟S130。If the error between the predicted value of the quality parameter and the actual sensing information SI is lower than the threshold value, it means that the set value of the model parameter in step S123 is appropriate. Next, step S127 is executed, and the identification unit 120 defines the set value of the model parameter as the model parameter MP that is finally adopted. Then step S130 is performed.
若品質參數的預測值與實際的感測資訊SI的誤差未低於門檻值,表示步驟S123中之模型參數的設定值是不合適的。接著執行步驟S125。If the error between the predicted value of the quality parameter and the actual sensing information SI is not lower than the threshold value, it means that the set value of the model parameter in step S123 is inappropriate. Next, step S125 is performed.
在步驟S125,識別單元120判斷更新模型參數的設定值的次數是否大於一預設次數。其中預設次數可依據不同情況設定。若是,代表無法在預設次數內使品質參數的預測值與實際的感測資訊SI的誤差低於門檻值,因此,流程回到步驟S122,取得另一感測資訊SI並執行後續步驟;若否,代表更新模型參數的設定值的次數仍在該預設次數以內,接著則執行步驟S126。In step S125, the identification unit 120 determines whether the number of times of updating the set value of the model parameter is greater than a preset number of times. The preset number of times can be set according to different situations. If so, it means that the error between the predicted value of the quality parameter and the actual sensing information SI cannot be made lower than the threshold value within the preset number of times. Therefore, the process returns to step S122 to obtain another sensing information SI and execute the subsequent steps; if No, it means that the number of times of updating the set value of the model parameter is still within the preset number of times, and then step S126 is executed.
步驟S126,識別單元120更新模型參數的設定值。例如識別單元120更新研磨拋光設備200及工件400之幾何參數的設定值、砂帶張力的設定值、變形校正參數的設定值、或磨耗校正參數的設定值。接著,回到步驟S123,識別單元120依據更新的模型參數的設定值計算對應之更新的品質參數的預測值。接著,執行步驟S124,識別單元120計算更新的品質參數的預測值與實際的感測資訊SI的誤差是否低於門檻值。也就是說,步驟S123至S126為一遞迴過程,其會重複執行直到由模型參數的設定值計算出之對應的品質參數的預測值與實際的感測資訊SI之誤差低於門檻值為止(步驟S124),或者直到更新模型參數的設定值的次數大於預設次數為止(步驟S125)。In step S126, the identification unit 120 updates the set values of the model parameters. For example, the identification unit 120 updates the set values of the geometric parameters of the grinding and polishing
在步驟S125中,當識別單元120判斷更新模型參數的設定值的次數大於預設次數,表示模型參數的初始的設定值挑選的不好,則可能無論更新幾次模型參數的設定值都無法收斂(意即重複步驟S123至S126的次數超過預設次數仍無法使得誤差低於門檻值),此時就需要回到取得感測資訊SI的步驟S122,另外挑選一初始的設定值的流程以重新開始下一次遞迴比較誤差的計算過程。In step S125, when the identification unit 120 judges that the number of times of updating the set value of the model parameter is greater than the preset number of times, it means that the initial set value of the model parameter is not selected well, and the set value of the model parameter may not be converged no matter how many times the set value of the model parameter is updated. (Meaning that the number of repeating steps S123 to S126 exceeds the preset number of times and still cannot make the error lower than the threshold value), at this time, it is necessary to return to step S122 of obtaining the sensing information SI, and select an initial setting value process to restart. Begins the calculation process of the error of the next recursive comparison.
請回頭繼續參照第1及2圖,在步驟S130,模擬單元130依據加工路徑PT、製程參數PP及模型參數MP計算出至少一品質參數QP。在此實施例中,加工路徑生成單元140依據工件400生成加工路徑PT,其為離線編程所產生的加工路徑PT。製程參數PP係由一現場人員透過輸入介面150輸入。在另一實施例中,加工路徑PT也可由一現場人員透過輸入介面150輸入。製程參數PP例如為研磨拋光接觸點、砂帶番號、工件速度、砂帶/拋光機速度、進給深度、工件材質、或工件原始表面品質。模型參數MP例如為研磨拋光設備200及工件400之幾何參數、砂帶張力、變形校正參數、或磨耗校正參數。至少一品質參數QP例如為正向/切線力分佈、材料移除率、表面粗糙度、或覆蓋率。在另一實施例中,研磨拋光模擬系統100更包括一外部感測單元(未繪示),研磨拋光模擬系統100可直接透過外部感測單元自研磨拋光設備200及工件400獲得模型參數MP。接著,模擬單元130依據加工路徑PT、製程參數PP及模型參數MP計算出至少一品質參數QP,如第1圖所示。Please refer back to FIGS. 1 and 2. In step S130, the
接著,請參照第5圖,其繪示根據本發明一實施例之步驟S130的子步驟的流程圖。步驟S130包括步驟S131至S133。Next, please refer to FIG. 5 , which shows a flowchart of sub-steps of step S130 according to an embodiment of the present invention. Step S130 includes steps S131 to S133.
步驟S131,模擬單元130根據研磨拋光設備200建立一研磨拋光設備物理模型。步驟S132,模擬單元130根據工件400建立一工件物理模型。在此請留意,步驟S131與步驟S132的執行前後順序可為二者同時、亦可由任一步驟在先,第5圖所示步驟S131在先、步驟S132在後僅為其中示意性的一實施例。請參照第6圖,其繪示根據本發明一實施例之研磨拋光設備物理模型210及工件物理模型410的示意圖。研磨拋光設備物理模型210及工件物理模型410包含已知的參數:
O1
、O2
: 兩個研磨輪的中心點
R1
、R2
: 研磨拋光設備之研磨輪的半徑
r:工件在接觸點處的局部表面曲率半徑(Local radius)(未標示)
A、B: 第一時間之研磨砂帶與兩個研磨輪的接觸點
C:第一時間之工件與研磨砂帶的接觸點
P:第一時間之工件的中心點
D、E: 第二時間之研磨砂帶與兩個研磨輪的接觸點
F、G:第二時間之工件與研磨砂帶的接觸點
P’:第二時間之工件的中心點
m0
:O1
至P的長度
n0
: O2
至P的長度
m:O1
至P’的長度
n: O2
至P’的長度
a: O1
與D之連線與O1
與P’之連線之間的角度
b: O2
與E之連線與O2
與P’之連線之間的角度
c: O1
與P’之連線與O1
與O2
之連線之間的角度
d: O2
與P’之連線與O1
與O2
之連線之間的角度
L:兩個研磨輪之間的距離(O1
至O2
的長度)
Lm0
: A至C的長度
Lth0
: In step S131 , the
接著,進入步驟S133,模擬單元130將加工路徑PT、製程參數PP及模型參數MP輸入至研磨拋光設備物理模型210及工件物理模型410以計算出至少一品質參數QP。以品質參數QP為正向/切線力分佈為例,二維的正向/切線力分佈F2D
以及三維的正向/切線力分佈F3D
可分別由下列式一及式二求出:(式一)(式二)
其中T為砂帶張力(模型參數MP)、δ為研磨深度(加工路徑PT)。Next, in step S133, the
另外,以品質參數QP為材料移除率γij 為例,材料移除率γij 可由下列式三求出:(式三) 其中CA 為校正用之固定參數(模型參數MP)、KA 為與工件材料與砂帶番號相關之參數(模型參數MP)、Kt 為磨耗校正參數(模型參數MP)、Vb 為砂帶/拋光機速度(製程參數PP)、Vw 為工件速度(製程參數PP)、α、β、γ為校正因子(模型參數MP)。In addition, taking the quality parameter QP as the material removal rate γ ij as an example, the material removal rate γ ij can be obtained from the following formula 3: (Formula 3) where C A is a fixed parameter for calibration (model parameter MP), K A is a parameter related to workpiece material and abrasive belt number (model parameter MP), and K t is a wear correction parameter (model parameter MP) , V b is the belt/polishing machine speed (process parameter PP), V w is the workpiece speed (process parameter PP), α, β, γ are correction factors (model parameter MP).
上述雖以正向/切線力分佈及材料移除率為例,但本案不以此為限。Although the positive/tangential force distribution and material removal rate are used as examples above, this case is not limited to this.
透過本發明之研磨拋光模擬方法及系統,可在研磨拋光作業執行中即時識別出模型參數,並計算至少一品質參數。如此一來,本案不需要花費大量的人力及時間來調整設備的各種參數。Through the grinding and polishing simulation method and system of the present invention, model parameters can be identified in real time during the execution of grinding and polishing operations, and at least one quality parameter can be calculated. In this way, this case does not need to spend a lot of manpower and time to adjust various parameters of the equipment.
請參照第7及8圖。第7圖繪示根據本發明一實施例之研磨拋光製程轉移方法的流程圖。第8圖繪示根據本發明一實施例之研磨拋光製程轉移的示意圖。Please refer to Figures 7 and 8. FIG. 7 is a flowchart illustrating a method for transferring a grinding and polishing process according to an embodiment of the present invention. FIG. 8 is a schematic diagram illustrating the transfer of the grinding and polishing process according to an embodiment of the present invention.
步驟S210,建立第一模擬環境EV1。第一模擬環境EV1對應具有一第一研磨拋光設備2001及一第一機器人3001之一第一真實環境,且第一模擬環境EV1包括一第一研磨拋光設備物理模型GMD1及一第一工件物理模型WMD1。Step S210, establishing a first simulated environment EV1. The first simulated environment EV1 corresponds to a first real environment with a first grinding and
步驟S220,於第一模擬環境EV1中執行研磨拋光模擬方法。此步驟的研磨拋光模擬方法類似於第2至4圖所述之研磨拋光模擬方法。亦即,取得第一研磨拋光設備2001及第一機器人3001進行一第一工件4001的研磨或拋光作業之一第一感測資訊、依據第一感測資訊識別出複數個第一模型參數、以及將一第一加工路徑、複數個第一製程參數及此些第一模型參數輸入至第一研磨拋光設備物理模型GMD1及第一工件物理模型WMD1計算出至少一第一品質參數。Step S220, the grinding and polishing simulation method is executed in the first simulation environment EV1. The grinding and polishing simulation method of this step is similar to the grinding and polishing simulation method described in Figures 2 to 4. That is, obtaining first sensing information of the first grinding and
步驟S230,建立第二模擬環境EV2。第二模擬環境EV2對應具有一第二研磨拋光設備2002及一第二機器人3002之一第二真實環境,且第二模擬環境EV2包括一第二研磨拋光設備物理模型GMD2及一第二工件物理模型WMD2。Step S230, establishing a second simulated environment EV2. The second simulated environment EV2 corresponds to a second real environment with a second grinding and
步驟S240,校準第一模擬環境EV1及第二模擬環境EV2。首先,取得關聯第一研磨拋光設備2001及第一機器人3001之一第一校準資訊、取得關聯第二研磨拋光設備2002及第二機器人3002之一第二校準資訊,並根據第一校準資訊及第二校準資訊分別校準第一模擬環境EV1及第二模擬環境EV2。第一校準資訊例如是第一機器人3001與第一研磨拋光設備2001之位置校準、第一機器人3001之夾爪治具單元之尺寸校準、第一工件4001之變異校正、或第一研磨拋光設備2001之額外旋轉軸校準。第二校準資訊例如是第二機器人3002與第二研磨拋光設備2002之位置校準、第二機器人3002之夾爪治具單元之尺寸校準、第二工件4002之變異校正、或第二研磨拋光設備2002之額外旋轉軸校準。Step S240, calibrating the first simulation environment EV1 and the second simulation environment EV2. First, obtain the first calibration information associated with the first grinding and
步驟S250,分析第一模擬環境EV1及第二模擬環境EV2得到差異資訊。差異資訊例如是第一工件4001與第二工件4002的幾何差異,以及第一機器人3001與第一研磨拋光設備2001之配置與第二機器人3002與第二研磨拋光設備2002之配置的配置差異。Step S250, analyzing the first simulation environment EV1 and the second simulation environment EV2 to obtain difference information. The difference information is, for example, the geometric difference between the
步驟S260,根據差異資訊從第一模擬環境EV1轉移研磨拋光製程至第二模擬環境EV2。更進一步來說,根據差異資訊,將至少一部分之第一加工路徑、此些第一製程參數及此些第一模型參數輸入至第二研磨拋光設備物理GMD2模型及第二工件物理模型WMD2,以模擬第二研磨拋光設備2002及第二機器人3002進行第二工件4002的研磨或拋光作業,並計算出至少一第二品質參數。在此步驟中,第一加工路徑例如是工件上的加工路徑或是機器人的加工路徑,且工件上的加工路徑與機器人的加工路徑具有對應關係,工件加工路徑可依據不同類型的機器人轉換成對應的機器人加工路徑。以下針對差異資訊的不同情況做詳細說明。Step S260 , transferring the grinding and polishing process from the first simulation environment EV1 to the second simulation environment EV2 according to the difference information. Furthermore, according to the difference information, at least a part of the first processing path, the first process parameters and the first model parameters are input into the second grinding and polishing equipment physical GMD2 model and the second workpiece physical model WMD2, so as to The second grinding and
當差異資訊為第一工件4001與第二工件4002相同,且第一機器人3001與第一研磨拋光設備2001之配置與第二機器人3002與第二研磨拋光設備2002之配置相同時,將第一加工路徑、第一製程參數及第一模型參數輸入至第二研磨拋光設備物理模型GMD2及第二工件物理模型WMD2中,以模擬第二研磨拋光設備2002及第二機器人3002進行第二工件4002的研磨或拋光作業,並計算出至少一第二品質參數。When the difference information is that the
當差異資訊為第一工件4002與第二工件4002相同,但第一機器人3001與第一研磨拋光設備2001之配置與第二機器人3002與第二研磨拋光設備2002之配置不同時,在第二模擬環境EV2中識別複數個第二模型參數,接著將第一加工路徑、第一製程參數及此些第二模型參數輸入至第二研磨拋光設備物理模型GMD2及第二工件物理模型WMD2中,以模擬第二研磨拋光設備2002及第二機器人3002進行第二工件4002的研磨或拋光作業,並計算出至少一第二品質參數。When the difference information is that the
當差異資訊為第一工件4001與第二工件4002不同,且第一機器人3001與第一研磨拋光設備2001之配置與第二機器人3002與第二研磨拋光設備2002之配置不同時,在第二模擬環境EV2中識別複數個第二模型參數,接著比對第一工件4001及第二工件4002,以得到第一工件4001與第二工件4002之一相同部分,將對應此相同部分之第一加工路徑、對應此相同部分之第一製程參數及此些第二模型參數輸入至第二研磨拋光設備物理模型GMD2及第二工件物理模型WMD2中,以模擬第二研磨拋光設備2002及第二機器人3002進行第二工件4002的研磨或拋光作業,並計算出至少一第二品質參數。第一工件4001與第二工件4002之相同部分的說明如下。When the difference information is that the
請參照第9圖,其繪示根據本發明一實施例之第一工件4001與第二工件4002之示意圖。第一工件4001包括一第一部份4001-1及一第二部分4001-2。第二工件4002包括一第一部份4002-1及一第二部分4002-2。第一工件4001與第二工件4002的相同部分為第一部份4001-1及第一部份4002-1,其皆為圓柱體。因此,在比對出相同部分之後,對應第一工件4001之第一部份4001-1的第一加工路徑,及對應第一工件4001之第一部份4001-1的第一製程參數被輸入至第二研磨拋光設備物理模型GMD2及第二工件物理模型WMD2中。Please refer to FIG. 9, which shows a schematic diagram of a
如此一來,透過本發明之研磨拋光製程轉移方法,可依據不同產線之間的共通性及差異資訊,在不同的產線之間轉移研磨拋光製程。In this way, through the method for transferring the grinding and polishing process of the present invention, the grinding and polishing process can be transferred between different production lines according to the commonality and difference information between different production lines.
綜上所述,雖然本發明已以實施例揭露如上,然其並非用以限定本發明。本發明所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。因此,本發明之保護範圍當視後附之申請專利範圍所界定者為準。To sum up, although the present invention has been disclosed by the above embodiments, it is not intended to limit the present invention. Those skilled in the art to which the present invention pertains can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope of the appended patent application.
100:研磨拋光模擬系統 110:感測單元 120:識別單元 130:模擬單元 140:加工路徑生成單元 150:輸入介面 200:研磨拋光設備 300:機器人 400:工件 SI:感測資訊 MP:模型參數 QP:品質參數 PP:製程參數 PT:加工路徑 S110,S120,S121,S122,S123,S124,S125,S126,S127,S130,S131,S132,S133,S210,S220,S230,S240,S250,S260:步驟 R:範圍 TP:接觸點 210:研磨拋光設備物理模型 410:工件物理模型 2001:第一研磨拋光設備 2002:第二研磨拋光設備 3001:第一機器人 3002:第二機器人 4001:第一工件 4002:第二工件 EV1:第一模擬環境 EV2:第二模擬環境 GMD1:第一研磨拋光設備物理模型 GMD2:第二研磨拋光設備物理模型 WMD1:第一工件物理模型 WMD2:第二工件物理模型 4001-1,4002-1:第一部份 4001-2,4002-2:第二部分100: Grinding and polishing simulation system 110: Sensing unit 120: Identification unit 130: Analog Unit 140: Processing path generation unit 150: Input interface 200: Grinding and polishing equipment 300: Robot 400: Workpiece SI: Sensing Information MP: model parameters QP: quality parameter PP: Process parameters PT: machining path S110, S120, S121, S122, S123, S124, S125, S126, S127, S130, S131, S132, S133, S210, S220, S230, S240, S250, S260: Steps R: range TP: touch point 210: Physical model of grinding and polishing equipment 410: Workpiece Physical Model 2001: The first grinding and polishing equipment 2002: Second grinding and polishing equipment 3001: First Robot 3002: Second Robot 4001: The first workpiece 4002: Second workpiece EV1: The first simulation environment EV2: Second Simulation Environment GMD1: Physical Model of the First Grinding and Polishing Equipment GMD2: Physical Model of the Second Grinding and Polishing Equipment WMD1: Physical model of the first workpiece WMD2: Second Workpiece Physical Model 4001-1, 4002-1: Part 1 4001-2, 4002-2: Part II
第1圖繪示研磨拋光模擬系統、研磨拋光設備、機器人、以及工件的示意圖。 第2圖繪示根據本發明一實施例之研磨拋光模擬方法的流程圖。 第3圖繪示根據本發明一實施例之步驟S110及S120的子步驟的流程圖。 第4圖繪示根據本發明一實施例之識別單元定義之範圍的示意圖。 第5圖繪示根據本發明一實施例之步驟S130的子步驟的流程圖。 第6圖繪示根據本發明一實施例之研磨拋光設備物理模型及工件物理模型的示意圖。 第7圖繪示根據本發明一實施例之研磨拋光製程轉移方法的流程圖。 第8圖繪示根據本發明一實施例之研磨拋光製程轉移的示意圖。 第9圖繪示根據本發明一實施例之第一工件與第二工件之示意圖。Figure 1 shows a schematic diagram of a grinding and polishing simulation system, a grinding and polishing equipment, a robot, and a workpiece. FIG. 2 shows a flowchart of a grinding and polishing simulation method according to an embodiment of the present invention. FIG. 3 is a flowchart illustrating sub-steps of steps S110 and S120 according to an embodiment of the present invention. FIG. 4 is a schematic diagram illustrating a range defined by an identification unit according to an embodiment of the present invention. FIG. 5 is a flowchart illustrating sub-steps of step S130 according to an embodiment of the present invention. FIG. 6 is a schematic diagram of a physical model of a grinding and polishing equipment and a physical model of a workpiece according to an embodiment of the present invention. FIG. 7 is a flowchart illustrating a method for transferring a grinding and polishing process according to an embodiment of the present invention. FIG. 8 is a schematic diagram illustrating the transfer of the grinding and polishing process according to an embodiment of the present invention. FIG. 9 is a schematic diagram of a first workpiece and a second workpiece according to an embodiment of the present invention.
S110,S120,S130:步驟S110, S120, S130: Steps
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Title |
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期刊韕施志軒/游鴻修韕機器人智慧製造單元與研磨拋光應用韕實例介紹 機械工業雜誌韕412期韕工業技術研究院韕2017/07/01韕28~43韕 * |
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