TWI762714B - Pattern exposure method and pattern exposure device - Google Patents

Pattern exposure method and pattern exposure device Download PDF

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TWI762714B
TWI762714B TW107131234A TW107131234A TWI762714B TW I762714 B TWI762714 B TW I762714B TW 107131234 A TW107131234 A TW 107131234A TW 107131234 A TW107131234 A TW 107131234A TW I762714 B TWI762714 B TW I762714B
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exposure
unit
area
image data
turn
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TW201923471A (en
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杉本重人
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日商V科技股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70283Mask effects on the imaging process
    • G03F7/70291Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

本發明提供一種圖案曝光方法及圖案曝光裝置,該圖案曝光方法中,藉由抑制無遮罩曝光的曝光圖像資料中平面角部上的邊緣誤差,以良好的精度形成被微細化之圖案。於曝光面上劃分光束的最小曝光單位,以最小曝光單位的集合特定曝光圖像資料中校正所需要的光束的接通區域,按接通區域內的最小曝光單位累積光束的強度分佈,並求出接通區域內的累積強度分佈,對累積強度分佈與所設定之閾值進行比較而求出於曝光面上連結累積強度分佈與閾值一致之點而成之輪廓來作為累積強度輪廓(AIP),於接通區域的外側按最小曝光單位設定接通光束之接通單位來校正曝光圖像資料,以使被接通區域的外緣和累積強度輪廓包圍之差分面積變小。 The present invention provides a pattern exposure method and a pattern exposure apparatus, in which a patterned pattern can be formed with good precision by suppressing edge errors on plane corners in exposed image data exposed without a mask. Divide the minimum exposure unit of the light beam on the exposure surface, use the minimum exposure unit to set the specific exposure image data to correct the required beam turn-on area, accumulate the intensity distribution of the light beam according to the minimum exposure unit in the turn-on area, and find The cumulative intensity distribution in the turn-on area is obtained, and the cumulative intensity distribution is compared with the set threshold to obtain a contour on the exposure surface that connects the points where the cumulative intensity distribution is consistent with the threshold as the cumulative intensity profile (AIP), On the outside of the turned-on area, the turn-on unit of the turn-on beam is set according to the minimum exposure unit to correct the exposure image data, so that the difference area surrounded by the outer edge of the turn-on area and the cumulative intensity profile becomes smaller.

Description

圖案曝光方法及圖案曝光裝置 Pattern exposure method and pattern exposure device

本發明係有關圖案曝光方法及圖案曝光裝置者。 The present invention relates to a pattern exposure method and a pattern exposure apparatus.

關於於光刻等微細圖案加工中所使用之圖案曝光,已知一種基於曝光圖像資料,於基板表面對被接通或斷開控制之光束(包括電子束)進行掃描,並於基板上直接描繪圖案之無遮罩曝光。無遮罩曝光中的光束的接通或斷開控制中使用能夠進行DMD(Digital Micro-mirror Device:數字微鏡裝置)、LD或LED陣列等光調製元件陣列、光源陣列或灰階的控制之GLV(Grating light Valve:柵狀光閥)等(例如,參閱下述專利文獻1)。 Regarding pattern exposure used in micro-pattern processing such as photolithography, it is known to scan a light beam (including an electron beam) controlled on or off on the surface of a substrate based on exposure image data, and directly on the substrate Unmasked exposure of the delineated pattern. It is used for the ON/OFF control of the light beam in maskless exposure. It is possible to control the light modulation element array such as DMD (Digital Micro-mirror Device), LD or LED array, light source array or gray scale. GLV (Grating light Valve: grating light valve) etc. (for example, refer to the following patent document 1).

[先行技術文獻] [Prior Technology Literature] [專利文獻] [Patent Literature]

專利文獻1:日本特開2007-94227號公報 Patent Document 1: Japanese Patent Laid-Open No. 2007-94227

前述之以往的圖案曝光(無遮罩曝光)中,按光束的掃描間距或光調製元件陣列等陣列間隔確定能夠控制之曝光的最小單位,但於各個光束中存在強度分佈(例如,高斯分佈),因此於曝光圖像資料的邊緣(接通區域與 斷開區域的邊界)中,所累積之曝光量不得不逐漸變低,於曝光圖像資料的邊緣線與實際顯影後得到之圖案的邊緣線之間產生小於前述之最小單位的尺寸誤差,該情況會成為問題。 In the above-mentioned conventional pattern exposure (maskless exposure), the minimum unit of exposure that can be controlled is determined according to the scanning pitch of the beam or the array interval such as the light modulation element array, but there is an intensity distribution (for example, a Gaussian distribution) in each beam. , so at the edges of the exposed image data (connected areas and In the boundary of the disconnected area), the accumulated exposure has to gradually become lower, resulting in a dimensional error smaller than the aforementioned minimum unit between the edge line of the exposed image data and the edge line of the pattern obtained after actual development. The situation will become a problem.

圖1(a)中,以網格線表示曝光的最小單位,且粗線表示曝光圖像資料的邊緣。於圖示的例中,將用粗線描繪之斷開區域的內側設為光束的接通區域,將用粗線描繪之斷開區域的外側設為光束的斷開區域而形成了斷開區域的圖案,但該圖案依據抗蝕劑是負型還是正型而成為點圖案和孔圖案。從而,將斷開區域的內側設為接通區域並將外側設為斷開區域,或者將斷開區域的內側設為斷開區域並將外側設為接通區域是依據所使用之抗蝕劑和欲得到之凹凸圖案而適當確定,因此本質上無問題。 In FIG. 1( a ), the minimum unit of exposure is represented by grid lines, and the thick lines represent the edges of the exposed image data. In the example shown in the figure, the inside of the off region drawn with the thick line is the on region of the light beam, and the outside of the off region drawn with the thick line is the off region of the light beam to form the off region. , but the pattern becomes a dot pattern and a hole pattern depending on whether the resist is negative or positive. Thus, whether the inside of the off region is the on region and the outside is the off region, or the inside of the off region is the off region and the outside is the on region depends on the resist used Since it is properly determined according to the desired concavo-convex pattern, there is no problem in essence.

當以該等曝光圖像資料進行圖案曝光時,圖1(a)的A1-A2之間的光束的累積強度分佈成為圖1(b)般,若累積僅A1-A2的線上的光束的強度,則成為如P1~P7的分佈,但當累積了照射於其周邊全部之光束時,成為以Pf表示之強度分佈。此時,若將強度Et設為抗蝕劑的顯影閾值,則藉由顯影得到之圖案的邊緣成為被強度Et劃分之S1,且在與曝光顯影資料中邊緣S0之間產生誤差me。如圖1(a)所示,該等邊緣的誤差me於曝光圖像資料的圖案中的平面角部尤其明顯。此外,在此所述之角部當然不僅包括凸狀圖案的角部還包括凹狀圖案的角部。 When pattern exposure is performed with these exposure image data, the cumulative intensity distribution of the beams between A1-A2 in Fig. 1(a) becomes like Fig. 1(b). If only the intensity of the beams on the line A1-A2 is accumulated , then it becomes a distribution like P1 to P7, but when the light beams irradiated on all its periphery are accumulated, it becomes an intensity distribution represented by Pf. At this time, if the intensity Et is set as the development threshold of the resist, the edge of the pattern obtained by development becomes S1 divided by the intensity Et, and an error me occurs between the edge S0 in the exposure and development data. As shown in FIG. 1(a), these edge errors me are particularly pronounced at flat corners in the pattern of the exposed image data. In addition, the corners mentioned here naturally include not only the corners of the convex pattern but also the corners of the concave pattern.

本發明係為了解決該等問題而提出者。亦即,本發明的課題為藉由 抑制無遮罩曝光的曝光圖像資料中平面角部上的邊緣誤差,以良好的精度形成被微細化之圖案等。 The present invention has been made in order to solve these problems. That is, the subject of the present invention is to Suppresses edge errors at the corners of planes in exposed image data exposed to maskless exposure, and forms fine-grained patterns with good precision.

為了解決該等課題,本發明具備以下構成。 In order to solve these problems, the present invention has the following configuration.

一種圖案曝光方法,基於曝光圖像資料對光束進行接通或斷開控制之同時進行掃描,並於曝光面上描繪圖案,該圖案曝光方法的特徵為,具備如下步驟:於前述曝光面上劃分光束的最小曝光單位,以前述最小曝光單位的集合特定前述曝光圖像資料中校正所需要的光束的接通區域;按前述接通區域內的最小曝光單位累積前述光束的強度分佈,並求出前述接通區域內的累積強度分佈;對前述累積強度分佈與所設定之閾值進行比較而求出於前述曝光面上連結前述累積強度分佈與前述閾值一致之點而成之輪廓來作為累積強度輪廓;及於前述接通區域的外側按前述最小曝光單位設定接通光束之接通單位來校正前述曝光圖像資料,以使被前述接通區域的外緣和前述累積強度輪廓包圍之差分面積變小。 A pattern exposure method, which scans while controlling the on or off of a light beam based on exposure image data, and draws a pattern on an exposure surface. The pattern exposure method is characterized by comprising the following steps: dividing the exposure surface on the The minimum exposure unit of the light beam, the set of the minimum exposure units is used to specify the light beam connection area required for correction in the exposure image data; the intensity distribution of the light beam is accumulated according to the minimum exposure unit in the connection area, and obtained The cumulative intensity distribution in the above-mentioned turn-on area; the above-mentioned cumulative intensity distribution is compared with the set threshold value to obtain a contour formed by connecting the above-mentioned cumulative intensity distribution and the above-mentioned threshold value on the above-mentioned exposure surface as the cumulative intensity profile. ; and set the turn-on unit of the turn-on beam on the outside of the turn-on area according to the minimum exposure unit to correct the exposure image data, so that the difference area surrounded by the outer edge of the turn-on area and the cumulative intensity profile becomes Small.

一種圖案曝光裝置,基於曝光圖像資料,對光束進行接通或斷開控制之同時進行掃描,並於曝光面上描繪圖案,該圖案曝光裝置的特徵為,具備校正前述曝光圖像資料之資料校正部,該資料校正部具備如下運算處理部:於前述曝光面上劃分光束的最小曝光單位,以前述最小曝光單位的集合特定前述曝光圖像資料中校正所需要的光束的接通區域;按前述接通區域內的最小曝光單位累積前述光束的強度分佈,並求出前述接通區域內 的累積強度分佈;對前述累積強度分佈與所設定之閾值進行比較而求出於前述曝光面上連結前述累積強度分佈與前述閾值一致之點而成之輪廓來作為累積強度輪廓;及於前述接通區域的外側按前述最小曝光單位設定接通光束之接通單位來校正前述曝光圖像資料,以使被前述接通區域的外緣和前述累積強度輪廓包圍之差分面積變小。 A pattern exposure device, based on exposure image data, scans the light beam while on or off control, and draws a pattern on the exposure surface, the pattern exposure device is characterized in that it has data for correcting the exposure image data. a correction unit, the data correction unit is provided with the following arithmetic processing unit: dividing the minimum exposure unit of the light beam on the exposure surface, and specifying the connected area of the light beam required for correction in the exposure image data by the set of the minimum exposure unit; The minimum exposure unit in the above-mentioned turn-on area accumulates the intensity distribution of the above-mentioned light beam, and obtains the above-mentioned turn-on area The cumulative intensity distribution of the above-mentioned cumulative intensity distribution is compared with the set threshold value to obtain the contour formed by connecting the above-mentioned cumulative intensity distribution and the above-mentioned threshold value on the above-mentioned exposure surface as the cumulative intensity contour; The outside of the pass-through area is set to the minimum exposure unit to set the pass-on unit of the pass-on beam to correct the exposure image data, so that the difference area surrounded by the outer edge of the pass-through area and the cumulative intensity profile becomes smaller.

1:圖案曝光裝置 1: Pattern exposure device

2:光照射部 2: Light irradiation part

3:掃描部 3: Scanning section

4:平台 4: Platform

5:控制部 5: Control Department

6:資料校正部 6: Data Correction Department

AIP:累積強度輪廓 AIP: Cumulative Intensity Profile

D:差分面積 D: Differential area

e:最小曝光單位 e: Minimum exposure unit

G1,G2,G3:接通單位 G1, G2, G3: On unit

h:突出量 h: amount of protrusion

L:最短距離 L: shortest distance

Lmax:最大值 L max : maximum value

me:誤差 me: error

S1,S0:邊緣 S1, S0: Edge

t:點 t: point

W:工件 W: workpiece

圖1係對本發明的課題進行說明之說明圖(圖1(a)表示曝光的最小單位和曝光圖像資料的邊緣,圖1(b)表示圖1(a)的A1-A2之間的光束的強度分佈。)。 1 is an explanatory diagram for explaining the subject of the present invention (FIG. 1(a) shows the minimum unit of exposure and the edge of the exposed image data, FIG. 1(b) shows the light beam between A1-A2 of FIG. 1(a) intensity distribution.).

圖2係對本發明的實施形態之圖案曝光方法進行說明之說明圖。 It is explanatory drawing explaining the pattern exposure method concerning embodiment of this invention.

圖3係對本發明的實施形態之圖案曝光方法進行說明之說明圖。 FIG. 3 is an explanatory diagram for explaining the pattern exposure method according to the embodiment of the present invention.

圖4係對本發明的實施形態之圖案曝光方法進行說明之說明圖。 FIG. 4 is an explanatory diagram for explaining a pattern exposure method according to an embodiment of the present invention.

圖5係表示本發明的實施形態之圖案曝光方法的處理算法之流程圖。 5 is a flowchart showing a processing algorithm of the pattern exposure method according to the embodiment of the present invention.

圖6係表示本發明的實施形態之圖案曝光裝置之說明圖。 It is explanatory drawing which shows the pattern exposure apparatus which concerns on embodiment of this invention.

以下,參閱圖式對本發明的實施形態進行說明。圖2中示出圖案曝光方法,該圖案曝光方法中,基於曝光圖像資料對光束進行接通或斷開控制之同時進行掃描,並於曝光面上描繪圖案。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 2 shows a pattern exposure method in which a pattern is drawn on an exposure surface while scanning is performed while on or off control of a light beam is performed based on exposure image data.

圖示的網格線劃分能夠控制的光束的最小曝光單位e。此處的最小曝光單位e依據掃描間距或光調製陣列、光源陣列的陣列間隔而適當設定。 曝光圖像資料能夠以最小曝光單位的集合特定光束的接通區域,於圖示的例中,粗線的內側成為依據曝光圖像資料特定之光束的接通區域,圖示的粗線的外側成為光束的斷開區域。 The illustrated grid lines divide the minimum exposure unit e of the light beam that can be controlled. The minimum exposure unit e here is appropriately set according to the scanning pitch, the light modulation array, and the array interval of the light source array. Exposure image data can be combined with a minimum exposure unit to specify the beam-on area. In the example shown in the figure, the inner side of the thick line becomes the beam-on area specified according to the exposure image data, and the outer side of the thick line in the illustration becomes the break area of the beam.

如圖2所示,當作為最小曝光單位的集合而特定於曝光圖像資料中校正所需要的光束的接通區域時,若按接通區域內的最小曝光單位e累積光束的強度分佈,並求出接通區域內的累積強度分佈,則能夠得到如圖1(b)所示的累積強度分佈。 As shown in Fig. 2, when the set of minimum exposure units is specific to the ON area of the light beam required for correction in the exposure image data, if the intensity distribution of the light beam is accumulated according to the minimum exposure unit e in the ON area, and By obtaining the cumulative intensity distribution in the ON region, the cumulative intensity distribution shown in Fig. 1(b) can be obtained.

而且,相對於該累積強度分佈,如圖1(b)所示,設定特定的閾值Et,並對累積強度分佈與所設定之閾值Et進行比較而求出於曝光面上連結累積強度分佈與閾值Et一致之點而成之輪廓來作為累積強度輪廓(Accumulated Intensity Profile,AIP)。關於累積強度輪廓,若將閾值Et設為抗蝕劑的顯影閾值,則成為模擬顯影圖案的輪廓。 Then, as shown in FIG. 1(b), a specific threshold value Et is set for this cumulative intensity distribution, and the cumulative intensity distribution and the set threshold value Et are compared to obtain a connection between the cumulative intensity distribution and the threshold value on the exposure surface. The contour formed by the consistent points of Et is used as the Accumulated Intensity Profile (AIP). As for the cumulative intensity profile, if the threshold value Et is set as the development threshold value of the resist, the profile of the simulated development pattern is obtained.

本發明的實施形態之圖案曝光方法中,導入前述之累積強度輪廓的概念來校正曝光圖像資料,以使累積強度輪廓接近曝光圖像資料的輪廓。具體而言,於接通區域的外側按最小曝光單位e設定接通光束之接通單位,以使被曝光圖像資料中接通區域的外緣(圖2的粗線)和累積強度輪廓(圖2的單點虛線)包圍之差分面積D變小之方式。 In the pattern exposure method of the embodiment of the present invention, the concept of the cumulative intensity profile described above is introduced to correct the exposure image data, so that the cumulative intensity profile is close to the profile of the exposure image data. Specifically, the turn-on unit of the turn-on beam is set according to the minimum exposure unit e outside the turn-on area, so that the outer edge of the turn-on area (the thick line in FIG. 2 ) and the cumulative intensity profile ( The way in which the differential area D enclosed by the single-dot dashed line in FIG. 2 becomes smaller.

如圖2所示,當於曝光圖像資料中平面角部的附近設定了接通單位G1時,若於附加了接通單位G1之接通區域求出累積強度分佈,且從該累積 強度分佈求出累積強度輪廓,則累積強度輪廓會接近校正前的曝光圖像資料的輪廓,且差分面積D會減少。 As shown in FIG. 2, when the on-unit G1 is set near the corner of the plane in the exposure image data, if the cumulative intensity distribution is obtained in the on-region to which the on-unit G1 is added, and from the cumulative intensity distribution If the cumulative intensity profile is obtained from the intensity distribution, the cumulative intensity profile will be close to the profile of the exposure image data before correction, and the difference area D will be reduced.

以下,對於曝光圖像資料中接通區域的外側的哪一位置設定接通單位之具體的步驟進行說明。 Hereinafter, a specific procedure for setting the turn-on unit at the position outside the turn-on area in the exposure image data will be described.

首先,於曝光面上特定X-Y坐標,並求出曝光圖像資料的輪廓上的坐標(X0、Y0)和累積強度輪廓上的坐標(X1、Y1)。而且,求出曝光圖像資料的輪廓上的1點至累積強度輪廓上的任意的點為止的距離中的最短距離L。而且,於需要校正之範圍內任意移動曝光圖像資料的輪廓上的點,於各點求出至累積強度輪廓為止的最短距離L,並特定該最短距離L成為最大值Lmax之曝光圖像資料的輪廓上的點t。如圖2所示,當曝光圖像資料具有平面角部時,如前述進行了特定之曝光圖像資料的輪廓上的點t成為平面角部的頂點。 First, the XY coordinates are specified on the exposure surface, and the coordinates (X0, Y0) on the contour of the exposure image data and the coordinates (X1, Y1) on the contour of the accumulated intensity are obtained. Then, the shortest distance L among the distances from one point on the contour of the exposure image data to any point on the contour of the accumulated intensity is obtained. Then, the points on the contour of the exposure image data are arbitrarily moved within the range to be corrected, the shortest distance L to the cumulative intensity contour is obtained at each point, and the exposure image at which the shortest distance L becomes the maximum value Lmax is specified. Point t on the profile of the data. As shown in FIG. 2, when the exposed image data has a flat corner, the point t on the outline of the exposed image data specified as described above becomes the vertex of the flat corner.

於如此求出之曝光圖像資料的輪廓上的點t的外側附近設定前述之接通單位。此時,臨時設定接通單位,並僅於臨時設定之接通單位所影響之區域重新求出累積強度輪廓,當相對於臨時設定接通單位之前的累積強度輪廓中的差分面積D,臨時設定之後的差分面積D變小時,確定臨時設定之接通單位的設定。如圖3所示,將接通單位依序設定為G1、G2、G3時,於接通單位的位置的臨時設定中確定差分面積D變小,當差分面積D未變小時,不進行設定而於其他位置進行臨時設定。 The aforementioned turn-on unit is set in the vicinity of the outer side of the point t on the outline of the exposure image data thus obtained. At this time, the switch-on unit is temporarily set, and the cumulative intensity profile is recalculated only in the area affected by the temporarily-set switch-on unit. After the difference area D becomes smaller, the setting of the temporarily set ON unit is determined. As shown in FIG. 3 , when the turn-on units are sequentially set to G1, G2, and G3, the difference area D is determined to become smaller in the temporary setting of the position of the turn-on unit. When the difference area D does not become smaller, no setting is made and Temporary settings in other locations.

又,如圖4所示,將接通單位依序設定為G1、G2、G3時,前述之差分面積D變小,但有時累積強度輪廓突出於初始的接通區域的外緣的外側。當欲積極避免該突出時,藉由計算求出累積強度輪廓突出於初始的接通區域的外緣的外側之突出量h,從而還能夠臨時設定接通單位的位置,以便抑制該突出量h。 As shown in FIG. 4 , when the turn-on units are sequentially set to G1, G2, and G3, the aforementioned difference area D becomes small, but the cumulative intensity profile may protrude outside the outer edge of the initial turn-on area. When it is desired to actively avoid the protrusion, by calculating the protrusion amount h by which the cumulative intensity profile protrudes outside the outer edge of the initial ON region, the position of the ON unit can be temporarily set to suppress the protrusion amount h. .

圖5中示出按照前述之步驟進行曝光圖像資料的校正之處理算法的一例。於開始之後的步驟S1中,獲取所輸入之曝光圖像資料。於下一步驟S2中,如前述,求出曝光圖像資料的接通區域的累積強度分佈。於下一步驟S3中,如前述,特定閾值Et,並求出校正對象區域的累積強度輪廓。於下一步驟S4中,如前述,於需要校正之範圍內任意移動曝光圖像資料的輪廓上的點,於各點求出至累積強度輪廓為止的最短距離L,並特定該最短距離L成為最大值Lmax之曝光圖像資料的輪廓上的點t。 FIG. 5 shows an example of a processing algorithm for correcting exposure image data in accordance with the aforementioned steps. In step S1 after the start, the input exposure image data is acquired. In the next step S2, as described above, the cumulative intensity distribution of the ON region of the exposed image data is obtained. In the next step S3, as described above, the threshold value Et is specified, and the cumulative intensity profile of the correction target region is obtained. In the next step S4, as mentioned above, the points on the contour of the exposure image data are arbitrarily moved within the range to be corrected, the shortest distance L to the cumulative intensity contour is obtained at each point, and the shortest distance L is specified as The point t on the contour of the exposed image data of the maximum value Lmax .

於下一步驟S5中,於曝光圖像資料的輪廓上的點t的外側附近臨時設定前述之接通單位。而且於下一步驟S6中,將臨時設定之接通單位附加於曝光圖像資料的接通區域,並重新求出校正對象區域的累積強度輪廓。 In the next step S5, the aforementioned ON unit is temporarily set in the vicinity of the outer side of the point t on the outline of the exposed image data. Then, in the next step S6, the temporarily set ON unit is added to the ON region of the exposure image data, and the cumulative intensity profile of the correction target region is newly obtained.

而且,於之後的步驟S7中,對從臨時設定接通單位之前的累積強度輪廓求出之差分面積D與從臨時設定接通單位之後重新求出之累積強度輪廓求出之差分面積D進行比較,從而進行從重新求出之累積強度輪廓求出之差分面積D是否變小之判斷。當未變小時(當為“否”時),取消臨時設定而進入到步驟S10,並進行是否臨時設定其他的接通單位之判斷。 Then, in the subsequent step S7, the difference area D obtained from the cumulative intensity profile before the temporary setting of the ON unit is compared with the difference area D obtained from the cumulative intensity profile newly obtained after the temporary setting of the ON unit , so as to judge whether the difference area D obtained from the newly obtained cumulative intensity profile becomes smaller. If it does not become smaller (in the case of "NO"), the temporary setting is canceled, and the process proceeds to step S10, and it is judged whether or not another ON unit is temporarily set.

當於步驟S7中,從重新求出之累積強度輪廓求出之差分面積D變得比之前的差分面積D小時(當為“是”時),接著進行基於重新求出之累積強度輪廓的前述之突出量h是否係容許範圍之判斷(能夠設定此處的容許範圍係零之情況。)。而且,當突出量h超出容許範圍時(當為“否”時),取消臨時設定而進入到步驟S10,並進行是否臨時設定其他的接通單位之判斷。 In step S7, when the difference area D obtained from the newly obtained cumulative intensity profile becomes smaller than the previous difference area D (in the case of "Yes"), the above-mentioned calculation based on the newly obtained cumulative intensity profile is then performed. Judgment of whether the protrusion amount h is within the allowable range (the allowable range here can be set to be zero.). Then, when the protrusion amount h exceeds the allowable range (in the case of NO), the temporary setting is canceled, and the process proceeds to step S10, and it is determined whether or not another ON unit is temporarily set.

而且,當於步驟S8中,基於重新求出之累積強度輪廓的突出量h係容許範圍時(當為“是”時),於步驟S9中,確定之前臨時設定之接通單位的設定而進入到步驟S10,並進行是否臨時設定其他的接通單位之判斷。 Then, in step S8, when the protrusion amount h based on the newly obtained cumulative intensity profile is within the allowable range (if "Yes"), in step S9, the setting of the previously temporarily set ON unit is determined and the process is entered. Going to step S10, it is judged whether or not to temporarily set other on-units.

於步驟10中,當臨時設定其他的接通單位時(當為“是”時),返回到步驟S5,於點t的附近臨時設定新的接通單位,並如前述依序執行步驟S6以後的處理。於步驟10中,當未臨時設定其他的接通單位時(當為“否”時),進行將至此所確定之所有的接通單位附加於曝光圖像資料的接通區域之曝光圖像資料的校正,並結束處理。 In step 10, when another on-unit is temporarily set (if "Yes"), the process returns to step S5, a new on-unit is temporarily set in the vicinity of point t, and steps S6 and later are performed in sequence as described above. processing. In step 10, when other on-units are not temporarily set (when "No"), add all the on-units determined so far to the exposure image data of the on-region of the exposure image data correction, and the process ends.

於步驟10中,是否臨時設定其他的接通單位之判斷中,對之前求出之差分面積D充分變小(例如,成為某一設定值以下)之情況、步驟S7中的“否”多次連續等,無法發現減小之前求出之差分面積D之接通單位之情況等進行“否”的判斷。 In step 10, in the judgment of whether to temporarily set another ON unit, if the difference area D obtained before is sufficiently small (for example, it becomes less than a certain set value), "NO" in step S7 is repeated several times. If it is continuous, etc., if the ON unit of the difference area D obtained before cannot be found to be reduced, a judgment of “NO” is made.

此外,圖5的例中,特定點t時示出求出Lmax之例,但並不限定於此, 亦可以首先特定曝光圖像資料的輪廓上的任意的點,並執行步驟S5至S10,之後(當步驟S10為“否”時),依序移動點而進行相同的處理。 In addition, in the example of FIG. 5, the example of obtaining Lmax is shown when the point t is specified, but it is not limited to this, and it is also possible to specify an arbitrary point on the outline of the exposure image data first, and then execute steps S5 to S10 , and thereafter (when step S10 is "NO"), the points are sequentially shifted to perform the same process.

圖6中示出執行前述之圖案曝光方法之圖案曝光裝置的構成例。圖案曝光裝置1具備於工件W的曝光面上照射光束Lb之光照射部2、沿特定方向對支撐工件W之平台4進行掃描之掃描部3及控制光照射部2及掃描部3之控制部5。而且,向控制部5輸入曝光圖像資料時,設置資料校正部6,且將經由該資料校正部6而校正之曝光圖像資料輸入到控制部5。 FIG. 6 shows a configuration example of a pattern exposure apparatus that executes the above-described pattern exposure method. The pattern exposure apparatus 1 includes a light irradiation unit 2 that irradiates the light beam Lb on the exposure surface of the workpiece W, a scanning unit 3 that scans a table 4 supporting the workpiece W in a specific direction, and a control unit that controls the light irradiation unit 2 and the scanning unit 3 5. Then, when the exposure image data is input to the control unit 5 , a data correction unit 6 is provided, and the exposure image data corrected by the data correction unit 6 is input to the control unit 5 .

控制部5進行如下控制,亦即基於經校正之曝光圖像資料對光束Lb進行接通或斷開控制之同時進行掃描,並於工件W的曝光面上描繪圖案。在此,圖示了對工件W進行掃描之掃描部3,但亦可以固定平台4而設置對光照射部2進行掃描之掃描部。 The control unit 5 performs control to draw a pattern on the exposure surface of the workpiece W while scanning on or off the light beam Lb based on the corrected exposure image data. Here, although the scanning part 3 which scans the workpiece|work W is shown in figure, the table 4 may be fixed, and the scanning part which scans the light irradiation part 2 may be provided.

資料校正部6具備用於進行前述之圖案曝光方法中的曝光圖像資料的校正之運算處理部。於曝光處理之前進行該等曝光圖像資料的校正,藉此於無遮罩曝光中,能夠以良好的精度形成被微細化之圖案。 The data correction unit 6 includes an arithmetic processing unit for performing correction of the exposure image data in the above-described pattern exposure method. Correction of the exposure image data is performed before the exposure process, whereby in the maskless exposure, a patterned pattern can be formed with good precision.

AIP:累積強度輪廓 AIP: Cumulative Intensity Profile

D:差分面積 D: Differential area

e:最小曝光單位 e: Minimum exposure unit

G1:接通單位 G1: Turn-on unit

L:最短距離 L: shortest distance

Lmax:最大值 L max : maximum value

Claims (6)

一種圖案曝光方法,其特徵在於,其係基於曝光圖像資料對光束進行接通或斷開控制並進行掃描,而於曝光面上描繪圖案者,且具備如下步驟: 於前述曝光面上劃分光束的最小曝光單位,以前述最小曝光單位的集合,特定出前述曝光圖像資料中之校正所需光束的接通區域; 按前述接通區域內的最小曝光單位累積前述光束的強度分佈,求出前述接通區域內的累積強度分佈; 對前述累積強度分佈與所設定之閾值進行比較,求出於前述曝光面上將前述累積強度分佈與前述閾值一致之點連成之輪廓作為累積強度輪廓;及 於前述接通區域的外側按前述最小曝光單位設定接通光束之接通單位來校正前述曝光圖像數據,以使被前述接通區域的外緣和前述累積強度輪廓包圍之差分面積變小。A pattern exposure method is characterized in that, based on exposure image data, the light beam is controlled on or off and scanned, and a pattern is drawn on the exposure surface, and the method includes the following steps: dividing the light beam on the exposure surface The minimum exposure unit of the above-mentioned minimum exposure unit is used to specify the connection area of the light beam required for correction in the above-mentioned exposure image data; according to the minimum exposure unit in the above-mentioned connection area, the intensity distribution of the above-mentioned light beam is accumulated to obtain The cumulative intensity distribution in the above-mentioned turn-on area; the above-mentioned cumulative intensity distribution is compared with the set threshold value, and the contour formed by connecting the above-mentioned cumulative intensity distribution and the above-mentioned threshold value on the above-mentioned exposure surface is obtained as the cumulative intensity contour; and setting the turn-on unit of the turn-on beam on the outside of the turn-on area according to the minimum exposure unit to correct the exposure image data so that the difference area surrounded by the outer edge of the turn-on area and the cumulative intensity profile becomes smaller . 如請求項1之圖案曝光方法,其中 將前述接通單位設定在前述曝光圖像資料中之平面角部的附近。The pattern exposure method as claimed in claim 1, wherein said turn-on unit is set in the vicinity of a corner of a plane in said exposed image data. 如請求項1之圖案曝光方法,其中 臨時設定前述接通單位,僅於臨時設定之前述接通單位所影響之區域新求出前述累積強度輪廓,當前述差分面積變小之情形時,確定臨時設定之前述接通單位的設定。The pattern exposure method of claim 1, wherein the on-unit is temporarily set, the cumulative intensity profile is newly obtained only in the area affected by the temporarily-set on-unit, and when the difference area becomes smaller, the temporary The setting of the aforementioned turn-on unit of the setting. 如請求項2之圖案曝光方法,其中 臨時設定前述接通單位,僅於臨時設定之前述接通單位所影響之區域新求出前述累積強度輪廓,當前述差分面積變小之情形時,確定臨時設定之前述接通單位的設定。The pattern exposure method of claim 2, wherein the on-unit is temporarily set, the cumulative intensity profile is newly obtained only in the area affected by the temporarily-set on-unit, and when the difference area becomes smaller, the temporary The setting of the aforementioned turn-on unit of the setting. 如請求項1至4中任一項之圖案曝光方法,其中 前述接通單位係設定成抑制前述累積強度輪廓突出於前述接通區域的外緣的外側之突出量。The pattern exposure method according to any one of claims 1 to 4, wherein the on-unit is set to suppress the protruding amount of the cumulative intensity profile beyond the outer edge of the on-region. 一種圖案曝光裝置,其特徵在於,其係基於曝光圖像資料對光束進行接通或斷開控制並進行掃描,而於曝光面上描繪圖案者,且 具備校正前述曝光圖像資料之資料校正部, 該資料校正部具備如下之運算處理部: 於前述曝光面上劃分光束的最小曝光單位,以前述最小曝光單位的集合,特定出前述曝光圖像資料中之校正所需光束的接通區域; 按前述接通區域內的最小曝光單位累積前述光束的強度分佈,求出前述接通區域內的累積強度分佈; 對前述累積強度分佈與所設定之閾值進行比較,求出於前述曝光面上將前述累積強度分佈與前述閾值一致之點連成之輪廓作為累積強度輪廓;及 於前述接通區域的外側按前述最小曝光單位設定接通光束之接通單位來校正前述曝光圖像數據,以使被前述接通區域的外緣和前述累積強度輪廓包圍之差分面積變小。A pattern exposure apparatus, characterized in that it controls on or off a light beam based on exposure image data and scans, and draws a pattern on an exposure surface, and is provided with a data correction section for correcting the exposure image data , the data correction unit is provided with the following arithmetic processing unit: dividing the minimum exposure unit of the light beam on the exposure surface, and using the set of the minimum exposure unit to specify the connected area of the light beam required for correction in the exposure image data; Accumulate the intensity distribution of the light beam in the minimum exposure unit in the above-mentioned turn-on area, and obtain the cumulative intensity distribution in the above-mentioned turn-on area; compare the above-mentioned cumulative intensity distribution with the set threshold, and obtain the The contour formed by the points where the aforementioned cumulative intensity distribution is consistent with the aforementioned threshold value is used as the cumulative intensity profile; and on the outside of the aforementioned switching region, the switching unit of the switching beam is set according to the aforementioned minimum exposure unit to correct the aforementioned exposure image data, so that the aforementioned exposure image data is corrected. The differential area enclosed by the outer edge of the aforementioned on-region and the aforementioned cumulative intensity profile becomes smaller.
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