TWI761564B - Manufacturing method of electromagnet assembly - Google Patents

Abstract

Provided is a method for preparing an electromagnet assembly, which may include the following steps: preparing a frame including a protruding part and a peripheral part surrounding the protruding part; disposing a coil on the outer periphery of the protruding part to cover the protruding part; heating a thermally conductive substance in a solid state under normal pressure to change it into a liquid state; filling the thermally conductive substance in a liquid state into a space between the protruding portion and the peripheral portion; and after the step of filling, A permanent magnet is arranged in the center of the coil.

Description

Preparation method of electromagnet assembly

The following description relates to a method of manufacturing an electromagnet assembly, for example, to a method of manufacturing an electromagnet assembly used in a magnetron sputtering device.

The sputtering device is, for example, a device that vapor-deposits a thin film on a substrate when manufacturing semiconductors, FPDs (LCD, OLED, etc.) or solar cells. In addition, the sputtering device can also be used in a roll to roll device.

One of the sputtering units, a magnetron sputtering unit, can use inline or cluster systems for evaporating thin films on large-area substrates. In an inline and cluster system, a plurality of processing chambers are arranged between the loading chamber and the unloading chamber, and the substrates loaded into the loading chamber pass through the plurality of processing chambers, and perform continuous processes at the same time. In the inline and cluster system, the sputtering device is arranged in at least one processing chamber, and the magnet units are arranged at a certain interval.

However, due to the magnet unit, there is a fixed magnetic field, so the erosion of the object surface is determined according to the plasma density of the electric and magnetic fields. In particular, the edge of the magnet unit, that is, the region adjacent to at least one end in the longitudinal direction, is applied with ground potential, so the plasma density at the edge of the substrate is higher than that in other regions, and thus the edge of the object is sputtered faster than other regions. faster. Therefore, the thickness distribution of the vapor-deposited film on the substrate is not uniform, and the film quality distribution is reduced. Due to the difference in plasma density, certain parts of the object are excessively eroded, and the efficiency of the object is reduced.

To solve the above problem, one approach is to use an object whose edge is thicker than the central portion. In order to manufacture the object, additional processes such as grinding the central portion of the flat object to reduce the thickness are required, and the flat object must be processed. However, due to the processing of the flat object, material loss and additional process costs will occur. In addition, problems such as the object being damaged may also occur in the process of processing the object.

As other methods to solve the problem, it also includes: using shunt to adjust the magnetic field strength on the surface of the object, using distance adjustment means to adjust the distance between the magnet and the object, or adding a method to the edge of the magnet The method of the Z motor, etc. However, these methods all need to increase the manufacturing cost, manually adjust the magnetic field strength, and the magnetic field strength cannot be adjusted locally, and have problems that repeated operations are required many times, and the operation time is long.

As yet another method, a coil formed of permanent magnets and wires crimped thereon is used to provide a structure capable of locally adjusting the magnetic field. In this case, in order to generate a strong magnetic field, many wires need to be wound to increase the amount of current passing through the coil, thereby increasing the magnetic field, but this method has a problem of being difficult to use in a field where the product size is limited. In addition, although a method of increasing the magnetic field by increasing the current through the coil can be used, there is a problem that the heat generated by the larger amount of current needs to be solved. For example, due to high heat, the magnetism of the permanent magnets is reduced, or the iron plate on which the permanent magnets are mounted is bent. To solve these problems, fluids such as water, oil, or air can be used as refrigerants, but water has the risk of inducting electric current in high-current electromagnets, and oil has the risk of contaminating devices operating in a vacuum environment. problem, and the air has the problem that the heat capacity is small and it is difficult to remove the heat sufficiently. In addition, although heat can be removed by using a heat dissipation structure such as a thermoelectric element or a heat pipe, in this case, the structure becomes more complicated, and the volume and manufacturing cost of the entire device are increased. Line contact or point contact is mostly formed between the coil and the heat dissipation structure, so there is a problem that the limitation of the contact area cannot be overcome

The above-mentioned background art is kept or acquired by the inventor in the process of exporting the present invention, and cannot be regarded as the known art disclosed to the general public before the application of the present invention.

technical issues

An object of one embodiment is to provide a method of manufacturing an electromagnet assembly to efficiently release heat while having high magnetic force.

An object of one embodiment is to provide a method of fabricating an electromagnet assembly for a magnetron sputtering device to locally adjust the magnetic field.

Technical solutions

According to one embodiment, a method of manufacturing an electromagnet assembly may include the steps of: preparing a frame including a protruding portion and a peripheral portion surrounding the protruding portion; disposing a coil on the outer periphery of the protruding portion to cover the protruding portion; heating a thermally conductive substance in a solid state under normal temperature and normal pressure to change it into a liquid state; filling the thermally conductive substance in a liquid state into a space between the protruding portion and the peripheral portion; and in the step of filling After that, a permanent magnet is arranged at the center of the coil.

The method for preparing the electromagnet assembly may further include the following steps: after the step of filling and before the step of arranging the permanent magnets, cooling the heat-conducting substance in a liquid state into a solid state, thereby generating a heat-conducting medium.

The volume occupied by the thermally conductive medium may be 1/2 or less of the space between the permanent magnet and the peripheral portion.

The thermally conductive substance may be a low melting point metal whose melting point may be 100 degrees (° C.) to 400 degrees.

The thermally conductive material may be composed of any one or more of indium, lead, and plastic-based thermally conductive media.

The peripheral portion can be made of non-magnetic heat dissipation material.

The permanent magnets can be formed of any one or more of neodymium and ferrite.

Wherein the preparation method of the electromagnet assembly may further include the following step: before the filling step or at the same time as the filling step, heating the frame.

The step of configuring the coil may include the step of inserting a preconfigured coil to the outer periphery of the protrusion.

A permanent magnet accommodating space for accommodating the permanent magnet may be formed inside the protruding portion.

The frame may be integrally formed by using aluminum or copper material.

The frame may include: a peripheral frame including the peripheral portion; and a plastic frame including the protrusion and separable from the peripheral frame.

The step of preparing the frame may include the step of bonding the molding frame to the peripheral frame, and the method of preparing the electromagnet assembly may further include the step of configuring the The molding frame is removed from the perimeter frame prior to the step of permanent magnets.

The electromagnet assembly may include a refrigerant flow path that induces the refrigerant to absorb heat generated in the coil and discharge it to the outside.

According to one embodiment, a method of manufacturing an electromagnet assembly may include the steps of: preparing a frame including a protruding portion and a peripheral portion surrounding the protruding portion; disposing a coil on the outer periphery of the protruding portion to cover the protruding portion; Under normal temperature and normal pressure, heat the thermally conductive substance in a solid state at a temperature below 200 degrees (°C) to change it into a liquid state; fill the thermally conductive substance in a liquid state into the space between the protruding portion and the peripheral portion. space; and a permanent magnet made of ferrous material is arranged in the center of the coil.

According to one embodiment, a method of manufacturing an electromagnet assembly for a magnetron sputtering device may include the steps of: preparing a frame including a plurality of protrusions and a peripheral portion surrounding the plurality of protrusions; The protrusions are respectively equipped with a plurality of coils; the heat conduction material in a solid state is heated under normal temperature and pressure to change it into a liquid state; the heat conduction material in the liquid state is filled between the plurality of protrusions and the peripheral part. and after the step of filling, disposing a plurality of permanent magnets at the centers of the plurality of coils, respectively.

The step of arranging the plurality of permanent magnets, respectively, may include the step of arranging two adjacent permanent magnets in at least a part of the plurality of permanent magnets with opposite polarities.

The electromagnet assembly for a magnetron sputtering device may include: a conductor installed with the two adjacent permanent magnets to effectively form magnetic lines of force between the two adjacent permanent magnets.

Among the plurality of permanent magnets, the size of the permanent magnets located at the peripheral portions on both sides may be smaller than the size of the permanent magnets located at the center.

Among the plurality of coils, the number of turns of the coils located at the peripheral portions on both sides may be smaller than the number of turns of the coils located at the center.

technical effect

According to one embodiment, since heat is not applied to the permanent magnet in the process of forming the cooling means, the problem that the permanent magnetic force is reduced can be prevented while the electromagnet can be effectively cooled.

According to one embodiment, the magnetic fields generated in each part of the electromagnet for the magnetron sputtering device have different strengths, so that local excessive erosion of the object can be prevented, and the service life of the object can be effectively prolonged, so that the sputtering can be reduced maintenance costs of the launcher.

Hereinafter, the embodiments will be described in detail with reference to the exemplary drawings. Reference numerals are added to the constituent elements in each drawing, and it should be noted that the same reference numerals are used as much as possible even if the same constituent elements are shown in other drawings. In addition, in the description of the embodiment, when the specific description of the related known technology or performance is judged to obscure the description of the embodiment, the detailed description is omitted.

In addition, when describing the structural elements of the embodiment, terms such as first, second, A, B, (a), (b) may be used. This term is only used to distinguish this structural element from other structural elements. The terms do not limit the nature of the corresponding structural elements, or the order or sequence, or the like. When some structural elements are described as "connected", "combined" or "connected" with other structural elements, the structural elements can be directly connected or connected with other structural elements, or can be understood as "connection" between structural elements ", "join" or "access" have other structural elements.

Structural elements included in any one embodiment and structural elements having a common function are also described using the same names in other embodiments. In the case where there is no contrary description, the descriptions described in any one embodiment can also be applied in other embodiments, and specific descriptions are omitted within the overlapping range.

FIG. 1 is a conceptual diagram of a magnetron sputtering apparatus according to one embodiment.

Referring to FIG. 1 , according to a magnetron sputtering apparatus 1 of an embodiment, a technique can be used to inject gas into a vacuum chamber to generate plasma, and make it with the object T containing the object substance to be evaporated ionized gas particles collision, and then the collision sputtered particles are evaporated on a target O such as a substrate. The magnetron sputtering device 1 can prepare a thin film at a relatively low temperature, and ions accelerated by a magnetic field are densely vapor-deposited on the substrate, which has the advantage of a faster evaporation rate.

The magnetron sputtering apparatus 1 may include an electromagnet assembly 11 due to the formation of magnetic lines of force on the object T. The electromagnet assembly 11 may be disposed behind the object T with respect to the target O. That is, the target O may be located in front of the object T (on the right side based on FIG. 1 ), and the electromagnet assembly 11 may be located behind the object T (on the left side based on FIG. 1 ).

The electromagnet assembly 11 may include: a magnetic field generating unit M for generating a magnetic field; and a refrigerant inflow line L_in and a refrigerant outflow line L_out for introducing the refrigerant, absorbing heat generated in the magnetic field generating unit M and discharging it to the outside. The electromagnet assembly 11 will be described below by way of example. Meanwhile, the electromagnet assembly 11 described below is not limited to the electromagnet assembly used in the magnetron sputtering apparatus.

2 is a perspective view of an electromagnet assembly according to one embodiment, and FIG. 3 is an exploded perspective view of the electromagnet assembly according to one embodiment.

Referring to FIG. 2 or FIG. 3 , the electromagnet assembly 21 according to one embodiment may include a magnetic field generating unit M, a heat sink 213 , a heat conduction medium 214 and a cooling plate 215 .

The magnetic field generating unit M may include a coil 212 configured to cover the permanent magnet 211 and the periphery of the permanent magnet 211 . For convenience of explanation, the external power supply for applying power to the coil 212 is omitted here. According to the structure as described above, the magnitude of the magnetic field generated in the magnetic field generating unit M can be adjusted by changing the number of turns of the coil 212 or controlling the magnitude of the current or voltage applied to the coil 212 . In addition, since the permanent magnet 211 does not need to excessively increase the current or voltage applied to the coil 212 in order to generate a magnetic field of a specific value, it is possible to save energy. In other words, the level of current or voltage applied in the coil 212 is lowered, so that the heat generated through the coil 212 can be reduced, and as a result, the cooling amount of the cooling means for discharging the heat generated in the coil 212 to the outside is reduced, Therefore, the equipment can be simplified, the energy consumed for cooling can be saved, and the energy efficiency of the electromagnet assembly 21 can be improved.

For example, the permanent magnet 211 may be formed of neodymium (Nd) or ferrite.

In addition, permanent magnets have a problem of reduced magnetism when they are operated in a high temperature environment. In the case of neodymium magnets in particular, they have very excellent magnetic characteristics among commonly sold magnets and can effectively generate a strong magnetic field, but due to defects in thermal tools, permanent magnetization may occur at temperatures above about 80 degrees Celsius. The problem of reduced magnetism, therefore, needs to be designed so that the heat generated in the coil 212 can be sufficiently discharged. Referring to FIGS. 4 , 9 and 10 , the above-mentioned problems can be solved according to the method of manufacturing the electromagnet assembly 21 to be described later.

In addition, the permanent magnet 211 does not necessarily have to be formed of neodymium or ferrite, and may be formed of other materials. In addition, the permanent magnet 211 may be formed of, for example, any one or more of neodymium and ferrite.

For example, the coil 212 may be formed of a wire coated with an insulating substance, so that the current flowing through the coil 212 can be prevented from being transmitted to the outside through the thermally conductive medium 214 .

The heat sink 213 can support at least one side of the magnetic field generating unit M as a structure for radiating heat generated in the magnetic field generating unit M to the outside. For example, the heat sink 213 may include a bobbin 2132, a peripheral portion 2131 surrounding the bobbin 2132, a coil accommodating space 2133 disposed between the peripheral portion 2131 and the bobbin 2132 for accommodating the coil 212, and the bobbin The interior of the barrel 2132 is used for a permanent magnet accommodating space 2134 for accommodating the permanent magnet 211 . For example, the peripheral portion 2131 may be formed of a non-magnetic heat-dissipating material with high thermal conductivity, such as aluminum or copper. For example, the heat sink 213 including the peripheral portion 2131 and the wire barrel 2132 may be integrally formed.

In addition, as described later with reference to FIGS. 4 and 5 , the heat sink 213 and the bobbin 2132 may be referred to as a “frame” and a “protrusion”, respectively.

In addition, as described later with reference to FIGS. 6 to 10 , if a protrusion is included in the molding frame 316 to perform a temporary bobbin function, the bobbin 2132 may be omitted in the heat sink 213 .

The thermally conductive medium 214 may fill the gap space between the coil 212 and the peripheral portion 2131 . Since the wire is repeatedly crimped for many times, the prepared coil 212 can accurately match the shape of the coil 212 with the pre-prepared coil accommodating space 2133 in terms of the manufacturing characteristics, but in fact, it is consistent with the pre-prepared coil 212. It is very difficult to form the coil accommodating space 2133 by matching the shape. In addition, the shape of the coil 212 is not uniform, so it is difficult to accurately make contact between the coil 212 and the peripheral portion 2131 on the ground, and a wire contact or point contact is formed in most parts between the two, so the coil 212 and the peripheral portion 2131 are formed between There are gap spaces separated from each other. The thermally conductive medium 214 is formed of a material with high thermal conductivity, can fill the gap space, and can efficiently transmit the heat emitted from the coil 212 to the peripheral portion 2131 and the like, and is discharged to the outside. For example, as the thermally conductive material forming the thermally conductive medium 214, a low-melting metal having a melting point of 100 to 400 degrees can be used. For example, the thermally conductive material may be formed of any one or more of indium (In), lead (Pb), and a plastic-based thermally conductive medium.

The thermally conductive medium 214 may be formed by filling the coil accommodating space 2133 with a thermally conductive material in a liquid state with the coil 212 inserted into the coil accommodating space 2133 and cooling it.

The volume occupied by the thermally conductive medium 214 may be, for example, 1/2 or less of the space between the permanent magnet 211 and the peripheral portion 2131 . The volume occupied by the thermally conductive medium 214 may be, for example, less than 1/2 of the coil accommodating space 2133 . According to this structure, the usage-amount of the thermally-conductive material with high thermal conductivity and expensive can be reduced, and therefore the manufacturing time and manufacturing cost of the thermally-conductive medium 214 can be reduced. For example, the peripheral portion 2131 formed of relatively cheap aluminum and other materials is used as the main heat dissipation means, and indium, which is about 100 times more expensive than aluminum, is used to form the heat conduction medium 214 as the auxiliary heat dissipation means, so that the entire electromagnet can be greatly reduced. Manufacturing time and manufacturing cost of assembly 21 .

The cooling plate 215 may be arranged on one side of the heat sink 213 . The cooling plate 215 may include a refrigerant flow path 2151 penetrating the refrigerant inflow line L_in and the refrigerant outflow line L_out, respectively, to induce the refrigerant. The refrigerant flowing through the refrigerant flow path 2151 absorbs heat generated in the coil 212 and is transferred from the coil 212 through the heat transfer medium 214 or the peripheral portion 2131 and the like, and is discharged to the outside. In addition, the cooling plate 215 and the heat sink 213 may be integrally formed.

In addition, the heat sink 213 of the electromagnet assembly 21 for the magnetron sputtering device may include a plurality of wire barrels 2132 , and a peripheral portion 2131 surrounding the plurality of wire barrels 2132 . Similarly, the magnetic field generation unit M may include a plurality of coils 212 respectively arranged in the plurality of bobbins 2132, and a plurality of permanent magnets 211 arranged at the centers of the plurality of coils 212, respectively.

For example, among the plurality of permanent magnets 211 shown in FIGS. 1 and 2 , at least a part of two permanent magnets 211 adjacent to each other may be arranged with opposite polarities. In addition, the electromagnet assembly 21 for the magnetron sputtering apparatus may include a conductor installed with adjacent two permanent magnets 211 . The conductors can effectively form magnetic lines of force between the two adjacent permanent magnets 211 to function as a bridge, so that the efficiency of the magnetic field generating portion M can be improved. The conductors may be, for example, the cooling plate 215 disposed on the bottom surface of the heat sink 213 , the cooling plate 215 disposed at the lower portion of the heat sink 213 , or other conductors additionally disposed between the heat sink 213 and the cooling plate 215 . That is, the lower part of the heat sink 213 or the upper part of the cooling plate 215 may be formed with the conductive substance.

In the magnetron sputtering apparatus 1 (refer to FIG. 1 ), considering that the peripheral portion of the object T tends to be rapidly worn out, the magnetic field magnitude of the peripheral portion of the magnetic field generating portion M is different from the magnetic field magnitude of the central portion of the magnetic field generator M. Comparatively, it can be formed smaller. For example, among the plurality of permanent magnets 211, the size of the permanent magnets 211 located in the peripheral portions on both sides may be smaller than the size of the permanent magnets 211 located in the center. As another example, among the plurality of coils 212, the number of turns of the coils 212 located in the peripheral portions on both sides may be smaller than the number of turns of the coils 212 located at the center. With the above structure, the entire area of the object T is uniformly worn, and thus the life cycle of the object T is increased, so that the maintenance cost of the magnetron sputtering apparatus 1 can be more effectively reduced.

FIG. 4 is a flowchart illustrating a method of manufacturing an electromagnet assembly according to one embodiment.

2 to 4 , a method for preparing the electromagnet assembly 21 according to one embodiment may include: preparing a frame in step S110; configuring a plurality of coils in step S120; heating the frame in step S130; heating in step S140 Thermally conductive substance; filling with thermally conductive substance in step S150 ; cooling in step S160 and disposing of permanent magnets in step S170 . In addition, unless otherwise specified, in the method for preparing the electromagnet assembly 21, the execution order of each step is not limited, and some steps may be omitted.

Step S110 is a step of preparing the frame 213 including the protruding portion 2132 and the peripheral portion 2131, wherein the frame 213 may be integrally formed by using materials such as aluminum or copper. Here, the frame 213 and the protruding portion 2132 may be understood as the heat sink 213 and the wire barrel 2132 illustrated in FIGS. 2 and 3 , respectively.

Step S120 may include, as a step of arranging the coil 212 covering the protrusion 2132 on the outer periphery of the protrusion 2132, for example, a step of crimping a wire on the outer periphery of the protrusion 2132 to form a coil. As another example, the step of inserting the pre-configured coil 212 to the outer periphery of the protrusion 2132 may also be included.

Step S130, as a step of heating the frame 213, can be performed before or simultaneously with step S150. For example, the frame 213 may be heated at a temperature of 150 degrees. According to this method, in the process of performing step S150, the thermally conductive material can sufficiently flow into the gap space between the protruding portion 2132 and the peripheral portion 2131 without the coil 212, and the fluidity of the thermally conductive material can be ensured. Therefore, the heat conduction efficiency of the heat conduction medium 214 generated during the step S160 may be improved.

Step S140 is a step of heating the thermally conductive substance in a solid state to change it into a liquid state at normal temperature and normal pressure, and may be performed before step S150. For example, a low-melting-point metal may be used as the heat-conducting substance, and in this case, the execution time of step S140 and the energy required for execution are reduced.

The step S150 is to fill the space between the protruding portion 2132 and the peripheral portion 2131 in the frame 213 with the thermally conductive substance in the liquid state generated in the step S140 . Through step S150, the heat conduction efficiency between the coil 212 and the peripheral portion 2131 is improved.

Step S170 may be executed after step S150 as a step of arranging the permanent magnet 211 in the center of the coil 212 . According to this method, the problem that the magnetic properties of the permanent magnets 211 are reduced due to the heat emitted from the thermally conductive material at a high temperature in a heated state can be prevented.

Step S160 may be performed before step S170, for example, as a step of cooling the heat-conductive substance in a liquid state filled in the frame 213 in step S150 into a solid state. Through this process, the problem that the magnetism of the permanent magnet 211 is reduced can be more effectively prevented.

Table 1 below compares the performance test results of the electromagnet assembly 21 according to the embodiment of the manufacturing method shown in FIGS. 2 to 4 with the performance test results of the electromagnet assemblies according to other comparative examples. First, the structures and detection methods of other comparative examples will be described. For ease of understanding, the description is made using the reference symbols of the embodiment, and the structure whose description is omitted may be regarded as substantially the same as the structure of the embodiment.

The first to third comparative examples, and the electromagnet assembly 21 according to the embodiment are prepared with permanent magnets 211 and coils 212 of the same size, number, and pattern, and use neodymium (Nd) magnets as the permanent magnets 211. In each example, a cooling plate 215 is attached to the lower side of the magnetic field generating portion M, and the performance is detected using water as a refrigerant. Specific conditions and detection methods for each example are shown below.

<First Comparative Example>

The electromagnet assembly according to the first comparative example does not include the heat sink 213 and the thermally conductive medium 214 , and the magnetic field generating portion M has a structure in which the cooling plate 215 is fixed by the epoxy molding liquid. The detected temperature is the surface temperature of the epoxy molding structure rather than the temperature of the coil 212, so the actual temperature of the coil 212 can be predicted to be higher than the detected temperature.

<Second comparative example>

In the electromagnet assembly according to the second comparative example, the thermally conductive medium 214 is not liquid but filled with magnesium oxide (MgO) powder, and the magnetic field generating portion M has a structure fixed to the cooling plate 215 by epoxy molding liquid. The detected temperature is the surface temperature of the epoxy molding structure rather than the temperature of the coil 212, so the actual temperature of the coil 212 can be predicted to be higher than the detected temperature.

<The third comparative example>

The electromagnet assembly according to the third comparative example does not use the thermally conductive medium 214 , and air is forced to flow in the gap space between the coil 212 and the peripheral portion 2131 , and therefore includes additional cooling means in addition to the cooling plate 215 . The detected temperature is the surface temperature of the coil 212 .

<Example>

The electromagnet assembly 21 according to the embodiment has the structure shown in FIG. 2 , is manufactured according to the manufacturing method of FIG. 4 , and uses indium (In) as the thermally conductive medium 214 . The detected temperature is the surface temperature of the coil 212 .

[Table 1]

As shown in Table 1 above, it was confirmed that the electromagnet assembly 21 according to the example had significantly smaller decrease in magnetism and temperature change than the electromagnet assemblies of the first comparative example and the second comparative example.

Furthermore, when compared with the 3rd comparative example provided with the additional cooling means, the cooling performance was similarly higher, and it was confirmed that the influence on the reduction of the magnetic field of the magnetic field generating part M was small.

FIG. 5 is a flowchart illustrating a method of manufacturing an electromagnet assembly according to one embodiment.

2 , 3 and 5 , a method for manufacturing an electromagnet assembly 21 according to an embodiment may include: preparing a frame in step S210 , configuring a coil in step S220 , heating the frame in step S230 , and in step S240 The thermally conductive material is heated, filled with the thermally conductive material S250 in step S250, and cooled in step S260, and a permanent magnet is arranged in step S270. In addition, unless otherwise specified, in the method for manufacturing the electromagnet assembly 21, the execution order of each step is not limited, and some steps may be omitted.

In FIG. 4, unlike the illustrated embodiment, step S270 of permanent magnet configuration may be performed after step S210 and before step S230. In this case, in the process of performing steps S230 and S250, in order to reduce the magnetic drop of the permanent magnet 211, the permanent magnet 211 can be made of a ferrite material which has less influence on the magnetic drop at a relatively high temperature of about 200 degrees. Permanent magnet 211 .

In addition, in step S240, the thermally conductive material is heated at a temperature of 200 degrees or lower, which can reduce the problem of magnetic degradation of the permanent magnet 211 made of ferrous material. The thermally conductive substance heated in step S240 may be a low melting point metal with a melting point of 200 degrees or less. For example, the thermally conductive substance may be formed of any one or more of indium (In), lead (Pb), and a plastic-based thermally conductive medium.

6 to 8 are views illustrating a method of manufacturing an electromagnet assembly according to one embodiment, and FIGS. 9 to 10 are flowcharts illustrating a method of manufacturing an electromagnet assembly according to one embodiment.

6 to 10 , a method for manufacturing the electromagnet assembly 31 according to one embodiment may include: preparing a frame in step S310 , configuring a coil in step S320 , heating the frame in step S330 , and heating a thermally conductive substance in step S340 , filling the thermally conductive material S250 in step S350, and cooling in step S360, removing the molding frame in step S380, combining the support frame in step S390, and disposing the permanent magnet in step S370. In addition, unless otherwise specified, in the method for manufacturing the electromagnet assembly 31, the execution order of each step is not limited, and some steps may be omitted.

Step S310 is a step of preparing the frames 313a, 316 including the protrusions 3162 and the peripheral portion 3131 protrudingly formed to surround the protrusions 3162. As shown in FIG. 10 , step S310 may include: step S312 of preparing peripheral frame 313a, step S314 of preparing molding frame 316, and step S316 of bonding molding frame 316 to peripheral frame 313a.

The frames 313a, 316 may include a peripheral frame 313a and a molding frame 316 that are separable from each other, and the peripheral portion 3131 and the protruding portion 3162 may be disposed on the peripheral frame 313a and the molding frame 316, respectively.

The peripheral frame 313a may include a peripheral portion 3131 and a accommodating space 3135 formed through the up-down direction. The peripheral frame 313 a may form the heat sink 313 of the electromagnet assembly 31 together with the support frame 313 b (refer to FIG. 8 ) combined in step S390 .

As an auxiliary structure temporarily used in steps S310 to S360, the molding frame 316 can be combined with or separated from the peripheral frame 313a, and can include: a cover plate 3161 for covering the lower side of the receiving space 3135 and a protrusion for inserting the space 3135 3162. The protrusion 3162 may serve as a bobbin for temporarily crimping the coil 312 .

Through step S316 , as shown in FIG. 7 , a coil accommodating space 3133 capable of accommodating the coil 312 can be arranged between the peripheral portion 3131 and the protruding portion 3162 .

Step S320 is a step of arranging the coil 312 on the outer periphery of the protruding portion 3162 to surround the protruding portion 3162, and the coil 312 may be arranged in the coil accommodating space 3133 formed in the step S316. Step S320 may be executed after step S316, but, unlike this, may be executed between steps S314 and S316, and of course may be executed simultaneously with step S316. For example, when the coil 312 is formed by crimping a wire on the outer periphery of the protrusion 3162, it may be more advantageous in terms of operation space to perform step S320 between steps S314 and S316.

Step S380 is a step of separating the molding frame 316 from the peripheral frame 313a, and the thermally conductive material is in a solid state by step S360, so it can be performed after the thermally conductive medium 314 is formed. In step S360, the peripheral frame 313a and the coil 312 are fixed to each other via the thermally conductive medium 314, and in step S380, a gap space is formed in the center of the coil 312 where the protrusion 3162 is vacated. The clearance space can be regarded as a permanent magnet receiving space 3134 .

Step S390, as a step of bonding the support frame 313b to the peripheral frame 313a, may be performed after step S380. The support frame 313b may form the heat sink 313 together with the peripheral frame 313a. The support frame 313b covers the lower side of the permanent magnet accommodating space 3134, and can be used to support the permanent magnet 311 configured in step S370. For example, the support frame 313b is formed of a conductor, so that magnetic lines of force are effectively formed between the two adjacent permanent magnets 311, thereby serving as a bridge. For example, the lower side of the support frame 313b may be configured with a cooling plate 215 as shown in FIG. 3 . In addition, the support frame 313b and the cooling plate 215 may be integrally formed.

According to the method as described above, the problem that the magnetism of the permanent magnet 311 is reduced by the heat of the heated thermally conductive material can be eliminated. In addition, compared with the method of using a mold to prepare the heat sink at one time, the shape of the mold is relatively simple, which is more advantageous in the manufacturing process. In addition, as shown in the figure, the bobbin is omitted in the heat sink 313, so that the space efficiency of the prepared electromagnet assembly 31 is improved, and the structure is more compact.

As described above, although the description has been made with reference to the drawings and the embodiments, the present invention is not limited to the embodiments described herein, and those skilled in the art to which the present invention pertains can make various modifications and modifications through the above description. For example, the illustrated techniques may be performed in a different order than the illustrated methods, and/or the illustrated elements may be combined or combined in different forms than the illustrated methods. Appropriate effects may also be obtained by substituting or substituting other structural elements or equivalents.

1‧‧‧Magnetron Sputtering Device 11‧‧‧Electromagnet Assembly 21‧‧‧Electromagnet Assembly 31‧‧‧Electromagnet Assembly 211‧‧‧Permanent Magnet 212‧‧‧Coil 213‧‧‧Frame\ Heat Sink 214‧‧‧Thermal conduction medium 215‧‧‧Cooling plate 311‧‧‧Permanent magnet 312‧‧‧Coil 313‧‧‧radiator 313a‧‧‧Peripheral frame\frame 313b‧‧‧Support frame 314‧‧‧Thermal conduction medium 316 ‧‧‧Plastic frame\Frame 2131‧‧‧Peripheral part 2132‧‧‧Protruding part\Spool 2133‧‧‧Coil storage space 2134‧‧‧Permanent magnet storage space 2151‧‧‧Refrigerant flow path 3131‧‧ ‧Peripheral portion 3133‧‧‧Coil accommodating space 3134‧‧‧Permanent magnet accommodating space 3135‧‧‧Accommodating space 3161‧‧‧Cover plate 3162‧‧‧Protrusion L_in‧‧‧Refrigerant inflow line L_out‧‧‧ Refrigerant Outflow Line M‧‧‧Magnetic Field Generation Unit O‧‧‧Target S110, S120, S130, S140, S150, S160, S170‧‧‧Steps S210, S220, S230, S240, S250, S260, S270‧‧‧Steps S310, S312, S314, S316, S320, S330, S340, S350, S360, S370, S380, S390‧‧‧Step T‧‧‧Object

FIG. 1 is a conceptual diagram of a magnetron sputtering apparatus according to one embodiment. 2 is a perspective view of an electromagnet assembly according to one embodiment. 3 is an exploded perspective view of an electromagnet assembly according to one embodiment. FIG. 4 is a flowchart illustrating a method of manufacturing an electromagnet assembly according to one embodiment. FIG. 5 is a flowchart illustrating a method of manufacturing an electromagnet assembly according to one embodiment. 6 to 8 are views illustrating a method of manufacturing an electromagnet assembly according to one embodiment. 9 to 10 are flowcharts illustrating a method of manufacturing an electromagnet assembly according to one embodiment.

21‧‧‧Electromagnetic components

211‧‧‧Permanent Magnets

212‧‧‧Coil

213‧‧‧ Heat sink

214‧‧‧Heat transfer medium

215‧‧‧Cooling plate

2131‧‧‧Peripheral Department

2132‧‧‧Spool

L_in‧‧‧refrigerant inflow line

L_out‧‧‧Refrigerant outflow line

M‧‧‧magnetic field generating unit

Claims (20)

A preparation method of an electromagnet assembly, comprising the steps of: preparing a frame including a protruding part and a peripheral part surrounding the protruding part; disposing a coil on the outer periphery of the protruding part to cover the protruding part; heating the thermally conductive substance in a solid state to change it into a liquid state; filling the space between the protrusion and the peripheral portion with the thermally conductive substance in a liquid state; cooling the thermally conductive substance in a liquid state to a solid state state, thereby generating a thermally conductive medium for fixing the coil and the peripheral portion to each other; and after the filling step, arranging a permanent magnet in the center of the coil. The method for producing an electromagnet assembly according to claim 1, wherein the step of generating a thermally conductive medium is performed after the step of filling and before the step of arranging the permanent magnet. The method for producing an electromagnet assembly according to claim 2, wherein the volume occupied by the thermally conductive medium is less than 1/2 of the space between the permanent magnet and the peripheral portion. The method for producing an electromagnet assembly according to claim 1, wherein the thermally conductive material is a low melting point metal with a melting point of 100°C to 400°C. The method for preparing an electromagnet assembly according to the claim 1, wherein the thermally conductive material is composed of any one or more of indium, lead, and a plastic-based thermally conductive medium. The method for producing an electromagnet assembly according to claim 1, wherein the peripheral portion is made of a non-magnetic heat-dissipating material. The method for producing an electromagnet assembly according to claim 1, wherein the permanent magnet is formed of any one or more of neodymium and ferrite. The method for preparing an electromagnet assembly according to claim 1, wherein the method for preparing an electromagnet assembly further comprises the following steps: before or at the same time as the step of filling, the frame is heating. The method for producing an electromagnet assembly according to claim 1, wherein the step of arranging the coil includes the step of inserting the pre-arranged coil into the outer periphery of the protruding portion. The method for producing an electromagnet assembly according to claim 1, wherein a permanent magnet accommodating space for accommodating the permanent magnet is formed inside the protruding portion. The method for producing an electromagnet assembly according to claim 10, wherein the frame is integrally formed by using aluminum or copper material. The method for preparing an electromagnet assembly as claimed in item 1 of the patent application scope, wherein the frame comprises: a perimeter frame containing the perimeter portion; and a molding frame containing the protrusion and separable from the perimeter frame. The method for producing an electromagnet assembly as claimed in claim 12, wherein the step of producing the frame includes the step of bonding the plastic frame to the peripheral frame, and the method for producing the electromagnet assembly It further includes the step of removing the shaped frame from the perimeter frame after the step of filling and before the step of disposing the permanent magnets. The method for producing an electromagnet assembly according to claim 1, wherein the electromagnet assembly includes a refrigerant flow path, and the refrigerant is induced to absorb heat generated in the coil and discharge it to the outside. A preparation method of an electromagnet assembly, comprising the steps of: preparing a frame including a protruding part and a peripheral part surrounding the protruding part; disposing a coil on the outer periphery of the protruding part to cover the protruding part; Heat the thermally conductive material in a solid state at a temperature below 200°C to change it into a liquid state; fill the space between the protruding portion and the peripheral portion with the thermally conductive material in a liquid state; The thermally conductive material is cooled to a solid state to generate a thermally conductive medium for fixing the coil and the peripheral portion to each other, and a permanent magnet made of ferrite is arranged in the center of the coil. A method for preparing an electromagnet assembly for a magnetron sputtering device, comprising the steps of: preparing a frame including a plurality of protruding parts and a peripheral part surrounding the plurality of protruding parts; disposing the plurality of protruding parts respectively a plurality of coils; heating a thermally conductive substance in a solid state under normal temperature and normal pressure to change it into a liquid state; filling the thermally conductive substance in a liquid state into the space between the plurality of protrusions and the peripheral portion; cooling the thermally conductive material in a liquid state to a solid state to generate a thermally conductive medium for fixing the plurality of coils and the peripheral portion to each other; and after the step of filling, disposing a plurality of permanent magnets respectively at each center of the plurality of coils. The method for preparing an electromagnet assembly as claimed in claim 16, wherein the step of disposing the plurality of permanent magnets respectively comprises: making at least a part of the plurality of permanent magnets adjacent to two permanent magnets in polarities Conversely configured steps. The method for preparing an electromagnet assembly as claimed in claim 17, wherein the electromagnet assembly comprises: a conductor on which the two adjacent permanent magnets are installed so that the two adjacent permanent magnets are connected to each other. magnetic lines of force are formed between them. The method for producing an electromagnet assembly according to claim 16, wherein among the plurality of permanent magnets, the size of the permanent magnets located at the peripheral portions on both sides is smaller than the size of the permanent magnets located at the center. The method for producing an electromagnet assembly according to claim 16, wherein among the plurality of coils, the number of turns of the coils located at the peripheral portions on both sides is smaller than that of the coils located at the center.

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