TWI760983B - Backlight module and display panel - Google Patents

Abstract

A backlight module includes a plurality of light-emitting elements and an isolation layer. The plurality of light-emitting elements and the isolation layer are on the same surface of the circuit board. The isolation layer includes a middle portion and an edge portion connecting the middle portion. The middle portion is a cross net structure and divides the circuit board into a plurality of independent sub-units, and at least one light-emitting element is provided in each sub-unit. The edge portion forms a closed circle around the plurality of light-emitting elements, and a height of the isolation layer in a direction perpendicular to the electric board is greater than a height of each light-emitting element in a direction perpendicular to the electric board. The middle portion is opaque, and the edge portion is at least partially transparent. The disclosure also provides a display panel using the backlight module.

Description

Backlight Modules and Display Panels

The invention relates to a backlight module and a display panel using the backlight module.

As an important component of the liquid crystal display panel, the backlight module provides the liquid crystal display panel with the backlight required for image display. A conventional backlight module includes a circuit board and an isolation layer of a plurality of light-emitting elements located on the same surface of the circuit board. The isolation layer is light-shielding and includes a middle portion and an edge portion connecting the middle portion, the middle portion is a crossed mesh structure and divides the circuit board into a plurality of mutually independent subunits, each subunit At least one light-emitting element is arranged in the middle, the edge portion forms a closed circle around the plurality of light-emitting elements, and the height of the isolation layer is greater than that of each light-emitting element. The isolation layer has a light-shielding effect, which can prevent interference between lights emitted by light-emitting elements in adjacent subunits. Due to the shading effect of the edge portion, the brightness at the peripheral edge of the backlight module is darker, and because the lightness at the edge is darker, it is easy to cause a bluish chromatic aberration. The color difference refers to when the human eye observes the product, The phenomenon of color inconsistency occurs, which is usually measured by the CIE (Committee on International Standards for Illumination) standard.

In view of this, it is necessary to provide a backlight module, which is beneficial to improve the problems of dim brightness and bluish chromatic aberration at the edge of the backlight module.

A backlight module, comprising: a circuit board; a plurality of light-emitting elements arranged on the circuit board; an isolation layer, which is located on the same surface of the circuit board as the plurality of light-emitting elements, the isolation layer comprising a middle portion and an edge portion connecting the middle portion , the middle part is a crossed mesh structure and divides the circuit board into a plurality of independent sub-units, each sub-unit is provided with at least one of the light-emitting elements, and the edge portion surrounds the plurality of light-emitting elements A closed circle is formed, and the height of the isolation layer in the direction perpendicular to the electric plate is greater than the height of each light-emitting element; and the middle portion is opaque to light, and the edge portion is at least partially transparent.

In the embodiment of the present application, the entire edge portion is made of light-transmitting material.

In the embodiment of the present application, the edge portion includes a first portion and a second portion that are connected to each other, the first portion and the second portion are stacked on top of the surface of the circuit board, and the first portion Located between the circuit board and the second part, the first part is a light-shielding material and the second part is a light-transmitting material.

In an embodiment of the present application, the edge portion includes a first portion and a second portion that are connected to each other, the first portion is located on the surface of the circuit board, and the second portion is located on the circuit board and wraps around the circuit board. The first part is made of light-shielding material and the second part is made of light-transmitting material.

In the embodiment of the present application, the edge portion includes a first portion and a second portion that are connected to each other, the first portion and the second portion are arranged on the surface of the electrical board, and the second portion is located at the Between the first part and the middle part, the first part is a light-shielding material or a reflective material and the second part is a light-transmitting material.

In the embodiment of the present application, the second part is formed by any one of a spraying process, a glue dispensing process and a lamination process.

In the embodiment of the present application, the light-transmitting portion of the edge portion is a transparent optical adhesive layer.

In the embodiments of the present application, phosphors and/or diffusion particles are doped into the light-transmitting portion of the edge portion.

In the embodiment of the present application, the backlight module further includes a light-transmitting protective layer on the circuit board and covering each light-emitting element and the isolation layer, and a light-transmitting protective layer located on the light-transmitting protective layer away from the circuit board Optical film layer on one side.

The present invention also provides a display panel, comprising: a display module; and a backlight module, which is stacked on one side of the display module and provides the display module with a backlight required for image display.

In the backlight module, the edge portion surrounding the plurality of light-emitting elements is at least partially transparent, so that the light emitted by the light-emitting element of each subunit at the edge of the circuit board is transmitted to the edge portion and The backlight module is emitted from the light-transmitting part of the edge portion, which is beneficial to improve the brightness of the edge position of the backlight module, and is beneficial to improve the brightness of the light emitted from the edge position of the backlight module. The phenomenon of bluish chromaticity caused.

100: Backlight module

10: circuit board

20: Light-emitting element

30: isolation layer

31: Middle part

311: Cross section

312: Longitudinal

X: first direction

Y: the second direction

32: Edge

33: Subunit

321: Part 1

322: Part II

40: Pad

50: light-transmitting protective layer

60: Optical film layer

61: The first diffuser

62: Second diffuser

63: First Brightness Enhancement Film

64: Second Brightness Enhancement Film

70: Fluorescence conversion layer

200: Display panel

300: Display module

400: Transparent cover

FIG. 1 is a plan view of a backlight module according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the backlight module according to the first embodiment of the present invention.

3 is three cross-sectional structural views of the edge portion of the isolation layer of the backlight module according to the first embodiment of the present invention.

4 is a cross-sectional view of a backlight module according to Embodiment 2 of the present invention.

5 is a cross-sectional view of a backlight module according to Embodiment 3 of the present invention.

6 is a cross-sectional view of a backlight module according to Embodiment 4 of the present invention.

7 is a cross-sectional view of a display panel according to an embodiment of the present invention.

The drawings illustrate embodiments of the present invention, which may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

Example 1

1 and 2 , a backlight module 100 provided by an embodiment of the present invention includes a circuit board 10 , a plurality of light-emitting elements 20 and an isolation layer 30 located on the same surface of the circuit board 10 . In this embodiment, the backlight module 100 is a direct type backlight module. The isolation layer 30 includes a middle portion 31 and an edge portion 32 connecting the middle portion 31 . The middle portion 31 is a crossed mesh structure and divides the circuit board 10 into a plurality of subunits 33 that are independent of each other, and each subunit 33 is provided with at least one of the light emitting elements 20 . In this embodiment, the complex subunits 33 are arranged in a matrix. FIG. 1 only shows the subunits 33 arranged in a 2×3 matrix, and the complex subunits 33 can form a network structure with complex rows and columns. FIG. 1 shows that each subunit 33 is provided with four light-emitting elements 20. It can be understood that the number of light-emitting elements 20 in each subunit is not limited; the plurality of light-emitting elements 20 on the circuit board 10 are also Arbitrary arrangements can be presented. The edge portion 32 forms a closed circle around the plurality of light-emitting elements 20 . The height of the isolation layer 30 is greater than that of each light emitting element 20 . The middle portion 31 is opaque and the edge portion 32 is at least partially transparent. The middle portion 31 with a light shielding function can effectively prevent interference between lights emitted by the light emitting elements 20 in adjacent subunits 33 . In this embodiment, the direction of the height of the isolation layer 30 perpendicular to the direction of the circuit board 10 is the thickness direction of the backlight module 100 . 2 only illustrates a part of the edge part 32 and a part of the middle part 31 at a part of the edge position of the backlight module 100 .

In this embodiment, the middle portion 31 includes a plurality of transverse portions 311 arranged in a plurality of rows along the first direction X and a plurality of vertical portions 312 arranged in a plurality of columns along the second direction Y, each transverse portion 311 intersects the plurality of vertical portions 312, each vertical portion 312 intersects the plurality of horizontal portions 311, and the first direction X intersects the second direction Y. In this embodiment, each horizontal portion 311 and each vertical portion 312 that are perpendicular to and intersect with the first direction X and the second direction Y intersect vertically, and the plurality of horizontal portions and the plurality of vertical portions connect the The circuit board 10 is divided into mutually independent complex subunits 33, and the complex subunits 33 are arranged in a matrix, that is, arranged in complex rows parallel to the first direction X and complex rows parallel to the second direction Y. It can be understood that the plurality of subunits 33 may be arranged in other manners, and the arrangement manner may be regular or irregular.

Referring to FIG. 3 , the edge portion 32 includes a first portion 321 and a second portion 322 that are connected to each other. The first portion 321 and the second portion 322 are stacked up and down on the surface of the circuit board. A portion 321 is located between the second portion 322 and the circuit board 10 , the first portion 321 is made of a light-shielding material, and the second portion 322 is made of a light-transmitting material. In this embodiment, the second part 322 is connected to the surface of the first part 321 away from the circuit board 10 , as shown in the first picture in FIG. 3 ; or the second part 322 wraps the surface of the circuit board 10 . One end of the first portion 321 away from the circuit board 10 is shown in the third picture in FIG. 3 . Besides, the second part 322 is not located on the first part 321, the second part 322 is located on the surface of the circuit board 10 and wraps the first part 321, and the first part 321 is a light-shielding material and the second portion 322 is a light-transmitting material, as shown in the second picture of FIG. 3 .

Embodiment 2

4 , the structure of the backlight module of the second embodiment is basically the same as that of the backlight module of the first embodiment, except that the edge portion 32 does not include a light-shielding portion, and the edge portion 32 is made of light-transmitting material as a whole. It can be understood that the first part 321 and the second part 322 are connected together. Translucent part of the body. The edge portion 32 is an optical adhesive layer as a whole. In this embodiment, the light transmittance of the edge portion 32 is more than 80%.

Embodiment 3

Referring to FIG. 5 , the structure of the backlight module of the third embodiment is basically the same as the structure of the backlight module of the first embodiment, the difference is that the first part 321 and the second part 322 connected to each other are not in the same position on the circuit board 10 . Similarly, the material of the second part 322 is also different. In this embodiment, the edge portion 32 includes a first portion 321 and a second portion 322 that are connected to each other. The first portion 321 and the second portion 322 are disposed on the surface of the circuit board 10 and the The second portion 322 is located between the first portion 321 and the middle portion 31 . In this embodiment, the first portion 321 is made of a light-shielding material or a reflective material, and the second portion 322 is made of a light-transmitting material.

In the above embodiment, the height of the second portion 322 may be greater than or equal to the height of the first portion 321 , and may also be smaller than the height of the first portion 321 . The greater the height of the second portion 322 is, the greater the transmittance of the light emitted by the plurality of light-emitting elements 20 at the edge of the backlight module 100 is. The user can design the second portion according to specific requirements. 322 height.

In the above embodiment, the light-transmitting portion of the edge portion 32 is a transparent optical adhesive layer, that is, the second portion 322 is a transparent optical adhesive layer. The material of the second part 322 can be, but is not limited to, liquid optical glue, liquid UV optical glue and traditional OCA glue; the second part 322 is formed on any one of the spraying process, the dispensing process and the lamination process. on the first part 321 or on the circuit board 10 . The light transmittance of the second portion 322 is above 80%. In the above embodiment, the light-transmitting portion of the edge portion 32 is doped with phosphors and/or diffusing particles, that is, the second portion 322 is doped with phosphors and/or diffusing particles. The phosphor powder can convert ultraviolet radiation into visible light (high color rendering), improve edge brightness and improve color shift phenomenon; the diffusing particles diffuse light to achieve light diffusion and increase brightness.

In the above embodiment, the material of the first part 321 with light-shielding properties may be, but not limited to, polyester (PET) film, polyethylene (PE) film, Mylar polyester film, Melinex polyester film, Teijin polyester film and Any one or several of Tetoron polyester films. The first portion 321 is formed on the circuit board 10 by any one of a spraying process, a glue dispensing process and a lamination process.

2 to 5 , the backlight module 100 further includes a light-transmitting protective layer 50 located on the circuit board 10 and covering each light-emitting element 20 and the isolation layer 30 , and a light-transmitting protective layer located on the light-transmitting protective layer 50 . 50 is the optical film layer 60 on the side away from the circuit board 10 . The light-transmitting protective layer 50 has light-transmitting properties. In one embodiment, the optical film layer 60 includes a first diffuser 61 , a second diffuser 62 , a first brightness enhancement film 63 and a second brightness enhancement film stacked on one side of the light-transmitting protective layer 50 in sequence. 64. The optical film layer 60 is located on one side of the light-emitting surface of the plurality of light-emitting elements 20 . Compared with the second diffuser 62 , the first brightness enhancement film 63 and the second brightness enhancement film 64 , the first diffuser 61 is closest to the light-transmitting protective layer 50 . In this embodiment, the optical film layer 60 makes the light emitted by the plurality of light-emitting elements 20 evenly distributed. The first diffusing sheet 61 and the second diffusing sheet 62 are used to enhance the brightness of the light emitted by each light-emitting element 20 and improve the uniformity of the light brightness. The first brightness enhancement film 63 and the second brightness enhancement film 64 focus the light emitted by the second diffuser 62 within a small angle range. Usually, two brightness enhancement films are used for one backlight module 100 , which are opposite to each other. Orientation is vertical to gather light. In this embodiment, a plurality of microstructures are designed on the first diffusion sheet 61 and the second diffusion sheet 62, and the plurality of microstructures are used to improve optical performance.

In the above-mentioned embodiment, each light-emitting element 20 is a light-emitting diode, and each light-emitting element 20 can be soldered on the circuit board 10 through the pad 40 . The pads 40 may be solder paste.

Referring to FIG. 6 , when each light-emitting element 20 emits blue light, so that the backlight module 100 can finally emit white light, a fluorescence conversion is provided between the second diffuser 62 and the first brightness enhancement film 63 layer 70, the fluorescent conversion layer 70 can convert a part of blue light into green light, and a part of blue light The light is converted into red light and the rest of the blue light passes through the fluorescent conversion layer 70 directly, then the green light, red light and blue light emitted from the fluorescent conversion layer 70 are mixed to form white light.

In this embodiment, the middle portion 31 with the shading function can effectively prevent the interference between the lights emitted by the light emitting elements 20 in the adjacent subunits 33; the light emission of each subunit 33 at the edge of the circuit board 10 The light emitted by the element 20 is transmitted to the first edge portion 32 and exits the backlight module 100 through the light-transmitting portion of the edge portion 32, thereby helping to improve the brightness of the edge position of the backlight module 100, and It is beneficial to improve the phenomenon of bluish chromaticity caused by the dim brightness of the light emitted from the edge position of the backlight module 100 .

Embodiment 4

Referring to FIG. 7 , a display panel 200 provided by an embodiment of the present invention includes a display module 300 and a side backlight module 100 stacked on the display module 300 . The backlight module 100 displays the The module 300 provides the backlight required for image display. The backlight module 100 and the display module 300 are bonded by optical glue (not shown). The display panel 200 further includes a transparent cover plate 400 , and the transparent cover plate 400 is located on a side of the display module 300 away from the backlight module 100 .

In this embodiment, the display module 300 includes a color filter substrate (not shown) located on the side of the backlight module 100 close to the transparent cover plate 400 , and a thin film capacitor disposed opposite to the color filter substrate. A crystal substrate (not shown) and a liquid crystal layer (not shown) located between the color filter substrate and the thin film transistor substrate, the thin film transistor substrate is located between the color filter substrate and the backlight Between modules 100.

In this embodiment, the display panel is a liquid crystal display panel. The liquid crystal display panel is applied to electronic devices that need to set a display screen, such as (but not limited to): mobile phones, mobile TVs, smart phones, bluetooth devices, wireless email receivers, handheld or portable Computers, Mini Notebooks, Notebooks, Smartbooks, Tablets, Printers Computers, Photocopiers, Scanners, Fax Machines, Global Positioning System (GPS) Receivers/Navigators, Video Cameras, Digital Media Players, Camcorders, Game Consoles, Watches, Clocks, Calculators, TV Monitors , flat panel displays, electronic reading devices (e.g., e-readers), mobile health devices, computer monitors, automotive displays (including odometer displays and speedometer displays, etc.), cockpit controls and/or displays, camera landscape displays ( For example, displays for rear view cameras in vehicles), electronic photographs, electronic signage or signage, projectors, refrigerators, washers, dryers, washers/dryers, aesthetic structures (for example, an image of a piece of jewelry or clothing) display), but not limited thereto.

The above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. The up, down, left and right directions appearing in the figures are only for the convenience of understanding. Although the present invention has been described in detail with reference to the preferred embodiments, the Those of ordinary skill should understand that the technical solutions of the present invention may be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention.

100: Backlight module

10: circuit board

20: Light-emitting element

31: Middle part

32: Edge

321: Part 1

322: Part II

40: Pad

50: light-transmitting protective layer

60: Optical film layer

61: The first diffuser

62: Second diffuser

63: First Brightness Enhancement Film

64: Second Brightness Enhancement Film

Claims (9)

A backlight module, which is improved by comprising: a circuit board; a plurality of light-emitting elements arranged on the circuit board; an isolation layer, which is located on the same surface of the circuit board as the light-emitting elements, and the isolation layer includes a middle part and an edge part connecting the middle part, the middle part is a crossed mesh structure and the circuit board is divided into a plurality of mutually independent sub-units, each sub-unit is provided with at least one of the light-emitting elements, the edge part A closed circle is formed around the light-emitting elements, the height of the isolation layer in the direction perpendicular to the circuit board is greater than the height of each light-emitting element; the middle portion is opaque, and the edge portion is at least partially light-transmitting; the edge portion It includes a first part and a second part that are connected to each other, the first part and the second part are stacked on the surface of the circuit board and the first part is located between the circuit board and the second part, the The first part is a light-shielding material and the second part is a light-transmitting material. The backlight module according to claim 1, wherein the entire edge portion is made of a light-transmitting material. A backlight module, which is improved by comprising: a circuit board; a plurality of light-emitting elements arranged on the circuit board; an isolation layer, which is located on the same surface of the circuit board as the light-emitting elements, and the isolation layer includes a middle part and an edge part connecting the middle part, the middle part is a crossed mesh structure and the circuit board is divided into a plurality of mutually independent sub-units, each sub-unit is provided with at least one of the light-emitting elements, the edge part A closed circle is formed around the light-emitting elements, the height of the isolation layer in the direction perpendicular to the circuit board is greater than the height of each light-emitting element; the middle portion is opaque, and the edge portion is at least partially light-transmitting, wherein the The edge portion includes a first portion and a second portion that are connected to each other, and the first portion is located on the circuit board and the second part is located on the circuit board and wraps the first part, the first part is made of light-shielding material and the second part is made of light-transmitting material. A backlight module, which is improved by comprising: a circuit board; a plurality of light-emitting elements arranged on the circuit board; an isolation layer, which is located on the same surface of the circuit board as the light-emitting elements, and the isolation layer includes a middle part and an edge part connecting the middle part, the middle part is a crossed mesh structure and the circuit board is divided into a plurality of mutually independent sub-units, each sub-unit is provided with at least one of the light-emitting elements, the edge part A closed circle is formed around the light-emitting elements, the height of the isolation layer in the direction perpendicular to the circuit board is greater than the height of each light-emitting element; the middle portion is opaque, and the edge portion is at least partially light-transmitting, wherein the The edge part includes a first part and a second part connected to each other, the first part and the second part are arranged on the surface of the circuit board and the second part is located between the first part and the middle part, the The first part is a light-shielding material or a reflective material and the second part is a light-transmitting material. The backlight module of claim 1, wherein the second part is formed by any one of a spraying process, a glue dispensing process and a lamination process. The backlight module of claim 1, wherein the light-transmitting portion of the edge portion is a transparent optical adhesive layer. The backlight module according to claim 1, wherein the light-transmitting portion of the edge portion is doped with phosphors and/or diffusing particles. The backlight module of claim 1, wherein the backlight module further comprises a light-transmitting protective layer on the circuit board and covering each light-emitting element and the isolation layer, and a light-transmitting protective layer located on the light-transmitting protective layer away from the An optical film layer on one side of the circuit board. A display panel, which is improved by comprising: A display module; and the backlight module according to any one of claims 1 to 8, which are stacked on one side of the display module and provide the display module with a backlight required for image display.

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