TWI760523B - 用於偵測一缺陷之方法、非暫時性電腦可讀媒體及系統 - Google Patents

用於偵測一缺陷之方法、非暫時性電腦可讀媒體及系統 Download PDF

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Publication number
TWI760523B
TWI760523B TW107123615A TW107123615A TWI760523B TW I760523 B TWI760523 B TW I760523B TW 107123615 A TW107123615 A TW 107123615A TW 107123615 A TW107123615 A TW 107123615A TW I760523 B TWI760523 B TW I760523B
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Taiwan
Prior art keywords
die
images
detection channel
image
channel
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TW107123615A
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English (en)
Chinese (zh)
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TW201909115A (zh
Inventor
普立查卓 Ｍ 桑卡
阿秀克 巴拉達拉真
羅柱桓
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美商克萊譚克公司
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Publication of TW201909115A publication Critical patent/TW201909115A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00—Image enhancement or restoration
    • G06T5/50—Image enhancement or restoration using two or more images, e.g. averaging or subtraction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G06T2207/20221—Image fusion; Image merging
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G06T2207/20224—Image subtraction
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Manufacturing & Machinery (AREA)
  • Image Processing (AREA)
TW107123615A 2017-07-10 2018-07-09 用於偵測一缺陷之方法、非暫時性電腦可讀媒體及系統 TWI760523B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201762530699P 2017-07-10 2017-07-10
US62/530,699 2017-07-10
US15/704,900 2017-09-14
US15/704,900 US10957033B2 (en) 2017-07-10 2017-09-14 Repeater defect detection

Publications (2)

Publication Number Publication Date
TW201909115A TW201909115A (zh) 2019-03-01
TWI760523B true TWI760523B (zh) 2022-04-11

Family

ID=64903357

Family Applications (1)

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TW107123615A TWI760523B (zh) 2017-07-10 2018-07-09 用於偵測一缺陷之方法、非暫時性電腦可讀媒體及系統

Country Status (7)

Country Link
US (1) US10957033B2 (https=)
EP (1) EP3635772B1 (https=)
JP (1) JP7073413B2 (https=)
KR (1) KR102356945B1 (https=)
CN (1) CN110870053B (https=)
TW (1) TWI760523B (https=)
WO (1) WO2019014077A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110208284B (zh) * 2019-05-27 2021-09-17 武汉中导光电设备有限公司 一种多通道缺陷合并分析的方法及系统
US11710227B2 (en) * 2020-06-19 2023-07-25 Kla Corporation Design-to-wafer image correlation by combining information from multiple collection channels
US11810284B2 (en) * 2020-08-21 2023-11-07 Kla Corporation Unsupervised learning for repeater-defect detection

Citations (5)

* Cited by examiner, † Cited by third party
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US20090091749A1 (en) * 2004-07-12 2009-04-09 Dov Furman Multi mode inspection method and apparatus
US20130129187A1 (en) * 2010-08-09 2013-05-23 Bt Imaging Pty Ltd Persistent feature detection
CN103748454A (zh) * 2011-07-12 2014-04-23 科磊股份有限公司 晶片检查
TW201614586A (en) * 2014-08-27 2016-04-16 Kla Tencor Corp Repeater detection
TW201643415A (zh) * 2011-07-28 2016-12-16 克萊譚克公司 用於偵測在晶圓上之缺陷之方法及系統

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EP1630862B1 (en) * 2003-05-30 2016-01-13 Ebara Corporation Sample inspection device and method, and device manufacturing method using the sample inspection device and method
US20050105791A1 (en) * 2003-10-29 2005-05-19 Lee Ken K. Surface inspection method
JP4771714B2 (ja) 2004-02-23 2011-09-14 株式会社Ｎｇｒ パターン検査装置および方法
KR100598381B1 (ko) 2004-06-18 2006-07-07 삼성전자주식회사 인-라인 타입의 자동 웨이퍼결함 분류장치 및 그 제어방법
US7729529B2 (en) * 2004-12-07 2010-06-01 Kla-Tencor Technologies Corp. Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle
JP4787673B2 (ja) 2005-05-19 2011-10-05 株式会社Ｎｇｒ パターン検査装置および方法
US7711177B2 (en) * 2006-06-08 2010-05-04 Kla-Tencor Technologies Corp. Methods and systems for detecting defects on a specimen using a combination of bright field channel data and dark field channel data
US7796804B2 (en) * 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US8126255B2 (en) 2007-09-20 2012-02-28 Kla-Tencor Corp. Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions
US8223327B2 (en) 2009-01-26 2012-07-17 Kla-Tencor Corp. Systems and methods for detecting defects on a wafer
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
US9766187B2 (en) 2014-08-27 2017-09-19 Kla-Tencor Corp. Repeater detection
US9816940B2 (en) 2015-01-21 2017-11-14 Kla-Tencor Corporation Wafer inspection with focus volumetric method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090091749A1 (en) * 2004-07-12 2009-04-09 Dov Furman Multi mode inspection method and apparatus
US20130129187A1 (en) * 2010-08-09 2013-05-23 Bt Imaging Pty Ltd Persistent feature detection
CN103748454A (zh) * 2011-07-12 2014-04-23 科磊股份有限公司 晶片检查
TW201643415A (zh) * 2011-07-28 2016-12-16 克萊譚克公司 用於偵測在晶圓上之缺陷之方法及系統
TW201614586A (en) * 2014-08-27 2016-04-16 Kla Tencor Corp Repeater detection

Also Published As

Publication number Publication date
TW201909115A (zh) 2019-03-01
EP3635772A4 (en) 2021-03-10
KR102356945B1 (ko) 2022-02-08
EP3635772A1 (en) 2020-04-15
KR20200018703A (ko) 2020-02-19
CN110870053A (zh) 2020-03-06
JP2020526911A (ja) 2020-08-31
US20190012778A1 (en) 2019-01-10
JP7073413B2 (ja) 2022-05-23
US10957033B2 (en) 2021-03-23
EP3635772B1 (en) 2025-09-03
CN110870053B (zh) 2023-09-15
WO2019014077A1 (en) 2019-01-17

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