KR102356945B1 - 리피터 결함 검출 - Google Patents

리피터 결함 검출 Download PDF

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Publication number
KR102356945B1
KR102356945B1 KR1020207003424A KR20207003424A KR102356945B1 KR 102356945 B1 KR102356945 B1 KR 102356945B1 KR 1020207003424 A KR1020207003424 A KR 1020207003424A KR 20207003424 A KR20207003424 A KR 20207003424A KR 102356945 B1 KR102356945 B1 KR 102356945B1
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South Korea
Prior art keywords
die
images
inspection channel
inspection
die images
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KR1020207003424A
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English (en)
Korean (ko)
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KR20200018703A (ko
Inventor
프렘챤드라 엠 샨카
아쇽 바라다라잔
주환 라
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케이엘에이 코포레이션
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H01L22/12—
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00—Image enhancement or restoration
    • G06T5/50—Image enhancement or restoration using two or more images, e.g. averaging or subtraction
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • H01L22/30—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/27—Structural arrangements therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G06T2207/20221—Image fusion; Image merging
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G06T2207/20224—Image subtraction
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Manufacturing & Machinery (AREA)
  • Image Processing (AREA)
KR1020207003424A 2017-07-10 2018-07-08 리피터 결함 검출 Active KR102356945B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762530699P 2017-07-10 2017-07-10
US62/530,699 2017-07-10
US15/704,900 2017-09-14
US15/704,900 US10957033B2 (en) 2017-07-10 2017-09-14 Repeater defect detection
PCT/US2018/041178 WO2019014077A1 (en) 2017-07-10 2018-07-08 DETECTION OF REPEATER DEFECTS

Publications (2)

Publication Number Publication Date
KR20200018703A KR20200018703A (ko) 2020-02-19
KR102356945B1 true KR102356945B1 (ko) 2022-02-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207003424A Active KR102356945B1 (ko) 2017-07-10 2018-07-08 리피터 결함 검출

Country Status (7)

Country Link
US (1) US10957033B2 (https=)
EP (1) EP3635772B1 (https=)
JP (1) JP7073413B2 (https=)
KR (1) KR102356945B1 (https=)
CN (1) CN110870053B (https=)
TW (1) TWI760523B (https=)
WO (1) WO2019014077A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110208284B (zh) * 2019-05-27 2021-09-17 武汉中导光电设备有限公司 一种多通道缺陷合并分析的方法及系统
US11710227B2 (en) * 2020-06-19 2023-07-25 Kla Corporation Design-to-wafer image correlation by combining information from multiple collection channels
US11810284B2 (en) * 2020-08-21 2023-11-07 Kla Corporation Unsupervised learning for repeater-defect detection

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130250287A1 (en) 2009-01-26 2013-09-26 Kla-Tencor Corporation Systems and Methods for Detecting Defects on a Wafer
US20160061745A1 (en) 2014-08-27 2016-03-03 Kla-Tencor Corporation Repeater Detection
US20160209334A1 (en) 2015-01-21 2016-07-21 Kla-Tencor Corporation Wafer inspection with focus volumetric method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1630862B1 (en) * 2003-05-30 2016-01-13 Ebara Corporation Sample inspection device and method, and device manufacturing method using the sample inspection device and method
US20050105791A1 (en) * 2003-10-29 2005-05-19 Lee Ken K. Surface inspection method
JP4771714B2 (ja) 2004-02-23 2011-09-14 株式会社Ｎｇｒ パターン検査装置および方法
KR100598381B1 (ko) 2004-06-18 2006-07-07 삼성전자주식회사 인-라인 타입의 자동 웨이퍼결함 분류장치 및 그 제어방법
EP1766363A2 (en) * 2004-07-12 2007-03-28 Negevtech Ltd. Multi mode inspection method and apparatus
US7729529B2 (en) * 2004-12-07 2010-06-01 Kla-Tencor Technologies Corp. Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle
JP4787673B2 (ja) 2005-05-19 2011-10-05 株式会社Ｎｇｒ パターン検査装置および方法
US7711177B2 (en) * 2006-06-08 2010-05-04 Kla-Tencor Technologies Corp. Methods and systems for detecting defects on a specimen using a combination of bright field channel data and dark field channel data
US7796804B2 (en) * 2007-07-20 2010-09-14 Kla-Tencor Corp. Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer
US8126255B2 (en) 2007-09-20 2012-02-28 Kla-Tencor Corp. Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions
US8605275B2 (en) * 2009-01-26 2013-12-10 Kla-Tencor Corp. Detecting defects on a wafer
CN103210482B (zh) * 2010-08-09 2016-06-22 Bt成像股份有限公司 持久性特征检测
US9279774B2 (en) * 2011-07-12 2016-03-08 Kla-Tencor Corp. Wafer inspection
US9311698B2 (en) 2013-01-09 2016-04-12 Kla-Tencor Corp. Detecting defects on a wafer using template image matching
US9766186B2 (en) * 2014-08-27 2017-09-19 Kla-Tencor Corp. Array mode repeater detection

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130250287A1 (en) 2009-01-26 2013-09-26 Kla-Tencor Corporation Systems and Methods for Detecting Defects on a Wafer
US20160061745A1 (en) 2014-08-27 2016-03-03 Kla-Tencor Corporation Repeater Detection
US20160209334A1 (en) 2015-01-21 2016-07-21 Kla-Tencor Corporation Wafer inspection with focus volumetric method

Also Published As

Publication number Publication date
TW201909115A (zh) 2019-03-01
EP3635772A4 (en) 2021-03-10
EP3635772A1 (en) 2020-04-15
KR20200018703A (ko) 2020-02-19
CN110870053A (zh) 2020-03-06
JP2020526911A (ja) 2020-08-31
US20190012778A1 (en) 2019-01-10
JP7073413B2 (ja) 2022-05-23
US10957033B2 (en) 2021-03-23
EP3635772B1 (en) 2025-09-03
TWI760523B (zh) 2022-04-11
CN110870053B (zh) 2023-09-15
WO2019014077A1 (en) 2019-01-17

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